MCP2551
High-Speed CAN Transceiver
Package Types
• Supports 1 Mb/s operation
• Implements ISO-11898 standard physical layer
requirements
• Suitable for 12V and 24V systems
• Externally-controlled slope for reduced RFI
emissions
• Detection of ground fault (permanent Dominant)
on TXD input
• Power-on Reset and voltage brown-out protection
• An unpowered node or brown-out event will not
disturb the CAN bus
• Low current standby operation
• Protection against damage due to short-circuit
conditions (positive or negative battery voltage)
• Protection against high-voltage transients
• Automatic thermal shutdown protection
• Up to 112 nodes can be connected
• High-noise immunity due to differential bus
implementation
• Temperature ranges:
- Industrial (I): -40°C to +85°C
- Extended (E): -40°C to +125°C
PDIP/SOIC
TXD
1
VSS
2
VDD
3
RXD
4
MCP2551
Features
8
RS
7
CANH
6
CANL
5
VREF
Block Diagram
VDD
TXD
Dominant
Detect
VDD
Driver
Control
TXD
RS
Slope
Control
Power-On
Reset
RXD
VREF
Thermal
Shutdown
CANH
0.5 VDD
GND
Reference
Voltage
CANL
Receiver
VSS
© 2010 Microchip Technology Inc.
DS21667F-page 1
MCP2551
NOTES:
DS21667F-page 2
© 2010 Microchip Technology Inc.
MCP2551
1.0
DEVICE OVERVIEW
1.4
Operating Modes
The MCP2551 is a high-speed CAN, fault-tolerant
device that serves as the interface between a CAN
protocol controller and the physical bus. The MCP2551
device provides differential transmit and receive
capability for the CAN protocol controller, and is fully
compatible with the ISO-11898 standard, including 24V
requirements. It will operate at speeds of up to 1 Mb/s.
The RS pin allows three modes of operation to be
selected:
Typically, each node in a CAN system must have a
device to convert the digital signals generated by a
CAN controller to signals suitable for transmission over
the bus cabling (differential output). It also provides a
buffer between the CAN controller and the high-voltage
spikes that can be generated on the CAN bus by
outside sources (EMI, ESD, electrical transients, etc.).
When in High-Speed or Slope-Control mode, the
drivers for the CANH and CANL signals are internally
regulated to provide controlled symmetry in order to
minimize EMI emissions.
1.1
Transmitter Function
The CAN bus has two states: Dominant and
Recessive. A Dominant state occurs when the
differential voltage between CANH and CANL is
greater than a defined voltage (e.g.,1.2V). A Recessive
state occurs when the differential voltage is less than a
defined voltage (typically 0V). The Dominant and
Recessive states correspond to the Low and High state
of the TXD input pin, respectively. However, a
Dominant state initiated by another CAN node will
override a Recessive state on the CAN bus.
1.1.1
MAXIMUM NUMBER OF NODES
The MCP2551 CAN outputs will drive a minimum load
of 45Ω, allowing a maximum of 112 nodes to be
connected (given a minimum differential input
resistance of 20 kΩ and a nominal termination resistor
value of 120Ω).
1.2
Receiver Function
The RXD output pin reflects the differential bus voltage
between CANH and CANL. The Low and High states of
the RXD output pin correspond to the Dominant and
Recessive states of the CAN bus, respectively.
1.3
Internal Protection
CANH and CANL are protected against battery shortcircuits and electrical transients that can occur on the
CAN bus. This feature prevents destruction of the
transmitter output stage during such a fault condition.
• High-Speed
• Slope-Control
• Standby
These modes are summarized in Table 1-1.
Additionally, the slope of the signal transitions on
CANH and CANL can be controlled with a resistor
connected from pin 8 (RS) to ground. The slope must
be proportional to the current output at RS, which will
further reduce EMI emissions.
1.4.1
HIGH-SPEED
High-Speed mode is selected by connecting the RS pin
to VSS. In this mode, the transmitter output drivers have
fast output rise and fall times to support high-speed
CAN bus rates.
