RClamp0502B Ultra-Low Capacitance TVS for ESD and CDE Protection PROTECTION PRODUCTS - RailClamp Description Features Transient protection for high-speed data lines to RailClamps are ultra low capacitance TVS arrays designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to high-speed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients). The RClampTM0502B has a typical capacitance of only 0.50pF (pin 1 to 2). This means it can be used on circuits operating in excess of 3GHz without signal attenuation. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, ±8kV contact discharge). Each device can be configured to protect 1 bidirectional line or two unidirectional lines. These devices are in a small SC-75 (SOT-523) package and feature a lead-free, matte tin finish. They are compatible with both lead free and SnPb assembly techniques. They are designed for use in applications where board space is at a premium. The combination of small size, low capacitance, and high level of ESD protection makes them a flexible solution for applications such as HDMI, MDDI, antenna circuits, Automatic Test Equipment, USB 2.0, and Infiniband circuits. IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) Designed to replace polymer TVS Protects up to two I/O lines Ultra-Low capacitance (<1pF) No insertion loss to >3.0GHz Low profile (<1mm) Low leakage current and clamping voltage Low operating voltage: 5.0V Solid-state silicon-avalanche technology Mechanical Characteristics SC-75 (SOT-523) package Lead Finish: Matte Tin RoHS/WEEE Compliant Molding compound flammability rating: UL 94V-0 Marking: P5 Packaging: Tape and Reel per EIA 481 Applications Dimensions High-Definition Multimedia Interface (HDMI) Mobile Display Digital Interface (MDDI) RF/Antenna Circuits USB 2.0 & Firewire Ports GaAs Photodetector Protection HBT Power Amp Protection Infiniband Transceiver Protection Schematic & PIN Configuration 1.60 0.50 BSC 3 0.80 1 1.60 2 1.00 BSC 0.75 Nominal Dimensions (mm) Revision 04/05/2005 SC-75 3L (Top View) 1 www.semtech.com RClamp0502B PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20µs) Pp k 125 Watts Peak Pulse Current (tp = 8/20µs) IP P 5 A ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) VESD 15 8 kV TJ -55 to +125 °C TSTG -55 to +150 °C Op erating Temp erature Storage Temp erature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Reverse Stand-Off Voltage VRWM Pin 1 or Pin 2 to Pin 3 and Between Pins 1 and 2 Reverse Breakdown Voltage V BR It = 1mA Pin 1 or Pin 2 to Pin 3 and Between Pins 1 and 2 Reverse Leakage Current IR VRWM = 5V, T=25°C Pin 1 or Pin 2 to Pin 3 and Between Pins 1 and 2 1 µA Clamping Voltage VC IPP = 1A, tp = 8/20µs Pi n 1 to Pi n 2 15 V Clamping Voltage VC IPP = 5A, tp = 8/20µs Pin 1 or Pin 2 to Pin 3 22 V Clamping Voltage VC IPP = 5A, tp = 8/20µs Pi n 1 to Pi n 2 25 V Junction Capacitance Cj VR = 0V, f = 1MHz Pi n 1 to Pi n 2 0.9 pF Junction Capacitance Cj VR = 0V, f = 1MHz Pin 1 or Pin 2 to Pin 3 1.2 pF 2005 Semtech Corp. 2 Minimum Typical Maximum Units 5 V 6 V 0.60 www.semtech.com RClamp0502B PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 10 110 90 % of Rated Power or IPP Peak Pulse Power - PPP (kW) 100 1 0.1 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10 100 0 1000 25 50 75 100 125 150 Ambient Temperature - TA (oC) Pulse Duration - tp (µs) Clamping Voltage vs. Peak Pulse Current Pin 1 to Pin 2 Clamping Voltage vs. Peak Pulse Current Pin 1 or Pin 2 to Pin 3 20 25 Clamping Voltage - VC (V) Clamping Voltage - VC (V) 18 20 15 10 Waveform Parameters: tr = 8µs td = 20µs 5 16 14 12 10 8 6 Waveform Parameters: tr = 8µs td = 20µs 4 2 0 0 0 1 2 3 4 5 0 6 1 2 Normalized Capacitance vs. Reverse Voltage Pin 1 or Pin 2 to Pin 3 4 5 6 Normalized Capacitance vs. Reverse Voltage Pin 1 to Pin 2 1.2 1.4 f = 1 MHz 1.2 Normalized Capacitance - Cj NormalizedCapacitance - Cj 3 Peak Pulse Current - IPP (A) Peak Pulse Current - IPP (A) 1 0.8 0.6 0.4 0.2 1 0.8 0.6 0.4 f = 1 MHz 0.2 0 0 1 2005 Semtech Corp. 2 3 Reverse Voltage - VR (V) 4 0 5 3 1 2 3 Reverse Voltage - VR (V) 4 5 www.semtech.com RClamp0502B PROTECTION PRODUCTS Typical Characteristics Insertion Loss S21 (Pin 1 to Pin 2) CH1 S21 LOG Insertion Loss S21 (Pin 1 or Pin 2 to Pin 3) 6 dB / REF 0 dB CH1 S21 3 0 dB 1 2: .07870 dB 1.8 GHz 2: .02010 dB 1.8 GHz 3: .28040 dB 2.5 GHz 3 0 dB 2 -6 dB -12 dB -12 dB -18 dB -18 dB -24 dB -24 dB -30 dB -30 dB 1 MHz 10 MHz 100 MHz -36 dB 3 1 GHz GHz STOP 3000. 000000 MHz START . 030 MHz 6 dB / REF 0 dB 1: .00460 dB 900 MHz -6 dB -36 dB LOG 1: .03430 dB 900 MHz 1 1 MHz START . 030 MHz 10 MHz 100 MHz 3: -.08180 dB 2.5 GHz 2 3 1 GHz GHz STOP 3000. 000000 MHz ESD Response (8kV Contact per IEC 61000-4-2) ESD Response (4kV Contact per IEC 61000-4-2) Analog Crosstalk CH1 S21 LOG START . 