SMDA05C THRU SMDA24C Bidirectional TVS Array for Protection of Four Lines PROTECTION PRODUCTS Description Features Transient protection for data lines to The SMDAxxC series of TVS arrays are designed to provide bidirectional protection for sensitive electronics from damage or latch-up due to ESD, lightning and other voltage-induced transient events. Each device will protect four data or I/O lines. They are available with operating voltages of 5V, 12V, 15V and 24V. TVS diodes are solid-state devices designed specifically for transient suppression. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage and no device degradation. The low profile SO-8 package allows the user to protect up to four independent lines with one package. The SMDAxxC series is suitable protection for sensitive semiconductors components such as microprocessors, ASICs, transceivers, transducers, and CMOS memory. IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 12A (8/20µs) Bidirectional protection Small SO-8 package Protects four I/O lines Working voltages: 5V, 12V, 15V and 24V Low leakage current Low operating and clamping voltages Solid-state silicon avalanche technology Mechanical Characteristics JEDEC SO-8 package Molding compound flammability rating: UL 94V-0 Marking : Part number, date code, logo Packaging : Tube or Tape and Reel per EIA 481 Applications The SMDAxxC series devices may be used to meet the ESD immunity requirements of IEC 61000-4-2, level 4 for air and contact discharge. Data and I/O Lines Microprocessor based equipment Notebooks, Desktops, and Servers Instrumentation LAN/WAN equipment Peripherals Serial and Parallel Ports Schematic & PIN Configuration 1 8 2 7 3 6 4 5 SO-8 (Top View) Revision 08/15/06 1 www.semtech.com SMDA05C THRU SMDA24C PROTECTION PRODUCTS Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Power (tp = 8/20µs) Ppk 300 Watts ESD Voltage (HBM per IEC 61000-4-2) VESD >25 kV Lead Soldering Temperature TL 260 (10 sec.) °C Operating Temperature TJ -55 to +125 °C TSTG -55 to +150 °C Storage Temperature Electrical Characteristics (T=25oC) SMDA05C Parameter Symbol Conditions Minimum Typical Maximum Units 5 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 5V, T=25°C 20 µA Clamp ing Voltage VC IPP = 1A, tp = 8/20µs 9.8 V Clamp ing Voltage VC IPP = 5A, tp = 8/20µs 11 V Maximum Peak Pulse Current IP P tp = 8/20µs 17 A Junction Cap acitance Cj VR = 0V, f = 1MHz 350 pF Symbol Conditions Maximum Units 12 V 6 V SMDA12C Parameter Minimum Typical Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 12V, T=25°C 1 µA Clamp ing Voltage VC IPP = 1A, tp = 8/20µs 19 V Clamp ing Voltage VC IPP = 5A, tp = 8/20µs 24 V Maximum Peak Pulse Current IP P tp = 8/20µs 12 A Junction Cap acitance Cj VR = 0V, f = 1MHz 120 pF 2005 Semtech Corp. 2 13.3 V www.semtech.com SMDA05C THRU SMDA24C PROTECTION PRODUCTS Electrical Characteristics (Continued) SMDA15C Parameter Symbol Conditions Minimum Typical Maximum Units 15 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 15V, T=25°C 1 µA Clamp ing Voltage VC IPP = 1A, tp = 8/20µs 24 V Clamp ing Voltage VC IPP = 5A, tp = 8/20µs 30 V Maximum Peak Pulse Current IP P tp = 8/20µs 10 A Junction Cap acitance Cj VR = 0V, f = 1MHz 75 pF Symbol Conditions Maximum Units 24 V 16.7 V SMDA24C Parameter Minimum Typical Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 24V, T=25°C 1 µA Clamp ing Voltage VC IPP = 1A, tp = 8/20µs 43 V Clamp ing Voltage VC IPP = 5A, tp = 8/20µs 55 V Maximum Peak Pulse Current IP P tp = 8/20µs 5 A Junction Cap acitance