TI TIBPAL16R4-25CN

TIBPAL16L8-25C, TIBPAL16R4-25C, TIBPAL16R6-25C, TIBPAL16R8-25C
TIBPAL16L8-30M, TIBPAL16R4-30M, TIBPAL16R6-30M, TIBPAL16R8-30M
LOW-POWER HIGH-PERFORMANCE IMPACT  PAL CIRCUITS
SRPS059 – FEBRUARY 1984 – REVISED APRIL 2000
D
D
D
DEVICE
I
INPUTS
3-STATE
O
OUTPUTS
REGISTERED
Q
OUTPUTS
I/O
PORTS
PAL16L8
10
2
0
6
4
PAL16R4
8
0
4 (3-state
buffers)
PAL16R6
8
0
6 (3-state
buffers)
2
8 (3-state
buffers)
0
PAL16R8
8
0
TIBPAL16L8’
C SUFFIX . . . J OR N PACKAGE
M SUFFIX . . . J OR W PACKAGE
(TOP VIEW)
I
I
I
I
I
I
I
I
I
GND
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
O
I/O
I/O
I/O
I/O
I/O
I/O
O
I
TIBPAL16L8’
C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
(TOP VIEW)
I
I
I
I
I
4
1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
I/O
I/O
I/O
I/O
I/O
I
GND
I
O
I/O
description
3 2
O
D
High-Performance Operation:
Propagation Delay
C Suffix . . . 25 ns Max
M Suffix . . . 30 ns Max
Functionally Equivalent, but Faster Than
PAL16L8A, PAL16R4A, PAL16R6A, and
PAL16R8A
Power-Up Clear on Registered Devices (All
Register Outputs Are Set High, but Voltage
Levels at the Output Pins Go Low)
Package Options Include Both Plastic and
Ceramic Chip Carriers in Addition to Plastic
and Ceramic DIPs
Dependable Texas Instruments Quality and
Reliability
I
I
I
VCC
D
These programmable array logic devices feature
high speed and functional equivalency when
compared with currently available devices. These
IMPACT circuits combine the latest Advanced
Low-Power Schottky technology with proven
titanium-tungsten fuses to provide reliable,
high-performance substitutes for conventional
TTL logic. Their easy programmability allows for
quick design of custom functions and typically
results in a more compact circuit board. In
addition, chip carriers are available for further
reduction in board space.
The TIBPAL16’ C series is characterized from 0°C
to 75°C. The TIBPAL16’ M series is characterized
for operation over the full military temperature
range of –55°C to 125°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
These devices are covered by U.S. Patent 4,410,987.
IMPACT is a trademark of Texas Instruments.
PAL is a registered trademark of Advanced Micro Devices Inc.
Copyright  2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
TIBPAL16R4-25C, TIBPAL16R6-25C, TIBPAL16R8-25C
TIBPAL16R4-30M, TIBPAL16R6-30M, TIBPAL16R8-30M
LOW-POWER HIGH-PERFORMANCE IMPACT  PAL CIRCUITS
SRPS059 FEBRUARY 1984 – REVISED APRIL 2000
15
7
14
8
13
9
12
10
11
TIBPAL16R6’
C SUFFIX . . . J OR N PACKAGE
M SUFFIX . . . J OR W PACKAGE
(TOP VIEW)
CLK
I
I
I
I
I
I
I
I
GND
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
I/O
Q
Q
Q
Q
Q
Q
I/O
OE
TIBPAL16R8’
C SUFFIX . . . J OR N PACKAGE
M SUFFIX . . . J OR W PACKAGE
(TOP VIEW)
CLK
I
I
I
I
I
I
I
I
GND
2
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
Q
Q
Q
Q
Q
Q
Q
Q
OE
POST OFFICE BOX 655303
I/O
6
5
17
6
16
7
15
8
14
9 10 11 12 13
I/O
Q
Q
Q
Q
TIBPAL16R6’
C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
(TOP VIEW)
I
I
I
I
I
3 2
I/O
16
1 20 19
18
4
1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
Q
Q
Q
Q
Q
TIBPAL16R8’
C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
(TOP VIEW)
I