1.4.2
SLOPE-CONTROL
Slope-Control mode further reduces EMI by limiting the
rise and fall times of CANH and CANL. The slope, or
slew rate (SR), is controlled by connecting an external
resistor (REXT) between RS and VOL (usually ground).
The slope is proportional to the current output at the RS
pin. Since the current is primarily determined by the
slope-control resistance value REXT, a certain slew rate
is achieved by applying a specific resistance.
Figure 1-1 illustrates typical slew rate values as a
function of the slope-control resistance value.
1.4.3
STANDBY MODE
The device may be placed in Standby or SLEEP mode
by applying a high-level to the RS pin. In SLEEP mode,
the transmitter is switched off and the receiver operates
at a lower current. The receive pin on the controller side
(RXD) is still functional, but will operate at a slower
rate. The attached microcontroller can monitor RXD for
CAN bus activity and place the transceiver into normal
operation via the RS pin (at higher bus rates, the first
CAN message may be lost).
The device is further protected from excessive current
loading by thermal shutdown circuitry that disables the
output drivers when the junction temperature exceeds
a nominal limit of 165°C. All other parts of the chip
remain operational, and the chip temperature is lowered due to the decreased power dissipation in the
transmitter outputs. This protection is essential to
protect against bus line short-circuit-induced damage.
© 2010 Microchip Technology Inc.
DS21667F-page 3
MCP2551
TABLE 1-1:
MODES OF OPERATION
Mode
Current at Rs Pin
Standby
Slope-Control
High-Speed
Resulting Voltage at RS Pin
-IRS < 10 µA
10 µA < -IRS < 200 µA
-IRS < 610 µA
TABLE 1-2:
VRS > 0.75 VDD
0.4 VDD < VRS < 0.6 VDD
0 < VRS < 0.3VDD
TRANSCEIVER TRUTH TABLE
VDD
VRS
TXD
CANH
Bus State( 1)
CANL
HIGH
LOW
Dominant
Not Driven
Not Driven
Recessive
Not Driven
Not Driven
Recessive
VRS > 0.75 VDD
HIGH
LOW
Dominant
VRS < 0.75 VDD
VPOR < VDD < 4.5V
Not Driven
Not Driven
Recessive
(See Note 3)
Not Driven
Not Driven
Recessive
VRS > 0.75 VDD
Not Driven/
Not Driven/
0 < VDD < VPOR
X
X
High Impedance
No Load
No Load
Note 1: If another bus node is transmitting a Dominant bit on the CAN bus, then RXD is a logic ‘0’.
2: X = “don’t care”.
3: Device drivers will function, although outputs are not ensured to meet the ISO-11898 specification.
VRS < 0.75 VDD
4.5V ≤ VDD ≤ 5.5V
FIGURE 1-1:
0
1 or floating
X
0
1 or floating
X
RXD( 1)
0
1
1
0
1
1
X
SLEW RATE VS. SLOPE-CONTROL RESISTANCE VALUE
25
Slew Rate V/μs
20
15
10
5
0
10
20
30
40
49
60
70
76
90 100 110 120
Resistance (k)
DS21667F-page 4
© 2010 Microchip Technology Inc.
MCP2551
1.5
TXD Permanent Dominant
Detection
If the MCP2551 detects an extended Low state on the
TXD input, it will disable the CANH and CANL output
drivers in order to prevent the corruption of data on the
CAN bus. The drivers are disabled if TXD is Low for
more than 1.25 ms (minimum). This implies a
maximum bit time of 62.5 µs (16 kb/s bus rate),
allowing up to 20 consecutive transmitted Dominant
bits during a multiple bit error and error frame scenario.
The drivers remain disabled as long as TXD remains
Low. A rising edge on TXD will reset the timer logic and
enable the CANH and CANL output drivers.
