SC1453 150mA Ultra Low Dropout Regulator with Low Noise Bypass POWER MANAGEMENT Description Features The SC1453 is a low dropout linear regulator that operates from a +2.25V to +6.5V input range and delivers up to 150mA. A PMOS pass transistor allows the low 75µA supply current to remain independent of load, making these devices ideal for battery operated portable equipment such as cellular phones, cordless phones and personal digital assistants. “2982/5205” compatible pinout Guaranteed 150 mA output current 2% output accuracy guaranteed over line, load and temperature Very small external components - designed to work with ceramic capacitors Low 26µVRMS output noise (1.5V option, CIN = COUT = 1µF, CBYP = 10nF) Very low supply current Thermal overload protection Reverse battery protection Low power shutdown Full industrial temperature range Very low profile packaging available (1mm max. height) Surface mount packaging (5 pin SOT-23 and TSOT-23) Available in Lead-free packages, fully WEEE and RoHS compliant The SC1453 has a bandgap reference bypass pin for very low noise operation - a 10nF (typ.) capacitor may be connected between this pin and ground. Other features include low powered shutdown, short circuit protection, thermal shutdown protection and reverse battery protection. The SC1453 comes in the tiny 5 lead SOT-23 package and the ultra-low profile 5 lead TSOT-23. Applications Battery Powered Systems Cellular Telephones Cordless Telephones Personal Digital Assistants Portable Instrumentation Modems PCMCIA cards Typical Application Circuit 1 VIN C1 1uF 3 U1 SC1453 IN OUT EN GND BYP 2 Revision: April 21, 2008 5 VOUT 4 C3 1uF C2 10nF 1 www.semtech.com SC1453 POWER MANAGEMENT Absolute Maximum Ratings Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. Parameter Symbol Maximum Units Input Supply Voltage VIN -0.6 to +7 V Thermal Resistance Junction to Ambient θJ A 256 °C/W Thermal Resistance Junction to Case θJ C 81 °C/W Operating Ambient Temperature Range TA -40 to +85 °C Operating Junction Temperature Range TJ -40 to +125 °C Storage Temperature Range TSTG -65 to 150 °C Lead Temperature (Soldering) 10 Sec. TLEAD 300 °C ESD Rating ESD 2 kV Electrical Characteristics Unless specified: VIN = VOUT + 1V, VEN = VIN, IOUT = 100µA, CIN = COUT = 1µF, TA = 25°C. Values in bold apply over full operating ambient temperature range. Parameter Symbol Conditions Min Typ Max Units 6.50 V 130 µA IN Supply Voltage Range VIN Supply Current IQ 2.25 IOUT = 0mA to150mA 75 160 VIN = 6.5V, VEN = 0V 0.1 1.0 µA 1.5 OUT Output Voltage (1) Line Regulation (1)(2) VOUT REG(LINE) IOUT = 1mA -1.5% 0mA ≤ IOUT ≤ 150mA, VOUT +1V ≤ VIN ≤ 5.5V -2.0% (VOUT(NOM) + 0.1V) ≤ VIN ≤ 5.5V, IOUT = 1mA VOUT +1.5% V +2.0% 2.5 10 mV 12 Load Regulation (1) REG(LOAD) IOUT = 0.1mA to 150mA -3 -10 mV -20 2008 Semtech Corp. 2 www.semtech.com SC1453 POWER MANAGEMENT Electrical Characteristics (Cont.) Unless specified: VIN = VOUT + 1V, VEN = VIN, IOUT = 100µA, CIN = COUT = 1µF, TA = 25°C. Values in bold apply over full operating ambient temperature range. Parameter Symbol Conditions Min Typ Max Units OUT (Cont.) Current Limit ILIM Dropout Voltage(1)(3) VD 400 mA IOUT = 1mA 1 IOUT = 50mA 50 mV 65 mV 75 