MCP19110/11 Digitally Enhanced Power Analog Controller with Integrated Synchronous Driver Synchronous Buck Features: Microcontroller Features: • Input Voltage: 4.5V to 32V • Output Voltage: 0.5V to 3.6V - Greater than 3.6V requires external divider • Switching Frequency: 100 kHz to 1.6 MHz • Quiescent Current: 5 mA Typical • High-Drive: - +5V Gate Drive - 1A/2A Source Current - 1A/2A Sink Current • Low-Drive: - +5V Gate Drive - 2A Source Current - 4A Sink Current • Peak Current Mode Control • Differential Remote Output Sense • Multi-Phase Systems: - Master or Slave - Frequency Synchronized - Common Error Signal • Multiple Output Systems: - Master or Slave - Frequency Synchronized • Configurable Parameters: - Overcurrent Limit - Input Undervoltage Lockout - Output Overvoltage - Output Undervoltage - Internal Analog Compensation - Soft Start Profile - Synchronous Driver Dead Time - Switching Frequency • Thermal Shutdown • Precision 8 MHz Internal Oscillator Block: - Factory Calibrated • Interrupt Capable - Firmware - Interrupt-on-Change Pins • Only 35 Instructions to Learn • 4096 Words On-Chip Program Memory • High Endurance Flash: - 100,000 write Flash Endurance - Flash Retention: >40 years • Watchdog Timer (WDT) with Independent Oscillator for Reliable Operation • Programmable Code Protection • In-Circuit Debug (ICD) via Two Pins (MCP19111) • In-Circuit Serial Programming™ (ICSP™) via Two Pins • 11 I/O Pins and One Input-Only Pin (MCP19110) - Three Open-Drain Pins • 14 I/O Pins and One Input-Only Pin (MCP19111) - Three Open-Drain Pins • Analog-to-Digital Converter (ADC): - 10-bit Resolution - 12 Internal Channels - Eight External Channels • Timer0: 8-bit Timer/Counter with 8-Bit Prescaler • Enhanced Timer1: - 16-bit Timer/Counter with Prescaler - Two Selectable Clock Sources • Timer2: 8-Bit Timer/Counter with Prescaler - 8-bit Period Register • I2CTM Communication: - 7-bit Address Masking - Two Dedicated Address Registers - SMBus/PMBusTM Compatibility 2013 Microchip Technology Inc. DS20002331B-page 1 MCP19110/11 GPB2 GPB1 -VSEN +VSEN +ISEN -ISEN 24 23 22 21 20 19 Pin Diagram – 24-Pin QFN (MCP19110) GPA0 1 18 VDD GPA1 2 17 BOOT GPA2 3 16 HDRV MCP19110 GPA3 4 15 PHASE GPA7 5 14 VDR GPA6 6 13 LDRV DS20002331B-page 2 7 8 9 10 11 12 GPA5/MCLR GPA4 GPB0 GND VIN PGND EXP-25 2013 Microchip Technology Inc. MCP19110/11 Timers MSSP 1 Y AN0 — — GPA1 2 Y AN1 — — GPA2 3 Y AN2 T0CKI GPA3 5 Y AN3 GPA4 8 N — — Pull-up A/D GPA0 Interrupt I/O ANSEL 24-PIN SUMMARY 24-Pin QFN TABLE 0-1: Basic Additional IOC Y — Analog Debug Output (1) IOC Y — Sync. Signal In/Out (2, 3) — IOC INT Y — — — IOC Y — — — IOC N — — MCLR — — (4) IOC (5) GPA5 7 N — — Y GPA6 6 N — — — IOC N ICSPDAT — GPA7 5 N — — SCL IOC N ICSPCLK — GPB0 9 N — — SDA IOC N — — GPB1 23 Y AN4 — — IOC Y — Error Signal In/Out (3) GPB2 24 Y AN5 — — IOC Y — — VIN 11 N — — — — — VIN Device Input Voltage VDR 14 N — — — — — VDR Gate Drive Supply Input Voltage VDD 18 N — — — — — VDD Internal Regulator Output GND 10 N — — — — — GND Small Signal Ground PGND 12 N — — — — — — Large Signal Ground LDRV 13 N — — — — — — Low-Side MOSFET Connection HDRV 16 N — — — — — — High-Side MOSFET Connection PHASE 15 N — — — — — — Switch Node BOOT 17 N — — — — — — Floating Bootstrap Supply +VSEN 21 N — — — — — — Output Voltage Differential Sense -VSEN 22 N — — — — — — Output Voltage Differential Sense +ISEN 20 N — — — — — — Current Sense Input -ISEN 19 N — — — — — — Current Sense Input Note 1: 2: 3: 4: 5: The Analog Debug Output is selected when the ATSTCON<BNCHEN> bit is set. Selected when device is functioning as multiple output master or slave by proper configuration of the MLTPH<2:0> bits in the BUFFCON register. Selected when device is functioning as multi-phase master or slave by proper configuration of the MLTPH<2:0> bits in the BUFFCON register. The IOC is disabled when MCLR is enabled. Weak pull-up always enabled when MCLR is enabled, otherwise the pull-up is under user control. 2013 Microchip Technology Inc. DS20002331B-page 3 MCP19110/11 GPB2 GPB5 GPB1 -VSEN +VSEN +ISEN -ISEN 28 27 26 25 24 23 22 Pin Diagram – 28-Pin QFN (MCP19111) GPA0 1 21 GPB6 GPA1 2 20 VDD GPA2 3 19 BOOT GPB4 4 18 HDRV GPA3 5 17 PHASE GPA7 6 16 VDR 15 LDRV MCP19111 EXP-29 DS20002331B-page 4 8 9 10 11 12 13 14 GPA4 GPB0 GPB7 GND VIN PGND 7 GPA5/MCLR GPA6 2013 Microchip Technology Inc. MCP19110/11 Timers MSSP 1 Y AN0 — — GPA1 2 Y AN1 — — GPA2 3 Y AN2 T0CKI GPA3 5 Y AN3 GPA4 9 N — — Pull-up A/D GPA0 Interrupt I/O ANSEL 28-PIN SUMMARY 28-Pin QFN TABLE 0-1: Basic Additional IOC Y — Analog Debug Output (1) IOC Y — Sync. Signal In/Out (2, 3) — IOC INT Y — — — IOC Y — — — IOC N — — MCLR — — (4) IOC (5) GPA5 8 N — — Y GPA6 7 N — — — IOC N — — GPA7 6 N — — SCL IOC N — — GPB0 10 N — — SDA IOC N — — GPB1 26 Y AN4 — — IOC Y — Error Signal In/Out (3) GPB2 28 Y AN5 — — IOC Y — — GPB4 4 Y AN6 — — IOC Y ICSPDAT ICDDAT — GPB5 27 Y AN7 — — IOC Y ICSPCLK ICDCLK Alternate Sync Signal In/Out (2, 3) GPB6 21 N — — — IOC Y — — GPB7 11 N — — — IOC Y — — VIN 13 N — — — — — VIN Device Input Voltage VDR 16 N — — — — — VDR Gate Drive Supply Input Voltage VDD 20 N — — — — — VDD Internal Regulator Output GND 12 N — — — — — GND Small Signal Ground PGND 14 N — — — — — — Large Signal Ground LDRV 15 N — — — — — — Low-Side MOSFET Connection HDRV 18 N — — — — — — High-Side MOSFET Connection PHASE 17 N — — — — — — Switch Node BOOT 19 N — — — — — — Floating Bootstrap Supply +VSEN 24 N — — — — — — Output Voltage Differential Sense -VSEN 25 N — — — — — — Output Voltage Differential Sense +ISEN 23 N — — — — — — Current Sense Input 22 N — — — — — — Current Sense Input -ISEN Note 1: 2: 3: 4: 5: The Analog Debug Output is selected when the ATSTCON<BNCHEN> bit is set. Selected when device is functioning as multiple output master or slave by proper configuration of the MLTPH<2:0> bits in the BUFFCON register. Selected when device is functioning as multi-phase master or slave by proper configuration of the MLTPH<2:0> bits in the BUFFCON register. The IOC is disabled when MCLR is enabled. Weak pull-up always enabled when MCLR is enabled, otherwise the pull-up is under user control. 2013 Microchip Technology Inc. DS20002331B-page 5 MCP19110/11 Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 9 2.0 Pin Description ........................................................................................................................................................................... 12 3.0 Functional Description ................................................................................................................................................................ 17 4.0 Electrical Characteristics ............................................................................................................................................................ 23 5.0 Digital Electrical Characteristics ................................................................................................................................................. 29 6.0 Configuring the MCP19110/11.................................................................................................................................................... 37 7.0 Typical Performance Curves ...................................................................................................................................................... 53 8.0 System Bench Testing ................................................................................................................................................................ 57 9.0 Device Calibration ...................................................................................................................................................................... 59 10.0 Relative Efficiency Measurement ............................................................................................................................................... 67 11.0 Memory Organization ................................................................................................................................................................. 69 12.0 Device Configuration .................................................................................................................................................................. 81 13.0 Oscillator Modes......................................................................................................................................................................... 83 14.0 Resets ........................................................................................................................................................................................ 85 15.0 Interrupts .................................................................................................................................................................................... 93 16.0 Power-Down Mode (Sleep) ...................................................................................................................................................... 101 17.0 Watchdog Timer (WDT)............................................................................................................................................................ 103 18.0 Flash Program Memory Control ............................................................................................................................................... 105 19.0 I/O Ports .................................................................................................................................................................................... 111 20.0 Interrupt-On-Change ................................................................................................................................................................ 121 21.0 Internal Temperature Indicator Module..................................................................................................................................... 123 22.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 125 23.0 Timer0 Module.......................................................................................................................................................................... 135 24.0 Timer1 Module with Gate Control............................................................................................................................................. 137 25.0 Timer2 Module.......................................................................................................................................................................... 140 26.0 PWM Module............................................................................................................................................................................ 143 27.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 147 28.0 In-Circuit Serial Programming™ (ICSP™) ............................................................................................................................... 191 29.0 Instruction Set Summary .......................................................................................................................................................... 193 30.0 Development Support............................................................................................................................................................... 203 31.0 Packaging Information.............................................................................................................................................................. 207 Appendix A: Revision History............................................................................................................................................................. 213 Index .................................................................................................................................................................................................. 215 The Microchip Web Site ..................................................................................................................................................................... 221 Customer Change Notification Service .............................................................................................................................................. 221 Customer Support .............................................................................................................................................................................. 221 ........................................................................................................................................................................................................... 222 Product Identification System............................................................................................................................................................. 223 DS20002331B-page 6 2013 Microchip Technology Inc. MCP19110/11 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our World Wide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s World Wide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. 2013 Microchip Technology Inc. DS20002331B-page 7 MCP19110/11 NOTES: DS20002331B-page 8 2013 Microchip Technology Inc. MCP19110/11 1.0 DEVICE OVERVIEW After initial device configuration using Microchip’s MPLAB® X Integrated Development Environment (IDE) software, the PMBus or I2C can be used by a host to communicate with, or modify, the operation of the MCP19110/11. The MCP19110/11 is a highly integrated, mixed signal, analog pulse-width modulation (PWM) current mode controller with an integrated microcontroller core for synchronous DC/DC step-down applications. Since the MCP19110/11 uses traditional analog control circuitry to regulate the output of the DC/DC converter, the integration of the PIC® microcontroller mid-range core is used to provide complete customization of device operating parameters, start-up and shut down profiles, protection levels and fault handling procedures. Two internal linear regulators generate two 5V rails. One 5V rail is used to provide power for the internal analog circuitry and is contained on-chip. The second 5V rail provides power to the PIC device and is present on the VDD pin. It is recommended that a 1 µF capacitor be placed between VDD and PGND. The VDD pin may also be directly connected to the VDR pin, or connected through a low-pass RC filter. The VDR pin provides power to the internal synchronous driver. The MCP19110/11 is designed to efficiently operate from a single 4.5V to 32V supply. It features integrated synchronous drivers, bootstrap device, internal linear regulator and 4 kW nonvolatile memory all in a space-saving 24-pin 4 mm x 4mm QFN package (MCP19110) or 28-pin 5 mm x 5 mm QFN package (MCP19111). FIGURE 1-1: TYPICAL APPLICATION CIRCUIT VIN GPA6 VIN GPB1 TRACK PGOOD CNTL ADDR1 ADDR0 SYNC SMBus Alert SCL SDA ICDDAT MPLAB® X ICD Programmer ICDCLK MCLR 2013 Microchip Technology Inc. GPA0 HDRV GPA2 BOOT GPB2 PHASE +VOUT GPA3 LDRV -VOUT GPB7 VDD GPB6 MCP19111 VDR GPA1 +ISEN GPA4 -ISEN GPA7 +VSEN GPB0 -VSEN GPB4 PGND GPB5 GND GPA5 DS20002331B-page 9 MCP19110/11 SYNCHRONOUS BUCK BLOCK DIAGRAM VIN Bias Gen dc current sense gain VDD VDD LDO1 To ADC LDO2 VIN VDR AVDD 3 +ISEN BGAP CSDGEN bit 5R 4 -ISEN ac current sense gain R +ISEN UVLO VDAC 6 BOOT 8 VOUT OV OV REF 5 8 VIN VOUT UV UV REF OC Comp 8+5 HDRV VREGREF PHASE BGAP AVDD 4 Lo_on -ISEN DLY 4 Slave Mode VOUT VOUT LVL_SFT LDRV +VSEN VDR -VSEN 2013 Microchip Technology Inc. DLY 4 4 4 Lo_on 5 VZC Master Mode Debug MUX I/O -VSEN UV VIN_OK OCFLAG OV A/D Mux I/O(Digital Signals) PGND Buck I/O +VSEN PIC CORE GND 11 (15) MCP19110/11 DS20002331B-page 10 FIGURE 1-2: MCP19110/11 FIGURE 1-3: MICROCONTROLLER CORE BLOCK DIAGRAM Configuration 13 Flash 4K x 14 Program Memory Program Bus PORTA GPA0 GPA1 GPA2 GPA3 RAM 256 bytes File Registers 8 Level Stack (13-bit) 14 8 Data Bus Program Counter RAM Addr GPA4 GPA5 GPA6 GPA7 9 Addr MUX Instruction reg Direct Addr 7 8 Indirect Addr PORTB GPB0 FSR reg GPB1 GPB2 STATUS reg 8 3 Instruction Decode & Control TESTCLKIN Timing Generation GPB4 (MCP19111) GPB5 (MCP19111) MUX Power-up Timer GPB6 (MCP19111) GPB7 (MCP19111) ALU Power-on Reset Watchdog Timer 8 W reg MSSP SDA SCL 8 MHz Internal Oscillator MCLR VIN VSS PMDATL Self read/ write flash memory Timer0 Timer1 Timer2 EEADDR T0CKI Analog Interface PWM Registers 2013 Microchip Technology Inc. DS20002331B-page 11 MCP19110/11 2.0 PIN DESCRIPTION The MCP19110/11 family of devices feature pins that have multiple functions associated with each pin. Table 2-1 provides a description of the different functions. See Section 2.1 “Detailed Pin Functional Description” for more detailed information. TABLE 2-1: MCP19110/11 PINOUT DESCRIPTION Name GPA0/AN0/ANALOG_TEST GPA1/AN1/CLKPIN Function Input Type Output Type GPA0 TTL CMOS General purpose I/O AN0 AN — A/D Channel 0 input. ANALOG_TEST — — Internal analog signal multiplexer output (1) GPA1 TTL CMOS General purpose I/O Description AN1 AN — A/D Channel 1 input. CLKPIN — — Switching frequency clock input or output (2 ,3) GPA2 TTL CMOS General purpose I/O AN2 AN — A/D Channel 2 input T0CKI ST — Timer0 clock input INT ST — External interrupt GPA3 TTL CMOS General purpose I/O AN3 AN — A/D Channel 3 input GPA4 GPA4 TTL OD General purpose I/O GPA5/MCLR GPA5 TTL — General purpose input only MCLR ST — GPA6 ST CMOS General purpose I/O CMOS Serial Programming Data I/O (MCP19110 Only) GPA2/AN2/T0CKI/INT GPA3/AN3 GPA6/ICSPDAT ICSPDAT GPA7/SCL/ICSPCLK Master Clear with internal pull-up GPA7 ST OD General purpose open-drain I/O SCL I2C OD I2C clock ICSPCLK ST — Serial Programming Clock (MCP19110 Only) GPB0 TTL OD General purpose I/O SDA I2C OD I2C data input/output GPB1 TTL CMOS General purpose I/O AN4 AN — A/D Channel 4 input EAPIN — — Error amplifier signal input/output (3) GPB2/AN5 GPB2 TTL CMOS AN5 AN — A/D Channel 5 input GPB4/AN6/ICSPDAT (MCP19111 Only) GPB4 TTL CMOS General purpose I/O AN6 AN — A/D Channel 6 input ICSPDAT ST CMOS GPB0/SDA GPB1/AN4/EAPIN Legend: Note 1: 2: 3: General purpose I/O Serial Programming Data I/O AN = Analog input or output CMOS =CMOS compatible input or output OD = Open Drain TTL = TTL compatible input ST =Schmitt Trigger input with CMOS levels I2C = Schmitt Trigger input with I2C Analog Test is selected when the ATSTCON<BNCHEN> bit is set. Selected when device is functioning as multiple output master or slave by proper configuration of the MLTPH<2:0> bits in the BUFFCON register. Selected when device is functioning as multi-phase master or slave by proper configuration of the MLTPH<2:0> bits in the BUFFCON register. DS20002331B-page 12 2013 Microchip Technology Inc. MCP19110/11 TABLE 2-1: MCP19110/11 PINOUT DESCRIPTION (CONTINUED) Name GPB5/AN7/ICSPCLK/ ALT_CLKPIN (MCP19111 Only) Function Input Type Output Type GPB5 TTL CMOS General purpose I/O Description AN7 AN — A/D Channel 7 input ISCPCLK ST — Serial Programming Clock ALT_CLKPIN — — Alternate switching frequency clock input or output (2,3) GPB6 (MCP19111 Only) GPB6 TTL CMOS General purpose I/O GPB7 (MCP19111 Only) GPB7 TTL CMOS General purpose I/O VIN VIN — — Device input supply voltage VDD VDD — — Internal +5V LDO output pin VDR VDR — — Gate drive supply input voltage pin GND GND — — Small signal quiet ground PGND PGND — — Large signal power ground LDRV LDRV — — High-current drive signal connected to the gate of the low-side MOSFET HDRV HDRV — — Floating high-current drive signal connected to the gate of the high-side MOSFET PHASE PHASE — — Synchronous buck switch node connection BOOT BOOT — — Floating bootstrap supply +VSEN +VSEN — — Positive input of the output voltage sense differential amplifier -VSEN -VSEN — — Negative input of the output voltage sense differential amplifier +ISEN +ISEN — — Current sense input -ISEN -ISEN — — Current sense input — — — Exposed Thermal Pad EP Legend: Note 1: 2: 3: AN = Analog input or output CMOS =CMOS compatible input or output OD = Open Drain TTL = TTL compatible input ST =Schmitt Trigger input with CMOS levels I2C = Schmitt Trigger input with I2C Analog Test is selected when the ATSTCON<BNCHEN> bit is set. Selected when device is functioning as multiple output master or slave by proper configuration of the MLTPH<2:0> bits in the BUFFCON register. Selected when device is functioning as multi-phase master or slave by proper configuration of the MLTPH<2:0> bits in the BUFFCON register. 2013 Microchip Technology Inc. DS20002331B-page 13 MCP19110/11 2.1 2.1.1 Detailed Pin Functional Description GPA0 PIN GPA0 is a general purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPA. An internal weak pull-up and interrupt-on-change are also available. AN0 is an input to the A/D. To configure this pin to be read by the A/D on channel 0, bits TRISA0 and ANSA0 must be set. When the ATSTCON<BNCHEN> bit is set, this pin is configured as the ANALOG_TEST function. It is a buffered output of the internal analog signal multiplexer. Signals present on this pin are controlled by the BUFFCON register, see Register 8-2. 2.1.2 GPA1 PIN GPA1 is a general purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPA. An internal weak pull-up and interrupt-on-change are also available. AN1 is an input to the A/D. To configure this pin to be read by the A/D on channel 1, bits TRISA1 and ANSA1 must be set. When the MCP19110/11 is configured as a multiple output or multi-phase MASTER or SLAVE, this pin is configured to be the switching frequency synchronization input or output, CLKPIN. See Section 3.10.6 “Multi-Phase System” and Section 3.10.7 “Multiple Output System” for more information. 2.1.3 GPA2 PIN GPA2 is a general purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPA. An internal weak pull-up and interrupt-on-change are also available. AN2 is an input to the A/D. To configure this pin to be read by the A/D on channel 2, bits TRISA2 and ANSA2 must be set. When bit T0CS is set, the T0CKI function is enabled. See Section 23.0 “Timer0 Module” for more information. GPA2 can also be configured as an external interrupt by setting of the INTE bit. See Section 15.2 “GPA2/INT Interrupt” for more information. 2.1.4 GPA3 PIN GPA3 is a general purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPA. An internal weak pull-up and interrupt-on-change are also available. DS20002331B-page 14 AN3 is an input to the A/D. To configure this pin to be read by the A/D on channel 3, bits TRISA3 and ANSA3 must be set. 2.1.5 GPA4 PIN GPA4 is a true open-drain general purpose pin whose data direction is controlled in TRISGPA. There is no internal connection between this pin and device VDD, making this pin ideal to be used as an SMBus Alert pin. This pin does not have a weak pull-up, but interrupt-onchange is available. 2.1.6 GPA5 PIN GPA5 is a general purpose TTL input-only pin. An internal weak pull-up and interrupt-on-change are also available. For programming purposes, this pin is to be connected to the MCLR pin of the serial programmer. See Section 28.0 “In-Circuit Serial Programming™ (ICSP™)” for more information. 2.1.7 GPA6 PIN GPA6 is a general purpose CMOS input/output pin whose data direction is controlled in TRISGPA. An interrupt-on-change is also available. On the MCP19110, the ISCPDAT is the serial programming data input function. This is used in conjunction with ICSPCLK to serial program the device. This pin function is only implemented on the MCP19110. 2.1.8 GPA7 PIN GPA7 is a true open-drain general purpose pin whose data direction is controlled in TRISGPA. There is no internal connection between this pin and device VDD. This pin does not have a weak pull-up, but interrupt-onchange is available. When the MCP19110/11 is configured for I2C communication (see Section 27.2 “I2C Mode Overview”), GPA7 functions as the I2C clock, SCL. On the MCP19110, the ISCPCLK is the serial programming clock function. This is used in conjunction with ICSPDAT to serial program the device. This pin function is only implemented on the MCP19110. 2.1.9 GPB0 PIN GPB0 is a true open-drain general purpose pin whose data direction is controlled in TRISGPB. There is no internal connection between this pin and device VDD. This pin does not have a weak pull-up, but interrupt-on-change is available. When the MCP19110/11 is configured for I2C communication (see Section 27.2 “I2C Mode Overview”), GPB0 functions as the I2C clock, SDA. 2013 Microchip Technology Inc. MCP19110/11 2.1.10 GPB1 PIN GPB1 is a general purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPB. An internal weak pull-up and interrupt-on-change are also available. AN4 is an input to the A/D. To configure this pin to be read by the A/D on channel 4, bits TRISB1 and ANSB1 must be set. When the MCP19110/11 is configured as a multiple output or multi-phase MASTER or SLAVE, this pin is configured to be the error amplifier signal input or output. See Section 3.10.6 “Multi-Phase System” and Section 3.10.7 “Multiple Output System”, for more information. 2.1.11 GPB2 PIN GPB2 is a general purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPB. An internal weak pull-up and interrupt-on-change are also available. AN5 is an input to the A/D. To configure this pin to be read by the A/D on channel 5, bits TRISB2 and ANSB2 must be set. 2.1.12 GPB4 PIN This pin and its associated functions are only available on the MCP19111 device. GPB4 is a general purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPB. An internal weak pull-up and interrupt-on-change are also available. AN6 is an input to the A/D. To configure this pin to be read by the A/D on channel 6, bits TRISB4 and ANSB4 must be set. This pin can also be configured as an alternate switching frequency synchronization input or output, ALT_CLKPIN, for use in multiple output or multi-phase systems. See Section 19.1 “Alternate Pin Function” for more information. 2.1.14 GPB6 PIN This pin and associated functions is only available on the MCP19111 device. GPB6 is a general purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPB. An internal weak pull-up and interrupt-on-change are also available. 2.1.15 GPB7 PIN This pin and associated functions is only available on the MCP19111 device. GPB7 is a general purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPB. An internal weak pull-up and interrupt-on-change are also available. 2.1.16 VIN PIN Device input power connection pin. It is recommended that capacitance be placed between this pin and the GND pin of the device. 2.1.17 VDD PIN The output of the internal +5.0V regulator is connected to this pin. It is recommended that a 1.0 µF bypass capacitor be connected between this pin and the GND pin of the device. The bypass capacitor should be placed physically close to the device. 2.1.18 VDR PIN On the MCP19111, the ISCPDAT is the serial programming data input function. This is used in conjunction with ICSPCLK to serial program the device. This pin function is only implemented on the MCP19111. The 5V supply for the low-side driver is connected to this pin. The pin can be connected by an RC filter to the VDD pin. 2.1.13 GND is the small signal ground connection pin. This pin should be connected to the exposed pad, on the bottom of the package. GBP5 PIN This pin and its associated functions are only available on the MCP19111 device. GPB5 is a general purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPB. An internal weak pull-up and interrupt-on-change are also available. AN7 is an input to the A/D. To configure this pin to be read by the A/D on channel 7, bits TRISB5 and ANSB5 must be set. On the MCP19111, the ISCPCLK is the serial programming clock function. This is used in conjunction with ICSPDAT to serial program the device. This pin function is only implemented on the MCP19111. 2013 Microchip Technology Inc. 2.1.19 2.1.20 GND PIN PGND PIN Connect all large signal level ground returns to PGND. These large-signal level ground traces should have a small loop area and minimal length to prevent coupling of switching noise to sensitive traces. 2.1.21 LDRV PIN The gate of the low-side or rectifying MOSFET is connected to LDRV. The PCB tracing connecting LDRV to the gate must be of minimal length and appropriate width to handle the high peak drive currents and fast voltage transitions. DS20002331B-page 15 MCP19110/11 2.1.22 HDRV PIN The gate of the high-side MOSFET is connected to HDRV. This is a floating driver referenced to PHASE. The PCB trace connecting HDRV to the gate must be of minimal length and appropriate width to handle the high-peak drive current and fast voltage transitions. 2.1.23 PHASE PIN The PHASE pin provides the return path for the highside gate driver. The source of the high-side MOSFET, drain of the low-side MOSFET and the inductor are connected to this pin. 2.1.24 BOOT PIN The BOOT pin is the floating bootstrap supply pin for the high-side gate driver. A capacitor is connected between this pin and the PHASE pin to provide the necessary charge to turn on the high-side MOSFET. 2.1.25 +VSEN PIN The non-inverting input of the unity gain amplifier used for output voltage remote sensing is connected to the +VSEN pin. This pin can be internally pulled-up to VDD by setting PE1<PUEN> bit. 2.1.26 -VSEN PIN The inverting input of the unity gain amplifier used for output voltage remote sensing is connected to the -VSEN pin. This pin can be internally pull-down to GND by setting PE1<PDEN> bit. 2.1.27 +ISEN PIN The non-inverting input of the current sense amplifier is connected to the +ISEN pin. 2.1.28 -ISEN PIN The inverting input of the current sense amplifier is connected to the -ISEN pin. 2.1.29 EXPOSED PAD (EP) There is no internal connection to the Exposed Thermal Pad. The EP should be connected to the GND pin and to the GND PCB plane to aid in the removal of the heat. DS20002331B-page 16 2013 Microchip Technology Inc. MCP19110/11 3.0 FUNCTIONAL DESCRIPTION 3.1 Linear Regulators Two internal linear regulators generate two 5V rails. One 5V rail is used to provide power for the internal analog circuitry and is contained on-chip. The second 5V rail provides power to the internal PIC core and it is present on the VDD pin. It is recommended that a 1 µF capacitor be placed between VDD and PGND. The VDR pin provides power to the internal synchronous MOSFET driver. VDD can be directly connected to VDR or connected through a low-pass RC filter to provide noise filtering. A 1 µF ceramic bypass capacitor should be placed between VDR and PGND. When connecting VDD to VDR, the gate drive current required to drive the external MOSFETs must be added to the MCP19110/11 quiescent current, IQ(max). This total current must be less than the maximum current, IDD-OUT, available from VDD that is specified in Section 4.2 “Electrical Characteristics”. EQUATION 3-1: TOTAL REGULATOR CURRENT I DD – OUT > I Q + I DRIVE + I EXT Where: - IDD-OUT is the total current available from VDD - IQ is the device quiescent current - IDRIVE is the current required to drive the external MOSFETs - IEXT is the amount of current used to power additional external circuitry. EQUATION 3-2: GATE DRIVE CURRENT I DRIVE = Q gHIGH + Q gLOW FSW Where: - IDRIVE is the current required to drive the external MOSFETs - QgHIGH is the total gate charge of the high-side MOSFET - QgLOW is the total gate charge of the low-side MOSFET - FSW is the switching frequency Alternatively, an external regulator can be used to power the synchronous driver. An external 5V source can be connected to VDR. The amount of current required from this external source can be found in Equation 3-2. Care must be taken that the voltage applied to VDR does not exceed the maximum ratings found in Section 4.1 “Absolute Maximum Ratings (†)”. 2013 Microchip Technology Inc. 3.2 Internal Synchronous Driver The internal synchronous driver is capable of driving two N-Channel MOSFETs in a synchronous rectified buck converter topology. The gate of the floating MOSFET is connected to the HDRV pin. The source of this MOSFET is connected to the PHASE pin. The HDRV pin source and sink current is configurable. By setting the DRVSTR bit in the PE1 register, the highside is capable of sourcing and sinking a peak current of 1A. By clearing this bit, the source and sink peak current is 2A. Note 1: The PE1<DRVSTR> bit configures the peak source/sink current of the HDRV pin. The MOSFET connected to the LDRV pin is not floating. The low-side MOSFET gate is connected to the LDRV pin and the source of this MOSFET is connected to PGND. The drive strength of the LDRV pin is not configurable. This pin is capable of sourcing a peak current of 2A. The peak sink current is 4A. This helps keep the low-side MOSFET off when the high-side MOSFET is turning on. Note 1: Refer to Figure 1-1 for a graphical representation of the MOSFET connections. 3.2.1 MOSFET DRIVER DEAD TIME The MOSFET driver dead time is defined as the time between one drive signal going low and the complimentary drive signal going high. Refer to Figure 6-2. The MCP19110/11 has the capability to adjust both the high-side and low-side driver dead time independently. The adjustment of the driver dead time is controlled by the DEADCON register and is adjustable in 4 ns increments. Note 1: The DEADCON register controls the amount of dead time added to the HDRV or LDRV signal. The dead time circuitry is enabled by the LDLYBY and HDLYBY bits in the PE1 register. 3.2.2 MOSFET DRIVER CONTROL The MCP19110/11 has the ability to disable the entire synchronous driver or just one side of the synchronous drive signal. The bits that control the MOSFET driver can be found in the Register 8-1. By setting ATSTCON<DRVDIS>, the entire synchronous driver is disabled. The HDRV and LDRV signals are set low and the PHASE pin is floating. Clearing this bit allows normal operation. Individual control of the HDRV or LDRV signal is accomplished by setting or clearing the HIDIS or LODIS bits in the ATSTCON register. When either driver is disabled, the output signal is set low. DS20002331B-page 17 MCP19110/11 3.3 Output Voltage 3.6 The output voltage is configured by the settings contained in the OVCCON and OVFCON registers. No external resistor divider is needed to set the output voltage. Refer to Section 6.10 “Output Voltage Configuration”. The MCP19110/11 contains a unity gain differential amplifier used for remote sensing of the output voltage. Connect the +VSEN and -VSEN pins directly at the load for better load regulation. The +VSEN and -VSEN are the positive and negative inputs, respectively, of the differential amplifier. 3.4 Switching Frequency The switching frequency is configurable over the range of 100 kHz to 1.6 MHz. The Timer2 module is used to generate the HDRV/LDRV switching frequency. Refer to Section 26.0 “PWM Module” for more information. Example 3-1 shows how to configure the MCP19110/11 for a switching frequency of 300 kHz. EXAMPLE 3-1: BANKSEL CLRF CLRF MOVLW MOVWF MOVLW MOVWF MOVLW MOVWF MOVLW MOVWF 3.5 CONFIGURING FSW T2CON T2CON TMR2 0x19 PR2 0x0A PWMRL 0x00 PWMPHL 0x04 T2CON ;Turn off Timer2 ;Initialize module ;Fsw=300 kHz ;Max duty cycle=40% ;No phase shift In current mode control systems, slope compensation needs to be added to the control path to help prevent subharmonic oscillation when operating with greater than 50% duty cycle. In the MCP19110/11, a negative slope is added to the error amplifier output signal before it is compared to the current sense signal. The amount of slope added is controlled by the SLPCRCON register, Register 6-7. Note 1: To enable the slope compensation circuitry, the ABECON<SLCPBY> bit must be cleared. The amount of slope compensation added should be equal to the inductor current down slope during the high-side off time. 3.7 Current Sense The output current is differentially sensed by the MCP19110/11. The sense element can be either a resistor placed in series with the output, or the series resistance of the inductor. If the inductor series resistance is used, a filter is needed to remove the large AC component of the voltage that appears across the inductor and leave only the small AC voltage that appears across the inductor resistance, as shown in Figure 3-2. This small AC voltage is representative of the output current. FIGURE 3-2: INDUCTOR CURRENT SENSE FILTER ;Turn on Timer2 VIN Compensation -ISEN The MCP19110/11 is an analog peak current mode controller with integrated adjustable compensation. The CMPZCON register is used to adjust the compensation zero frequency and gain. Figure 3-1 shows the internal compensation network with the output differential amplifier. FIGURE 3-1: Slope Compensation +ISEN RS CS L RL HDRV To Load PHASE LDRV SIMPLIFIED INTERNAL COMPENSATION The value of RS and CS can be found by using Equation 3-3. When the current sense filter time constant is set equal to the inductor time constant, the voltage appearing across CS approximates the current flowing in the inductor, multiplied by the inductor resistance. +VSEN -VSEN VREF DS20002331B-page 18 2013 Microchip Technology Inc. MCP19110/11 EQUATION 3-3: CALCULATING FILTER VALUES L ------ = R S C S RL Where: - L is the inductance value of the output inductor - RL is the series resistance of the output inductor - RS is the current sense filter resistor - CS is the current sense filter capacitor Both AC gain and DC gain can be added to the current sense signal. Refer to Section 6.3 “Current Sense AC Gain” and Section 6.4 “Current Sense DC Gain” for more information. FIGURE 3-3: 3.7.1 PLACEMENT OF THE CURRENT SENSE FILTER COMPONENTS The amplitude of the current sense signal is typically less than 100 mV peak-to-peak. Therefore, the small signal current sense traces are very susceptible to circuit noise. When designing the printed circuit board, placement of RS and CS is very important. The +ISEN and -ISEN traces should be routed parallel to each other with minimum spacing. This Kelvin sense routing technique helps minimize noise sensitivity. The filter capacitor (CS), should be placed as close to the MCP19110/11 as possible. This will help filter any noise that is injected onto the current sense lines. The trace connecting CS to the inductor should occur directly at the inductor and not at any other +VSEN trace. The filter resistor (RS), should be placed close to the inductor. See Figure 3-3 for component placement. Care should also be taken to avoid routing the +ISEN and -ISEN traces near the high current switching nodes of the HDRV, LDRV, PHASE, or BOOST traces. It is recommended that a ground layer be placed between these high current traces and the small signal current sense traces. CURRENT SENSE FILTER COMPONENT PLACEMENT -ISEN +ISEN CS RS To PHASE 2013 Microchip Technology Inc. INDUCTOR To Load DS20002331B-page 19 MCP19110/11 3.8 3.8.1 Protection Features INPUT UNDERVOLTAGE LOCKOUT The input Undervoltage Lockout (UVLO) threshold is configurable by the VINLVL register, Register 6-1. When the voltage at the VIN pin of the MCP19110/11 is below the configurable threshold, the PIR2<VINIF> flag will be set. This flag is cleared by hardware once the VIN voltage is greater than the configurable threshold. By enabling the global interrupts or polling the VINIF bit, the MCP19110/11 can be disabled when the VIN voltage is below the threshold. Note 1: The UVLO DAC must be enabled by setting the VINLVL<UVLOEN> bit. 2: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit (GIE) of the INTCON register. 3.8.3 When the output undervoltage DAC is enabled by setting the ABECON<UVDCEN> bit, the voltage measured between the +VSEN and -VSEN pins is monitored and compared to the UV threshold controlled by the OUVCON register (Register 6-12). When the output voltage is below the threshold, the PIR2<UVIF> flag will be set. Once set, firmware can determine how the MCP19110/11 responds to the fault condition and it must clear the UVIF flag. By setting the PE1<UVTEE> bit, the HDRV and LDRV signals will be asserted low when the UVIF flag is set. The signals will remain low until the flag is cleared. Note 1: The UV DAC must be enabled by setting the ABECON<UVDCEN> bit. 2: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit (GIE) of the INTCON register. Some techniques that can be used to disable the switching of the MCP19110/11 while the VINIF flag is set include setting the ATSTCON<DVRDIS> bit, setting the reference voltage to 0V, setting the PE1<PUEN> bit, or setting the ATSTCON<HIDIS> and ATSTCON<LODIS> bits. 3.8.2 OUTPUT OVERCURRENT The MCP19110/11 senses the voltage drop across the high-side MOSFET to determine when an output overcurrent (OC) exists. This voltage drop is configurable by the OCCON register (Register 6-2), and is measured when the high-side MOSFET is conducting. To avoid false OC events, leading edge blanking is applied to the measurements. The amount of blanking is controlled by the OCLEB<1:0> bits in the OCCON register. See Section 6.2 “Output Overcurrent” for more information. When the input voltage is greater than 20V, or if the RDSON of the high-side MOSFET is such that the programmed overcurrent threshold does not produce acceptable peak overcurrent protection, an alternative method must be used to determine an overcurrent situation. An alternative technique can use the configurable output undervoltage protection, and the PE1<UVTEE> bit, to quickly terminate switching when the output voltage drops because of an overcurrent event. Note 1: The OC DAC must be enabled by setting the OCCON<OCEN> bit. DS20002331B-page 20 OUTPUT UNDERVOLTAGE 3: The output of the remote sense comparator is compared to the UV threshold. Therefore, the offset in this comparator should be considered when calculating the UV threshold. 3.8.4 OUTPUT OVERVOLTAGE When the output overvoltage DAC is enabled by setting the ABECON<OVDCEN> bit, the voltage measured between the +VSEN and -VSEN pins is monitored and compared to the OV threshold controlled by the OOVCON register (Register 6-13). When the output voltage is above the threshold, the PIR2<OVIF> flag will be set. Once set, firmware can determine how the MCP19110/11 responds to the fault condition and it must clear the OVIF flag. By setting the PE1<OVTEE> bit, the HDRV and LDRV signals will be asserted low when the OVIF flag is set. The signals will remain low until the flag is cleared. Note 1: The OV DAC must be enabled by setting the ABECON<UVDCEN> bit. 2: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit (GIE) of the INTCON register. 3: The output of the remote sense comparator is compared to the OV threshold. Therefore, the offset in this comparator should be considered when calculating the OV threshold. 2013 Microchip Technology Inc. MCP19110/11 3.8.5 OVERTEMPERATURE The MCP19110/11 features a hardware overtemperature shutdown protection typically set at +160°C. No firmware fault-handling procedure is required to shutdown the MCP19110/11 for an overtemperature condition. 3.9 PIC Microcontroller Core Integrated into the MCP19110/11 is the PIC microcontroller mid-range core. This is a fully functional microcontroller, allowing proprietary features to be implemented. Setting the CONFIG<CP> bit enables the code protection. The firmware is then protected from external reads or writes. Various status and fault bits are available to customize the fault handling response. A minimal amount of firmware is required to properly configure the MCP19110/11. Section 6.0 “Configuring the MCP19110/11” contains detailed information about each register that needs to be set for the MCP19110/11 device to operate. To aid in the development of the required firmware, a Graphical User Interface (GUI) has been developed. This GUI can be used to quickly configure the MCP19110/11 for basic operation. Customized or proprietary features can then be added to the GUI generated firmware. Note 1: The GUI can be found on MCP19110/11 product page www.microchip.com. the on 2: Microchip's MPLAB X Integrated Development Environment Software is required to use the GUI. The MCP19110/11 device features firmware debug support. See Section 30.0 “Development Support” for more information. 3.10 Miscellaneous Features 3.10.1 DEVICE ADDRESSING The communication address of the MCP19110/11 is stored in the SSPADD register. This value can be loaded when the device firmware is programmed or configured by external components. By reading a voltage on a GPIO with the ADC, a device specific address can be stored into the SSPADD register. The MCP19110/11 contains a second address register, SSPADD2. This is a 7-bit address that can be used as the SMBus alert address when PMBus communication is used. See Section 27.0 “Master Synchronous Serial Port (MSSP) Module” for more information. 3.10.2 DEVICE ENABLE A GPIO pin can be configured to be a device enable pin. By configuring the pin as an input, the PORT register or the interrupt on change (IOC) can be used to enable the device. Example 3-2 shows how to configure a GPIO as an enable pin by testing the PORT register. EXAMPLE 3-2: BANKSEL BSF BANKSEL BCF : : : WAIT_ENABLE: BANKSEL BTFSS GOTO BANKSEL BSF : : : CONFIGURING GPA3 AS DEVICE ENABLE TRISGPA TRISGPA, 3 ANSELA ANSELA, 3 ;Set GPA3 as input ;Set GPA3 as digital input ;Insert additional user code here PORTGPA PORTGPA, 3 WAIT_ENABLE ATSTCON ATSTCON, 0 2013 Microchip Technology Inc. ;Test GPA3 to see if pulled high ;A high on GPA3 indicated device to be enabled ;Stay in loop waiting for device enable ;Enable the device by enabling drivers ;Insert additional code here DS20002331B-page 21 MCP19110/11 3.10.3 OUTPUT POWER GOOD The output voltage measured between the +VSEN and -VSEN pins can be monitored by the internal ADC. In firmware, when this ADC reading matches a userdefined power good value, a GPIO can be toggled to indicate the system output voltage is within a specified range. Delays, hysteresis and time-out values can all be configured in firmware. 3.10.4 OUTPUT VOLTAGE SOFT-START During start-up, soft start of the output voltage is accomplished in firmware. By using one of the internal timers and incrementing the OVCCON or OVFCON register on a timer overflow, very long soft start times can be achieved. 3.10.5 OUTPUT VOLTAGE TRACKING The MCP19110/11 can be configured to track another voltage signal at start-up or shutdown. The ADC is configured to read a GPIO that has the desired tracking voltage applied to it. The firmware then handles the tracking of the internal output voltage reference to this ADC reading. 3.10.6 MULTI-PHASE SYSTEM In a multi-phase system, the output of each converter is connected together. There is one master device that sets the system switching frequency and provides each slave device with an error signal, in order to regulate the output to the same value. The MCP19110/11 can be configured as a multi-phase master or slave by the setting of the MLTPH<2:0> bits in the BUFFCON register (Register 8-2). When set as a multi-phase master device, the internal switching frequency clock is connected to GPA1 and the output of the error amplifier is connected to GPB1. The GPIOs need to be configured as outputs. When set as a multi-phase slave device, the GPA1 pin is configured as the CLKPIN function. The switching frequency clock from the master device must be connected to GPA1. The slave device will synchronize its internal switching frequency clock to the master clock. Phase shift can be applied by setting the PWMPHL register of the slave device. The slave GPB1 pin is configured as the error signal input pin (EAPIN). The master error amplifier output must be connected to GPB1. Gain can be added to the master error amplifier output signal by the SLVGNCON register setting (Register 6-8). The slave device will use this master error signal to regulate the output voltage. When set as a slave device, GPA1 and GPB1 need to be configured as inputs. Refer to Section 26.1 “Standard PulseWidth Modulation (PWM) Mode” for additional information. DS20002331B-page 22 Note 1: The ALT_CLKPIN can also be used by setting the APFCON<CLKSEL> bit. This function is only available in the MCP19111. 3.10.7 MULTIPLE OUTPUT SYSTEM In a multiple output system, the switching frequency of each converter should be synchronized to a master clock to prevent beat frequencies from developing. Phase shift is often added to the master clock to help smooth the system input current. The MCP19110/11 has the ability to function as a multiple output master or slave by setting the appropriate MLTPH<2:0> bits in the BUFFCON register (Register 8-2). When configured as a multiple output master, the GPA1 pin is set as the CLKPIN output function. The internal switching frequency clock is applied to this pin and is to be connected to the GPA1 pin of the slave units. When configured as a multiple output slave, the GPA1 pin is set as the CLKPIN input function. The switching frequency clock of the master device is connected to this pin. Phase shift can be applied by appropriately setting the PWMPHL register of the slave device. Refer to Section 26.1 “Standard Pulse-Width Modulation (PWM) Mode”. Note 1: The ALT_CLKPIN can also be used by setting the APFCON<CLKSEL> bit. This function is only available in the MCP19111. 3.10.8 SYSTEM BENCH TESTING The MCP19110/11 is a highly integrated controller. To facilitate system prototyping, various internal signals can be measured by configuring the MCP19110/11 in bench test mode. To accomplish this, the ATSTCON<BNCHEN> bit is set. This configures GPA0 as the ANALOG_TEST feature. The signals measured on GPA0 are controlled by the ASEL<4:0> bits of the BUFFCON register. See Section 8.0 “System Bench Testing” for more information. Note 1: The factory-set calibration words are write-protected even when the MCP19110/11 is placed in a Bench Test mode. 2013 Microchip Technology Inc. MCP19110/11 4.0 ELECTRICAL CHARACTERISTICS 4.1 ABSOLUTE MAXIMUM RATINGS (†) VIN – VGND .................................................................................................................................................. -0.3V to +32V VBOOT - VPHASE .......................................................................................................................................... -0.3V to +6.5V VPHASE (continuous) ........................................................................................................................ GND – 0.3V to +38V VPHASE (transient < 100 ns)............................................................................................................. GND – 5.0V to +38V VDD internally generated ...................................................................................................................................