SEMTECH RCLAMP0504F

RClamp0504F
RailClamp®
Low Capacitance TVS Array
PROTECTION PRODUCTS - RailClamp®
Description
Features
‹ Transient protection for high-speed data lines to
RailClamps® are surge rated diode arrays designed to
protect high speed data interfaces. This series has
been specifically designed to protect sensitive components which are connected to data and transmission
lines from overvoltage caused by ESD (electrostatic
discharge), CDE (Cable Discharge Events), and EFT
(electrical fast transients).
The unique design incorporates surge rated, low
capacitance steering diodes and a TVS diode in a
single package. During transient conditions, the
steering diodes direct the transient to either the
positive side of the power supply line or to ground. The
internal TVS diode prevents over-voltage on the power
line, protecting any downstream components.
The low capacitance array configuration allows the user
to protect four high-speed data or transmission lines.
The low inductance construction minimizes voltage
overshoot during high current surges. This device is
optimized for ESD protection of portable electronics.
They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, ±8kV
contact discharge).
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Mechanical Characteristics
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EIAJ SC-70 6L package
Lead Finish: Matte Tin
RoHS/WEEE Compliant
Molding compound flammability rating: UL 94V-0
Marking : F54
Packaging : Tape and Reel per EIA 481
Applications
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Circuit Diagram
USB 2.0
USB OTG
Monitors and Flat Panel Displays
Digital Visual Interface (DVI)
High-Definition Multimedia Interface (HDMI)
Gigabit Ethernet
SIM Ports
IEEE 1394 Firewire Ports
Schematic & PIN Configuration
5
1
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Array of surge rated diodes with internal TVS Diode
Small package (2.4 x 2.2mm) saves board space
Protects up to four I/O lines & power line
Low capacitance (<3pF) for high-speed interfaces
No insertion loss to 2.0GHz
Low leakage current and clamping voltage
Low operating voltage: 5.0V
Solid-state silicon-avalanche technology
3
4
6
1
6
2
5
3
4
2
SC-70 6L (Top View)
Revision 11/18/2008
1
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RClamp0504F
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20μs)
Pp k
150
Watts
Peak Pulse Current (tp = 8/20μs)
IP P
6
A
ESD p er IEC 61000-4-2 (Air)
ESD p er IEC 61000-4-2 (Contact)
VESD
15
8
kV
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
Op erating Temp erature
Storage Temp erature
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Minimum
Typical
Maximum
Units
Reverse Stand-Off Voltage
VRWM
Pi n 5 to 2
5
V
Reverse Breakdown Voltage
V BR
It = 1mA
Pi n 5 to 2
Reverse Leakage Current
IR
VRWM = 5V, T=25°C
Pi n 5 to 2
3
μA
Clamp ing Voltage
VC
IPP = 1A, tp = 8/20μs
A n y p i n to p i n 2
15
V
Clamp ing Voltage
VC
IPP = 6A, tp = 8/20μs
A n y p i n to p i n 2
25
V
Junction Cap acitance
Cj
VR = 0V, f = 1MHz
Any I/O p in to p in 2
3
pF
VR = 0V, f = 1MHz
Between I/O p ins
1.5
pF
6
V
Note 1: I/O pins are pin 1, 3, 4, and 6
© 2008 Semtech Corp.
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RClamp0504F
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
10
110
90
% of Rated Power or IPP
Peak Pulse Power - P PP (kW)
100
1
0.1
80
70
60
50
40
30
20
10
0
0.01
0.1
1
10
100
0
1000
25
50
Pulse Duration - tp (μs)
Pulse Waveform
80
PP
Percent of I
Clamping Voltage - VC (V)
90
e
-t
50
40
td = IPP/2
30
125
150
25
Waveform
Parameters:
tr = 8µs
td = 20µs
100
60
100
Clamping Voltage vs. Peak Pulse Current
110
70
75
Ambient Temperature - TA (oC)
20
Waveform
Parameters:
tr = 8µs
td = 20µs
20
Pin 1, 3, 4,
or 6 to pin 2
15
Pin 5 to pin 2
10
10
0
0
5
10
15
20
25
5
30
0
1
Time (µs)
Forward Voltage vs. peak Pulse Current
2
3
4
Peak Pulse Current - IPP (A)
5
6
Capacitance vs. Reverse Voltage
(Normalized to 0V)
2
8
f = 1MHz
Normalized Capacitance
Forward Voltage - V F (V)
7
6
5
4
3
Waveform
Parameters:
tr = 8µs
td = 20µs
2
1
1.5
Any I/O Pin
to Pin 2
1
0.5
0
0
1
2
3
4
5
0
6
0
Peak Pulse Current - IPP (A)
© 2008 Semtech Corp.
1
2
3
4
5
Reverse Voltage - VR (V)
3
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RClamp0504F
PROTECTION PRODUCTS
Typical Characteristics
Insertion Loss S21 (I/O to Pin 2)
CH1 S21
LOG
Insertion Loss S21 (I/O to I/O)
6 dB / REF 0 dB
CH1 S21
STOP 3000. 000000 MHz
START . 030 MHz
LOG
START. 030 MHz
6 dB / REF 0 dB
START. 030 MHz
Analog Crosstalk
CH1 S21
LOG
STOP 3000. 000000 MHz
ESD Response (8kV Contact per IEC 61000-4-2)
20 dB/ REF 0 dB
STOP 3000. 000000 MHz
Note: Data is taken with a 10x attenuator
© 2008 Semtech Corp.