030 MHz 2005 Semtech Corp. 20 dB /REF 0 dB STOP 3000. 000000 MHz 4 www.semtech.com RClamp0502B PROTECTION PRODUCTS Applications Information Figure 1. Pin Configuration Device Connection Options This device is optimized for protection of 1 line operating in excess of 3GHz. It may also be used to protect two lines operating in excess of 2.0GHz. The device is connected as follows: Protection for one line with <1pF capacitance can be achieved by connecting one data line to either pin 1 or pin 2 with the other pin connected to ground. Pin 3 is not connected. The connection to ground should be made directly to a ground plane. The path length should also be kept as short as possible to minimize parasitic inductance. Protection of two lines is achieved by connecting data lines at pins 1 & 2. Pin 3 is connected to ground. The connection to ground should be made directly to a ground plane. The path length should also be kept as short as possible to minimize parasitic inductance. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 2005 Semtech Corp. 5 www.semtech.com RClamp0502B PROTECTION PRODUCTS Applications Information The HDMI Compliance Test Specification (CTS) requires sink (receiver) ports maintain a differential impedance of 100 Ohms +/- 15%. The measurement is taken using a Time Domain Reflectometry (TDR) method that utilizes a pulse with a risetime <= 200ps. ESD protection devices have an inherent junction capacitance. Even a small amount of added capacitance on an HDMI port will cause the impedance of the differential pair to drop. As such, some form of compensation to the layout will be required to bring the differential pairs back within the required 100 Ohm +/- 15% range. The higher the added capacitance, the more extreme the modifications will need to be. If the added capacitance is too high, compensation may not even be possible. The RClamp0502B presents <1pF capacitance between the pairs while being rated to handle >8kV ESD contact discharges (>15kV air discharge) as outlined in IEC 61000-4-2. As such, it is possible to make minor adjustments to the board layout parameters to compensate for the added capacitance of the RClamp0502B. Figure 2 shows how to implement the RClamp0502B in an HDMI application (transmitter and receiver). Figure 3 shows impedance test results using a Semtech evaluation board with layout compensation. As shown, the device meets the HDMI CTS impedance requirements. A X-axis Y-axis A 1.640 99.2 B B 1.855 104.6 (nsec) (Ohm) Figure 3 - TDR Measurement using Semtech Evaluation Board HDMI Transmitter HDMI Display Figure 2 - HDMI Schematic 2005 Semtech Corp. 6 www.semtech.com RClamp0502B PROTECTION PRODUCTS Applications Information - Spice Model RClamp0502B Spice Model Table 1 - R Clamp0502B Spice Parameters 2005 Semtech Corp. Parameter Unit D1 (T VS) D2 (T VS) IS Amp 4.43E-14 4.43E-14 BV Volt 8.89 8.89 VJ Volt 0.68 0.68 RS Ohm 1.72 1.72 IB V Amp 1.0E-3 1.0E-3 CJO Farad 1.18E-12 1.18E-12 TT sec 2.541E-9 2.541E-9 M -- 0.133 0.133 N -- 1.1 1.1 EG eV 1.11 1.11 7 www.semtech.com RClamp0502B PROTECTION PRODUCTS Outline Drawing -SC-75 (SOT-523) A D DIM e1 B A A1 A2 b c D E E1 e e1 L N 0 aaa bbb 3 E E1 1 2 bxN bbb e A C A B A2 DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .023 .035 .000 .004 .023 .030 .031 .005 .012 .003 .008 .059 .063 .067 .057 .063 .069 .029 .031 .033 .039 BSC .020 BSC (.009) 3 0° 8° .004 .008 0.60 0.00 0.60 0.15 0.10 1.50 1.45 0.75 0.75 - 0.90 0.10 0.80 0.30 0.20 1.60 1.70 1.60 1.75 0.80 0.85 1.00 BSC 0.50 BSC (0.22) 3 0° 8° 0.10 0.20 aaa C SEATING PLANE A1 C H SEE DETAIL A 0 SEATING PLANE C SIDE VIEW c L DETAIL A NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H- 3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. Land Pattern -SC-75 (SOT-523) X Y Z C DIM C P p1 G X Y Z G Y DIMENSIONS INCHES MILLIMETERS (.055) .039 .020 .024 .016 .031 .087 (1.40) 1.00 0.50 0.60 0.40 0.80 2.20 p1 P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2005 Semtech Corp. 8 www.semtech.com RClamp0502B PROTECTION PRODUCTS Marking Ordering Information P5 Part Number Lead Finish Qty per Reel Reel Size RClamp 0502B.TCT Pb Free 3,000 7 Inch RailClamp and RClamp are registered marks of Semtech Corporation Tape and Reel Specification Device Orientation in Tape Tape Width B, (Max) D D1 ( M IN ) 8 mm 4.2 mm (.165) 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) 1.0 mm (.039) E 1.750±.10 mm (.069±.004) F K (MAX) P P0 P2 T(MAX) W 3.5±0.05 mm (.138±.002) 2.4 mm (.094) 4.0±0.1 mm (.157±.004) 4.0±0.1 mm (.157±.004) 2.0±0.05mm (.079±.002) 0.4 mm (.016) 8.3 mm (.312±.012) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2005 Semtech Corp. 9 www.semtech.com