I
I
I
I
3 2
Q
5
3 2
OE
I/O
I/O
17
4
OE
I/O
Q
4
I
I
I
I
I
4
1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
• DALLAS, TEXAS 75265
OE
Q
Q
18
I
I
CLK
VCC
3
VCC
I/O
I/O
Q
Q
Q
Q
I/O
I/O
OE
I
GND
19
I
I
CLK
VCC
20
2
I
GND
1
I
I
CLK
VCC
CLK
I
I
I
I
I
I
I
I
GND
TIBPAL16R4’
C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
(TOP VIEW)
I
GND
TIBPAL16R4’
C SUFFIX . . . J OR N PACKAGE
M SUFFIX . . . J OR W PACKAGE
(TOP VIEW)
Q
Q
Q
Q
Q
TIBPAL16L8-25C, TIBPAL16R4-25C
TIBPAL16L8-30M, TIBPAL16R4-30M
LOW-POWER HIGH-PERFORMANCE IMPACT  PAL CIRCUITS
SRPS059 – FEBRUARY 1984 – REVISED APRIL 2000
functional block diagrams (positive logic)
TIBPAL16L8’
&
32 × 64
16 ×
10
I
16
6
16
EN ≥ 1
7
O
7
O
7
I/O
7
I/O
7
I/O
7
I/O
7
I/O
7
I/O
6
TIBPAL16R4’
OE
CLK
EN 2
C1
&
32 × 64
I
16 ×
8
≥1
8
I=1 2
Q
1D
8
Q
8
Q
8
Q
16
4
4
16
EN ≥ 1
7
I/O
7
I/O
7
I/O
7
I/O
4
4
denotes fused inputs
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
TIBPAL16R6-25C, TIBPAL16R8-25C
TIBPAL16R6-30M, TIBPAL16R8-30M
LOW-POWER HIGH-PERFORMANCE IMPACT  PAL CIRCUITS
SRPS059 – FEBRUARY 1984 – REVISED APRIL 2000
functional block diagrams (positive logic)
TIBPAL16R6’
OE
CLK
EN 2
C1
&
32 × 64
I
16 ×
8
≥1
8
I=1 2
Q
1D
8
Q
8
Q
8
Q
8
Q
8
Q
16
6
2
16
EN ≥ 1
7
I/O
I/O
7
2
6
TIBPAL16R8’
OE
CLK
EN 2
C1
&
32 × 64
16 ×
I
8
8
≥1
I=1 2
8
Q
8
Q
8
Q
8
Q
8
Q
8
Q
8
Q
16
8
16
8
denotes fused inputs
4
Q
1D
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TIBPAL16L8-25C
TIBPAL16L8-30M
LOW-POWER HIGH-PERFORMANCE IMPACT  PAL CIRCUITS
SRPS059 – FEBRUARY 1984 – REVISED APRIL 2000
logic diagram (positive logic)
I
1
First
Fuse
Numbers
I
I
I
I
I
I
I
I
2
3
4
5
6
7
8
9
Increment
0
4
8
12
16
20
24
28
0
32
64
96
128
160
192
224
31
19
256
288
320
352
384
416
448
480
18
512
544
576
608
640
672
704
736
17
768
800
832
864
896
928
960
992
16
1024
1056
1088
1120
1152
1184
1216
1248
15
1280
1312
1344
1376
1408
1440
1472
1504
14
1536
1568
1600
1632
1664
1696
1728
1760
13
1792
1824
1856
1888
1920
1952
1984
2016
12
11
O
I/O
I/O
I/O
I/O
I/O
I/O
O
I
Fuse number = First fuse number + Increment
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
TIBPAL16R4-25C
TIBPAL16R4-30M
LOW-POWER HIGH-PERFORMANCE IMPACT  PAL CIRCUITS
SRPS059 – FEBRUARY 1984 – REVISED APRIL 2000
logic diagram (positive logic)
CLK
1
First
Fuse
Numbers
I
I
I
I
I
I
I
I
2
3
4
5
6
7
8
9
Increment
0
4
8
12
16
20
24
31
19
256
288
320
352
384
416
448
480
18
512
544
576
608
640
672
704
736
I=1
1D
768
800
832
864
896
928
960
992
I=1
1D
1024
1056
1088
1120
1152
1184
1216
1248
I=1
1D
1280
1312
1344
1376
1408
1440
1472
1504
I=1
1D
17
I/O
I/O
Q
C1
16
Q
C1
15
Q
C1
14
Q
C1
1536
1568
1600
1632
1664
1696
1728
1760
13
1792
1824
1856
1888
1920
1952
1984
2016
12
11
Fuse number = First fuse number + Increment
6
28
0
32
64
96
128
160
192
224
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
I/O
I/O
OE
TIBPAL16R6-25C
TIBPAL16R6-30M
LOW-POWER HIGH-PERFORMANCE IMPACT  PAL CIRCUITS
SRPS059 – FEBRUARY 1984 – REVISED APRIL 2000
logic diagram (positive logic)
CLK
1
First
Fuse
Numbers
I
I
I
I
I
I
I
I
2
3
4
5
6
7
8
9
Increment
0
4
8
12
16
20
24
28
31
0
32
64
96
128
160
192
224
19
256
288
320
352
384
416
448
480
I=1
1D
512
544
576
608
640
672
704
736
I=1
1D