IOUT = 100mA 100 125 mV 155 IOUT = 150mA 150 190 mV 230 Output Voltage Noise, COUT = 1µF Output Voltage Noise, COUT = 100µF Power Supply Rejection Ratio en 10Hz to 100kHz, IOUT = 1mA CBYP = 10nF, VOUT = 1.5V 26 10Hz to 100kHz, IOUT = 1mA CBYP = 10nF, VOUT = 3.3V 54 10Hz to 100kHz, IOUT = 1mA CBYP = 10nF, VOUT = 1.5V 13 10Hz to 100kHz, IOUT = 1mA CBYP = 10nF, VOUT = 3.3V 29 PSRR f = 120Hz, CBYP = 10nF 61 dB tr CBYP = 10nF 1.3 ms VIH 2.25V ≤ VIN ≤ 6.5V VIL 2.25V ≤ VIN ≤ 6.5V IEN 0V ≤ VEN ≤ VIN en µVRMS µVRMS BYP Start-up Rise Time EN Enable Input Threshold Enable Input Bias Current (4) 1.6 V 0.4 -0.5 0 +0.5 µA Over Temperature Protection High Trip Level Hysteresis THI 150 °C THYST 20 °C Notes: (1) Low duty cycle pulse testing with Kelvin connections required. (2) VIN(MIN) = 2.25V. (3) Defined as the input to output differential at which the output voltage drops 100mV below the value measured at a differential of 1V. Not measurable on 1.5V and 1.8V parts due to minimum VIN constraints. (4) Guaranteed by design. 2008 Semtech Corp. 3 www.semtech.com SC1453 POWER MANAGEMENT Pin Configuration Top View (SOT-23-5 & TSOT-23-5) Pin Descriptions Pin # Pin Name 1 IN 2 GND 3 EN Active high enable pin. Connect to IN if not being used. 4 BYP Reference bypass. Connect a 10nF capacitor (typical) between this pin and GND to reduce output noise. 5 OUT Regulator output, sourcing up to 150mA. 2008 Semtech Corp. Pin Function Input pin. Ground pin. Can be used for heatsinking if needed. 4 www.semtech.com SC1453 POWER MANAGEMENT Ordering Information P ackag e SOT-23-5 Voltage Option (V) Part Number 1.5 SC1453ITSK1.5TR SC1453ISK-1.8TR 1.8 SC1453ITSK1.8TR 2.5 SC1453ISK-2.5TR 2.5 SC1453ITSK2.5TR 2.7 SC1453ISK-2.7TR 2.7 SC1453ITSK2.7TR 2.8 SC1453ISK-2.8TR 2.8 SC1453ITSK2.8TR 2.9 SC1453ISK-2.9TR 2.85 SC1453ITSK285TR 3.0 SC1453ISK-3.0TR 2.9 SC1453ITSK2.9TR 3.1 SC1453ISK-3.1TR 3.0 SC1453ITSK3.0TR 3.2 SC1453ISK-3.2TR 3.1 SC1453ITSK3.1TR 3.3 SC1453ISK-3.3TR 3.2 SC1453ITSK3.2TR 1.5 SC1453ISK1.5TRT 3.3 SC1453ITSK3.3TR 1.8 SC1453ISK18TRT 1.5 SC1453ITSK15TRT 2.5 SC1453ISK2.5TRT 1.8 SC1453ITSK18TRT 2.7 SC1453ISK2.7TRT 2.5 SC1453ITSK25TRT 2.8 SC1453ISK2.8TRT 2.7 SC1453ITSK27TRT 2.9 SC1453ISK2.9TRT 2.8 SC1453ITSK28TRT 3.0 SC1453ISK3.0TRT 2.85 SC1453TSK285TRT 3.1 SC1453ISK3.1TRT 2.9 SC1453ITSK29TRT 3.2 SC1453ISK3.2TRT 3.0 SC1453ITSK30TRT 3.3 SC1453ISK33TRT 3.1 SC1453ITSK31TRT 3.2 SC1453ITSK32TRT 3.3 SC1453ITSK33TRT Specify S C 1453E V B Voltage Option (V) Part Number 1.5 SC1453ISK-1.5TR 1.8 (1) Lead-free SOT-23-5 (1)(2) P ackag e TSOT-23-5 Lead-free TSOT-23-5 (1)(2) Notes: (1) Only available in tape and reel packaging. A reel contains 3000 devices. (2) Lead free packaging (ordered with suffix extension “TRT”) is optional. Consult factory for availability. This product is fully WEEE and RoHS compliant. (3) Evaluation board for SC1453. Specify output voltage option when ordering. 