TC4431/TC4432 1.5A High-Speed 30V MOSFET Drivers Features General Description • High Peak Output Current – 1.5 A • Wide Input Supply Operating Range: - 4.5V to 30V • High Capacitive Load Drive Capability: - 1000 pF in 25 nsec • Short Delay Times – <78 nsec Typ. • Low Supply Current: - With Logic ‘1’ Input – 2.5 mA - With Logic ‘0’ Input – 300 µA • Low Output Impedance – 7 Ω • Latch-Up Protected: Will Withstand >300 mA Reverse Current • ESD Protected – 4 kV The TC4431/TC4432 are 30V CMOS buffer/drivers suitable for use in high-side driver applications. They will not latch up under any conditions within their power and voltage ratings. They can accept, without damage or logic upset, up to 300 mA of reverse current (of either polarity) being forced back into their outputs. All terminals are fully protected against up to 4 kV of electrostatic discharge. Under-voltage lockout circuitry forces the output to a ‘low’ state when the input supply voltage drops below 7V. For operation at lower voltages, disable the lockout and start-up circuit by grounding pin 3 (LOCK DIS); for all other situations, pin 3 (LOCK DIS) should be left floating. The under-voltage lockout and start-up circuit gives brown out protection when driving MOSFETS. Applications Package Type • Small Motor Drive • Power MOSFET Driver • Driving Bipolar Transistors 8-Pin PDIP/SOIC/CERDIP VDD 1 IN 2 LOCK DIS 3 8 VDD 7 OUT TC4431 6 OUT GND 4 5 GND 7 2 6 Inverting VDD 1 IN 2 LOCK DIS 3 8 VDD 7 OUT TC4432 6 OUT GND 4 2 5 GND 7 6 Non Inverting © 2007 Microchip Technology Inc. DS21424D-page 1 TC4431/TC4432 Functional Block Diagram 3 LOCK DIS 8 VDD 7 OUT OUT UV LOCK 2 mA Inverting TC4431 6 2 Input 250 mV Non Inverting TC4432 TC4431/TC4432 Inverting/Non Inverting 4, 5 GND Effective Input C = 10 pF DS21424D-page 2 © 2007 Microchip Technology Inc. TC4431/TC4432 1.0 ELECTRICAL CHARACTERISTICS † Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings† Supply Voltage ....................................................... 36V Input Voltage (Note 1)................... VDD + 0.3V to GND Package Power Dissipation (TA ≤ 70°C) PDIP ............................................................ 730 mW CERDIP ....................................................... 800 mW SOIC............................................................ 470 mW Maximum Junction Temperature, TJ ................ +150°C Storage Temperature Range .............. -65°C to +150°C DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, TA = +25ºC with 4.5V ≤ VDD ≤ 30V. Parameters Sym Min Typ Max Units Logic ‘1’, High Input Voltage VIH 2.4 Logic ‘0’, Low Input Voltage VIL — Input Current (Note 1) IIN High Output Voltage Low Output Voltage Conditions — — V — 0.8 V -1 — 1 µA 0V ≤ VIN ≤ 12V VOH VDD – 1.0 VDD – 0.8 — V IOUT = 100 mA VOL — — 0.025 V Output Resistance RO — 7 10 Ω IOUT = 10 mA, VDD = 30V Peak Output Current IPK — — 3.0 1.5 — — A Source: VDD = 30V Sink: VDD = 30V Latch-Up Protection Withstand Reverse Current IREV — 0.3 — A Duty cycle ≤ 2%, t ≤ 300 µsec tR — 25 40 ns Figure 4-1 Fall Time tF — 33 50 ns Figure 4-1 Delay Time tD1 — 62 80 ns Figure 4-1 Delay Time tD2 — 78 90 ns Figure 4-1 Power Supply Current IS — — 2.5 0.3 4 0.4 mA VIN = 3V VIN = 0V Start-up Threshold VS — 8.4 10 V Drop-out Threshold VDO 7 7.7 — V Input Output Switching Time (Note 2) Rise Time Power Supply Note 1: 2: 3: Note 3 For inputs >12V, add a 1 kΩ resistor in series with the input. See Section 2.0 “Typical Performance Curves” for input current graph. Switching times are ensured by design. For operation below 7V, pin 3 (LOCK DIS) should be tied to ground to disable the lockout and start-up circuit, otherwise, pin 3 must be left floating. © 2007 Microchip Technology Inc. DS21424D-page 3 TC4431/TC4432 DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, Over operating temperature range with 4.5V ≤ VDD ≤ 30V. Parameters Sym Min Typ Max Units Conditions Logic ‘1’, High Input Voltage VIH 2.4 — — V Logic ‘0’, Low Input Voltage VIL — — 0.8 V Input Current (Note 1) IIN -10 — 10 µA 0V ≤ VIN ≤ 12V IOUT = 100 mA Input Output High Output Voltage VOH VDD – 1.2 — — V Low Output Voltage VOL — — 0.025 V Output Resistance RO — — 12 Ω IOUT = 10 mA, VDD = 30V Rise Time tR — — 60 ns Figure 4-1 Fall Time tF — — 70 ns Figure 4-1 Delay Time tD1 — — 100 ns Figure 4-1 Delay Time tD2 — — 110 ns Figure 4-1 Power Supply Current IS — — — — 6 0.7 mA VIN = 3V VIN = 0V Start-up Threshold VS — 8.4 10 V Drop-out Threshold VDO 7 7.7 — V Switching Time (Note 2) Power Supply Note 1: 2: 3: Note 3 For inputs >12V, add a 1 kΩ resistor in series with the input. See Section 2.0 “Typical Performance Curves” for input current graph. Switching times are ensured by design. For operation below 7V, pin 3 (LOCK DIS) should be tied to ground to disable the lockout and start-up circuit, otherwise, pin 3 must be left floating. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 30V. Parameters Sym Min Typ Max Units Conditions Temperature Ranges Specified Temperature Range (C) TA 0 — +70 ºC Specified Temperature Range (E) TA -40 — +85 ºC Specified Temperature Range (V) TA -40 — +125 ºC Maximum Junction Temperature TJ — — +150 ºC Storage Temperature Range TA -65 — +150 ºC Package Thermal Resistances: Thermal Resistance, 8L-SOIC θJA — 155 — ºC/W Thermal Resistance, 8L-PDIP θJA — 125 — ºC/W Thermal Resistance, 8L-CERDIP θJA — 150 — ºC/W DS21424D-page 4 © 2007 Microchip Technology Inc. TC4431/TC4432 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, TA = +25ºC with 4.5V ≤ VDD ≤ 30V. 60 150 50 125 40 100 Time (nsec) ISUPPLY (mA) CLOAD = 1000 pF TA = +25°C 2 MHz VDD = 12V 30 900 kHz 20 600 kHz 10 tFALL 75 50 tRISE 25 200 kHz 20 kHz 0 100 0 1000 CLOAD (pF) FIGURE 2-1: Capacitive Load. 3 10,000 Supply Current vs. 6 9 FIGURE 2-3: 12 15 18 VDD (V) 21 24 27 30 Rise/Fall Time vs. VDD. 300 CLOAD = 1000 pF TA = +25°C 50 250 tD1 40 TIME (nsec) INPUT CURRENT (mA) 45 35 30 25 20 200 150 tD2 100 WITHOUT 1 K RES. 15 50 10 WITH 1 K RES. 0 5 3 0 3 FIGURE 2-2: Voltage. 6 9 12 15 18 21 24 INPUT VOLTAGE (VIN) 27 30 FIGURE 2-4: 6 9 12 15 18 VDD (V) 21 24 27 30 tD1 and tD2 Delay vs. VDD. Input Current vs. Input © 2007 Microchip Technology Inc. DS21424D-page 5 TC4431/TC4432 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin No. Symbol 1 VDD 3.1 Description Supply Input, 4.5V to 30V 2 IN 3 LOCK DIS TTL/CMOS Compatible Input 4 GND Ground 5 GND Ground 6 OUT Drive Output, Pull Down 7 OUT Drive Output, Pull Up 8 VDD Supply Input, 4.5V to 30V Input Pin, Enable/Disable for UV Lockout Supply Input (VDD) 3.4 Ground (GND) The VDD input is the bias supply input for the MOSFET driver and is rated for 4.5V to 30V with respect to the ground pins. The VDD input should be bypassed to ground with a local ceramic capacitor. The value of this capacitor should be chosen based on the capacitive load that is being driven. The ground pins are the return path for the bias current and for the high peak currents which discharge the load capacitor. Both ground pins should be used to ensure proper operation. The ground pins should be tied into a ground plane or have short traces to the bias supply source return. 