Obsolete Device TC1025 Linear Building Block – Dual Low Power Comparator Features General Description • Rail-to-Rail Inputs and Outputs • Optimized for Single Supply Operation • Small Packages: 8-Pin MSOP, 8-Pin SOIC or 8-Pin PDIP • Ultra Low Input Bias Current: Less than 100pA • Low Quiescent Current: 8μA (Typ.) • Operates Down to VDD = 1.8V The TC1025 is a dual low-power comparator with a typical supply current of 8μA and operation ensured to VDD = 1.8V. Input and output signal swing is rail-to-rail. Available in a space-saving 8-pin MSOP package, the TC1025 consumes half the board area required by a standard 8-Pin SOIC package. It is also available in 8-Pin SOIC and PDIP packages. It is ideal for applications requiring high integration, small-size and low power. Applications Functional Block Diagram • Power Management Circuits • Battery Operated Equipment • Consumer Products OUTA TC1025 1 8 OUTB Device Selection Table TC1025CEPA 8-Pin PDIP -40°C to +85°C TC1025CEUA 8-Pin MSOP -40°C to +85°C TC1025CEOA 8-Pin SOIC -40°C to +85°C 2 A + Package VSS INA+ INA- 7 B – – VDD + Part Number Temperature Range 3 6 4 5 INB+ INB- Package Types 8-Pin PDIP 8-Pin MSOP 8-Pin SOIC OUTA 1 8 OUTB VSS 2 7 VDD INA+ 3 6 INB+ INA- 4 5 INB- TC1025CEPA TC1025CEUA TC1025CEOA © 2005 Microchip Technology Inc. DS21656C-page 1 TC1025 1.0 ELECTRICAL CHARACTERISTICS *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. ABSOLUTE MAXIMUM RATINGS* Supply Voltage ......................................................6.0V Voltage on Any Pin .......... (VSS – 0.3V) to (VDD + 0.3V) Junction Temperature....................................... +150°C Operating Temperature Range.............-40°C to +85°C Storage Temperature Range ..............-55°C to +150°C TC1025 ELECTRICAL SPECIFICATIONS Electrical Characteristics: Typical values apply at 25°C and VDD = 3.0V. Minimum and maximum values apply for TA = -40° to +85°C, and VDD = 1.8V to 5.5V, unless otherwise specified. Symbol Parameter Min Typ Max Units Test Conditions VDD Supply Voltage 1.8 — 5.5 V IQ Supply Current — 8 12 μA VSS – 0.2 — VDD + 0.2 V -5 -5 — +5 +5 mV mV VDD = 3V, VCM = 1.5V, TA = 25°C -100 — 100 pA TA = 25°C, IN+,IN- = VDD to VSS RL = 10kΩ to VSS Comparator VICMR Common Mode Input Range VOS Input Offset Voltage IB Input Bias Current VOH Output High Voltage VDD – 0.3 — — V VOL Output Low Voltage — — 0.3 V RL = 10kΩ to VDD CMRR Common Mode Rejection Ratio 66 — — dB TA = 25°C, VDD = 5V VCM = VDD to VSS PSRR Power Supply Rejection Ratio 60 — — dB TA = 25°C, VCM = 1.2V VDD = 1.8V to 5V ISRC Output Source Current 1 — — mA IN+ = VDD, IN- = VSS, Output Shorted to VSS VDD = 1.8V ISINK Output Sink Current 2 — — mA IN+ = VSS, IN- = VDD, Output Shorted to VDD VDD = 1.8V tPD1 Response Time — 4 — μsec 100mV Overdrive, CL = 100pF tPD2 Response Time — 6 — μsec 10mV Overdrive, CL = 100pF DS21656C-page 2 © 2005 Microchip Technology Inc. TC1025 2.0 PIN DESCRIPTION The description of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin PDIP) (8-Pin MSOP) (8-Pin SOIC) Symbol 1 OUTA 2 VSS Negative power supply. 3 INA+ Non inverting input. 4 INA- Inverting input. 5 INB- Inverting input. 6 INB+ Non inverting input. 7 VDD Positive power supply. 8 OUTB © 2005 Microchip Technology Inc. Description Comparator output. Comparator input. DS21656C-page 3 TC1025 3.0 DETAILED DESCRIPTION The TC1025 is one of a series of very low-power, linear building block products targeted at low-voltage, singlesupply applications. The TC1025 minimum operating voltage is 1.8V, and typical supply current is only 8μA. It combines two comparators in a single package. 4.0 The TC1025 lends itself to a wide variety of applications, particularly in battery-powered systems. Typically, it finds application in power management, processor supervisory, and interface circuitry. 4.1 3.1 Comparators The TC1025 contains two comparators. The comparator’s input range extends beyond both supply voltages by 200mV and the outputs will swing to within several millivolts of the supplies depending on the load current being driven. TYPICAL APPLICATIONS External Hysteresis (Comparator) Hysteresis can be set externally with two resistors using positive feedback techniques (see Figure 4-1). The design procedure for setting external comparator hysteresis is as follows: 1. The comparators exhibit propagation delay and supply current which are largely independent of supply voltage. The low input bias current and offset voltage make them suitable for high impedance precision applications. 