1.6
When the device is powered on, CANH and CANL
remain in a high-impedance state until VDD reaches the
voltage-level VPORH. In addition, CANH and CANL will
remain in a high-impedance state if TXD is Low when
VDD reaches VPORH. CANH and CANL will become
active only after TXD is asserted High. Once powered
on, CANH and CANL will enter a high-impedance state
if the voltage level at VDD falls below VPORL, providing
voltage brown-out protection during normal operation.
1.7.2
GROUND SUPPLY (VSS)
Ground supply pin.
SUPPLY VOLTAGE (VDD)
Positive supply voltage pin.
1.7.4
RECEIVER DATA OUTPUT (RXD)
RXD is a CMOS-compatible output that drives High or
Low depending on the differential signals on the CANH
and CANL pins and is usually connected to the receiver
data input of the CAN controller device. RXD is High
when the CAN bus is Recessive and Low in the
Dominant state.
1.7.5
Pin Descriptions
TRANSMITTER DATA INPUT (TXD)
TXD is a TTL-compatible input pin. The data on this pin
is driven out on the CANH and CANL differential output
pins. It is usually connected to the transmitter data
output of the CAN controller device. When TXD is Low,
CANH and CANL are in the Dominant state. When TXD
is High, CANH and CANL are in the Recessive state,
provided that another CAN node is not driving the CAN
bus with a Dominant state. TXD has an internal pull-up
resistor (nominal 25 kΩ to VDD).
1.7.3
Power-on Reset
1.7
1.7.1
REFERENCE VOLTAGE (VREF)
Reference Voltage Output (defined as VDD/2).
The 8-pin pinout is listed in Table 1-3.
1.7.6
TABLE 1-3:
MCP2551 PINOUT
CAN LOW (CANL)
The CANL output drives the Low side of the CAN
differential bus. This pin is also tied internally to the
receive input comparator.
Pin
Number
Pin
Name
1
TXD
Transmit Data Input
1.7.7
2
VSS
Ground
3
VDD
Supply Voltage
4
RXD
Receive Data Output
The CANH output drives the high-side of the CAN
differential bus. This pin is also tied internally to the
receive input comparator.
5
VREF
Reference Output Voltage
1.7.8
6
CANL
CAN Low-Level Voltage I/O
7
CANH
CAN High-Level Voltage I/O
The RS pin is used to select High-Speed, Slope-Control
or Standby modes via an external biasing resistor.
8
RS
Pin Function
CAN HIGH (CANH)
SLOPE RESISTOR INPUT (RS)
Slope-Control Input
© 2010 Microchip Technology Inc.
DS21667F-page 5
MCP2551
NOTES:
DS21667F-page 6
© 2010 Microchip Technology Inc.
MCP2551
2.0
ELECTRICAL
CHARACTERISTICS
2.1
Terms and Definitions
A number of terms are defined in ISO-11898 that are
used to describe the electrical characteristics of a CAN
transceiver device. These terms and definitions are
summarized in this section.
2.1.1
BUS VOLTAGE
VCANL and VCANH denote the voltages of the bus line
wires CANL and CANH relative to ground of each
individual CAN node.
2.1.2
COMMON MODE BUS VOLTAGE
RANGE
Boundary voltage levels of VCANL and VCANH with
respect to ground, for which proper operation will occur,
if up to the maximum number of CAN nodes are
connected to the bus.
2.1.3
2.1.5
DIFFERENTIAL VOLTAGE, VDIFF
(OF CAN BUS)
Differential voltage of the two-wire CAN bus, value
VDIFF = VCANH - VCANL.
2.1.6
INTERNAL CAPACITANCE, CIN
(OF A CAN NODE)
Capacitance seen between CANL (or CANH) and
ground during the Recessive state when the CAN node
is disconnected from the bus (see Figure 2-1).
2.1.7
INTERNAL RESISTANCE, RIN
(OF A CAN NODE)
Resistance seen between CANL (or CANH) and
ground during the Recessive state when the CAN node
is disconnected from the bus (see Figure 2-1).
FIGURE 2-1:
PHYSICAL LAYER
DEFINITIONS
ECU
DIFFERENTIAL INTERNAL
CAPACITANCE, CDIFF
(OF A CAN NODE)
RIN
Capacitance seen between CANL and CANH during
the Recessive state when the CAN node is
disconnected from the bus (see Figure 2-1).