3.2 3.5 Control Input (IN) The MOSFET driver input is a TTL/CMOS compatible input with 250 mV of hysteresis between the high and low threshold voltages. If an input signal level of greater than 12V is applied to the device, a series current limiting resistor is recommended. 3.3 Lockout Disable (LOCK DIS) Drive Output (OUT) The TC4431/TC4432 devices have individual source and sink output pins. This feature can be used to adjust the rise and fall time independently by adding separate charge and discharge resistors external to the device. Pin 7 (source output) can source 3 A peak currents into capacitive loads and pin 6 (sink output) can sink 1.5 A peak currents from a capacitive load. The lockout pin enables/disables the undervoltage lockout feature of the device. If undervoltage lockout is desired (output is not enabled until the bias voltage reaches 8.4V (typical) on the rising edge and is disabled when the bias voltage reaches 7.7V (typical) on the falling edge), the lockout pin should be left floating. If operation below 7V is desired, the lockout pin should be tied to ground. DS21424D-page 6 © 2007 Microchip Technology Inc. TC4431/TC4432 4.0 APPLICATIONS INFORMATION +5V 90% Input VDD = 30V 0V 4.7 µF 0.1 µF tD1 tD2 tF VDD 7 2 90% 10% 10% 0V Output 6 Inverting Driver CL = 1000 pF +5V LOCK DIS tR 90% Output 1, 8 Input 10% 3 90% Input 4, 5 0V VDD Input: 100 kHz, square wave, tRISE = tFALL ≤ 10 nsec 10% tD1 90% tR Output 0V 90% tD2 10% tF 10% Non Inverting Driver FIGURE 4-1: Switching Time Test Circuit. © 2007 Microchip Technology Inc. DS21424D-page 7 TC4431/TC4432 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 8-Lead CERDIP (300 mil) XXXXXXXX XXXXXNNN YYWW TC4432 e3 EJA^^256 0749 8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW Legend: XX...X Y YY WW NNN e3 * Note: DS21424D-page 8 Example: TC4431 e3 EPA^^256 0749 8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW NNN Example: Example: TC4431E e3 OA^^0749 256 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2007 Microchip Technology Inc. TC4431/TC4432 /HDG&HUDPLF'XDO,Q/LQH-$±%RG\>&(5',3@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ N E1 NOTE 1 1 2 D E A2 A c L A1 b1 b E2 e 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV ,1&+(6 0,1 1 120 0$; 3LWFK H 7RSWR6HDWLQJ3ODQH $ ± ± 6WDQGRII $ ± ± &HUDPLF3DFNDJH+HLJKW $ ± 6KRXOGHUWR6KRXOGHU:LGWK ( ± &HUDPLF3DFNDJH:LGWK ( 2YHUDOO/HQJWK ' 7LSWR6HDWLQJ3ODQH / ± /HDG7KLFNQHVV F ± E ± E ± ( ± 8SSHU/HDG:LGWK /RZHU/HDG:LGWK 2YHUDOO5RZ6SDFLQJ %6& 1RWHV 3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKLQWKHKDWFKHGDUHD 6LJQLILFDQW&KDUDFWHULVWLF 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% © 2007 Microchip Technology Inc. DS21424D-page 9 TC4431/TC4432 /HDG3ODVWLF'XDO,Q/LQH3±PLO%RG\>3',3@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ N NOTE 1 E1 1 3 2 D E A2 A L A1 c e eB b1 b 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV ,1&+(6 0,1 1 120 0$; 3LWFK H 7RSWR6HDWLQJ3ODQH $ ± ± 0ROGHG3DFNDJH7KLFNQHVV $ %DVHWR6HDWLQJ3ODQH $ ± ± 6KRXOGHUWR6KRXOGHU:LGWK ( 0ROGHG3DFNDJH:LGWK ( 2YHUDOO/HQJWK ' 7LSWR6HDWLQJ3ODQH / /HDG7KLFNQHVV F E E H% ± ± 8SSHU/HDG:LGWK /RZHU/HDG:LGWK 2YHUDOO5RZ6SDFLQJ %6& 1RWHV 3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKWKHKDWFKHGDUHD 6LJQLILFDQW&KDUDFWHULVWLF 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6&%DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% DS21424D-page 10 © 2007 Microchip Technology Inc. TC4431/TC4432 /HDG3ODVWLF6PDOO2XWOLQH61±1DUURZPP%RG\>62,&@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D e N E E1 NOTE 1 1 2 3 α h b h A2 A c φ L A1 L1 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV β 0,//,0(7(56 0,1 1 120 0$; 3LWFK H 2YHUDOO+HLJKW $ ± %6& ± 0ROGHG3DFNDJH7KLFNQHVV $ ± ± 6WDQGRII $ ± 2YHUDOO:LGWK ( 0ROGHG3DFNDJH:LGWK ( %6& 2YHUDOO/HQJWK ' %6& %6& &KDPIHURSWLRQDO K ± )RRW/HQJWK / ± )RRWSULQW / 5() )RRW$QJOH ± /HDG7KLFNQHVV F ± /HDG:LGWK E ± 0ROG'UDIW$QJOH7RS ± 0ROG'UDIW$QJOH%RWWRP ± 1RWHV 3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKLQWKHKDWFKHGDUHD 6LJQLILFDQW&KDUDFWHULVWLF 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 5() 5HIHUHQFH'LPHQVLRQXVXDOO\ZLWKRXWWROHUDQFHIRULQIRUPDWLRQSXUSRVHVRQO\ 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% © 2007 Microchip Technology Inc. DS21424D-page 11 TC4431/TC4432 /HDG3ODVWLF6PDOO2XWOLQH61±1DUURZPP%RG\>62,&@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ DS21424D-page 12 © 2007 Microchip Technology Inc. TC4431/TC4432 APPENDIX A: REVISION HISTORY Revision D (December 2007) The following is the list of modifications: 1. 2. 3. Section 1.0 “Electrical Characteristics”: Added V temperature information to Temperature Characteristics table. Added Revision History. Added V temperature range to Product identification System page. Revision C (May 2003) The following is the list of modifications: 1. Undocumented changes Revision B (May 2002) The following is the list of modifications: 1. Undocumented changes Revision A (April 2002) • Original Release of this Document. © 2007 Microchip Technology Inc. DS21424D-page 13 TC4431/TC4432 NOTES: DS21424D-page 14 © 2007 Microchip Technology Inc. TC4431/TC4432 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X /XX Temperature Range Device: TC4431: TC4432: Package Examples: a) b) 1.5A High-Speed 30V MOSFET Driver, Inverting 1.5A High-Speed 30V MOSFET Driver, Non Inverting c) a) Temperature Range: C E V = = = 0°C to +70°C -40°C to +85°C -40°C to +125°C b) c) Package: JA = Ceramic Dual In-line (300 mil Body), 8-lead * OA = Plastic SOIC, (150 mil Body), 8-lead OA713 = Plastic SOIC, (150 mil Body), 8-lead (Tape and Reel) PA = Plastic DIP (300 mil Body), 8-lead* * TC4431COA: 1.5A MOSFET driver, SOIC package, 0°C to +70°C. TC4431EJA: 1.5A MOSFET driver, CERDIP package, -40ºC to +85ºC. TC4431VPA: 1.5A MOSFET driver, PDIP package, -40°C to +125°C. TC4432CPA: 1.5A MOSFET driver, PDIP package, 0°C to +70°C. TC4432EPA: 1.5A MOSFET driver, PDIP package, -40°C to +85°C. TC4432VOA713: Tape and Reel, 1.5A MOSFET driver, SOIC package, -40°C to +125°C. * Offered in E-temp range only. * * The only package offered in the V temp range. © 2007 Microchip Technology Inc. DS21424D-page 15 TC4431/TC4432 NOTES: DS21424D-page 16 © 2007 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2007 Microchip Technology Inc. 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