STB80NF55-06 - STB80NF55-06-1 STP80NF55-06 - STP80NF55-06FP N-channel 55V - 0.005Ω - 80A - TO-220 /FP - I2PAK - D2PAK STripFET™ II Power MOSFET General features Type VDSS RDS(on) ID STB80NF55-06 55V <0.0065Ω 80A (1) STB80NF55-06-1 55V <0.0065Ω STP80NF55-06 55V <0.0065Ω 80A (1) STP80NF55-06FP 55V <0.0065Ω 60A (1) 3 3 80A(1) 1 2 TO-220 1 2 TO-220FP 1. Limited by package ■ Exceptional dv/dt capability ■ 100% avalanche tested ■ Application oriented characterization 3 1 D²PAK Description This Power MOSFET is the latest development of STMicroelectronis unique "Single Feature Size™" strip-based process. The resulting transistor shows extremely high packing density for low onresistance, rugged avalanche characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility. 3 12 I²PAK Internal schematic diagram Applications ■ Switching application Order codes Part number Marking Package Packaging STB80NF55-06T4 B80NF55-06 D²PAK Tape & reel STB80NF55-06-1 B80NF55-06-1 I²PAK Tube STP80NF55-06 P80NF55-06 TO-220 Tube STP80NF55-06FP P80NF55-06FP TO-220FP Tube October 2006 Rev 8 1/17 www.st.com 17 Contents STB80NF55-06 - STB80NF55-06-1 - STP80NF55-06 - STP80NF55-06FP Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................ 6 3 Test circuit 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2/17 ................................................ 9 STB80NF55-06 - STB80NF55-06-1 - STP80NF55-06 - STP80NF55-06FP 1 Electrical ratings Electrical ratings Table 1. Absolute maximum ratings Value Symbol Parameter Unit TO-220 / D²/ I²PAK TO-220FP VDS Drain-source voltage (VGS = 0) VGS Gate-source voltage ID (1) Drain current (continuous) at TC = 25°C 80 60 (2) A ID (1) Drain current (continuous) at TC=100°C 80 42 (2) A IDM(3) Drain current (pulsed) 320 240 (2) A PTOT Total dissipation at TC = 25°C 300 45 W 2 0.30 W/°C Derating factor dv/dt (4) Peak diode recovery voltage slope EAS (5) VISO TJ Tstg Single pulse avalanche energy Insulation withstand voltage (DC) Operating junction temperature Storage temperature 55 V ± 20 V 7 V/ns 1.3 J -- 2500 -55 to 175 V °C 1. Limited by Package 2. Limited only by maximum temperature allowed 3. Pulse width limited by safe operating area 4. ) ISD ≤80A, di/dt ≤400A/µs, VDD ≤V(BR)DSS, Tj ≤TJMAX 5. Starting TJ = 25 oC, ID = 40A, VDD = 45V Table 2. Thermal data Value Symbol Parameter Unit TO-220 / D²/ I²PAK TO-220FP 0.5 3.33 RthJC Thermal resistance junction-case max RthJA Thermal resistance junction-ambient max 62.5 °C/W Tl Maximum lead temperature for soldering purpose 300 °C °C/W 3/17 Electrical characteristics 2 STB80NF55-06 - STB80NF55-06-1 - STP80NF55-06 - STP80NF55-06FP Electrical characteristics (TCASE=25°C unless otherwise specified) Table 3. Symbol V(BR)DSS On/off states Parameter Drain-source breakdown voltage Test conditions ID = 250µA, VGS= 0 Zero gate voltage drain current (VGS = 0) IGSS Gate body leakage current (VDS = 0) VGS = ±20V VGS(th) Gate threshold voltage VDS= VGS, ID = 250µA RDS(on) Static drain-source on resistance VGS= 10V, ID= 40A Symbol gfs (1) Ciss Coss Crss Qg Qgs Qgd Typ. Max. 55 VDS = Max rating @125°C 2 Unit V VDS = Max rating, IDSS Table 4. Min. 3 1 10 µA µA ±100 nA 4 V 0.005 0.0065 Ω Dynamic Parameter Test conditions Min. Typ. Max. Unit Forward transconductance VDS =15V, ID = 40A 150 S Input capacitance Output capacitance Reverse transfer capacitance VDS =25V, f=1 MHz, VGS=0 4400 1020 350 pF pF pF Total gate charge Gate-source charge Gate-drain charge VDD = 44V, ID = 80A VGS =10V 142 29 60.5 189 nC nC nC Typ. Max. Unit 1. Pulsed: pulse duration=300µs, duty cycle 1.5% Table 5. Symbol td(on) tr td(off) tf 4/17 Switching times Parameter Turn-on delay time Rise time Turn-off delay time Fall time Test conditions VDD= 50 V, ID= 40A, RG=4.7Ω, VGS=10V (see Figure 15) Min. 27 155 125 65 ns ns ns ns STB80NF55-06 - STB80NF55-06-1 - STP80NF55-06 - STP80NF55-06FP Table 6. Symbol Electrical characteristics Source drain diode Max Unit Source-drain current 80 A ISDM(1) Source-drain current (pulsed) 320 A VSD(2) Forward on voltage ISD=80A, VGS=0 1.5 V Reverse recovery time Reverse recovery charge Reverse recovery current ISD=80A, ISD trr Qrr IRRM Parameter Test conditions di/dt = 100A/µs, VDD=35V, TJ = 150°C Min Typ. 100 0.32 6.5 ns µC A 1. Pulse width limited by safe operating area 2. Pulsed: pulse duration=300µs, duty cycle 1.5% 5/17 Electrical characteristics STB80NF55-06 - STB80NF55-06-1 - STP80NF55-06 - STP80NF55-06FP 2.1 