SMDA05C-5 THRU SMDA24C-5 Bidirectional TVS Array for Protection of Five Lines PROTECTION PRODUCTS Description Features Transient protection for data lines to The SMDAxxC-5 series of transient voltage suppressors are designed to protect components which are connected to data and transmission lines from voltage surges caused by electrostatic discharge (ESD), electrical fast transients (EFT), and lightning. TVS diodes are characterized by their high surge capability, low operating and clamping voltages, and fast response time. This makes them ideal for use as board level protection of sensitive semiconductor components. The SMDAxxC-5 is designed to provide transient suppression on multiple data lines and I/O ports. The low profile SO-8 design allows the user to protect up to five data and I/O lines with one package. IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 12A (8/20µs) Small SO-8 surface mount package Protects five I/O lines Working voltages: 5V, 12V, 15V and 24V Low leakage current Low operating and clamping voltages Solid-state silicon avalanche technology Mechanical Characteristics The SMDAxxC-5 TVS diode array will meet the surge requirements of IEC 61000-4-2 (Formerly IEC 801-2), Level 4, “Human Body Model” for air and contact discharge. JEDEC SO-8 package Molding compound flammability rating: UL 94V-0 Marking : Part number, date code, logo Packaging : Tube or Tape and Reel per EIA 481 Applications RS-232 and RS-422 Data Lines Microprocessor Based Equipment LAN/WAN Equipment Notebooks, Desktops, and Servers Instrumentation Peripherals Set Top Box Serial and Parallel Ports Schematic and PIN Configuration SO-8 (Top View) Revision 08/15/06 1 www.semtech.com SMDA05C-5 THRU SMDA24C-5 PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20µs) Pp k 300 Watts Lead Soldering Temperature TL 260 (10 sec.) °C Operating Temperature TJ -55 to +125 °C TSTG -55 to +150 °C Storage Temperature Electrical Characteristics SMDA05C-5 Parameter Symbol Conditions Minimum Typical Maximum Units 5 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 5V, T=25°C 20 µA Clamping Voltage VC IPP = 1A, tp = 8/20µs 9.8 V Maximum Peak Pulse Current IP P tp = 8/20µs 17 A Junction Capacitance Cj Between I/O Pins and Ground VR = 0V, f = 1MHz 350 pF Symbol Conditions Maximum Units 12 V 6 V SMDA12C-5 Parameter Minimum Typical Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 12V, T=25°C 1 µA Clamping Voltage VC IPP = 1A, tp = 8/20µs 19 V Maximum Peak Pulse Current IP P tp = 8/20µs 12 A Junction Capacitance Cj Between I/O Pins and Ground VR = 0V, f = 1MHz 120 pF 2004 Semtech Corp. 2 16.7 V www.semtech.com SMDA05C-5 THRU SMDA24C-5 PROTECTION PRODUCTS Electrical Characteristics SMDA15C-5 Parameter Symbol Conditions Minimum Typical Maximum Units 15 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 15V, T=25°C 1 µA Clamping Voltage VC IPP = 1A, tp = 8/20µs 24 V Maximum Peak Pulse Current IP P tp = 8/20µs 10 A Junction Capacitance Cj Between I/O Pins and Ground VR = 0V, f = 1MHz 75 pF Symbol Conditions Maximum Units 24 V 16.7 V SMDA24C-5 Parameter Minimum Typical Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 24V, T=25°C 1 µA Clamp ing Voltage VC IPP = 1A, tp = 8/20µs 43 V Maximum Peak Pulse Current IP P tp = 8/20µs 5 A Junction Cap acitance Cj Between I/O Pins and Ground VR = 0V, f = 1MHz 50 pF 2004 Semtech Corp. 3 26.7 V www.semtech.com SMDA05C-5 THRU SMDA24C-5 PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 10 110 % of Rated Power or PI P Peak Pulse Power - PPk (kW) 100 1 0.1 90 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10 100 0 1000 25 50 75 100 125 150 Ambient Temperature - TA (oC) Pulse Duration - tp (µs) Pulse Waveform 110 Waveform