768
800
832
864
896
928
960
992
I=1
1D
1024
1056
1088
1120
1152
1184
1216
1248
I=1
1D
1280
1312
1344
1376
1408
1440
1472
1504
I=1
1D
1536
1568
1600
1632
1664
1696
1728
1760
I=1
1D
18
I/O
Q
C1
17
Q
C1
16
Q
C1
15
Q
C1
14
Q
C1
13
Q
C1
1792
1824
1856
1888
1920
1952
1984
2016
12
11
I/O
OE
Fuse number = First fuse number + Increment
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
TIBPAL16R8-25C
TIBPAL16R8-30M
LOW-POWER HIGH-PERFORMANCE IMPACT  PAL CIRCUITS
SRPS059 – FEBRUARY 1984 – REVISED APRIL 2000
logic diagram (positive logic)
CLK
1
First
Fuse
Numbers
I
I
I
I
I
I
I
I
2
3
4
5
6
7
8
9
Increment
0
4
8
12
16
20
24
28
31
0
32
64
96
128
160
192
224
I=1
1D
256
288
320
352
384
416
448
480
I=1
1D
512
544
576
608
640
672
704
736
I=1
1D
768
800
832
864
896
928
960
992
I=1
1D
1024
1056
1088
1120
1152
1184
1216
1248
I=1
1D
1280
1312
1344
1376
1408
1440
1472
1504
I=1
1D
1536
1568
1600
1632
1664
1696
1728
1760
I=1
1D
1792
1824
1856
1888
1920
1952
1984
2016
I=1
1D
19
Q
C1
18
Q
C1
17
Q
C1
16
Q
C1
15
Q
C1
14
Q
C1
13
Q
C1
12
Q
C1
11
OE
Fuse number = First fuse number + Increment
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TIBPAL16L8-25C, TIBPAL16R4-25C, TIBPAL16R6-25C, TIBPAL16R8-25C
LOW-POWER HIGH-PERFORMANCE IMPACT  PAL CIRCUITS
SRPS059 – FEBRUARY 1984 – REVISED APRIL 2000
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
Voltage applied to disabled output (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
Operating free-air temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 75°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
NOTE 1: These ratings apply, except for programming pins, during a programming cycle.
recommended operating conditions
MIN
NOM
MAX
UNIT
4.75
5
5.25
V
5.5
V
0.8
V
VCC
VIH
Supply voltage
VIL
IOH
Low-level input voltage
High-level output current
–3.2
mA
IOL
fclock
Low-level output current
24
mA
30
MHz
High-level input voltage
2
Clock frequency
0
tw
Pulse duration,
duration clock (see Note 2)
tsu
th
Setup time, input or feedback before clock↑
Hold time, input or feedback after clock↑
High
10
Low
15
ns
20
ns
0
ns
TA
Operating free-air temperature
0
25
75
°C
NOTE 2: The total clock period of clock high and clock low must not exceed clock frequency, fclock. The minimum pulse durations specified are
for clock high or low only, but not for both simultaneously.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
TIBPAL16L8-25C, TIBPAL16R4-25C, TIBPAL16R6-25C, TIBPAL16R8-25C
LOW-POWER HIGH-PERFORMANCE IMPACT  PAL CIRCUITS
SRPS059 – FEBRUARY 1984 – REVISED APRIL 2000
electrical characteristics over recommended operating free-air temperature range
PARAMETER
TEST CONDITIONS
VIK
VOH
VCC = 4.75 V,
VCC = 4.75 V,
II = –18 mA
IOH = –3.2 mA
VOL
VCC = 4.75 V,
IOL = 24 mA
VCC = 5
5.25
25 V
V,
VO = 2.7
27V
VCC = 5
5.25
25 V
V,
VO = 0.4
04V
II
IIH
VCC = 5.25 V,
VCC = 5.25 V,
VI = 5.5 V
VI = 2.7 V
IIL
IO‡
VCC = 5.25 V,
VCC = 5.25 V,
VI = 0.4 V
VO = 2.25 V
IOZH
IOZL
Outputs
I/O ports
Outputs
I/O ports
MIN
2.4
TYP†
MAX
UNIT
–1.5
V
3.3
0.35
V
0.5
20
100
–20
–250
–30
V
µA
µA
0.1
mA
20
µA
–0.25
mA
–125
mA
ICC
VCC = 5.25 V,
VI = 0,
Outputs open
75
100
mA
† All typical values are at VCC = 5 V, TA = 25°C.