2008 Semtech Corp. (1) Evaluation Board (3) 5 www.semtech.com SC1453 POWER MANAGEMENT Marking Information Top Mark Bottom Mark x3XX yyww x = package (5 for SOT-23-5, T for TSOT-23-5) 3 = SC1453 XX = voltage option (examples: 5331 for 3.1V option in SOT-23-5 yyww = Date code (example: 0008 for week 8 of 2000) Top Mark Bottom Mark BX00 yyww For SC1453, 2.85V option: X = L for SOT-23-5 and N for TSOT-23-5 yyww = Date code (example: 0008 for week 8 of 2000) Block Diagram 2008 Semtech Corp. 6 www.semtech.com SC1453 POWER MANAGEMENT Applications Information Theory Of Operation Component Selection - General The SC1453 is intended for applications where very low dropout voltage, low supply current and low output noise are critical. It provides a very simple, low cost solution that uses very little pcb real estate. Only three external capacitors are required for operation (two if a low noise output is not required). Output capacitor - Semtech recommends a minimum capacitance of 1µF at the output with an equivalent series resistance (ESR) of < 1Ω over temperature. While the SC1453 has been designed to be used with ceramic capacitors, it does not have to be used with ceramic capacitors, allowing the designer a choice. Increasing the bulk capacitance will further reduce output noise and improve the overall transient response. The SC1453 contains a bandgap reference trimmed for optimal temperature coefficient which is fed into the inverting input of an error amplifier. The output voltage of the regulator is divided down internally using a resistor divider and compared to the bandgap voltage. The error amplifier drives the gate of a low R DS(ON) P-channel MOSFET pass device. Input capacitor - Semtech recommends the use of a 1µF ceramic capacitor at the input. This allows for the device being some distance from any bulk capacitance on the rail. Additionally, input droop due to load transients is reduced, improving overall load transient response. Bypass capacitor - Semtech recommends the use of a 10nF ceramic capacitor to bypass the bandgap reference. Increasing this capacitor to 100nF will further improve power supply rejection and overall output noise. CBYP may be omitted if low noise operation is not required. An active high enable pin (EN) allows the regulator to be shut down. Pulling this pin low causes the device to enter a very low power shutdown mode, where it will draw typically 0.1µA from the input supply. A bypass pin (BYP) is provided to decouple the bandgap reference to reduce output noise and also to improve power supply rejection. This pin can be left open if low noise operation is not required. Thermal Considerations The worst-case power dissipation for this part is given by: The regulator has its own current limit circuitry to ensure that the output current will not damage the device during output short, overload or start-up. The current limit is guaranteed to be greater than 400mA to allow fast charging of the output capacitor and high initial currents for DSP initialization. PD(MAX ) = (VIN(MAX) − VOUT(MIN) )• IOUT(MAX ) + VIN(MAX ) • IQ(MAX ) For all practical purposes, equation (1) can be reduced to the following expression: PD(MAX) = (VIN(MAX ) − VOUT(MIN) )• IOUT(MAX) The SC1453 has a fast start-up circuit to speed up the initial charging time of the bypass capacitor to enable the output voltage to come up quicker (typically 1.3ms with CBYP = 10nF). (2) Looking at a typical application, 3.3V to 2.8V at 150mA: VIN(MAX) = 3.3 + 5% = 3.465V VOUT(MIN) = 2.8V - 2% = 2.744V IOUT = 150mA TA = 85°C The SC1453 includes thermal shutdown circuitry to turn off the device if T J exceeds 150°C (typical), with the device remaining off until TJ drops by 20°C (typical). Reverse battery protection circuitry ensures that the device cannot be damaged if the input supply is accidentally reversed, limiting the reverse current to less than 1.5mA. 2008 Semtech Corp. (1) 7 www.semtech.com SC1453 POWER MANAGEMENT Applications Information (Cont.) Inserting these values into equation (2) gives us: Layout Considerations PD(MAX ) = (3.465 − 2.744 ) • 0.150 = 108mW While layout for linear devices is generally not as critical as for a switching application, careful attention to detail will ensure reliable operation. Using this figure, we can calculate the maximum thermal impedance allowable to maintain TJ ≤ 125°C: θ JA (MAX ) = (T J(MAX ) − TA (MAX ) ) PD(MAX ) = 1) Attaching the part to a larger copper footprint will enable better heat transfer from the device, especially on PCBs where there are internal ground and power planes. (125 − 85) = 370°C / W 0.108 2) Place the input, output and bypass capacitors close to the device for optimal transient response and device behaviour. With the standard SOT-23-5/TSOT-23-5 Land Pattern shown at the end of this datasheet, and minimum trace widths, the thermal impedance junction to ambient for SC1453ISK is 256°C/W. Thus no additional heatsinking is required for this example. 3) Connect all ground connections directly to the ground plane. If there is no ground plane, connect to a common local ground point before connecting to board ground. The junction temperature can be reduced further (or higher power dissipation can be allowed) by the use of larger trace widths and connecting PCB copper to the GND pin (pin 2), which connects directly to the device substrate. Adding approximately one square inch of PCB copper to pin 2 will reduce θ JA to approximately 130°C/W and T J(MAX) for the example above to approximately 100°C for the SOT-23-5 package. The use of multi layer boards with internal ground/power planes will lower the junction temperature and improve overall output voltage accuracy. 2008 Semtech Corp. 8 www.semtech.com SC1453 POWER MANAGEMENT Typical Characteristics Quiescent Current vs. Junction Temperature Off-State Quiescent Current vs. Input Voltage vs. Junction Temperature 120 200 IOUT = 150mA VIN = 6.5V VIN = 6.5V VEN = 0V 175 100 150 IQ(OFF) (nA) IQ (µA) 80 VIN = 3.8V 60 40 125 100 75 50 20 25 0 0 -50 -25 0 25 50 75 100 125 -50 -25 0 25 TJ (°C) vs. Output Current vs. Input Voltage Change 12 -0.05 REGLINE (mV) IOUT = 50mA -0.15 100mA ≤ IOUT ≤ 150mA -0.20 -0.25 IOUT = 1mA 8 VIN = VOUT + 1V to 6.5V 6 4 2 VIN = VOUT + 1V to 5.5V VIN = VOUT + 1V -0.30 0 -50 -25 0 25 50 75 100 125 -50 -25 0 25 TJ (°C) 50 75 100 125 TJ (°C) Load Regulation vs. Current Limit vs. Junction Temperature Junction Temperature vs. Input Voltage 0.90 VIN = VOUT + 1V IOUT = 0.1mA to 150mA 0.85 8 0.80 7 0.75 6 0.70 ILIM (A) REGLOAD (mV) 125 10 -0.10 9 100 Line Regulation vs. Junction Temperature IOUT = 1mA 10 75 Output Voltage vs. Junction Temperature 0.00 VOUT Deviation (%) 50 TJ (°C) 5 4 0.65 0.60 3 0.55 2 0.50 1 