+5V ±20% VHDRV, HDRV Pin..........................................................................................................+VPHASE – 0.3V to VBOOT + 0.3V VLDRV, LDRV Pin............................................................................................................. +(VGND – 0.3V) to (VDD + 0.3V) Voltage on MCLR with respect to GND.................................................................................................... -0.3V to +13.5V Maximum Voltage: any other pin..................................................................................... +(VGND – 0.3V) to (VDD + 0.3V) Maximum output current sunk by any single I/O pin ...............................................................................................25 mA Maximum output current sourced by any single I/O pin ..........................................................................................25 mA Maximum current sunk by all GPIO ........................................................................................................................65 mA Maximum current sourced by all GPIO ...................................................................................................................65 mA ESD protection on all pins (HBM) ........................................................................................................................... 1.0 kV ESD protection on all pins (MM) 100V † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 2013 Microchip Technology Inc. DS20002331B-page 23 MCP19110/11 4.2 Electrical Characteristics Electrical Specifications: Unless otherwise noted, VIN = 12V, VREF = 1.2V, FSW = 300 kHz, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +125°C. Parameter Symbol Min Typ Max Units VIN 4.5 — 32 V Conditions Input Input Voltage IQ — 5 10 mA Not switching Shutdown Current ISHDN — 1.8 2.2 mA Note 4 Adjustable Input Undervoltage Lockout Range UVLO 3 — 32 V VINLVL is a LOG DAC UVLOHYS — 13 — % Hysteresis applied to adjustable UVLO setpoint Overcurrent Minimum Threshold OCMIN — 160 — mV Overcurrent Maximum Threshold OCMAX — 620 — mV Overcurrent Mid-Scale Threshold OCMID 240 400 550 mV Overcurrent Step Size Input Quiescent Current Input Undervoltage Lockout Hysteresis Overcurrent OCSTEP_SIZE 10 15 20 mV Adjustable OC Leading Edge Blanking Minimum Set Point LEBmin — 114 — ns Adjustable OC Leading Edge Blanking Maximum Set Point LEBmax — 780 — ns Current Sense Minimum AC Gain IAC_GAIN — 0 — dB Current Sense Maximum AC Gain IAC_GAIN — 22.8 — dB Current Sense AC Gain Mid-Set Point IAC_GAIN 8.5 11.5 14 dB Current Sense AC Gain Step Size IAC_GAIN_STEP — 1.5 — dB Current Sense AC Gain Offset Voltage IAC_OFFSET -175 9 135 mV Current Sense Minimum DC Gain IDC_GAIN — 19.5 — dB Current Sense Maximum DC Gain IDC_GAIN — 35.7 — dB Current Sense DC Gain Mid-Set Point IDC_GAIN 27 28.6 30.3 dB Current Sense DC Gain Step Size IDC_GAIN_STEP — 2.3 — dB Current Sense Note 1: 2: 3: 4: Ensured by design. Not production tested. VDD-OUT is the voltage present at the VDD pin. VDD is the internally generated bias voltage. This is the total source current for all GPIO pins combined. Individually, each pin can source a maximum of 25 mA. PE1 = 0x00h, ABECON = 0x00h, ATSTCON = 0x80h, WPUGPA = 0x00h, WPUGPB = 0x00h, and SLEEP command issued to PIC core, see SECTION 16.0. DS20002331B-page 24 2013 Microchip Technology Inc. MCP19110/11 4.2 Electrical Characteristics (Continued) Electrical Specifications: Unless otherwise noted, VIN = 12V, VREF = 1.2V, FSW = 300 kHz, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +125°C. Parameter Symbol Min Typ Max Units Conditions Current Sense DC Gain Offset Voltage IDC_OFFSET 1.4 1.56 1.7 V Voltage for Zero Current VZC — 1.45 — V VZCCON = 0x80h Adjustable VOUT Range VOUT_RANGE 0.5 — 3.6 V VOUT range with no external voltage divider VOUT Coarse Resolution VOUT_COARSE 10.8 15.8 25.8 mV VOUT_COARSE_MID 1.85 2.04 2.25 V VOUT_FINE — 0.8 1 mV Adjustable Overvoltage Range OVRANGE 0 — 4.5 V Adjustable Overvoltage Mid-Set Point OVMID 1.8 2 2.3 V Adjustable Overvoltage Resolution OVR — 15 — mV UVRANGE 0 — 4.5 Adjustable Undervoltage Mid-Set Point UVMID 1.8 2 2.3 V Adjustable Undervoltage Resolution UVR — 15 — mV AVOL 0.95 1 1.05 V/V Common Mode Range VCMR GND – 0.3 — VDD + 1.0 V Common Mode Reject Ratio CMRR — 57 — dB VOS — 40 — mV Minimum Zero Frequency FZERO_MIN — 350 — Hz Maximum Zero Frequency Voltage Reference VOUT Coarse Mid Set Point VOUT Fine Resolution Output Overvoltage Output Undervoltage Adjustable Undervoltage Range Remote Sense Differential Amplifier Closed Loop Voltage Gain Differential Amplifier Offset Note 1 See Section 9.5 “Calibration Word 5” and Section 9.6 “Calibration Word 6” Compensation FZERO_MAX — 35000 — Hz Minimum Error Amplifier Gain GEA_MIN — 0 — dB Maximum Error Amplifier Gain GEA_MAX — 36.15 — dB Note 1: 2: 3: 4: Ensured by design. Not production tested. VDD-OUT is the voltage present at the VDD pin. VDD is the internally generated bias voltage. This is the total source current for all GPIO pins combined. Individually, each pin can source a maximum of 25 mA. PE1 = 0x00h, ABECON = 0x00h, ATSTCON = 0x80h, WPUGPA = 0x00h, WPUGPB = 0x00h, and SLEEP command issued to PIC core, see SECTION 16.0. 2013 Microchip Technology Inc. DS20002331B-page 25 MCP19110/11 4.2 Electrical Characteristics (Continued) Electrical Specifications: Unless otherwise noted, VIN = 12V, VREF = 1.2V, FSW = 300 kHz, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +125°C. Parameter Symbol Min Typ Max Units Conditions Internal Oscillator Frequency FOSC 7.60 8.00 8.40 MHz Switching Frequency FSW — FOSC/N — kHz Switching Frequency Range Select N 5 — 80 — (N–1)/N — %/ 100 DTSTEP — 4 — ns RHDRV-SCR — 1 2.6 Measured at 500 mA Note 1, High Range — 2 3.5 Measured at 500 mA Note 1, Low Range — 1 2.6 Measured at 500 mA Note 1, High Range — 2 3.5 Measured at 500 mA Note 1, Low Range — 2 — A Note 1, High Range — 1 — A Note 1, Low Range — 2 — A Note 1, High Range Oscillator Maximum Duty Cycle Dead Time Adjustment Dead Time Step Size HDRV Output Driver HDRV Source Resistance HDRV Sink Resistance RHDRV-SINK HDRV Source Current IHDRV-SCR HDRV Sink Current IHDRV-SINK HDRV Rise Time HDRV Fall Time tRH tFH — 1 — A Note 1, Low Range — 15 30 ns Note 1, CLOAD = 3.3 nF, High Range — 15 30 ns Note 1, CLOAD = 3.3 nF, High Range LDRV Output Driver LDRV Source Resistance RLDRV-SCR — 1 2.5 Measured at 500 mA Note 1 LDRV Sink Resistance RLDRV-SINK — 0.5 1.0 Measured at 500 mA Note 1 LDRV Source Current ILDRV-SCR — 2 — A Note 1 LDRV Sink Current ILDRV-SINK — 4 — A Note 1 LDRV Rise Time tRL — 15 30 ns Note 1, CLOAD = 3.3 nF LDRV Fall Time tFL — 7 15 ns Note 1, CLOAD = 3.3 nF Note 1: 2: 3: 4: Ensured by design. Not production tested. VDD-OUT is the voltage present at the VDD pin. VDD is the internally generated bias voltage. This is the total source current for all GPIO pins combined. Individually, each pin can source a maximum of 25 mA. PE1 = 0x00h, ABECON = 0x00h, ATSTCON = 0x80h, WPUGPA = 0x00h, WPUGPB = 0x00h, and SLEEP command issued to PIC core, see SECTION 16.0. DS20002331B-page 26 2013 Microchip Technology Inc. MCP19110/11 4.2 Electrical Characteristics (Continued) Electrical Specifications: Unless otherwise noted, VIN = 12V, VREF = 1.2V, FSW = 300 kHz, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +125°C. Parameter Symbol Min Typ Max Units Conditions VDD 4.6 5.0 5.4 V VIN = 6.0V to 32V, Note 2 AVDD — 5.0 — V VIN = 6.0V to 32V, Note 2 IDD 30 — — mA Line Regulation VDD/ (VDD x VIN) — 0.05 0.1 %/V (VDD+1.0V) VIN 20V Note 2 Load Regulation VDD/VDD -1.75 -0.8 +0.5 % IDD_SC — 65 — mA Dropout Voltage VIN – VDD — 0.5 1 V IDD = 30 mA, VIN = VDD + 1.0V Note 2 Power Supply Rejection Ratio PSRRLDO — 60 — dB f 1000 Hz, IDD = 25 mA, CIN = 0 µF, CDD = 1 µF BG -2.5% 1.23 +2.5% V Maximum GPIO Sink Current ISINK_GPIO — — 90 mA Note 3, Note 1 Maximum GPIO Source Current ISOURCE_GPIO — — 90 mA Note 3, Note 1 GPIO Weak Pull-up Current IPULL-UP_GPIO 50 250 400 µA VDD = 5V GPIO Output Low Voltage VOL — — 0.6 V IOL = 7 mA, VDD= 5V, TA = +90°C GPIO Output High Voltage VOH VDD – 0.7 — — V IOH = -2.5 mA, VDD = 5V, TA = +90°C GPIO_IIL — ±0.1 ±1 µA Negative current is defined as current sourced by the pin, TA = +90°C VIL GND — 0.8 V I/O Port with TTL buffer VDD = 5V, TA = +90°C GND 0.2VDD V I/O Port with Schmitt Trigger buffer, VDD = 5V, TA = +90°C GND 0.2VDD V MCLR, TA = +90°C Linear Regulator Bias Voltage, LDO Output Internal Circuitry Bias Voltage Maximum VDD Output Current Output Short Circuit Current Band Gap Voltage VIN = 6.0V to 20V, VDD = 5.0V, Note 2 IDD = 1 mA to 30 mA Note 2 VIN = (VDD + 1.0V) Note 2 GPIO Pins GPIO Input Leakage Current GPIO Input Low Voltage Note 1: 2: 3: 4: Ensured by design. Not production tested. VDD-OUT is the voltage present at the VDD pin. VDD is the internally generated bias voltage. This is the total source current for all GPIO pins combined. Individually, each pin can source a maximum of 25 mA. PE1 = 0x00h, ABECON = 0x00h, ATSTCON = 0x80h, WPUGPA = 0x00h, WPUGPB = 0x00h, and SLEEP command issued to PIC core, see SECTION 16.0. 2013 Microchip Technology Inc. DS20002331B-page 27 MCP19110/11 4.2 Electrical Characteristics (Continued) Electrical Specifications: Unless otherwise noted, VIN = 12V, VREF = 1.2V, FSW = 300 kHz, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +125°C. Parameter Symbol Min Typ Max Units Conditions GPIO Input High Voltage VIH 2.0 — VDD V I/O Port with TTL buffer, VDD = 5V, TA = +90°C 0.8VDD — VDD V I/O Port with Schmitt Trigger buffer, VDD = 5V, TA = +90°C 0.8VDD — VDD V MCLR, TA = +90°C Thermal Shutdown Thermal Shutdown TSHD — 160 — °C Thermal Shutdown Hysteresis TSHD_HYS — 20 — °C Note 1: 2: 3: 4: 4.3 Ensured by design. Not production tested. VDD-OUT is the voltage present at the VDD pin. VDD is the internally generated bias voltage. This is the total source current for all GPIO pins combined. Individually, each pin can source a maximum of 25 mA. PE1 = 0x00h, ABECON = 0x00h, ATSTCON = 0x80h, WPUGPA = 0x00h, WPUGPB = 0x00h, and SLEEP command issued to PIC core, see SECTION 16.0. Thermal Specifications Parameter Symbol Min Typ Max Units Specified Temperature Range TA -40 — +125 C Operating Temperature Range TA -40 — +125 C Test Conditions Temperature Ranges Maximum Junction Temperature TJ — — +150 C Storage Temperature Range TA -65 — +150 C Thermal Resistance, 24L-QFN 4x4 JA — 42 — C/W Thermal Resistance, 28L-QFN 5x5 JA — 35.3 — C/W Thermal Package Resistances DS20002331B-page 28 2013 Microchip Technology Inc. MCP19110/11 5.0 DIGITAL ELECTRICAL CHARACTERISTICS 5.1 Timing Parameter Symbology The timing parameter symbols have been created with one of the following formats: 1. TppS2ppS 2. TppS T F Frequency Lowercase letters (pp) and their meanings: pp cc CCP1 ck CLKOUT cs CS di SDI do SDO dt Data in io I/O port mc MCLR Uppercase letters and their meanings: S F Fall H High I Invalid (high-impedance) L Low I2C only AA Output access BUF Bus free TCC:ST (I2C specifications only) CC HD Hold ST DAT DATA input hold STA START condition FIGURE 5-1: (I2C specifications only) (I2C specifications only) 3. TCC:ST 4. Ts TTime osc rd rw sc ss t0 t1 wr OSC1 RD RD or WR SCK SS T0CKI T1CKI WR P R V Z Period Rise Valid High-impedance High Low High Low SU Setup STO STOP condition LOAD CONDITIONS Load Condition 1 Load Condition 2 VDD/2 RL CL Pin VSS CL Pin VSS RL = 464 CL = 50 pF for all GPIO pins 2013 Microchip Technology Inc. DS20002331B-page 29 MCP19110/11 5.2 AC Characteristics: MCP19110/11 (Industrial, Extended) FIGURE 5-2: EXTERNAL CLOCK TIMING Q4 Q1 Q2 Q3 Q4 Q1 OSC 1 2 TABLE 5-1: Param No. EXTERNAL CLOCK TIMING REQUIREMENTS Sym Characteristic Min Typ† Max Units FOSC Oscillator Frequency(1) — 8 — MHz 1 TOSC 2 TCY Oscillator Period(1) Instruction Cycle Time(1) — 250 — ns — 1000 — ns Conditions * † These parameters are characterized but not tested. Data in “Typ” column is at VIN = 12V (VDD = 5V), +25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. FIGURE 5-3: CLKOUT AND I/O TIMING Q1 Q4 Q2 Q3 OSC 22 23 19 18 I/O Pin (input) 15 17 I/O Pin (output) new value old value 20, 21 DS20002331B-page 30 2013 Microchip Technology Inc. MCP19110/11 TABLE 5-2: Param No. CLKOUT AND I/O TIMING REQUIREMENTS Sym Characteristic 17 TosH2ioV OSC1 (Q1 cycle) to 18 TosH2ioI 19 TioV2osH Port input valid to OSC1 (I/O in setup time) Port out valid OSC1 (Q2 cycle) to Port input invalid (I/O in hold time) Min Typ† Max — 50 150* ns Units Conditions — — 300 ns 100 — — ns 0 — — ns 20 TioR Port output rise time — 10 40 ns 21 TioF Port output fall time — 10 40 ns 22 22A Tinp INT pin high or low time 25 40 — — — — ns ns 23 23A Trbp Trbp Port A change INT high or low time Tcy — — ns * † These parameters are characterized but not tested. Data in “Typ” column is at VIN = 12V (VDD = 5V), +25C unless otherwise stated. FIGURE 5-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING VDD MCLR 30 Internal POR 33 PWRT Time-out 32 OSC Time-out Internal Reset Watchdog Timer Reset 34 31 34 I/O Pins 2013 Microchip Technology Inc. DS20002331B-page 31 MCP19110/11 TABLE 5-3: Param No. RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, AND POWER-UP TIMER REQUIREMENTS Sym Characteristic Typ† Min Max Units Conditions 30 TMCL MCLR Pulse Width (low) 2 — — µs VDD = 5V, -40°C to +85°C 31 TWDT Watchdog Timer Time-out Period (No Prescaler) 7 18 33 ms VDD = 5V, -40°C to +85°C 32 TOST Oscillation Start-up Timer Period — 1024TOSC — — TOSC = OSC1 period 33* TPWRT Power-up Timer Period (4 x TWDT) 28 64 132 ms VDD = 5V, -40°C to +85°C 34 TIOZ I/O high-impedance from MCLR Low or Watchdog Timer Reset — — 2.0 µs * † These parameters are characterized but not tested. Data in “Typ” column is at VIN = 12V (VDD = 5V), +25°C unless otherwise stated. These parameters are for design guidance only and are not tested. FIGURE 5-5: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS T0CKI 41 40 42 TABLE 5-4: Param No. Sym 40* Tt0H 41* TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS Tt0L 42* Tt0P * † Characteristic T0CKI High Pulse Width T0CKI Low Pulse Width T0CKI Period Min Typ† Max Units No Prescaler 0.5TCY + 20 — — ns With Prescaler 10 — — ns No Prescaler 0.5TCY + 20 — — ns With Prescaler 10 — — ns Greater of: 20 or TCY + 40 N — — ns Conditions N = prescale value (2, 4, ..., 256) These parameters are characterized but not tested. Data in “Typ” column is at VIN = 12V (VDD = 5V), +25°C unless otherwise stated. These parameters are for design guidance only and are not tested. DS20002331B-page 32 2013 Microchip Technology Inc. MCP19110/11 FIGURE 5-6: PWM TIMING PWM (CLKPIN) 53 Note: TABLE 5-5: 54 Refer to Figure 5-1 for load conditions. PWM REQUIREMENTS Param No. Sym Characteristic Min 53* TccR PWM (CLKPIN) output rise time — 10 25 ns TccF PWM (CLKPIN) output fall time — 10 25 ns 54* * † Typ† Max Units Conditions These parameters are characterized but not tested. Data in “Typ” column is at VIN = 12V (VDD = 5V), +25°C unless otherwise stated. Parameters are for design guidance only and are not tested. TABLE 5-6: MCP19110/11 A/D CONVERTER (ADC) CHARACTERISTICS: Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +125°C Param No. Sym Characteristic Min Typ† Max Unit s AD01 NR Resolution — — 10 AD02 EIL Integral Error — — 1 AD03 EDL Differential Error — — 1 AD04 EOFF Offset Error — +3.0 +5.0 AD07 EGN — 2 5 AD06 AD06A VREF Reference Voltage(3) — AVDD — V AD07 VAIN Full-Scale Range GND — AVDD V AD08 ZAIN Recommended Impedance of Analog Voltage Source — — 10 k Gain Error Conditions bit LSb AVDD = 5.0V LSb No missing codes to 10 bits AVDD = 5.0V LSb AVDD = 5.0V LSb AVDD = 5.0V * These parameters are characterized but not tested. † Data in ‘Typ’ column is at VIN = 12V (VDD = 5V), +25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Total Absolute Error includes integral, differential, offset and gain errors. 2: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes. 3: When ADC is off, it will not consume any current other than leakage current. The power-down current specification includes any such leakage from the ADC module. 2013 Microchip Technology Inc. DS20002331B-page 33 MCP19110/11 TABLE 5-7: MCP19110/11 A/D CONVERSION REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +125°C Param No. Sym AD130* TAD Characteristic A/D Clock Period A/D Internal RC Oscillator Period AD131 TCNV Conversion Time (not including Acquisition Time)(1) Min Typ† 1.6 — 9.0 µs TOSC-based, VREF 3.0V 3.0 — 9.0 µs TOSC-based, VREF full range 3.0 6.0 9.0 µs ADCS<1:0> = 11 (ADRC mode) At VDD = 2.5V 1.6 4.0 6.0 µs At VDD = 5.0V — 11 — TAD Set GO/DONE bit to new data in A/D Result register AD132* TACQ Acquisition Time AD133* TAMP Amplifier Settling Time AD134 TGO Q4 to A/D Clock Start Max Units 11.5 — µs — — 5 µs — TOSC/2 — — — TOSC/ 2 + TCY — — Conditions If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. * † These parameters are characterized but not tested. Data in ‘Typ’ column is at VIN = 12V (VDD = 5V), +25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: ADRESH and ADRESL registers may be read on the following TCY cycle. FIGURE 5-7: A/D CONVERSION TIMING (NORMAL MODE) BSF ADCON0, GO 134 1/2 TCY 131 Q4 130 A/D CLK 9 A/D DATA 8 7 6 3 OLD_DATA ADRES 2 1 0 NEW_DATA ADIF GO SAMPLE DONE 132 SAMPLING STOPPED Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. DS20002331B-page 34 2013 Microchip Technology Inc. MCP19110/11 FIGURE 5-8: A/D CONVERSION TIMING (SLEEP MODE) BSF ADCON0, GO 134 131 Q4 130 A/D CLK 9 A/D DATA 8 7 6 OLD_DATA ADRES 3 2 1 0 NEW_DATA ADIF GO SAMPLE DONE 132 SAMPLING STOPPED Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. 2013 Microchip Technology Inc. DS20002331B-page 35 MCP19110/11 NOTES: DS20002331B-page 36 2013 Microchip Technology Inc. MCP19110/11 6.0 CONFIGURING THE MCP19110/11 The VINLVL<UVLOEN> bit must be set to enable the input Undervoltage Lockout circuitry. The MCP19110/11 is an analog controller with digital peripheral. This means that device configuration is handled through register settings instead of adding external components. The following sections detail how to set the analog control registers. 6.1 Note: The VINIF interrupt flag bit is set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. Input Undervoltage Lockout The VINLVL register contains the digital value that sets the input Undervoltage Lockout. When the input voltage on the VIN pin to the MCP19110/11 is below this programmed level, the INTCON<VINIF> flag will be set. This bit is automatically cleared when the MCP19110/11 VIN voltage rises above this programmed level. REGISTER 6-1: VINLVL: INPUT UNDERVOLTAGE LOCKOUT CONTROL REGISTER R/W-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x UVLOEN — UVLO5 UVLO4 UVLO3 UVLO2 UVLO1 UVLO0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 UVLOEN: Undervoltage Lockout DAC Control bit 1 = Undervoltage Lockout DAC is enabled 0 = Undervoltage Lockout DAC is disabled bit 6 Unimplemented: Read as ‘0’ bit 5-0 UVLO<5:0>: Undervoltage Lockout Configuration bits UVLO<5:0> = 26.5*ln(UVLOSET_POINT/4) 2013 Microchip Technology Inc. x = Bit is unknown DS20002331B-page 37 MCP19110/11 6.2 Output Overcurrent The MCP19110/11 features a cycle-by-cycle peak current limit. By monitoring the OCIF interrupt flag, custom overcurrent fault handling can be implemented. To detect an output overcurrent, the MCP19110/11 senses the voltage drop across the high-side MOSFET while it is conducting. Leading edge blanking is incorporated to mask the overcurrent measurement for a given amount of time. This helps prevent false overcurrent readings. When the input voltage is greater than 20V, or if the RDSON of the high-side MOSFET is such that the programmed overcurrent threshold does not produce acceptable peak overcurrent protection, an alternative method must be used to determine an output overcurrent situation. An alternative technique can use the configurable output undervoltage protection and the PE1<UVTEE> bit to quickly terminate switching when the output voltage drops because of an overcurrent event. When an output overcurrent is sensed, the OCIF flag is set and the high-side drive signal is immediately terminated. Without any custom overcurrent handling implemented, the high-side drive signal will be asserted high at the beginning of the next clock cycle. If the overcurrent condition still exists, the high-drive signal will again be terminated. The OCIF interrupt flag must be cleared in software. However, if a subsequent switching cycle without an overcurrent condition has not occurred, hardware will immediately set the OCIF interrupt flag. Register OCCON contains the bits used to configure both the output overcurrent limit and the amount of leading edge blanking (see Register 6-2). The OCCON<OCEN> bit must be set to enable the input overcurrent circuitry. Note: The OCIF interrupt flag bit is set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. DS20002331B-page 38 2013 Microchip Technology Inc. MCP19110/11 REGISTER 6-2: OCCON: OUTPUT OVERCURRENT CONTROL REGISTER R/W-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x OCEN OCLEB1 OCLEB0 OOC4 OOC3 OOC2 OOC1 OOC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 OCEN: Output Overcurrent DAC Control bit 1 = Output Overcurrent DAC is enabled 0 = Output Overcurrent DAC is disabled bit 6-5 OCLEB<1:0>: Leading Edge Blanking 00 = 114 ns blanking 01 = 213 ns blanking 10 = 400 ns blanking 11 = 780 ns blanking bit 4-0 OOC<4:0>: Output Overcurrent Configuration bits 00000 = 160 mV drop 00001 = 175 mV drop 00010 = 190 mV drop 00011 = 205 mV drop 00100 = 220 mV drop 00101 = 235 mV drop 00110 = 250 mV drop 00111 = 265 mV drop 01000 = 280 mV drop 01001 = 295 mV drop 01010 = 310 mV drop 01011 = 325 mV drop 01100 = 340 mV drop 01101 = 355 mV drop 01110 = 370 mV drop 01111 = 385 mV drop 10000 = 400 mV drop 10001 = 415 mV drop 10010 = 430 mV drop 10011 = 445 mV drop 10100 = 460 mV drop 10101 = 475 mV drop 10110 = 490 mV drop 10111 = 505 mV drop 11000 = 520 mV drop 11001 = 535 mV drop 11010 = 550 mV drop 11011 = 565 mV drop 11100 = 580 mV drop 11101 = 595 mV drop 11110 = 610 mV drop 11111 = 625 mV drop 2013 Microchip Technology Inc. x = Bit is unknown DS20002331B-page 39 MCP19110/11 6.3 Current Sense AC Gain The current measured across the inductor is a square wave that is averaged by the capacitor (CS) connected between +ISEN and -ISEN. This very small voltage plus the ripple can be amplified by the current sense AC gain circuitry. The amount of gain is controlled by the CSGSCON register. REGISTER 6-3: CSGSCON: CURRENT SENSE AC GAIN CONTROL REGISTER U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x — Reserved Reserved Reserved CSGS3 CSGS2 CSGS1 CSGS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-4 Reserved bit 3-0 CSGS<3:0>: Current Sense AC Gain Setting bits 0000 = 0 dB 0001 = 1.0 dB 0010 = 2.5 dB 0011 = 4.0 dB 0100 = 5.5 dB 0101 = 7.0 dB 0110 = 8.5 dB 0111 = 10.0 dB 1000 = 11.5 dB 1001 = 13.0 dB 1010 = 14.5 dB 1011 = 16.0 dB 1100 = 17.5 dB 1101 = 19.0 dB 1110 = 20.5 dB 1111 = 22.0 dB DS20002331B-page 40 x = Bit is unknown 2013 Microchip Technology Inc. MCP19110/11 6.4 Current Sense DC Gain DC gain can be added to the sensed inductor current to allow it to be read by the ADC. The amount of DC gain added is controlled by the CSDGCON register. Adding DC gain to the current sense signal used by the control loop may also be needed in some multi-phase systems to account for device and component differences. The CSDGEN bit determines if the gained current sense signal is added back to the AC current signal (see Register 6-4). If the CSDGEN bit is cleared, DC gain can still be added, but the gained signal is not added back to the AC current signal. REGISTER 6-4: CSDGCON: CURRENT SENSE DC GAIN CONTROL REGISTER R/W-0 U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x CSDGEN — — — Reserved CSDG2 CSDG1 CSDG0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CSDGEN: Current Sense DC Gain Enable bit 1 = DC gain current sense signal used in control loop. 0 = DC gain current sense signal only read by ADC. bit 6-4 Unimplemented: Read as ‘0’ bit 3 Reserved bit 2-0 CSDG<2:0>: Current Sense DC Gain Setting bits 000 = 19.5 dB 001 = 21.8 dB 010 = 24.1 dB 011 = 26.3 dB 100 = 28.6 dB 101 = 30.9 dB 110 = 33.2 dB 111 = 35.7 dB 2013 Microchip Technology Inc. x = Bit is unknown DS20002331B-page 41 MCP19110/11 6.5 Voltage for Zero Current In multi-phase systems it may be necessary to provide some offset to the sensed inductor current. The VZCCON register can be used to provide a positive or negative offset in the sensed current. Typically, the VZCCON will be set to 0x80h, which corresponds to the sensed inductor current centered around 1.45V. However, by adjusting the VZCCON register, this centered voltage can be shifted up or down by approximately 3.28 mV per step. REGISTER 6-5: VZCCON: VOLTAGE FOR ZERO CURRENT CONTROL REGISTER R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x VZC7 VZC6 VZC5 VZC4 VZC3 VZC2 VZC1 VZC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 x = Bit is unknown VZC<7:0>: Voltage for Zero Current Setting bits 00000000 = -420.00 mV Offset 00000001 = -416.72 mV Offset • • • 10000000 = 0 mV Offset • • • 11111110 = +413.12 mV Offset 11111111 = +416.40 mV Offset DS20002331B-page 42 2013 Microchip Technology Inc. MCP19110/11 6.6 FIGURE 6-1: Compensation Setting The MCP19110/11 uses a peak current mode control architecture. A control reference is used to regulate the peak current of the converter directly. The inner current loop essentially turns the inductor into a voltagecontrolled current source. This reduces the control-tooutput transfer function to a simple single-pole model of a current source feeding a capacitor. The desired response of the overall loop can be tuned by proper placement of the compensation zero frequency and gain. Figure 6-1 shows a simplified drawing of the internal compensation. See Register 6-6 for the adjustable zero frequency and gain settings. REGISTER 6-6: SIMPLIFIED COMPENSATION +VSEN -VSEN VREF CMPZCON: COMPENSATION SETTING CONTROL REGISTER R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x CMPZF3 CMPZF2 CMPZF1 CMPZF0 CMPZG3 CMPZG2 CMPZG1 CMPZG0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 CMPZF<3:0>: Compensation Zero Frequency Setting bits 0000 = 1500 Hz 0001 = 1850 Hz 0010 = 2300 Hz 0011 = 2840 Hz 0100 = 3460 Hz 0101 = 4300 Hz 0110 = 5300 Hz 0111 = 6630 Hz 1000 = 8380 Hz 1001 = 9950 Hz 1010 = 12200 Hz 1011 = 14400 Hz 1100 = 18700 Hz 1101 = 23000 Hz 1110 = 28400 Hz 1111 = 35300 Hz bit 3-0 CMPZG<3:0>: Compensation Gain Setting bits 0000 = 36.15 dB 0001 = 33.75 dB 0010 = 30.68 dB 0011 = 28.43 dB 0100 = 26.10 dB 0101 = 23.81 dB 0110 = 21.44 dB 0111 = 19.10 dB 1000 = 16.78 dB 1001 = 14.32 dB 1010 = 12.04 dB 1011 = 9.54 dB 1100 = 7.23 dB 1101 = 4.61 dB 1110 = 2.28 dB 1111 = 0.00 dB 2013 Microchip Technology Inc. x = Bit is unknown DS20002331B-page 43 MCP19110/11 6.7 Slope Compensation A negative voltage slope is added to the output of the error amplifier. This is done to prevent subharmonic instability when: 1. 2. The amount of negative slope added to the error amplifier output is controlled by Register 6-7. The slope compensation is enabled by setting the SLCPBY bit in the ABECON register. the operating duty cycle is greater than 50% wide changes in the duty cycle occur. REGISTER 6-7: SLPCRCON: SLOPE COMPENSATION RAMP CONTROL REGISTER R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x SLPG3 SLPG2 SLPG1 SLPG0 SLPS3 SLPS2 SLPS1 SLPS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 SLPG<3:0>: Slope Compensation Amplitude Configuration bits 0000 = 0.017 VPK-PK, measured for 50% duty cycle waveform 0001 = 0.022 VPK-PK, measured for 50% duty cycle waveform 0010 = 0.030 VPK-PK, measured for 50% duty cycle waveform 0011 = 0.040 VPK-PK, measured for 50% duty cycle waveform 0100 = 0.053 VPK-PK, measured for 50% duty cycle waveform 0101 = 0.070 VPK-PK, measured for 50% duty cycle waveform 0110 = 0.094 VPK-PK, measured for 50% duty cycle waveform 0111 = 0.125 VPK-PK, measured for 50% duty cycle waveform 1000 = 0.170 VPK-PK, measured for 50% duty cycle waveform 1001 = 0.220 VPK-PK, measured for 50% duty cycle waveform 1010 = 0.300 VPK-PK, measured for 50% duty cycle waveform 1011 = 0.400 VPK-PK, measured for 50% duty cycle waveform 1100 = 0.530 VPK-PK, measured for 50% duty cycle waveform 1101 = 0.700 VPK-PK, measured for 50% duty cycle waveform 1110 = 0.940 VPK-PK, measured for 50% duty cycle waveform 1111 = 1.250 VPK-PK, measured for 50% duty cycle waveform bit 3-0 SLPS<3:0>: Slope Compensation V/t Configuration bits 6.7.1 SLPS<3:0> CONFIGURATION The SLPS<3:0> directly controls the V/t of the added ramp. This byte should be set proportional to the switching frequency according to the following equation: EQUATION 6-1: F SW n = --------------------- – 1 100 000 6.7.2 x = Bit is unknown SLPG<3:0> CONFIGURATION The SLPG<3:0> controls the amplitude of the added ramp. The values listed above correspond to a 50% duty cycle waveform and is true only if the SLPS<3:0> bits are set according to the equation in Section 6.7.1 “SLPS<3:0> Configuration”. If less amplitude is required, the SLPS<3:0> bits can be adjusted to a lower switching frequency. Where: FSW = Device switching frequency n = Decimal equivalent of SLPS<3:0> DS20002331B-page 44 2013 Microchip Technology Inc. MCP19110/11 6.8 MASTER Error Signal Gain Note: When operating in a multi-phase system, the output of the MASTER’s error amplifier is used by all SLAVE devices as their control signal. It is important to balance the current in all phases to maintain a uniform temperature across all phases. Component tolerances make this balancing difficult. Each SLAVE device has the ability to gain or attenuate the MASTER error signal depending upon the settings of Register 6-8. REGISTER 6-8: The SLVGNCON register is configured in the multi-phase SLAVE device. SLVGNCON: MASTER ERROR SIGNAL INPUT GAIN CONTROL REGISTER U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x — — — SLVGN4 SLVGN3 SLVGN2 SLVGN1 SLVGN0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 SLVGN<4:0>: MASTER Error Signal Gain bits 00000 = -3.3 dB 00001 = -3.1 dB 00010 = -2.9 dB 00011 = -2.7 dB 00100 = -2.5 dB 00101 = -2.3 dB 00110 = -2.1 dB 00111 = -1.9 dB 01000 = -1.7 dB 01001 = -1.4 dB 01010 = -1.2 dB 01011 = -1.0 dB 01100 = -0.8 dB 01101 = -0.6 dB 01110 = -0.4 dB 01111 = -0.2 dB 10000 = 0.0 dB 10001 = 0.2 dB 10010 = 0.4dB 10011 = 0.7 dB 10100 = 0.9 dB 10101 = 1.1 dB 10110 = 1.3 dB 10111 = 1.5 dB 11000 = 1.7 dB 11001 = 1.9 dB 11010 = 2.1 dB 11011 = 2.3 dB 11100 = 2.6 dB 11101 = 2.8 dB 11110 = 3.0 dB 11111 = 3.2 dB 2013 Microchip Technology Inc. x = Bit is unknown DS20002331B-page 45 MCP19110/11 6.9 MOSFET Driver Programmable Dead Time FIGURE 6-2: The turn-on delay of the high-side and low-side drive signals can be configured independently to allow different MOSFETs and circuit board layouts to be used to construct an optimized system. See Figure 6-2. HDRV Setting the HDLYBY and LDLYBY bits of the PE1 register enables the high-side and low-side delay, respectively. The amount of delay added is controlled in the DEADCON register. See Register 6-9 for more information. REGISTER 6-9: MOSFET DRIVER DEAD TIME HDLY LDLY LDRV DEADCON: DRIVER DEAD TIME CONTROL REGISTER R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x HDLY3 HDLY2 HDLY1 HDLY0 LDLY3 LDLY2 LDLY1 LDLY0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 HDLY<3:0>: High-Side Dead Time Configuration bits 0000 = 11 ns delay 0001 = 15 ns delay 0010 = 19 ns delay 0011 = 23 ns delay 0100 = 27 ns delay 0101 = 31 ns delay 0110 = 35 ns delay 0111 = 39 ns delay 1000 = 43 ns delay 1001 = 47 ns delay 1010 = 51 ns delay 1011 = 55 ns delay 1100 = 59 ns delay 1101 = 63 ns delay 1110 = 67 ns delay 1111 = 71 ns delay bit 3-0 LDLY<3:0>: Low-Side Dead Time Configuration bits 0000 = 4 ns delay 0001 = 8 ns delay 0010 = 12 ns delay 0011 = 16 ns delay 0100 = 20 ns delay 0101 = 24 ns delay 0110 = 28 ns delay 0111 = 32 ns delay 1000 = 36 ns delay 1001 = 40 ns delay 1010 = 44 ns delay 1011 = 48 ns delay 1100 = 52 ns delay 1101 = 56 ns delay 1110 = 60 ns delay 1111 = 64 ns delay DS20002331B-page 46 x = Bit is unknown 2013 Microchip Technology Inc. MCP19110/11 6.10 Output Voltage Configuration Note: Two registers control the error amplifier reference voltage. The reference is coarsely set in 15 mV steps and then finely adjusted in 0.82 mV steps above the coarse setting (see Registers 6-10 and 6-11). Higher output voltages can be achieved by using a voltage divider connected between the output and the +VSEN pin. Care must be taken to ensure maximum voltage rating compliance on all pins. REGISTER 6-10: The OVFCON<VOUTEN> bit must be set to enable the output voltage setting registers. OVCCON: OUTPUT VOLTAGE SET POINT COARSE CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 OVC7 OVC6 OVC5 OVC4 OVC3 OVC2 OVC1 OVC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 x = Bit is unknown OVC<7:0>: Output Voltage Set Point Coarse Configuration bits OVC<7:0> = (VOUT/15.8 mV)+15.8 mV REGISTER 6-11: OVFCON: OUTPUT VOLTAGE SET POINT FINE CONTROL REGISTER R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 VOUTEN — — OVF4 OVF3 OVF2 OVF1 OVF0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 VOUTEN: Output Voltage DAC Enable bit 1 = Output Voltage DAC is enabled 0 = Output Voltage DAC is disabled bit 6-5 Unimplemented: Read as ‘0’ bit 4-0 OVF<4:0>: Output Voltage Set Point Fine Configuration bits OVF<4:0> = (VOUT – VOUT_COARSE)/0.8 mV 2013 Microchip Technology Inc. x = Bit is unknown DS20002331B-page 47 MCP19110/11 6.11 Output Undervoltage The output voltage is monitored, and when it is below the output undervoltage threshold, the UVIF flag is set. This flag must be cleared in software. See Section 15.3.1.4 “PIR2 Register” for more information. The output undervoltage threshold is controlled by the OUVCON register, as shown in Register 6-12. REGISTER 6-12: OUVCON: OUTPUT UNDERVOLTAGE DETECT LEVEL CONTROL REGISTER R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x OUV7 OUV6 OUV5 OUV4 OUV3 OUV2 OUV1 OUV0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 6.12 x = Bit is unknown OUV<7:0>: Output Undervoltage Detect Level Configuration bits OUV<7:0> = (VOUT_UV_Detect_Level)/15 mV Output Overvoltage The output voltage is monitored, and when it is above the output overvoltage threshold, the OVIF flag is set. This flag must be cleared in software. See Section 15.3.1.4 “PIR2 Register” for more information. The output overvoltage threshold is controlled by the OOVCON register, as shown in Register 6-13. REGISTER 6-13: OOVCON: OUTPUT OVERVOLTAGE DETECT LEVEL CONTROL REGISTER R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x OOV7 OOV6 OOV5 OOV4 OOV3 OOV2 OOV1 OOV0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 x = Bit is unknown OOV<7:0>: Output Overvoltage Detect Level Configuration bits OOV<7:0> = (VOUT_OV_Detect_Level)/15 mV DS20002331B-page 48 2013 Microchip Technology Inc. MCP19110/11 6.13 Analog Peripheral Control The MCP19110/11 has various analog peripherals. These peripherals can be configured to allow customizable operation. Refer to Register 6-14 more information. 6.13.1 DIODE EMULATION MODE The MCP19110/11 can operate in either diode emulation or synchronous rectification mode. When operating in diode emulation mode, the LDRV signal is terminated when the voltage across the low-side MOSFET is approximately 0V. This condition is true when the inductor current reaches approximately 0A. Both the HDRV and LDRV signals are low until the beginning of the next switching cycle. At that time, the HDRV signal is asserted high, turning on the high-side MOSFET. When operating in Synchronous Rectification mode, the LDRV signal is held high until the beginning of the next switching cycle. At that time, the HDRV signal is asserted high, turning on the high-side MOSFET. The PE1<DECON> bit controls the operating mode of the MCP19110/11. 6.13.2 HIGH-SIDE DRIVE STRENGTH The peak source and sink current of the high-side driver can be configured to either be 1A source/sink or 2A source/sink. The PE1<DVRSTR> bit determines the high-side drive strength. 6.13.3 6.13.4 OUTPUT VOLTAGE SENSE PULL-UP/PULL-DOWN A high-impedance pull-up on the +VSEN pin can be configured by setting the PE1<PUEN> bit. When set, the +VSEN pin is internally pulled-up to VDD. A high-impedance pull-down on the -VSEN can be configured by setting the PE1<PDEN> bit. When set, the -VSEN pin is internally pulled-down to ground. 6.13.5 OUTPUT UNDERVOLTAGE ACCELERATOR The MCP19110/11 has additional control circuitry to allow it to respond quickly to an output undervoltage condition. The enabling of this circuitry is handled by the PE1<UVTEE> bit. When this bit is set, the MCP19110/11 will respond to an output undervoltage condition by setting both the HDRV and LDRV signals low and turning off both the high-side and low-side MOSFETs. 6.13.6 OUTPUT OVERVOLTAGE ACCELERATOR The MCP19110/11 has additional control circuitry to allow it to respond quickly to an output overvoltage condition. The enabling of this circuitry is handled by the PE1<OVTEE> bit. When this bit is set, the MCP19110/11 will respond to an output overvoltage condition by setting both the HDRV and LDRV signals low and turning off both the high-side and low-side MOSFETs. MOSFET DRIVER DEAD TIME As described in Section 6.9 “MOSFET Driver Programmable Dead Time”, the MOSFET drive dead time can be adjusted. In order to enable dead time settings, the proper bypass bits must be cleared. PE1<HDLYBY> and PE1<LDLYBY> control the delay circuits. Clearing the respective bits allows the dead time programmed by the DEADCON register to be added to the appropriate turn-on edge. 2013 Microchip Technology Inc. DS20002331B-page 49 MCP19110/11 REGISTER 6-14: PE1: ANALOG PERIPHERAL ENABLE 1 CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 DECON DVRSTR HDLYBY LDLYBY PDEN PUEN UVTEE OVTEE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 DECON: Diode Emulation Mode bit 1 = Diode emulation mode enabled 0 = Synchronous rectification mode enabled bit 6 DVRSTR: High-Side Drive Strength Configuration bit 1 = High-side 1A source/sink drive strength 0 = High-side 2A source/sink drive strength bit 5 HDLYBY: High-Side Dead Time Bypass bit 1 = High-side dead time bypass is enabled 0 = High-side dead time bypass is disabled bit 4 LDLYBY: Low-Side Dead Time Bypass bit 1 = Low-side dead time bypass is enabled 0 = Low-side dead time bypass is disabled bit 3 PDEN: -VSEN Weak Pull Down Enable bit 1 = -VSEN weak pull down is enabled 0 = -VSEN weak pull down is disabled bit 2 PUEN: +VSEN Weak Pull Up Enable bit 1 = +VSEN weak pull up is enabled 0 = +VSEN weak pull up is disabled bit 1 UVTEE: Output Undervoltage Accelerator Enable bit 1 = Output undervoltage accelerator is enabled 0 = Output undervoltage accelerator is disabled bit 0 OVTEE: Output Overvoltage Accelerator Enable bit 1 = Output overvoltage accelerator is enabled 0 = Output overvoltage accelerator is disabled DS20002331B-page 50 x = Bit is unknown 2013 Microchip Technology Inc. MCP19110/11 6.14 Analog Blocks Enable Control Various analog circuit blocks can be enabled or disabled, as shown in Register 6-15. Additional enable bits are located in the ATSTCON register. 6.14.1 OUTPUT OVERVOLTAGE ENABLE The output overvoltage is enabled by setting the ABECON<OVDCEN> bit. Clearing this bit will disable the output overvoltage circuitry and cause the setting in the OOVCON register to be ignored. 6.14.2 OUTPUT UNDERVOLTAGE ENABLE The output undervoltage is enabled by setting the ABECON<UVDCEN> bit. Clearing this bit will disable the output undervoltage circuitry and cause the setting in the OUVCON register to be ignored. 6.14.3 RELATIVE EFFICIENCY MEASUREMENT CONTROL 6.14.6 INTERNAL TEMPERATURE MEASUREMENT CONTROL The internal temperature of the silicon can be measured with the ADC. To enable the internal temperature measurement circuitry, the ABECON<TMPSEN> bit must be set. 6.14.7 RELATIVE EFFICIENCY CIRCUITY CONTROL Section 10.0 “Relative Efficiency Measurement” describes the procedure used to measure the relative efficiency of the system. Setting the ABECON<RECIREN> bit enables the relative efficiency measurement circuitry. 6.14.8 SIGNAL CHAIN CONTROL Setting the ABECON<PATHEN> bit enables the voltage control path. Under normal operation, this bit is set. Section 10.0 “Relative Efficiency Measurement” describes the procedure used to measure the relative efficiency of the system. Setting the ABECON<MEASEN> bit initiates the relative measurement. 6.14.4 SLOPE COMPENSATION CONTROL The slope compensation described in Register 6-7 can be bypassed by setting the ABECON<SLCPBY> bit. Under normal operation, this bit will always be set. 6.14.5 CURRENT MEASUREMENT CONTROL The peak current measurement circuitry is controlled by the ABECON<CRTMEN> bit. Setting this bit enables the current measurement circuitry. Under normal operation, this bit will be set. 2013 Microchip Technology Inc. DS20002331B-page 51 MCP19110/11 REGISTER 6-15: ABECON: ANALOG BLOCK ENABLE CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 OVDCEN UVDCEN MEASEN SLCPBY CRTMEN TMPSEN RECIREN PATHEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 OVDCEN: Output overvoltage DAC control bit 1 = Output overvoltage DAC is enabled 0 = Output overvoltage DAC is disabled bit 6 UVDCEN: Output undervoltage DAC control bit 1 = Output undervoltage DAC is enabled 0 = Output undervoltage DAC is disabled bit 5 MEASEN: Relative efficiency measurement control bit 1 = Initiate relative efficiency measurement 0 = Relative efficiency measurement not in progress bit 4 SLCPBY: Slope compensation bypass control bit 1 = Slope compensation is disabled 0 = Slope compensation is enabled bit 3 CRTMEN: Current measurement circuitry control bit 1 = Current measurement circuitry is enabled 0 = Current measurement circuitry is disabled bit 2 TMPSEN: Internal temperature sensor control bit 1 = Internal temperature sensor circuitry is enabled 0 = Internal temperature sensor circuitry is disabled bit 1 RECIREN: Relative efficiency circuitry control bit 1 = Relative efficiency measurement circuitry is enabled 0 = Relative efficiency measurement circuitry is disabled bit 0 PATHEN: Signal chain circuitry control bit 1 = Signal chain circuitry is enabled 0 = Signal chain circuitry is disabled DS20002331B-page 52 x = Bit is unknown 2013 Microchip Technology Inc. MCP19110/11 7.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore, outside the warranted range. Note: Unless otherwise indicated, VIN = 12V, FSW = 300 kHz, TA = +25°C. 1.0 5.6 0.8 Quiesc cent Current (mA) 5.4 0.6 INL (LSB) 5.2 5.0 4.8 4.6 0.4 0.2 0.0 -0.2 -0.4 -0.6 4.4 -0.8 4.2 -40 -25 -10 5 20 35 50 65 80 -1.0 95 110 125 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 CODE Temperature (ºC) FIGURE 7-1: IQ vs. Temperature. FIGURE 7-4: OVFCON DAC INL vs. Code and Temperature (-40°C to +125°C). 0.2 0.0016 0.0 0.0014 0.0012 DNL (LSB) INL (LSB) -0.2 -0.4 -0.6 0.0010 0.0008 0.0006 -0.8 0.0004 -1.0 0.0002 0.0000 -1.2 0 64 128 CODE 192 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 CODE 256 FIGURE 7-2: OVCCON DAC INL vs. Code and Temperature (-40°C to +125°C). FIGURE 7-5: OVFCON DAC DNL vs. Code and Temperature (-40°C to +125°C). 0.030 5.09 0.025 5.08 0.020 5.07 -40ºC VDD (V) DNL (LSB) IDD = 1 mA 0.015 +125ºC 5.06 0.010 5.05 0.005 +25ºC 5.04 0 64 128 CODE 192 256 FIGURE 7-3: OVCCON DAC DNL vs. Code and Temperature (-40°C to +125°C). 2013 Microchip Technology Inc. 6 8 10 12 14 16 18 20 22 24 26 28 30 32 Input Voltage, VIN (V) FIGURE 7-6: VDD vs. Input Voltage. DS20002331B-page 53 MCP19110/11 Note: Unless otherwise indicated, VIN = 12V, FSW = 300 kHz, TA = +25°C. 5.07 5.06 3.35 3.33 5.04 5.03 - 40ºC +25ºC VREGREF (V) VDD (V) 5.05 5.02 OVCCON = 0xDCh 3.34 +125ºC 3.32 3.31 3.30 3.29 3.28 5.01 3.27 5.00 3.26 4.99 3.25 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 Current (mA) FIGURE 7-7: VDD vs. Output Current. -40 -25 -10 20 35 50 65 80 95 110 125 Temperature (ºC) FIGURE 7-10: VREGREF vs. Temperature (VREGREF = 3.3V). 80 OVCCON = 0x28h 0.62 0.61 0.60 0 59 0.59 HD DRV Dead Time (ns) 0.63 VREGREF (V) 5 70 60 50 -40ºC 40 125ºC +125ºC 30 0.58 20 0.57 10 +25ºC -40 -25 -10 5 0 20 35 50 65 80 95 110 125 Temperature (ºC) FIGURE 7-8: VREGREF vs. Temperature (VREGREF = 0.6V). 2 4 FIGURE 7-11: HDLY Code. 1.84 6 8 10 HDLY CODE 14 16 HDRV Dead Time vs. 70 OVCCON = 0x78h +25ºC LDR RV Dead Time (ns) 1.83 1.82 VREGREF (V) 12 1.81 1.80 1.79 1.78 60 50 40 +125ºC 30 20 -40ºC 10 1.77 -40 -25 -10 5 20 35 50 65 80 95 110 125 Temperature (ºC) FIGURE 7-9: VREGREF vs. Temperature (VREGREF = 1.8V). DS20002331B-page 54 0 0 2 FIGURE 7-12: LDLY Code. 4 6 8 10 LDLY CODE 12 14 16 LDRV Dead Time vs. 2013 Microchip Technology Inc. MCP19110/11 Note: Unless otherwise indicated, VIN = 12V, FSW = 300 kHz, TA = +25°C. 1.4 8.05 DRVSTR = 0 Oscillattor Frequency (MHz) HDR RV Resistance () 1.3 1.2 1.1 1.0 RHDRV-SOURCE 0.9 0.8 0.7 0.6 RHDRV-SINK 0.5 0.4 -40 -25 -10 5 FIGURE 7-13: Temperature. CR RNT Voltage (V) HDR RV Resistance () RHDRV-SOURCE 1.5 1.0 RHDRV-SINK 0.5 -40 -25 -10 5 FIGURE 7-14: Temperature. HDRV RDSon vs. RLDRV-SOURCE 1.0 0.8 0.6 RLDRV-SINK 0.2 -40 -25 -10 FIGURE 7-15: Temperature. 