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RClamp0504F
PROTECTION PRODUCTS
Applications Information
Protection of Four Data Lines and Power Supply Line
Device Connection Options for Protection of Four
High-Speed Data Lines
This device is designed to protect data lines by
clamping them to a fixed reference. When the voltage
on the protected line exceeds the reference voltage
the steering diodes are forward biased, conducting the
transient current away from the sensitive circuitry.
Data lines are connected at pins 1, 3, 4 and 6. Pin 2
should be connected directly to a ground plane. The
path length is kept as short as possible to minimize
parasitic inductance.
The positive reference is connected at pin 5. The
options for connecting the positive reference are as
follows:
Protection of Four Data Lines Using Internal TVS
Diode as Reference
1. To protect data lines and the power line, connect
pin 5 directly to the positive supply rail (VCC). In this
configuration the data lines are referenced to the
supply voltage. The internal TVS diode prevents
over-voltage on the supply rail.
2. In applications where the supply rail does not exit
the system, the internal TVS may be used as the
reference. In this case, pin 5 is not connected.
The steering diodes will begin to conduct when the
voltage on the protected line exceeds the working
voltage of the TVS (plus one diode drop).
3. In applications where complete supply isolation is
desired, the internal TVS is again used as the
reference and VCC is connected to one of the I/O
inputs. An example of this configuration is the
protection of a SIM port. The Clock, Reset, I/O,
and VCC lines are connected at pins 1, 3, 4, and 6.
Pin 2 is connected to ground and pin 5 is not
connected.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small compared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
© 2008 Semtech Corp.
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RClamp0504F
PROTECTION PRODUCTS
Typical Applications
SIM Port - Protection of Three Data Lines and VCC
USB OTG
Receptable
Carkit
VBus
DD+
ID
GND
To
Phone
Mini B Receptable
Shield
Gnd
1
6
2
5
3
4
Mini A Receptable
USB OTG Carkit Protection
© 2008 Semtech Corp.
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RClamp0504F
PROTECTION PRODUCTS
Typical Applications
SD12
RClamp0504F
IEEE 1394 Firewire Protection
RClamp0504F
RClamp0504F
Gigabit Ethernet Protection
© 2008 Semtech Corp.
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RClamp0504F
PROTECTION PRODUCTS
Outline Drawing - SC70-6L
A
DIM
D
e1
A
A1
A2
b
c
D
E1
E
e
e1
L
L1
N
01
aaa
bbb
ccc
N
E/2
E
E1
ccc C
2X N/2 TIPS
1
2
e
B
D
aaa C
A2
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.043
.000
.004
.028 .035 .039
.012
.006
.003
.009
.071 .079 .087
.045 .049 .053
.083 BSC
.026 BSC
.051
.010 .014 .018
(.017)
6
0°
8°
.004
.004
.012
1.10
0.10
0.00
0.70 0.90 1.00
0.15
0.30
0.08
0.22
1.80 2.00 2.20
1.15 1.25 1.35
2.10 BSC
0.65 BSC
1.30 BSC
0.26 0.36 0.46
(0.42)
6
0°
8°
0.10
0.10
0.30
A
SEATING
PLANE
H
A1
C
bxN
bbb
C A-B D
c
GAGE
PLANE
0.15
L
01
(L1)
DETAIL
SEE DETAIL
SIDE VIEW
A
A
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
4. REFERENCE JEDEC STD MO-203, VARIATION AB.
Land Pattern - SC70-6L
X
DIM
C
G
C
G
P
X
Y
Z
Z
Y
DIMENSIONS
MILLIMETERS
INCHES
(.073)
.039
.026
.016
.033
.106
(1.85)
1.00
0.65
0.40
0.85
2.70
P
NOTES:
1.
© 2008 Semtech Corp.
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
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RClamp0504F
PROTECTION PRODUCTS
Marking
Ordering Information
Part Number
Qty per
Reel
Reel
Size
RClamp 0504F.TCT
3,000
7 Inch
RailClamp and RClamp are trademarks of Semtech Corporation
F54
1
Tape and Reel Specification
F54
F54
F54
F54
F54
F54
F54
F54
Device Orientation in Tape
Tape
Width
B, (Max)
D
D1
( M IN )
8 mm
4.2 mm
(.165)
1.5 + 0.1 mm
- 0.0 mm
(0.59 +.005
- .000)
1.0 mm
(.039)
E
1.750±.10
mm
(.069±.004)
F
K
(MAX)
P
P0
P2
T(MAX)
W
3.5±0.05
mm
(.138±.002)
2.4 mm
(.094)
4.0±0.1
mm
(.157±.004)
4.0±0.1
mm
(.157±.004)
2.0±0.05mm
(.079±.002)
0.4 mm
(.016)
8.3 mm
(.312±.012)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2008 Semtech Corp.
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