‡ The output conditions have been chosen to produce a current that closely approximates one-half of the short-circuit output current, IOS.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
FROM
(INPUT)
TO
(OUTPUT)
I, I/O
O, I/O
tpd
ten
CLK↑
Q
OE↓
Q
tdis
ten
OE↑
Q
I, I/O
tdis
I, I/O
PARAMETER
fmax
tpd
TYP†
MAX
15
25
ns
10
15
ns
15
20
ns
10
20
ns
O, I/O
14
25
ns
O, I/O
13
25
ns
TEST CONDITIONS
30
R1 = 500 Ω,
R2 = 500 Ω,
S Fi
See
Figure 3
† All typical values are at VCC = 5 V, TA = 25°C.
10
MIN
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
MHz
TIBPAL16L8-30M, TIBPAL16R4-30M, TIBPAL16R6-30M, TIBPAL16R8-30M
LOW-POWER HIGH-PERFORMANCE IMPACT  PAL CIRCUITS
SRPS059 – FEBRUARY 1984 – REVISED APRIL 2000
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
Voltage applied to disabled output (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
Operating free-air temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to 125°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
NOTE 1: These ratings apply, except for programming pins, during a programming cycle.
recommended operating conditions
MIN
NOM
MAX
UNIT
4.5
5
5.5
V
5.5
V
VCC
VIH
Supply voltage
VIL
IOH
Low-level input voltage
0.8
V
High-level output current
–2
mA
IOL
fclock
Low-level output current
12
mA
25
MHz
High-level input voltage
2
Clock frequency
0
tw
Pulse duration,
duration clock (see Note 2)
tsu
th
Setup time, input or feedback before clock↑
Hold time, input or feedback after clock↑
High
15
Low
20
ns
25
ns
0
ns
TA
Operating free-air temperature
–55
25
125
°C
NOTE 2: The total clock period of clock high and clock low must not exceed clock frequency, fclock. The minimum pulse durations specified are
for clock high or low only, but not for both simultaneously.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
11
TIBPAL16L8-30M, TIBPAL16R4-30M, TIBPAL16R6-30M, TIBPAL16R8-30M
LOW-POWER HIGH-PERFORMANCE IMPACT  PAL CIRCUITS
SRPS059 – FEBRUARY 1984 – REVISED APRIL 2000
electrical characteristics over recommended operating free-air temperature range
PARAMETER
TEST CONDITIONS
VIK
VOH
VCC = 4.5 V,
VCC = 4.5 V,
II = –18 mA
IOH = –2 mA
VOL
VCC = 4.5 V,
IOL = 12 mA
VCC = 5
5.5
5V
VO = 2.7
27V
VCC = 5
5.5
5V
V,
VO = 0.4
04V
VCC = 5
5.5
5V
V,
VI = 5
5.5
5V
VCC = 5.5 V,
VI = 2.7 V
IOZH
IOZL
Outputs
I/O ports
Outputs
I/O ports
Pin 1, 11
II
All others
MIN
2.4
TYP†
I/O ports
I/O ports
All others
IOS‡
ICC
V
V
0.4
20
100
–20
–250
0.2
0.1
V
µA
µA
mA
50
100
All others
IIL
UNIT
–1.5
3.2
0.25
Pin 1, 11
IIH
MAX
µA
20
VCC = 5
5.5
5V
V,
VI = 0
0.4
4V
VCC = 5.5 V,
VCC = 5.5 V,
VO = 0.5 V
VI = 0,
–0.25
–0.2
–30
Outputs open
75
mA
–250
mA
105
mA
† All typical values are at VCC = 5 V, TA = 25°C.