Electrical characteristics (curves) Figure 1. Safe operating area for TO-220/ D²PAK/ I²PAK Figure 2. Thermal impedance for TO-220/ D²PAK/ I²PAK Figure 3. Safe operating area for TO-220FP Figure 4. Thermal impedance for TO-220FP Figure 5. Output characterisics Figure 6. Transfer characteristics 6/17 STB80NF55-06 - STB80NF55-06-1 - STP80NF55-06 - STP80NF55-06FP Figure 7. Transconductance Figure 9. Gate charge vs gate-source voltage Figure 10. Capacitance variations Figure 11. Normalized gate threshold voltage vs temperature Figure 8. Electrical characteristics Static drain-source on resistance Figure 12. Normalized on resistance vs temperature 7/17 Electrical characteristics STB80NF55-06 - STB80NF55-06-1 - STP80NF55-06 - STP80NF55-06FP Figure 13. Source-drain diode forward characteristics 8/17 Figure 14. Normalized BVDSS vs temperature STB80NF55-06 - STB80NF55-06-1 - STP80NF55-06 - STP80NF55-06FP 3 Test circuit Test circuit Figure 15. Switching times test circuit for resistive load Figure 16. Gate charge test circuit Figure 17. Test circuit for inductive load Figure 18. Unclamped Inductive load test switching and diode recovery times circuit Figure 19. Unclamped inductive waveform 9/17 Package mechanical data 4 STB80NF55-06 - STB80NF55-06-1 - STP80NF55-06 - STP80NF55-06FP Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 10/17 STB80NF55-06 - STB80NF55-06-1 - STP80NF55-06 - STP80NF55-06FP Package mechanical data TO-220 MECHANICAL DATA DIM. mm. MIN. TYP inch MAX. MIN. TYP. MAX. A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034 b1 1.15 1.70 0.045 0.066 c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107 0.551 L 13 14 0.511 L1 3.50 3.93 0.137 L20 16.40 L30 0.154 0.645 28.90 1.137 øP 3.75 3.85 0.147 0.151 Q 2.65 2.95 0.104 0.116 11/17 Package mechanical data STB80NF55-06 - STB80NF55-06-1 - STP80NF55-06 - STP80NF55-06FP D2PAK MECHANICAL DATA TO-247 MECHANICAL DATA mm. inch DIM. MIN. TYP MAX. MIN. TYP. MAX. A 4.4 4.6 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.7 0.93 0.027 0.036 B2 1.14 1.7 0.044 0.067 C 0.45 0.6 0.017 0.023 C2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 0.368 10.4 0.393 D1 E 8 10 E1 0.315 8.5 0.334 G 4.88 5.28 0.192 0.208 L 15 15.85 0.590 0.625 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.068 M 2.4 3.2 0.094 0.126 R 0º 0.015 4º 3 V2 0.4 1 12/17 STB80NF55-06 - STB80NF55-06-1 - STP80NF55-06 - STP80NF55-06FP Package mechanical data TO-262 (I2PAK) MECHANICAL DATA mm. inch DIM. MAX. MIN. A 4.40 MIN. TYP 4.60 0.173 TYP. MAX. A1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.034 b1 1.14 1.70 0.044 0.066 c 0.49 0.70 0.019 0.027 c2 1.23 1.32 0.048 0.052 0.181 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 E 10 10.40 0.393 0.410 L 13 14 0.511 0.551 L1 3.50 3.93 0.137 0.154 L2 1.27 1.40 0.050 0.055 13/17 Package mechanical data STB80NF55-06 - STB80NF55-06-1 - STP80NF55-06 - STP80NF55-06FP TO-220FP MECHANICAL DATA mm. DIM. MIN. A 4.4 inch TYP MAX. MIN. TYP. 4.6 0.173 0.181 MAX. 0.106 B 2.5 2.7 0.098 D 2.5 2.75 0.098 0.108 E 0.45 0.7 0.017 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067 G 4.95 5.2 0.195 0.204 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 .0385 0.417 L5 2.9 3.6 0.114 0.141 L6 15.9 16.4 0.626 0.645 9 9.3 0.354 0.366 Ø 3 3.2 0.118 0.126 B D A E L7 L3 L6 F2 H G G1 F F1 L7 L2 14/17 L5 1 2 3 L4 STB80NF55-06 - STB80NF55-06-1 - STP80NF55-06 - STP80NF55-06FP Packaging mechanical data 5 Packaging mechanical data D2PAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. mm MIN. A B 1.5 C 12.8 D 20.2 G 24.4 N 100 T TAPE MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626 D 1.5 1.6 0.059 0.063 D1 1.59 1.61 0.062 0.063 E 1.65 1.85 0.065 0.073 F 11.4 11.6 0.449 0.456 K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082 inch MAX. MIN. MAX. 330 12.992 13.2 0.504 0.520 26.4 0.960 1.039 0.059 0795 3.937 30.4 1.197 BASE QTY BULK QTY 1000 1000 MAX. R 50 1.574 T 0.25 0.35 0.0098 0.0137 W 23.7 24.3 0.933 0.956 * on sales type 15/17 Revision history 6 STB80NF55-06 - STB80NF55-06-1 - STP80NF55-06 - STP80NF55-06FP Revision history Table 7. 16/17 Revision history Date Revision Changes 21-Jun-2004 5 Complete version 13-Mar-2005 6 Package inserted: I2PAK 20-Jul-2006 7 New template, no content change 24-Oct-2006 8 Corrected value on Table 1.: Absolute maximum ratings STB80NF55-06 - STB80NF55-06-1 - STP80NF55-06 - STP80NF55-06FP Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 17/17