SEMTECH UCLAMP0504T

uClamp0504T
Low Profile μClamp®
4-Line ESD Protection
PROTECTION PRODUCTS - MicroClamp®
Description
Features
®
The μClamp series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due
to ESD. It is designed to replace single line devices such
as multilayer varistors (MLVs) in space constrained applications such as cell phones, notebook computers, and
other portable electronics. It features large cross-sectional area junctions for conducting high transient currents. TVS diodes offer desirable characteristics for
board level protection including fast response time, low
operating and clamping voltage, and no device degradation.
‹ Transient protection for data lines to
The μClamp®0504T is in a 6-pin SLP1313P6T package.
It measures 1.3 x 1.3 mm with a nominal height of only
0.4mm. The leads are spaced at a pitch of 0.4mm
and are finished with lead-free NiPdAu. Each device
features four TVS diodes with an operating voltage of
5 volts and a maximum loading capacitance of only
10pF.
They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, ±8kV
contact discharge). The combination of small size and
high ESD surge capability makes them ideal for use in
portable applications such as cellular phones, digital
cameras, and notebook computers.
Mechanical Characteristics
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IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
Cable Discharge Event (CDE)
Ultra-small package
Protects four data lines
Low clamping voltage
Working voltage: 5V
Low capacitance (10pF)
Solid-state silicon-avalanche technology
SLP1313P6T package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 1.3 x 1.3 x 0.4 mm
Lead Finish: NiPdAu
Molding compound flammability rating: UL 94V-0
Marking : Marking code
Packaging : Tape and Reel
Applications
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Dimensions
Cellular Handsets & Accessories
Notebooks & Handhelds
mp3 Players
Cordless Phones
Portable Instrumentation
Digital Cameras
Peripherals
Schematic
1
1
1.30
2 3
3
4
6
1.30
6
5
4
0.40 BSC
0.40
Center Tab (GND)
Nominal Dimensions (mm)
(SLP1313P6T Bottom View)
Revision 10/07/2009
Note: Pin 2 and 5 are N.C.
1
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uClamp0504T
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20μs)
Pp k
25
Watts
Maximum Peak Pulse Current (tp = 8/20μs)
Ip p
2
Amps
VESD
+/- 20
+/- 15
kV
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
ESD p er IEC 61000-4-2 (Air)
ESD p er IEC 61000-4-2 (Contact)
Op erating Temp erature
Storage Temp erature
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Reverse Stand-Off Voltage
VRWM
Reverse Breakdown Voltage
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 5V, T=25°C
Forward Voltage
VF
IF = 10mA
Clamp ing Voltage
VC
Junction Cap acitance
Junction Cap acitance
© 2009 Semtech Corp.
Minimum
Typical
Maximum
Units
5
V
6
V
0.25
μA
1.2
V
IPP = 2A, tp = 8/20μs
12.5
V
Cj
VR = 0V, f = 1MHz
10
pF
Cj
VR = 3.3V, f = 1MHz
2
1
4.5
pF
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uClamp0504T
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
110
10
90
% of Rated Power or IPP
Peak Pulse Power - PPP (kW)
100
1
0.1
80
70
60
50
40
30
20
10
0
0.01
0.1
1
10
0
100
25
50
75
100
125
150
Ambient Temperature - TA (oC)
Pulse Duration - tp (us)
Forward Voltage vs. Forward Current
Clamping Voltage vs. Peak Pulse Current
8
15
Forward Voltage - VF V)
Clamping Voltage - VC (V)
7
10
5
Waveform
Parameters:
tr = 8μs
td = 20μs
6
5
4
3
Waveform
Parameters:
tr = 8μs
td = 20μs
2
1
0
0
0
0.5
1
1.5
2
2.5
0
3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Forward Current - IF (A)
Peak Pulse Current - IPP (A)
Normalized Junction Capacitance vs. Reverse Voltage
ESD Clamping
(8kV Contact per IEC 61000-4-2)
1.1
f = 1 MHz
1
0.9
CJ(VR) / CJ(VR=0)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
1
2
3
Reverse Voltage - VR (V)
4
5
Note: Data is taken with a 10x attenuator
© 2009 Semtech Corp.