0.45 0 VIN = 6.5V VIN = 3.8V 0.40 -50 -25 0 25 50 75 100 125 -50 TJ (°C) 2008 Semtech Corp. -25 0 25 50 75 100 125 TJ (°C) 9 www.semtech.com SC1453 POWER MANAGEMENT Typical Characteristics (Cont.) Dropout Voltage vs. Junction Temperature Dropout Voltage vs. Output Current vs. Output Current vs. Junction Temperature 200 200 175 175 150 150 IOUT = 150mA 125 VD (mV) VD (mV) 125 100 75 100 75 50 Top to bottom: TJ = 125°C TJ = 25°C TJ = -40°C 50 IOUT = 50mA 25 25 0 0 -50 -25 0 25 50 75 100 125 0 25 50 75 TJ (°C) 100 125 Bypass Start-up Rise Time vs. Junction Temperature Enable Input Threshold Voltage vs. Junction vs. Input Voltage Temperature vs. Input Voltage 1.8 1.7 1.6 CBYP = 10nF 1.6 1.5 VIN = 3.8V 1.4 VEN (V) tr (ms) 150 IOUT (mA) 1.3 1.2 1.4 VIH @ VIN = 6.5V 1.2 VIH @ VIN = 3.8V 1.0 VIL @ VIN = 6.5V 0.8 1.1 VIL @ VIN = 3.8V VIN = 6.5V 1.0 0.6 0.9 0.8 0.4 -50 -25 0 25 50 75 100 125 -50 -25 0 25 TJ (°C) 5.0 4.5 75 Output Spectral Noise Density vs. Frequency Junction Temperature vs. Output Voltage, COUT = 1µF VIN = VOUT + 1V IOUT = 1mA CIN = 1µF CBYP = 10nF TJ = 25°C 1 3.5 en (µV/√Hz) 3.0 2.5 2.0 1.5 0.1 0.01 1.0 0.5 0.0 -25 0 25 50 75 100 Top to bottom: VOUT = 3.3V VOUT = 3.0V VOUT = 2.8V VOUT = 2.5V VOUT = 1.8V VOUT = 1.5V 0.001 0.01 125 TJ (°C) 2008 Semtech Corp. 125 10 VIN = VEN = -6.5V -50 100 Reverse Battery Protection vs. 4.0 I(REV BAT) (mA) 50 TJ (°C) 0.1 1 10 100 1000 f (kHz) 10 www.semtech.com SC1453 POWER MANAGEMENT Typical Characteristics (Cont.) Output Spectral Noise Density vs. Frequency Output Spectral Noise Density vs. Frequency vs. Output Voltage, COUT = 100µF vs. Output Capacitance 10 10 VIN = VOUT + 1V IOUT = 1mA CIN = 1µF CBYP = 10nF TJ = 25°C 0.1 0.01 1 en (µV/√Hz) en (µV/√Hz) 1 Top to bottom: VOUT = 3.3V VOUT = 3.0V VOUT = 2.8V VOUT = 2.5V VOUT = 1.8V VOUT = 1.5V 0.001 0.01 0.1 0.01 0.1 1 10 100 Left to right: COUT = 100µF COUT = 44µF COUT = 22µF COUT = 10µF COUT = 1µF VOUT = 1.5V VIN = 2.5V IOUT = 1mA CBYP = 10nF CIN = 1µF TJ = 25°C 0.001 0.01 1000 0.1 1 f (kHz) 100 Output Spectral Noise Density vs. Frequency Output Spectral Noise Density vs. Frequency vs. Bypass Capacitance vs. Output Current 10 en (µV/√Hz) en (µV/√Hz) VOUT = 1.5V VIN = 2.5V IOUT = 1mA CIN = 1µF COUT = 1µF TJ = 25°C 0.001 0.01 0.1 0.01 0.1 1 10 100 Top to bottom: IOUT = 150mA IOUT = 100mA IOUT = 50mA IOUT = 1mA 1 0.1 0.01 VOUT = 1.5V VIN = 2.5V CIN = 1µF CBYP = 10nF COUT = 1µF TJ = 25°C 0.001 0.01 1000 0.1 1 f (kHz) 10 100 Power Supply Rejection Ratio vs. Frequency vs. Output Voltage, CBYP = 10nF vs. Output Voltage, CBYP = 100nF 80 70 70 60 60 50 50 20 10 VIN = VOUT + 1V CIN = COUT = 1µF CBYP = 10nF IOUT = 1mA TJ = 25°C 0 0.01 0.1 PSRR (dB) 80 40 Top to bottom: VOUT = 1.5V VOUT = 1.8V VOUT = 2.5V VOUT = 2.8V VOUT = 3.0V VOUT = 3.3V 1 40 30 20 10 10 100 VIN = VOUT + 1V CIN = COUT = 1µF CBYP = 100nF IOUT = 1mA TJ = 25°C 0 0.01 1000 f (kHz) 2008 Semtech Corp. 1000 f (kHz) Power Supply Rejection Ratio vs. Frequency 30 1000 10 CBYP = 1nF CBYP = 10nF CBYP = 100nF CBYP = 1µF 1 PSRR (dB) 10 f (kHz) 0.1 Top to bottom: VOUT = 1.5V VOUT = 2.5V VOUT = 1.8V VOUT = 2.8V VOUT = 3.0V VOUT = 3.3V 1 10 100 1000 f (kHz) 11 www.semtech.com SC1453 POWER MANAGEMENT Evaluation Board