EClamp2386P ESD/EMI Protection for Color LCD Interfaces PRELIMINARY PROTECTION PRODUCTS - EMIClampTM Description Features The EClampTM2386P is a low pass filter array with integrated TVS diodes. It is designed to suppress unwanted EMI/RFI signals and provide electrostatic discharge (ESD) protection in portable electronic equipment. This state-of-the-art device utilizes solidstate silicon-avalanche technology for superior clamping performance and DC electrical characteristics. They have been optimized for protection of color LCD panels in cellular phones and other portable electronics. Bidirectional EMI/RFI filter with integrated TVS for ESD protection ESD protection to IEC 61000-4-2 (ESD) Level 4, ±15kV (air), ±8kV (contact) Filter performance: 30dB minimum attenuation The device consists of six identical circuits comprised of TVS diodes for ESD protection, and a resistor capacitor network for EMI/RFI filtering. A series resistor value of 200Ω and a capacitance value of 12pF are used to achieve 30dB minimum attenuation from 800MHz to 2.7GHz. The TVS diodes provide effective suppression of ESD voltages in excess of ±15kV (air discharge) and ±8kV (contact discharge) per IEC 610004-2, level 4. 800MHz to 2.7GHz TVS working voltage: 5V Resistor: 200Ω +/− 15% Total Capacitance: 12pF (VR = 2.5V) Protection and filtering for six lines Solid-state technology Mechanical Characteristics The EClamp2386P is in a 12-pin, RoHS/WEEE compliant, SLP3016P12 package. It measures 3.0 x 1.6 x 0.58mm. The leads are spaced at a pitch of 0.5mm and are finished with lead-free NiPd. The small package makes it ideal for use in portable electronics such as cell phones, digital still cameras, and PDAs. SLP3016P12 12-pin package RoHS/WEEE Compliant Nominal Dimensions: 3.0 x 1.6 x 0.58 mm Lead Pitch: 0.5mm Lead finish: NiPd Marking: Marking Code Packaging: Tape and Reel per EIA 481 Applications Color LCD Protection Cell Phone CCD Camera Lines Clamshell Cell Phones Package Configuration Circuit Diagram (Each Line) 3.00 1 2 200 Ω IN 1.60 OUT 12pF 12pF 0.50 BSC GND 0.58 12 Pin SLP package (Bottom Side View) Nominal Dimensions in mm Device Schematic (6X) Revision 1/25/2006 1 www.semtech.com EClamp2386P PRELIMINARY PROTECTION PRODUCTS Maximum Ratings R ating Symbol Value Units VESD +/- 17 +/- 12 kV Junction Temp erature TJ 125 o Op erating Temp erature Top -40 to +85 o Storage Temp erature TSTG -55 to +150 o ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) C C C Electrical Characteristics (T = 25oC) P a r a met er Symb ol C on d i t i on s Mi n i mu m Ty p i c a l M a xi m u m Un i ts 5 V 10 V 0.5 µA T VS Reverse Stand-Of f Voltage VRWM T VS Reverse Breakdown Voltage VBR It = 1mA T VS Reverse Leakage Current IR VRWM = 3.0V Total Series Resistance R Each Line 170 200 230 Ohms C 1, C 2 Each Line VR = 2.5V, f = 1MHz 10 12 15 pF C in Input to Gnd, Each Line VR = 2.5V, f = 1MHz 20 24 30 pF Capacitance Total Capacitance 2006 Semtech Corp. 2 6 8 www.semtech.com EClamp2386P PRELIMINARY PROTECTION PRODUCTS Typical Characteristics Typical Insertion Loss S21 (Each Line) CH1 S21 LOG Analog Crosstalk (Each Line) CH1 S21 6 dB / REF 0 dB LOG 20 dB /REF 0 dB 1: -12.260 dB 112 MHz 2: -35.300 dB 800 MHz 0 dB 3: -34.405 dB 1.8 GHz -6 dB -12 dB 4: -30.362 dB 2.7 GHz 1 -18 dB -24 dB 4 -30 dB -36 dB 2 3 -42 dB -48 dB 1 MHz 10 MHz 100 MHz 3 1 GHz GHz START . 030 MHz STOP 3000. 000000 MHz STOP 3 000. 000000 MHz START . 030 MHz ESD Clamping (+8kV Contact) ESD Clamping (-8kV Contact) Capacitance vs. Reverse Voltage (Normalized to 2.5 volts) 2 CJ(VR) / CJ(VR=0) 1.5 1 0.5 f = 1 MHz 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Reverse Voltage - VR (V) 2006 Semtech Corp. 3 www.semtech.com EClamp2386P PRELIMINARY PROTECTION PRODUCTS Device Connection The EClamp2386P is comprised of six identical circuits each consisting of a low pass filter for EMI/RFI suppression and dual TVS diodes for ESD protection. The device is in a 12-pin SLP package. Electrical connection is made to the 12 pins located at the bottom of the device. A center tab serves as the ground connection. The device has a flow through design for easy layout. Pin connections are noted in Figure 1. All path lengths should be kept as short as possible to minimize the effects of parasitic inductance in the board traces. Recommendations for the ground connection are given below. Figure 1 - Pin Identification and Configuration (Top Side View) In 1 In 2 In 3 In 4 In 5 In 6 Ground Connection Recommendation Parasitic inductance present in the board layout will affect the filtering performance of the device. As frequency increases, the effect of the inductance becomes more dominant. This