5 7.99 7.98 7.97 7.96 1.64 1.63 1.62 1.61 1.60 1.59 1.58 1.57 1.56 1.55 1.54 1.53 20 35 50 65 80 95 110 125 Temperature (ºC) LDRV RDSon vs. 2013 Microchip Technology Inc. 5 20 35 50 65 80 95 110 125 Temperature (ºC) Oscillator Frequency vs. RIND = 3.0 m 0 5 10 15 20 Output Current (A) FIGURE 7-17: Current. Percen ntage of Occurences LDR RV Resistance () 1.4 0.4 8.00 20 35 50 65 80 95 110 125 Temperature (ºC) 1.6 1.2 8.01 FIGURE 7-16: Temperature. DRVSTR = 1 2.0 8.02 -40 -25 -10 3.0 2.5 8.03 7.95 20 35 50 65 80 95 110 125 Temperature (ºC) HDRV RDSon vs. 8.04 25 30 CRNT Voltage vs. Output 24% 22% 20% 18% 16% 14% 12% 10% 8% 6% 4% 2% 0% 30 38 FIGURE 7-18: CMRR. 47 56 64 73 CMRR (dB) 81 90 100 Remote Sense Amplifier DS20002331B-page 55 MCP19110/11 NOTES: DS20002331B-page 56 2013 Microchip Technology Inc. MCP19110/11 8.0 SYSTEM BENCH TESTING 8.1 To allow for easier system design and bench testing, the MCP19110/11 family of devices feature a multiplexer used to output various internal analog signals. These signals can be measured on the GPA0 pin through a unity gain buffer. The configuration control of the GPA0 pin is found in the ATSTCON register, as shown in Register 8-1. Control of the signals present at the output of the unity gain buffer is found in the BUFFCON register, as shown in Register 8-2. REGISTER 8-1: 8.1.1 Analog Bench Test Control ATSTCON REGISTER The ATSTCON register contains the bits used to disable the MOSFET drivers and configure the GPA0 pin as the unity gain buffer out, as shown in Register 8-1. Note 1: The DRVDIS bit is reset to ‘1’ so the highside and low-side drivers are in a known state after reset. This bit must be cleared by software for normal operation. ATSTCON: ANALOG BENCH TEST CONTROL REGISTER R/W-1 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-1 Reserved — — Reserved HIDIS LODIS BNCHEN DRVDIS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Reserved bit 6-5 Unimplemented: Read as ‘0’ bit 4 Reserved bit 3 HIDIS: High-side driver control bit 1 = High-side driver is disabled 0 = High-side driver is enabled bit 2 LODIS: Low-side driver control bit 1 = Low-side driver is disabled 0 = Low-side driver is enabled bit 1 BNCHEN: GPA0 bench test configuration control bit 1 = GPA0 is configured for analog bench test output 0 = GPA0 is configured for normal operation bit 0 DRVDIS: MOSFET driver disable control bit 1 = High-side and low-side drivers are set low, PHASE pin is floating 0 = High-side and low-side drivers are set for normal operation 2013 Microchip Technology Inc. x = Bit is unknown DS22331A-page 57 MCP19110/11 8.2 Unity Gain Buffer When measuring signals with the unity gain buffer, the buffer offset must be added to the measured signal. The factory measured buffer offset can be read from memory location 2087h. Refer to Section 11.1.1 “Reading Program Memory as Data” for more information. The unity gain buffer module is used during a multiphase application and while operating in Bench Test mode. When the ATSTCON<BNCHEN> bit is set, the device is in Bench Test mode and the ASEL<4:0> bits of the BUFFCON register determine which internal analog signal can be measured on the GPA0 pin. REGISTER 8-2: BUFFCON: UNITY GAIN BUFFER CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 MLTPH2 MLTPH1 MLTPH0 ASEL4 ASEL3 ASEL2 ASEL1 ASEL0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-5 MLTPH<2:0>: System configuration bits 000 = Device set as stand-alone unit 001 = Device set as multiple output MASTER 010 = Device set as multiple output SLAVE 011 = Device set as multi-phase MASTER 100 = Device set as multi-phase SLAVE bit 4-0 ASEL<4:0>: Multiplexer output control bit 00000 = Voltage proportional to current in the inductor 00001 = Error amplifier output plus slope compensation, input to PWM comparator 00010 = Input to slope compensation circuitry 00011 = Band gap reference 00100 = Output voltage reference 00101 = Output voltage after internal differential amplifier 00110 = Unimplemented 00111 = Voltage proportional to the internal temperature 01000 = Internal ground for current sense circuitry, see Section 6.5 “Voltage for Zero Current” 01001 = Output overvoltage comparator reference 01010 = Output undervoltage comparator reference 01011 = Error amplifier output 01100 = For a multi-phase SLAVE, error amplifier signal received from MASTER 01101 = For multi-phase SLAVE, error signal received from MASTER with gain, see Section 6.8 “MASTER Error Signal Gain” 01110 = VIN divided down by 1/5 01111 = DC inductor valley current 10000 = Unimplemented • • • 11100 = Unimplemented 11101 = Overcurrent reference 11110 = Unimplemented 11111 = Unimplemented DS22331A-page 58 2013 Microchip Technology Inc. MCP19110/11 9.0 DEVICE CALIBRATION 9.1 Calibration Word 1 The DOV<3:0> bits at memory location 2080h set the offset calibration for the output voltage remote sense differential amplifier. Firmware must read these values and write them to the DOVCAL register for proper calibration. Read-only memory locations 2080h through 208Fh contain factory calibration data. Refer to Section 18.0 “Flash Program Memory Control” for information on how to read from these memory locations. The FCAL<6:0> bits at memory location 2080h set the internal oscillator calibration. Firmware must read these values and write them to the OSCCAL register for proper calibration. REGISTER 9-1: CALWD1: CALIBRATION WORD 1 REGISTER U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 — — DOV3 DOV2 DOV1 DOV0 bit 13 bit 8 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 — FCAL6 FCAL5 FCAL4 FCAL3 FCAL2 FCAL1 FCAL0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 13-12 Unimplemented: Read as ‘0’ bit 11-8 DOV<3:0>: Output voltage remote sense differential amplifier offset calibration bits. bit 7 Unimplemented: Read as ‘0’ bit 6-0 FCAL<6:0>: Internal oscillator calibration bits. 2013 Microchip Technology Inc. DS20002331B-page 59 MCP19110/11 9.2 Calibration Word 2 The TTA<3:0> bits at memory location 2082h calibrate the overtemperature shutdown threshold point. Firmware must read these values and write them to the TTACAL register for proper calibration. The BGR<3:0> bits at memory location 2082h calibrate the internal band gap. Firmware must read these values and write them to the BGRCAL register for proper calibration. REGISTER 9-2: CALWD2: CALIBRATION WORD 2 REGISTER U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 — — TTA3 TTA2 TTA1 TTA0 bit 13 bit 8 U-0 U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 — — — — BGR3 BGR2 BGR1 BGR0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 13-12 Unimplemented: Read as ‘0’ bit 11-8 TTA<3:0>: Overtemperature shutdown threshold calibration bits. bit 7-4 Unimplemented: Read as ‘0’ bit 3-0 BGR<3:0>: Internal band gap calibration bits. DS20002331B-page 60 x = Bit is unknown 2013 Microchip Technology Inc. MCP19110/11 9.3 Calibration Word 3 The VRO<3:0> bits at memory location 2083h calibrate the offset of the buffer amplifier of the output voltage regulation reference set point. This effectively changes the band gap reference. Firmware must read these values and write them to the VROCAL register for proper calibration. The ZRO<3:0> bits at memory location 2083h calibrate the offset of the error amplifier. Firmware must read these values and write them to the ZROCAL register for proper calibration. REGISTER 9-3: CALWD3: CALIBRATION WORD 3 REGISTER U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 — — VRO3 VRO2 VRO1 VRO0 bit 13 bit 8 U-0 U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 — — — — ZRO3 ZRO2 ZRO1 ZRO0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 13-12 Unimplemented: Read as ‘0’ bit 11-8 VRO<3:0>: Reference voltage offset calibration bits. bit 7-4 Unimplemented: Read as ‘0’ bit 3-0 ZRO<3:0>: Error amplifier offset voltage calibration bits. 2013 Microchip Technology Inc. x = Bit is unknown DS20002331B-page 61 MCP19110/11 9.4 Calibration Word 4 The TANA<9:0> bits at memory location 2084h contain the ADC reading from the internal temperature sensor when the silicon temperature is at +30°C. The temperature coefficient of the internal temperature sensor is 16 mV/°C. REGISTER 9-4: CALWD4: CALIBRATION WORD 4 REGISTER U-0 U-0 U-0 U-0 R/P-1 R/P-1 — — — — TANA9 TANA8 bit 13 bit 8 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 TANA7 TANA6 TANA5 TANA4 TANA3 TANA2 TANA1 TANA0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 13-10 Unimplemented: Read as ‘0’ bit 9-0 TANA<9:0>: ADC internal temperature sensor at +30°C calibration bits TANA<9:0> = (Temperature x 13.3 mV/°C) +1.75 DS20002331B-page 62 2013 Microchip Technology Inc. MCP19110/11 9.5 Calibration Word 5 The DIFC<7:0> bits at memory location 2085h contain the offset voltage information for the output voltage difference amplifier. The value is an 8-bit two’s complement number that represents the number of the OVCCON counts needed to adjust for the differential amplifier offset. This value can be used to completely remove the differential amplifier offset. For example, the offset of the differential amplifier is measured to be -64 mV. Since one OVCCON count equals 16 mV, this represents four counts of the OVCCON register. Therefore, the value stored at location 2085h would be 0xFCh, where the setting of the DIFC7 bit represents a negative number. REGISTER 9-5: CALWD5: CALIBRATION WORD 5 REGISTER U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — bit 13 bit 8 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 DIFC7 DIFC6 DIFC5 DIFC4 DIFC3 DIFC2 DIFC1 DIFC0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 13-8 Unimplemented: Read as ‘0’ bit 7-0 DIFC<7:0>: OVCCON counts to adjust for differential amplifier offset calibration bits 2013 Microchip Technology Inc. DS20002331B-page 63 MCP19110/11 9.6 Calibration Word 6 The DIFF<7:0> bits at memory location 2086h contain the offset voltage information for the output voltage difference amplifier. The value is an 8-bit two’s complement number that represents the number of the OVFCON counts needed to adjust for the differential amplifier offset. This value can be used to completely remove the differential amplifier offset. For example, the offset of the differential amplifier is measured to be +4.2 mV. Since one OVFCON count equals 0.7 mV, this represents six counts of the OVFCON register. Therefore the value stored at location 2086h would be 0x06h, where clearing the DIFF7 bit represents a positive number. REGISTER 9-6: CALWD6: CALIBRATION WORD 6 REGISTER U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — bit 13 bit 8 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 DIFF7 DIFF6 DIFF5 DIFF4 DIFF3 DIFF2 DIFF1 DIFF0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 13-8 Unimplemented: Read as ‘0’ bit 7-0 DIFF<7:0>: OVFCON counts to adjust for differential amplifier offset calibration bits DS20002331B-page 64 2013 Microchip Technology Inc. MCP19110/11 9.7 Calibration Word 7 The BUFF<7:0> bits at memory location 2087h represent the offset voltage of the unity gain buffer. This is an 8-bit two’s complement number. The MSB is the sign bit. If the MSB is set to 1, the resulting number is negative. REGISTER 9-7: CALWD7: CALIBRATION WORD 7 REGISTER U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — bit 13 bit 8 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 BUFF7 BUFF6 BUFF5 BUFF4 BUFF3 BUFF2 BUFF1 BUFF0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 13-8 Unimplemented: Read as ‘0’ bit 7-0 BUFF<7:0>: Unity gain buffer offset voltage calibration bits 2013 Microchip Technology Inc. x = Bit is unknown DS20002331B-page 65 MCP19110/11 NOTES: DS20002331B-page 66 2013 Microchip Technology Inc. MCP19110/11 10.0 RELATIVE EFFICIENCY MEASUREMENT 7. With a constant input voltage, output voltage and load current, any change in the high-side MOSFET on-time represents a change in the system efficiency. The MCP19110/11 is capable of measuring the on-time of the high-side MOSFET. Therefore, the relative efficiency of the system can be measured and optimized by changing the system parameters, such as switching frequency, driver dead time or high-side drive strength. 10.1 Relative Efficiency Measurement Procedure To measure the relative efficiency, the RELEFF register, ABECON<MEASEN> and ABECON<RECIREN> bits, and the ADC RELEFF input are used. The following steps outlines the measurement process: 1. 2. 3. 4. 5. 6. Set the ABECON<RECIREN> bit to enable the measurement circuitry. Clear the ABECON<MEASEN> bit. With the ADC, read the RELEFF channel and store this reading as the High. With the ADC, read the VZC channel and store this reading as the Low. Set the ABECON<MEASEN> bit to initiate a measurement cycle. Monitor the RELEFF<MSDONE> bit. When set, it indicates the measurement is complete. REGISTER 10-1: When the measurement is complete, use the ADC to read the RELEFF channel. This value becomes the Fractional variable in Equation 10-1. This reading should be accomplished approximately 50ms after the RELESS<MSDONE> bit is set. 8. Read the value of the RE<6:0> bits in the RELEFF register and store the reading as Whole. 9. Clear the ABECON<MEASEN> bit. 10. The relative efficiency is then calculated by the following equation: EQUATION 10-1: Unicycle = Fractional – Low Whole + ------------------------------------------------ High – Low ------------------------------------------------------------------------------- PR2 + 1 Where: Whole = Value obtained in Step 8 of the measurement procedure Fractional = Value obtained in Step 7 of the measurement procedure High = Value obtained in Step 3 of the measurement procedure Low = Value obtained in Step 4 of the measurement procedure Note 1: The RELEFF<MSDONE> bit is set and cleared automatically. RELEFF: RELATIVE EFFICIENCY MEASUREMENT REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 MSDONE RE6 RE5 RE4 RE3 RE2 RE1 RE0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 MSDONE: Relative efficiency measurement done bit 1 = Relative efficiency measurement is complete 0 = Relative efficiency measurement is not complete bit 6-0 RE<6:0>: Whole clock counts for relative efficiency measurement result 2013 Microchip Technology Inc. x = Bit is unknown DS20002331B-page 67 MCP19110/11 NOTES: DS20002331B-page 68 2013 Microchip Technology Inc. MCP19110/11 11.0 MEMORY ORGANIZATION FIGURE 11-1: PROGRAM MEMORY MAP AND STACK FOR MCP19110/11 There are two types of memory in the MCP19110/11: • Program Memory • Data Memory - Special Function Registers (SFRs) - General Purpose RAM 11.1 Program Memory Organization The MCP19110/11 has a 13-bit program counter capable of addressing an 8K x 14 program memory space. Only the first 4K x 14 (0000h-0FFFh) is physically implemented. Addressing a location above this boundary will cause a wrap-around within the first 4K x 14 space. The Reset vector is at 0000h and the interrupt vector is at 0004h (see Figure 11-1). The width of the program memory bus (instruction word) is 14-bits. Since all instructions are a single word, the MCP19110/11 has space for 4K of instructions. PC<12:0> CALL, RETURN RETFIE, RETLW 13 Stack Level 1 Stack Level 8 Reset Vector 0000h Interrupt Vector 0004h 0005h On-Chip Program Memory 0FFFh 1000h Shadows 000-FFFh 1FFFh User IDs(1) 2000h 2003h ICD Instruction(1) 2004h Manufacturing Codes(1) 2005h Device ID (hardcoded)(1) 2006h Config Word(1) 2007h Reserved 2008h 200Ah 200Bh Reserved for Manufacturing & Test(1) Calibration Words(1) 207Fh 2080h 208Fh 2090h Unimplemented 20FFh 2100h Shadows 2000-20FFh 3FFFh Note 1: Not code protected. 2013 Microchip Technology Inc. DS20002331B-page 69 MCP19110/11 11.1.1 READING PROGRAM MEMORY AS DATA There are two methods of accessing constants in program memory. The first method is to use tables of RETLW instructions. The second method is to set a Files Select Register (FSR) to point to the program memory. 11.1.1.1 RETLW Instruction The RETLW instruction can be used to provide access to tables of constants. The recommended way to create such a table is shown in Example 11-1. EXAMPLE 11-1: constants RETLW RETLW RETLW RETLW DATA0 DATA1 DATA2 DATA3 RETLW INSTRUCTION ;Index0 data ;Index1 data my_function ;… LOTS OF CODE… MOVLW DATA_INDEX call constants ;… THE CONSTANT IS IN W 11.1.1.2 Indirect Read with Files Select Register (FSR) The program memory can be accessed as data by setting bit 7 of the FSRxH register and reading the matching INDFx register. The MOVIW instruction will place the lower 8 bits of the addressed word in the W register. Writes to the program memory cannot be performed via the INDF registers. Instructions that access the program memory via the FSR require one extra instruction cycle to complete. Example 11-2 demonstrates accessing the program memory via an FSR. 11.2 Data Memory Organization The data memory (see Table 11-1) is partitioned into four banks, which contain the General Purpose Registers (GPR) and the Special Function Registers (SFR). The Special Function Registers are located in the first 32 locations of each bank. Register locations 20h-7Fh in Bank 0, A0h-EFh in Bank 1 and 120h-16Fh in Bank 2 are General Purpose Registers, implemented as static RAM. All other RAM is unimplemented and returns ‘0’ when read. The RP<1:0> bits of the STATUS register are the bank select bits. RP1 RP0 0 0 -> Bank 0 is selected 0 1 -> Bank 1 is selected 1 0 -> Bank 2 is selected 1 1 -> Bank 3 is selected To move values from one register to another register, the value must pass throught the W register. This means that for all register-to-register moves, two instruction cycles are required. The STATUS contains: register, shown in Register 11-1, • the arithmetic status of the ALU • the Reset status • the bank select bits for data memory (RAM) The STATUS register can be the destination for any instruction, like any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. The HIGH directive will set bit<7> if a label points to a location in program memory. For example, CLRF STATUS will clear the upper three bits and set the Z bit. This leaves the STATUS register as ‘000u u1uu’ (where u = unchanged). EXAMPLE 11-2: Therefore, it is recommended that only BCF, BSF, SWAPF and MOVWF instructions are used to alter the STATUS register, because these instructions do not affect any Status bits. For other instructions not affecting any Status bits, see the Section 29.0 “Instruction Set Summary”. ACCESSING PROGRAM MEMORY VIA FSR constants RETLW DATA0 ;Index0 data RETLW DATA1 ;Index1 data RETLW DATA2 RETLW DATA3 my_function ;… LOTS OF CODE… MOVLW LOW constants MOVWF FSR1L MOVLW HIGH constants MOVWF FSR1H MOVIW 0[FSR1] ;THE PROGRAM MEMORY IS IN W DS20002331B-page 70 Note 1: The C and DC bits operate as Borrow and Digit Borrow out bits, respectively, in subtraction. 2013 Microchip Technology Inc. MCP19110/11 REGISTER 11-1: R/W-0 STATUS: STATUS REGISTER R/W-0 IRP RP1 R/W-0 RP0 R-1 TO R-1 PD R/W-x Z R/W-x R/W-x (1) DC bit 7 C(1) bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 IRP: Register Bank Select bit (used for Indirect addressing) 1 = Bank 2 & 3 (100h – 1FFh) 0 = Bank 0 & 1 (00h – FFh) bit 6-5 RP<1:0>: Register Bank Select bits (used for Direct addressing) 00 = Bank 0 (00h - 7Fh) 01 = Bank 1 (80h - FFh) 10 = Bank 2 (100h - 17Fh) 11 = Bank 3 (180h - 1FFh) bit 4 TO: Time-out bit 1 = After power-up, CLRWDT instruction or SLEEP instruction 0 = A WDT time-out occurred bit 3 PD: Power-down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit Carry/Digit Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions) 1 = A carry-out from the 4th low-order bit of the result occurred 0 = No carry-out from the 4th low-order bit of the result bit 0 C: Carry/Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1) 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note 1: 11.2.1 For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or low-order bit of the source register. SPECIAL FUNCTION REGISTERS The Special Function Registers are registers used by the CPU and peripheral functions for controlling the desired operation of the device (see Table 11-1). These registers are static RAM. The special registers can be classified into two sets: core and peripheral. The Special Function Registers associated with the microcontroller core are described in this section. Those related to the operation of the peripheral features are described in the associated section for that peripheral feature. 2013 Microchip Technology Inc. DS20002331B-page 71 MCP19110/11 11.3 DATA MEMORY TABLE 11-1: MCP19110/11 DATA MEMORY MAP File Address File Address File Address File Address Indirect addr.(1) 00h Indirect addr. (1) 80h Indirect addr.(1) 100h Indirect addr. (1) TMR0 01h OPTION_REG 81h TMR0 101h OPTION_REG 181h PCL 02h PCL 82h PCL 102h PCL 182h STATUS 03h STATUS 83h STATUS 103h STATUS 183h 184h 180h FSR 04h FSR 84h FSR 104h FSR PORTGPA 05h TRISGPA 85h WPUGPA 105h IOCA 185h PORTGPB 06h TRISGPB 86h WPUGPB 106h IOCB 186h PIR1 07h PIE1 87h PE1 107h ANSELA 187h ANSELB PIR2 08h PIE2 88h BUFFCON 108h PCON 09h APFCON 89h ABECON 109h 188h PCLATH 0Ah PCLATH 8Ah PCLATH 10Ah PCLATH 18Ah INTCON 0Bh INTCON 8Bh INTCON 10Bh INTCON 18Bh TMR1L 0Ch 8Ch 10Ch PORTICD(2) 18Ch TMR1H 0Dh 8Dh 10Dh TRISICD(2) 18Dh T1CON 0Eh 8Eh 10Eh ICKBUG(2) 18Eh TMR2 0Fh 8Fh 10Fh BIGBUG(2) 18Fh 190h 189h T2CON 10h VINLVL 90h SSPADD 110h PMCON1 PR2 11h OCCON 91h SSPBUF 111h PMCON2 191h 92h SSPCON1 112h PMADRL 192h CSGSCON 93h SSPCON2 113h PMADRH 193h 94h SSPCON3 114h PMDATL 194h CSDGCON 95h SSPMSK 115h PMDATH 96h SSPSTAT 116h 196h 117h 197h 12h PWMPHL 13h PWMPHH 14h PWMRL 15h PWMRH 16h 17h VZCCON 97h SSPADD2 SSPMSK2 195h 18h CMPZCON 98h 118h OSCCAL 198h OVCCON 19h OUVCON 99h 119h DOVCAL 199h OVFCON 1Ah OOVCON 9Ah 11Ah TTACAL 19Ah OSCTUNE 1Bh DEADCON 9Bh 11Bh BGRCAL 19Bh ADRESL 1Ch SLPCRCON 9Ch 11Ch VROCAL 19Ch ADRESH 1Dh SLVGNCON 9Dh 11Dh ZROCAL 19Dh ADCON0 1Eh RELEFF 9Eh 11Eh ADCON1 1Fh 9Fh 11Fh ATSTCON 19Fh 20h General Purpose Register General Purpose Register 80 Bytes General Purpose Register 120h 1A0h 80 bytes EFh 96 Bytes Accesses Bank 0 7Fh Bank 0 Note 1: 2: A0h 19Eh F0h 16F Accesses Bank 0 FFh Bank 1 170h 1EF Accesses Bank 0 17Fh Bank2 1F0h 1FFh Bank3 Unimplemented data memory locations, read as '0'. Not a physical register. Only accessible when DBGEN = 0 and ICKBUG<INBUG> = 1. DS20002331B-page 72 2013 Microchip Technology Inc. MCP19110/11 TABLE 11-2: Adr Name MCP19110/11 SPECIAL REGISTERS SUMMARY BANK 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR Reset Value on all other resets(1) Bank 0 00h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx xxxx xxxx 01h TMR0 Timer0 Module’s Register xxxx xxxx uuuu uuuu 02h PCL 03h STATUS 04h FSR 05h PORTGPA GPA7 GPA6 06h PORTGPB GPB7 GPB6 07h PIR1 — ADIF 08h PIR2 UVIF — 09h PCON — 0Ah PCLATH — 0Bh INTCON GIE Program Counter's (PC) Least Significant byte IRP RP1 RP0 TO PD Z 0000 0000 0000 0000 DC C 0001 1xxx 000q quuu GPA1 GPA0 xxxx xxxx uuuu uuuu Indirect data memory address pointer GPA5 xxxx xxxx uuuu uuuu GPA4 GPA3 GPA2 GPB5 GPB4 — GPB2 GPB1 GPB0 xxx- xxxx uuu- uuuu BCLIF SSPIF — — TMR2IF TMR1IF -000 --00 -000 --00 OCIF OVIF — — VINIF DCERIF 0-00 --00 0-00 --00 — — — — ---- -qq- ---- -uu- — — PEIE T0IE — OT POR Write buffer for upper 5 bits of program counter INTE IOCE T0IF INTF ---0 0000 ---0 0000 IOCF(3) 0000 000x 0000 000u 0Ch TMR1L Holding register for the Least Significant byte of the 16-bit TMR1 xxxx xxxx uuuu uuuu 0Dh TMR1H Holding register for the Most Significant byte of the 16-bit TMR1 xxxx xxxx uuuu uuuu 0Eh T1CON 0Fh TMR2 10h T2CON 11h PR2 12h — — T1CKPS1 — — — T1CKPS0 — — TMR1CS TMR1ON TMR2ON T2CKPS1 T2CKPS0 Timer2 Module Register — — 0000 0000 uuuu uuuu Timer2 Module Period Register — --00 --00 --uu --uu ---- -000 ---- -000 1111 1111 1111 1111 Unimplemented — — 13h PWMPHL SLAVE Phase Shift Register xxxx xxxx uuuu uuuu 14h PWMPHH SLAVE Phase Shift Register xxxx xxxx uuuu uuuu 15h PWMRL PWM Register Low Byte xxxx xxxx uuuu uuuu 16h PWMRH PWM Register High Byte xxxx xxxx uuuu uuuu 17h — Unimplemented 18h — Unimplemented 19h OVCCON OVC7 OVC6 OVC5 OVC4 1Ah OVFCON VOUTON — — OVF4 1Bh OSCTUNE — — — TUN4 OVC3 — — — — OVC2 OVC1 OVC0 0000 0000 0000 0000 OVF3 OVF2 OVF1 OVF0 0--0 0000 0--0 0000 TUN3 TUN2 TUN1 TUN0 ---0 0000 ---0 0000 1Ch ADRESL Least significant 8 bits of the right-shifted result xxxx xxxx uuuu uuuu 1Dh ADRESH Most significant 2 bits of right-shifted result ---- --xx uuuu uuuu 1Eh ADCON0 — CHS4 CHS3 CHS2 CHS1 CHS0 GO/DONE ADON -000 0000 -000 0000 1Fh ADCON1 — ADCS2 ADCS1 ADCS0 — — — — -000 ---- -000 ---- Legend: Note 1: 2: 3: — = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented Other (non power-up) resets include MCLR Reset and Watchdog Timer Reset during normal operation. IRP & RP1 bits are reserved, always maintain these bits clear. MCLR and WDT reset does not affect the previous value data latch. The IOCF bit will be cleared upon reset but will set again if the mismatch exists. 2013 Microchip Technology Inc. DS20002331B-page 73 MCP19110/11 TABLE 11-3: Addr MCP19110/11 SPECIAL REGISTERS SUMMARY BANK 1 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR Reset Values on all other resets(1) Bank 1 80h INDF 81h OPTION_REG Addressing this location uses contents of FSR to address data memory (not a physical register) 82h PCL 83h STATUS 84h FSR 85h TRISGPA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 86h TRISGPB TRISB7 TRISB6 TRISB5 TRISB4 87h PIE1 — ADIE BCLIE 88h PIE2 UVIE — 89h APFCON — — 8Ah PCLATH — — — 8Bh INTCON GIE PEIE T0IE 8Ch — Unimplemented — — 8Dh — Unimplemented — — 8Eh — Unimplemented — — 8Fh — Unimplemented — — RAPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 DC C TRISA2 TRISA1 TRISA0 1111 1111 1111 1111 — TRISB2 TRISB1 TRISB0 1111 1111 1111 1111 SSPIE — — TMR2IE TMR1IE -000 --00 -000 --00 OCIE OVIE — — VINIE DCERIE 0-00 --00 0-00 --00 — — — — — CLKSEL ---- ---0 ---- ---0 Program Counter's (PC) Least Significant byte IRP(2) RP1(2) xxxx xxxx uuuu uuuu 1111 1111 1111 1111 RP0 TO PD Z 0000 0000 0000 0000 Indirect data memory address pointer xxxx xxxx uuuu uuuu Write buffer for upper 5 bits of program counter INTE IOCE T0IF 0001 1xxx 000q quuu INTF IOCF(4) ---0 0000 ---0 0000 0000 000x 0000 000u 90h VINLVL UVLOEN — UVLO5 UVLO4 UVLO3 UVLO2 UVLO1 UVLO0 0-xx xxxx 0-uu uuuu 91h OCCON OCEN OCLEB1 OCLEB0 OOC4 OOC3 OOC2 OOC1 OOC0 0xxx xxxx 0uuu uuuu 92h — — — Reserved Reserved Reserved Reserved Reserved Reserved --xx xxxx --uu uuuu — Reserved Reserved Reserved CSGS3 CSGS2 CSGS1 CSGS0 -xxx xxxx -uuu uuuu Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved xxxx xxxx uuuu uuuu CSDGEN — — — Reserved CSDG2 CSDG1 CSDG0 0--- xxxx 0--- uuuu — — — — Reserved Reserved Reserved Reserved ---- xxxx ---- uuuu VZC7 VZC6 VZC5 VZC4 VZC3 VZC2 VZC1 VZC0 xxxx xxxx uuuu uuuu CMPZF3 CMPZF2 CMPZF1 CMPZF0 CMPZG3 CMPZG2 CMPZG1 CMPZG0 xxxx xxxx uuuu uuuu 93h CSGSCON 94h 95h — CSDGCON 96h — 97h VZCCON 98h CMPZCON 99h OUVCON OUV7 OUV6 OUV5 OUV4 OUV3 OUV2 OUV1 OUV0 xxxx xxxx uuuu uuuu 9Ah OOVCON OOV7 OOV6 OOV5 OOV4 OOV3 OOV2 OOV1 OOV0 xxxx xxxx uuuu uuuu 9Bh DEADCON HDLY3 HDLY2 HDLY1 HDLY0 LDLY3 LDLY2 LDLY1 LDLY0 xxxx xxxx uuuu uuuu 9Ch SLPCRCON SLPG3 SLPG2 SLPG1 SLPG0 SLPS3 SLPS2 SLPS1 SLPS0 xxxx xxxx uuuu uuuu 9Dh SLVGNCON — — — SLVGN4 SLVGN3 SLVGN2 SLVGN1 SLVGN0 ---x xxxx ---u uuuu 9Eh RELEFF MSDONE RE6 RE5 RE4 RE3 RE2 RE1 RE0 0000 0000 0000 0000 9Fh — Legend: Note 1: 2: 3: 4: — = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented Other (non power-up) resets include MCLR Reset and Watchdog Timer Reset during normal operation. IRP & RP1 bits are reserved, always maintain these bits clear. RA3 pull-up is enabled when pin is configured as MCLR in Configuration Word. MCLR and WDT Reset does not affect the previous value data latch. The IOCF bit will be cleared upon reset but will set again if the mismatch exists. DS20002331B-page 74 Unimplemented — — 2013 Microchip Technology Inc. MCP19110/11 TABLE 11-4: Adr Name MCP19110/11 SPECIAL REGISTERS SUMMARY BANK 2 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR Reset Value on all other resets(1) Bank 2 100h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx xxxx xxxx 101h TMR0 Timer0 Module’s Register xxxx xxxx uuuu uuuu 102h PCL Program Counter's (PC) Least Significant byte 0000 0000 0000 0000 103h STATUS IRP(2) RP1 (2) RP0 TO PD Z DC C 0001 1xxx 000q quuu 104h FSR 105h WPUGPA — — WPUA5 Indirect data memory address pointer — WPUA3 WPUA2 WPUA1 WPUA0 --1- 1111 --u- uuuu 106h WPUGPB WPUB7 WPUB6 WPUB5 WPUB4 — WPUB2 WPUB1 — 1111 -11- uuuu -uu- 107h PE1 DECON DVRSTR HDLYBY LDLYBY PDEN PUEN UVTEE OVTEE 0000 1100 0000 1100 108h BUFFCON MLTPH2 MLTPH1 MLTPH0 ASEL4 ASEL3 ASEL2 ASEL1 ASEL0 0000 0000 0000 0000 109h ABECON OVDCEN UVDCEN MEASEN SLCPBY CRTMEN TMPSEN RECIREN PATHEN 10Ah PCLATH — — — 10Bh INTCON GIE PEIE T0IE xxxx xxxx uuuu uuuu Write buffer for upper 5 bits of program counter INTE IOCE T0IF INTF 0000 0000 0000 0000 ---0 0000 ---0 0000 IOCF(3) 0000 000x 0000 000u 10Ch — Unimplemented — — 10Dh — Unimplemented — — 10Eh — Unimplemented — — — Unimplemented — — 10Fh 110h SSPADD ADD<7:0> 0000 0000 0000 0000 111h SSPBUF 112h SSPCON1 Synchronous Serial Port Receive Buffer/Transmit Register WCOL SSPOV SSPEN CKP 113h SSPCON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 0000 0000 0000 0000 114h SSPCON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 0000 0000 0000 0000 115h SSPMSK 116h SSPSTAT R/W UA BF 117h SSPADD2 118h 119h xxxx xxxx uuuu uuuu SSPM>3:0> 0000 0000 0000 0000 MSK<7:0> SMP CKE D/A P S 1111 1111 1111 1111 — — ADD2<7:0> 0000 0000 0000 0000 SSPMSK2 MSK2<7:0> 1111 1111 1111 1111 — Unimplemented — — 11Ah — Unimplemented — — 11Bh — Unimplemented — — 11Ch — Unimplemented — — 11Dh — Unimplemented — — 11Eh — Unimplemented — — 11Fh — Unimplemented — — Legend: Note 1: 2: 3: — = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented Other (non power-up) resets include MCLR Reset and Watchdog Timer Reset during normal operation. IRP & RP1 bits are reserved, always maintain these bits clear. MCLR and WDT reset does not affect the previous value data latch. The IOCF bit will be cleared upon reset but will set again if the mismatch exists. 2013 Microchip Technology Inc. DS20002331B-page 75 MCP19110/11 TABLE 11-5: Addr MCP19110/11 SPECIAL REGISTERS SUMMARY BANK 3 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR Reset Values on all other resets(1) Bank 3 180h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx uuuu uuuu 181h OPTION_REG RAPU INTEDG 1111 1111 1111 1111 IRP(2) RP1(2) T0CS T0SE PSA PS2 PS1 PS0 DC C 182h PCL 183h STATUS Program Counter's (PC) Least Significant byte 184h FSR 185h IOCA IOCA7 IOCA6 IOCA5 IOCA4 IOCA3 IOCA2 IOCA1 IOCA0 0000 0000 0000 0000 186h IOCB IOCB7 IOCB6 IOCB5 IOCB4 — IOCB2 IOCB1 IOCB0 0000 -000 0000 -000 187h ANSELA — — — — ANSA3 ANSA2 ANSA1 ANSA0 ---- 1111 ---- 1111 188h ANSELB — — ANSB5 ANSB4 — ANSB2 ANSB1 — --11 -11- --11 -11- 189h — TO PD Z 0000 0000 0000 0000 Indirect data memory address pointer 18Bh INTCON (5) 18Ch PORTICD (5) 18Dh TRISICD (5) 18Eh ICKBUG (5) 18Fh BIGBUG — — — GIE PEIE T0IE — Write buffer for upper 5 bits of program counter INTE 0001 1xxx 000q quuu xxxx xxxx uuuu uuuu Unimplemented 18Ah PCLATH 190h RP0 IOCE T0IF INTF IOCF(4) — ---0 0000 ---0 0000 0000 000x 0000 000u In-Circuit Debug Port Register In-Circuit Debug TRIS Register In-Circuit Debug Register 0--- ---- 0--- ---- In-Circuit Debug Breakpoint Register PMCON1 — CALSEL — — — WREN ---- ---- ---- ---WR RD Program Memory Control Register 2 (not a physical register) -0-- -000 -0-- -000 191h PMCON2 192h PMADRL PMADRL7 PMADRL6 PMADRL5 PMADRL4 PMADRL3 PMADRL2 PMADRL1 PMADRL0 0000 0000 0000 0000 193h PMADRH — — — — PMADRH3 PMADRH2 PMADRH1 PMADRH0 ---- 0000 ---- 0000 194h PMDATL PMDATL7 PMDATL6 PMDATL5 PMDATL4 PMDATL3 PMDATL2 PMDATL1 PMDATL0 0000 0000 0000 0000 195h PMDATH — — PMDATH5 PMDATH4 PMDATH3 PMDATH2 PMDATH1 PMDATH0 --00 0000 --00 0000 ---- ---- ---- ---- 196h — Unimplemented — — 197h — Unimplemented — — 198h OSCCAL — FCALT6 FCALT5 FCALT4 FCALT3 FCALT2 FCALT1 FCALT0 xxxx xxxx uuuu uuuu 199h DOVCAL — — — — DOVT3 DOVT2 DOVT1 DOVT0 xxxx xxxx uuuu uuuu 19Ah TTACAL — — — — TTA3 TTA2 TTA1 TTA0 xxxx xxxx uuuu uuuu 19Bh BGRCAL Reserve d Reserved Reserved Reserved BGRT3 BGRT2 BGRT1 BGRT0 xxxx xxxx uuuu uuuu 19Ch VROCAL — — — — VROT3 VROT2 VROT1 VROT0 xxxx xxxx uuuu uuuu 19Dh ZROCAL — — — — ZROT3 ZROT2 ZROT1 ZROT0 xxxx xxxx uuuu uuuu LODIS BNCHEN DRVDIS 1--0 0001 1--0 0001 19Eh 19Fh — ATSTCON Legend: Note 1: 2: 3: 4: 5: Unimplemented — — — — HIDIS — — — = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented Other (non power-up) resets include MCLR Reset and Watchdog Timer Reset during normal operation. IRP & RP1 bits are reserved, always maintain these bits clear. RA3 pull-up is enabled when pin is configured as MCLR in Configuration Word. MCLR and WDT Reset does not affect the previous value data latch. The IOCF bit will be cleared upon reset but will set again if the mismatch exists. Only accessible when DBGEN = 0 and ICKBUG<INBUG> = 1. DS20002331B-page 76 2013 Microchip Technology Inc. MCP19110/11 11.3.0.1 OPTION Register Note 1: To achieve a 1:1 prescaler assignment for Timer0, assign the prescaler to the WDT by setting PSA bit to ‘1’ of the OPTION register. See Section 23.1.3 “Software Programmable Prescaler” The OPTION register is a readable and writable register, which contains various control bits to configure: • • • • Timer0/WDT prescaler External GPA2/INT interrupt Timer0 Weak pull-ups on PORTGPA and PORTGPB REGISTER 11-2: OPTION_REG: OPTION REGISTER (Note 1) R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 RAPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 RAPU: Port GPx Pull-up Enable bit 1 = Port GPx pull-ups are disabled 0 = Port GPx pull-ups are enabled bit 6 INTEDG: Interrupt Edge Select bit 0 = Interrupt on rising edge of INT pin 1 = Interrupt on falling edge of INT pin bit 5 T0CE: TMR0 Clock Source Select bit 1 = Transition on T0CKI pin 0 = Internal instruction cycle clock bit 4 T0SE: TMR0 Source Edge Select bit 1 = Increment on high-to-low transition on T0CKI pin 0 = Increment on low-to-high transition on T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is assigned to WDT 0 = Prescaler is assigned to the Timer0 module bit 2-0 PS<2:0>: Prescaler Rate Select bits Note 1: Bit Value TMR0 Rate WDT Rate 000 001 010 011 100 101 110 111 1: 2 1: 4 1: 8 1: 16 1: 32 1: 64 1: 128 1: 256 1: 1 1: 2 1: 4 1: 8 1: 16 1: 32 1: 64 1: 128 x = Bit is unknown Individual WPUx bit must also be enabled. 2013 Microchip Technology Inc. DS20002331B-page 77 MCP19110/11 11.4 11.4.3 PCL and PCLATH COMPUTED FUNCTION CALLS The Program Counter (PC) is 13 bits wide. The low byte comes from the PCL register, which is a readable and writable register. The high byte (PC<12:8>) is not directly readable or writable and comes from PCLATH. On any Reset, the PC is cleared. Figure 11-2 shows the two situations for loading the PC. The upper example in Figure 11-2 shows how the PC is loaded on a write to PCL (PCLATH<4:0> PCH). The lower example in Figure 11-2 shows how the PC is loaded during a CALL or GOTO instruction (PCLATH<4:3> PCH). A computed function CALL allows programs to maintain tables of functions and provides another way to execute state machines or look-up tables. When performing a table read using a computed function CALL, care should be exercised if the table location crosses a PCL memory boundary (each 256-byte block). FIGURE 11-2: 11.4.4 LOADING OF PC IN DIFFERENT SITUATIONS PCH 12 PCL 8 7 0 Instruction with PC Destination 5 8 PCLATH<4:0> ALU Result PCLATH PCH 12 11 10 8 7 PCL 0 PC GOTO, CALL 2 PCLATH<4:3> 11 Opcode <10:0> PCLATH 11.4.1 COMPUTED GOTO A computed GOTO is accomplished by adding an offset to the program counter (ADDWF PCL). Care should be exercised when jumping into a look-up table or program branch table (computed GOTO) by modifying the PCL register. Assuming that PCLATH is set to the table start address, if the table length is greater than 255 instructions or if the lower 8 bits of the memory address rolls over from 0xFFh to 0X00h in the middle of the table, then PCLATH must be incremented for each address rollover that occurs between the table beginning and the table location within the table. STACK The MCP19110/11 has an 8-level x 1-bit wide hardware stack (refer to Figure 11-1). The stack space is not part of either program or data space and the Stack Pointer is not readable or writable. The PC is PUSHed onto the stack when a CALL instruction is executed or an interrupt causes a branch. The stack is POPed in the event of a RETURN, RETLW or a RETFIE instruction execution. PCLATH is not affected by a PUSH or POP operation. The stack operates as a circular buffer. This means that after the stack has been PUSHed eight times, the ninth push overwrites the value that was stored from the first push. The tenth push overwrites the second push (and so on). Note 1: There are no Status bits to indicate Stack Overflow or Stack Underflow conditions. 2: There are no instructions/mnemonics called PUSH or POP. These are actions that occur from the execution of the CALL, RETURN, RETLW and RETFIE instructions or the vectoring to an interrupt address. MODIFYING PCL Executing any instruction with the PCL register as the destination simultaneously causes the Program Counter PC<12:8> bits (PCH) to be replaced by the contents of the PCLATH register. This allows the entire content of the program counter to be changed by writing the desired upper 5 bits to the PCLATH register. When the lower 8 bits are written to the PCL register, all 13 bits of the program counter will change to the values contained in the PCLATH register and those being written to the PCL register. 11.4.2 If using the CALL instruction, the PCH<2:0> and PCL registers are loaded with the operand of the CALL instruction. PCH<6:3> is loaded with PCLATH<6:3>. 11.5 Indirect Addressing, INDF and FSR Registers The INDF register is not a physical register. Addressing the INDF register will cause indirect addressing. Indirect addressing is possible by using the INDF register. Any instruction using the INDF register actually accesses data pointed to by the File Select Register (FSR). Reading INDF itself indirectly will produce 00h. Writing to the INDF register directly results in a no operation (although Status bits may be affected). An effective 9-bit address is obtained by concatenating the 8-bit FSR and the IRP bit of the STATUS register, as shown in Figure 11-3. A simple program to clear RAM location 40h-7Fh using indirect addressing is shown in Example 11-3. For more information, refer to Application Note AN556 – “Implementing a Table Read” (DS00556). DS20002331B-page 78 2013 Microchip Technology Inc. MCP19110/11 EXAMPLE 11-3: MOVLW MOVWF NEXT CLRF INCF BTFSS GOTO CONTINUE FIGURE 11-3: INDIRECT ADDRESSING 0x40 FSR INDF FSR FSR,7 NEXT ;initialize pointer ;to RAM ;clear INDF register ;inc pointer ;all done? ;no clear next ;yes continue DIRECT/INDIRECT ADDRESSING Direct Addressing RP1 RP0 6 Bank Select From Opcode Indirect Addressing 0 IRP 7 File Select Register Bank Select Location Select 00 01 10 0 Location Select 11 00h 180h Data Memory 7Fh 1FFh Bank 0 Bank 1 Bank 2 Bank 3 For memory map detail, see Figure 11-2. 2013 Microchip Technology Inc. DS20002331B-page 79 MCP19110/11 NOTES: DS20002331B-page 80 2013 Microchip Technology Inc. MCP19110/11 12.0 DEVICE CONFIGURATION Note: Device Configuration consists of Configuration Word, Code Protection and Device ID. 12.1 Configuration Word There are several Configuration Word bits that allow different timers to be enabled and memory protection options. These are implemented as Configuration Word at 2007h. REGISTER 12-1: The DBGEN bit in Configuration Word is managed automatically by device development tools, including debuggers and programmers. For normal device operation, this bit should be maintained as a '1'. CONFIG – CONFIGURATION WORD REGISTER R/P-1 U-1 R/P-1 R/P-1 U-1 U-1 DBGEN — WRT1 WRT0 — — bit 13 bit 8 U-1 R/P-1 R/P-1 R/P-1 R/P-1 U-1 U-1 U-1 — CP MCLRE PWRTE WDTE — — — bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 13 DBGEN: ICD Debug bit 1 = ICD debug mode disabled 0 = ICD debug mode enabled bit 12 Unimplemented: Read as ‘1’ bit 11-10 WRT<1:0>: Flash Program Memory Self Write Enable bit 11 = Write protection off 10 = 000h to 3FFh write protected, 400h to FFFh may be modified by PMCON1 control 01 = 000h to 7FFh write protected, 800h to FFFh may be modified by PMCON1 control 00 = 000h to FFFh write protected, entire program memory is write protected. bit 9-7 Unimplemented: Read as ‘1’ bit 6 CP: Code Protection 1 = Program memory code protection is disabled 0 = Program memory code protection is enabled bit 5 MCLRE: MCLR Pin Function Select 1 = MCLR pin is MCLR function and weak internal pull-up is enabled 0 = MCLR pin is alternate function, MCLR function is internally disabled bit 4 PWRTE: Power-up Timer Enable bit 1 = PWRT disabled 0 = PWRT enabled bit 3 WDTE: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled bit 2-0 Unimplemented: Read as ‘1’ 2013 Microchip Technology Inc. DS20002331B-page 81 MCP19110/11 12.2 Code Protection 12.4 Code protection allows the device to be protected from unauthorized access. Internal access to the program memory is unaffected by any code protection setting. 12.2.1 Four memory locations (2000h – 2003h) are designated as ID locations where the user can store checksum or other code identification numbers. These locations are not accessible during normal execution but are readable and writable during Program/Verify mode. Only the Least Significant seven bits of the ID locations are reported when using MPLAB Integrated Development Environment (IDE). PROGRAM MEMORY PROTECTION The entire program memory space is protected from external reads and writes by the CP bit in the Configuration Word. When CP = 0, external reads and writes of the program memory are inhibited and a read will return all ‘0’s. The CPU can continue to read program memory, regardless of the protection bit settings. Writing the program memory is dependent upon the write protection setting. See Section 12.3 “Write Protection” for more information. 12.3 ID Locations 12.5 Device ID and Revision ID The memory location 2006h is where the Device ID and Revision ID are stored. The upper nine bits hold the Device ID. The lower five bits hold the Revision ID. Development tools, such as device programmers and debuggers, may be used to read the Device ID and Revision ID. Write Protection Write protection allows the device to be protected from unintended self-writes. Applications, such as bootloader software, can be protected while allowing other regions of the program memory to be modified. The WRT<1:0> bits in the Configuration Word define the size of the program memory block that is protected. REGISTER 12-2: DEVICEID: DEVICE ID REGISTER(1) R R R R R R DEV<8:3> bit 13 R R bit 8 R R R DEV<2:0> R R R REV<4:0> bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 13-5 x = Bit is unknown DEV<8:0>: Device ID bits DEVICEID<13:0> Values Device bit 4-0 Note 1: DEV<8:0> REV<4:0> MCP19110 00 0111 111 x xx MCP19111 10 1111 100 x xxxx REV<4:0>: Revision ID bits These bits are used to identify the revision. This location cannot be written. DS20002331B-page 82 2013 Microchip Technology Inc. MCP19110/11 13.0 OSCILLATOR MODES 13.3 The MCP19110/11 has one oscillator configuration which is an 8 MHz internal oscillator. 13.1 Internal Oscillator (INTOSC) The Internal Oscillator module provides a system clock source of 8 MHz. The frequency of the internal oscillator can be trimmed with a calibration value in the OSCTUNE register. 13.2 Frequency Tuning in User Mode In addition to the factory calibration, the base frequency can be tuned in the user's application. This frequency tuning capability allows the user to deviate from the factory-calibrated frequency. The user can tune the frequency by writing to the OSCTUNE register (see Register 13-1). Oscillator Calibration The 8 MHz internal oscillator is factory calibrated. The factory calibration values reside in the read-only Calibration Word 1 register. These values must be read from the Calibration Word 1 register and stored in the OSCCAL register. Refer to Section 18.0 “Flash Program Memory Control” for the procedure on reading from program memory. Note 1: The FCAL<6:0> bits from the Calibration Word 1 register must be written into the OSCCAL register to calibrate the internal oscillator. REGISTER 13-1: OSCTUNE – OSCILLATOR TUNING REGISTER U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — TUN4 TUN3 TUN2 TUN1 TUN0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 TUN<4:0>: Frequency Tuning bits 01111 = Maximum frequency 01110 = • • • 00001 = 00000 = Center frequency. Oscillator Module is running at the calibrated frequency. 11111 = • • • 10000 = Minimum frequency 2013 Microchip Technology Inc. DS20002331B-page 83 MCP19110/11 13.3.1 OSCILLATOR DELAY UPON POWER-UP, WAKE-UP AND BASE FREQUENCY CHANGE On power up, the device is held in reset by the power-up time, if the power-up timer is enabled. In applications where the OSCTUNE register is used to shift the frequency of the internal oscillator, the application should not expect the frequency of the internal oscillator to stabilize immediately. In this case, the frequency may shift gradually toward the new value. The time for this frequency shift is less than eight cycles of the base frequency. TABLE 13-1: Following a wake-up from Sleep mode or POR, an internal delay of ~10 µs is invoked to allow the memory bias to stabilize before program execution can begin. SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page OSCTUNE — — — TUN4 TUN3 TUN2 TUN1 TUN0 83 Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by clock sources. TABLE 13-2: SUMMARY OF CALIBRATION WORD ASSOCIATED WITH CLOCK SOURCES Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 CALWD1 13:8 — — — — DOV3 DOV2 DOV1 DOV0 7:0 — FCAL6 FCAL5 FCAL4 FCAL3 FCAL2 FCAL1 FCAL0 Register on Page 59 Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by clock sources. DS20002331B-page 84 2013 Microchip Technology Inc. MCP19110/11 14.0 RESETS The reset logic is used to place the MCP19110/11 into a known state. The source of the reset can be determined by using the device status bits. There are multiple ways to reset this device: • • • • Power-on Reset (POR) Overtemperature Reset (OT) MCLR Reset WDT Reset To allow VDD to stabilize, an optional power-up timer can be enabled to extend the Reset time after a POR event. Some registers are not affected in any Reset condition; their status is unknown on POR and unchanged in any other Reset. Most other registers are reset to a “Reset state” on: • • • • Power-on Reset MCLR Reset MCLR Reset during Sleep WDT Reset WDT wake-up does not cause register resets in the same manner as a WDT Reset, since wake-up is viewed as the resumption of normal operation. TO and PD bits are set or cleared differently in different Reset situations, as indicated in Table 14-1. Software can use these bits to determine the nature of the Reset. See Table 14-2 for a full description of Reset states of all registers. A simplified block diagram of the On-Chip Reset Circuit is shown in Figure 14-1. The MCLR Reset path has a noise filter to detect and ignore small pulses. See Section 5.0 “Digital Electrical Characteristics” for pulse-width specifications. FIGURE 14-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT External Reset MCLR/VPP pin Sleep WDT Module VDD Rise Detect WDT Time-out Reset Power-on Reset VDD S PWRT On-Chip RC OSC Chip_Reset 11-bit Ripple Counter R Q Enable PWRT Note 1: Refer to the Configuration Word register (Register 12-1). TABLE 14-1: TIME-OUT IN VARIOUS SITUATIONS Power-up PWRTE = 0 PWRTE = 1 Wake-up from Sleep TPWRT — — 2013 Microchip Technology Inc. DS20002331B-page 85 MCP19110/11 TABLE 14-2: STATUS/PCON BITS AND THEIR SIGNIFICANCE POR TO PD Condition 0 1 1 Power-on Reset u 0 u WDT Reset u 0 0 WDT Wake-up u u u MCLR Reset during normal operation u 1 0 MCLR Reset during Sleep Legend: u = unchanged, x = unknown 14.1 Power-on Reset (POR) The on-chip POR circuit holds the chip in Reset until VDD has reached a high enough level for proper operation. To take advantage of the POR, simply connect the MCLR pin through a resistor to VDD. This will eliminate external RC components usually needed to create Power-on Reset. Note: The POR circuit does not produce an internal Reset when VDD declines. To re-enable the POR, VDD must reach VSS for a minimum of 100 µs. When the device starts normal operation (exits the Reset condition), device operating parameters (i.e., voltage, frequency, temperature, etc.) must be met to ensure proper operation. If these conditions are not met, the device must be held in Reset until the operating conditions are met. 14.2 MCLR MCP19110/11 has a noise filter in the MCLR Reset path. The filter will detect and ignore small pulses. It should be noted that a WDT Reset does not drive MCLR pin low. Voltages applied to the MCLR pin that exceed its specification can result in both MCLR Resets and excessive current beyond the device specification during the ESD event. For this reason, Microchip recommends that the MCLR pin no longer be tied directly to VDD. The use of an RC network, as shown in Figure 14-2, is suggested. An internal MCLR option is enabled by clearing the MCLRE bit in the Configuration Word register. When MCLRE = 0, the Reset signal to the chip is generated internally. When the MCLRE = 1, the MCLR pin becomes an external Reset input. In this mode, the MCLR pin has a weak pull-up to VDD. FIGURE 14-2: RECOMMENDED MCLR CIRCUIT VDD R2 MCLR SW1 (optional) 100 (needed with capacitor) MCP19110/11 R1 1 k (or greater) C1 0.1 µF (optional, not critical) DS20002331B-page 86 2013 Microchip Technology Inc. MCP19110/11 14.3 Power-up Timer (PWRT) The Power-up Timer provides a fixed 64 ms (nominal) time-out on power-up only, from POR Reset. The Power-up Timer operates from an internal RC oscillator. The chip is kept in Reset as long as PWRT is active. The PWRT delay allows the VDD to rise to an acceptable level. A Configuration bit (PWRTE), can disable (if set) or enable (if cleared or programmed) the Power-up Timer. The Power-up Timer delay will vary from chip-to-chip due to: • VDD variation • Temperature variation • Process variation Note: 14.4 Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up. Thus, a series resistor of 50-100 should be used when applying a “low” level to the MCLR pin, rather than pulling this pin directly to VSS. Watchdog Timer (WDT) Reset The Watchdog Timer generates a Reset if the firmware does not issue a CLRWDT instruction within the time-out period. The TO and PD bits in the STATUS register are changed to indicate the WDT Reset. See Section 17.0 “Watchdog Timer (WDT)” for more information. 14.5 Power-Up Timer The Power-up Timer optionally delays device execution after a POR event. This timer is typically used to allow VDD to stabilize before allowing the device to start running. The Power-up Timer is controlled by the PWRTE bit of Configuration Word. 14.6 Start-up Sequence Upon the release of a POR, the following must occur before the device will begin executing: • Power-up Timer runs to completion (if enabled) • Oscillator start-up timer runs to completion • MCLR must be released (if enabled) The total time-out will vary based on PWRTE bit status. For example, with PWRTE bit erased (PWRT disabled), there will be no time-out at all. Figures 14-3, 14-4 and 14-5 depict time-out sequences. Since the time-outs occur from the POR pulse, if MCLR is kept low long enough, the time-outs will expire. Then, bringing MCLR high will begin execution immediately (see Figure 14-4). This is useful for testing purposes or to synchronize more than one MCP19110/11 device operating in parallel. 14.6.1 POWER CONTROL (PCON) REGISTER The Power Control register PCON (address 8Eh) has two Status bits to indicate what type of Reset occurred last. FIGURE 14-3: TIME-OUT SEQUENCE ON POWER-UP (DELAYED MCLR): CASE 1 VDD MCLR Internal POR TPWRT PWRT Time-out TIOSCST OST Time-out Internal Reset 2013 Microchip Technology Inc. DS20002331B-page 87 MCP19110/11 FIGURE 14-4: TIME-OUT SEQUENCE ON POWER-UP (DELAYED MCLR): CASE 2 VDD MCLR Internal POR TPWRT PWRT Time-out TIOSCST OST Time-out Internal Reset TIME-OUT SEQUENCE ON POWER-UP (MCLR WITH VDD) FIGURE 14-5: VDD MCLR Internal POR TPWRT PWRT Time-out TIOSCST OST Time-out Internal Reset DS20002331B-page 88 2013 Microchip Technology Inc. MCP19110/11 TABLE 14-3: INITIALIZATION CONDITION FOR REGISTERS Address Power-on Reset MCLR Reset WDT Reset Wake-up from Sleep through Interrupt Wake-up from Sleep through WDT Time-out — xxxx xxxx uuuu uuuu uuuu uuuu INDF 00h/80h/ 100h/180h xxxx xxxx xxxx xxxx uuuu uuuu TMR0 01h/101h xxxx xxxx uuuu uuuu uuuu uuuu PCL 02h/82h/ 102h/182h 0000 0000 0000 0000 PC + 1(3) STATUS 03h/83h/ 103h/183h 0001 1xxx 000q quuu(4) uuuq quuu(4) FSR 04h/84h/ 104h/184h xxxx xxxx uuuu uuuu uuuu uuuu PORTGPA 05h xxxx xxxx uuuu uuuu uuuu uuuu PORTGPB 06h xxx- xxxx uuu- uuuu uuu- uuuu PIR1 07h -000 --00 -000 --00 -uuu --uu PIR2 08h 0-00 --00 0-00 --00 u-uu --uu PCON 09h ---- -qq- ---- -uu- ---- -uu- PCLATH 0Ah/8Ah/ 10Ah/18Ah ---0 0000 ---0 0000 ---u uuuu INTCON 0Bh/8Bh/ 10Bh/18Bh 0000 000x 0000 000u uuuu uuuu(2) TMR1L 0Ch xxxx xxxx uuuu uuuu uuuu uuuu TMR1H 0Dh xxxx xxxx uuuu uuuu uuuu uuuu T1CON 0Eh --00 --00 --uu --uu --uu --uu TMR2 0Fh 0000 0000 uuuu uuuu uuuu uuuu T2CON 10h ---- -000 ---- -000 ---- -uuu PR2 11h 1111 1111 1111 1111 uuuu uuuu PWMPHL 13h xxxx xxxx uuuu uuuu uuuu uuuu PWMPHH 14h xxxx xxxx uuuu uuuu uuuu uuuu PWMRL 15h xxxx xxxx uuuu uuuu uuuu uuuu PWMRH 16h xxxx xxxx uuuu uuuu uuuu uuuu OVCCON 19h 0000 0000 0000 0000 uuuu uuuu OVFCON 1Ah 0--0 0000 0--0 0000 u--u uuuu OSCTUNE 1Bh ---0 0000 ---0 0000 ---u uuuu (1) 1Ch xxxx xxxx uuuu uuuu uuuu uuuu ADRESH(1) 1Dh ---- --xx ---- --uu ---- ---uu ADCON0(1) 1Eh -000 0000 -000 0000 -uuu uuuu ADCON1(1) 1Fh -000 ---- -000 ---- -uuu ---- 81h/181h 1111 1111 1111 1111 uuuu uuuu 85h 1111 1111 1111 1111 uuuu uuuu 86h 1111 1111 1111 1111 uuuu uuuu Register W ADRESL OPTION_REG TRISGPA TRISGPB Legend: Note 1: 2: 3: 4: u = unchanged, x = unknown, – = unimplemented bit, reads as ‘0’, q = value depends on condition. If VDD goes too low, Power-on Reset will be activated and registers will be affected differently. One or more bits in INTCON and/or PIRx will be affected (to cause wake-up). When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h). See Table 14-5 for Reset value for specific condition. 