‡ Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second. Set VO at 0.5 V to
avoid test-equipment degradation.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
FROM
(INPUT)
TO
(OUTPUT)
I, I/O
tpd
ten
tdis
ten
PARAMETER
fmax
tpd
TYP†
MAX
O, I/O
15
30
ns
CLK↑
Q
10
20
ns
OE↓
Q
15
25
ns
OE↑
Q
10
25
ns
I, I/O
O, I/O
14
30
ns
O, I/O
13
30
ns
MIN
25
tdis
I, I/O
† All typical values are at VCC = 5 V, TA = 25°C.
12
TEST CONDITIONS
POST OFFICE BOX 655303
R1 = 390 Ω,
R2 = 750 Ω,
S Fi
See
Figure 4
• DALLAS, TEXAS 75265
UNIT
MHz
TIBPAL16L8-25C, TIBPAL16R4-25C, TIBPAL16R6-25C, TIBPAL16R8-25C
TIBPAL16L8-30M, TIBPAL16R4-30M, TIBPAL16R6-30M, TIBPAL16R8-30M
LOW-POWER HIGH-PERFORMANCE IMPACT  PAL CIRCUITS
SRPS059 – FEBRUARY 1984 – REVISED APRIL 2000
programming information
Texas Instruments programmable logic devices can be programmed using widely available software and
inexpensive device programmers.
Complete programming specifications, algorithms, and the latest information on hardware, software, and
firmware are available upon request. Information on programmers capable of programming Texas Instruments
programmable logic also is available, upon request, from the nearest TI field sales office or local authorized TI
distributor, by calling Texas Instruments at +1 (972) 644–5580, or by visiting the TI Semiconductor Home Page
at www.ti.com/sc.
preload procedure for registered outputs (see Figure 1 and Note 3)
The output registers can be preloaded to any desired state during device testing. This permits any state to be
tested without having to step through the entire state-machine sequence. Each register is preloaded individually
by following the steps given below.
Step 1.
Step 2.
Step 3.
Step 4.
With VCC at 5 V and Pin 1 at VIL, raise Pin 11 to VIHH.
Apply either VIL or VIH to the output corresponding to the register to be preloaded.
Pulse Pin 1, clocking in preload data.
Remove output voltage, then lower Pin 11 to VIL. Preload can be verified by observing the
voltage level at the output pin.
VIHH
Pin 11
td
VIL
td
tsu
tw
VIH
Pin 1
VIL
VIH
Registered I/O
Input
VOH
Output
VIL
VOL
NOTE 3: td = tsu = th = 100 ns to 1000 ns VIHH = 10.25 V to 10.75 V
Figure 1. Preload Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
13
TIBPAL16L8-25C, TIBPAL16R4-25C, TIBPAL16R6-25C, TIBPAL16R8-25C
TIBPAL16L8-30M, TIBPAL16R4-30M, TIBPAL16R6-30M, TIBPAL16R8-30M
LOW-POWER HIGH-PERFORMANCE IMPACT  PAL CIRCUITS
SRPS059 – FEBRUARY 1984 – REVISED APRIL 2000
power-up reset (see Figure 2)
Following power up, all registers are set high. This feature provides extra flexibility to the system designer and
is especially valuable in simplifying state-machine initialization. To ensure a valid power-up reset, it is important
that the rise of VCC be monotonic. Following power-up reset, a low-to-high clock transition must not occur until
all applicable input and feedback setup times are met.
VCC
5V
4V
tpd†
(600 ns TYP, 1000 ns MAX)
VOH
Active-Low
Registered Output
1.5 V
VOL
tsu‡
VIH
CLK
1.5 V
1.5 V
VIL
tw
† This is the power-up reset time and applies to registered outputs only. The values shown are from characterization data.
‡ This is the setup time for input or feedback.