effect is given by Equation 1. Equation 1: The Impedance of an Inductor at Frequency XLF XLF(L, f ) = 2 * π * f * L Out 1 Out 2 Out 3 Out 4 Out 5 Out 6 12 GND 6 7 Pin Identification 1-6 Inp ut Lines 7 - 12 Outp ut Lines Center Tab Ground Figure 2 - Inductance of Rectangular Wire Loops Where: L= Inductance (H) f = Frequency (Hz) Ground Via 1 Ground Via 2 d Via connections to the ground plane form rectangular wire loops or ground loop inductance as shown in Figure 2. Ground loop inductance can be reduced by using multiple vias to make the connection to the ground plane. Bringing the ground plane closer to the signal layer (preferably the next layer) also reduces ground loop inductance. Multiple vias in the device ground pad will result in a lower inductive ground loop over two exterior vias. Vias with a diameter d are separated by a distance y run between layers separated by a distance x. The inductance of the loop path is given by Equation 2. Thus, decreasing distance x and y will reduce the loop inductance and result in better high frequency filter characteristics. 2006 Semtech Corp. 1 Signal Layer x Ground Layer Layer y Equation 2: Inductance of Rectangular Wire Loop [ LRECT(d, x , y) = 10.16 *10 −9 * x * ln [ ] + y * ln[ ]] 2*y d 2*x d Where: d = Diameter of the wire (in) x = Length of wire loop (in) y = Breath of wire loop (in) 4 www.semtech.com EClamp2386P PRELIMINARY PROTECTION PRODUCTS Applications Information Figure 3 shows the recommended device layout. The ground pad vias have a diameter of 0.008 inches (0.20 mm) while the two external vias have a diameter of 0.010 inches (0.250mm). The internal vias are spaced approximately evenly from the center of the pad. The designer may choose to use more vias with a smaller diameter (such as 0.005 inches or 0.125mm) since changing the diameter of the via will result in little change in inductance (i.e. the log function in Equation 2 in highly insensitive to parameter d) . Figure 4 shows a typical insertion loss (S21) plot for the device using Semtech’s filter evaluation board with 50 Ohm traces and the recommended via configuration. Figure 4 - Filter Characteristics Using Recommended Layout with Internal Vias CH1 S21 LOG 6 dB / REF 0 dB 1: -12.260 dB 112 MHz 2: -35.300 dB 800 MHz 0 dB 3: -34.405 dB 1.8 GHz -6 dB -12 dB 4: -30.362 dB 2.7 GHz 1 -18 dB -24 dB 4 -30 dB -36 dB 2 3 -42 dB Figure 3 - Recommended Layout Using Ground Vias -48 dB 1 MHz START . 030 MHz 2006 Semtech Corp. 5 10 MHz 100 MHz 3 1 GHz GHz STOP 3000. 000000 MHz www.semtech.com EClamp2386P PRELIMINARY PROTECTION PRODUCTS Applications Information - Spice Model Line In 0.7nH 0.7nH Line Out 200 EClamp2386P Spice Model Table 1 - EClamp2386P Spice Parameters 2006 Semtech Corp. Parameter Unit D1 (T VS) D2 (T VS) IS Amp 5.15E-15 5.15E-15 BV Volt 7.53 7.53 VJ Volt 0.75 0.75 RS Ohm 0.426 0.426 IB V A mp 1E-3 1E-3 CJO Farad 23E-12 23E-12 TT sec 2.541E-9 2.541E-9 M -- 0.256 0.256 N -- 1.1 1.1 EG eV 1.11 1.11 6 www.semtech.com EClamp2386P PRELIMINARY PROTECTION PRODUCTS Outline Drawing - SLP3016P12 A B D DIM E PIN 1 INDICATOR (LASER MARK) A SEATING PLANE aaa C A1 A2 C D1 1 A A1 A2 b D D1 E E1 e L N aaa bbb DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .020 .023 .026 .000 .001 .002 (.006) .007 .010 .012 .114 .118 .122 .083 .087 .091 .059 .063 .067 .010 .016 .020 .020 BSC .011 .013 .015 12 .003 .004 0.50 0.58 0.65 0.00 .003 0.05 (0.15) 0.20 0.25 0.30 2.90 3.00 3.10 2.10 2.20 2.30 1.50 1.60 1.70 0.25 0.40 0.50 0.50 BSC 0.28 0.33 0.38 12 0.08 0.10 2 LxN E/2 E1 N bxN e bbb C A B D/2 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. Land Pattern - SLP3016P12 P X Z F G Y (C) DIM B C F G P X Y Z DIMENSIONS INCHES MILLIMETERS .091 2.30 .060 1.52 .018 0.45 .035 0.89 .020 0.50 .012 0.30 .025 0.63 .085 2.15 B NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET 2006 Semtech Corp. 7 www.semtech.com EClamp2386P PRELIMINARY PROTECTION PRODUCTS Marking Ordering Information 2386P PIN 1 INDICATOR (LASER MARK) Part Number Qty per Reel R eel Size EClamp 2386P.TCT 3000 7 Inch EMIClamp and EClamp are marks of Semtech Corporation Tape and Reel Specification Pin 1 Location User Direction of feed Device Orientation in Tape A0 1.78 +/-0.05 mm B0 K0 3.18 +/-0.05 mm 0.76 +/-0.05 mm Tape Width B, (Max) D D1 8 mm 4.2 mm (.165) 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) 0.8 mm ±0.05 (.031) E 1.750±.10 mm (.069±.004) F K (MAX) P P0 P2 T(MAX) W 3.5±0.05 mm (.138±.002) 2.4 mm (.094) 4.0±0.1 mm (.157±.004) 4.0±0.1 mm (.157±.004) 2.0±0.05mm (.079±.002) 0.4 mm (.016) 8.0 mm + 0.3 mm - 0.1 mm (.312±.012) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2006 Semtech Corp. 8 www.semtech.com