Schematic J1 RIPPLE MON J2 IN MON J3 1 U1 SC1453 J4 5 OUT IN R1 IN C1 C2 R4 3 EN 2 J5 C3 C5 IQ MON 1 2 3 C4 R2 R3 OUT MON J6 1 2 J8 EN 4 BYP GND J7 FLG EN J10 GND J11 GND J12 GND J13 GND J14 GND J9 LOAD DRV J15 GND Q1 1 2 3 4 J16 1 2 3 S S S G D D D D 8 7 6 5 Si4410 LOAD DRV EN Evaluation Board Bill of Materials Quantity Reference Part/Description Vendor Notes 2 C 1, C 4 Not placed 2 C 2, C 3 1µF ceramic Murata 1 C5 10nF ceramic Various 1 J1 BNC socket Various VOUT ripple monitor 3 J2 - J4 Test pin Various Red 1 J5 Test pin Various White 1 J6 Header, 2 pin Various 1 J7 Not placed 2 J8 , J1 6 Header, 3 pin Various 1 J9 Test pin Various Orange 6 J1 0 - J1 5 Test pin Various Black (J14 not placed) 1 Q1 S i 4410 Vishay 2 R1, R2 Not placed 1 R3 See next page Various 1 R4 10kΩ, 1/10W Various 1 U1 SC1453ISK-X.X or SC1453ITSK-XX Semtech 2008 Semtech Corp. 12 GRM42-6X7R105K10 www.semtech.com SC1453 POWER MANAGEMENT Evaluation Board Gerber Plots Top Copper Bottom Copper Top Silk Screen 2008 Semtech Corp. 13 Output Voltage Option (V) R3 Value/Siz e 1.5 10Ω/0.5W 1.8 12Ω/0.5W 2.5 16Ω/0.5W 2.6 16Ω/0.5W 2.7 18Ω/0.5W 2.8 18Ω/0.5W 2.85 18Ω/0.5W 2.9 18Ω/0.5W 3.0 20Ω/0.5W 3.1 20Ω/0.5W 3.2 22Ω/0.5W 3.3 22Ω/0.5W www.semtech.com SC1453 POWER MANAGEMENT Outline Drawing - SOT-23-5 DIMENSIONS MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX A e1 2X E/2 D A A1 A2 b c D E1 E e e1 L L1 N 01 aaa bbb ccc N EI 1 E 2 ccc C 2X N/2 TIPS e B D aaa C A2 .035 .000 .035 .010 .003 .110 .060 - .045 - .057 .006 .051 .020 .009 .118 .069 .114 .063 .110 BSC .037 BSC .075 BSC .012 .018 .024 (.024) 5 0° 10° .004 .008 .008 0.90 0.00 .90 0.25 0.08 2.80 1.50 - 1.15 - 1.45 0.15 1.30 0.50 0.22 3.00 1.75 2.90 1.60 2.80 BSC 0.95 BSC 1.90 BSC 0.30 0.45 0.60 (0.60) 5 0° 10° 0.10 0.20 0.20 A SEATING PLANE A1 C H bxN bbb C A-B D c GAGE PLANE 0.25 L 01 (L1) SEE DETAIL A DETAIL A SIDE VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. Land Pattern - SOT-23-5 X DIM (C) G Z Y P DIMENSIONS MILLIMETERS INCHES (.098) .055 .037 .024 .043 .141 C G P X Y Z (2.50) 1.40 0.95 0.60 1.10 3.60 NOTES: 1. 2008 Semtech Corp. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 14 www.semtech.com SC1453 POWER MANAGEMENT Outline Drawing - TSOT-23-5 DIM A e1 A A1 A2 b c D E1 E e e1 L L1 N 01 aaa bbb ccc D N 2X E/2 E1 1 E 2 ccc C 2X N/2 TIPS e B D aaa C A2 SEATING PLANE DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX - .000 .028 .012 .003 .110 .060 bxN bbb .039 .004 .035 .020 .008 .118 .067 .114 .063 .110 BSC .037 BSC .075 BSC .012 .018 .024 (.024) 5 0° 8° .004 .008 .010 - 0.00 0.70 0.30 0.08 2.80 1.50 - 1.00 0.10 0.90 0.50 0.20 3.00 1.70 2.90 1.60 2.80 BSC 0.95 BSC 1.90 BSC 0.30 0.45 0.60 (0.60) 5 0° 8° 0.10 0.20 0.25 A H A1 C - c GAGE PLANE C A-B D 0.25 L 01 (L1) DETAIL SEE DETAIL A A SIDE VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MO-193, VARIATION AB. Land Pattern - TSOT-23-5 X DIM (C) G Z Y P C G P X Y Z DIMENSIONS INCHES MILLIMETERS (.087) .031 .037 .024 .055 .141 (2.20) 0.80 0.95 0.60 1.40 3.60 NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. Contact Information Semtech Corporation Power Management Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2008 Semtech Corp. 15 www.semtech.com