2013 Microchip Technology Inc. DS20002331B-page 89 MCP19110/11 TABLE 14-3: INITIALIZATION CONDITION FOR REGISTERS (CONTINUED) Address Power-on Reset MCLR Reset WDT Reset Wake-up from Sleep through Interrupt Wake-up from Sleep through WDT Time-out PIE1 87h -000 --00 -000 --00 -uuu --uu PIE2 88h 0-00 --00 0-00 --00 u-uu --uu APFCON 89h ---- ---0 ---- ---0 ---- ---u VINLVL 90h 0-xx xxxx 0-uu uuuu u-uu uuuu OCCON 91h 0xxx xxxx 0uuu uuuu uuuu uuuu CSGSCON 93h -xxx xxxx -uuu uuuu -uuu uuuu CSDGCON 95h 0--- xxxx 0--- uuuu u--- uuuu VZCCON 97h xxxx xxxx uuuu uuuu uuuu uuuu CMPZCON 98h xxxx xxxx uuuu uuuu uuuu uuuu OUVCON 99h xxxx xxxx uuuu uuuu uuuu uuuu OOVCON 9Ah xxxx xxxx uuuu uuuu uuuu uuuu DEADCON 9Bh xxxx xxxx uuuu uuuu uuuu uuuu SLPCRCON 9Ch xxxx xxxx uuuu uuuu uuuu uuuu SLVGNCON 9Dh ---x xxxx ---u uuuu ---u uuuu RELEFF 9Eh 0000 0000 0000 0000 uuuu uuuu WPUGPA 105h --1- 1111 --u- uuuu --u- uuuu WPUGPB 106h 1111 -11- uuuu -uu- uuuu -uu- PE1 107h 0000 1100 0000 1100 uuuu uuuu BUFFCON 108h 000- 0000 000- 0000 uuu- uuuu ABECON 109h 0000 0000 0000 0000 uuuu uuuu SSPADD 110h 0000 0000 0000 0000 uuuu uuuu SSPBUF 111h xxxx xxxx uuuu uuuu uuuu uuuu SSPCON1 112h 0000 0000 0000 0000 uuuu uuuu SSPCON2 113h 0000 0000 0000 0000 uuuu uuuu SSPCON3 114h 0000 0000 0000 0000 uuuu uuuu SSPMSK 115h 1111 1111 1111 1111 uuuu uuuu SSPSTAT 116h SSPADD2 117h 0000 0000 0000 0000 uuuu uuuu Register SSPMSK2 118h 1111 1111 1111 1111 uuuu uuuu IOCA 185h 0000 0000 0000 0000 uuuu uuuu IOCB 186h 0000 -000 0000 -000 uuuu -uuu ANSELA 187h ---- 1111 ---- 1111 ---- uuuu ANSELB 188h --11 -11- --11 -11- --uu -uu- PMCON1 190h -0-- -000 -0-- -000 -u-- -uuu PMCON2 191h ---- ---- ---- ---- ---- ---- PMADRL 192h 0000 0000 0000 0000 uuuu uuuu PMADRH 193h ---- -000 ---- -000 ---- -uuu PMDATL 194h 0000 0000 0000 0000 uuuu uuuu Legend: Note 1: 2: 3: 4: u = unchanged, x = unknown, – = unimplemented bit, reads as ‘0’, q = value depends on condition. If VDD goes too low, Power-on Reset will be activated and registers will be affected differently. One or more bits in INTCON and/or PIRx will be affected (to cause wake-up). When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h). See Table 14-5 for Reset value for specific condition. DS20002331B-page 90 2013 Microchip Technology Inc. MCP19110/11 TABLE 14-3: INITIALIZATION CONDITION FOR REGISTERS (CONTINUED) Address Power-on Reset MCLR Reset WDT Reset Wake-up from Sleep through Interrupt Wake-up from Sleep through WDT Time-out PMDATH 195h --00 0000 --00 0000 --uu uuuu OSCCAL 198h -xxx xxxx -uuu uuuu -uuu uuuu DOVCAL 199h ---- xxxx ---- uuuu ---- uuuu TTACAL 19Ah ---- xxxx ---- uuuu ---- uuuu BGRCAL 19Bh ---- xxxx ---- uuuu ---- uuuu VROCAL 19Ch ---- xxxx ---- uuuu ---- uuuu ZROCAL 19Dh ---- xxxx ---- uuuu ---- uuuu 19F 1--- 0001 1--- 0001 u--- uuuu Register ATSTCON Legend: Note 1: 2: 3: 4: 14.7 u = unchanged, x = unknown, – = unimplemented bit, reads as ‘0’, q = value depends on condition. If VDD goes too low, Power-on Reset will be activated and registers will be affected differently. One or more bits in INTCON and/or PIRx will be affected (to cause wake-up). When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h). See Table 14-5 for Reset value for specific condition. Determining the Cause of a Reset TABLE 14-4: Upon any Reset, multiple bits in the STATUS and PCON register are updated to indicate the cause of the Reset. Table 14-4 and Table 14-5 show the Reset conditions of these registers. TABLE 14-5: POR TO RESET STATUS BITS AND THEIR SIGNIFICANCE PD Condition 0 1 1 Power-on Reset u 0 u WDT Reset u 0 0 WDT Wake-up from Sleep u 1 0 Interrupt Wake-up from Sleep u u u MCLR Reset during normal operation u 1 0 MCLR Reset during Sleep 0 0 x Not allowed. TO is set on POR 0 x 0 Not allowed. PD is set on POR RESET CONDITION FOR SPECIAL REGISTERS (Note 2) Program Counter STATUS Register PCON Register Power-on Reset 0000h 0001 1xxx ---- -u0- MCLR Reset during normal operation 0000h 000u uuuu ---- -uu- MCLR Reset during Sleep 0000h 0001 0uuu ---- -uu- WDT Reset 0000h 0000 uuuu ---- -uu- WDT Wake-up from Sleep PC + 1 uuu0 0uuu ---- -uu- PC + 1(1) uuu1 0uuu ---- -uu- Condition Interrupt Wake-up from Sleep Legend: Note 1: 2: u = unchanged, x = unknown, - = unimplemented bit, reads as ‘0’. When the wake-up is due to an interrupt and Global Enable bit (GIE) is set, the return address is pushed on the stack and PC is loaded with the interrupt vector (0004h) after execution of PC + 1. If a Status bit is not implemented, that bit will be read as ‘0’. 2013 Microchip Technology Inc. DS20002331B-page 91 MCP19110/11 14.8 Power Control (PCON) Register The Power Control (PCON) register contains flag bits to differentiate between a: • Power-on Reset (POR) • Overtemperature (OT) The PCON register bits are shown in Register 14-1. REGISTER 14-1: PCON – POWER CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 U-0 — — — — — OT POR — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-3 Unimplemented: Read as '0' bit 2 OT: Overtemperature Reset Status bit 1 = No Overtemperature Reset occurred 0 = An Overtemperature Reset occurred (must be set in software after an Overtemperature occurs) bit 1 POR: Power-on Reset Status bit 1 = No Power-on Reset occurred 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0 Unimplemented: Read as '0' TABLE 0-1: Name PCON STATUS SUMMARY OF REGISTERS ASSOCIATED WITH RESETS Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page — — — — — OT POR — 92 IPR RP1 RP0 TO PD Z DC C 71 Legend: — = unimplemented bit, reads as ‘0’. Shaded cells are not used by Resets. Note 1: Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation. DS20002331B-page 92 2013 Microchip Technology Inc. MCP19110/11 15.0 INTERRUPTS The MCP19110/11 has multiple sources of interrupt: • • • • • • • • • • • • External Interrupt (INT pin) Interrupt-On-Change (IOC) Interrupts Timer0 Overflow Interrupt Timer1 Overflow Interrupt Timer2 Match Interrupt ADC Interrupt System Overvoltage Error System Undervoltage Error System Overcurrent Error SSP BCL System Input Undervoltage Error The Interrupt Control register (INTCON) and Peripheral Interrupt Request Registers (PIRx) record individual interrupt requests in flag bits. The INTCON register also has individual and global interrupt enable bits. The Global Interrupt Enable bit, GIE of the INTCON register, enables (if set) all unmasked interrupts, or disables (if cleared) all interrupts. Individual interrupts can be disabled through their corresponding enable bits in the INTCON register and PIEx registers. GIE is cleared on Reset. When an interrupt is serviced, the following actions occur automatically: • The GIE is cleared to disable any further interrupt. • The return address is pushed onto the stack. • The PC is loaded with 0004h. 15.1 Interrupt Latency For external interrupt events, such as the INT pin or PORTGPx change interrupt, the interrupt latency will be three or four instruction cycles. The exact latency depends upon when the interrupt event occurs (see Figure 15-2). The latency is the same for one or two-cycle instructions. 15.2 GPA2/INT Interrupt The external interrupt on the GPA2/INT pin is edge-triggered; either on the rising edge, if the INTEDG bit of the OPTION register is set, or the falling edge, if the INTEDG bit is cleared. When a valid edge appears on the GPA2/INT pin, the INTF bit of the INTCON register is set. This interrupt can be disabled by clearing the INTE control bit of the INTCON register. The INTF bit must be cleared by software in the Interrupt Service Routine before re-enabling this interrupt. The GPA2/INT interrupt can wake-up the processor from Sleep, if the INTE bit was set prior to going into Sleep. See Section 16.0 “Power-Down Mode (Sleep)” for details on Sleep, and Section 16.1 “Wake-up from Sleep” for timing of wake-up from Sleep through GPA2/INT interrupt. Note: The ANSEL register must be initialized to configure an analog channel as a digital input. Pins configured as analog inputs will read ‘0’ and cannot generate an interrupt. The firmware within the Interrupt Service Routine (ISR) should determine the source of the interrupt by polling the interrupt flag bits. The interrupt flag bits must be cleared before exiting the ISR, to avoid repeated interrupts. Because the GEI bit is cleared, any interrupt that occurs while executing the ISR will be recorded through its interrupt flag, but will not cause the processor to redirect to the interrupt vector. Note 1: Individual interrupt flag bits are set, regardless of the status of their corresponding mask bit or the GIE bit. 2: When an instruction that clears the GIE bit is executed, any interrupts that were pending for execution in the next cycle are ignored. The interrupts, which were ignored, are still pending to be serviced when the GIE bit is set again. The RETFIE instruction exists the ISR by popping the previous address from the stack, restoring the saved context from the shadow registers and setting the GIE bit. For additional information on a specific Interrupt’s operation, refer to its Peripheral chapter. 2013 Microchip Technology Inc. DS20002331B-page 93 MCP19110/11 FIGURE 15-1: INTERRUPT LOGIC UVIF UVIE OVIF OVIE OCIF OCIE VINIF VINIE T0IF T0IE INTF INTE IOCF IOCE ADIF ADIE BCLIF BCLIE Wake-up (If in Sleep mode) Interrupt to CPU PEIF PEIE SSPIF SSPIE GIE TMR2IF TMR2IE TMR1IF TMR1IE FIGURE 15-2: INT PIN INTERRUPT TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 CLKIN (3) CLKOUT (4) INT pin (1) (1) INTF flag (INTCON reg.) (5) Interrupt Latency(2) GIE bit (INTCON reg.) INSTRUCTION FLOW PC PC Instruction Fetched Instruction Executed Inst (PC) Inst (PC – 1) PC + 1 Inst (PC + 1) Inst (PC) PC + 1 — Dummy Cycle 0004h 0005h Inst (0004h) Inst (0005h) Dummy Cycle Inst (0004h) Note 1: INTF flag is sampled here (every Q1). 2: Asynchronous interrupt latency = 3-4 TCY. Synchronous latency = 3 TCY, where TCY = instruction cycle time. Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction. 3: CLKOUT is available only in INTOSC and RC Oscillator modes. 4: For minimum width of INT pulse, refer to AC specifications in Section 5.0 “Digital Electrical Characteristics”. 5: INTF is enabled to be set any time during the Q4-Q1 cycles. DS20002331B-page 94 2013 Microchip Technology Inc. MCP19110/11 15.3 Interrupt Control Registers 15.3.1 Note: INTCON REGISTER The INTCON register is a readable and writable register, that contains the various enable and flag bits for the TMR0 register overflow, interrupt-on-change and external INT pin interrupts. REGISTER 15-1: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. INTCON – INTERRUPT CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-x GIE PEIE T0IE INTE IOCE T0IF INTF IOCF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 GIE: Global Interrupt Enable bit 1 = Enables all unmasked interrupts 0 = Disables all interrupts bit 6 PEIE: Peripheral Interrupt Enable bit 1 = Enables all unmasked peripheral interrupts 0 = Disables all peripheral interrupts bit 5 T0IE: TMR0 Overflow Interrupt Enable bit 1 = Enables the TMR0 interrupt 0 = Disables the TMR0 interrupt bit 4 INTE: INT External Interrupt Enable bit 1 = Enables the INT external interrupt 0 = Disables the INT external interrupt bit 3 IOCE: Interrupt-on-Change Enable bit(1) 1 = Enables the interrupt-on-change 0 = Disables the interrupt-on-change bit 2 T0IF: TMR0 Overflow Interrupt Flag bit(2) 1 = TMR0 register has overflowed (must be cleared in software) 0 = TMR0 register did not overflow bit 1 INTF: External Interrupt Flag bit 1 = The external interrupt occurred (must be cleared in software) 0 = The external interrupt did not occur bit 0 IOCF: Interrupt-on-Change Interrupt Flag bit 1 = When at least one of the interrupt-on-change pins changed state 0 = None of the interrupt-on-change pins have changed state Note 1: 2: x = Bit is unknown IOC register must also be enabled. T0IF bit is set when TMR0 rolls over. TMR0 is unchanged on Reset and should be initialized before clearing T0IF bit. 2013 Microchip Technology Inc. DS20002331B-page 95 MCP19110/11 15.3.1.1 PIE1 Register The PIE1 register contains the Peripheral Interrupt Enable bits, as shown in Register 15-2. Note 1: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. REGISTER 15-2: PIE1 – PERIPHERAL INTERRUPT ENABLE REGISTER 1 U-0 R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 — ADIE BCLIE SSPIE — — TMR2IE TMR1IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 UNIMPLEMENTED: Read as '0' bit 6-0 ADIE: ADC Interrupt Enable bit 1 = Enables the ADC interrupt 0 = Disables the ADC interrupt bit 6-0 BCLIE: MSSP Bus Collision Interrupt Enable bit 1 = Enables the MSSP Bus Collision Interrupt 0 = Disables the MSSP Bus Collision Interrupt bit 6-0 SSPIE: Synchronous Serial Port (MSSP) Interrupt Enable bit 1 = Enables the MSSP interrupt 0 = Disables the MSSP interrupt bit 6-0 UNIMPLEMENTED: Read as 0 bit 6-0 TMR2IE: Timer2 Interrupt Enable 1 = Enables the Timer2 interrupt 0 = Disables the Timer2 interrupt bit 6-0 TMR1IE: Timer1 Interrupt Enable 1 = Enables the Timer1 interrupt 0 = Disables the Timer1 interrupt DS20002331B-page 96 x = Bit is unknown 2013 Microchip Technology Inc. MCP19110/11 15.3.1.2 PIE2 Register The PIE2 register contains the Peripheral Interrupt Enable bits, as shown in Register 15-3. Note 1: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. REGISTER 15-3: PIE2 – PERIPHERAL INTERRUPT ENABLE REGISTER 2 U-0 U-0 R/W-0 R/W-0 U-0 U-0 R/W-0 U-0 UVIE — OCIE OVIE — — VINIE — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 UVIE: Output Undervoltage Interrupt enable bit 1 = Enables the UV interrupt 0 = Disables the UV interrupt bit 6 UNIMPLEMENTED: Read as '0' bit 5 OCIE: Output Overcurrent Interrupt enable bit 1 = Enables the OC interrupt 0 = Disables the OC interrupt bit 4 OVIE: Output Overvoltage Interrupt enable bit 1 = Enables the OV interrupt 0 = Disables the OV interrupt bit 3-2 UNIMPLEMENTED: Read as '0' bit 1 VINIE: VIN UVLO Interrupt Enable 1 = Enables the VIN UVLO interrupt 0 = Disables the VIN UVLO interrupt bit 0 UNIMPLEMENTED: Read as '0' 2013 Microchip Technology Inc. x = Bit is unknown DS20002331B-page 97 MCP19110/11 15.3.1.3 PIR1 Register The PIR1 register contains the Peripheral Interrupt Flag bits, as shown in Register 15-4. Note 1: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. REGISTER 15-4: PIR1 – PERIPHERAL INTERRUPT FLAG REGISTER 1 U-0 R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 — ADIF BCLIF SSPIF — — TMR2IF TMR1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 UNIMPLEMENTED: Read as '0' bit 6 ADIF: ADC Interrupt Flag bit 1 = ADC conversion complete 0 = ADC conversion has not completed or has not been started bit 5 BCLIF: MSSP Bus Collision Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 4 SSPIF: Synchronous Serial Port (MSSP) Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 3-2 UNIMPLEMENTED: Read as '0' bit 1 TMR2IF: Timer2 to PR2 Match Interrupt Flag 1 = Timer2 to PR2 match occurred (must be cleared in software) 0 = Timer2 to PR2 match did not occur bit 0 TMR1IF: Timer1 Interrupt Flag 1 = Timer1 rolled over (must be cleared in software) 0 = Timer1 has not rolled over DS20002331B-page 98 x = Bit is unknown 2013 Microchip Technology Inc. MCP19110/11 15.3.1.4 PIR2 Register The PIR2 register contains the Peripheral Interrupt Flag bits, as shown in Register 15-5. Note 1: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. REGISTER 15-5: PIR2 – PERIPHERAL INTERRUPT FLAG REGISTER 2 R/W-0 U-0 R/W-0 R/W-0 U-0 U-0 R/W-0 U-0 UVIF — OCIF OVIF — — VINIF — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 UVIF: Output undervoltage error interrupt flag bit 1 = Output undervoltage error has occurred 0 = Output undervoltage error has not occurred bit 6 UNIMPLEMENTED: Read as '0' bit 5 OCIF: Output overcurrent error interrupt flag bit 1 = Output overcurrent error has occurred 0 = Output overcurrent error has not occurred bit 4 OVIF: Output overvoltage error interrupt flag bit 1 = Output overvoltage error has occurred 0 = Output overvoltage error has not occurred bit 3-2 UNIMPLEMENTED: Read as '0' bit 1 VINIF: VIN Status bit 1 = VIN is below acceptable level 0 = VIN is at acceptable level bit 0 UNIMPLEMENTED: Read as '0' TABLE 15-1: Name INTCON x = Bit is unknown SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page GIE PEIE T0IE INTE IOCE T0IF INTF IOCF 95 RAPU INTEDG T0CE T0SE PSA PS2 PS1 PS0 77 PIE1 — ADIE BCLIE SSPIE — — TMR2IE TMR1IE 96 OPTION_REG PIE2 UVIE — OCIE OVIE — — VINIE — 97 PIR1 — ADIF BCLIF SSPIF — — TMR2IF TMR1IF 98 PIR2 UVIF — OCIF OVIF — — VINIF — 99 Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by Interrupts. 2013 Microchip Technology Inc. DS20002331B-page 99 MCP19110/11 15.4 Context Saving During Interrupts During an interrupt, only the return PC value is saved on the stack. Typically, users may wish to save key registers during an interrupt (e.g., W and STATUS registers). This must be implemented in software. Temporary holding registers W_TEMP and STATUS_TEMP should be placed in the last 16 bytes of GPR (see Figure 11-2). These 16 locations are common to all banks and do not require banking. This makes context save and restore operations simpler. The code shown in Example 15-1 can be used to: • • • • • Store the W register Store the STATUS register Execute the ISR code Restore the Status (and Bank Select Bit register) Restore the W register Note: The MCP19110/11 device does not require saving the PCLATH. However, if computed GOTOs are used in both the ISR and the main code, the PCLATH must be saved and restored in the ISR. EXAMPLE 15-1: MOVWF SWAPF SAVING STATUS AND W REGISTERS IN RAM W_TEMP STATUS,W MOVWF STATUS_TEMP : :(ISR) : SWAPF STATUS_TEMP,W MOVWF SWAPF SWAPF STATUS W_TEMP,F W_TEMP,W DS20002331B-page 100 ;Copy W to TEMP ;Swap status to ;Swaps are used ;Save status to register be saved into W because they do not affect the status bits bank zero STATUS_TEMP register ;Insert user code here ;Swap STATUS_TEMP register into W ;(sets bank to original state) ;Move W into STATUS register ;Swap W_TEMP ;Swap W_TEMP into W 2013 Microchip Technology Inc. MCP19110/11 16.0 POWER-DOWN MODE (SLEEP) 16.1 Wake-up from Sleep The Power-Down mode is entered by executing a SLEEP instruction. The device can wake-up from Sleep through one of the following events: Upon entering Sleep mode, the following conditions exist: 1. 2. 3. 4. 5. 1. 2. 3. 4. 5. 6. 7. 8. 9. WDT will be cleared but keeps running, if enabled for operation during Sleep. PD bit of the STATUS register is cleared. TO bit of the STATUS register is set. CPU clock is not disabled. Timer1 oscillator is unaffected, and peripherals that operate from it may continue operation in Sleep. ADC is unaffected. I/O ports maintain the status they had before SLEEP was executed (driving high, low or high-impedance). Resets other than WDT are not affected by Sleep mode. Analog circuitry is unaffected by execution of SLEEP instruction. Refer to individual chapters for more details on peripheral operation during Sleep. To minimize current consumption, the following conditions should be considered: • • • • • I/O pins should not be floating External circuitry sinking current from I/O pins Internal circuitry sourcing current from I/O pins Current draw from pins with internal weak pull-ups Modules using Timer1 oscillator I/O pins that are high-impedance inputs should be pulled to VDD or GND externally to avoid switching currents caused by floating inputs. The SLEEP instruction does not affect the analog circuitry. The enable state of the analog circuitry does not change with the execution of the SLEEP instruction. External Reset input on MCLR pin, if enabled POR Reset Watchdog Timer, if enabled Any external interrupt Interrupts by peripherals capable of running during Sleep (see individual peripheral for more information) The first two events will cause a device Reset. The last three events are considered a continuation of program execution. To determine whether a device Reset or Wake-up event occurred, refer to Section 14.7 “Determining the Cause of a Reset”. The following peripheral interrupts can wake the device from Sleep: 1. 2. 3. 4. Timer1 interrupt. Timer1 must be operating as an asynchronous counter A/D conversion Interrupt-on-change External Interrupt from INT pin When the SLEEP instruction is being executed, the next instruction (PC + 1) is prefetched. For the device to wake-up through an interrupt event, the corresponding interrupt enable bit must be enabled. Wake-up will occur regardless of the state of the GIE bit. If the GIE bit is disabled, the device continues execution at the instruction after the SLEEP instruction. If the GIE bit is enabled, the device executes the instruction after the SLEEP instruction, the device will then call the Interrupt Service Routine. In cases where the execution of the instruction following SLEEP is not desirable, the user should have an NOP after the SLEEP instruction. The WDT is cleared when the device wakes up from Sleep, regardless of the source of wake-up. Examples of internal circuitry that might be sourcing current include modules, such as the DAC. See Section 22.0 “Analog-to-Digital Converter (ADC) Module” for more information on this module. 2013 Microchip Technology Inc. DS20002331B-page 101 MCP19110/11 16.1.1 WAKE-UP USING INTERRUPTS When global interrupts are disabled (GIE cleared) and any interrupt source has both its interrupt enable bit and interrupt flag bit set, one of the following will occur: • If the interrupt occurs before the execution of a SLEEP instruction: - SLEEP instruction will execute as an NOP - WDT and WDT prescaler will not be cleared - TO bit of the STATUS register will not be set - PD bit of the STATUS register will not be cleared FIGURE 16-1: • If the interrupt occurs during or after the execution of a SLEEP instruction: - SLEEP instruction will be completely executed - Device will immediately wake-up from Sleep - WDT and WDT prescaler will be cleared - TO bit of the STATUS register will be set - PD bit of the STATUS register will be cleared Even if the flag bits were checked before executing a SLEEP instruction, it may be possible for flag bits to become set before the SLEEP instruction completes. To determine whether a SLEEP instruction executed, test the PD bit. If the PD bit is set, the SLEEP instruction was executed as an NOP. WAKE-UP FROM SLEEP THROUGH INTERRUPT Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC TOST Interrupt Latency(1) Interrupt flag GIE bit (INTCON reg.) Processor in Sleep Instruction Flow PC PC PC + 1 Instruction Inst(PC) = Sleep Inst(PC + 1) Fetched Instruction Sleep Inst(PC - 1) Executed PC + 2 PC + 2 PC + 2 0004h Inst(0004h) Inst(PC + 2) Inst(PC + 1) Dummy Cycle Dummy Cycle 0005h Inst(0005h) Inst(0004h) Note 1: GIE = 1 assumed. In this case, after wake-up, the processor calls the ISR at 0004h. If GIE = 0, execution will continue in-line. TABLE 16-1: Name INTCON SUMMARY OF REGISTERS ASSOCIATED WITH POWER-DOWN MODE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page GIE PEIE T0IE INTE IOCE T0IF INTF IOCF 95 IOCA IOCA7 IOCA6 IOCA5 IOCA4 IOCA3 IOCA2 IOCA1 IOCA0 122 IOCB IOCB7 IOCB6 IOCB5 IOCB4 — IOCB2 IOCB1 IOCB0 122 PIE1 — ADIE BCLIE SSPIE — — TMR2IE TMR1IE 96 PIE2 UVIE — OCIE OVIE — — VINIE — 97 PIR1 — ADIF BCLIF SSPIF — — TMR2IF TMR1IF 98 PIR2 UVIF — OCIF OVIF — — VINIF — 99 IRP RP1 RP0 TO PD Z DC C 71 STATUS Legend: — = unimplemented, read as ‘0’. Shaded cells are not used in Power-down mode. DS20002331B-page 102 2013 Microchip Technology Inc. MCP19110/11 17.0 WATCHDOG TIMER (WDT) 17.2 The WDT has a nominal time-out period of 18 ms (with no prescaler). The time-out periods vary with temperature, VDD and process variations from part to part (see Table 5-4). If longer time-out periods are desired, a prescaler with a division ratio of up to 1:128 can be assigned to the WDT under software control by writing to the OPTION register. Thus, time-out periods up to 2.3 seconds can be realized. The Watchdog Timer is a free-running timer. The WDT is enabled by setting the WDTE bit of the Configuration Word (default setting). During normal operation, a WDT time-out generates a device Reset. If the device is in Sleep mode, a WDT time-out causes the device to wake-up and continue with normal operation. The WDT can be permanently disabled by clearing the WDTE bit of the Configuration word. See Section 12.1 “Configuration Word” for more information. 17.1 The CLRWDT and SLEEP instructions clear the WDT and the prescaler, if assigned to the WDT, and prevent it from timing out and generating a device Reset. The TO bit in the STATUS register will be cleared upon a Watchdog Timer time-out. Watchdog Timer (WDT) Operation During normal operation, a WDT time-out generates a device RESET. If the device is in SLEEP mode, a WDT time-out causes the device to wake-up and continue with normal operation; this is known as a WDT wakeup. The WDT can be permanently disabled by clearing the WDTE configuration bit. 17.3 WDT Programming Considerations Under worst-case conditions (i.e., VDD = Minimum, Temperature = Maximum, Maximum WDT prescaler), it may take several seconds before a WDT time-out occurs. The postscaler assignment is fully under software control and can be changed during program execution. FIGURE 17-1: WDT Period WATCHDOG TIMER WITH SHARED PRESCALER BLOCK DIAGRAM FOSC/4 Data Bus 0 8 1 Sync 2 TCY 1 T0CKI pin T0SE TMR0 0 0 T0CS Set Flag bit T0IF on Overflow PSA 8-bit Prescaler 1 PSA 8 PS<2:0> Watchdog Timer 1 WDT Time-out 0 PSA WDTE Note 1: T0SE, T0CS, PSA, PS<2:0> are bits in the OPTION_REG register. 2: WDTE bit is in the Configuration Word register. 2013 Microchip Technology Inc. DS20002331B-page 103 MCP19110/11 TABLE 17-1: WDT STATUS Conditions WDT WDTE = 0 CLRWDT Command Cleared Exit Sleep TABLE 17-2: SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 OPTION_REG RAPU INTEDG T0CS T0SE PSA Bit 2 Bit 1 Bit 0 PS<2:0> Register on Page 77 Legend: Shaded cells are not used by the Watchdog Timer. TABLE 17-3: SUMMARY OF CONFIGURATION WORD ASSOCIATED WITH WATCHDOG TIMER Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register on Page CONFIG 13:8 — — DBGEN — WRT1 WRT0 — — 81 7:0 — CP MCLRE PWRTE WDTE — — — Legend: — = unimplemented location, read as ‘1’. Shaded cells are not used by Watchdog Timer. DS20002331B-page 104 2013 Microchip Technology Inc. MCP19110/11 18.0 FLASH PROGRAM MEMORY CONTROL The Flash program memory is readable and writable during normal operation (full VIN range). This memory is not directly mapped in the register file space. Instead, it is indirectly addressed through the Special Function Registers (SFR) (see Registers 18-1 to 185). There are six SFRs used to read and write this memory: • • • • • • PMCON1 PMCON2 PMDATL PMDATH PMADRL PMADRH When interfacing the program memory block, the PMDATL and PMDATH registers form a two-byte word, which holds the 14-bit data for read/write, and the PMADRL and PMADRH registers form a two-byte word, which holds the 13-bit address of the FLASH location being accessed. These devices have 4K words of program Flash with an address range from 0000h to 0FFFh. The program memory allows single word read and a four-word write. A four-word write automatically erases the row of the location and writes the new data (erase before write). The write time is controlled by an on-chip timer. The write/erase voltages are generated by an on-chip charge pump rated to operate over the voltage range of the device for byte or word operations. 18.1 PMADRH and PMADRL Registers The PMADRH and PMADRL registers can address up to a maximum of 4K words of program memory. When selecting a program address value, the Most Significant Byte (MSB) of the address is written to the PMADRH register and the Least Significant Byte (LSB) is written to the PMADRL register. 18.2 PMCON1 and PMCON2 Registers PMCON1 is the control register for the data program memory accesses. Control bits RD and WR initiate read and write, respectively. These bits cannot be cleared, only set in software. They are cleared in hardware at completion of the read or write operation. The inability to clear the WR bit in software prevents the accidental premature termination of a write operation. The WREN bit, when set, will allow a write operation. On power-up, the WREN bit is clear. The CALSEL bit allows the user to read locations in test memory in case there are calibration bits stored in the calibration word locations that need to be transferred to SFR trim registers. The CALSEL bit is only for reads, and if a write operation is attempted with CALSEL = 1, no write will occur. PMCON2 is not a physical register. Reading PMCON2 will read all '0's. The PMCON2 register is used exclusively in the flash memory write sequence. When the device is code protected, the CPU may continue to read and write the Flash program memory. Depending on the settings of the Flash Program Memory Enable (WRT<1:0>) bits, the device may or may not be able to write certain blocks of the program memory, however, reads of the program memory are allowed. When the Flash Program Memory Code Protection (CP) bit is enabled, the program memory is code protected, and the device programmer (ICSP) cannot access data or program memory. 2013 Microchip Technology Inc. DS20002331B-page 105 MCP19110/11 18.3 Flash Program Memory Control Registers REGISTER 18-1: R/W-0 PMDATL: PROGRAM MEMORY DATA LOW BYTE REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PMDATL<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 x = Bit is unknown PMDATL<7:0>: 8 Least Significant Data bits Read from Program Memory REGISTER 18-2: R/W-0 PMADRL: PROGRAM MEMORY ADDRESS LOW BYTE REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PMADRL<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 x = Bit is unknown PMADRL<7:0>: 8 Least Significant Address bits for Program Memory Read/Write Operation REGISTER 18-3: PMDATH: PROGRAM MEMORY DATA HIGH BYTE REGISTER U-0 U-0 — — R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PMDATH<5:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 PMDATH<5:0>: 6 Most Significant Data bits Read from Program Memory DS20002331B-page 106 2013 Microchip Technology Inc. MCP19110/11 REGISTER 18-4: PMADRH: PROGRAM MEMORY ADDRESS HIGH BYTE REGISTER U-0 U-0 U-0 U-0 — — — — R/W-0 R/W-0 R/W-0 R/W-0 PMADRH<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-4 Unimplemented: Read as ‘0’ bit 3-0 PMADRH<3:0>: Specifies the 4 Most Significant Address bits or High bits for Program Memory Reads. REGISTER 18-5: PMCON1: PROGRAM MEMORY CONTROL REGISTER 1 U-1 R/W-0 U-0 U-0 U-0 R/W-0 R/S-0 R/S-0 — CALSEL — — — WREN WR RD bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown S = Bit can only be set bit 7 Unimplemented: Read as '1' bit 6 CALSEL: Program Memory calibration space select bit 1 = Select test memory area for reads only (for loading calibration trim registers) 0 = Select user area for reads bit 5-3 Unimplemented: Read as '0' bit 2 WREN: Program Memory Write Enable bit 1 = Allows write cycles 0 = Inhibits write to the Flash Program Memory bit 1 WR: Write Control bit 1 = Initiates a write cycle to program memory. (The bit is cleared by hardware when write is complete. The WR bit can only be set (not cleared) in software.) 0 = Write cycle to the Flash memory is complete bit 0 RD: Read Control bit 1 = Initiates a program memory read. (The read takes one cycle. The RD is cleared in hardware; the RD bit can only be set (not cleared) in software). 0 = Does not initiate a Flash memory read 2013 Microchip Technology Inc. DS20002331B-page 107 MCP19110/11 18.3.1 READING THE FLASH PROGRAM MEMORY To read a program memory location, the user must write two bytes of the address to the PMADRL and PMADRH registers, and then set control bit RD (PMCON1<0>). Once the read control bit is set, the program memory Flash controller will use the second instruction cycle after to read the data. This causes the second instruction immediately following the “BSF PMCON1,RD” instruction to be ignored. The data is available, in the very next cycle, in the PMDATL and PMDATH registers; it can be read as two bytes in the following instructions. PMDATL and PMDATH registers will hold this value until another read or until it is written to by the user (during a write operation). EXAMPLE 18-1: FLASH PROGRAM READ BANKSELPM_ADR; Change STATUS bits RP1:0 to select bank with PMADR MOVLWMS_PROG_PM_ADDR; MOVWFPMADRH; MS Byte of Program Address to read MOVLWLS_PROG_PM_ADDR; MOVWFPMADRL; LS Byte of Program Address to read BANKSELPMCON1; Bank to containing PMCON1 BSF PMCON1, RD; EE Read NOP ; First instruction after BSF PMCON1,RD executes normally NOP ; Any instructions here are ignored as program ; memory is read in second cycle after BSF PMCON1,RD ; BANKSELPMDATL; Bank to containing PMADRL MOVFPMDATL, W; W = LS Byte of Program PMDATL MOVFPMDATH, W; W = MS Byte of Program PMDATL FIGURE 18-1: FLASH PROGRAM MEMORY READ CYCLE EXECUTION – NORMAL MODE Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Flash ADDR PC Flash DATA PC + 1 INSTR (PC) PMADRH,PMADRL INSTR (PC + 1) PC+3 PC +3 PMDATH,PMDATL INSTR (PC - 1) BSF PMCON1,RD INSTR (PC + 1) Executed here Executed here Executed here PC + 4 PC + 5 INSTR (PC + 3) INSTR (PC + 4) NOP Executed here INSTR (PC + 3) Executed here INSTR (PC + 4) Executed here RD bit PMDATH PMDATL Register EERHLT DS20002331B-page 108 2013 Microchip Technology Inc. MCP19110/11 18.3.2 WRITING TO THE FLASH PROGRAM MEMORY A word of the Flash program memory may only be written to if the word is in an unprotected segment of memory, as defined in Section 12.1 “Configuration Word” (bits WRT1:WRT0). Note: The write protect bits are used to protect the users’ program from modification by the user’s code. They have no effect when programming is performed by ICSP. The code-protect bits, when programmed for code protection, will prevent the program memory from being written via the ICSP interface. Flash program memory must be written in four-word blocks. See Figures 18-2 and 18-3 for more details. A block consists of four words with sequential addresses, with a lower boundary defined by an address, where PMADRL<1:0> = 00. All block writes to program memory are done as 16-word erase by four-word write operations. The write operation is edge-aligned and cannot occur across boundaries. To write program data, it must first be loaded into the buffer registers (see Figure 18-2). This is accomplished by first writing the destination address to PMADRL and PMADRH, and then writing the data to PMDATL and PMDATH. After the address and data have been set, then the following sequence of events must be executed: 1. 2. Write 55h, then AAh, to PMCON2 (Flash programming sequence). Set the WR control bit of the PMCON1 register. All four buffer register locations should be written to with correct data. If less than four words are being written to in the block of four words, then a read from the program memory location(s) not being written to must be performed. This takes the data from the program memory location(s) not being written and loads it into the PMDATL and PMDATH registers. Then the sequence of events to transfer data to the buffer registers must be executed. To transfer data from the buffer registers to the program memory, the PMADRL and PMADRH must point to the last location in the four-word block (PMADRL<1:0> = 11). Then the following sequence of events must be executed: 1. 2. Write 55h, then AAh, to PMCON2 (Flash programming sequence). Set control bit WR of the PMCON1 register to begin the write operation. 2013 Microchip Technology Inc. The user must follow the same specific sequence to initiate the write for each word in the program block, writing each program word in sequence (000, 001, 010, 011). When the write is performed on the last word (PMADRL<1:0> = 11), a block of sixteen words is automatically erased and the content of the four-word buffer registers are written into the program memory. After the “BSF PMCON1,WR” instruction, the processor requires two cycles to set up the erase/write operation. The user must place two NOP instructions after the WR bit is set. Since data is being written to buffer registers, the writing of the first three words of the block appears to occur immediately. The processor will halt internal operations for the typical 4 ms, only during the cycle in which the erase takes place (i.e., the last word of the sixteen-word block erase). This is not Sleep mode, as the clocks and peripherals will continue to run. After the four-word write cycle, the processor will resume operation with the third instruction after the PMCON1 write instruction. The above sequence must be repeated for the higher 12 words. Note: An erase is only initiated for the write of four words, just after a row boundary; or PMCON1<WR> set with PMADRL<3:0> = xxxx0011. Refer to Figure 18-2 for a block diagram of the buffer registers and the control signals for test mode. 18.3.3 PROTECTION AGAINST SPURIOUS WRITE There are conditions when the device should not write to the program memory. To protect against spurious writes, various mechanisms have been built in. On power-up, WREN is cleared. Also, the Power-up Timer (72 ms duration) prevents program memory writes. The write initiate sequence, and the WREN bit, help prevent an accidental write during a power glitch or software malfunction. 18.3.4 OPERATION DURING CODE PROTECT When the device is code protected, the CPU is able to read and write unscrambled data to the program memory. The test mode access is disabled. 18.3.5 OPERATION DURING WRITE PROTECT When the program memory is write protected, the CPU can read and execute from the program memory. The portions of program memory that are write protected can not be modified by the CPU using the PMCON registers. The write protection has no effect in ICSP mode. DS20002331B-page 109 MCP19110/11 FIGURE 18-2: BLOCK WRITES TO 4K FLASH PROGRAM MEMORY 7 5 0 07 PMDATH PMDATL 6 8 14 14 First word of block to be written 14 PMADRL<1:0> = 00 PMADRL<1:0> = 01 Buffer Register PMADRL<1:0> = 10 Buffer Register If at new row sixteen words of Flash are erased, then four buffers are transferred to Flash automatically after this word is written 14 PMADRL<1:0> = 11 Buffer Register Buffer Register Program Memory FIGURE 18-3: FLASH PROGRAM MEMORY LONG WRITE CYCLE EXECUTION Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Flash ADDR PMADRH,PMADRL PC + 1 INSTR (PC) Flash DATA Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 INSTR (PC + 1) ignored read BSF PMCON1,WR INSTR (PC + 1) Executed here Executed here PMDATH,PMDATL Processor halted EE Write Time PC + 2 PC + 3 PC + 4 INSTR (PC+2) INSTR (PC+3) (INSTR (PC + 2) NOP INSTR (PC + 3) NOP Executed here Executed here Executed here Flash Memory Location WR bit PMWHLT DS20002331B-page 110 2013 Microchip Technology Inc. MCP19110/11 19.0 I/O PORTS In general, when a peripheral is enabled, that pin may not be used as a general purpose I/O pin. Each port has two registers for its operation. These registers are: • TRISGPx registers (data direction register) • PORTGPx registers (reads the levels on the pins of the device) Some ports may have one or more of the following additional registers. These registers are: • ANSELx (analog select) • WPUx (weak pull-up) Ports with analog functions also have an ANSELx register, which can disable the digital input and save power. A simplified model of a generic I/O port, without the interfaces to other peripherals, is shown in Figure 19-1. FIGURE 19-1: GENERIC I/O PORTGPX OPERATION Read LATx D TRISx Q Write LATx Write PORTx VDD CK Data Register Data Bus I/O pin Read PORTx To peripherals ANSELx EXAMPLE 19-1: ; ; ; ; VSS INITIALIZING PORTA This code example illustrates initializing the PORTGPA register. The other ports are initialized in the same manner. BANKSEL CLRF BANKSEL CLRF BANKSEL MOVLW MOVWF PORTGPA; PORTGPA;Init PORTA ANSELA; ANSELA;digital I/O TRISGPA; B'00011111';Set GPA<4:0> as ;inputs TRISGPA;and set GPA<7:6> as ;outputs 2013 Microchip Technology Inc. DS20002331B-page 111 MCP19110/11 19.1 Alternate Pin Function The Alternate Pin Function Control (APFCON) register is used to steer specific peripheral input and output functions between different pins. The APFCON register is shown in Register 19-1. For the MCP19111 device, the following function can be moved between different pins: This bit has no effect on the values of any TRIS register. PORT and TRIS overrides will be routed to the correct pin. The unselected pin will be unaffected. • Frequency Synchronization Clock Input/Output REGISTER 19-1: APFCON: ALTERNATE PIN FUNCTION CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 — — — — — — — CLKSEL bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-1 Unimplemented: Read as ‘0’ bit 0 CLKSEL: Pin Selection bit 1 = Multi-phase or multiple output clock function is on GPB5 0 = Multi-phase or multiple output clock function is on GPA1 19.2 PORTGPA and TRISGPA Registers PORTGPA is an 8-bit wide, bidirectional port consisting of five CMOS I/O, two open-drain I/O, and one opendrain input-only pin. The corresponding data direction register is TRISGPA (Register 19-3). Setting a TRISGPA bit (= 1) will make the corresponding PORTGPA pin an input (i.e., disable the output driver). Clearing a TRISGPA bit (= 0) will make the corresponding PORTGPA pin an output (i.e., enables output driver). The exception is GPA5, which is input only and its TRISGPA bit will always read as ‘1’. Example 19-1 shows how to initialize an I/O port. Reading the PORTGPA register (Register 19-2) reads the status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modifywrite operations. The TRISGPA register (Register 19-3) controls the PORTGPA pin output drivers, even when they are being used as analog inputs. The user must ensure the bits in the TRISGPA register are maintained set when using them as analog inputs. I/O pins configured as analog input always read ‘0’. If the pin is configured for a digital output (either port or alternate function), the TRISGPA bit must be cleared in order for the pin to drive the signal, and a read will reflect the state of the pin. DS20002331B-page 112 19.2.1 x = Bit is unknown INTERRUPT-ON-CHANGE Each PORTGPA pin is individually configurable as an interrupt-on-change pin. Control bits IOCA<7:0> enable or disable the interrupt function for each pin. The interrupt-on-change feature is disabled on a Power-on Reset. Reference Section 20.0 “InterruptOn-Change” for more information. 19.2.2 WEAK PULL-UPS PORTGPA <3:0> and PORTGPA5 have an internal weak pull-up. PORTGPA<7:6> are special ports for the SSP module and do not have weak pull-ups. Individual control bits can enable or disable the internal weak pull-ups (see Register 19-4). The weak pull-up is automatically turned off when the port pin is configured as an output, an alternative function or on a Power-on Reset setting the RAPU bit of the OPTION register. The weak pull-up on GPA5 is enabled when configured as MCLR pin by setting bit 5 of the Configuration word, and disabled when GPA5 is an I/O. There is no software control of the MCLR pull-up. 2013 Microchip Technology Inc. MCP19110/11 19.2.3 ANSELA REGISTER Analog input functions, such as ADC, are not shown in the priority lists. These inputs are active when the I/O pin is set for Analog mode using the ANSELA registers. Digital output functions may control the pin when it is in Analog mode with the priority shown in Table 19-1. The ANSELA register (Register 19-5) is used to configure the Input mode of an I/O pin to analog. Setting the appropriate ANSELA bit high will cause all digital reads on the pin to be read as ‘0’ and allows analog functions on the pin to operate correctly. TABLE 19-1: The state of the ANSELA bits has no effect on the digital output functions. A pin with TRISGPA clear and ANSELA set will still operate as a digital output, but the Input mode will be analog. This can cause unexpected behavior when executing read-modify-write instructions on the affected port. Note: 19.2.4 Function Priority(1) Pin Name The ANSELA bits default to the Analog mode after Reset. To use any pins as digital general purpose or peripheral inputs, the corresponding ANSELA bits must be initialized to ‘0’ by user software. PORTGPA FUNCTIONS AND OUTPUT PRIORITIES Each PORTGPA pin is multiplexed with other functions. The pins, their combined functions and their output priorities are shown in Table 19-1. For additional information, refer to the appropriate section in this data sheet. GPA0 GPA0 AN0 ANALOG_TEST GPA1 GPA1 AN1 CLKPIN GPA2 GPA2 AN2 T0CKI INT GPA3 GPA3 AN3 GPA4 GPA4 (open-drain input/output) GPA5 GPA5 (open-drain data input only) GPA6 GPA6 ICSPDAT (MCP19110 Only) GPA7 GPA7 (open-drain output) SCL ICSPCLK (MCP19110 Only) PORTGPA pins GPA7 and GPA4 are true open-drain pins with no connection back to VDD. Note 1: When multiple outputs are enabled, the actual pin control goes to the peripheral with the highest priority. REGISTER 19-2: PORTGPA OUTPUT PRIORITY Priority listed from highest to lowest. PORTGPA: PORTGPA REGISTER R/W-x R/W-x R-x R-x R/W-x R/W-x R/W-x R/W-x GPA7 GPA6 GPA5 GPA4 GPA3 GPA2 GPA1 GPA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 GPA7: General Purpose Open-Drain I/O pin. bit 6 GPA6: General Purpose I/O pin. 1 = Port pin is > VIH 0 = Port pin is < VIL bit 5 GPA5/MCLR: General Purpose Open-Drain I/O pin. bit 4 GPA4: General Purpose Open-Drain I/O pin. bit 3-0 GPA<3:0>: General Purpose I/O pin. 1 = Port pin is > VIH 0 = Port pin is < VIL 2013 Microchip Technology Inc. x = Bit is unknown DS20002331B-page 113 MCP19110/11 REGISTER 19-3: TRISGPA: PORTGPA TRI-STATE REGISTER R/W-1 R/W-1 R-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 TRISA<7:6>: PORTGPA Tri-State Control bit 1 = PORTGPA pin configured as an input (tri-stated) 0 = PORTGPA pin configured as an output bit 5 TRISA5: GPA5 Port Tri-State Control bit This bit is always ‘1’ as GPA5 is an input only bit 4-0 TRISA<4:0>: PORTGPA Tri-State Control bit 1 = PORTGPA pin configured as an input (tri-stated) 0 = PORTGPA pin configured as an output REGISTER 19-4: x = Bit is unknown WPUGPA: WEAK PULL-UP PORTGPA REGISTER U-0 U-0 R/W-1 U-0 R/W-1 R/W-1 R/W-1 R/W-1 — — WPUA5 — WPUA3 WPUA2 WPUA1 WPUA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5 WPUA5: Weak Pull-up Register bit 1 = Pull-up enabled. 0 = Pull-up disabled. bit 4 Unimplemented: Read as ‘0’ bit 3-0 WPUA<3:0>: Weak Pull-up Register bit 1 = Pull-up enabled. 0 = Pull-up disabled. Note 1: 2: x = Bit is unknown The weak pull-up device is enabled only when the global RAPU bit is enabled, the pin is in input mode (TRISGPA = 1), and the individual WPUA bit is enabled (WPUA = 1), and the pin is not configured as an analog input. GPA5 weak pull-up is also enabled when the pin is configured as MCLR in Configuration word. DS20002331B-page 114 2013 Microchip Technology Inc. MCP19110/11 REGISTER 19-5: ANSELA: ANALOG SELECT PORTGPA REGISTER U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — — — ANSA3 ANSA2 ANSA1 ANSA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 Unimplemented: Read as ‘0’ bit 3-0 ANSA<3:0>: Analog Select PORTGPA Register bit 1 = Analog input. Pin is assigned as analog input.(1) 0 = Digital I/O. Pin is assigned to port or special function. Note 1: x = Bit is unknown Setting a pin to an analog input automatically disables the digital input circuitry, weak pull-ups, and interrupt-on-change if available. The corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin. TABLE 19-2: Name SUMMARY OF REGISTERS ASSOCIATED WITH PORTGPA Bit 0 Register on Page ANSA1 ANSA0 115 — CLKSEL 112 PS1 PS0 77 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 ANSELA — — — — ANSA3 ANSA2 APFCON — — — — — — RAPU INTEDG T0CS T0SE PSA PS2 OPTION_REG PORTGPA GPA7 GPA6 GPA5 GPA4 GPA3 GPA2 GPA1 GPA0 113 TRISGPA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 114 WPUGPA — — WPUA5 — WPUA3 WPUA2 WPUA1 WPUA0 114 Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by PORTGPA. 2013 Microchip Technology Inc. DS20002331B-page 115 MCP19110/11 19.3 PORTGPB and TRISGPB Registers PORTGPB is an 8-bit wide, bidirectional port consisting of seven general purpose I/O ports. The corresponding data direction register is TRISGPB (Register 19-7). Setting a TRISGPB bit (= 1) will make the corresponding PORTGPB pin an input (i.e., disable the output driver). Clearing a TRISGPB bit (= 0) will make the corresponding PORTGPB pin an output (i.e., enable the output driver). Example 19-1 shows how to initialize an I/O port. Some pins for PORTGPB are multiplexed with an alternate function for the peripheral, or a clock function. In general, when a peripheral or clock function is enabled, that pin may not be used as a general purpose I/O pin. Reading the PORTGPB register (Register 19-6) reads the status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modify-write operations. The TRISGPB register (Register 19-7) controls the PORTGPB pin output drivers, even when they are being used as analog inputs. The user should ensure the bits in the TRISGPB register are maintained set when using them as analog inputs. I/O pins configured as analog input always read ‘0’. If the pin is configured for a digital output (either port or alternate function), the TRISGPB bit must be cleared in order for the pin to drive the signal and a read will reflect the state of the pin. 19.3.1 Input mode will be analog. This can cause unexpected behavior when executing read-modify-write instructions on the affected port. Note: 19.3.4 The ANSELB bits default to the Analog mode after Reset. To use any pins as digital general purpose or peripheral inputs, the corresponding ANSELB bits must be initialized to ‘0’ by the user’s software. PORTGPB FUNCTIONS AND OUTPUT PRIORITIES Each PORTGPB pin is multiplexed with other functions. The pins, their combined functions and their output priorities are shown in Table 19-3. For additional information, refer to the appropriate section in this data sheet. PORTGPB pin GPB0 is a true open-drain pin with no connection back to VDD. When multiple outputs are enabled, the actual pin control goes to the peripheral with the highest priority. Analog input functions, such as ADC, and some digital input functions are not included in the list below. These inputs are active when the I/O pin is set for Analog mode using the ANSELB registers. Digital output functions may control the pin when it is in Analog mode, with the priority shown in Table 19-3. TABLE 19-3: PORTGPB OUTPUT PRIORITY INTERRUPT-ON-CHANGE Pin Name Each PORTGPB pin is individually configurable as an interrupt-on-change pin. Control bits IOCB<7:4> and IOCB<2:0> enable or disable the interrupt function for each pin. The interrupt-on-change feature is disabled on a Power-on Reset. Reference Section 20.0 “Interrupt-On-Change” for more information. GPB0 GPB0 (open-drain input/output) SDA GPB1 GPB1 AN4 EAPIN GPB2 GPB2 AN5 Each of the PORTGPB pins has an individually configurable internal weak pull-up. Control bits WPUB<7:4> and WPUB<2:1> enable or disable each pull-up (see Register 19-8). Each weak pull-up is automatically turned off when the port pin is configured as an output. All pull-ups are disabled on a Power-on Reset by the RAPU bit of the OPTION register. GPB4 GPB4 AN6 ICSPDAT/ICDDAT (MCP19111 Only) GPB5 GPB5 AN7 ICSPCLK/ICDCLK (MCP19111 Only) ALT_CLKPIN (MCP19111 Only) 19.3.3 GPB6 GPB6 19.3.2 WEAK PULL-UPS ANSELB REGISTER The ANSELB register (Register 19-9) is used to configure the Input mode of an I/O pin to analog. Setting the appropriate ANSELB bit high will cause all digital reads on the pin to be read as ‘0’ and allows analog functions on the pin to operate correctly. GPB7 Note 1: Function Priority(1) GPB7 Priority listed from highest to lowest. The state of the ANSELB bits has no effect on the digital output functions. A pin with TRISGPB clear and ANSELB set will still operate as a digital output, but the DS20002331B-page 116 2013 Microchip Technology Inc. MCP19110/11 REGISTER 19-6: R/W-x GPB7 PORTGPB: PORTGPB REGISTER R/W-x (1) (1) GPB6 R/W-x GPB5 R/W-x (1) (1) GPB4 U-x R/W-x R/W-x R/W-x — GPB2 GPB1 GPB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 GPB<7:4>: General Purpose I/O Pin bit 1 = Port pin is > VIH 0 = Port pin is < VIL bit 3 Unimplemented: Read as ‘0’ bit 2-0 GPB<2:0>: General Purpose I/O Pin bit 1 = Port pin is > VIH 0 = Port pin is < VIL Note 1: x = Bit is unknown Not implemented on MCP19110. REGISTER 19-7: TRISGPB: PORTGPB TRI-STATE REGISTER R/W-1 R/W-1 R/W-1 R/W-1 U-1 R/W-1 R/W-1 R/W-1 TRISB7(1) TRISB6(1) TRISB5(1) TRISB4(1) — TRISB2 TRISB1 TRISB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 TRISB<7:4>: PORTGPB Tri-State Control bit 1 = PORTGPB pin configured as an input (tri-stated) 0 = PORTGPB pin configured as an output bit 3 Unimplemented: Read as ‘1’ bit 2-0 TRISB<2:0>: PORTGPB Tri-State Control bit 1 = PORTGPB pin configured as an input (tri-stated) 0 = PORTGPB pin configured as an output Note 1: x = Bit is unknown Not implemented on MCP19110. 