LC03-3.3 Low Capacitance 3.3 Volt TVS for High Speed Interfaces PROTECTION PRODUCTS Description Features The LC03-3.3 transient voltage suppressor is designed to protect components which are connected to high speed data and telecommunication lines from voltage surges caused by lightning, electrostatic discharge (ESD), and electrical fast transients (EFT). 1800 watts peak pulse power (tp = 8/20µs) Transient protection for high-speed data lines to TVS diodes are ideal for use as board level protection of sensitive semiconductor components. The LC033.3 combines a TVS diode with a rectifier bridge to provide transient protection in both common and differential mode with a single device. The LC03-3.3 utilizes Semtech’s EPD technology for superior electrical characteristics at 3.3 volts. The capacitance of the device is minimized to ensure correct signal transmission on high speed lines. Bellcore 1089 (Intra-Building) 100A (2/10µs) ITU K.20 IPP=40A (5/310µs) IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 100A (8/20µs) Protects two lines in common and differential mode Low capacitance for high-speed interfaces Low operating voltage (3.3V) Low clamping voltage Integrated structure saves board space and increases reliability Solid-state EPD technology Mechanical Characteristics The LC03-3.3 meets the short-haul (intra-building) transient immunity requirements of Bellcore 1089 for telecommunications applications. JEDEC SO-8 package Molding compound flammability rating: UL 94V-0 Marking : Part number, date code Packaging : Tube or Tape and Reel per EIA 481 Applications Circuit Diagram Low Voltage Interfaces T3/E3 10/100/1000 Ethernet Set-Top Box ISDN Interfaces Schematic & PIN Configuration 1 8 2 7 3 6 4 5 Pin 1 and 8 Pin 2, 3, 6, and 7 Ground Pin 4 and 5 SO-8 (Top View) Revision 10/14/04 1 www.semtech.com LC03-3.3 PRELIMINARY PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20µs) Pp k 1800 Watts Peak Pulse Current (tp = 8/20µs) IP P 100 A Lead Soldering Temp erature TL 260 (10 sec.) °C Op erating Temp erature TJ -55 to +125 °C TSTG -55 to +150 °C Storage Temp erature Electrical Characteristics LC03-3.3 Parameter Reverse Stand-Off Voltage Symbol Conditions Minimum Typical VRWM Maximum Units 3.3 V Punch-Through Voltage V PT IPT = 2µA 3.5 V Snap-Back Voltage VSB ISB = 50mA 2.8 V Reverse Leakage Current IR VRWM = 3.3V, T=25°C 1 µA Clamping Voltage VC IPP = 50A, tp = 8/20µs Line-to-Ground 11.5 V Clamping Voltage VC IPP = 50A, tp = 8/20µs Line-to-Line 13.5 V Clamping Voltage VC IPP = 100A, tp = 8/20µs Line-to-Ground 15 V Clamping Voltage VC IPP = 100A, tp = 8/20µs Line-to-Line 18 V Junction Capacitance Cj Between I/O pins and Ground VR = 0V, f = 1MHz 16 25 pF Between I/O pins VR = 0V, f = 1MHz 8 12 pF 2004 Semtech Corp. 2 www.semtech.com LC03-3.3 PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 100 100 % of Rated Power or PI P Peak Pulse Power - Ppk (kW) 110 10 1 90 80 70 60 50 40 30 20 10 0 0.1 0.1 1 10 100 0 1000 25 50 Pulse Duration - tp (µs) 110 Percent of IPP 80 Clamping Voltage - VC (V) 90 -t e 50 40 125 td = IPP/2 30 20 Line-To-Line 10 Line-To-Ground 5 Waveform Parameters: tr = 8µs td = 20µs 0 0 5 10 15 175 15 10 0 150 20 Waveform Parameters: tr = 8µs td = 20µs 100 60 100 Clamping Voltage vs. Peak Pulse Current Pulse Waveform 70 75 Ambient Temperature - TA (oC) 20 25 0 30 20 40 Time (µs) 60 80 100 Peak Pulse Current - IPP (A) Insertion Loss S21 (Line to Ground) Capacitance vs. Reverse Voltage 10 CH1 S21 LOG 3 dB/ REF 0 dB Capacitance - Cj (pF) 9.5 9 8.5 8 7.5 f = 1MHz 7 0 0.5 1 1.5 2 Reverse Voltage - VR (V) 2.5 3 3.5 START. 030 MHz 2004 Semtech Corp. 3 STOP 3000. 000000 MHz www.semtech.com LC03-3.3 PRELIMINARY PROTECTION PRODUCTS Applications Information Matte Tin Lead Finish Device Connection Options for Protection of Two High-Speed Data Lines Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. The LC03-3.3 is designed to protect two high-speed data lines (one differential pair) from transient overvoltages which result from lightning and ESD. The device can be configured to protect in differential (Lineto-Line) and common (Line-to-Ground) mode. Data line inputs/outputs are connected at pins 1 to 8, and 4 to 5 as shown. Pins 2, 3, 6, and 7 are connected to ground. These pins should be connected directly to a ground plane on the board for best results. The path length is kept as short as possible to minimize parasitic inductance. In applications where high common mode voltages are present, differential protection is achieved by leaving pins 2, 3, 6, and 7 not connected. Connection for Differential (Line-to-Line) and Common Mode Protection (Line-to-Ground) Connection for Differential Protection (Line-to-Line) 2004 Semtech Corp. 4 www.semtech.com LC03-3.3 PROTECTION PRODUCTS Typical Applications Bellcore 1089 Intra-Building Protection Gigabit Ethernet 2004 Semtech Corp. 5 www.semtech.com LC03-3.3 PRELIMINARY PROTECTION PRODUCTS Outline Drawing - SO-8 A h D e N h H 2X E/2 E1 E 1 0.25 L (L1) e/2 DETAIL B 01 A D aaa C SEATING PLANE A2 A C SEE DETAIL A .053 .069 .004 .010 .049 .065 .020 .012 .007 .010 .189 .193 .197 .150 .154 .157 .236 BSC .050 BSC .010 .020 .016 .028 .041 (.041) 8 0° 8° .004 .010 .008 1.35 1.75 0.10 0.25 1.25 1.65 0.31 0.51 0.17 0.25 4.80 4.90 5.00 3.80 3.90 4.00 6.00 BSC 1.27 BSC 0.25 0.50 0.40 0.72 1.04 (1.04) 8 0° 8° 0.10 0.25 0.20 SIDE VIEW A1 bxN bbb DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX A A1 A2 b c D E1 E e h L L1 N 01 aaa bbb ccc c GAGE PLANE 2 ccc C 2X N/2 TIPS DIM C A-B D NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MS-012, VARIATION AA. Land Pattern -SO-8 X DIM (C) G C G P X Y Z Z Y DIMENSIONS INCHES MILLIMETERS (.205) .118 .050 .024 .087 .291 (5.20) 3.00 1.27 0.60 2.20 7.40 P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2. REFERENCE IPC-SM-782A, RLP NO. 300A. 2004 Semtech Corp. 6 www.semtech.com LC03-3.3 PROTECTION PRODUCTS Ordering Information Part Number Lead Finish Qty per Reel R eel Size LC03-3.3.TB SnPb 500 7 Inch LC03-3.3.TBT Pb Free 500 7 Inch Marking Diagram SC YYWW LC03-3.3 Note: YYWW = Date Code Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2004 Semtech Corp. 7 www.semtech.com