RIN
CANL
CANH
CIN
2.1.4
DIFFERENTIAL INTERNAL
RESISTANCE, RDIFF
(OF A CAN NODE)
CDIFF
RDIFF
CIN
GROUND
Resistance seen between CANL and CANH during the
Recessive state when the CAN node is disconnected
from the bus (see Figure 2-1).
© 2010 Microchip Technology Inc.
DS21667F-page 7
MCP2551
Absolute Maximum Ratings†
VDD .............................................................................................................................................................................7.0V
DC Voltage at TXD, RXD, VREF and VS ............................................................................................ -0.3V to VDD + 0.3V
DC Voltage at CANH, CANL (Note 1) .......................................................................................................... -42V to +42V
Transient Voltage on Pins 6 and 7 (Note 2) ............................................................................................. -250V to +250V
Storage temperature ...............................................................................................................................-55°C to +150°C
Operating ambient temperature ..............................................................................................................-40°C to +125°C
Virtual Junction Temperature, TVJ (Note 3).............................................................................................-40°C to +150°C
Soldering temperature of leads (10 seconds) .......................................................................................................+300°C
ESD protection on CANH and CANL pins (Note 4) ...................................................................................................6 kV
ESD protection on all other pins (Note 4) ..................................................................................................................4 kV
Note 1: Short-circuit applied when TXD is High and Low.
2: In accordance with ISO-7637.
3: In accordance with IEC 60747-1.
4: Classification A: Human Body Model.
† NOTICE: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.
DS21667F-page 8
© 2010 Microchip Technology Inc.
MCP2551
2.2
DC Characteristics
Electrical Characteristics:
Industrial (I): TAMB = -40°C to +85°C VDD = 4.5V to 5.5V
Extended (E): TAMB = -40°C to +125°C VDD = 4.5V to 5.5V
DC Specifications
Param
No.
Sym
Characteristic
Min
Max
Units
Conditions
D1
—
75
mA
Dominant; VTXD = 0.8V; VDD
D2
—
10
mA
Recessive; VTXD = +2V;
RS = 47 kW
—
365
µA
-40°C ≤ TAMB ≤ +85°C, Standby;
(Note 2)
—
465
µA
-40°C ≤ TAMB ≤ +125°C,
Standby; (Note 2)
Supply
IDD
Supply Current
D3
D4
VPORH
High-level of the Power-on
Reset comparator
3.8
4.3
V
CANH, CANL outputs are active
when VDD > VPORH
D5
VPORL
Low-level of the Power-on
Reset comparator
3.4
4.0
V
CANH, CANL outputs are not
active when VDD < VPORL
D6
VPORD
Hysteresis of Power-on
Reset comparator
0.3
0.8
V
Note 1
2.0
3.0
V
VTXD = VDD; no load.
-2
+2
mA
-2V < V(CAHL,CANH) < +7V,
0V <VDD < 5.5V
-10
+10
mA
-5V < V(CANL,CANH) < +40V,
0V <VDD < 5.5V
Bus Line (CANH; CANL) Transmitter
D7
D8
D9
VCANH(r);
VCANL(r)
CANH, CANL Recessive
bus voltage
IO(CANH)(reces)
Recessive output current
IO(CANL)(reces)
D10
VO(CANH)
CANH Dominant
output voltage
2.75
4.5
V
VTXD = 0.8V
D11
VO(CANL)
CANL Dominant
output voltage
0.5
2.25
V
VTXD = 0.8V
D12
VDIFF(r)(o)
Recessive differential
output voltage
-500
+50
mV
D13
VDIFF(d)(o)
Dominant differential
output voltage
1.5
3.0
V
—
-200
mA
VCANH = -5V
—
-100
(typical)
mA
VCANH = -40V, +40V. (Note 1)
—
200
mA
VCANL = -40V, +40V. (Note 1)
-1.0
+0.5
V
-2V < V(CANL, CANH) < +7V
(Note 3)
-1.0
+0.4
V
-12V < V(CANL, CANH) < +12V
(Note 3)
D14
D15
D16
D17
Note 1:
2:
3:
IO(SC)(CANH)
CANH short-circuit
output current
IO(SC)(CANL)l
CANL short-circuit
output current
VDIFF(r)(i)
Recessive differential
input voltage
VTXD = 2V; no load
VTXD = 0.8V; VDD = 5V
40W < RL < 60W (Note 2)
This parameter is periodically sampled and not 100% tested.