2013 Microchip Technology Inc. DS20002331B-page 117 MCP19110/11 REGISTER 19-8: R/W-1 WPUGPB: WEAK PULL-UP PORTGPB REGISTER R/W-1 (2) WPUB7 WPUB6 (2) R/W-1 WPUB5 (2) R/W-1 WPUB4 (2) U-0 R/W-1 R/W-1 U-0 — WPUB2 WPUB1 — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 WPUB<7:4>: Weak Pull-up Register bit 1 = Pull-up enabled 0 = Pull-up disabled bit 3 Unimplemented: Read as ‘0’ bit 2-1 WPUB<2:1>: Weak Pull-up Register bit 1 = Pull-up enabled 0 = Pull-up disabled bit 0 Unimplemented: Read as ‘0’ Note 1: 2: x = Bit is unknown The weak pull-up device is enabled only when the global RAPU bit is enabled, the pin is in Input mode (TRISGPA = 1), the individual WPUB bit is enabled (WPUB = 1), and the pin is not configured as an analog input. Not implemented on MCP19110. REGISTER 19-9: U-0 — ANSELB: ANALOG SELECT PORTGPB REGISTER U-0 R/W-1 R/W-1 U-0 R/W-1 R/W-1 U-0 — ANSB5(2) ANSB4(2) — ANSB2 ANSB1 — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 ANSB<5:4>: Analog Select PORTGPB Register bit 1 = Analog input. Pin is assigned as analog input(1). 0 = Digital I/O. Pin is assigned to port or special function. bit 3 Unimplemented: Read as ‘0’ bit 2-1 ANSB<2:1>: Analog Select PORTGPB Register bit 1 = Analog input. Pin is assigned as analog input(1). 0 = Digital I/O. Pin is assigned to port or special function. bit 0 Unimplemented: Read as ‘0’ Note 1: 2: x = Bit is unknown Setting a pin to an analog input automatically disables the digital input circuitry, weak pull-ups and interrupt-on-change if available. The corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin. Not implemented on MCP19110. DS20002331B-page 118 2013 Microchip Technology Inc. MCP19110/11 TABLE 19-4: SUMMARY OF REGISTERS ASSOCIATED WITH PORTGPB Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ANSELB — — ANSB5 ANSB4 — ANSB2 ANSB1 — 118 APFCON — — — — — — — CLKSEL 112 OPTION_REG RAPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 77 PORTGPB GPB7 GPB6 GPB5 GPB4 — GPB2 GPB1 GPB0 117 TRISGPB TRISB7 TRISB6 TRISB5 TRISB4 — TRISB2 TRISB1 TRISB0 117 WPUGPB WPUB7 WPUB6 WPUB5 WPUB4 — WPUB2 WPUB1 — 118 Name Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by PORTGPB. 2013 Microchip Technology Inc. DS20002331B-page 119 MCP19110/11 NOTES: DS20002331B-page 120 2013 Microchip Technology Inc. MCP19110/11 20.0 INTERRUPT-ON-CHANGE Each PORTGPA and PORTGPB pin is individually configurable as an interrupt-on-change pin. Control bits IOCA and IOCB enable or disable the interrupt function for each pin. Refer to Register 20-1 and Register 20-2. The interrupt-on-change is disabled on a Power-on Reset. The interrupt-on-change on GPA5 is disabled when configured as MCLR pin in the Configuration Word. For enabled interrupt-on-change pins, the values are compared with the old value latched on the last read of PORTGPA or PORTGPB. The mismatched outputs of the last read of all the PORTGPA and PORTGPB pins are OR’ed together to set the Interrupt-on-Change Interrupt Flag bit (IOCF) in the INTCON register (Register 15-1). 20.1 Enabling the Module 20.3 The user, in the Interrupt Service Routine, clears the interrupt by: a) Any read of PORTGPA or PORTGPB AND Clear flag bit IOCF. This will end the mismatch condition; b) Any write of PORTGPA or PORTGPB AND Clear flag bit IOCF will end the mismatch condition; OR A mismatch condition will continue to set flag bit IOCF. Reading PORTGPA or PORTGPB will end the mismatch condition and allow flag bit IOCF to be cleared. The latch holding the last read value is not affected by a MCLR Reset. After this Reset, the IOCF flag will continue to be set if a mismatch is present. Note: To allow individual port pins to generate an interrupt, the IOCIE bit of the INTCON register must be set. If the IOCIE bit is disabled, the edge detection on the pin will still occur, but an interrupt will not be generated. 20.4 20.2 Individual Pin Configuration To enable a pin to detect an interrupt-on-change, the associated IOCAx or IOCBx bit of the IOCA or IOCB register is set. 2013 Microchip Technology Inc. Clearing Interrupt Flags If a change on the I/O pin should occur when any PORTGPA or PORTGPB operation is being executed, then the IOCF interrupt flag may not get set. Operation in Sleep The interrupt-on-change interrupt sequence will wake the device from Sleep mode, if the IOCE bit is set. DS20002331B-page 121 MCP19110/11 20.5 Interrupt-On-Change Registers REGISTER 20-1: IOCA: INTERRUPT-ON-CHANGE PORTGPA REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 IOCA7 IOCA6 IOCA5 IOCA4 IOCA3 IOCA2 IOCA1 IOCA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 IOCA<7:6>: Interrupt-on-Change PORTGPA Register bits. 1 = Interrupt-on-change enabled on the pin. 0 = Interrupt-on-change disabled on the pin. bit 5 IOCA<5>: Interrupt-on-Change PORTGPA Register bits(1). 1 = Interrupt-on-change enabled on the pin. 0 = Interrupt-on-change disabled on the pin. bit 4-0 IOCA<4:0>: Interrupt-on-Change PORTGPA Register bits. 1 = Interrupt-on-change enabled on the pin. 0 = Interrupt-on-change disabled on the pin. Note 1: x = Bit is unknown The Interrupt-on-change on GPA5 is disabled if GPA5 is configured as MCLR. REGISTER 20-2: R/W-0 (1) IOCB7 IOCB: INTERRUPT-ON-CHANGE PORTGPB REGISTER R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 IOCB6(1) IOCB5(1) IOCB4(1) — IOCB2 IOCB1 IOCB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 IOCB<7:4>: Interrupt-on-Change PORTGPB Register bits. 1 = Interrupt-on-change enabled on the pin. 0 = Interrupt-on-change disabled on the pin. bit 3 Unimplemented: Read as ‘0’ bit 2-0 IOCB<2:0>: Interrupt-on-Change PORTGPB Register bits. 1 = Interrupt-on-change enabled on the pin. 0 = Interrupt-on-change disabled on the pin. Note 1: Not implemented on MCP19111. TABLE 20-1: Name ANSELA x = Bit is unknown SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPT-ON-CHANGE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page — — — — ANSA3 ANSA2 ANSA1 ANSA0 115 118 ANSELB — — ANSB5 ANSB4 — ANSB2 ANSB1 — INTCON GIE PEIE T0IE INTE IOCE T0IF INTF IOCF 96 IOCA IOCA7 IOCA6 IOCA5 IOCA4 IOCA3 IOCA2 IOCA1 IOCA0 122 IOCB IOCB7 IOCB6 IOCB5 IOCB4 — IOCB2 IOCB1 IOCB0 122 TRISGPA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 114 TRISB7 TRISB6 TRISB5 TRISB4 — TRISB2 TRISB1 TRISB0 117 TRISGPB Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by interrupt-on-change. DS20002331B-page 122 2013 Microchip Technology Inc. MCP19110/11 21.0 INTERNAL TEMPERATURE INDICATOR MODULE The MCP19110/11 is equipped with a temperature circuit designed to measure the operating temperature of the silicon die. The circuit's range of the operating temperature falls between -40°C and +125°C. The output is a voltage that is proportional to the device temperature. The output of the temperature indicator is internally connected to the device ADC. 21.2 Temperature Output The output of the circuit is measured using the internal analog-to-digital converter. Channel 10 is reserved for the temperature circuit output. Refer to Section 22.0 “Analog-to-Digital Converter (ADC) Module” for detailed information. The temperature of the silicon die can be calculated by the ADC measurement by using Equation 21-1. EQUATION 21-1: 21.1 Circuit Operation The TMPSEN bit in the ABECON register, Register 6-15, is set to enable the internal temperature measurement circuit. The MCP19110/11 overtemperature shutdown feature is NOT controlled by this bit. FIGURE 21-1: SILICON DIE TEMPERATURE ADC READING – 1.75 TEMP_DIE = ----------------------------------------------------------13.3mV/ C TEMPERATURE CIRCUIT DIAGRAM VDD TMPSEN VOUT ADC MUX ADC n CHS bits (ADCON0 register) 2013 Microchip Technology Inc. DS20002331B-page 123 MCP19110/11 NOTES: DS20002331B-page 124 2013 Microchip Technology Inc. MCP19110/11 22.0 ANALOG-TO-DIGITAL CONVERTER (ADC) MODULE The internal band gap supplies the voltage reference to the ADC. The ADC can generate an interrupt upon completion of a conversion. This interrupt can be used to wake-up the device from Sleep. The Analog-to-Digital Converter (ADC) allows conversion of an analog input signal to a 10-bit binary representation of that signal. This device uses analog inputs, which are multiplexed into a single sample and hold circuit. The output of the sample and hold is connected to the input of the converter. The converter generates a 10-bit binary result via successive approximation and stores the right justified conversion result into the ADC result registers (ADRESH:ADRESL register pair). Figure 22-1 shows the block diagram of the ADC. FIGURE 22-1: ADC BLOCK DIAGRAM VIN_ANA 00000 VREF 00001 OVREF 00010 UVREF 00011 VBGR 00100 VOUT 00101 CRT 00110 VZC 00111 DEMAND 01000 RELEFF 01001 TEMP_ANA 01010 ANA_IN 01011 DCI 01100 GPA0 10000 GPA1 10001 GPA2 10010 GPA3 10011 GPB1 10100 GPB2 10101 GPB4(3) 10110 GPB5(3) 10111 VREF ADC GO/DONE 10 ADON ADRESH ADRESL VSS CHS4:CHS0 Note 1: When ADON = 0, all multiplexer inputs are disconnected. 2: See ADCON0 register (Register 22-1) for detailed analog channel selection per device. 3: Not implemented on MCP19110. 2013 Microchip Technology Inc. DS20002331B-page 125 MCP19110/11 22.1 ADC Configuration When configuring and using the ADC, the following functions must be considered: • • • • • Port configuration Channel selection ADC conversion clock source Interrupt control Result formatting 22.1.1 PORT CONFIGURATION The ADC can be used to convert both analog and digital signals. When converting analog signals, the I/O pin should be configured for analog by setting the associated TRIS and ANSEL bits. Refer to Section 19.0 “I/O Ports” for more information. Note: 22.1.2 Analog voltages on any pin that is defined as a digital input may cause the input buffer to conduct excess current. CHANNEL SELECTION 22.1.3 ADC CONVERSION CLOCK The source of the conversion clock is software selectable via the ADCS bits of the ADCON1 register. There are five possible clock options: • • • • • FOSC/8 FOSC/16 FOSC/32 FOSC/64 FRC (clock derived from internal oscillator with a divisor of 16) The time to complete one bit conversion is defined as TAD. One full 10-bit conversion requires 11 TAD periods as shown in Figure 22-2. For a correct conversion, the appropriate TAD specification must be met. Refer to the A/D conversion requirements in Section 5.0 “Digital Electrical Characteristics” for more information. Table 22-1 gives examples of appropriate ADC clock selections. Note: There are up to 19 channel selections available on the MCP19110 and 21 channel selections available on the MCP19111: • • • • • • • • • • • • • • AN<6:0> pins VIN: 1/5 of the input voltage (VIN) VREGREF: VOUT reference voltage OV_REF: reference for OV comparator UV_REF: reference for UV comparator VBGR: band gap reference VOUT: output voltage CRT: voltage proportional to the AC inductor current VZC: an internal ground, Voltage for Zero Current DEMAND: input to slope compensation circuitry RELEFF: relative efficient measurement channel TMP_ANA: voltage proportional to silicon die temperature ANA_IN: for a multi-phase slave, error amplifier signal received from master DCI: DC inductor valley current The CHS<4:0> bits of the ADCON0 register determine which channel is connected to the sample and hold circuit. When changing channels, a delay is required before starting the next conversion. Refer to Section 22.2 “ADC Operation” for more information. DS20002331B-page 126 Unless using the FRC, any changes in the system clock frequency will change the ADC clock frequency, which may adversely affect the ADC result. TABLE 22-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES ADC Clock Period (TAD) Device Frequency (FOSC) ADC Clock Source ADCS<2:0> 8 MHz FOSC/8 001 1.0 µs(2) FOSC/16 101 2.0 µs FOSC/32 010 4.0 µs FOSC/64 110 8.0 µs(3) FRC x11 2.0 – 6.0 µs(1,4) Legend: Shaded cells are outside of recommended range. Note 1: The FRC source has a typical TAD time of 4 µs for VDD > 3.0V. 2: These values violate the minimum required TAD time. 3: For faster conversion times, the selection of another clock source is recommended. 4: The FRC clock source is only recommended if the conversion will be preformed during Sleep. 2013 Microchip Technology Inc. MCP19110/11 FIGURE 22-2: ANALOG-TO-DIGITAL CONVERSION TAD CYCLES TCY - TAD TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9 TAD10 TAD11 b9 b8 b7 b6 b5 b4 b3 b1 b2 b0 Conversion starts Holding capacitor is disconnected from analog input (typically 100 ns) Set GO/DONE bit On the following cycle: ADRESH:ADRESL is loaded, GO bit is cleared, ADIF bit is set, holding capacitor is connected to analog input. 22.1.4 INTERRUPTS This interrupt can be generated while the device is operating, or while in Sleep. If the device is in Sleep, the interrupt will wake-up the device. Upon waking from Sleep, the next instruction following the SLEEP instruction is always executed. If the user is attempting to wake-up from Sleep and resume in-line code execution, the GIE and PEIE bits of the INTCON register must be disabled. If the GIE and PEIE bits of the INTCON register are enabled, execution will switch to the Interrupt Service Routine. The ADC module allows for the ability to generate an interrupt upon completion of an Analog-to-Digital conversion. The ADC Interrupt Flag is the ADIF bit in the PIR1 register. The ADC Interrupt Enable is the ADIE bit in the PIE1 register. The ADIF bit must be cleared in software. Note 1: The ADIF bit is set at the completion of every conversion, regardless of whether or not the ADC interrupt is enabled. 22.1.5 2: The ADC operates during Sleep-only when the FRC oscillator is selected. RESULT FORMATTING The 10-bit A/D conversion result is supplied in right justified format only. Figure 22-3 shows the output format. FIGURE 22-3: 10-BIT A/D RESULT FORMAT (ADFM = 1) MSB bit 7 Read as ‘0’ 2013 Microchip Technology Inc. LSB bit 0 bit 7 bit 0 10-bit A/D Result DS20002331B-page 127 MCP19110/11 22.2 22.2.1 ADC Operation STARTING A CONVERSION To enable the ADC module, the ADON bit of the ADCON0 register must be set to a ‘1’. Setting the GO/DONE bit of the ADCON0 register to a ‘1’ will start the Analog-to-Digital conversion. Note: 22.2.2 The GO/DONE bit should not be set in the same instruction that turns on the ADC. Refer to Section 22.2.5 “A/D Conversion Procedure”. COMPLETION OF A CONVERSION When the conversion is complete, the ADC module will: • Clear the GO/DONE bit • Set the ADIF Interrupt Flag bit • Update the ADRESH:ADRESL registers with new conversion result 22.2.3 TERMINATING A CONVERSION If a conversion must be terminated before completion, the GO/DONE bit can be cleared in software. The ADRESH:ADRESL registers will not be updated with the partially complete Analog-to-Digital conversion sample. Instead, the ADRESH:ADRESL register pair will retain the value of the previous conversion. Additionally, a two TAD delay is required before another acquisition can be initiated. Following the delay, an input acquisition is automatically started on the selected channel. Note: 22.2.4 A device Reset forces all registers to their Reset state. Thus, the ADC module is turned off and any pending conversion is terminated. ADC OPERATION DURING SLEEP The ADC module can operate during Sleep. This requires the ADC clock source to be set to the FRC option. When the FRC clock source is selected, the ADC waits one additional instruction before starting the conversion. This allows the SLEEP instruction to be executed, which can reduce system noise during the conversion. If the ADC interrupt is enabled, the device will wake-up from Sleep when the conversion completes. If the ADC interrupt is disabled, the ADC module is turned off after the conversion completes, although the ADON bit remains set. When the ADC clock source is something other than FRC, a SLEEP instruction causes the present conversion to be aborted and the ADC module is turned off, although the ADON bit remains set. DS20002331B-page 128 22.2.5 A/D CONVERSION PROCEDURE This is an example procedure for using the ADC to perform an Analog-to-Digital conversion: 1. 2. 3. 4. 5. 6. 7. 8. Configure Port: • Disable pin output driver (Refer to the TRIS register) • Configure pin as analog (Refer to the ANSEL register) Configure the ADC module: • Select ADC conversion clock • Select ADC input channel • Turn on ADC module Configure ADC interrupt (optional): • Clear ADC interrupt flag • Enable ADC interrupt • Enable peripheral interrupt • Enable global interrupt(1) Wait the required acquisition time(2). Start conversion by setting the GO/DONE bit. Wait for ADC conversion to complete by one of the following: • Polling the GO/DONE bit • Waiting for the ADC interrupt (interrupts enabled) Read ADC Result. Clear the ADC interrupt flag (required if interrupt is enabled). Note 1: The global interrupt can be disabled if the user is attempting to wake-up from Sleep and resume in-line code execution. 2: Refer to Section 22.4 “A/D Acquisition Requirements”. EXAMPLE 22-1: A/D CONVERSION ;This code block configures the ADC ;for polling, Frc clock and AN0 input. ; ;Conversion start & polling for completion ; are included. ; BANKSEL ADCON1 ; MOVLW B’01110000’ ;Frc clock MOVWF ADCON1 ; BANKSEL TRISGPA ; BSF TRISGPA,0 ;Set GPA0 to input BANKSEL ANSELA ; BSF ANSELA,0 ;Set GPA0 to analog BANKSEL ADCON0 ; MOVLW B’01000001’ ;Select channel AN0 MOVWF ADCON0 ;Turn ADC On CALL SampleTime ;Acquisiton delay BSF ADCON0,1 ;Start conversion BTFSC ADCON0,1 ;Is conversion done? GOTO $-1 ;No, test again BANKSEL ADRESH ; MOVF ADRESH,W ;Read upper 2 bits MOVWF RESULTHI ;store in GPR space BANKSEL ADRESL ; MOVF ADRESL,W ;Read lower 8 bits MOVWF RESULTLO ;Store in GPR space 2013 Microchip Technology Inc. MCP19110/11 22.3 ADC Register Definitions The following registers are used to control the operation of the ADC: REGISTER 22-1: ADCON0: A/D CONTROL REGISTER 0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — CHS4 CHS3 CHS2 CHS1 CHS0 GO/DONE ADON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 Unimplemented: Read as ‘0’ bit 6-2 CHS<4:0>: Analog Channel Select bits 00000 = VIN_ANA (analog voltage proportional to VIN) 00001 = VREGREF (reference voltage for VREG output) 00010 = OV_REF (reference for overvoltage comparator) 00011 = UV_REF (reference for undervoltage comparator) 00100 = VBGR (band gap reference) 00101 = INT_VREG (internal version of the VREG load voltage) 00110 = CRT (voltage proportional to the current in the inductor) 00111 = VZC (an internal ground, Voltage for Zero Current) 01000 = DEMAND (input to current loop, output of demand mux) 01001 = RELEFF (analog voltage proportional to duty cycle) 01010 = TMP_ANA (analog voltage proportional to temperature) 01011 = ANA_IN (demanded current from the remote master) 01100 = DCI (dc inductor valley current) 01101 = Unimplemented 01110 = Unimplemented 01111 = Unimplemented 10000 = GPA0 (i.e. ADDR1) 10001 = GPA1 (i.e. ADDR0) 10010 = GPA2 (i.e. Temperature Sensor Input) 10011 = GPA3 (i.e. Tracking Voltage) 10100 = GPB1 10101 = GPB2 10110 = GPB4(1) 10111 = GPB5(1) 11000 = Unimplemented 11001 = Unimplemented 11011 = Unimplemented 11100 = Unimplemented 11101 = Unimplemented 11110 = Unimplemented 11111 = Unimplemented bit 1 GO/DONE: A/D Conversion Status bit 1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle. This bit is automatically cleared by hardware when the A/D conversion has completed. 0 = A/D conversion completed/not in progress bit 0 ADON: ADC Enable bit 1 = ADC is enabled 0 = ADC is disabled and consumes no operating current Note 1: Not implemented on MCP19110. 2013 Microchip Technology Inc. DS20002331B-page 129 MCP19110/11 REGISTER 22-2: ADCON1: A/D CONTROL REGISTER 1 U-0 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0 — ADCS2 ADCS1 ADCS0 — — — — bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 Unimplemented: Read as ‘0’ bit 6-4 ADCS<2:0>: A/D Conversion Clock Select bits 000 = Reserved 001 = FOSC/8 010 = FOSC/32 x11 = FRC (clock derived from internal oscillator with a divisor of 16) 100 = Reserved 101 = FOSC/16 110 = FOSC/64 bit 3-0 Unimplemented: Read as ‘0’ REGISTER 22-3: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) U-0 U-0 U-0 U-0 U-0 U-0 R-x R-x — — — — — — ADRES9 ADRES8 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 Unimplemented: Read as ‘0’ bit 1-0 ADRES<9:8>: Most Significant A/D Results REGISTER 22-4: x = Bit is unknown ADRESL: ADC RESULT REGISTER LOW (ADRESL) R-x R-x R-x R-x R-x R-x R-x R-x ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2 ADRES1 ADRES0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 x = Bit is unknown ADRES<7:0>: Least Significant A/D results DS20002331B-page 130 2013 Microchip Technology Inc. MCP19110/11 22.4 A/D Acquisition Requirements For the ADC to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The Analog Input model is shown in Figure 22-4. The source impedance (RS) and the internal sampling switch (RSS) impedance directly affect the time required to charge the capacitor CHOLD. The sampling switch (RSS) impedance varies over the device voltage (VDD), refer to Figure 22-4. EQUATION 22-1: The maximum recommended impedance for analog sources is 10 k. As the source impedance is decreased, the acquisition time may be decreased. After the analog input channel is selected (or changed), an A/D acquisition must be done before the conversion can be started. To calculate the minimum acquisition time, Equation 22-1 may be used. This equation assumes that 1/2 LSb error is used (1,024 steps for the ADC). The 1/2 LSb error is the maximum error allowed for the ADC to meet its specified resolution. ACQUISITION TIME EXAMPLE Assumptions: Temperature = +50°C and external impedance of 10 k 5.0V V DD T ACQ = Amplifier Settling Time + Hold Capacitor Charging Time + Temperature Coefficient = T AMP + T C + T COFF = 2 µs + T C + Temperature - 25°C 0.05 µs/°C The value for TC can be approximated with the following equations: V 1 1 – ------------------------------ = V APPLIED CHOLD n+1 2 – 1 – TC ---------- RC V APPLIED 1 – e = V CHOLD – TC ---------- RC 1 V APPLIED 1 – e = V APPLIED 1 – ------------------------------ n+1 2 – 1 ;[1] VCHOLD charged to within 1/2 lsb ;[2] VCHOLD charge response to VAPPLIED ;combining [1] and [2] Note: Where n = number of bits of the ADC. Solving for TC: T C = – C HOLD R IC + R SS + R S ln(1/2047) = – 10 pF 1 k + 7 k + 10 k ln(0.0004885) = 1.37 µs Therefore: T ACQ = 2 µs + 1.37µs + 50°C- 25°C 0.05µs/°C = 4.67 µs Note 1: The charge holding capacitor (CHOLD) is not discharged after each conversion. 2: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin leakage specification. 2013 Microchip Technology Inc. DS20002331B-page 131 MCP19110/11 FIGURE 22-4: ANALOG INPUT MODEL RS VA VDD Analog Input pin VT 0.6V CPIN 5 pF VT 0.6V Sampling Switch RIC 1k SS RSS ILEAKAGE(1) CHOLD = 10 pF VSS/VREF- 6V 5V VDD 4V 3V 2V Legend: CHOLD = Sample/Hold Capacitance CPIN = Input Capacitance RSS ILEAKAGE = Leakage current at the pin due to various junctions 5 6 7 8 91011 Sampling Switch (k) RIC = Interconnect Resistance RSS = Resistance of Sampling Switch SS = Sampling Switch VT = Threshold Voltage Note 1: Refer to Section 5.0 “Digital Electrical Characteristics”. FIGURE 22-5: ADC TRANSFER FUNCTION Full-Scale Range 3FFh 3FEh 3FDh ADC Output Code 3FCh 3FBh 03h 02h 01h 00h Analog Input Voltage 0.5 LSB VREF- DS20002331B-page 132 Zero-Scale Transition 1.5 LSB Full-Scale Transition VREF+ 2013 Microchip Technology Inc. MCP19110/11 TABLE 22-2: Name SUMMARY OF REGISTERS ASSOCIATED WITH ADC Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ADCON0 — CHS4 CHS3 CHS2 CHS1 CHS0 GO/DONE ADON 129 ADCON1 — ADCS2 ADCS1 ADCS0 — — — — 130 ADRESH — — — — — — ADRES9 ADRES8 130 ADRESL ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2 ADRES1 ADRES0 130 ANSELA — — — — ANSA3 ANSA2 ANSA1 ANSA0 115 ANSELB — — ANSB5 ANSB4 — ANSB2 ANSB1 — 118 INTCON GIE PEIE T0IE INTE IOCE T0IF INTF IOCF 95 — ADIE BCLIE SSPIE — — TMR2IE TMR1IE 96 PIE1 PIR1 — ADIF BCLIF SSPIF — — TMR2IF TMR1IF 98 TRISGPA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 114 TRISGPB TRISB7 TRISB6 TRISB5 TRISB4 — TRISB2 TRISB1 TRISB0 117 Legend: — = unimplemented read as ‘0’. Shaded cells are not used for ADC module. 2013 Microchip Technology Inc. DS20002331B-page 133 MCP19110/11 NOTES: DS20002331B-page 134 2013 Microchip Technology Inc. MCP19110/11 23.0 TIMER0 MODULE The Timer0 module is an 8-bit timer/counter with the following features: • • • • • 8-bit timer/counter register (TMR0) 8-bit prescaler (independent of Watchdog Timer) Programmable internal or external clock source Programmable external clock edge selection Interrupt on overflow Figure 23-1 is a block diagram of the Timer0 module. FIGURE 23-1: BLOCK DIAGRAM OF THE TIMER0 FOSC/4 Data Bus 0 8 T0CKI 1 Sync 2 TCY 1 TMR0 0 TMR0SE TMR0CS 8-bit Prescaler PSA Set Flag bit TMR0IF on Overflow Overflow to Timer1 8 PS<2:0> 23.1 Timer0 Operation The Timer0 module can be used as either an 8-bit timer or an 8-bit counter. 23.1.1 8-BIT TIMER MODE The Timer0 module will increment every instruction cycle, if used without a prescaler. 8-Bit Timer mode is selected by clearing the T0CS bit of the OPTION_REG register. When TMR0 is written, the increment is inhibited for two instruction cycles immediately following the write. Note: 23.1.2 The value written to the TMR0 register can be adjusted, in order to account for the two-instruction cycle delay when TMR0 is written. 8-BIT COUNTER MODE 23.1.3 SOFTWARE PROGRAMMABLE PRESCALER A single software programmable prescaler is available for use with either Timer0 or the Watchdog Timer (WDT), but not both simultaneously. The prescaler assignment is controlled by the PSA bit of the OPTION_REG register. To assign the prescaler to Timer0, the PSA bit must be cleared to ‘0’. There are eight prescaler options for the Timer0 module ranging from 1:2 to 1:256. The prescale values are selectable via the PS<2:0> bits of the OPTION_REG register. In order to have a 1:1 prescaler value for the Timer0 module, the prescaler must be disabled by setting the PSA bit of the OPTION_REG register. The prescaler is not readable or writable. When assigned to the Timer0 module, all instructions writing to the TMR0 register will clear the prescaler. In 8-Bit Counter mode, the Timer0 module will increment on every rising or falling edge of the T0CKI pin. The incrementing edge is determined by the T0SE bit of the OPTION_REG register. 8-Bit Counter mode using the T0CKI pin is selected by setting the T0CS bit in the OPTION_REG register to ‘1’. 2013 Microchip Technology Inc. DS20002331B-page 135 MCP19110/11 23.1.4 23.1.5 SWITCHING PRESCALER BETWEEN TIMER0 AND WDT MODULES As a result of having the prescaler assigned to either Timer0 or the WDT, it is possible to generate an unintended device Reset when switching prescaler values. When changing the prescaler assignment from Timer0 to the WDT module, the instruction sequence shown in Example 23-1 must be executed. Timer0 will generate an interrupt when the TMR0 register overflows from FFh to 00h. The T0IF interrupt flag bit of the INTCON register is set every time the TMR0 register overflows, regardless of whether or not the Timer0 interrupt is enabled. The T0IF bit can only be cleared in software. The Timer0 interrupt enable is the T0IE bit of the INTCON register. Note: EXAMPLE 23-1: CHANGING PRESCALER (TIMER0 WDT) BANKSEL TMR0 CLRWDT CLRF TMR0 ; ;Clear WDT ;Clear TMR0 and ;prescaler BANKSEL OPTION_REG ; BSF OPTION_REG,PSA ;Select WDT CLRWDT ; ; MOVLW b’11111000’ ;Mask prescaler ANDWF OPTION_REG,W ;bits IORLW b’00000101’ ;Set WDT prescaler MOVWF OPTION_REG ;to 1:32 23.1.6 The Timer0 interrupt cannot wake the processor from Sleep since the timer is frozen during Sleep. USING TIMER0 WITH AN EXTERNAL CLOCK When Timer0 is in Counter mode, the synchronization of the T0CKI input and the Timer0 register is accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the internal phase clocks. Therefore, the high and low periods of the external clock source must meet the timing requirements as shown in Section 5.0 “Digital Electrical Characteristics”. When changing the prescaler assignment from the WDT to the Timer0 module, the following instruction sequence must be executed (see Example 23-2). EXAMPLE 23-2: TIMER0 INTERRUPT 23.1.7 OPERATION DURING SLEEP Timer0 cannot operate while the processor is in Sleep mode. The contents of the TMR0 register will remain unchanged while the processor is in Sleep mode. CHANGING PRESCALER (WDT TIMER0) CLRWDT ;Clear WDT and ;prescaler BANKSEL OPTION_REG ; MOVLW b’11110000’ ;Mask TMR0 select and ANDWF OPTION_REG,W ;prescaler bits IORLW b’00000011’ ;Set prescale to 1:16 MOVWF OPTION_REG ; TABLE 23-1: Name INTCON OPTION_REG SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page GIE PEIE T0IE INTE IOCIE T0IF INTF IOCIF 96 RAPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 77 TRISA7 TRISA6 TRISA5 TRISA2 TRISA1 TRISA0 TMR0 TRISGPA Timer0 Module Register TRISA4 TRISA3 135* 114 Legend: — = Unimplemented locations, read as ‘0’. Shaded cells are not used by the Timer0 module. * Page provides register information. DS20002331B-page 136 2013 Microchip Technology Inc. MCP19110/11 24.0 TIMER1 MODULE WITH GATE CONTROL The Timer1 module is a 16-bit timer with the following features: • • • • • 16-bit timer register pair (TMR1H:TMR1L) Readable and Writable (both registers) Selectable internal clock source 2-bit prescaler Interrupt on overflow Figure 24-1 is a block diagram of the Timer1 module. FIGURE 24-1: TIMER1 BLOCK DIAGRAM TMR1ON Set flag bit TMR1IF on Overflow TMR1(1) TMR1H TMR1L FOSC 1 Prescaler 1, 2, 4, 8 0 2 FOSC/4 T1CKPS<1:0> Note 1: TMR1 register increments on rising edge. 24.1 Timer1 Operation The Timer1 module is a 16-bit incrementing timer which is accessed through the TMR1H:TMR1L register pair. Writes to TMR1H or TMR1L directly update the counter. The timer is incremented on every instruction cycle. Timer1 is enabled by configuring the TMR1ON bit in the T1CON register. Table 24-1 displays the Timer1 enable selections. 24.2 Clock Source Selection The TMR1CS bit of the T1CON register is used to select the clock source for Timer1. Table 24-1 displays the clock source selections. 2013 Microchip Technology Inc. TMR1CS 24.2.1 INTERNAL CLOCK SOURCE The TMR1H:TMR1L register pair will increment on multiples of FOSC or FOSC/4 as determined by the Timer1 prescaler. As an example, when the FOSC internal clock source is selected, the Timer1 register value will increment by four counts every instruction clock cycle. TABLE 24-1: TMR1CS CLOCK SOURCE SELECTIONS Clock Source 1 8 MHz system Clock (FOSC) 0 2 MHz instruction clock (FOSC/4) DS20002331B-page 137 MCP19110/11 24.3 Timer1 Prescaler 24.5 Timer1 has four prescaler options allowing 1, 2, 4 or 8 divisions of the clock input. The T1CKPS bits of the T1CON register control the prescale counter. The prescale counter is not directly readable or writable; however, the prescaler counter is cleared upon a write to TMR1H or TMR1L. Unlike other standard mid-range Timer1 modules, the MCP19110/11 Timer1 module only clocks from an internal system clock, and thus does not run during Sleep mode, nor can it be used to wake the device from this mode. 24.6 24.4 Timer1 Interrupt Timer1 Control Register The Timer1 Control register (T1CON), shown in Register 24-1, is used to control Timer1 and select the various features of the Timer1 module. The Timer1 register pair (TMR1H:TMR1L) increments to FFFFh and rolls over to 0000h. When Timer1 rolls over, the Timer1 interrupt flag bit of the PIR1 register is set. To enable the interrupt on rollover, you must set these bits: • • • • Timer1 in Sleep TMR1ON bit of the T1CON register TMR1IE bit of the PIE1 register PEIE bit of the INTCON register GIE bit of the INTCON register The interrupt is cleared by clearing the TMR1IF bit in the Interrupt Service Routine. Note: The TMR1H:TMR1L register pair and the TMR1IF bit should be cleared before enabling interrupts. REGISTER 24-1: T1CON: TIMER1 CONTROL REGISTER U-0 U-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 — — T1CKPS1 T1CKPS0 — — TMR1CS TMR1ON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits 11 = 1:8 Prescale value 10 = 1:4 Prescale value 01 = 1:2 Prescale value 00 = 1:1 Prescale value bit 3-2 Unimplemented: Read as ‘0’ bit 1 TMR1CS: Timer1 Clock Source Control bit 1 = 8 MHz system clock (FOSC) 0 = 2 MHz instruction clock (FOSC) bit 0 TMR1ON: Timer1 On bit 1 = Enables Timer1 0 = Stops Timer1, Clears Timer1 gate flip-flop DS20002331B-page 138 x = Bit is unknown 2013 Microchip Technology Inc. MCP19110/11 TABLE 24-2: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER1 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page INTCON GIE PEIE T0IE INTE IOCE T0IF INTF IOCF 95 PIE1 — ADIE BCLIE SSPIE — — TMR2IE TMR1IE 95 PIR1 — ADIF BCLIF SSPIF — — TMR2IF TMR1IF 98 TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register 137* TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register 137* T1CON — — T1CKPS1 T1CKPS0 — — TMR1CS TMR1ON 138 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Timer1 module. * Page provides register information. 2013 Microchip Technology Inc. DS20002331B-page 139 MCP19110/11 25.0 TIMER2 MODULE The Timer2 module is an 8-bit timer with the following features: • • • • 8-bit timer register (TMR2) 8-bit period register (PR2) Interrupt on TMR2 match with PR2 Software programmable prescaler (1:1, 1:4, 1:16) See Figure 25-1 for a block diagram of Timer2. 25.1 The TMR2 and PR2 registers are both fully readable and writable. On any Reset, the TMR2 register is set to 00h and the PR2 register is set to FFh. Timer2 is turned on by setting the TMR2ON bit in the T2CON register to a ‘1’. Timer2 is turned off by clearing the TMR2ON bit to a ‘0’. The Timer2 prescaler is controlled by the T2CKPS bits in the T2CON register. The prescaler counter is cleared when: Timer2 Operation The clock input to the Timer2 module is the system clock (FOSC). The clock is fed into the Timer2 prescaler, which has prescale options of 1:1, 1:4 or 1:16. The output of the prescaler is then used to increment the TMR2 register. The values of TMR2 and PR2 are constantly compared to determine when they match. TMR2 will increment from 00h until it matches the value in PR2. When a match occurs, TMR2 is reset to 00h on the next increment cycle. FIGURE 25-1: The match output of the Timer2/PR2 comparator is used to set the TMR2IF interrupt flag bit in the PIR1 register. • A write to TMR2 occurs. • A write to T2CON occurs. • Any device Reset occurs (Power-on Reset, MCLR Reset, Watchdog Timer Reset, or Brown-out Reset). Note: TMR2 is not cleared when T2CON is written. TIMER2 BLOCK DIAGRAM TMR2 Output FOSC Prescaler 1:1, 1:4, 1:8, 1:16 2 Sets Flag bit TMR2IF Reset TMR2 Comparator EQ T2CKPS<1:0> PR2 DS20002331B-page 140 2013 Microchip Technology Inc. MCP19110/11 25.2 Timer2 Control Register REGISTER 25-1: T2CON: TIMER2 CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 — — — — — TMR2ON T2CKPS1 T2CKPS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-3 Unimplemented: Read as ‘0’ bit 2 TMR2ON: Timer2 On bit 1 = Timer2 is on 0 = Timer2 is off bit 1-0 T2CKPS<1:0>: Timer2 Clock Prescale Select bits 00 =Prescaler is 1 01 =Prescaler is 4 10 =Prescaler is 8 11 =Prescaler is 16 TABLE 25-1: x = Bit is unknown SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page INTCON GIE PEIE T0IE INTE IOCE T0IF INTF IOCF 95 PIE1 — ADIE BCLIE SSPIE — — TMR2IE TMR1IE 96 PIR1 — ADIF BCLIF SSPIF — — TMR2IF TMR1IF 98 — — — PR2 T2CON Timer2 Module Period Register TMR2 — — 140* TMR2ON T2CKPS1 T2CKPS0 Holding Register for the 8-bit TMR2 Time Base 141 140* Legend: — = unimplemented read as ‘0’. Shaded cells are not used for Timer2 module. * Page provides register information. 2013 Microchip Technology Inc. DS20002331B-page 141 MCP19110/11 NOTES: DS20002331B-page 142 2013 Microchip Technology Inc. MCP19110/11 26.0 PWM MODULE The CCP module implemented on the MCP19110/11 is a modified version of the CCP module found in standard mid-range microcontrollers. In the MCP19110/11, the PWM module is used to generate the system clock or system oscillator. This system clock will control the MCP19110/11 switching frequency, as well as set the maximum allowable duty cycle. The PWM module does not continuously adjust the duty cycle to control the output voltage. This is accomplished by the analog control loop and associated circuitry. 26.1 Standard Pulse-Width Modulation (PWM) Mode The PWM module output signal is used to set the operating switching frequency and maximum allowable duty cycle of the MCP19110/11. The actual duty cycle on the HDRV and LDRV is controlled by the analog PWM control loop. However, this duty cycle cannot be greater than the value in the PWMRL register. There are two modes of operation that concern the system clock PWM signal. These modes are stand-alone (non-frequency synchronization) and frequency synchronization. 26.1.1 STAND-ALONE (NON-FREQUENCY SYNCHRONIZATION) MODE 26.1.2 SWITCHING FREQUENCY SYNCHRONIZATION MODE The MCP19110/11 can be programmed to be a switching frequency MASTER or SLAVE device. The MASTER device functions as described in Section 26.1.1 “Stand-Alone (Non-Frequency Synchronization) Mode” with the exception of the system clock also being applied to GPA1. A SLAVE device will receive the MASTER system clock on GPA1. This MASTER system clock will be OR’ed with the output of the TIMER2 module. This OR’ed signal will latch PWMRL into PWMRH and PWMPHL into PWMPHH. Figure 26-1 shows a simplified block diagram of the CCP module in PWM mode. The PWMPHL register allows for a phase shift to be added to the SLAVE system clock. It is desired to have the MCP19110/11 SLAVE device’s system clock start point shifted by a programmed amount from the MASTER system clock. This SLAVE phase shift is specified by writing to the PWMPHL register. The SLAVE phase shift can be calculated by using the following equation. EQUATION 26-2: SLAVE PHASE SHIFT=PWMPHL•TOSC•(T2 PRESCALE VALUE) When the MCP19110/11 is running stand-alone, the PWM signal functions as the system clock. It is operating at the programmed switching frequency with a programmed maximum duty cycle (DCLOCK). The programmed maximum duty cycle is not adjusted on a cycle-by-cycle basis to control the MCP19110/11 system output. The required duty cycle (DBUCK) to control the output is adjusted by the MCP19110/11 analog control loop and associated circuitry. DCLOCK does, however, set the maximum allowable DBUCK. EQUATION 26-1: D BUCK 1 – D CLOCK 2013 Microchip Technology Inc. DS20002331B-page 143 MCP19110/11 FIGURE 26-1: SIMPLIFIED PWM BLOCK DIAGRAM PWMRL PWMPHL 8 8 PWMPHH (SLAVE) PWMRH (SLAVE) LATCH DATA LATCH DATA 8 8 Comparator Comparator 8 R Q S Q OSC SYSTEM CLOCK 8 RESET TIMER TMR2 (Note 1) 8 Comparator 8 CLKPIN_IN PR2 Note 1: TIMER 2 should be clocked by FOSC (8 MHz). A PWM output (Figure 26-2) has a time base (period) and a time that the output stays high (duty cycle). The frequency of the PWM is the inverse of the period (1/period). FIGURE 26-2: PWM OUTPUT 26.1.3 PWM PERIOD The PWM period is specified by writing to the PR2 register. The PWM period can be calculated using the following equation: EQUATION 26-3: Period PWM PERIOD=[(PR2)+1] x TOSC x (T2 PRESCALE VALUE) Duty Cycle TMR2 = PR2 + 1 TMR2 = PWMRH TMR2 = PR2 + 1 DS20002331B-page 144 When TMR2 is equal to PR2, the following two events occur on the next increment cycle: • TMR2 is cleared • The PWM duty cycle is latched from PWMRL into PWMRH 2013 Microchip Technology Inc. MCP19110/11 26.1.4 PWM DUTY CYCLE (DCLOCK) 26.2 The PWM duty cycle (DCLOCK) is specified by writing to the PWMRL register. Up to 8-bit resolution is available. The following equation is used to calculate the PWM duty cycle (DCLOCK): Operation during Sleep When the device is placed in Sleep, the allocated timer will not increment and the state of the module will not change. If the CLKPIN pin is driving a value, it will continue to drive that value. When the device wakes up, it will continue from this state. EQUATION 26-4: PWM DUTY CYCLE=PWMRL x TOSC x (T2 PRESCALE VALUE) The PWMRL bits can be written to at any time, but the duty cycle value is not latched into PWMRH until after a match between PR2 and TMR2 occurs. TABLE 26-1: SUMMARY OF REGISTERS ASSOCIATED WITH PWM MODULE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page APFCON — — — — — — — CLKSEL 112 T2CON — — — — — Name PR2 TMR2ON T2CKPS1 T2CKPS0 141 Timer2 Module Period Register 140* PWMRL PWM Register Low Byte 143* PWMPHL SLAVE Phase Shift Byte 143* BUFFCON MLTPH2 MLTPH1 MLTPH0 ASEL4 ASEL3 ASEL2 ASEL1 ASEL0 58 Legend: — = Unimplemented locations, read as ‘0’. Shaded cells are not used by Capture mode. * Page provides register information. 2013 Microchip Technology Inc. DS20002331B-page 145 MCP19110/11 NOTES: DS20002331B-page 146 2013 Microchip Technology Inc. MCP19110/11 27.0 27.1 The I2C interface supports the following modes and features: MASTER SYNCHRONOUS SERIAL PORT (MSSP) MODULE • • • • • • • • • • • • • Master SSP (MSSP) Module Overview The Master Synchronous Serial Port (MSSP) module is a serial interface useful for communicating with other peripheral or microcontroller devices. These peripheral devices may be Serial EEPROMs, shift registers, display drivers, A/D converters, etc. The MSSP module only operates in Inter-Integrated Circuit (I2C) mode. Master mode Slave mode Byte NACKing (Slave mode) Limited Multi-Master support 7-bit and 10-bit addressing Start and Stop interrupts Interrupt masking Clock stretching Bus collision detection General call address matching Dual Address masking Address Hold and Data Hold modes Selectable SDA hold times Figure 27-1 is a block diagram of the I2C interface module in Master mode. Figure 27-2 is a diagram of the I2C interface module in Slave mode. MSSP BLOCK DIAGRAM (I2C MASTER MODE) Internal data bus Read [SSPM 3:0] Write SSPBUF SCL Receive Enable (RCEN) SSPSR SCL in Bus Collision 2013 Microchip Technology Inc. MSb LSb Start bit, Stop bit, Acknowledge Generate (SSPCON2) Start bit detect, Stop bit detect, Write collision detect, Clock arbitration, State counter for, end of XMIT/RCV, Address Match detect (Hold off clock source) Shift Clock SDA in Clock Cntl SDA Baud rate generator (SSPADD) Clock arbitrate/BCOL detect FIGURE 27-1: Set/Reset: S, P, SSPSTAT, WCOL, SSPxOV Reset SEN, PEN (SSPCON2) Set SSPIF, BCLIF DS20002331B-page 147 MCP19110/11 FIGURE 27-2: MSSP BLOCK DIAGRAM (I2C SLAVE MODE) Internal Data Bus Read Write SSPBUF Reg SCL Shift Clock SSPSR Reg SDA MSb LSb SSPMSK Reg Match Detect Addr Match SSPADD Reg Start and Stop bit Detect 27.2 I2C MODE OVERVIEW The Inter-Integrated Circuit Bus (I2C) is a multi-master serial data communication bus. Devices communicate in a master/slave environment, where the master devices initiate the communication. A Slave device is controlled through addressing. The MSSP module has eight registers for I2C operation. They are the: • • • • • • • • • • MSSP Status Register (SSPSTAT) MSSP Control Register1 (SSPCON1) MSSP Control Register2 (SSPCON2) MSSP Control Register3 (SSPCON3) Serial Receive/Transmit Buffer (SSPBUF) MSSP Shift Register (SSPSR) - Not directly accessible MSSP Address Register (SSPADD) MSSP Address Register2 (SSPADD2) MSSP Address Mask Register1 (SSPMSK) MSSP Address Mask Register2 (SSPMSK2) DS20002331B-page 148 Set, Reset S, P bits (SSPSTAT Reg) The SSPCON1 register is used to define the I2C mode. Four selection bits (SSPCON1<3:0>) allow one of the following I2C modes to be selected: • • • • I2C Slave mode (7-bit address) I2C Slave mode (10-bit address) I2C Master mode, clock = OSC/4 (SSPADD +1) I2C firmware controlled Master mode (Slave idle) The SSPSTAT register gives the status of the data transfer. This information includes detection of a START or STOP bit, specifies if the data received byte was data or address, if the next byte is completion of the 10-bit address, and if this will be a read or write data transfer. The SSPBUF is the register to which transfer data is written to or read from. The SSPSR register shifts the data in or out of the device. In receive operation, the SSPBUF and SSPSR create a double buffer receiver. This allows reception of the next byte to begin before reading the last byte of received data. When the complete byte is received before the SSPBUF register is read, a receiver overflow has occurred and the SSPOV bit (SSPCON1<6>) is set and the byte in the SSPSR is lost. 2013 Microchip Technology Inc. MCP19110/11 The I2C bus specifies two signal connections: • Serial Clock (SCL) • Serial Data (SDA) Both the SCL and SDA connections are bidirectional open-drain lines, each requiring pull-up resistors for the supply voltage. Pulling the line to ground is considered a logical zero; letting the line float is considered a logical one. Before selecting any I2C mode, the SCL and SDA pins must be programmed to inputs by setting the appropriate TRIS bits. Selecting I2C mode, by setting the SSPEN bit, enables the SCL and SDA pins to be used as clock and data lines in I2C mode. Figure 27-3 shows a typical connection between two devices configured as master and slave. FIGURE 27-3: I2C MASTER/SLAVE CONNECTION VDD SCL SCL VDD Master SDA Slave SDA The I2C bus can operate with one or more master devices and one or more slave devices. There are four potential modes of operation for a given device: • Master Transmit mode (master is transmitting data to a slave) • Master Receive mode (master is receiving data from a slave) • Slave Transmit mode (slave is transmitting data to a master) • Slave Receive mode (slave is receiving data from the master) To begin communication, a master device starts out in Master Transmit mode. The master device sends out a Start bit followed by the address byte of the slave it intends to communicate with. This is followed by a single Read/Write bit, which determines whether the master intends to transmit to or receive data from the slave device. If the requested slave exists on the bus, it will respond with an Acknowledge bit, otherwise known as an ACK. The master then continues in either Transmit mode or Receive mode and the slave continues in the complement, either in Receive mode or Transmit mode, respectively. 2013 Microchip Technology Inc. A Start bit is indicated by a high-to-low transition of the SDA line while the SCL line is held high. Address and data bytes are sent out, Most Significant bit (MSb) first. The Read/Write bit is sent out as a logical one when the master intends to read data from the slave, and is sent out as a logical zero when it intends to write data to the slave. The Acknowledge bit (ACK) is an active-low signal, which holds the SDA line low to indicate to the transmitter that the slave device has received the transmitted data and is ready to receive more. The transition of a data bit is always performed while the SCL line is held low. Transitions that occur while the SCL line is held high are used to indicate Start and Stop bits. If the master intends to write to the slave, then it repeatedly sends out a byte of data, with the slave responding after each byte with an ACK bit. In this example, the master device is in Master Transmit mode, and the slave is in Slave Receive mode. If the master intends to read from the slave, then it repeatedly receives a byte of data from the slave, and responds after each byte with an ACK bit. In this example, the master device is in Master Receive mode, and the slave is Slave Transmit mode. On the last byte of data communicated, the master device may end the transmission by sending a Stop bit. If the master device is in Receive mode, it sends the Stop bit in place of the last ACK bit. A Stop bit is indicated by a low-to-high transition of the SDA line, while the SCL line is held high. In some cases, the master may want to maintain control of the bus and reinitiate another transmission. If so, the master device may send another Start bit in place of the Stop bit or last ACK bit when it is in receive mode. The I2C bus specifies three message protocols: • Single message where a master writes data to a slave • Single message where a master reads data from a slave • Combined message where a master initiates a minimum of two writes, or two reads, or a combination of writes and reads, to one or more slaves When one device is transmitting a logical one, or letting the line float, and a second device is transmitting a logical zero, or holding the line low, the first device can detect that the line is not a logical one. This detection, when used on the SCL line, is called clock stretching. Clock stretching gives slave devices a mechanism to control the flow of data. When this detection is used on the SDA line, it is called arbitration. Arbitration ensures that there is only one master device communicating at any single time. DS20002331B-page 149 MCP19110/11 27.2.1 CLOCK STRETCHING When a slave device has not completed processing data, it can delay the transfer of more data through the process of Clock Stretching. An addressed slave device may hold the SCL clock line low after receiving or sending a bit, indicating that it is not yet ready to continue. The master that is communicating with the slave will attempt to raise the SCL line in order to transfer the next bit, but will detect that the clock line has not yet been released. Because the SCL connection is open-drain, the slave has the ability to hold that line low until it is ready to continue communicating. Clock stretching allows receivers that cannot keep up with a transmitter to control the flow of incoming data. 27.2.2 ARBITRATION Each master device must monitor the bus for Start and Stop bits. If the device detects that the bus is busy, it cannot begin a new message until the bus returns to an Idle state. However, two master devices may try to initiate a transmission on or about the same time. When this occurs, the process of arbitration begins. Each transmitter checks the level of the SDA data line and compares it to the level that it expects to find. The first transmitter to observe that the two levels don't match, loses arbitration, and must stop transmitting on the SDA line. For example, if one transmitter holds the SDA line to a logical one (lets it float) and a second transmitter holds it to a logical zero (pulls it low), the result is that the SDA line will be low. The first transmitter then observes that the level of the line is different than expected and concludes that another transmitter is communicating. The first transmitter to notice this difference is the one that loses arbitration and must stop driving the SDA line. If this transmitter is also a master device, it also must stop driving the SCL line. It then can monitor the lines for a Stop condition before trying to reissue its transmission. In the meantime, the other device that has not noticed any difference between the expected and actual levels on the SDA line continues with its original transmission. It can do so without any complications, because so far, the transmission appears exactly as expected with no other transmitter disturbing the message. If two master devices are sending a message to two different slave devices at the address stage, the master sending the lower slave address always wins arbitration. When two master devices send messages to the same slave address, and addresses can sometimes refer to multiple slaves, the arbitration process must continue into the data stage. Arbitration usually occurs very rarely, but it is a necessary process for proper multi-master support. 