Figure 2. Power-Up Reset Waveforms
14
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TIBPAL16L8-25C, TIBPAL16R4-25C, TIBPAL16R6-25C, TIBPAL16R8-25C
LOW-POWER HIGH-PERFORMANCE IMPACT  PAL CIRCUITS
SRPS059 – FEBRUARY 1984 – REVISED APRIL 2000
PARAMETER MEASUREMENT INFORMATION
7V
S1
R1
From Output
Under Test
Test
Point
CL
(see Note A)
R2
LOAD CIRCUIT FOR 3-STATE OUTPUTS
3.5 V
Timing
Input
0.3 V
1.3 V
3.5 V
1.3 V
0.3 V
3.5 V
Low-Level
Pulse
1.3 V
0.3 V
1.3 V
VOLTAGE WAVEFORMS
PULSE DURATIONS
3.5 V
Output
Control
(low-level
enabling)
3.5 V
1.3 V
1.3 V
tdis
0.3 V
tpd
VOH
In-Phase
Output
1.3 V
1.3 V
Out-of-Phase
Output
(see Note D)
Waveform 1
S1 Closed
(see Note B)
1.3 V
tpd
1.3 V
tdis
ten
VOH
1.3 V
VOL
Waveform 2
S1 Open
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
≈3.5 V
VOL + 0.3 V
VOL
VOL
tpd
1.3 V
0.3 V
ten
1.3 V
tpd
1.3 V
0.3 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Input
1.3 V
tw
th
tsu
Data
Input
3.5 V
High-Level
Pulse
1.3 V
VOH
1.3 V
VOH – 0.3 V
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
NOTES: A. CL includes probe and jig capacitance and is 50 pF for tpd and ten, 5 pF for tdis.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses have the following characteristics: PRR ≤ 1 MHz, tr = tf ≤ 2 ns, duty cycle = 50%
D. When measuring propagation delay times of 3-state outputs from low to high, switch S1 is closed.
When measuring propagation delay times of 3-state outputs from high to low, switch S1 is open.
E. Equivalent loads may be used for testing.
Figure 3. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
15
TIBPAL16L8-25C, TIBPAL16R4-25C, TIBPAL16R6-25C, TIBPAL16R8-25C
LOW-POWER HIGH-PERFORMANCE IMPACT  PAL CIRCUITS
SRPS059 – FEBRUARY 1984 – REVISED APRIL 2000
PARAMETER MEASUREMENT INFORMATION
5V
S1
R1
From Output
Under Test
Test
Point
CL
(see Note A)
R2
LOAD CIRCUIT FOR 3-STATE OUTPUTS
3V
Timing
Input
0
1.5 V
3V
1.5 V
0
3V
Low-Level
Pulse
1.5 V
0
1.5 V
VOLTAGE WAVEFORMS
PULSE DURATIONS
3V
Output
Control
(low-level
enabling)
3V
1.5 V
1.5 V
tdis
0
tpd
VOH
In-Phase
Output
1.5 V
1.5 V
Out-of-Phase
Output
(see Note D)
Waveform 1
S1 Closed
(see Note B)
1.5 V
tpd
1.5 V
tdis
ten
VOH
1.5 V
VOL
Waveform 2
S1 Open
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
≈3.3 V
VOL + 0.5 V
VOL
VOL
tpd
1.5 V
0
ten
1.5 V
tpd
1.5 V
0
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Input
1.5 V
tw
th
tsu
Data
Input
3V
High-Level
Pulse
1.5 V
VOH
1.5 V
VOH – 0.5 V
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
NOTES: A. CL includes probe and jig capacitance and is 50 pF for tpd and ten, 5 pF for tdis.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses have the following characteristics: PRR ≤ 10 MHz, tr = tf ≤ 2 ns, duty cycle = 50%