ITXD = IRXD = IVREF = 0 mA; 0V < VCANL < VDD; 0V < VCANH < VDD; VRS = VDD.
This is valid for the receiver in all modes; High-speed, Slope-control and Standby.
© 2010 Microchip Technology Inc.
DS21667F-page 9
MCP2551
2.2
DC Characteristics (Continued)
Electrical Characteristics:
Industrial (I): TAMB = -40°C to +85°C VDD = 4.5V to 5.5V
Extended (E): TAMB = -40°C to +125°C VDD = 4.5V to 5.5V
DC Specifications (Continued)
Param
No.
Sym
Characteristic
Min
Max
Units
Conditions
Bus Line (CANH; CANL) Receiver: [TXD = 2V; pins 6 and 7 externally driven]
D18
D19
VDIFF(d)(i)
VDIFF(h)(i)
D20
RIN
D21
RIN(d)
Dominant differential
input voltage
Differential input hysteresis
0.9
5.0
V
-2V < V(CANL, CANH) < +7V
(Note 3)
1.0
5.0
V
-12V < V(CANL, CANH) < +12V
(Note 3)
100
200
mV
CANH, CANL Commonmode input resistance
5
50
kW
Deviation between CANH
and CANL Common-mode
input resistance
-3
+3
%
See Figure 2-3 (Note 1)
VCANH = VCANL
Bus Line (CANH; CANL) Receiver: [TXD = 2V; pins 6 and 7 externally driven]
D22
D24
RDIFF
Differential input resistance
20
100
kW
ILI
CANH, CANL input leakage
current
—
150
µA
VDD < VPOR;
VCANH = VCANL = +5V
V
Output Recessive
Transmitter Data Input (TXD)
D25
VIH
High-level input voltage
2.0
VDD
D26
VIL
Low-level input voltage
VSS
+0.8
V
Output Dominant
D27
IIH
High-level input current
-1
+1
µA
VTXD = VDD
D28
IIL
Low-level input current
-100
-400
µA
VTXD = 0V
—
V
IOH = 8 mA
0.8
V
IOL = 8 mA
V
-50 µA < IVREF < 50 µA
Receiver Data Output (RXD)
D31
VOH
High-level output voltage
D32
VOL
Low-level output voltage
0.7 VD
D
—
Voltage Reference Output (VREF)
D33
VREF
Reference output voltage
0.45 V 0.55 VD
DD
D
Standby/Slope-Control (RS pin)
D34
VSTB
D35
ISLOPE
D36
VSLOPE
Input voltage for standby
mode
Slope-control mode current
Slope-control mode voltage
0.75 V
DD
-10
0.4 VD
D
—
V
-200
µA
0.6 VDD
V
Thermal Shutdown
D37
TJ(sd)
Shutdown junction
temperature
155
180
o
Note 1
D38
TJ(h)
Shutdown temperature
hysteresis
20
30
o
-12V < V(CANL, CANH) < +12V
(Note 3)
Note 1:
2:
3:
C
C
This parameter is periodically sampled and not 100% tested.
ITXD = IRXD = IVREF = 0 mA; 0V < VCANL < VDD; 0V < VCANH < VDD; VRS = VDD.
This is valid for the receiver in all modes; High-speed, Slope-control and Standby.
DS21667F-page 10
© 2010 Microchip Technology Inc.