27.3 I2C MODE OPERATION All MSSP I2C communication is byte oriented and shifted out MSb first. Six SFR registers and two interrupt flags interface the module with the PIC microcontroller and user software. Two pins, SDA and SCL, are exercised by the module to communicate with other external I2C devices. 27.3.1 BYTE FORMAT All communication in I2C is done in 9-bit segments. A byte is sent from a Master to a Slave or vice-versa, followed by an Acknowledge bit sent back. After the 8th falling edge of the SCL line, the device outputting data on the SDA changes that pin to an input and reads in an acknowledge value on the next clock pulse. The clock signal, SCL, is provided by the master. Data is valid to change while the SCL signal is low, and sampled on the rising edge of the clock. Changes on the SDA line while the SCL line is high define special conditions on the bus, explained below. 27.3.2 DEFINITION OF I2C TERMINOLOGY There is language and terminology in the description of I2C communication that have definitions specific to I2C. That word usage is defined below and may be used in the rest of this document without explanation. This table was adapted from the Philips I2C specification. 27.3.3 SDA AND SCL PINS On the MCP19110/11, the SCL and SDA pins are always open-drain. These pins should be set by the user to inputs by setting the appropriate TRIS bits. Note: Data is tied to output zero when an I2C mode is enabled. Slave Transmit mode can also be arbitrated, when a master addresses multiple slaves, but this is less common. DS20002331B-page 150 2013 Microchip Technology Inc. MCP19110/11 27.3.4 SDA HOLD TIME The hold time of the SDA pin is selected by the SDAHT bit of the SSPCON3 register. Hold time is the time SDA is held valid after the falling edge of SCL. Setting the SDAHT bit selects a longer 300 ns minimum hold time and may help on buses with large capacitance. TABLE 27-1: I2C BUS TERMS TERM Description Transmitter The device which shifts data out onto the bus. Receiver The device which shifts data in from the bus. Master The device that initiates a transfer, generates clock signals and terminates a transfer. Slave The device addressed by the master. Multi-Master A bus with more than one device that can initiate data transfers. Arbitration Procedure to ensure that only one master at a time controls the bus. Winning arbitration ensures that the message is not corrupted. Synchronization Procedure to synchronize the clocks of two or more devices on the bus. Idle No master is controlling the bus, and both SDA and SCL lines are high. Active Any time one or more master devices are controlling the bus. Addressed Slave Slave device that has received a matching address and is actively being clocked by a master. Matching Address Address byte that is clocked into a slave that matches the value stored in SSPADDx. Write Request Slave receives a matching address with R/W bit clear, and is ready to clock in data. Read Request Master sends an address byte with the R/W bit set, indicating that it wishes to clock data out of the Slave. This data is the next and all following bytes until a Restart or Stop. Clock Stretching When a device on the bus holds SCL low to stall communication. Bus Collision Any time the SDA line is sampled low by the module while it is outputting and expected high state. 27.3.5 START CONDITION 2C specification defines a Start condition as a The I transition of SDA from a high to a low state, while SCL line is high. A Start condition is always generated by the master and signifies the transition of the bus from an Idle to an Active state. Figure 27-4 shows the wave forms for Start and Stop conditions. A bus collision can occur on a Start condition if the module samples the SDA line low before asserting it low. This does not conform to the I2C Specification, that states no bus collision can occur on a Start. 27.3.6 STOP CONDITION A Stop condition is a transition of the SDA line from low-to-high state while the SCL line is high. Note: At least one SCL low time must appear before a Stop is valid, therefore, if the SDA line goes low then high again while the SCL line stays high, only the Start condition is detected. 2013 Microchip Technology Inc. 27.3.7 RESTART CONDITION A Restart is valid any time that a Stop would be valid. A master can issue a Restart if it wishes to hold the bus after terminating the current transfer. A Restart has the same effect on the slave that a Start would, resetting all slave logic and preparing it to clock in an address. The master may want to address the same or another slave. In 10-bit Addressing Slave mode, a Restart is required for the master to clock data out of the addressed slave. Once a slave has been fully addressed, matching both high and low address bytes, the master can issue a Restart and the high address byte with the R/W bit set. The slave logic will then hold the clock and prepare to clock out data. After a full match with R/W clear in 10-bit mode, a prior match flag is set and maintained. Until a Stop condition, a high address with R/W clear or a high address match fails. DS20002331B-page 151 MCP19110/11 27.3.8 START/STOP CONDITION INTERRUPT MASKING The SCIE and PCIE bits of the SSPCON3 register can enable the generation of an interrupt in Slave modes that do not typically support this function. These bits will have no effect on slave modes where interrupt on Start and Stop detect are already enabled. I2C START AND STOP CONDITIONS FIGURE 27-4: SDA SCL S Start Condition FIGURE 27-5: P Change of Data Allowed Change of Data Allowed Stop Condition I2C RESTART CONDITION Sr Change of Data Allowed 27.3.9 ACKNOWLEDGE SEQUENCE The 9th SCL pulse for any transferred byte in I2C is dedicated as an Acknowledge. It allows receiving devices to respond back to the transmitter by pulling the SDA line low. The transmitter must release control of the line during this time to shift in the response. The Acknowledge (ACK) is an active-low signal, pulling the SDA line low indicates to the transmitter that the device has received the transmitted data and is ready to receive more. The result of an ACK is placed in the ACKSTAT bit of the SSPCON2 register. Slave software, when the AHEN and DHEN bits are set, allow the user to set the ACK value sent back to the transmitter. The ACKDT bit of the SSPCON2 register is set/cleared to determine the response. DS20002331B-page 152 Restart Condition Change of Data Allowed Slave hardware will generate an ACK response if the AHEN and DHEN bits of the SSPCON3 register are clear. There are certain conditions where an ACK will not be sent by the slave. If the BF bit of the SSPSTAT register or the SSPOV bit of the SSPCON1 register are set when a byte is received, an ACK will not be sent. When the module is addressed, after the 8th falling edge of SCL on the bus, the ACKTIM bit of the SSPCON3 register is set. The ACKTIM bit indicates the acknowledge time of the active bus. The ACKTIM Status bit is only active when the AHEN bit or DHEN bit is enabled. 2013 Microchip Technology Inc. MCP19110/11 27.4 I2C SLAVE MODE OPERATION The MSSP Slave mode operates in one of the four modes selected in the SSPM bits of SSPCON1 register. The modes can be divided into 7-bit and 10-bit Addressing mode. 10-bit Addressing mode operates the same as 7-bit, with some additional overhead for handling the larger addresses. Modes with Start and Stop bit interrupts operate the same as the other modes. The exception is the SSPIF bit getting set upon detection of a Start, Restart or Stop condition. 27.4.1 SLAVE MODE ADDRESSES, SSPADD The SSPADD register (Register 27-7) contains the Slave mode address. The first byte received after a Start or Restart condition is compared against the value stored in this register. If the byte matches, the value is loaded into the SSPBUF register and an interrupt is generated. If the value does not match, the module goes idle and no indication is given to the software that anything happened. The SSPMSK register (Register 27-6) affects the address matching process. See Section 27.4.10 “SSPMSKx Register” for more information. 27.4.2 SECOND SLAVE MODE ADDRESS, SSPADD2 The SSPADD2 register (Register 27-9) contains a second Slave mode address. To enable the use of this second Slave mode address, bit 0 must be set. The first byte received after a Start or Restart condition is compared against the value stored in this register. If the byte matches, the value is loaded into the SSPBUF register and an interrupt is generated. If the value does not match, the module goes Idle and no indication is given to the software that anything happened. The SSPMSK2 register, Register 27-8, affects the address matching process. See Section 27.4.10 “SSPMSKx Register” for more information. 27.4.2.1 I2C Slave 7-bit Addressing Mode In 7-bit Addressing mode, the LSb of the received data byte is ignored when determining if there is an address match. 2013 Microchip Technology Inc. 27.4.2.2 I2C Slave 10-bit Addressing Mode In 10-bit Addressing mode, the first received byte is compared to the binary value of ‘1 1 1 1 0 A9 A8 0’. A9 and A8 are the two MSb of the 10-bit address and stored in bits 2 and 1 of the SSPADDx register. After the acknowledge of the high byte, the UA bit is set, and SCL is held low until the user updates SSPADDx with the low address. The low address byte is clocked in and all eight bits are compared to the low address value in SSPADDx. Even if there is no address match, SSPIF and UA are set, and SCL is held low until SSPADDx is updated to receive a high byte again. When SSPADDx is updated, the UA bit is cleared. This ensures the module is ready to receive the high address byte on the next communication. A high and low address match as a write request is required at the start of all 10-bit addressing communication. A transmission can be initiated by issuing a Restart once the slave is addressed, and clocking in the high address with the R/W bit set. The slave hardware will then acknowledge the read request and prepare to clock out data. This is only valid for a slave after it has received a complete high and low address byte match. 27.4.3 SLAVE RECEPTION When the R/W bit of a matching received address byte is clear, the R/W bit of the SSPSTAT register is cleared. The received address is loaded into the SSPBUF register and acknowledged. When an overflow condition exists for a received address, then not Acknowledge is given. An overflow condition is defined as either bit BF of the SSPSTAT register is set, or bit SSPOV of the SSPCON1 register is set. The BOEN bit of the SSPCON3 register modifies this operation. For more information, see Register 27-5. An MSSP interrupt is generated for each transferred data byte. Flag bit, SSPIF, must be cleared by software. When the SEN bit of the SSPCON2 register is set, SCL will be held low (clock stretch) following each received byte. The clock must be released by setting the CKP bit of the SSPCON1 register, except sometimes in 10-bit mode. DS20002331B-page 153 MCP19110/11 27.4.3.1 7-bit Addressing Reception This section describes a standard sequence of events for the MSSP module configured as an I2C Slave in 7-bit Addressing mode, all decisions made by hardware or software and their effect on reception. Figure 27-6 and Figure 27-7 are used as a visual reference for this description. This is a step-by-step process of what typically must be done to accomplish I2C communication. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. Start bit detected. S bit of SSPSTAT is set; SSPIF is set if interrupt on Start detect is enabled. Matching address with R/W bit clear is received. The slave pulls SDA low sending an ACK to the master, and sets SSPIF bit. Software clears the SSPIF bit. Software reads received address from SSPBUF clearing the BF flag. If SEN = 1, Slave software sets CKP bit to release the SCL line. The master clocks out a data byte. Slave drives SDA low, sending an ACK to the master, and sets SSPIF bit. Software clears SSPIF. Software reads the received byte from SSPBUF clearing BF. Steps 8–12 are repeated for all received bytes from the Master. Master sends Stop condition, setting P bit of SSPSTAT, and the bus goes Idle. 27.4.3.2 7-bit Reception with AHEN and DHEN Slave device reception with AHEN and DHEN set operates the same as without these options, with extra interrupts and clock stretching added after the 8th falling edge of SCL. These additional interrupts allow the slave software to decide whether it wants to ACK the receive address or data byte, rather than the hardware. This functionality adds support for PMBus that was not present on previous versions of this module. This list describes the steps that need to be taken by slave software to use these options for I2C communication. Figure 27-8 displays a module using both address and data holding. Figure 27-9 includes the operation with the SEN bit of the SSPCON2 register set. 1. S bit of SSPSTAT is set; SSPIF is set if interrupt on Start detect is enabled. 2. Matching address with R/W bit clear is clocked in. SSPIF is set and CKP cleared after the 8th falling edge of SCL. 3. Slave clears the SSPIF. 4. Slave can look at the ACKTIM bit of the SSPCON3 register to determine if the SSPIF was after or before the ACK. 5. Slave reads the address value from SSPBUF, clearing the BF flag. 6. Slave sets ACK value clocked out to the master by setting ACKDT. 7. Slave releases the clock by setting CKP. 8. SSPxIF is set after an ACK, not after a NACK. 9. If SEN = 1 the slave hardware will stretch the clock after the ACK. 10. Slave clears SSPIF. Note: SSPIF is still set after the 9th falling edge of SCL even if there is no clock stretching and BF has been cleared. Only if NACK is sent to Master is SSPIF not set. 11. SSPIF set and CKP cleared after 8th falling edge of SCL for a received data byte. 12. Slave looks at ACKTIM bit of SSPCON3 to determine the source of the interrupt. 13. Slave reads the received data from SSPBUF clearing BF. 14. Steps 7–14 are the same for each received data byte. 15. Communication is ended by either the slave sending an ACK = 1, or the master sending a Stop condition. If a Stop is sent and Interrupt on Stop Detect is disabled, the slave will only know by polling the P bit of the SSTSTAT register. DS20002331B-page 154 2013 Microchip Technology Inc. 2013 Microchip Technology Inc. I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 0, DHEN = 0) FIGURE 27-6: Bus Master sends Stop condition From Slave to Master Receiving Address Receiving Data Receiving Data ACK = 1 SDA SCL S A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 ACK 8 9 D7 D6 D5 D4 D3 D2 D1 1 2 3 4 5 6 7 D0 ACK D7 8 9 1 D6 D5 D4 D3 D2 D1 D0 2 3 4 5 6 7 8 9 P SSPIF Cleared by software Cleared by software SSPIF set on 9th falling edge of SCL BF SSPBUF is read First byte of data is available in SSPBUF SSPOV SSPOV set because SSPBUF is still full. ACK is not sent. MCP19110/11 DS20002331B-page 155 Bus Master sends Stop condition Receive Address SDA SCL S Receive Data A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 R/W=0 ACK 8 9 SEN Receive Data D7 D6 D5 D4 D3 D2 D1 D0 ACK 1 2 3 4 5 6 7 8 9 SEN ACK D7 D6 D5 D4 D3 D2 D1 D0 1 2 3 4 5 6 7 8 9 P Clock is held low until CKP is set to ‘1’ SSPIF Cleared by software BF SSPBUF is read Cleared by software SSPIF set on 9th falling edge of SCL First byte of data is available in SSPBUF SSPOV SSPOV set because SSPBUF is still full. ACK is not sent. CKP CKP is written to ‘1’ in software, releasing SCL CKP is written to 1 in software, releasing SCL 2013 Microchip Technology Inc. SCL is not held low because ACK= 1 MCP19110/11 DS20002331B-page 156 I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 0, DHEN = 0) FIGURE 27-7: 2013 Microchip Technology Inc. FIGURE 27-8: I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 1, DHEN = 1) Master Releases SDAx to slave for ACK sequence Master sends Stop condition Receiving Address SDA Receiving Data Received Data ACK ACK D7 D6 D5 D4 D3 D2 D1 D0 A7 A6 A5 A4 A3 A2 A1 ACK=1 D7 D6 D5 D4 D3 D2 D1 D0 SCL S 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 P SSPIF If AHEN = 1: SSPIF is set BF SSPIF is set on 9th falling edge of SCL, after ACK Address is read from SSBUF Cleared by software No interrupt after not ACK from Slave Data is read from SSPBUF ACKDT Slave software clears ACKDT to Slave software sets ACKDT to not ACK ACK the received byte CKP When AHEN=1: CKP is cleared by hardware and SCL is stretched When DHEN=1: CKP is cleared by hardware on 8th falling edge of SCL CKP set by software, SCL is released ACKTIM ACKTIM set by hardware on 8th falling edge of SCL P ACKTIM set by hardware on 8th falling edge of SCL DS20002331B-page 157 MCP19110/11 S ACKTIM cleared by hardware in 9th rising edge of SCL R/W = 0 Receiving Address SDA Master sends Stop condition Master releases SDA to slave for ACK sequence Receive Data ACK A7 A6 A5 A4 A3 A2 A1 ACK SCL S 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 ACK Receive Data D7 D6 D5 D4 D3 D2 D1 D0 8 9 D7 D6 D5 D4 D3 D2 D1 D0 1 2 3 4 5 6 7 8 9 P SSPIF No interrupt after if not ACK from Slave Cleared by software BF Received address is loaded into SSPBUF Received data is available on SSPBUF ACKDT Slave software clears ACKDT to ACK the received byte SSPBUF can be read any time before next byte is loaded Slave sends not ACK CKP When AHEN = 1; on the 8th falling edge of SCL of an address byte, CKP is cleared When DHEN = 1; on the 8th falling edge of SCL of a received data byte, CKP is cleared ACKTIM 2013 Microchip Technology Inc. ACKTIM is set by hardware on 8th falling edge of SCL S P ACKTIM is cleared by hardware on 9th rising edge of SCL Set by software, release SCL CKP is not cleared if not ACK MCP19110/11 DS20002331B-page 158 I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 1, DHEN = 1) FIGURE 27-9: MCP19110/11 27.4.4 SLAVE TRANSMISSION 27.4.4.2 7-bit Transmission When the R/W bit of the incoming address byte is set and an address match occurs, the R/W bit of the SSPSTAT register is set. The received address is loaded into the SSPBUF register, and an ACK pulse is sent by the slave on the ninth bit. A master device can transmit a read request to a slave, and then clock data out of the slave. The list below outlines what software for a slave will need to do to accomplish a standard transmission. Figure 27-10 can be used as a reference to this list. Following the ACK, slave hardware clears the CKP bit and the SCL pin is held low (see Section 27.4.7 “Clock Stretching” for more detail). By stretching the clock, the master will be unable to assert another clock pulse until the slave is done preparing the transmit data. 1. The transmit data must be loaded into the SSPBUF register which also loads the SSPSR register. Then the SCL pin should be released by setting the CKP bit of the SSPCON1 register. The eight data bits are shifted out on the falling edge of the SCL input. This ensures that the SDA signal is valid during the SCL high time. The ACK pulse from the master-receiver is latched on the rising edge of the ninth SCL input pulse. This ACK value is copied to the ACKSTAT bit of the SSPCON2 register. If ACKSTAT is set (not ACK), then the data transfer is complete. In this case, when the not ACK is latched by the slave, the slave goes Idle and waits for another occurrence of the Start bit. If the SDA line was low (ACK), the next transmit data must be loaded into the SSPBUF register. Again, the SCL pin must be released by setting bit CKP. An MSSP interrupt is generated for each data transfer byte. The SSPIF bit must be cleared by software and the SSPSTAT register is used to determine the status of the byte. The SSPIF bit is set on the falling edge of the ninth clock pulse. 27.4.4.1 Slave Mode Bus Collision A slave receives a Read request and begins shifting data out on the SDA line. If a bus collision is detected and the SBCDE bit of the SSPCON3 register is set, the BCLIF bit of the PIR register is set. Once a bus collision is detected, the slave goes Idle and waits to be addressed again. User software can use the BCLIF bit to handle a slave bus collision. 2013 Microchip Technology Inc. Master sends a Start condition on SDA and SCL. 2. S bit of SSPSTAT is set; SSPIF is set if interrupt on Start detect is enabled. 3. Matching address with R/W bit set is received by the Slave setting SSPIF bit. 4. Slave hardware generates an ACK and sets SSPIF. 5. SSPIF bit is cleared by user. 6. Software reads the received address from SSPBUF, clearing BF. 7. R/W is set so CKP was automatically cleared after the ACK. 8. The slave software loads the transmit data into SSPBUF. 9. CKP bit is set releasing SCL, allowing the master to clock the data out of the slave. 10. SSPIF is set after the ACK response from the master is loaded into the ACKSTAT register. 11. SSPIF bit is cleared. 12. The slave software checks the ACKSTAT bit to see if the master wants to clock out more data. Note 1:If the master ACKs the clock will be stretched. 2: ACKSTAT is the only bit updated on the rising edge of SCL (9th) rather than the falling. 13. Steps 9-13 are repeated for each transmitted byte. 14. If the master sends a not ACK; the clock is not held, but SSPIF is still set. 15. The master sends a Restart condition or a Stop. 16. The slave is no longer addressed. DS20002331B-page 159 I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN = 0) Master sends Stop condition Receiving Address SDA A7 A6 A5 A4 A3 A2 A1 R/W = 1 ACK 1 8 Automatic Transmitting Data Automatic Transmitting Data ACK D7 D6 D5 D4 D3 D2 D1 D0 ACK D7 D6 D5 D4 D3 D2 D1 D0 1 1 SCL 2 3 4 5 6 7 9 2 3 4 5 6 7 8 9 2 3 4 5 6 7 8 S SSPIF Cleared by software BF Received address is read from SSPBUF Data to transmit is loaded into SSPBUF BF is automatically cleared after 8th falling edge of SCL CKP When R/W is set SCL is always held low after 9th SCL falling edge CKP is not held for not Set by software ACK ACKSTAT Masters not ACK is copied to ACKSTAT R/W R/W is copied from the matching address byte D/A 2013 Microchip Technology Inc. Indicates an address has been received S P 9 P MCP19110/11 DS20002331B-page 160 FIGURE 27-10: MCP19110/11 27.4.4.3 7-bit Transmission with Address Hold Enabled Setting the AHEN bit of the SSPCON3 register enables additional clock stretching and interrupt generation after the 8th falling edge of a received matching address. Once a matching address has been clocked in, CKP is cleared and the SSPIF interrupt is set. Figure 27-11 displays a standard waveform of a 7-bit Address Slave Transmission with AHEN enabled. 1. 2. Bus starts Idle. Master sends Start condition; the S bit of SSPSTAT is set; SSPIF is set if interrupt on Start detect is enabled. 3. Master sends matching address with R/W bit set. After the 8th falling edge of the SCL line, the CKP bit is cleared and SSPIF interrupt is generated. 4. Slave software clears SSPIF. 5. Slave software reads ACKTIM bit of SSPCON3 register, and R/W and D/A of the SSPSTAT register to determine the source of the interrupt. 6. Slave reads the address value from the SSPBUF register clearing the BF bit. 7. Slave software decides from this information if it wishes to ACK or not ACK and sets ACKDT bit of the SSPCON2 register accordingly. 8. Slave sets the CKP bit releasing SCL. 9. Master clocks in the ACK value from the slave. 10. Slave hardware automatically clears the CKP bit and sets SSPIF after the ACK if the R/W bit is set. 11. Slave software clears SSPIF. 12. Slave loads value to transmit to the master into SSPBUF setting the BF bit. Note: SSPBUF cannot be loaded until after the ACK. 13. Slave sets CKP bit releasing the clock. 14. Master clocks out the data from the slave and sends an ACK value on the 9th SCL pulse. 15. Slave hardware copies the ACK value into the ACKSTAT bit of the SSPCON2 register. 16. Steps 10–15 are repeated for each byte transmitted to the master from the slave. 17. If the master sends a not ACK, the slave releases the bus, allowing the master to send a Stop and end the communication. Note: Master must send a not ACK on the last byte to ensure that the slave releases the SCL line to receive a Stop. 2013 Microchip Technology Inc. DS20002331B-page 161 Master sends Stop condition Master releases SDAx to slave for ACK sequence Receiving Address SDA ACK A7 A6 A5 A4 A3 A2 A1 SCL S 1 2 3 4 5 6 Automatic R/W = 1 7 8 9 Transmitting Data Automatic ACK D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 1 1 2 3 4 5 6 7 8 9 Transmitting Data 2 3 4 5 6 7 Cleared by software BF Received address is read from SSPBUF Data to transmit is loaded into SSPBUF BF is automatically cleared after 8th falling edge of SCL ACKDT Slave clears ACKDT to ACK address ACKSTAT Master’s ACK response is copied to SSPSTAT CKP When AHEN = 1; CKP is cleared by hardware after receiving matching address. ACKTIM ACKTIM is set on 8th falling edge of SCL 2013 Microchip Technology Inc. D/A 8 9 P SSPIF R/W ACK When R/W = 1; CKP is always cleared after ACK Set by software, releases SCL ACKTIM is cleared on 9th rising edge of SCL CKP not cleared after not ACK MCP19110/11 DS20002331B-page 162 I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN = 1) FIGURE 27-11: MCP19110/11 27.4.5 SLAVE MODE 10-BIT ADDRESS RECEPTION This section describes a standard sequence of events for the MSSP module configured as an I2C Slave in 10-bit Addressing mode. Figure 27-12 is used as a visual reference for this description. This is a step-by-step process of what must be done by slave software to accomplish I2C communication. 1. 2. 3. 4. 5. 6. 7. 8. Bus starts Idle. Master sends Start condition; S bit of SSPSTAT is set; SSPIF is set, if interrupt on Start detect is enabled. Master sends matching high address with R/W bit clear; UA bit of the SSPSTAT register is set. Slave sends ACK and SSPIF is set. Software clears the SSPIF bit. Software reads received address from SSPBUF clearing the BF flag. Slave loads low address into SSPADDx, releasing SCL. Master sends matching low-address byte to the Slave; UA bit is set. Note: 9. 27.4.6 10-BIT ADDRESSING WITH ADDRESS OR DATA HOLD Reception using 10-bit addressing with AHEN or DHEN set is the same as with 7-bit modes. The only difference is the need to update the SSPADDx register using the UA bit. All functionality, specifically when the CKP bit is cleared and SCL line is held low, are the same. Figure 27-13 can be used as a reference of a slave in 10-bit addressing with AHEN set. Figure 27-14 shows a standard waveform for a slave transmitter in 10-bit Addressing mode. Updates to the SSPADDx register are not allowed until after the ACK sequence. Slave sends ACK and SSPIF is set. Note: If the low address does not match, SSPIF and UA are still set so that the slave software can set SSPADDx back to the high address. BF is not set because there is no match. CKP is unaffected. 10. Slave clears SSPIF. 11. Slave reads the received matching address from SSPBUF clearing BF. 12. Slave loads high address into SSPADD. 13. Master clocks a data byte to the slave and clocks out the slave’s ACK on the 9th SCL pulse; SSPIF is set. 14. If SEN bit of SSPCON2 is set, CKP is cleared by hardware and the clock is stretched. 15. Slave clears SSPIF. 16. Slave reads the received byte from SSPBUF clearing BF. 17. If SEN is set, the slave sets CKP to release the SCL. 18. Steps 13–17 repeat for each received byte. 19. Master sends Stop to end the transmission. 2013 Microchip Technology Inc. DS20002331B-page 163 Master sends Stop condition Receive First Address Byte SDA SCL 1 1 1 1 0 A9 A8 1 2 3 4 5 6 7 Receive Second Address Byte ACK 8 9 A7 A6 A5 A4 A3 A2 A1 A0 ACK 1 2 3 4 5 6 7 8 9 Receive Data Receive Data D7 D6 D5 D4 D3 D2 D1 D0 ACK 1 2 3 4 5 6 7 8 9 D7 D6 D5 D4 D3 D2 D1 D0 ACK 1 2 3 4 5 6 7 S SCL is held low while CKP = 0 SSPIF Set by hardware on 9th falling edge Cleared by software BF Receive address is read from SSPBUF If address matches SSPADD it is loaded into SSPBUF Data is read from SSPBUF UA When UA = 1; SCL is held low Software updates SSPADD and releases SCL CKP 2013 Microchip Technology Inc. When SEN = 1; CKP is cleared after 9th falling edge of received byte Set by software, releasing SCL 8 9 P MCP19110/11 DS20002331B-page 164 I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 0, DHEN = 0) FIGURE 27-12: 2013 Microchip Technology Inc. I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 1, DHEN = 0) FIGURE 27-13: Receive First Address Byte SDA Receive Second Address Byte R/W = 0 1 1 1 1 0 A9 A8 1 2 3 4 5 6 7 ACK Receive Data A7 A6 A5 A4 A3 A2 A1 A0 ACK 1 2 3 4 5 6 7 8 9 Receive Data D7 D6 D5 D4 D3 D2 D1 1 2 3 4 5 6 7 D0 ACK D7 D6 D5 SCL S 8 9 UA UA 8 9 1 2 SSPIF Set by hardware on 9th falling edge Cleared by software Cleared by software BF SSPBUF can be read anytime before the next received byte Received data is read from SSPBUF ACKDT Slave software clears ACKDT to ACK the received byte UA Update to SSPADD is not allowed until 9th falling edge of SCL Update of SSPADD, clears UA and releases SCL If when AHEN = 1; on the 8th falling edge of SCL of an address byte, CKP is cleared DS20002331B-page 165 ACKTIM ACKTIM is set by hardware on 8th falling edge of SCL Set CKP with software releases SCL MCP19110/11 CKP Master sends Restart event Receiving Address R/W = 0 SDA 1 1 1 1 0 A9 A8 SCL S 1 2 3 4 5 6 7 ACK 8 9 Master sends not ACK Receiving Second Address Byte Receive First Address Byte A7 A6 A5 A4 A3 A2 A1 A0 ACK 1 1 1 1 0 A9 A8 1 2 3 4 5 6 7 8 1 9 2 3 4 5 6 7 8 Transmitting Data Byte ACK 9 1 2 3 4 5 6 7 SSPIF Cleared by software Set by hardware BF SSPBUF loaded with received address Received address is read from SSPBUF UA UA indicates SSPADD must be updated After SSPADD is updated, UA is cleared and SCL is released Data to transmit is loaded into SSPBUF High address is loaded back into SSPADD CKP When R/W = 1; CKP is cleared on 9th falling edge of SCLx ACKSTAT Set by software releases SCL Masters not ACK is copied R/W R/W is copied from the matching address byte D/A 2013 Microchip Technology Inc. Indicates an address has been received ACK = 1 D7 D6 D5 D4 D3 D2 D1 D0 Sr Set by hardware Master sends Stop condition 8 9 P MCP19110/11 DS20002331B-page 166 I2C SLAVE, 10-BIT ADDRESS, TRANSMISSION (SEN = 0, AHEN = 0, DHEN = 0) FIGURE 27-14: MCP19110/11 27.4.7 CLOCK STRETCHING 27.4.7.2 Clock stretching occurs when a device on the bus holds the SCL line low, effectively pausing communication. The slave may stretch the clock to allow more time to handle data or prepare a response for the master device. A master device is not concerned with stretching, as anytime it is active on the bus and not transferring data, it is stretching. Any stretching done by a slave is invisible to the master software and handled by the hardware that generates SCL. The CKP bit of the SSPCON1 register is used to control stretching in software. Any time the CKP bit is cleared, the module will wait for the SCL line to go low and then hold it. Setting CKP will release SCL and allow more communication. 27.4.7.1 Normal Clock Stretching Following an ACK, if the R/W bit of the SSPSTAT is set, causing a read request, the slave hardware will clear CKP. This allows the slave time to update SSPBUF with data to transfer to the master. If the SEN bit of SSPCON2 is set, the slave hardware will always stretch the clock after the ACK sequence. Once the slave is ready; CKP is set by software and communication resumes. Note 1: The BF bit has no effect on if the clock will be stretched or not. This is different than previous versions of the module that would not stretch the clock or clear CKP, if SSPBUF was read before the 9th falling edge of SCL. 2: Previous versions of the module did not stretch the clock for a transmission if SSPBUF was loaded before the 9th falling edge of SCL. It is now always cleared for read requests. FIGURE 27-15: 10-bit Addressing Mode In 10-bit Addressing mode, when the UA bit is set, the clock is always stretched. This is the only time the SCL is stretched without CKP being cleared. SCL is released immediately after a write to SSPADDx. Note: Previous versions of the module did not stretch the clock if the second address byte did not match. 27.4.7.3 Byte NACKing When AHEN bit of SSPCON3 is set; CKP is cleared by the hardware after the 8th falling edge of SCL for a received matching address byte. When DHEN bit of SSPCON3 is set; CKP is cleared after the 8th falling edge of SCL for received data. Stretching after the 8th falling edge of SCL allows the slave to look at the received address or data and decide if it wants to ACK the received data. 27.4.8 CLOCK SYNCHRONIZATION AND THE CKP BIT Any time the CKP bit is cleared, the module will wait for the SCL line to go low and then hold it. However, clearing the CKP bit will not assert the SCL output low until the SCL output is already sampled low. Therefore, the CKP bit will not assert the SCL line until an external I2C master device has already asserted the SCL line. The SCL output will remain low until the CKP bit is set and all other devices on the I2C bus have released SCL. This ensures that a write to the CKP bit will not violate the minimum high time requirement for SCL (see Figure 27-15). CLOCK SYNCHRONIZATION TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 SDA DX DX ‚ – 1 SCL CKP Master device asserts clock Master device releases clock WR SSPCON1 2013 Microchip Technology Inc. DS20002331B-page 167 MCP19110/11 27.4.9 GENERAL CALL ADDRESS SUPPORT In 10-bit Address mode, the UA bit will not be set on the reception of the general call address. The slave will prepare to receive the second byte as data, just as it would in the 7-bit mode. The addressing procedure for the I2C bus is such that the first byte after the Start condition usually determines which device will be the slave addressed by the master device. The exception is the general call address, which can address all devices. When this address is used, all devices should, in theory, respond with an acknowledge. If the AHEN bit of the SSPCON3 register is set, just as with any other address reception, the slave hardware will stretch the clock after the 8th falling edge of SCL. The slave must then set its ACKDT value and release the clock with communication progressing as it would normally. The general call address is a reserved address in the I2C protocol, defined as address 0x00. When the GCEN bit of the SSPCON2 register is set, the slave module will automatically ACK the reception of this address, regardless of the value stored in SSPADDx. After the slave clocks in an address of all zeros with the R/W bit clear, an interrupt is generated and slave software can read SSPBUF and respond. Figure 27-16 shows a general call reception sequence. FIGURE 27-16: SLAVE MODE GENERAL CALL ADDRESS SEQUENCE Address is compared to General Call Address after ACK, set interrupt Receiving Data ACK R/W = 0 ACK D7 D6 D5 D4 D3 D2 D1 D0 General Call Address SDA SCL S 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 SSPIF BF (SSPSTAT<0>) Cleared by software GCEN (SSPCON2<7>) SSPBUF is read ’1’ 27.4.10 SSPMSKX REGISTER An SSP Mask (SSPMSKx) register (Register 27-6 and Register 27-8) is available in I2C Slave mode as a mask for the value held in the SSPSRx register during an address comparison operation. A zero (‘0’) bit in the SSPMSKx register has the effect of making the corresponding bit of the received address a “don’t care”. This register is reset to all ‘1’s upon any Reset condition and, therefore, has no effect on standard SSP operation until written with a mask value. The SSP Mask register is active during: • 7-bit Address mode: address compare of A<7:1>. • 10-bit Address mode: address compare of A<7:0> only. The SSP mask has no effect during the reception of the first (high) byte of the address. DS20002331B-page 168 2013 Microchip Technology Inc. MCP19110/11 27.5 I2C Master Mode 27.5.1 I2C MASTER MODE OPERATION Master mode is enabled by setting and clearing the appropriate SSPM bits in the SSPCON1 register and by setting the SSPEN bit. In Master mode, the SDA and SCK pins must be configured as inputs. The MSSP peripheral hardware will override the output driver TRIS controls when necessary, to drive the pins low. The master device generates all of the serial clock pulses and the Start and Stop conditions. A transfer is ended with a Stop condition or with a Repeated Start condition. Since the Repeated Start condition is also the beginning of the next serial transfer, the I2C bus will not be released. Master mode of operation is supported by interrupt generation on the detection of the Start and Stop conditions. The Stop (P) and Start (S) bits are cleared from a Reset or when the MSSP module is disabled. Control of the I 2C bus may be taken when the P bit is set, or the bus is Idle. In Master Transmitter mode, serial data is output through SDA, while SCL outputs the serial clock. The first byte transmitted contains the slave address of the receiving device (7 bits) and the Read/Write (R/W) bit. In this case, the R/W bit will be logic ‘0’. Serial data is transmitted eight bits at a time. After each byte is transmitted, an Acknowledge bit is received. Start and Stop conditions are output to indicate the beginning and the end of a serial transfer. In Firmware Controlled Master mode, user code conducts all I 2C bus operations based on Start and Stop bit condition detection. Start and Stop condition detection is the only active circuitry in this mode. All other communication is done by the user software directly manipulating the SDA and SCL lines. The following events will cause the SSP Interrupt Flag bit, SSPIF, to be set (SSP interrupt, if enabled): • • • • • Start condition detected Stop condition detected Data transfer byte transmitted/received Acknowledge transmitted/received Repeated Start generated Note 1: The MSSP module, when configured in I2C Master mode, does not allow queuing of events. For instance, the user is not allowed to initiate a Start condition and immediately write the SSPBUF register to initiate transmission before the Start condition is complete. In this case, the SSPBUF will not be written to and the WCOL bit will be set, indicating that a write to the SSPBUF did not occur. 2: When in Master mode, Start/Stop detection is masked and an interrupt is generated when the SEN/PEN bit is cleared and the generation is complete. 2013 Microchip Technology Inc. In Master Receive mode, the first byte transmitted contains the slave address of the transmitting device (7 bits) and the R/W bit. In this case, the R/W bit will be logic ‘1’. Thus, the first byte transmitted is a 7-bit slave address followed by a ‘1’ to indicate the receive bit. Serial data is received via SDA, while SCL outputs the serial clock. Serial data is received eight bits at a time. After each byte is received, an Acknowledge bit is transmitted. Start and Stop conditions indicate the beginning and the end of transmission. A Baud Rate Generator is used to set the clock frequency output on SCL. See Section 27.6 “Baud Rate Generator” for more detail. 27.5.2 CLOCK ARBITRATION Clock arbitration occurs when the master, during any receive, transmit or Repeated Start/Stop condition, releases the SCL pin (SCL allowed to float high). When the SCL pin is allowed to float high, the Baud Rate Generator (BRG) is suspended from counting until the SCL pin is actually sampled high. When the SCL pin is sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD<7:0> and begins counting. This ensures that the SCL high time will always be at least one BRG rollover count in the event that the clock is held low by an external device (Figure 27-17). DS20002331B-page 169 MCP19110/11 FIGURE 27-17: BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION SDA DX DX ‚ – 1 SCL deasserted but slave holds SCL low (clock arbitration) SCL allowed to transition high SCL BRG decrements on Q2 and Q4 cycles BRG Value 03h 02h 01h 00h (hold off) 03h 02h SCL is sampled high, reload takes place and BRG starts its count BRG Reload 27.5.3 WCOL STATUS FLAG If the user writes the SSPBUF when a Start, Restart, Stop, Receive or Transmit sequence is in progress, the WCOL is set and the contents of the buffer are unchanged (the write does not occur). Any time the WCOL bit is set, it indicates that an action on SSPBUF was attempted while the module was not Idle. Note: 27.5.4 Because queuing of events is not allowed, writing to the lower five bits of SSPCON2 is disabled until the Start condition is complete. I2C MASTER MODE START CONDITION TIMING To initiate a Start condition, the user sets the Start Enable bit, SEN bit of the SSPCON2 register. If the SDA and SCL pins are sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD<7:0> and starts its count. If SCL and SDA are both sampled high when the Baud Rate Generator times out (TBRG), the SDA pin is driven low. The action FIGURE 27-18: of the SDA being driven low while SCL is high is the Start condition and causes the S bit of the SSPSTAT register to be set. Following this, the Baud Rate Generator is reloaded with the contents of SSPADD<7:0> and resumes its count. When the Baud Rate Generator times out (TBRG), the SEN bit of the SSPCON2 register will be automatically cleared by hardware; the Baud Rate Generator is suspended, leaving the SDA line held low and the Start condition is complete. Note 1: If at the beginning of the Start condition, the SDA and SCL pins are already sampled low, or if during the Start condition, the SCL line is sampled low before the SDA line is driven low, a bus collision occurs, the Bus Collision Interrupt Flag, BCLIF, is set, the Start condition is aborted and the I2C module is reset into its Idle state. 2: The Philips I2C Specification states that a bus collision cannot occur on a Start. FIRST START BIT TIMING Write to SEN bit occurs here Set S bit (SSPSTAT<3>) At completion of Start bit, hardware clears SEN bit and sets SSPIF bit SDA = 1, SCL = 1 TBRG TBRG Write to SSPBUF occurs here SDA 1st bit 2nd bit TBRG SCL S DS20002331B-page 170 TBRG 2013 Microchip Technology Inc. MCP19110/11 27.5.5 I2C MASTER MODE REPEATED START CONDITION TIMING Note 1: If RSEN is programmed while any other event is in progress, it will not take effect. A Repeated Start condition occurs when the RSEN bit of the SSPCON2 register is programmed high and the Master state machine is no longer active. When the RSEN bit is set, the SCL pin is asserted low. When the SCL pin is sampled low, the Baud Rate Generator is loaded and begins counting. The SDA pin is released (brought high) for one Baud Rate Generator count (TBRG). When the Baud Rate Generator times out, if SDA is sampled high, the SCL pin will be deasserted (brought high). When SCL is sampled high, the Baud Rate Generator is reloaded and begins counting. SDA and SCL must be sampled high for one TBRG. This action is then followed by the assertion of the SDA pin (SDA = 0) for one TBRG while SCL is high. SCL is asserted low. Following this, the RSEN bit of the SSPCON2 register will be automatically cleared and the Baud Rate Generator will not be reloaded, leaving the SDA pin held low. As soon as a Start condition is detected on the SDA and SCL pins, the S bit of the SSPSTAT register will be set. The SSPIF bit will not be set until the Baud Rate Generator has timed out. FIGURE 27-19: 2: A bus collision during the Repeated Start condition occurs if: •SDA is sampled low when SCL goes from low-to-high. •SCL goes low before SDA is asserted low. This may indicate that another master is attempting to transmit a data ‘1’. REPEAT START CONDITION WAVEFORM S bit set by hardware Write to SSPCON2 occurs here SDA = 1, SCL (no change) At completion of Start bit, hardware clears RSEN bit and sets SSPIF SDA = 1, SCL = 1 TBRG TBRG TBRG 1st bit SDA Write to SSPBUF occurs here TBRG SCL Sr TBRG Repeated Start 2013 Microchip Technology Inc. DS20002331B-page 171 MCP19110/11 27.5.6 I2C MASTER MODE TRANSMISSION Transmission of a data byte, a 7-bit address or the other half of a 10-bit address is accomplished by simply writing a value to the SSPBUF register. This action will set the Buffer Full flag bit, BF, and will allow the Baud Rate Generator to begin counting and start the next transmission. Each bit of address/data will be shifted out onto the SDA pin after the falling edge of SCL is asserted. SCL is held low for one Baud Rate Generator rollover count (TBRG). Data should be valid before SCL is released high. When the SCL pin is released high, it is held that way for TBRG. The data on the SDA pin must remain stable for that duration and some hold time after the next falling edge of SCL. After the 8th bit is shifted out (the falling edge of the 8th clock), the BF flag is cleared and the master releases the SDA. This allows the slave device being addressed to respond with an ACK bit during the 9th bit time if an address match occurred, or if data was received properly. The status of ACK is written into the ACKSTAT bit on the rising edge of the 9th clock. If the master receives an Acknowledge, the Acknowledge Status bit, ACKSTAT, is cleared. If not, the bit is set. After the 9th clock, the SSPIF bit is set and the master clock (Baud Rate Generator) is suspended until the next data byte is loaded into the SSPBUF, leaving SCL low and SDA unchanged (Figure 27-20). After the write to the SSPBUF, each bit of the address will be shifted out on the falling edge of SCL until all seven address bits and the R/W bit are completed. On the falling edge of the 8th clock, the master will release the SDA pin, allowing the slave to respond with an Acknowledge. On the falling edge of the 9th clock, the master will sample the SDA pin to see if the address was recognized by a slave. The status of the ACK bit is loaded into the ACKSTAT Status bit of the SSPCON2 register. Following the falling edge of the 9th clock transmission of the address, the SSPIF is set, the BF flag is cleared and the Baud Rate Generator is turned off until another write to the SSPBUF takes place, holding SCL low and allowing SDA to float. 27.5.6.1 BF Status Flag In Transmit mode, the BF bit of the SSPSTAT register is set when the CPU writes to SSPBUF, and is cleared when all eight bits are shifted out. 27.5.6.2 If the user writes the SSPBUF when a transmit is already in progress (i.e., SSPSR is still shifting out a data byte), the WCOL is set and the contents of the buffer are unchanged (the write does not occur). WCOL must be cleared by software before the next transmission. 27.5.6.3 ACKSTAT Status Flag In Transmit mode, the ACKSTAT bit of the SSPCON2 register is cleared when the slave has sent an Acknowledge (ACK = 0) and is set when the slave does not Acknowledge (ACK = 1). A slave sends an Acknowledge when it has recognized its address (including a general call), or when the slave has properly received its data. 27.5.6.4 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. DS20002331B-page 172 WCOL Status Flag Typical transmit sequence The user generates a Start condition by setting the SEN bit of the SSPCON2 register. SSPIF is set by hardware on completion of the Start. SSPIF is cleared by software. The MSSP module will wait the required start time before any other operation takes place. The user loads the SSPBUF with the slave address to transmit. Address is shifted out the SDA pin until all eight bits are transmitted. Transmission begins as soon as SSPBUF is written to. The MSSP module shifts in the ACK bit from the slave device and writes its value into the ACKSTAT bit of the SSPCON2 register. The MSSP module generates an interrupt at the end of the 9th clock cycle by setting the SSPIF bit. The user loads the SSPBUF with eight bits of data. Data is shifted out the SDA pin until all eight bits are transmitted. The MSSP module shifts in the ACK bit from the slave device and writes its value into the ACKSTAT bit of the SSPCON2 register. Steps 8–11 are repeated for all transmitted data bytes. The user generates a Stop or Restart condition by setting the PEN or RSEN bits of the SSPCON2 register. Interrupt is generated once the Stop/Restart condition is complete. 2013 Microchip Technology Inc. 2013 Microchip Technology Inc. FIGURE 27-20: I2C MASTER MODE WAVEFORM (TRANSMISSION, 7 OR 10-BIT ADDRESS) ACKSTAT in SSPCON2 = 1 Write SSPCON2<0> SEN = 1 Start condition begins From slave, clear ACKSTAT bit SSPCON2<6> SEN = 0 Transmitting Data or Second Half of 10-bit Address R/W = 0 Transmit Address to Slave ACK SDA A7 A6 A5 A4 A3 A2 ACK = 0 A1 D7 D6 D5 D4 D3 D2 D1 D0 2 3 4 5 6 7 8 SSPBUF written with 7-bit address and R/W start transmit SCL S 1 2 3 4 5 6 7 8 9 SSPIF Cleared by software 1 SCL held low while CPU responds to SSPIF Cleared by software service routine from SSP interrupt 9 P Cleared by software BF (SSPSTAT<0>) SSPBUF written SSPBUF is written by software SEN After Start condition, SEN cleared by hardware DS20002331B-page 173 R/W MCP19110/11 PEN MCP19110/11 27.5.7 I2C MASTER MODE RECEPTION Master mode reception is enabled by programming the Receive Enable bit, RCEN bit, of the SSPCON2 register. Note: The MSSP module must be in an Idle state before the RCEN bit is set, or the RCEN bit will be disregarded. The Baud Rate Generator begins counting and on each rollover, the state of the SCL pin changes (high-tolow/low-to-high) and data is shifted into the SSPSR. After the falling edge of the eighth clock, the receive enable flag is automatically cleared, the contents of the SSPSR are loaded into the SSPBUF, the BF flag bit is set, the SSPIF flag bit is set and the Baud Rate Generator is suspended from counting, holding SCL low. The MSSP is now in Idle state awaiting the next command. When the buffer is read by the CPU, the BF flag bit is automatically cleared. The user can then send an Acknowledge bit at the end of reception by setting the Acknowledge Sequence Enable, ACKEN bit, of the SSPCON2 register. 