Parameters: tr = 8µs td = 20µs 100 90 Percent of I PP 80 70 e-t 60 50 40 td = IPP/2 30 20 10 0 0 5 10 15 20 25 30 Time (µs) ESD Pulse Waveform (Per IEC 61000-4-2) IEC 61000-4-2 Discharge Parameters Level 2004 Semtech Corp. 4 First Peak Current Peak Current at 30 ns Peak Current at 60 ns Test Test Voltage Voltage (Contact (A ir Discharge) Discharge) ( kV ) (kV) (A ) (A ) (A ) 1 7.5 4 8 2 2 2 15 8 4 4 4 3 22.5 12 6 6 8 4 30 16 8 8 15 www.semtech.com SMDA05C-5 THRU SMDA24C-5 PROTECTION PRODUCTS Applications Information Circuit Diagram Device Connection for Protection of Five Data Lines The SMDAxxC-5 is designed to protect up to 5 data or I/O lines. They are bidirectional devices and may be used on lines where the signal polarities are above and below ground. The SMDAxxC-5 TVS arrays employ a monolithic structure. Therefore, the working voltage (VRWM) and breakdown voltage (VBR) specifications apply to the differential voltage between any two data line pins. For example, the SMDA24C-5 is designed for a maximum voltage excursion of ±12V between any two data lines. The device is connected as follows: z Connection Diagram Pins 1, 2, 3, 4, and 5 are connected to the lines that are to be protected. Pin 8 is connected to ground. The ground connections should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Pins 6 and 7 are not connected. DATA IN DATA OUT 8 7 6 5 1 2 3 4 Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z Place the TVS near the input terminals or connectors to restrict transient coupling. z Minimize the path length between the TVS and the protected line. z Minimize all conductive loops including power and ground loops. z The ESD transient return path to ground should be kept as short as possible. z Never run critical signals near board edges. z Use ground planes whenever possible. DATA IN DATA OUT Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both 2004 Semtech Corp. lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 5 www.semtech.com SMDA05C-5 THRU SMDA24C-5 PROTECTION PRODUCTS Outline Drawing - SO-8 A e N h D h H 2X E/2 E1 E 1 c GAGE PLANE 2 0.25 ccc C 2X N/2 TIPS DIM L (L1) e/2 DETAIL B 01 A D aaa C SEATING PLANE A2 A C .053 .069 .010 .004 .065 .049 .012 .020 .010 .007 .189 .193 .197 .150 .154 .157 .236 BSC .050 BSC .010 .020 .016 .028 .041 (.041) 8 8° 0° .004 .010 .008 1.35 1.75 0.10 0.25 1.25 1.65 0.31 0.51 0.17 0.25 4.80 4.90 5.00 3.80 3.90 4.00 6.00 BSC 1.27 BSC 0.25 0.50 0.40 0.72 1.04 (1.04) 8 0° 8° 0.10 0.25 0.20 SIDE VIEW A1 bxN bbb A SEE DETAIL A A1 A2 b c D E1 E e h L L1 N 01 aaa bbb ccc DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX C A-B D NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MS-012, VARIATION AA. Land Pattern - SO-8 X DIM (C) G Z Y C G P X Y Z DIMENSIONS INCHES MILLIMETERS (.205) .118 .050 .024 .087 .291 (5.20) 3.00 1.27 0.60 2.20 7.40 P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2. REFERENCE IPC-SM-782A, RLP NO. 300A. 2004 Semtech Corp. 6 www.semtech.com SMDA05C-5 THRU SMDA24C-5 PROTECTION PRODUCTS Ordering Information Part Number Lead Finish Qty per Reel Reel Size SMDA05C-5.TB SnPb 500 7 Inch SMDA12C-5.TB SnPb 500 7 Inch SMDA15C-5.TB SnPb 500 7 Inch SMDA24C-5.TB SnPb 500 7 Inch SMDA05C-5.TBT Pb Free 500 7 Inch SMDA12C-5.TBT Pb Free 500 7 Inch SMDA15C-5.TBT Pb Free 500 7 Inch SMDA24C-5.TBT Pb Free 500 7 Inch SMDA05C-5 SnPb 95/Tube N/A SMDA12C-5 SnPb 95/Tube N/A SMDA15C-5 SnPb 95/Tube N/A SMDA24C-5 SnPb 95/Tube N/A SMDA05C-5.T Pb Free 95/Tube N/A SMDA12C-5.T Pb Free 95/Tube N/A SMDA15C-5.T Pb Free 95/Tube N/A SMDA24C-5.T Pb Free 95/Tube N/A Note: Lead-free devices are RoHS/WEEE Compliant Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2004 Semtech Corp. 7 www.semtech.com