MCP2551
FIGURE 2-1:
TEST CIRCUIT FOR ELECTRICAL CHARACTERISTICS
0.1µF
VDD
CANH
TXD
VREF
CAN
Transceiver
60 Ω
100 pF
RXD
CANL
30 pF
RS
GND
Rext
Note:
FIGURE 2-2:
RS may be connected to VDD or GND via a load resistor depending on desired
operating mode as described in Section 1.7.3 “Supply Voltage (VDD)”.
TEST CIRCUIT FOR AUTOMOTIVE TRANSIENTS
CANH
TXD
VREF
CAN
Transceiver
500 pF
60Ω
Schaffner
Generator
RXD
CANL
500 pF
RS
GND
Note:
Rext
RS may be connected to VDD or
GND via a load resistor depending
on desired operating mode as
described in Section 1.7.8 “Slope
Resistor Input (Rs)”.
The wave forms of the applied transients shall be in accordance with “ISO-7637, Part 1”, test pulses 1, 2, 3a and 3b.
FIGURE 2-3:
HYSTERESIS OF THE RECEIVER
RXD (receive data
output voltage)
VOH
VDIFF (r)(i)
VDIFF (d)(i)
VOL
hysteresis
D19
0.5
0.9
VDIFF (V)
© 2010 Microchip Technology Inc.
DS21667F-page 11
MCP2551
2.3
AC Characteristics
Electrical Characteristics:
Industrial (I): TAMB = -40°C to +85°C VDD = 4.5V to 5.5V
Extended (E): TAMB = -40°C to +125°C VDD = 4.5V to 5.5V
AC Specifications
Param
No.
Sym
1
tBIT
2
fBIT
3
TtxL2bus(d)
4
5
6
TtxH2bus(r)
TtxL2rx(d)
TtxH2rx(r)
Characteristic
Min
Max
Units
Bit time
1
62.5
µs
VRS = 0V
Bit frequency
16
1000
kHz
VRS = 0V
Delay TXD to bus active
—
70
ns
-40°C ≤ TAMB ≤ +125°C,
VRS = 0V
—
125
ns
-40°C ≤ TAMB ≤ +85°C,
VRS = 0V
—
170
ns
-40°C ≤ TAMB ≤ +125°C,
VRS = 0V
—
130
ns
-40°C ≤ TAMB ≤ +125°C,
VRS = 0V
—
250
ns
-40°C ≤ TAMB ≤ +125°C,
RS = 47 kΩ
—
175
ns
-40°C ≤ TAMB ≤ +85°C,
VRS = 0V
—
225
ns
-40°C ≤ TAMB ≤ +85°C,
RS = 47 kΩ
—
235
ns
-40°C ≤ TAMB ≤ +125°C,
VRS = 0V
—
400
ns
-40°C ≤ TAMB ≤ +125°C,
RS = 47 kΩ
CANH, CANL slew rate
5.5
8.5
V/µs
Delay TXD to bus inactive
Delay TXD to receive active
Delay TXD to receiver
inactive
Conditions
Refer to Figure 2-1;
RS = 47 kΩ, (Note 1)
7
SR
10
tWAKE
Wake-up time from standby
(Rs pin)
—
5
µs
See Figure 2-5
11
TbusD2rx(s)
Bus Dominant to RXD Low
(Standby mode)
—
550
ns
VRS = +4V; (See Figure 2-6)
12
CIN(CANH)
CIN(CANL)
CANH; CANL input
capacitance
—
20
(typical)
pF
1 Mb/s data rate;
VTXD = VDD, (Note 1)
13
CDIFF
Differential input
capacitance
—
10
(typical)
pF
1 Mb/s data rate
(Note 1)
14
TtxL2busZ
TX Permanent Dominant
Timer Disable Time
1.25
4
ms
15
TtxR2pdt(res)
TX Permanent Dominant
Timer Reset Time
—
1
µs
Rising edge on TXD while
device is in permanent
Dominant state
Note 1: This parameter is periodically sampled and not 100% tested.
DS21667F-page 12
© 2010 Microchip Technology Inc.