D. When measuring propagation delay times of 3-state outputs, switch S1 is closed.
E. Equivalent loads may be used for testing.
Figure 4. Load Circuit and Voltage Waveforms
16
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
4-Mar-2005
PACKAGING INFORMATION
(1)
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
5962-85155052A
ACTIVE
LCCC
FK
20
1
None
Call TI
Level-NC-NC-NC
5962-8515505RA
ACTIVE
CDIP
J
20
1
None
Call TI
Level-NC-NC-NC
5962-8515505SA
ACTIVE
CFP
W
20
1
None
Call TI
Level-NC-NC-NC
5962-85155062A
ACTIVE
LCCC
FK
20
1
None
Call TI
Level-NC-NC-NC
5962-8515506RA
ACTIVE
CDIP
J
20
1
None
Call TI
Level-NC-NC-NC
5962-8515506SA
ACTIVE
CFP
W
20
1
None
Call TI
Level-NC-NC-NC
5962-85155072A
ACTIVE
LCCC
FK
20
1
None
Call TI
Level-NC-NC-NC
5962-8515507RA
ACTIVE
CDIP
J
20
1
None
Call TI
Level-NC-NC-NC
5962-8515507SA
ACTIVE
CFP
W
20
1
None
Call TI
Level-NC-NC-NC
5962-85155082A
ACTIVE
LCCC
FK
20
1
None
Call TI
Level-NC-NC-NC
5962-8515508RA
ACTIVE
CDIP
J
20
1
None
Call TI
Level-NC-NC-NC
5962-8515508SA
ACTIVE
CFP
W
20
1
None
Call TI
Level-NC-NC-NC
JM38510/50605BRA
ACTIVE
CDIP
J
20
1
None
Call TI
Level-NC-NC-NC
JM38510/50606BRA
ACTIVE
CDIP
J
20
1
None
Call TI
Level-NC-NC-NC
JM38510/50607BRA
ACTIVE
CDIP
J
20
1
None
Call TI
Level-NC-NC-NC
JM38510/50608BRA
ACTIVE
CDIP
J
20
1
None
Call TI
Level-NC-NC-NC
TIBPAL16L8-25CFN
ACTIVE
PLCC
FN
20
46
None
Call TI
Level-1-220-UNLIM
TIBPAL16L8-25CN
ACTIVE
PDIP
N
20
20
None
Call TI
Level-NC-NC-NC
TIBPAL16L8-30MFKB
ACTIVE
LCCC
FK
20
1
None
Call TI
Level-NC-NC-NC
TIBPAL16L8-30MJ
ACTIVE
CDIP
J
20
1
None
Call TI
Level-NC-NC-NC
TIBPAL16L8-30MJB
ACTIVE
CDIP
J
20
1
None
Call TI
Level-NC-NC-NC
TIBPAL16L8-30MWB
ACTIVE
CFP
W
20
1
None
Call TI
Level-NC-NC-NC
TIBPAL16R4-25CFN
ACTIVE
PLCC
FN
20
46
None
Call TI
Level-1-220-UNLIM
TIBPAL16R4-25CN
ACTIVE
PDIP
N
20
20
None
Call TI
Level-NC-NC-NC
TIBPAL16R4-30MFKB
ACTIVE
LCCC
FK
20
1
None
Call TI
Level-NC-NC-NC
TIBPAL16R4-30MJ
ACTIVE
CDIP
J
20
1
None
Call TI
Level-NC-NC-NC
TIBPAL16R4-30MJB
ACTIVE
CDIP
J
20
1
None
Call TI
Level-NC-NC-NC
TIBPAL16R4-30MWB
ACTIVE
CFP
W
20
1
None
Call TI
Level-NC-NC-NC
TIBPAL16R6-25CFN
ACTIVE
PLCC
FN
20
46
None
Call TI
Level-1-220-UNLIM
TIBPAL16R6-25CN
ACTIVE
PDIP
N
20
20
None
Call TI
Level-NC-NC-NC
TIBPAL16R6-30MFKB
ACTIVE
LCCC
FK
20
1
None
Call TI
Level-NC-NC-NC
TIBPAL16R6-30MJ
ACTIVE
CDIP
J
20
1
None
Call TI
Level-NC-NC-NC
TIBPAL16R6-30MJB
ACTIVE
CDIP
J
20
1
None
Call TI
Level-NC-NC-NC
TIBPAL16R6-30MWB
ACTIVE
CFP
W
20
1
None
Call TI
Level-NC-NC-NC
TIBPAL16R8-25CFN
ACTIVE
PLCC
FN
20
46
None
Call TI
Level-1-220-UNLIM
TIBPAL16R8-25CN
ACTIVE
PDIP
N
20
20
None
Call TI
Level-NC-NC-NC
TIBPAL16R8-30MFKB
ACTIVE
LCCC
FK
20
1
None
Call TI
Level-NC-NC-NC
TIBPAL16R8-30MJ
ACTIVE
CDIP
J
20
1
None
Call TI
Level-NC-NC-NC
TIBPAL16R8-30MJB
ACTIVE
CDIP
J
20
1
None
Call TI
Level-NC-NC-NC
TIBPAL16R8-30MWB
ACTIVE
CFP
W
20
1
None
Call TI
Level-NC-NC-NC
The marketing status values are defined as follows:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Mar-2005
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
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reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE
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