uClamp1211P µClampTM 1-Line ESD protection PROTECTION PRODUCTS - MicroClampTM Description Features The µClamp series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD. It is designed to replace multilayer varistors (MLVs) in portable applications. It features large crosssectional area junctions for conducting high transient currents. It offers superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. TM Transient protection for data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (tp = 5/50ns) Cable Discharge Event (CDE) Ultra-small package (1.0 x 0.6 x 0.5mm) Protects one I/O or power line Low clamping voltage Working voltage: ±12V Low leakage current Solid-state silicon-avalanche technology Mechanical Characteristics The µClamp 1211P is in a 2-pin, RoHS/WEEE compliant, SLP1006P2 package. It measures 1.0 x 0.6 x 0.5mm. The leads are spaced at a pitch of 0.65mm and are finished with lead-free NiPdAu. Each device will protect one bidirectional line operating at ±12 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, ±8kV contact discharge). The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players. TM SLP1006P2 package Molding compound flammability rating: UL 94V-0 Marking : Marking code Packaging : Tape and Reel Lead Finish: NiPdAu RoHS/WEEE Compliant Applications Dimensions Cellular Handsets & Accessories Cordless Phones Personal Digital Assistants (PDAs) Notebooks & Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players Schematic & PIN Configuration 1.0 0.60 0.65 0.50 Maximum Dimensions (mm) Revision 08/23/2007 SLP1006P2 (Bottom View) 1 www.semtech.com uClamp1211P PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20µs) Pp k 200 Watts Peak Pulse Current (tp = 8/20µs) Ip p 7 Amps ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) VESD ±15 ±8 kV TJ -55 to +125 °C TSTG -55 to +150 °C Op erating Temp erature Storage Temp erature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Minimum Typical Maximum Units 12 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 12V, T=25°C 1 µA Clamping Voltage VC IPP = 1A, tp = 8/20µs 19 V Clamping Voltage VC IPP = 7A, tp = 8/20µs 28.5 V Junction Capacitance Cj VR = 0V, f = 1MHz 25 pF 2007 Semtech Corp. 2 13.3 V www.semtech.com uClamp1211P PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 10 110 Peak Pulse Power - Ppk (kW) 100 % of Rated Power or I PP 90 1 0.1 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10 100 0 1000 25 50 75 100 125 150 Ambient Temperature - TA (oC) Pulse Duration - tp (µs) Normalized Junction Capacitance vs. Reverse Voltage Clamping Voltage vs. Peak Pulse Current 30 1.1 f = 1 MHz 1 0.9 0.8 20 CJ(VR) / CJ(VR=0) Clamping Voltage - VC (V) 25 15 10 Waveform Parameters: tr = 8µs td = 20µs 5 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 0 1 2 3 4 5 Peak Pulse Current - IPP (A) 6 7 8 0 LOG 2 3 Reverse Voltage - VR (V) 4 5 ESD Clamping (8kV Contact per IEC 61000-4-2) Insertion Loss (S21) CH1 S21 1 6 dB / REF 0 dB 1: -3.0028 dB 334MHz 2: -11.453 dB 900 MHz 0 dB 4 3: -17.015 dB 1.8 GHz -6 dB -12 dB 3 1 -18 dB 4: -10.370 dB 2.5 GHz 2 -24 dB -30 dB -36 dB -42 dB -48 dB 1 MHz START . 030 MHz 2007 Semtech Corp. 10 MHz 100 MHz 3 1 GHz GHz Note: Data is taken with a 10x attenuator STOP 3000. 000000 MHz 3 www.semtech.com uClamp1211P PROTECTION PRODUCTS Applications Information Device Connection Options Circuit Diagram This TVS diode is designed to protect one data, I/O, or power supply line. The device is bidirectional and may be used on lines where the signal polarity can go above and below ground. The device is symmetrical, and therefore, the orientation of the device is not critical. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z Place the TVS near the input terminals or connectors to restrict transient coupling. z Minimize the path length between the TVS and the protected line. z Minimize all conductive loops including power and ground loops. z The ESD transient return path to ground should be kept as short as possible. z Never run critical signals near board edges. z Use ground planes whenever possible. 2007 Semtech Corp. 4 www.semtech.com uClamp1211P PROTECTION PRODUCTS Applications Information - Spice Model uClamp1211P Spice Model Table 1 - µClamp1211P Spice Parameters 2007 Semtech Corp. Parameter Unit D1 (T VS) D2 (T VS) IS Amp 1.48E-14 1.48E-14 BV Volt 15.5 15.5 VJ Volt 0.7 0.7 RS Ohm 0.721 0.721 IB V Amp 1E-3 1E-3 CJO Farad 10E-12 10E-12 TT sec 2.541E-9 2.541E-9 M -- 0.201 0.201 N -- 1.1 1.1 EG eV 1.11 1.11 5 www.semtech.com uClamp1211P PROTECTION PRODUCTS Outline Drawing - SLP1006P2 A B D DIMENSIONS INCHES MILLIMETERS DIM MIN NOM MAX MIN NOM MAX E A A1 b D E e L R N aaa bbb TOP VIEW A SEATING PLANE aaa C C A1 .016 .020 .022 .000 .001 .002 .018 .020 .022 .035 .039 .043 .020 .024 .028 .026 BSC .008 .010 .012 .002 .004 .006 2 .003 .004 0.40 0.50 0.55 0.00 0.03 0.05 0.45 0.50 0.55 0.90 1.00 1.10 0.50 0.60 0.70 0.65 BSC 0.20 0.25 0.30 0.05 0.10 0.15 2 0.08 0.10 PIN 1 ID R bxN bbb C A B 2x L e BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP1006P2 DIMENSIONS Y (C) DIM C G X Y Z Z G X INCHES (.033) .012 .024 .022 .055 MILLIMETERS (0.85) 0.30 0.60 0.55 1.40 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2007 Semtech Corp. 6 www.semtech.com uClamp1211P PROTECTION PRODUCTS Marking Code Ordering Information S Part Number Working Voltage uClamp 1211P.TCT 12V Device Qty per Marking Reel S 3,000 Reel Size 7 Inch MicroClamp, uClamp and µClamp are marks of Semtech Corporation PIN 1 ID Tape and Reel Specification A0 0.69 +/-0.10 mm B0 K0 1.19 +/-0.10 mm 0.66 +/-0.10 mm Tape Width B, (Max) D D1 8 mm 4.2 mm (.165) 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) 0.4 mm ±0.25 (.031) E 1.750±.10 mm (.069±.004) F P P0 P2 T W 3.5±0.05 mm (.138±.002) 4.0±0.10 mm (.157±.004) 4.0±0.1 mm (.157±.004) 2.0±0.05 mm (.079±.002) 0.254±0.02 mm (.016) 8.0 mm + 0.3 mm - 0.1 mm (.312±.012) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2007 Semtech Corp. 7 www.semtech.com