Cj VR = 0V, f = 1MHz 50 pF 2005 Semtech Corp. 3 26.7 V www.semtech.com SMDA05C THRU SMDA24C PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 10 110 Peak Pulse Power - PPP (kW) 100 % of Rated Power or IPP 90 1 0.1 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10 100 0 1000 25 50 75 100 125 150 Ambient Temperature - TA (oC) Pulse Duration - tp (µs) Pulse Waveform 110 Waveform Parameters: tr = 8µs td = 20µs 100 90 Percent of I PP 80 70 e-t 60 50 40 td = IPP/2 30 20 10 0 0 5 10 15 20 25 30 Time (µs) ESD Pulse Waveform (IEC 61000-4-2) IEC 61000-4-2 Discharge Parameters Level 2005 Semtech Corp. 4 First Peak Current Peak Current at 30 ns Peak Current at 60 ns Test Test Voltage Voltage (Contact (A ir Discharge) Discharge) (kV) ( kV ) (A ) (A ) (A ) 1 7.5 4 8 2 2 2 15 8 4 4 4 3 22.5 12 6 6 8 4 30 16 8 8 15 www.semtech.com SMDA05C THRU SMDA24C PROTECTION PRODUCTS Applications Information Device Connection for Protection of Four Data Lines Circuit Diagram The SMDAxxC series of devices are designed to protect up to four data lines. The devices are connected as follows: z The SMDAxxC are bidirectional devices and are designed for use on lines where the normal operating voltage is above and below ground. Pins 1, 2, 3, and 4 are connected to the protected lines. Pins 5, 6, 7, and 8 are connected to ground. Since the device is electrically symmetrical, these connections may be reversed. The ground connections should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. 1 8 2 7 3 6 4 5 I/O Line Protection Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z z z z z z Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Typical Connection Matte Tin Lead Finish To Protected Device Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 2005 Semtech Corp. 1 8 2 7 3 6 4 5 Ground From Connector 5 www.semtech.com SMDA05C THRU SMDA24C PROTECTION PRODUCTS Outline Drawing - SO-8 A e N h D h H 2X E/2 E1 E 1 c GAGE PLANE 2 0.25 ccc C 2X N/2 TIPS DIM L (L1) e/2 DETAIL B 01 A D aaa C SEATING PLANE A2 A C .053 .069 .010 .004 .065 .049 .012 .020 .010 .007 .189 .193 .197 .150 .154 .157 .236 BSC .050 BSC .010 .020 .016 .028 .041 (.041) 8 8° 0° .004 .010 .008 1.35 1.75 0.10 0.25 1.25 1.65 0.31 0.51 0.17 0.25 4.80 4.90 5.00 3.80 3.90 4.00 6.00 BSC 1.27 BSC 0.25 0.50 0.40 0.72 1.04 (1.04) 8 0° 8° 0.10 0.25 0.20 SIDE VIEW A1 bxN bbb A SEE DETAIL A A1 A2 b c D E1 E e h L L1 N 01 aaa bbb ccc DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX C A-B D NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MS-012, VARIATION AA. Land Pattern - SO-8 X DIM (C) G Z Y C G P X Y Z DIMENSIONS INCHES MILLIMETERS (.205) .118 .050 .024 .087 .291 (5.20) 3.00 1.27 0.60 2.20 7.40 P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2. REFERENCE IPC-SM-782A, RLP NO. 300A. 2005 Semtech Corp. 6 www.semtech.com SMDA05C THRU SMDA24C PROTECTION PRODUCTS Ordering Information Part Number Working Voltage Lead Finish Qty per Reel Reel Size SMDA05C.TB 5 SnPb 500 7 Inch SMDA12C.TB 12 SnPb 500 7 Inch SMDA15C.TB 15 SnPb 500 7 Inch SMDA24C.TB 24 SnPb 500 7 Inch SMDA05C.TBT 5 Pb Free 500 7 Inch SMDA12C.TBT 12 Pb Free 500 7 Inch SMDA15C.TBT 15 Pb Free 500 7 Inch SMDA24C.TBT 24 Pb Free 500 7 Inch SMDA05C 5 SnPb 95/Tube N/A SMDA12C 12 SnPb 95/Tube N/A SMDA15C 15 SnPb 95/Tube N/A SMDA24C 24 SnPb 95/Tube N/A SMDA05C.T 5 Pb Free 95/Tube N/A SMDA12C.T 12 Pb Free 95/Tube N/A SMDA15C.T 15 Pb Free 95/Tube N/A SMDA24C.T 24 Pb Free 95/Tube N/A Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2005 Semtech Corp. 7 www.semtech.com