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uClamp0504T
PROTECTION PRODUCTS
Applications Information
Device Connection Options
Circuit Diagram
This device is designed to protect four data lines. The
device is unidirectional and may be used on lines
where the signal polarity is above ground.
1
3
4
6
Circuit Board Layout Recommendations for Suppression of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
z Place the TVS near the input terminals or connectors to restrict transient coupling.
z Minimize the path length between the TVS and the
protected line.
z Minimize all conductive loops including power and
ground loops.
z The ESD transient return path to ground should be
kept as short as possible.
z Never run critical signals near board edges.
z Use ground planes whenever possible.
© 2009 Semtech Corp.
Center Tab (GND)
Note: Pin 2 and 5 are N.C.
4
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uClamp0504T
PROTECTION PRODUCTS
Applications Information - Spice Model
uClamp0504T Spice Model
uClamp0504T Spice Parameters
© 2009 Semtech Corp.
Parameter
Unit
D1 (T VS)
IS
Amp
2.05e-15
BV
Volt
7.0
VJ
Volt
0.80
RS
Ohm
0.75
IB V
Amp
1.0E-3
CJO
Farad
9e-12
TT
sec
2.541E-9
M
--
0.25
N
--
1.1
EG
eV
1.11
5
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uClamp0504T
PROTECTION PRODUCTS
Outline Drawing - SLP1313P6T
A
B
D
DIM
E
PIN 1
INDICATOR
(LASER MARK)
A
SEATING
PLANE
aaa C
A2
C
A1
A
A1
A2
b
D
D1
E
E1
e
L
N
aaa
bbb
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
0.37 0.40 0.43
0.00 0.03 0.05
(0.13)
0.15 0.20 0.25
1.20 1.30 1.40
0.90 1.00 1.10
1.20 1.30 1.40
0.20 0.30 0.40
0.40 BSC
0.20 0.25 0.30
6
0.08
0.10
.015 .016 .017
0.00 .001 .002
(.005)
.006 .008 .010
.047 .051 .055
.035 .039 .043
.047 .051 .055
.008 .012 .016
.016 BSC
.008 .010 .012
6
.003
.004
D1
1
2
LxN
E/2
E1
N
bxN
bbb
e
C A B
D/2
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - SLP1313P6T
P
DIMENSIONS
(C) H
G
DIM
C
G
H
K
P
X
Y
Z
Z
Y
X
INCHES
(.050)
.027
.012
.039
.016
.008
.023
.073
MILLIMETERS
(1.27)
0.69
0.30
1.00
0.40
0.20
0.58
1.85
K
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD
SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.
FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR
FUNCTIONAL PERFORMANCE OF THE DEVICE.
© 2009 Semtech Corp.
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uClamp0504T
PROTECTION PRODUCTS
Marking Code
Ordering Information
U504T
YW
Part Number
Working
Voltage
Qty per
Reel
Reel
Size
uClamp 0504T.TCT
5V
3,000
7 Inch
Notes:
1) This is a lead-free, RoHS/WEEE compliant product
MicroClamp, uClamp and μClamp are marks of Semtech
Corporation
YW = Date Code
Tape and Reel Specification
Pin 1 Location
User Direction of feed
Device Orientation in Tape
A0
1.51 +/-0.05 mm
B0
K0
1.51 +/-0.05 mm
0.56 +/-0.05 mm
Tape
Width
B, (Max)
D
D1
8 mm
4.2 mm
(.165)
1.5 + 0.1 mm
- 0.0 mm
(0.59 +.005
- .000)
0.8 mm
±0.05
(.031)
E
1.750±.10
mm
(.069±.004)
F
K
(MAX)
P
P0
P2
T(MAX)
W
3.5±0.05
mm
(.138±.002)
2.4 mm
(.094)
4.0±0.1
mm
(.157±.004)
4.0±0.1
mm
(.157±.004)
2.0±0.05mm
(.079±.002)
0.4 mm
(.016)
8.0 mm
+ 0.3 mm
- 0.1 mm
(.312±.012)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2009 Semtech Corp.
7
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