27.5.7.1 BF Status Flag In receive operation, the BF bit is set when an address or data byte is loaded into SSPBUF from SSPSR. It is cleared when the SSPBUF register is read. 27.5.7.2 SSPOV Status Flag 27.5.7.4 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. In receive operation, the SSPOV bit is set when eight bits are received into the SSPSR and the BF flag bit is already set from a previous reception. 13. 14. 27.5.7.3 15. WCOL Status Flag If the user writes the SSPBUF when a receive is already in progress (i.e., SSPSR is still shifting in a data byte), the WCOL bit is set and the contents of the buffer are unchanged (the write does not occur). DS20002331B-page 174 Typical Receive Sequence: The user generates a Start condition by setting the SEN bit of the SSPCON2 register. SSPIF is set by hardware on completion of the Start. SSPIF is cleared by software. The user writes SSPBUF with the slave address to transmit and the R/W bit set. Address is shifted out the SDA pin until all eight bits are transmitted. Transmission begins as soon as SSPBUF is written to. The MSSP module shifts in the ACK bit from the slave device and writes its value into the ACKSTAT bit of the SSPCON2 register. The MSSP module generates an interrupt at the end of the 9th clock cycle by setting the SSPIF bit. User sets the RCEN bit of the SSPCON2 register and the Master clocks in a byte from the slave. After the 8th falling edge of SCL, SSPIF and BF are set. Master clears SSPIF and reads the received byte from SSPBUF, clears BF. Master sets ACK value sent to slave in ACKDT bit of the SSPCON2 register and initiates the ACK by setting the ACKEN bit. Masters ACK is clocked out to the Slave and SSPIF is set. The user clears SSPIF. Steps 8–13 are repeated for each received byte from the slave. Master sends a not ACK or Stop to end communication. 2013 Microchip Technology Inc. 2013 Microchip Technology Inc. I2C MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS) FIGURE 27-21: Write to SSPCON2<4> to start Acknowledge sequence SDA = ACKDT (SSPCON2<5>) = 0 Write to SSPCON2<0> (SEN = 1), begin Start condition Write to SSPBUF occurs here, start XMIT RCEN cleared automatically ACK from Slave Transmit Address to Slave SDA A7 A6 A5 A4 A3 A2 RCEN = 1, start next receive ACK PEN bit = 1 written here RCEN cleared automatically Receiving Data from Slave Receiving Data from Slave A1 R/W Set ACKEN, start Acknowledge sequence SDA = ACKDT = 1 ACK from Master SDA = ACKDT = 0 Master configured as a receiver by programming SSPCON2<3> (RCEN = 1) SEN = 0 D7 D6 D5 D4 D3 D2 D1 ACK D0 D7 D6 D5 D4 D3 D2 D1 D0 ACK Bus master terminates transfer ACK is not sent SCL S 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 Data shifted in on falling edge of CLK Set SSPIF interrupt at end of receive Cleared by software Cleared by software BF (SSPSTAT<0>) P Set SSPIF at end of receive Set SSPIF interrupt at end of Acknowledge sequence SSPIF SDA = 0, SCLx = 1 while CPU responds to SSPxIF 9 8 Cleared by software Cleared by software Cleared in software Set SSPIF interrupt at end of Acknowledge sequence Set P bit (SSPSTAT<4>) and SSPIF Last bit is shifted into SSPSR and contents are unloaded into SSPBUF SSPOV SSPOV is set because SSPBUF is still full DS20002331B-page 175 RCEN Master configured as a receiver by programming SSPCON2<3> (RCEN = 1) RCEN cleared automatically ACK from Master SDA = ACKDT = 0 RCEN cleared automatically MCP19110/11 ACKEN MCP19110/11 27.5.8 ACKNOWLEDGE SEQUENCE TIMING 27.5.9 A Stop bit is asserted on the SDA pin at the end of a receive/transmit by setting the Stop Sequence Enable bit, PEN bit of the SSPCON2 register. At the end of a receive/transmit, the SCL line is held low after the falling edge of the 9th clock. When the PEN bit is set, the master will assert the SDA line low. When the SDA line is sampled low, the Baud Rate Generator is reloaded and counts down to ‘0’. When the Baud Rate Generator times out, the SCL pin will be brought high and one TBRG (Baud Rate Generator rollover count) later, the SDA pin will be deasserted. When the SDA pin is sampled high while SCL is high, the P bit of the SSPSTAT register is set. A TBRG later, the PEN bit is cleared and the SSPIF bit is set (Figure 27-23). An Acknowledge sequence is enabled by setting the Acknowledge Sequence Enable bit, ACKEN bit, of the SSPCON2 register. When this bit is set, the SCL pin is pulled low and the contents of the Acknowledge data bit are presented on the SDA pin. If the user wishes to generate an Acknowledge, then the ACKDT bit should be cleared. If not, the user should set the ACKDT bit before starting an Acknowledge sequence. The Baud Rate Generator then counts for one rollover period (TBRG) and the SCL pin is deasserted (pulled high). When the SCL pin is sampled high (clock arbitration), the Baud Rate Generator counts for TBRG. The SCL pin is then pulled low. Following this, the ACKEN bit is automatically cleared, the Baud Rate Generator is turned off and the MSSP module then goes into Idle mode (Figure 27-22). 27.5.8.1 27.5.9.1 WCOL Status Flag If the user writes the SSPBUF when a Stop sequence is in progress, then the WCOL bit is set and the contents of the buffer are unchanged (the write does not occur). WCOL Status Flag If the user writes the SSPBUF when an Acknowledge sequence is in progress, then WCOL is set and the contents of the buffer are unchanged (the write does not occur). FIGURE 27-22: STOP CONDITION TIMING ACKNOWLEDGE SEQUENCE WAVEFORM Acknowledge sequence starts here, write to SSPCON2 ACKEN = 1, ACKDT = 0 SDA ACKEN automatically cleared D0 SCL TBRG TBRG ACK 8 9 SSPIF SSPIF set at the end of receive Note: Cleared in software TBRG = one Baud Rate Generator period. FIGURE 27-23: STOP CONDITION RECEIVE OR TRANSMIT MODE SCL = 1 for TBRG, followed by SDA = 1 for TBRG after SDA sampled high. P bit (SSPSTAT<4>) is set. Write to SSPCON2, set PEN Falling edge of 9th clock PEN bit (SSPCON2<2>) is cleared by hardware and the SSPIF bit is set TBRG SCL SDA Cleared in software SSPIF set at the end of Acknowledge sequence ACK P TBRG Note: TBRG TBRG SCL brought high after TBRG SDA asserted low before rising edge of clock to setup Stop condition TBRG = one Baud Rate Generator period. DS20002331B-page 176 2013 Microchip Technology Inc. MCP19110/11 27.5.10 SLEEP OPERATION 27.5.13 2 While in Sleep mode, the I C slave module can receive addresses or data, and when an address match or complete byte transfer occurs, wakes the processor from Sleep (if the MSSP interrupt is enabled). 27.5.11 EFFECTS OF A RESET A Reset disables the MSSP module and terminates the current transfer. 27.5.12 MULTI-MASTER MODE In Multi-Master mode, the interrupt generation on the detection of the Start and Stop conditions allows the determination of when the bus is free. The Stop (P) and Start (S) bits are cleared from a Reset or when the MSSPx module is disabled. Control of the I 2C bus may be taken when the P bit of the SSPSTAT register is set, or the bus is Idle, with both the S and P bits clear. When the bus is busy, enabling the SSP interrupt will generate the interrupt when the Stop condition occurs. In multi-master operation, the SDA line must be monitored for arbitration to see if the signal level is the expected output level. This check is performed by hardware with the result placed in the BCLIF bit. The states where arbitration can be lost are: • • • • • Address Transfer Data Transfer A Start Condition A Repeated Start Condition An Acknowledge Condition MULTI-MASTER COMMUNICATION, BUS COLLISION AND BUS ARBITRATION Multi-Master mode support is achieved by bus arbitration. When the master outputs address/data bits onto the SDA pin, arbitration takes place when the master outputs a ‘1’ on SDA, by letting SDA float high and another master asserts a ‘0’. When the SCL pin floats high, data should be stable. If the expected data on SDA is a ‘1’ and the data sampled on the SDA pin is ‘0’, then a bus collision has taken place. The master will set the Bus Collision Interrupt Flag, BCLIF and reset the I2C port to its Idle state (Figure 27-24). If a transmit was in progress when the bus collision occurred, the transmission is halted, the BF flag is cleared, the SDA and SCL lines are deasserted and the SSPBUF can be written to. When the user services the bus collision Interrupt Service Routine and if the I2C bus is free, the user can resume communication by asserting a Start condition. If a Start, Repeated Start, Stop or Acknowledge condition was in progress when the bus collision occurred, the condition is aborted, the SDA and SCL lines are deasserted and the respective control bits in the SSPCON2 register are cleared. When the user services the bus collision Interrupt Service Routine and if the I2C bus is free, the user can resume communication by asserting a Start condition. The master will continue to monitor the SDA and SCL pins. If a Stop condition occurs, the SSPIF bit will be set. A write to the SSPBUF will start the transmission of data at the first data bit, regardless of where the transmitter left off when the bus collision occurred. In Multi-Master mode, the interrupt generation on the detection of Start and Stop conditions allows the determination of when the bus is free. Control of the I2C bus can be taken when the P bit is set in the SSPSTAT register, or the bus is Idle and the S and P bits are cleared. FIGURE 27-24: BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE Data changes while SCL = 0 SDA line pulled low by another source SDA released by master Sample SDA. While SCL is high, data does not match what is driven by the master. Bus collision has occurred. SDA SCL Set bus collision interrupt (BCLIF) BCLIF 2013 Microchip Technology Inc. DS20002331B-page 177 MCP19110/11 27.5.13.1 Bus Collision During a Start Condition During a Start condition, a bus collision occurs if: a) b) SDA or SCL are sampled low at the beginning of the Start condition (Figure 27-25). SCL is sampled low before SDA is asserted low (Figure 27-26). During a Start condition, both the SDA and the SCL pins are monitored. If the SDA pin is sampled low during this count, the BRG is reset and the SDA line is asserted early (Figure 27-27). If, however, a ‘1’ is sampled on the SDA pin, the SDA pin is asserted low at the end of the BRG count. The Baud Rate Generator is then reloaded and counts down to zero; if the SCL pin is sampled as ‘0’ during this time, a bus collision does not occur. At the end of the BRG count, the SCL pin is asserted low. Note: If the SDA pin is already low, or the SCL pin is already low, then all of the following occur: • the Start condition is aborted • the BCLIF flag is set • the MSSP module is reset to its Idle state (Figure 27-25). The Start condition begins with the SDA and SCL pins deasserted. When the SDA pin is sampled high, the Baud Rate Generator is loaded and counts down. If the SCL pin is sampled low while SDA is high, a bus collision occurs because it is assumed that another master is attempting to drive a data ‘1’ during the Start condition. FIGURE 27-25: The reason that bus collision is not a factor during a Start condition is that no two bus masters can assert a Start condition at the exact same time. Therefore, one master will always assert SDA before the other. This condition does not cause a bus collision because the two masters must be allowed to arbitrate the first address following the Start condition. If the address is the same, arbitration must be allowed to continue into the data portion, Repeated Start or Stop conditions. BUS COLLISION DURING START CONDITION (SDA ONLY) SDA goes low before the SEN bit is set. Set BCLIF, S bit and SSPIF set because SDA = 0, SCL = 1. SDA SCL Set SEN, enable Start condition if SDA = 1, SCL = 1 SEN BCLIF SEN cleared automatically because of bus collision. SSP module reset into Idle state. SDA sampled low before Start condition. Set BCLIF. S bit and SSPIF set because SDA = 0, SCL = 1. SSPIF and BCLIF are cleared by software S SSPIF SSPIF and BCLIF are cleared by software DS20002331B-page 178 2013 Microchip Technology Inc. MCP19110/11 FIGURE 27-26: BUS COLLISION DURING START CONDITION (SCL = 0) SDA = 0, SCL = 1 TBRG TBRG SDA SCL Set SEN, enable Start sequence if SDA = 1, SCL = 1 SCL = 0 before SDA = 0, bus collision occurs. Set BCLIF. SEN SCL = 0 before BRG time-out, bus collision occurs. Set BCLIF. BCLIF Interrupt cleared by software S ’0’ ’0’ SSPIF ’0’ ’0’ FIGURE 27-27: BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION SDA = 0, SCL = 1 Set S SDA Less than TBRG Set SSPIF TBRG SDA pulled low by other master. Reset BRG and assert SDAx. SCL S SEN SCLx pulled low after BRG time-out Set SEN, enable Start sequence if SDA = 1, SCL = 1 BCLIF ’0’ S SSPIF SDAx = 0, SCL = 1, set SSPIF 2013 Microchip Technology Inc. Interrupts cleared by software DS20002331B-page 179 MCP19110/11 27.5.13.2 Bus Collision During a Repeated Start Condition If SDA is low, a bus collision has occurred (i.e., another master is attempting to transmit a data ‘0’, Figure 27-28). If SDA is sampled high, the BRG is reloaded and begins counting. If SDA goes from high-to-low before the BRG times out, no bus collision occurs because no two masters can assert SDA at exactly the same time. During a Repeated Start condition, a bus collision occurs if: a) b) A low level is sampled on SDA when SCL goes from low level to high level. SCL goes low before SDA is asserted low, indicating that another master is attempting to transmit a data ‘1’. If SCL goes from high-to-low before the BRG times out and SDA has not already been asserted, a bus collision occurs. In this case, another master is attempting to transmit a data ‘1’ during the Repeated Start condition (see Figure 27-29.) When the user releases SDA and the pin is allowed to float high, the BRG is loaded with SSPADD and counts down to zero. The SCL pin is then deasserted and when sampled high, the SDA pin is sampled. FIGURE 27-28: If, at the end of the BRG time-out, both SCL and SDA are still high, the SDA pin is driven low and the BRG is reloaded and begins counting. At the end of the count, regardless of the status of the SCL pin, the SCL pin is driven low and the Repeated Start condition is complete. BUS COLLISION DURING A REPEATED START CONDITION (CASE 1) SDA SCL Sample SDA when SCL goes high. If SDA = 0, set BCLIF and release SDA and SCL. RSEN BCLIF Cleared by software S ’0’ SSPIF ’0’ FIGURE 27-29: BUS COLLISION DURING REPEATED START CONDITION (CASE 2) TBRG TBRG SDA SCL BCLIF SCL goes low before SDA, set BCLIF. Release SDA and SCL. Interrupt cleared by software RSEN S ’0’ SSPIF DS20002331B-page 180 2013 Microchip Technology Inc. MCP19110/11 27.5.13.3 Bus Collision During a Stop Condition The Stop condition begins with SDA asserted low. When SDA is sampled low, the SCL pin is allowed to float. When the pin is sampled high (clock arbitration), the Baud Rate Generator is loaded with SSPADD and counts down to 0. After the BRG times out, SDA is sampled. If SDA is sampled low, a bus collision has occurred. This is due to another master attempting to drive a data ‘0’ (Figure 27-30). If the SCL pin is sampled low before SDA is allowed to float high, a bus collision occurs. This is another case of another master attempting to drive a data ‘0’ (Figure 27-31). Bus collision occurs during a Stop condition if: a) b) After the SDA pin has been deasserted and allowed to float high, SDA is sampled low after the BRG has timed out. After the SCL pin is deasserted, SCL is sampled low before SDA goes high. FIGURE 27-30: BUS COLLISION DURING A STOP CONDITION (CASE 1) TBRG TBRG TBRG SDA sampled low after TBRG, set BCLIF SDA SCL SDA asserted low PEN BCLIF P ’0’ SSPIF ’0’ FIGURE 27-31: BUS COLLISION DURING A STOP CONDITION (CASE 2) TBRG SDA SCL Assert SDA TBRG TBRG SCL goes low before SDA goes high, set BCLIF PEN BCLIF P ’0’ SSPIF ’0’ 2013 Microchip Technology Inc. DS20002331B-page 181 MCP19110/11 TABLE 27-1: SUMMARY OF REGISTERS ASSOCIATED WITH I2C OPERATION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page: INTCON GIE PEIE T0IE INTE IOCE T0IF INTF IOCF 95 PIE1 — ADIE BCLIE SSPIE — — TMR2IE TMR1IE 96 PIR1 — ADIF BCLIF SSPIF — — TMR2IF TMR1IF 98 TRISGPA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 114 TRISGPB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 117 SSPADD ADD7 ADD6 ADD5 ADD4 ADD3 ADD2 ADD1 ADD0 188 WCOL SSPOV SSPEN CKP SSPCON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN SSPCON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE SSPMSK MSK7 MSK6 MSK5 MSK4 MSK3 MSK2 SSPSTAT SMP CKE D/A P S R/W SSPMSK2 MSK27 MSK26 MSK25 MSK24 MSK23 SSPADD2 ADD27 ADD26 ADD25 ADD24 ADD23 SSPBUF SSPCON1 Synchronous Serial Port Receive Buffer/Transmit Register SSPM3 SSPM2 SSPM1 148* SSPM0 185 RSEN SEN 186 AHEN DHEN 187 MSK1 MSK0 188 UA BF 184 MSK22 MSK21 MSK20 189 ADD22 ADD21 ADD20 189 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the MSSP module in I2C mode. * Page provides register information. DS20002331B-page 182 2013 Microchip Technology Inc. MCP19110/11 27.6 BAUD RATE GENERATOR The MSSP module has a Baud Rate Generator available for clock generation in I2C Master mode. The Baud Rate Generator (BRG) reload value is placed in the SSPADD register (Register 27-7). When a write occurs to SSPBUF, the Baud Rate Generator will automatically begin counting down. Once the given operation is complete, the internal clock will automatically stop counting and the clock pin will remain in its last state. An internal signal “Reload” in Figure 27-32 triggers the value from SSPADD to be loaded into the BRG counter. This occurs twice for each oscillation of the module clock line. The logic dictating when the reload signal is asserted depends on the mode the MSSP is being operated in. Table 27-2 demonstrates clock rates based on instruction cycles and the BRG value loaded into SSPADD. EQUATION 27-1: F FIGURE 27-32: F OSC = ---------------------------------------------CLOCK SSPADD + 1 4 BAUD RATE GENERATOR BLOCK DIAGRAM SSPM<3:0> SSPM<3:0> SCL Reload Control SSPCLK SSPADD<7:0> Reload BRG Down Counter FOSC/2 Note: Values of 0x00, 0x01 and 0x02 are not valid for SSPADD when used as a Baud Rate Generator for I2C. This is an implementation limitation. TABLE 27-2: Note 1: MSSP CLOCK RATE W/BRG FOSC FCY BRG Value FCLOCK (2 Rollovers of BRG) 8 MHz 2 MHz 04h 400 kHz(1) 8 MHz 2 MHz 0Bh 166 kHz 8 MHz 2 MHz 13h 100 kHz 2C I2C specification (which applies to rates greater than The I interface does not conform to the 400 kHz 100 kHz) in all details, but may be used with care where higher rates are required by the application. 2013 Microchip Technology Inc. DS20002331B-page 183 MCP19110/11 REGISTER 27-2: SSPSTAT: SSP STATUS REGISTER R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0 SMP CKE D/A P S R/W UA BF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 SMP: Data Input Sample bit 1 = Slew rate control disabled for standard speed mode (100 kHz and 1 MHz) 0 = Slew rate control enabled for high speed mode (400 kHz) bit 6 CKE: Clock Edge Select bit 1 = Enable input logic so that thresholds are compliant with SMBus specification 0 = Disable SMBus specific inputs bit 5 D/A: Data/Address bit 1 = Indicates that the last byte received or transmitted was data 0 = Indicates that the last byte received or transmitted was address bit 4 P: Stop bit (This bit is cleared when the MSSP module is disabled, SSPEN is cleared.) 1 = Indicates that a Stop bit has been detected last (this bit is ‘0’ on Reset) 0 = Stop bit was not detected last bit 3 S: Start bit (This bit is cleared when the MSSP module is disabled, SSPEN is cleared.) 1 = Indicates that a Start bit has been detected last (this bit is ‘0’ on Reset) 0 = Start bit was not detected last bit 2 R/W: Read/Write bit information This bit holds the R/W bit information following the last address match. This bit is only valid from the address match to the next Start bit, Stop bit, or not ACK bit. In I2 C Slave mode: 1 = Read 0 = Write In I2 C Master mode: 1 = Transmit is in progress 0 = Transmit is not in progress OR-ing this bit with SEN, RSEN, PEN, RCEN or ACKEN will indicate if the MSSP is in Idle mode. bit 1 UA: Update Address bit (10-bit I2C mode only) 1 = Indicates that the user needs to update the address in the SSPADD register 0 = Address does not need to be updated bit 0 BF: Buffer Full Status bit Receive: 1 = Receive complete, SSPBUF is full 0 = Receive not complete, SSPBUF is empty Transmit: 1 = Data transmit in progress (does not include the ACK and Stop bits), SSPBUF is full 0 = Data transmit complete (does not include the ACK and Stop bits), SSPBUF is empty DS20002331B-page 184 2013 Microchip Technology Inc. MCP19110/11 REGISTER 27-3: SSPCON1: SSP CONTROL REGISTER 1 R/C/HS-0 R/C/HS-0 R/W-0 R/W-0 WCOL SSPOV SSPEN CKP R/W-0 R/W-0 R/W-0 R/W-0 SSPM<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared HS = Bit is set by hardware C = User cleared x = Bit is unknown bit 7 WCOL: Write Collision Detect bit Master mode: 1 = A write to the SSPBUF register was attempted while the I2C conditions were not valid for a transmission to be started 0 = No collision Slave mode: 1 = The SSPBUF register is written while it is still transmitting the previous word (must be cleared in software) 0 = No collision bit 6 SSPOV: Receive Overflow Indicator bit (1) 1 = A byte is received while the SSPBUF register is still holding the previous byte. SSPOV is a “don’t care” in Transmit mode (must be cleared in software). 0 = No overflow bit 5 SSPEN: Synchronous Serial Port Enable bit In both modes, when enabled, these pins must be properly configured as input or output 1 = Enables the serial port and configures the SDA and SCL pins as the source of the serial port pins (2) 0 = Disables serial port and configures these pins as I/O port pins bit 4 CKP: Clock Polarity Select bit In I2 C Slave mode: SCL release control 1 = Enable clock 0 = Holds clock low (clock stretch). (Used to ensure data setup time.) In I2 C Master mode: Unused in this mode bit 3-0 SSPM<3:0>: Synchronous Serial Port Mode Select bits 0000 = Reserved 0001 = Reserved 0010 = Reserved 0011 = Reserved 0100 = Reserved 0101 = Reserved 0110 = I2C Slave mode, 7-bit address 0111 = I2C Slave mode, 10-bit address 1000 = I2C Master mode, clock = FOSC/(4 x (SSPADD+1))(3) 1001 = Reserved 1010 = Reserved 1011 = I2C firmware controlled Master mode (Slave idle) 1100 = Reserved 1101 = Reserved 1110 = I2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled 1111 = I2C Slave mode, 10-bit address with Start and Stop bit interrupts enabled Note 1: 2: 3: In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by writing to the SSPBUF register. When enabled, the SDA and SCL pins must be configured as inputs. SSPADD values of 0, 1 or 2 are not supported for I2C Mode. 2013 Microchip Technology Inc. DS20002331B-page 185 MCP19110/11 REGISTER 27-4: SSPCON2: SSP CONTROL REGISTER 2 R/W-0/0 R-0/0 R/W-0/0 R/S/HS-0/0 R/S/HS-0/0 R/S/HS-0/0 R/S/HS-0/0 R/W/HS-0/0 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown H = Bit is set by hardware S = User set -n/n = Value at POR/Value at all other resets bit 7 GCEN: General Call Enable bit (in I2C Slave mode only) 1 = Enable interrupt when a general call address (0x00 or 00h) is received in the SSPSR 0 = General call address disabled bit 6 ACKSTAT: Acknowledge Status bit 1 = Acknowledge was not received 0 = Acknowledge was received bit 5 ACKDT: Acknowledge Data bit In Receive mode: Value transmitted when the user initiates an Acknowledge sequence at the end of a receive 1 = Not Acknowledge 0 = Acknowledge bit 4 ACKEN: Acknowledge Sequence Enable bit (in I2C Master mode only) In Master Receive mode: 1 = Initiate Acknowledge sequence on SDA and SCL pins, and transmit ACKDT data bit. Automatically cleared by hardware. 0 = Acknowledge sequence Idle bit 3 RCEN: Receive Enable bit (in I2C Master mode only) 1 = Enables Receive mode for I2C 0 = Receive Idle bit 2 PEN: Stop Condition Enable bit (in I2C Master mode only) SCK Release Control: 1 = Initiate Stop condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Stop condition Idle bit 1 RSEN: Repeated Start Condition Enabled bit (in I2C Master mode only) 1 = Initiate Repeated Start condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Repeated Start condition Idle bit 0 SEN: Start Condition Enabled bit (in I2C Master mode only) In Master mode: 1 = Initiate Start condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Start condition Idle In Slave mode: 1 = Clock stretching is enabled for both slave transmit and slave receive (stretch enabled) 0 = Clock stretching is disabled Note 1: For bits ACKEN, RCEN, PEN, RSEN, SEN: If the I2C module is not in the Idle mode, this bit may not be set (no spooling) and the SSPBUF may not be written (or writes to the SSPBUF are disabled). DS20002331B-page 186 2013 Microchip Technology Inc. MCP19110/11 REGISTER 27-5: SSPCON3: SSP CONTROL REGISTER 3 R-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit -n/n = Value at POR/Value at ‘1’ = Bit is set all other resets U = Unimplemented bit, read as ‘0’ ‘0’ = Bit is cleared x = Bit is unknown bit 7 ACKTIM: Acknowledge Time Status bit(2) 1 = Indicates the I2C bus is in an Acknowledge sequence, set on the 8th falling edge of SCL clock 0 = Not an Acknowledge sequence, cleared on the 9th rising edge of SCL clock bit 6 PCIE: Stop Condition Interrupt Enable bit 1 = Enable interrupt on detection of Stop condition 0 = Stop detection interrupts are disabled(1) bit 5 SCIE: Start Condition Interrupt Enable bit 1 = Enable interrupt on detection of Start or Restart conditions 0 = Start detection interrupts are disabled(1) bit 4 BOEN: Buffer Overwrite Enable bit In I2C Master mode: This bit is ignored. In I2C Slave mode: 1 = SSPBUF is updated and ACK is generated for a received address/data byte, ignoring the state of the SSPOV bit only if the BF bit = 0. 0 = SSPBUF is only updated when SSPOV is clear bit 3 SDAHT: SDA Hold Time Selection bit 1 = Minimum of 300 ns hold time on SDA after the falling edge of SCL 0 = Minimum of 100 ns hold time on SDA after the falling edge of SCL bit 2 SBCDE: Slave Mode Bus Collision Detect Enable bit (I2C Slave mode only) If on the rising edge of SCL, SDA is sampled low when the module is outputting a high state, the BCLIF bit of the PIR2 register is set, and bus goes Idle 1 = Enable slave bus collision interrupts 0 = Slave bus collision interrupts are disabled bit 1 AHEN: Address Hold Enable bit (I2C Slave mode only) 1 = Following the 8th falling edge of SCL for a matching received address byte; CKP bit of the SSPCON1 register will be cleared and the SCL will be held low. 0 = Address holding is disabled bit 0 DHEN: Data Hold Enable bit (I2C Slave mode only) 1 = Following the 8th falling edge of SCL for a received data byte; slave hardware clears the CKP bit of the SSPCON1 register and SCL is held low. 0 = Data holding is disabled Note 1: 2: This bit has no effect in Slave modes that Start and Stop condition detection is explicitly listed as enabled. The ACKTIM Status bit is only active when the AHEN bit or DHEN bit is set. 2013 Microchip Technology Inc. DS20002331B-page 187 MCP19110/11 REGISTER 27-6: SSPMSK: SSP MASK REGISTER 1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 MSK<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-1 MSK<7:1>: Mask bits 1 = The received address bit n is compared to SSPADD<n> to detect I2C address match 0 = The received address bit n is not used to detect I2C address match bit 0 MSK<0>: Mask bit for I2C Slave mode, 10-bit Address I2C Slave mode, 10-bit address (SSPM<3:0> = 0111 or 1111): 1 = The received address bit 0 is compared to SSPADD<0> to detect I2C address match 0 = The received address bit 0 is not used to detect I2C address match I2C Slave mode, 7-bit address, the bit is ignored REGISTER 27-7: R/W-0 SSPADD: MSSP ADDRESS AND BAUD RATE REGISTER 1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ADD<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Master mode: bit 7-0 ADD<7:0>: Baud Rate Clock Divider bits SCL pin clock period = ((ADD<7:0> + 1) x 4)/FOSC 10-Bit Slave mode — Most Significant Address byte: bit 7-3 Not used: Unused for Most Significant Address byte. Bit state of this register is a “don’t care”. Bit pattern sent by master is fixed by I2C specification and must be equal to ‘11110’. However, those bits are compared by hardware and are not affected by the value in this register. bit 2-1 ADD<2:1>: Two Most Significant bits of 10-bit address bit 0 Not used: Unused in this mode. Bit state is a “don’t care”. 10-Bit Slave mode — Least Significant Address byte: bit 7-0 ADD<7:0>: Eight Least Significant bits of 10-bit address 7-Bit Slave mode: bit 7-1 ADD<7:1>: 7-bit address bit 0 Not used: Unused in this mode. Bit state is a “don’t care”. DS20002331B-page 188 2013 Microchip Technology Inc. MCP19110/11 REGISTER 27-8: SSPMSK2: SSP MASK REGISTER 2 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 MSK2<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-1 MSK2<7:1>: Mask bits 1 = The received address bit n is compared to SSPADD2<n> to detect I2C address match 0 = The received address bit n is not used to detect I2C address match bit 0 MSK2<0>: Mask bit for I2C Slave mode, 10-bit Address I2C Slave mode, 10-bit address (SSPM<3:0> = 0111 or 1111): 1 = The received address bit 0 is compared to SSPADD2<0> to detect I2C address match 0 = The received address bit 0 is not used to detect I2C address match I2C Slave mode, 7-bit address, the bit is ignored REGISTER 27-9: R/W-0 SSPADD2: MSSP ADDRESS 2 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ADD2<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Master mode: bit 7-0 ADD2<7:0>: Baud Rate Clock Divider bits SCL pin clock period = ((ADD<7:0> + 1) *4)/FOSC 10-Bit Slave mode — Most Significant Address byte: bit 7-3 Not used: Unused for Most Significant Address byte. Bit state of this register is a “don’t care”. Bit pattern sent by master is fixed by I2C specification and must be equal to ‘11110’. However, those bits are compared by hardware and are not affected by the value in this register. bit 2-1 ADD2<2:1>: Two Most Significant bits of 10-bit address bit 0 ADD2<0>: SSPADD2 Enable bit. 1 = Enable address matching with SSPADD2 0 = Disable address matching with SSPADD2 10-Bit Slave mode — Least Significant Address byte: bit 7-0 ADD2<7:0>: Eight Least Significant bits of 10-bit address 7-Bit Slave mode: bit 7-1 ADD2<7:1>: 7-bit address bit 0 ADD2<0>: SSPADD2 Enable bit. 1 = Enable address matching with SSPADD2 0 = Disable address matching with SSPADD2 2013 Microchip Technology Inc. DS20002331B-page 189 MCP19110/11 NOTES: DS20002331B-page 190 2013 Microchip Technology Inc. MCP19110/11 28.0 IN-CIRCUIT SERIAL PROGRAMMING™ (ICSP™) 28.1 Common Programming Interfaces Connection to a target device is typically done through an ICSP header. A commonly found connector on development tools is the RJ-11 in the 6P6C (6 pin, 6 connector) configuration. See Figure 28-1. ICSP programming allows customers to manufacture circuit boards with unprogrammed devices. Programming can be done after the assembly process, allowing the device to be programmed with the most recent firmware or a custom firmware. Five pins are needed for ICSP programming: • ICSPCLK • ICSPDAT • MCLR • VDD • VSS FIGURE 28-1: ICSPDAT NC ICSPCLK 2 4 6 VDD In Program/Verify mode, the Program Memory, User IDs and the Configuration Words are programmed through serial communications. The ICSPDAT pin is a bidirectional I/O used for transferring the serial data and the ICSPCLK pin is the clock input. The device is placed into a Program/Verify mode by holding the ICSPDAT and ICSPCLK pins low, while raising the MCLR pin from VIL to VIHH. ICD RJ-11 STYLE CONNECTOR INTERFACE 1 3 5 MCLR VSS Target PC Board Bottom Side Pin Description 1 = 1 = MCLR 2 = 2 = VDDTarget 3 = 3 = VSS (ground) 4 = 4 = ICSPDAT 5 = 5 = ICSPCLK 6 = 6 = No Connect Another connector often found in use with the PICkit™ programmers is a standard 6-pin header with 0.1 inch spacing. Refer to Figure 28-2. FIGURE 28-2: PICkit-STYLE CONNECTOR INTERFACE Pin 1 Indicator Pin Description* 1 2 3 4 5 6 * 1 = 1 = MCLR 2 = 2 = VDDTarget 3 = 3 = VSS (ground) 4 = 4 = ICSPDAT 5 = 5 = ICSPCLK 6 = 6 = No Connect The 6-pin header (0.100" spacing) accepts 0.025" square pins. 2013 Microchip Technology Inc. DS20002331B-page 191 MCP19110/11 For additional interface recommendations, refer to your specific device programmer manual prior to PCB design. It is recommended that isolation devices be used to separate the programming pins from other circuitry. The type of isolation is highly dependent on the specific application and may include devices, such as resistors, diodes, or even jumpers. See Figure 28-3 for more information. FIGURE 28-3: TYPICAL CONNECTION FOR ICSP PROGRAMMING External Programming Signals VDD Device to be Programmed VDD VDD VPP MCLR VSS VSS Data ICSPDAT Clock ICSPCLK * * * To Normal Connections 28.2 * Isolation devices (as required) In-Circuit Debugger In-circuit debugging requires access to the ICDCLK, ICDDATA, and MCLR pins. These pins are only available on the MCP19111 device. DS20002331B-page 192 2013 Microchip Technology Inc. MCP19110/11 29.0 INSTRUCTION SET SUMMARY The MCP19110/11 instruction set is highly orthogonal and is comprised of three basic categories: • Byte-oriented operations • Bit-oriented operations • Literal and control operations Each instruction is a 14-bit word divided into an opcode, which specifies the instruction type, and one or more operands, which further specify the operation of the instruction. The formats for each of the categories are presented in Figure 29-1, while the various opcode fields are summarized in Table 29-1. Table 29-2 lists the instructions recognized by the MPASMTM assembler. For byte-oriented instructions, ‘f’ represents a file register designator and ‘d’ represents a destination designator. The file register designator specifies which file register is to be used by the instruction. The destination designator specifies where the result of the operation is to be placed. If ‘d’ is zero, the result is placed in the W register. If ‘d’ is one, the result is placed in the file register specified in the instruction. For bit-oriented instructions, ‘b’ represents a bit field designator, which selects the bit affected by the operation, while ‘f’ represents the address of the file in which the bit is located. For literal and control operations, ‘k’ represents an 8-bit or 11-bit constant, or literal value. One instruction cycle consists of four oscillator periods; for an oscillator frequency of 4 MHz, this gives a normal instruction execution time of 1 µs. All instructions are executed within a single instruction cycle, unless a conditional test is true, or the program counter is changed as a result of an instruction. When this occurs, the execution takes two instruction cycles, with the second cycle executed as an NOP. TABLE 29-1: OPCODE FIELD DESCRIPTIONS Field f Description Register file address (0x00 to 0x7F) W Working register (accumulator) b Bit address within an 8-bit file register k Literal field, constant data or label x Don’t care location (= 0 or 1). The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. d Destination select; d = 0: store result in W, d = 1: store result in file register f. Default is d = 1. PC Program Counter TO Time-Out bit C DC Z PD Carry bit Digit carry bit Zero bit Power-Down bit FIGURE 29-1: GENERAL FORMAT FOR INSTRUCTIONS Byte-Oriented file register operations 13 8 7 6 OPCODE d f (FILE #) 0 d = 0 for destination W d = 1 for destination f f = 7-bit file register address Bit-Oriented file register operations 13 10 9 7 6 OPCODE b (BIT #) f (FILE #) 0 b = 3-bit bit address f = 7-bit file register address All instruction examples use the format ‘0xhh’ to represent a hexadecimal number, where ‘h’ signifies a hexadecimal digit. Literal and control operations 29.1 Read-Modify-Write Operations Any instruction that specifies a file register as part of the instruction performs a Read-Modify-Write (RMW) operation. The register is read, the data is modified, and the result is stored according to either the instruction or the destination designator ‘d’. A read operation is performed on a register even if the instruction writes to that register. For example, a CLRF PORTA instruction will read PORTGPA, clear all the data bits, then write the result back to PORTGPA. This example would have the unintended consequence of clearing the condition that set the IOCF flag. 2013 Microchip Technology Inc. General 13 8 7 OPCODE 0 k (literal) k = 8-bit immediate value CALL and GOTO instructions only 13 11 OPCODE 10 0 k (literal) k = 11-bit immediate value DS20002331B-page 193 MCP19110/11 TABLE 29-2: MCP19110/11 INSTRUCTION SET 14-Bit Opcode Mnemonic, Operands Description Cycles MSb LSb Status Affecte d Notes BYTE-ORIENTED FILE REGISTER OPERATIONS ADDWF ANDWF CLRF CLRW COMF DECF DECFSZ INCF INCFSZ IORWF MOVF MOVWF NOP RLF RRF SUBWF SWAPF XORWF f, d f, d f – f, d f, d f, d f, d f, d f, d f, d f – f, d f, d f, d f, d f, d Add W and f AND W with f Clear f Clear W Complement f Decrement f Decrement f, Skip if 0 Increment f Increment f, Skip if 0 Inclusive OR W with f Move f Move W to f No Operation Rotate Left f through Carry Rotate Right f through Carry Subtract W from f Swap nibbles in f Exclusive OR W with f 1 1 1 1 1 1 1(2) 1 1(2) 1 1 1 1 1 1 1 1 1 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 0111 0101 0001 0001 1001 0011 1011 1010 1111 0100 1000 0000 0000 1101 1100 0010 1110 0110 dfff dfff lfff 0xxx dfff dfff dfff dfff dfff dfff dfff lfff 0xx0 dfff dfff dfff dfff dfff ffff C, DC, Z 1, 2 ffff Z 1, 2 ffff Z 2 xxxx Z ffff Z 1, 2 ffff Z 1, 2 ffff 1, 2, 3 ffff Z 1, 2 ffff 1, 2, 3 ffff Z 1, 2 ffff Z 1, 2 ffff 0000 ffff C 1, 2 ffff C 1, 2 ffff C, DC, Z 1, 2 ffff 1, 2 ffff Z 1, 2 bfff bfff bfff bfff ffff ffff ffff ffff kkkk kkkk kkkk 0110 kkkk kkkk kkkk 0000 kkkk 0000 0110 kkkk kkkk kkkk C, DC, Z kkkk Z kkkk 0100 TO, PD kkkk Z kkkk kkkk 1001 kkkk 1000 0011 TO, PD kkkk C, DC, Z Z kkkk BIT-ORIENTED FILE REGISTER OPERATIONS BCF BSF BTFSC BTFSS f, b f, b f, b f, b Bit Clear f Bit Set f Bit Test f, Skip if Clear Bit Test f, Skip if Set 1 1 1 (2) 1 (2) 01 01 01 01 00bb 01bb 10bb 11bb 1, 2 1, 2 3 3 LITERAL AND CONTROL OPERATIONS ADDLW ANDLW CALL CLRWDT GOTO IORLW MOVLW RETFIE RETLW RETURN SLEEP SUBLW XORLW Note 1: 2: 3: k k k – k k k – k – – k k Add literal and W AND literal with W Call Subroutine Clear Watchdog Timer Go to address Inclusive OR literal with W Move literal to W Return from interrupt Return with literal in W Return from Subroutine Go into Standby mode Subtract W from literal Exclusive OR literal with W 1 1 2 1 2 1 1 2 2 2 1 1 1 11 11 10 00 10 11 11 00 11 00 00 11 11 111x 1001 0kkk 0000 1kkk 1000 00xx 0000 01xx 0000 0000 110x 1010 When an I/O register is modified as a function of itself (e.g., MOVF PORTA, 1), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared if assigned to the Timer0 module. If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as an NOP. DS20002331B-page 194 2013 Microchip Technology Inc. MCP19110/11 29.2 Instruction Descriptions ADDLW Add literal and W Syntax: [ label ] ADDLW Operands: 0 k 255 Operation: (W) + k (W) Status Affected: Description: BCF k Bit Clear f Syntax: [ label ] BCF Operands: 0 f 127 0b7 C, DC, Z Operation: 0 (f<b>) The contents of the W register are added to the eight-bit literal ‘k’ and the result is placed in the W register. Status Affected: None Description: Bit ‘b’ in register ‘f’ is cleared. ADDWF Add W and f BSF Bit Set f Syntax: [ label ] ADDWF Syntax: [ label ] BSF Operands: 0 f 127 d 0,1 Operands: 0 f 127 0b7 Operation: (W) + (f) (destination) Operation: 1 (f<b>) Status Affected: C, DC, Z Status Affected: None Description: Add the contents of the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. Description: Bit ‘b’ in register ‘f’ is set. ANDLW AND literal with W BTFSC Bit Test f, Skip if Clear Syntax: [ label ] ANDLW Syntax: [ label ] BTFSC f,b Operands: 0 k 255 Operands: Operation: (W) .AND. (k) (W) 0 f 127 0b7 Status Affected: Z Operation: skip if (f<b>) = 0 Description: The contents of W register are AND’ed with the eight-bit literal ‘k’. The result is placed in the W register. Status Affected: None Description: If bit ‘b’ in register ‘f’ is ‘1’, the next instruction is executed. If bit ‘b’ in register ‘f’ is ‘0’, the next instruction is discarded, and an NOP is executed instead, making this a two-cycle instruction. f,d k ANDWF AND W with f Syntax: [ label ] ANDWF Operands: 0 f 127 d 0,1 Operation: (W) .AND. (f) (destination) Status Affected: Z Description: AND the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. 2013 Microchip Technology Inc. f,b f,b f,d DS20002331B-page 195 MCP19110/11 BTFSS Bit Test f, Skip if Set CLRWDT Clear Watchdog Timer Syntax: [ label ] BTFSS f,b Syntax: [ label ] CLRWDT Operands: 0 f 127 0b<7 Operands: None Operation: 00h WDT 0 WDT prescaler, 1 TO 1 PD Status Affected: TO, PD Description: CLRWDT instruction resets the Watchdog Timer. It also resets the prescaler of the WDT. Status bits TO and PD are set. Operation: skip if (f<b>) = 1 Status Affected: None Description If bit ‘b’ in register ‘f’ is ‘0’, the next instruction is executed. If bit ‘b’ is ‘1’, then the next instruction is discarded and an NOP is executed instead, making this a two-cycle instruction. CALL Call Subroutine COMF Complement f Syntax: [ label ] CALL k Syntax: [ label ] COMF Operands: 0 k 2047 Operands: Operation: (PC)+ 1 TOS, k PC<10:0>, (PCLATH<4:3>) PC<12:11> 0 f 127 d [0,1] Operation: (f) (destination) Status Affected: Z Status Affected: None Description: Description: Call Subroutine. First, return address (PC + 1) is pushed onto the stack. The eleven-bit immediate address is loaded into PC bits <10:0>. The upper bits of the PC are loaded from PCLATH. CALL is a two-cycle instruction. The contents of register ‘f’ are complemented. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. CLRF Clear f DECF Decrement f Syntax: [ label ] CLRF Syntax: [ label ] DECF f,d Operands: 0 f 127 Operands: Operation: 00h (f) 1Z 0 f 127 d [0,1] Operation: (f) - 1 (destination) Status Affected: Z Status Affected: Z Description: The contents of register ‘f’ are cleared and the Z bit is set. Description: Decrement register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. CLRW Clear W Syntax: [ label ] CLRW Operands: None Operation: 00h (W) 1Z f Status Affected: Z Description: W register is cleared. Zero bit (Z) is set. DS20002331B-page 196 f,d 2013 Microchip Technology Inc. MCP19110/11 DECFSZ Decrement f, Skip if 0 INCFSZ Increment f, Skip if 0 Syntax: [ label ] DECFSZ f,d Syntax: [ label ] Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: (f) - 1 (destination); skip if result = 0 Operation: (f) + 1 (destination), skip if result = 0 Status Affected: None Status Affected: None Description: The contents of register ‘f’ are decremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘1’, the next instruction is executed. If the result is ‘0’, then an NOP is executed instead, making it a two-cycle instruction. Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘1’, the next instruction is executed. If the result is ‘0’, an NOP is executed instead, making it a two-cycle instruction. GOTO Unconditional Branch IORLW Inclusive OR literal with W Syntax: [ label ] Syntax: [ label ] Operands: 0 k 2047 Operands: 0 k 255 Operation: k PC<10:0> PCLATH<4:3> PC<12:11> Operation: (W) .OR. k (W) Status Affected: Z Status Affected: None Description: Description: GOTO is an unconditional branch. The eleven-bit immediate value is loaded into PC bits <10:0>. The upper bits of PC are loaded from PCLATH<4:3>. GOTO is a two-cycle instruction. The contents of the W register are OR’ed with the eight-bit literal ‘k’. The result is placed in the W register. INCF Increment f IORWF Inclusive OR W with f Syntax: [ label ] Syntax: [ label ] Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: (f) + 1 (destination) Operation: (W) .OR. (f) (destination) Status Affected: Z Status Affected: Z Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. Description: Inclusive OR the W register with register ‘f’. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. GOTO k INCF f,d 2013 Microchip Technology Inc. INCFSZ f,d IORLW k IORWF f,d DS20002331B-page 197 MCP19110/11 MOVF Move f Syntax: [ label ] Operands: 0 f 127 d [0,1] MOVF f,d MOVWF Move W to f Syntax: [ label ] MOVWF Operands: 0 f 127 Operation: (W) (f) f Operation: (f) (dest) Status Affected: None Status Affected: Z Description: Description: The contents of register ‘f’ is moved to a destination dependent upon the status of ‘d’. If d = 0, destination is W register. If d = 1, the destination is file register ‘f’ itself. d = 1 is useful to test a file register since Status flag Z is affected. Move data from W register to register ‘f’. Words: 1 Cycles: 1 Words: 1 Cycles: 1 Example: MOVF Example: MOVW F OPTION Before Instruction OPTION = W = After Instruction OPTION = W = FSR, 0 0xFF 0x4F 0x4F 0x4F After Instruction W = value in FSR register Z = 1 NOP No Operation Move literal to W Syntax: [ label ] Syntax: [ label ] Operands: None Operands: 0 k 255 Operation: No operation Operation: k (W) Status Affected: None Status Affected: None Description: No operation. Description: The eight-bit literal ‘k’ is loaded into W register. The “don’t cares” will assemble as ‘0’s. Words: 1 Cycles: 1 MOVLW Words: 1 Cycles: 1 Example: MOVLW MOVLW k NOP 0x5A After Instruction W = DS20002331B-page 198 Example: NOP 0x5A 2013 Microchip Technology Inc. MCP19110/11 RETFIE Return from Interrupt RETLW Return with literal in W Syntax: [ label ] Syntax: [ label ] RETFIE RETLW k Operands: None Operands: 0 k 255 Operation: TOS PC, 1 GIE Operation: k (W); TOS PC Status Affected: None Status Affected: None Description: Return from Interrupt. Stack is POPed and Top-of-Stack (TOS) is loaded in the PC. Interrupts are enabled by setting Global Interrupt Enable bit, GIE (INTCON<7>). This is a two-cycle instruction. Description: The W register is loaded with the eight-bit literal ‘k’. The program counter is loaded from the top of the stack (the return address). This is a two-cycle instruction. Words: 1 Cycles: 2 Words: 1 Cycles: 2 Example: Example: RETFIE After Interrupt PC = GIE = TOS 1 TABLE CALL TABLE;W contains ;table offset ;value GOTO DONE • • ADDWF PC ;W = offset RETLW k1 ;Begin table RETLW k2 ; • • • RETLW kn ;End of table DONE Before Instruction W = 0x07 After Instruction W = value of k8 RETURN 2013 Microchip Technology Inc. Return from Subroutine Syntax: [ label ] Operands: None RETURN Operation: TOS PC Status Affected: None Description: Return from subroutine. The stack is POPed and the top of the stack (TOS) is loaded into the program counter. This is a two-cycle instruction. DS20002331B-page 199 MCP19110/11 RLF Rotate Left f through Carry SLEEP Enter Sleep mode Syntax: [ label ] Syntax: [ label ] SLEEP Operands: 0 f 127 d [0,1] RLF f,d Operation: See description below Status Affected: C Description: The contents of register ‘f’ are rotated one bit to the left through the Carry flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. C Words: 1 Cycles: 1 Example: RLF Operands: None Operation: 00h WDT, 0 WDT prescaler, 1 TO, 0 PD Status Affected: TO, PD Description: The power-down Status bit, PD is cleared. Time-out Status bit, TO is set. Watchdog Timer and its prescaler are cleared. The processor is put into Sleep mode with the oscillator stopped. Register f REG1,0 Before Instruction REG1 = 0110 C = After Instruction REG1 = 0110 W = 1100 C = 1110 0 1110 1100 1 RRF Rotate Right f through Carry SUBLW Subtract W from literal Syntax: [ label ] Syntax: [ label ] SUBLW k Operands: 0 f 127 d [0,1] Operands: 0 k 255 Operation: k - (W) W) Operation: See description below Status Affected: C Description: The contents of register ‘f’ are rotated one bit to the right through the Carry flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. RRF f,d Description: C DS20002331B-page 200 Status Affected: C, DC, Z Register f The W register is subtracted (two’s complement method) from the eight-bit literal ‘k’. The result is placed in the W register. Result Condition C=0 Wk C=1 Wk DC = 0 W<3:0> k<3:0> DC = 1 W<3:0> k<3:0> 2013 Microchip Technology Inc. MCP19110/11 SUBWF Subtract W from f XORWF Exclusive OR W with f Syntax: [ label ] SUBWF f,d Syntax: [ label ] XORWF Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: (f) - (W) destination) Operation: (W) .XOR. (f) destination) Status Affected: C, DC, Z Status Affected: Z Description: Description: Exclusive OR the contents of the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. Subtract (two’s complement method) W register from register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. C=0 Wf C=1 Wf DC = 0 W<3:0> f<3:0> DC = 1 W<3:0> f<3:0> SWAPF Swap Nibbles in f Syntax: [ label ] SWAPF f,d Operands: 0 f 127 d [0,1] Operation: (f<3:0>) (destination<7:4>), (f<7:4>) (destination<3:0>) Status Affected: None Description: The upper and lower nibbles of register ‘f’ are exchanged. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed in register ‘f’. XORLW Exclusive OR literal with W Syntax: [ label ] XORLW k Operands: 0 k 255 Operation: (W) .XOR. k W) Status Affected: Z Description: The contents of the W register are XOR’ed with the eight-bit literal ‘k’. The result is placed in the W register. 