SMF05C TVS Diode Array For ESD and Latch-Up Protection PRELIMINARY PROTECTION PRODUCTS Description Features The SMF series TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD and other voltage-induced transient events. They are designed for use in applications where board space is at a premium. Each device will protect up to five lines. They are unidirectional devices and may be used on lines where the signal polarities are above ground. TVS diodes are solid-state devices designed specifically for transient suppression. They feature large cross-sectional area junctions for conducting high transient currents. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The SMF series devices may be used to meet the immunity requirements of IEC 61000-4-2, level 4. The small SC70 package makes them ideal for use in portable electronics such as cell phones, PDA’s, notebook computers, and digital cameras. ESD protection for data lines to Mechanical Characteristics 3 Cellular Handsets and Accessories Cordless Phones Personal Digital Assistants (PDA’s) Notebooks and Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players Schematic & PIN Configuration 4 5 6 2 Revision 08/04/04 EIAJ SC70-6L package Molding compound flammability rating: UL 94V-0 Marking : Marking Code Packaging : Tape and Reel per EIA 481 Applications Circuit Diagram 1 IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) Small package for use in portable electronics Protects five I/O lines Working voltage: 5V Low leakage current Low operating and clamping voltages Solid-state silicon-avalanche technology 1 6 2 5 3 4 SC70-6L (Top View) 1 www.semtech.com SMF05C PRELIMINARY PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20µs) Pp k 100 Watts Peak Pulse Current (tp = 8/20µs) IP P 8 A ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) VESD 20 15 kV Lead Soldering Temperature TL 260 (10 seconds) o Operating Temperature TJ -55 to +125 o TSTG -55 to +150 o Storage Temperature C C C Electrical Characteristics SMF05C Parameter Symbol Conditions Minimum Typical Maximum Units 5 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 5V, T=25°C 5 µA Clamping Voltage VC IPP = 5A, tp = 8/20µs 9.8 V Clamping Voltage VC IPP = 8A, tp = 8/20µs 12.5 V Junction Capacitance Cj VR = 0V, f = 1MHz 130 pF 2004 Semtech Corp. 2 6 V www.semtech.com SMF05C PRELIMINARY PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 110 10 90 % of Rated Power or IPP Peak Pulse Power - Ppk (kW) 100 1 0.1 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10 100 0 1000 25 Percent of IPP 80 -t e 50 td = IPP/2 30 20 10 7 6 5 4 Waveform Parameters: tr = 8µs td = 20µs 3 2 1 0 5 10 15 150 8 Clamping Voltage - VC (V) 90 0 125 9 Waveform Parameters: tr = 8µs td = 20µs 100 40 100 Clamping Voltage vs. Peak Pulse Current 110 60 75 o Pulse Waveform 70 50 Ambient Temperature - TA ( C) Pulse Duration - tp (µs) 20 25 30 0 Time (µs) 0 2 4 6 8 10 Peak Pulse Current - IPP (A) Capacitance vs. Reverse Voltage ESD Clamping Characteristics (8kV Contact Discharge per IEC 61000-4-2) 140 Capacitance - Cj (pF) 120 100 80 60 40 20 f = 1MHz 0 0 1 2 3 4 5 6 Reverse Voltage - VR (V) 2004 Semtech Corp. 3 www.semtech.com SMF05C PRELIMINARY PROTECTION PRODUCTS Applications Information Device Connection for Protection of Five Data Lines SMF05C Circuit Diagram The SMF05C is designed to protect up to five unidirectional data lines. The device is connected as follows: 1 3 4 5 6 1. Unidirectional protection of five I/O lines is achieved by connecting pins 1, 3, 4, 5 and 6 to the data lines. Pin 2 is connected to ground. The ground connection should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Circuit Board Layout Recommendations for Suppression of ESD. 2 Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z Place the SMF05C near the input terminals or connectors to restrict transient coupling. z Minimize the path length between the SMF05C and the protected line. z Minimize all conductive loops including power and ground loops. z The ESD transient return path to ground should be kept as short as possible. z Never run critical signals near board edges. z Use ground planes whenever possible. Protection of Five Unidirectional Lines Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 2004 Semtech Corp. 4 www.semtech.com SMF05C PRELIMINARY PROTECTION PRODUCTS Typical Applications 2004 Semtech Corp. 5 www.semtech.com SMF05C PRELIMINARY PROTECTION PRODUCTS Outline Drawing - SC70 6L A e1 D DIM N 2X E/2 EI ccc C 2X N/2 TIPS 1 SEE DETAIL E 2 e H c GAGE PLANE D 0.15 aaa C L (L1) A2 A DETAIL C A SIDE VIEW B SEATING PLANE A A1 A2 b c D E1 E e e1 L L1 N 01 aaa bbb ccc 01 DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .043 .000 .004 .028 .035 .039 .012 .006 .003 .009 .075 .079 .083 .045 .049 .053 .083 BSC .026 BSC .051 .010 .014 .018 (.017) 6 0° 8° .004 .004 .012 1.10 0.00 0.10 0.70 0.90 1.00 0.15 0.30 0.08 0.22 1.90 2.00 2.10 1.15 1.25 1.35 2.10 BSC 0.65 BSC 1.30 BSC 0.26 0.36 0.46 (0.42) 6 0° 8° 0.10 0.10 0.30 A A1 bxN bbb C A-B D NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MO-203, VARIATION AB. Land Pattern - SC70 6L X DIM C G C G P X Y Z Z Y DIMENSIONS INCHES MILLIMETERS (.073) .039 .026 .016 .033 .106 (1.85) 1.00 0.65 0.40 0.85 2.70 P NOTES: 1. 2004 Semtech Corp. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 6 www.semtech.com SMF05C PRELIMINARY PROTECTION PRODUCTS Marking Codes Part Number Marking Code SMF05C 5C Note: (1) Pin 1 Identified with a dot Ordering Information Part Number Lead Finish Qty per Reel R eel Size SMF05C.TC SnPb 3,000 7 Inch SMF05C.TCT Matte Sn 3,000 7 Inch Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2004 Semtech Corp. 7 www.semtech.com