MCP2551
2.4
Timing Diagrams and Specifications
FIGURE 2-4:
TIMING DIAGRAM FOR AC CHARACTERISTICS
VDD
TXD (transmit data
input voltage)
0V
VDIFF (CANH,
CANL differential
voltage)
RXD (receive data
output voltage)
0.5V
0.9V
0.7 VDD
0.3 VDD
3
4
5
6
FIGURE 2-5:
TIMING DIAGRAM FOR WAKE-UP FROM STANDBY
VRS Slope resistor
input voltage
VDD
0.6 VDD
0V
VRXD Receive data
output voltage
0.3 VDD
10
VTXD = 0.8V
FIGURE 2-6:
TIMING DIAGRAM FOR BUS DOMINANT TO RXD LOW (STANDBY MODE)
1.5V
VDIFF, Differential
voltage
0.9V
0V
Receive data
output voltage
0.3 VDD
11
VRS = 4V; VTXD = 2V
© 2010 Microchip Technology Inc.
DS21667F-page 13
MCP2551
NOTES:
DS21667F-page 14
© 2010 Microchip Technology Inc.
MCP2551
3.0
PACKAGING INFORMATION
3.1
Package Marking Information
8-Lead PDIP (300 mil)
XXXXXXXX
XXXXXNNN
YYWW
8-Lead SOIC (150 mil)
XXXXXXXX
XXXXYYWW
NNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Example:
MCP2551
3
I/P e^^256
1019
Example:
MCP2551E
3
SN e^^1019
256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3)
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2010 Microchip Technology Inc.
DS21667F-page 15
MCP2551
3
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DS21667F-page 16
© 2010 Microchip Technology Inc.
MCP2551
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3
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&&255***'
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D
e
N
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NOTE 1
1
2
3
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h
b
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© 2010 Microchip Technology Inc.
DS21667F-page 17
MCP2551
!
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3
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DS21667F-page 18
© 2010 Microchip Technology Inc.
MCP2551
APPENDIX A:
REVISION HISTORY
Revision F (July 2010)
The following is the list of modifications:
1.
Updates to the packaging diagrams.
Revision E (January 2007)
The following is the list of modifications:
1.
Updates to the packaging diagrams.
Revision D (October 2003)
The following is the list of modifications:
1.
Undocumented changes.
Revision C (November 2002)
The following is the list of modifications:
1.
Undocumented changes.
Revision B (June 2002)
The following is the list of modifications:
1.
Undocumented changes.
Revision A (June 2001)
• Original Release of this Document.
© 2010 Microchip Technology Inc.
DS21667F-page 19
MCP2551
NOTES:
DS21667F-page 20
© 2010 Microchip Technology Inc.
MCP2551
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
-X
/XX
XXX
Device
Temperature
Range
Package
Pattern
Examples:
a)
b)
Device:
MCP2551: High-Speed CAN Transceiver
MCP2551T: High-Speed CAN Transceiver
(Tape and Reel)
c)
d)
Temperature
Range:
I
E
Package:
P
SN
=
=
-40°C to +85°C
-40°C to +125°C
=
=
© 2010 Microchip Technology Inc.
Plastic DIP (300 mil Body) 8-lead
Plastic SOIC (150 mil Body) 8-lead
e)
f)
MCP2551-I/P:
Industrial temperature,
PDIP package.
MCP2551-E/P:
Extended temperature,
PDIP package.
MCP2551-I/SN: Industrial temperature,
SOIC package.
MCP2551T-I/SN: Tape and Reel,
Industrial Temperature,
SOIC package.
MCP2551T-E/SN: Tape and Reel,
Extended Temperature,
SOIC package.
MCP2551-E/SN: Extended Temperature,
SOIC package.
DS21667F-page 21
MCP2551
NOTES:
DS21667F-page 22
© 2010 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2010, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN:
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2010 Microchip Technology Inc.
DS21667F-page 23
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-6578-300
Fax: 886-3-6578-370
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
01/05/10
DS21667F-page 24
© 2010 Microchip Technology Inc.