2013 Microchip Technology Inc. f,d DS20002331B-page 201 MCP19110/11 NOTES: DS20002331B-page 202 2013 Microchip Technology Inc. MCP19110/11 30.0 DEVELOPMENT SUPPORT The PIC® microcontrollers (MCU) and dsPIC® digital signal controllers (DSC) are supported with a full range of software and hardware development tools: • Integrated Development Environment - MPLAB® X IDE Software • Compilers/Assemblers/Linkers - MPLAB XC Compiler - MPASMTM Assembler - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB Assembler/Linker/Librarian for Various Device Families • Simulators - MPLAB X SIM Software Simulator • Emulators - MPLAB REAL ICE™ In-Circuit Emulator • In-Circuit Debuggers/Programmers - MPLAB ICD 3 - PICkit™ 3 • Device Programmers - MPLAB PM3 Device Programmer • Low-Cost Demonstration/Development Boards, Evaluation Kits and Starter Kits • Third-party Development Tools 30.1 MPLAB X Integrated Development Environment Software The MPLAB X IDE is a single, unified graphical user interface for Microchip and third-party software, and hardware development tool that runs on Windows®, Linux and Mac OS® X. Based on the NetBeans IDE, MPLAB X IDE is an entirely new IDE with a host of free software components and plug-ins for highperformance application development and debugging. Moving between tools and upgrading from software simulators to hardware debugging and programming tools is simple with the seamless user interface. With complete project management, visual call graphs, a configurable watch window and a feature-rich editor that includes code completion and context menus, MPLAB X IDE is flexible and friendly enough for new users. With the ability to support multiple tools on multiple projects with simultaneous debugging, MPLAB X IDE is also suitable for the needs of experienced users. Feature-Rich Editor: • Color syntax highlighting • Smart code completion makes suggestions and provides hints as you type • Automatic code formatting based on user-defined rules • Live parsing User-Friendly, Customizable Interface: • Fully customizable interface: toolbars, toolbar buttons, windows, window placement, etc. • Call graph window Project-Based Workspaces: • • • • Multiple projects Multiple tools Multiple configurations Simultaneous debugging sessions File History and Bug Tracking: • Local file history feature • Built-in support for Bugzilla issue tracker 2013 Microchip Technology Inc. DS20002331B-page 203 MCP19110/11 30.2 MPLAB XC Compilers The MPLAB XC Compilers are complete ANSI C compilers for all of Microchip’s 8, 16, and 32-bit MCU and DSC devices. These compilers provide powerful integration capabilities, superior code optimization and ease of use. MPLAB XC Compilers run on Windows, Linux or MAC OS X. For easy source level debugging, the compilers provide debug information that is optimized to the MPLAB X IDE. The free MPLAB XC Compiler editions support all devices and commands, with no time or memory restrictions, and offer sufficient code optimization for most applications. MPLAB XC Compilers include an assembler, linker and utilities. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. MPLAB XC Compiler uses the assembler to produce its object file. Notable features of the assembler include: • • • • • • Support for the entire device instruction set Support for fixed-point and floating-point data Command-line interface Rich directive set Flexible macro language MPLAB X IDE compatibility 30.3 MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for PIC10/12/16/18 MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code, and COFF files for debugging. 30.4 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler. It can link relocatable objects from precompiled libraries, using directives from a linker script. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction 30.5 MPLAB Assembler, Linker and Librarian for Various Device Families MPLAB Assembler produces relocatable machine code from symbolic assembly language for PIC24, PIC32 and dsPIC DSC devices. MPLAB XC Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • • • • • • Support for the entire device instruction set Support for fixed-point and floating-point data Command-line interface Rich directive set Flexible macro language MPLAB X IDE compatibility The MPASM Assembler features include: • Integration into MPLAB X IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multipurpose source files • Directives that allow complete control over the assembly process DS20002331B-page 204 2013 Microchip Technology Inc. MCP19110/11 30.6 MPLAB X SIM Software Simulator The MPLAB X SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB X SIM Software Simulator fully supports symbolic debugging using the MPLAB XC Compilers, and the MPASM and MPLAB Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool. 30.7 MPLAB REAL ICE In-Circuit Emulator System The MPLAB REAL ICE In-Circuit Emulator System is Microchip’s next generation high-speed emulator for Microchip Flash DSC and MCU devices. It debugs and programs all 8, 16 and 32-bit MCU, and DSC devices with the easy-to-use, powerful graphical user interface of the MPLAB X IDE. The emulator is connected to the design engineer’s PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with in-circuit debugger systems (RJ-11) or with the new high-speed, noise tolerant, LowVoltage Differential Signal (LVDS) interconnection (CAT5). The emulator is field upgradeable through future firmware downloads in MPLAB X IDE. MPLAB REAL ICE offers significant advantages over competitive emulators including full-speed emulation, run-time variable watches, trace analysis, complex breakpoints, logic probes, a ruggedized probe interface and long (up to three meters) interconnection cables. 2013 Microchip Technology Inc. 30.8 MPLAB ICD 3 In-Circuit Debugger System The MPLAB ICD 3 In-Circuit Debugger System is Microchip’s most cost-effective, high-speed hardware debugger/programmer for Microchip Flash DSC and MCU devices. It debugs and programs PIC Flash microcontrollers and dsPIC DSCs with the powerful, yet easy-to-use graphical user interface of the MPLAB IDE. The MPLAB ICD 3 In-Circuit Debugger probe is connected to the design engineer’s PC using a highspeed USB 2.0 interface and is connected to the target with a connector compatible with the MPLAB ICD 2 or MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3 supports all MPLAB ICD 2 headers. 30.9 PICkit 3 In-Circuit Debugger/ Programmer The MPLAB PICkit 3 allows debugging and programming of PIC and dsPIC Flash microcontrollers at a most affordable price point using the powerful graphical user interface of the MPLAB IDE. The MPLAB PICkit 3 is connected to the design engineer’s PC using a full-speed USB interface and can be connected to the target via a Microchip debug (RJ-11) connector (compatible with MPLAB ICD 3 and MPLAB REAL ICE). The connector uses two device I/O pins and the Reset line to implement in-circuit debugging and In-Circuit Serial Programming™ (ICSP™). 30.10 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages, and a modular, detachable socket assembly to support various package types. The ICSP cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices, and incorporates an MMC card for file storage and data applications. DS20002331B-page 205 MCP19110/11 30.11 Demonstration/Development Boards, Evaluation Kits, and Starter Kits A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. 30.12 Third-Party Development Tools Microchip also offers a great collection of tools from third-party vendors. These tools are carefully selected to offer good value and unique functionality. • Device Programmers and Gang Programmers from companies, such as SoftLog and CCS • Software Tools from companies, such as Gimpel and Trace Systems • Protocol Analyzers from companies, such as Saleae and Total Phase • Demonstration Boards from companies, such as MikroElektronika, Digilent® and Olimex • Embedded Ethernet Solutions from companies, such as EZ Web Lynx, WIZnet and IPLogika® The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Also available are starter kits that contain everything needed to experience the specified device. This usually includes a single application and debug capability, all on one board. Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits. DS20002331B-page 206 2013 Microchip Technology Inc. MCP19110/11 31.0 PACKAGING INFORMATION 31.1 Package Marking Information 24-Lead QFN (4x4x0.9 mm) (MCP19110 only) PIN 1 Example PIN 1 28-Lead QFN (5x5x0.9 mm)(MCP19111 only) PIN 1 19110 E/MJ ^^ e3 1320 256 Example PIN 1 19111 e3 E/MQ ^^ 1246256 Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code RoHS Compliant JEDEC designator for Matte Tin (Sn) This package is RoHS Compliant. The RoHS Compliant JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2013 Microchip Technology Inc. DS20002331B-page 207 MCP19110/11 24-Lead Plastic Quad Flat, No Lead Package (MJ) – 4x4x0.9 mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20002331B-page 208 2013 Microchip Technology Inc. MCP19110/11 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2013 Microchip Technology Inc. DS20002331B-page 209 MCP19110/11 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20002331B-page 210 2013 Microchip Technology Inc. MCP19110/11 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2013 Microchip Technology Inc. DS20002331B-page 211 MCP19110/11 28-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5 mm Body [QFN] Land Pattern With 0.55 mm Contact Length Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Microchip Technology Drawing C04-2140A DS20002331B-page 212 2013 Microchip Technology Inc. MCP19110/11 APPENDIX A: REVISION HISTORY Revision B (June 2013) The following is the list of modifications: 1. Added new device MCP19110 to the family and the related information across the document. 2. Updated information in Features section. 3. Added pinout diagram and pin summary table for the MCP19110 device. 4. Updated Figure 1-1. 5. Updated Section 2.0 “Pin Description”. 6. Updated Section 4.3 “Thermal Specifications”. 7. Added new Section 28.2 “In-Circuit Debugger”. 8. Updated Section 31.1 “Package Marking Information”. 9. Updated Product Identification System. 10. Fixed minor typographical errors. Revision A (January 2013) • Original Release of this Document. 2013 Microchip Technology Inc. DS20002331B-page 213 MCP19110/11 NOTES: DS20002331B-page 214 2013 Microchip Technology Inc. MCP19110/11 INDEX A Simplified PWM ........................................................ 144 Timer0 ...................................................................... 135 Timer1 ...................................................................... 137 Timer2 ...................................................................... 140 Watchdog Timer ....................................................... 103 A/D Specifications...................................................... 3, 5, 33 A/D Conversion ................................................................. 127 Requirements.............................................................. 34 Timing ................................................................... 34, 35 Absolute Maximum Ratings ................................................ 23 AC Characteristics .............................................................. 30 ACKSTAT ......................................................................... 172 ACKSTAT Status Flag ...................................................... 172 ADC .................................................................................. 125 Acquisition Requirements ......................................... 131 Associated Registers ................................................ 133 Block Diagram........................................................... 125 Calculating Acquisition Time..................................... 131 Channel Selection..................................................... 126 Configuration............................................................. 126 Configuring Interrupt ................................................. 128 Conversion Clock...................................................... 126 Conversion Procedure .............................................. 128 Internal Sampling Switch (RSS) IMPEDANCE .............. 131 Interrupts................................................................... 127 Operation .................................................................. 128 Operation During Sleep ............................................ 128 Port Configuration ..................................................... 126 Register Definitions................................................... 129 Source Impedance.................................................... 131 Special Event Trigger................................................ 128 ADCON0 Register............................................................. 129 ADCON1 Register............................................................. 130 ADRESH Register (ADFM = 0) ......................................... 130 ADRESL Register (ADFM = 0).......................................... 130 Alternate Pin Function....................................................... 112 Analog Blocks Enable Control ............................................ 51 Analog Peripheral Control ................................................... 49 Analog-to-Digital Converter. See ADC ANSELA Register ............................................................. 115 ANSELB Register ............................................................. 118 APFCON Register............................................................. 112 Assembler MPASM Assembler................................................... 204 B Bench Testing Analog Bench Test Control ......................................... 57 System ........................................................................ 57 BF ............................................................................. 172, 174 BF Status Flag .......................................................... 172, 174 Block Diagrams ADC .......................................................................... 125 ADC Transfer Function ............................................. 132 Analog Input Model ................................................... 132 Generic I/O Port ........................................................ 111 Interrupt Logic ............................................................. 94 MCLR Circuit............................................................... 86 MCP19110/11 Synchronous Buck Block Diagram...... 10 MSSP (I2C Master Mode) ......................................... 147 MSSP (I2C Slave Mode) ........................................... 148 On-Chip Reset Circuit ................................................. 85 2013 Microchip Technology Inc. C C Compilers MPLAB C18.............................................................. 204 Calibration Word Associated Registers.................................................. 84 Capture/Compare/PWM ........................................... 143, 145 Clock Switching .................................................................. 84 Code Examples A/D Conversion ........................................................ 128 Assigning Prescaler to Timer0.................................. 136 Assigning Prescaler to WDT..................................... 136 Initializing PORTA .................................................... 111 Saving Status and W Registers in RAM ................... 100 Compensation .................................................................... 18 Compensation Setting ........................................................ 43 Computed Function Calls ................................................... 78 Computed GOTO................................................................ 78 Current Measurement Control ................................................. 51 Current Sense ........................................................ 18, 40, 41 Customer Change Notification Service............................. 221 Customer Support............................................................. 221 D Data Memory ...................................................................... 70 Data Memory Map .............................................................. 72 DC and AC Characteristics................................................. 53 Graphs and Tables ..................................................... 53 DC Characteristics.............................................................. 30 Development Support ....................................................... 203 Device Configuration ........................................................ 37, 81 Code Protection.................................................. 82 Configuration Word............................................. 81 ID Locations ....................................................... 82 User ID ............................................................... 82 Write Protection .................................................. 82 Device Calibration............................................................... 59 Calibration Word 1...................................................... 59 Calibration Word 2...................................................... 60 Calibration Word 3...................................................... 61 Calibration Word 4...................................................... 62 Calibration Word 5...................................................... 63 Calibration Word 6...................................................... 64 Calibration Word 7...................................................... 65 Device Overview................................................................... 9 Digital Electrical Characteristics ......................................... 29 Diode Emulation Mode ....................................................... 49 E ECCP/CCP. See Enhanced Capture/Compare/PWM Electrical Characteristics .............................................. 23, 24 Errata .................................................................................... 7 External Clock..................................................................... 30 DS20002331B-page 215 MCP19110/11 F Features Miscellaneous ............................................................. 21 Protection .................................................................... 20 Synchronous Buck ........................................................ 1 Firmware Instructions........................................................ 193 Flash Program Memory Control ........................................ 105 Operation During Code Protect................................. 109 Operation during write Protect .................................. 109 Protecting .................................................................. 109 Reading..................................................................... 108 Writing to ................................................................... 109 Flash Program Memory Control Registers........................ 106 H High-Side Drive Strength .................................................... 49 I I/O Ports.......................................................................... 111 I2C Mode (MSSPx) Acknowledge Sequence ........................................... 152 Acknowledge Sequence Timing................................ 176 Associated Registers ................................................ 182 Bus Collision During a Repeated Start Condition ................... 180 During a Start Condition.................................... 178 During a Stop Condition.................................... 181 Effects of a Reset...................................................... 177 I2C Clock Rate w/BRG .............................................. 183 Master Mode ............................................................. 169 Clock Arbitration................................................ 169 Operation .......................................................... 169 Reception.......................................................... 174 Start Condition Timing .............................. 170, 171 Transmission..................................................... 172 Multi-Master Communication, Bus Collision and Arbitration .................................................................... 177 Multi-Master Mode .................................................... 177 Operation .................................................................. 150 Overview ................................................................... 148 Read/Write Bit Information (R/W Bit) ........................ 153 Slave Mode 10-bit Address Reception.................................. 163 Bus Collision ..................................................... 159 Clock Synchronization ...................................... 167 General Call Address Support .......................... 168 Operation .......................................................... 153 SSPMSKx Register........................................... 168 Transmission..................................................... 159 Sleep Operation ........................................................ 177 Stop Condition Timing............................................... 176 In-Circuit Serial Programming (ICSP) ............................... 191 Common Programming Interfaces ............................ 191 In-Circuit Debugger ................................................... 192 Indirect Addressing ............................................................. 78 Input .................................................................................... 24 Type ............................................................................ 12 Undervoltage Lockout ........................................... 20, 37 Instruction Format ............................................................. 193 DS20002331B-page 216 Instruction Set................................................................... 193 ADDLW..................................................................... 195 ADDWF..................................................................... 195 ANDLW..................................................................... 195 ANDWF..................................................................... 195 BCF .......................................................................... 195 BSF........................................................................... 195 BTFSC ...................................................................... 195 BTFSS ...................................................................... 196 CALL......................................................................... 196 CLRF ........................................................................ 196 CLRW ....................................................................... 196 CLRWDT .................................................................. 196 COMF ....................................................................... 196 DECF ........................................................................ 196 DECFSZ ................................................................... 197 GOTO ....................................................................... 197 INCF ......................................................................... 197 INCFSZ..................................................................... 197 IORLW ...................................................................... 197 IORWF...................................................................... 197 MOVF ....................................................................... 198 MOVLW .................................................................... 198 MOVWF .................................................................... 198 NOP .......................................................................... 198 RETFIE ..................................................................... 199 RETLW ..................................................................... 199 RETURN................................................................... 199 RLF ........................................................................... 200 RRF .......................................................................... 200 SLEEP ...................................................................... 200 SUBLW ..................................................................... 200 SUBWF..................................................................... 201 SWAPF ..................................................................... 201 XORLW .................................................................... 201 XORWF .................................................................... 201 Summary Table ........................................................ 194 Internal Sampling Switch (RSS) IMPEDANCE ...................... 131 Internal Synchronous Driver ............................................... 17 Internal Temperature Indicator Module............................. 123 Circuit Operation....................................................... 123 Temperature Output ................................................. 123 Internal Temperature Measurement Control....................... 51 Internet Address ............................................................... 221 Interrupt-on-Change ......................................................... 121 Associated Registers ................................................ 122 Clearing Interrupt Flags ............................................ 121 Enabling the Module ................................................. 121 Operation in Sleep .................................................... 121 Pin Configuration ...................................................... 121 Registers .................................................................. 122 Interrupts ADC .......................................................................... 128 Associated Registers .................................................. 99 Context Saving ......................................................... 100 Control Registers ........................................................ 95 RA2/INT ...................................................................... 93 TMR1 ........................................................................ 138 L Linear Regulators ............................................................... 17 2013 Microchip Technology Inc. MCP19110/11 M P MASTER Error Signal Gain ................................................ 45 Master Synchronous Serial Port. See MSSPx MCLR .................................................................................. 86 Internal ........................................................................ 86 Memory Organization.......................................................... 69 Data ............................................................................ 70 Program ...................................................................... 69 Microchip Internet Web Site .............................................. 221 MOSFET ................................... 15, 16, 17, 38, 46, 49, 57, 67 Driver Dead Time........................................................ 17 MOSFET Driver Dead Time .................................................................. 49 Programmable Dead Time.......................................... 46 MPLAB ASM30 Assembler, Linker, Librarian ................... 204 MPLAB Integrated Development Environment Software .. 203 MPLAB PM3 Device Programmer .................................... 205 MPLAB REAL ICE In-Circuit Emulator System................. 205 MPLINK Object Linker/MPLIB Object Librarian ................ 204 MSSPx .............................................................................. 147 Arbitration.................................................................. 150 Baud Rate Generator................................................ 183 Clock Stretching........................................................ 150 I2C Bus Terms .......................................................... 151 I2C Master Mode....................................................... 169 I2C Mode................................................................... 148 I2C Mode Operation .................................................. 150 I2C Slave Mode Operation ........................................ 153 Module Overview ...................................................... 147 Multi-Phase System ............................................................ 22 Packaging ......................................................................... 207 Marking..................................................................... 207 Specifications ........................................................... 208 PCL..................................................................................... 78 Modifying .................................................................... 78 PCLATH ............................................................................. 78 PCON Register ............................................................. 87, 92 Pin Diagram 24-Pin QFN................................................................... 2 28-Pin QFN................................................................... 4 Pinout Description Summary .................................................................. 3, 5 Pinout Description Table..................................................... 12 PIR1 Register ..................................................................... 98 PIR2 Register ..................................................................... 99 PMADRH Register............................................................ 105 PMADRL Register .................................................... 105, 106 PMCON1 Register .................................................... 105, 107 PMCON2 Register ............................................................ 105 PMDATH Register ............................................................ 106 PMDATL Register............................................................. 106 PMDRH Register .............................................................. 107 PORTB Additional Pin Functions Weak Pull-up .................................................... 117 Pin Descriptions and Diagrams ................................ 119 PORTGPA ................................................................ 112, 121 ANSELA Register ..................................................... 113 Associated Registers................................................ 115 Functions and Output Priorities ................................ 113 Interrupt-on-Change ................................................. 112 Weak Pull-Ups.......................................................... 112 PORTGPA Register.......................................................... 112 PORTGPB ................................................................ 116, 121 ANSELB Register ..................................................... 116 Associated Registers................................................ 119 Functions and Output Priorities ................................ 116 Interrupt-on-Change ................................................. 116 P1B/P1C/P1D.Capture/Compare/PWM ................... 116 Weak Pull-Ups.......................................................... 116 PORTGPB Register.................................................. 116, 117 Power-Down Mode (Sleep)............................................... 101 Associated Registers................................................ 102 Power-on Reset (POR)....................................................... 86 Power-up Timer (PWRT) .................................................... 87 Prescaler, Timer1 Select (T1CKPS1:T1CKPS0 Bits) .............................. 46 Product Identification System ........................................... 223 Program Memory ................................................................ 69 Map and Stack (MCP19111) ...................................... 69 Program Memory Protection............................................... 82 Programming, Device Instructions.................................... 193 Pulse-Width Modulation...................................................... 33 Associated Registers................................................ 145 Duty Cycle ................................................................ 145 Module...................................................................... 143 Operating during Sleep............................................. 145 Period ....................................................................... 144 Stand-alone Mode .................................................... 143 Standard Mode ......................................................... 143 Switching Frequency Synchronization Mode............ 143 O OPCODE Field Descriptions ............................................. 193 Oscillator ............................................................................. 83 Associated Registers .................................................. 84 Calibration................................................................... 83 Delay Upon Power-up................................................. 84 Frequency Tuning ....................................................... 83 Internal Oscillator ........................................................ 83 Oscillator Module ................................................................ 84 Output ................................................................................. 49 Multiple System........................................................... 22 Overcurrent ..................................................... 20, 38, 39 Overvoltage..................................................... 20, 25, 48 Overvoltage Enable .................................................... 51 Power Good ................................................................ 22 Type ............................................................................ 12 Undervoltage................................................... 20, 25, 48 Undervoltage Accelerator ........................................... 49 Undervoltage Enable .................................................. 51 Voltage........................................................................ 18 Soft-Start............................................................. 22 Tracking .............................................................. 22 Voltage Configuration ................................................. 47 Voltage Sense Pull-up/Pull-down................................ 49 Overcurrent ......................................................................... 39 Overvoltage Accelerator ..................................................... 49 2013 Microchip Technology Inc. DS20002331B-page 217 MCP19110/11 R Reader Response ............................................................. 222 Read-Modify-Write Operations.......................................... 193 Register OVFCON (Output Voltage Set Point Fine Control) ..... 47 Registers ABECON (Analog Block Enable Control).................... 52 ADCON0 (ADC Control 0) ........................................ 129 ADCON1 (ADC Control 1) ........................................ 130 ADRESH (ADC Result High) with ADFM = 0)........... 130 ADRESL (ADC Result Low) with ADFM = 0) ............ 130 ANSELA (Analog Select GPA).................................. 115 ANSELB (Analog Select GPB).................................. 118 APFCON (Alternate Pin Function Control)................ 112 ATSTCON (Analog Bench Test Control) .................... 57 BUFFCON (Unity Gain Buffer Control) ....................... 58 CALWD1 (Calibration Word 1) .................................... 59 CALWD2 (Calibration Word 2) .................................... 60 CALWD3 (Calibration Word 3) .................................... 61 CALWD4 (Calibration Word 4) .................................... 62 CALWD5 (Calibration Word 5) .................................... 63 CALWD6 (Calibration Word 6) .................................... 64 CALWD7 (Calibration Word 7) .................................... 65 CMPZCON (Compensation Setting Control) .............. 43 CONFIG (Configuration Word).................................... 81 CSDGCON (Voltage For Zero Current Control).......... 41 CSGSCON (Current Sense AC Gain Control) ............ 40 DEADCON (Driver Dead Time Control) ...................... 46 DEVICEID (Device ID) ................................................ 82 INTCON (Interrupt Control) ......................................... 95 IOCA (Interrupt-on-Change PORTGPA) ................... 122 IOCB (Interrupt-on-Change PORTGPB) ................... 122 LPCRCON (Slope Compensation Ramp Control)....... 44 OCCON (Output Overcurrent Control) ........................ 39 OOVCON (Output Overvoltage Detect Level Control) 48 OPTION_REG (Option) .............................................. 77 OSCTUNE (Oscillator Tuning) .................................... 83 OUVCON (Output Undervoltage Detect Level Control) .. 48 OVCCON (Output Voltage Set Point Coarse Control) 47 PCON (Power Control) ......................................... 87, 92 PE1(Analog Peripheral Enable 1 Control) .................. 50 PIE1 (Peripheral Interrupt Enable) .............................. 96 PIR1 (Peripheral Interrupt Flag) .................................. 98 PIR2 (Peripheral Interrupt Flag) .................................. 99 PMADRL (Program Memory Address)...................... 106 PMCON1 (Program Memory Control) ....................... 107 PMDATH (Program Memory Data) ........................... 106 PMDATL (Program Memory Data)............................ 106 PMDRH (Program Memory Address)........................ 107 PORTGPA ................................................................ 113 PORTGPB ................................................................ 117 RELEFF (Relative Efficiency Measurement) .............. 67 Reset Values............................................................... 89 SLVGNCON (MASTER Error Signal Input Gain Control) 45 Special Registers Summary...................... 73, 74, 75, 76 SSPCON1(SSP Control)........................................... 185 SSPSTAT (SSP Status) ............................................ 184 SSPxADD (MSSPx Address and Baud Rate, I2C Mode) 188, 189 SSPxCON1 (MSSPx Control 1) ................................ 185 SSPxCON2 (SSPx Control 2) ................................... 186 SSPxCON3 (SSPx Control 3) ................................... 187 SSPxMSK (SSPx Mask) ................................... 188, 189 DS20002331B-page 218 SSPxSTAT (SSPx Status) ........................................ 184 STATUS ..................................................................... 71 T1CON (Timer1 Control) .......................................... 138 TRISA (Tri-State PORTA)......................................... 114 TRISGPB (PORTGPB Tri-State) .............................. 117 TXCON ..................................................................... 141 VINLVL (Input Undervoltage Lockout Control) ........... 37 VZCCON (Voltage for Zero Current Control).............. 42 WPUB (Weak Pull-up PORTB)................................. 114 WPUGPA Weak Pull-up PORTGPA.................................. 114 WPUGPB (Weak Pull-up PORTGPB) ...................... 118 Relative Efficiency Circuity Control..................................... 51 Relative Efficiency Measurement ....................................... 67 Procedure ................................................................... 67 Relative Efficiency Measurement Control........................... 51 Reset .................................................................................. 85 Determining Causes ................................................... 91 Resets................................................................................. 85 Associated Registers .................................................. 92 Revision History................................................................ 213 S Signal Chain Control........................................................... 51 Sleep Wake-up from ........................................................... 101 Wake-up Using Interrupts ......................................... 102 Slope Compensation .................................................... 18, 44 Slope Compensation Control.............................................. 51 Software Simulator (MPLAB SIM) .................................... 205 Special Event Trigger ....................................................... 128 Special Function Registers ................................................. 71 Special Registers Summary Bank 0 ........................................................................ 73 Bank 1 ........................................................................ 74 Bank 2 ........................................................................ 75 Bank 3 ........................................................................ 76 SSPxADD Register................................................... 188, 189 SSPxCON1 Register ........................................................ 185 SSPxCON2 Register ........................................................ 186 SSPxCON3 Register ........................................................ 187 SSPxMSK Register................................................... 188, 189 SSPxOV............................................................................ 174 SSPxOV Status Flag ........................................................ 174 SSPxSTAT Register ......................................................... 184 R/W Bit ..................................................................... 153 Stack................................................................................... 78 Start-up Sequence.............................................................. 87 STATUS Register ............................................................... 71 Switching Frequency .......................................................... 18 System Bench Testing.................................................. 22, 57 2013 Microchip Technology Inc. MCP19110/11 T T1CON Register ............................................................... 138 T1CKPS1:T1CKPS0 Bits ............................................ 46 Temperature Indicator Module .......................................... 123 Thermal Specifications........................................................ 28 Timer Requirements RESET, Watchdog Timer, Oscillator Start-up Timer and Power-up ............................................................ 32 Timer0 ....................................................................... 135, 141 8-Bit Counter Mode................................................... 135 8-bit Timer Mode....................................................... 135 Associated Registers ................................................ 136 External Clock........................................................... 136 Operation .................................................................. 135 Operation During Sleep ............................................ 136 T0CKI........................................................................ 136 Timer0 Module .................................................................. 135 Timer1 ............................................................................... 137 Associated Registers ................................................ 139 Associated registers.................................................. 139 Clock Source Selection............................................. 137 Control Register ........................................................ 138 Interrupt..................................................................... 138 Operation .................................................................. 137 Operation During Sleep ............................................ 138 Prescaler................................................................... 138 Sleep......................................................................... 138 TMR1H Register ....................................................... 137 TMR1L Register........................................................ 137 Timer1 Module .................................................................. 137 Timer2 Associated registers.................................................. 141 Control Register ........................................................ 141 Operation .................................................................. 140 Timer2 Module .................................................................. 140 Timer2/4/6 Associated Registers ................................................ 141 Timers Timer1 T1CON.............................................................. 138 Timer2/4/6 TXCON ............................................................. 141 Timing Diagrams Acknowledge Sequence ........................................... 176 Baud Rate Generator with Clock Arbitration ............. 170 BRG Reset Due to SDA Arbitration During Start Condition .................................................................... 179 Bus Collision During a Repeated Start Condition (Case 1)....................................................................... 180 Bus Collision During a Repeated Start Condition (Case 2)....................................................................... 180 Bus Collision During a Start Condition (SCL = 0) ..... 179 Bus Collision During a Stop Condition (Case 1) ....... 181 Bus Collision During a Stop Condition (Case 2) ....... 181 Bus Collision During Start Condition (SDA only) ...... 178 Bus Collision for Transmit and Acknowledge............ 177 Capture/Compare/PWM.............................................. 33 Clock Synchronization .............................................. 167 First Start Bit Timing ................................................. 170 I2C Master Mode (7 or 10-Bit Transmission) ............ 173 I2C Master Mode (7-Bit Reception)........................... 175 I2C Stop Condition Receive or Transmit Mode ......... 176 INT Pin Interrupt.......................................................... 94 Power-up Timer .......................................................... 31 Repeat Start Condition.............................................. 171 2013 Microchip Technology Inc. Reset .......................................................................... 31 Start-up Timer............................................................. 31 Time-out Sequence Case 1 ................................................................ 87 Case 2 ................................................................ 88 Case 3 ................................................................ 88 Timer0 ........................................................................ 32 Timer1 ........................................................................ 32 Wake-up from Interrupt............................................. 102 Watchdog Timer ......................................................... 31 Timing Parameter Symbology ............................................ 29 Timing Requirements CLKOUT and I/O ........................................................ 31 External Clock ............................................................ 30 TRISA Register................................................................. 114 TRISGPA .......................................................................... 112 TRISGPA Register............................................................ 112 TRISGPB Register.................................................... 116, 117 TXCON (Timer2/4/6) Register .......................................... 141 Typical Application Circuit..................................................... 9 Typical Performance Curves .............................................. 53 U Undervoltage Lockout Input............................................................................ 37 Unity Gain Buffer ................................................................ 58 V Voltage For Zero Current.................................................... 42 W Watchdog Timer (WDT).............................................. 87, 103 Associated Registers................................................ 104 Configuration Word w/ Watchdog Timer................... 104 Operation.................................................................. 103 Period ....................................................................... 103 Programming Considerations ................................... 103 WCOL ....................................................... 170, 172, 174, 176 WCOL Status Flag.................................... 170, 172, 174, 176 WPUB Register................................................................. 114 WPUGPB Register ........................................................... 118 WWW Address ................................................................. 221 WWW, On-Line Support ....................................................... 7 DS20002331B-page 219 MCP19110/11 NOTES: DS20002331B-page 220 2013 Microchip Technology Inc. MCP19110/11 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our website at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. 2013 Microchip Technology Inc. DS20002331B-page 221 MCP19110/11 NOTES: DS20002331B-page 222 2013 Microchip Technology Inc. MCP19110/11 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. [X](1) PART NO. Device X - Tape and Reel Temperature Option Range Device: /XX Package MCP19110: Digitally Enhanced Power Analog Controller with Integrated Synchronous Driver MCP19111: Digitally Enhanced Power Analog Controller with Integrated Synchronous Driver Tape and Reel Option: Blank T = Standard packaging (tube) = Tape and Reel Temperature Range: E = -40C to +125C Package: MJ = 24-lead Plastic Quad Flat, No Lead Package 4x4x0.9 mm body (QFN) MQ = 28-lead Plastic Quad Flat, No Lead Package 5x5x0.9 mm body (QFN) Examples: a) b) Extended temperature, 24LD QFN 4x4 package MCP19110T-E/MJ: Tape and Reel, Extended temperature, 24LD QFN 4x4 package a) MCP19111-E/MQ: b) MCP19110-E/MJ: Extended temperature, 28LD QFN 5x5 package MCP19111T-E/MQ: Tape and Reel, Extended temperature, 28LD QFN 5x5 package Note 2013 Microchip Technology Inc. (Extended) 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20002331B-page 223 MCP19110/11 NOTICE TO CUSTOMERS This product is subject to a license from Power-One®, Inc. related to digital power technology (DPT) patents owned by Power-One, Inc. This license does not extend to stand-alone power supply products. DS20002331B-page 224 2013 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2013, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-62077-288-1 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2013 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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