uClamp2511T Low Profile μClamp® 1-Line ESD protection PROTECTION PRODUCTS - MicroClamp® Description Features ® The μClamp series of Transient Voltage Suppressors (TVS) are designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and PDAs. They offer superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs. They are designed to protect sensitive semiconductor components from damage or upset due to electrostatic discharge (ESD), lightning, electrical fast transients (EFT), and cable discharge events (CDE). Transient protection for data lines to The μClamp®2511T is constructed using Semtech’s proprietary EPD process technology. The EPD process provides low standoff voltages with significant reductions in leakage currents and capacitance over siliconavalanche diode processes. They feature a true operating voltage of 2.5 volts for superior protection when compared to traditional pn junction devices. The μClamp2511T is in a 2-pin SLP1006P2T package. It measures 1.0 x 0.6 x 0.4mm. The leads are spaced at a pitch of 0.65mm and are finished with lead-free NiPdAu. Each device will protect one line operating at 2.5 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, ±8kV contact discharge). The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players. IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (tp = 5/50ns) Cable Discharge Event (CDE) Ultra-small package (1.0 x 0.6 x 0.4mm) Protects one data line Low reverse current: 10nA typical (VR=2.5V) Working voltage: 2.5V Low leakage current Solid-state silicon-avalanche technology Mechanical Characteristics SLP1006P2T package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 1.0 x 0.6 x 0.4 mm Lead Finish: NiPdAu Molding compound flammability rating: UL 94V-0 Marking : Marking code Packaging : Tape and Reel Applications Dimensions Cellular Handsets & Accessories Portable Instrumentation Keypads, Side Keys, LCD Displays Notebooks & Desktop Computers MP3 Players Schematic & PIN Configuration 1.0 0.60 0.65 0.40 Nominal Dimensions (mm) Revision 10/09/2009 SLP1006P2T (Bottom View) 1 www.semtech.com uClamp2511T PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20μs) Pp k 40 Watts Maximum Peak Pulse Current (tp = 8/20μs) Ip p 5 Amps VESD +/- 20 +/- 15 kV TJ -40 to +85 °C TSTG -55 to +150 °C ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) Op erating Temp erature Storage Temp erature Electrical Characteristics (T=25oC) Parameter Reverse Stand-Off Voltage Symbol Conditions Minimum VRWM Punch-Through Voltage V PT IPT = 2μA 2.7 Snap -Back Voltage VSB ISB = 50mA 2.8 Reverse Leakage Current IR VRWM = 2.5V Clamp ing Voltage VC Clamp ing Voltage Junction Cap acitance © 2009 Semtech Corp. Typical 3.1 Maximum Units 2.5 V 3.6 V V 0.05 μA IPP = 1A, tp = 8/20μs 5.5 V VC IPP = 5A, tp = 8/20μs 8 V I/O p in to Gnd VR = 0V, f = 1MHz 10 pF Cj 2 0.01 6 www.semtech.com uClamp2511T PROTECTION PRODUCTS Non-Repetitive Peak Pulse Power vs. Pulse Time Clamping Voltage vs. Peak Pulse Current 10 1 Clamping Voltage - VC (V) Peak Pulse Power - P PP (kW) 9 0.1 8 7 6 5 4 3 Waveform Parameters: tr = 8μs td = 20μs 2 1 0 0.01 0.1 1 10 100 0 1000 1 2 3 4 5 Peak Pulse Current - IPP (A) Pulse Duration - tp (s) Typical Insertion Loss (S21) Normalized Junction Capacitance vs. Reverse Voltage CH1 S21 LOG 6 dB / REF 0 dB 1: -2.2287 dB 800 MHz 1.6 f = 1 MHz 1.4 1.2 Cj(VR) / Cj(VR=0V) 2: -2.3884 dB 900 MHz 0 dB 12 -6 dB 1 -18 dB 0.6 -24 dB 0.4 -30 dB 0.2 -36 dB 0 -42 dB 0.5 1 1.5 2 Reverse Voltage - VR (V) 2.5 3 -48 dB 4 4: -13.643 dB 2.5 GHz 1 MHz 10 MHz 100 MHz START . 030 MHz 3 1 GHz GHz STOP 3000. 000000 MHz ESD Clamping (Pin 1 to 2 and 2 to 1) (-8kV Contact per IEC 61000-4-2) ESD Clamping (Pin 1 to 2 and 2 to 1) (8kV Contact per IEC 61000-4-2) Note: Data is taken with a 10x attenuator © 2009 Semtech Corp. 3: -5.5200 dB 1.8 GHz 3 -12 dB 0.8 0 6 Note: Data is taken with a 10x attenuator 3 www.semtech.com uClamp2511T PROTECTION PRODUCTS Applications Information Device Connection Options Device Schematic & Pin Configuration The μClamp2511T is designed to protect one data line operating up to 2.5 volts. It will present a high impedance to the protected line up to 2.5 volts. It will “turn on” when the line voltage exceeds 2.7 volts. The device is bidirectional and may be used on lines where the signal polarity is above and below ground. These devices are not recommended for use on DC power supply lines due to their snap-back voltage characteristic. EPD TVS Characteristics These devices are constructed using Semtech’s proprietary EPD technology. The structure of the EPD TVS is vastly different from the traditional pn-junction devices. At voltages below 5V, high leakage current and junction capacitance render conventional avalanche technology impractical for most applications. However, by utilizing the EPD technology, these devices can effectively operate at 2.5V while maintaining excellent electrical characteristics. The EPD TVS employs a complex nppn structure in contrast to the pn structure normally found in traditional silicon-avalanche TVS diodes. The EPD mechanism is achieved by engineering the center region of the device such that the reverse biased junction does not avalanche, but will “punch-through” to a conducting state. This structure results in a device with superior DC electrical parameters at low voltages while maintaining the capability to absorb high transient currents. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z Place the TVS near the input terminals or connectors to restrict transient coupling. z Minimize the path length between the TVS and the protected line. z Minimize all conductive loops including power and ground loops. z The ESD transient return path to ground should be kept as short as possible. z Never run critical signals near board edges. z Use ground planes whenever possible. © 2009 Semtech Corp. 4 www.semtech.com uClamp2511T PROTECTION PRODUCTS Applications Information - Spice Model Spice Model uClamp2511T Spice Parameters © 2009 Semtech Corp. Parameter Unit D1 (T VS) D2 (T VS) IS Amp 1E-20 1E-20 BV Volt 2.2 2.2 VJ Volt 0.7 0.7 RS Ohm 0.3 0.3 IB V Amp 1E-3 1E-3 CJO Farad 12E-12 12E-12 TT sec 2.541E-9 2.541E-9 M -- 0.05 0.05 N -- 1.1 1.1 EG eV 1.11 1.11 5 www.semtech.com uClamp2511T PROTECTION PRODUCTS Outline Drawing - SLP1006P2T A B D E DIM TOP VIEW A SEATING PLANE aaa C C A1 A A1 b D E e L R N aaa bbb DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .015 .016 .017 .000 .001 .002 .018 .020 .022 .035 .039 .043 .020 .024 .028 .026 BSC .008 .010 .012 .002 .004 .006 2 .003 .004 0.37 0.40 0.43 0.00 0.03 0.05 0.45 0.50 0.55 0.90 1.00 1.10 0.50 0.60 0.70 0.65 BSC 0.20 0.25 0.30 0.05 0.10 0.15 2 0.08 0.10 PIN 1 ID R bxN bbb C A B 2x L e BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP1006P2T Y (C) DIM C G X Y Z Z G X DIMENSIONS INCHES MILLIMETERS (.033) (0.85) .012 0.30 .024 0.60 .022 0.55 .055 1.40 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. © 2009 Semtech Corp. 6 www.semtech.com uClamp2511T PROTECTION PRODUCTS Marking Code Ordering Information 51 Part Number Working Voltage Qty per Reel Reel Size uClamp 2511T.TCT 2.5V 3,000 7 Inch Notes: 1) This is a lead-free, RoHS/WEEE compliant product MicroClamp, uClamp and μClamp are marks of Semtech Corporation Notes: 1)Marking will also include line matrix date code 2) Device is electrically symmetrical Tape and Reel Specification Pin 1 Location User Direction of feed Device Orientation in Tape A0 0.69 +/-0.10 mm B0 K0 1.19 +/-0.10 mm 0.66 +/-0.10 mm Tape Width B, (Max) D D1 8 mm 4.2 mm (.165) 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) 0.4 mm ±0.25 (.031) E 1.750±.10 mm (.069±.004) F P P0 P2 T W 3.5±0.05 mm (.138±.002) 4.0±0.10 mm (.157±.004) 4.0±0.1 mm (.157±.004) 2.0±0.05 mm (.079±.002) 0.254±0.02 mm (.016) 8.0 mm + 0.3 mm - 0.1 mm (.312±.012) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 © 2009 Semtech Corp. 7 www.semtech.com