2. 3. Choose the feedback resistor RC. Since the input bias current of the comparator is at most 100pA, the current through RC can be set to 100nA (i.e., 1000 times the input bias current) and retain excellent accuracy. The current through RC at the comparator’s trip point is VR/ RC where VR is a stable reference voltage. Determine the hysteresis voltage (VHY) between the upper and lower thresholds. Calculate RA as follows: EQUATION 4-1: VHY R A = R C ⎛⎝ -----------⎞⎠ V DD 4. 5. Choose the rising threshold voltage for VSRC (VTHR). Calculate RB as follows: EQUATION 4-2: 1 R B = ----------------------------------------------------------V 1 THR ⎞ 1 ⎛ -------------------- – ------- – ------⎝ VR × RA ⎠ RA RC 6. Verify the formulas: threshold voltages with these VSRC rising: EQUATION 4-3: 1 1 1 VTHR = ( V R ) ( R A ) ⎛ -------⎞ + ⎛ -------⎞ + ⎛ -------⎞ ⎝ R A⎠ ⎝ R B⎠ ⎝ R C⎠ VSRC falling: EQUATION 4-4: R A × VDD V THF = V THR – ⎛ -------------------------⎞ ⎝ RC ⎠ DS21656C-page 4 © 2005 Microchip Technology Inc. TC1025 4.2 32.768 kHz “Time of Day Clock” Crystal Controlled Oscillator A very stable oscillator driver can be designed by using a crystal resonator as the feedback element. Figure 4-2 shows a typical application circuit using this technique to develop clock driver for a Time Of Day (TOD) clock chip. The value of RA and RB determine the DC voltage level at which the comparator trips – in this case onehalf of VDD. The RC time constant of RC and CA should be set several times greater than the crystal oscillator’s period, which will ensure a 50% duty cycle by maintaining a DC voltage at the inverting comparator input equal to the absolute average age of the output signal. 4.3 Non-Retriggerable One Shot Multivibrator Using two comparators, a non-retriggerable one shot multivibrator can be designed using the circuit configuration of Figure 4-3. A key feature of this design is that the pulse width is independent of the magnitude of the supply voltage because the charging voltage and the intercept voltage are a fixed percentage of VDD. In addition, this one shot is capable of pulse width with as much as a 99% duty cycle and exhibits input lockout to ensure that the circuit will not retrigger before the output pulse has completely timed out. The trigger level is the voltage required at the input to raise the voltage at node A higher than the voltage at node B, and is set by the resistive divider R4 and R10 and the impedance network composed of R1, R2 and R3. When the one shot has been triggered, the output of CMPTR2 is high, causing the reference voltage at the non-inverting input of CMPTR1 to go to VDD. This prevents any additional input pulses from disturbing the circuit until the output pulse has timed out. The value of the timing capacitor C1 must be small enough to allow CMPTR1 to discharge C1 to a diode voltage before the feedback signal from CMPTR2 (through R10) switches CMPTR1 to its high state and allows C1 to start an exponential charge through R5. Proper circuit action depends upon rapidly discharging C1 through the voltage set by R6, R9 and D2 to a final voltage of a small diode drop. Two propagation delays after the voltage on C1 drops below the level on the non-inverting input of CMPTR2, the output of CMPTR1 switches to the positive rail and begins to charge C1 through R5. The time delay which sets the output pulse width results from C1 charging to the reference voltage set by R6, R9 and D2, plus four comparator propagation delays. When the voltage across C1 charges beyond the reference, the output pulse returns to ground and the input is again ready to accept a trigger signal. © 2005 Microchip Technology Inc. 4.4 Oscillators and Pulse Width Modulators Microchip’s linear building block comparators adapt well to oscillator applications for low frequencies (less than 100kHz). Figure 4-4 shows a symmetrical square wave generator using a minimum number of components. The output is set by the RC time constant of R4 and C1, and the total hysteresis of the loop is set by R1, R2 and R3. The maximum frequency of the oscillator is limited only by the large signal propagation delay of the comparator in addition to any capacitive loading at the output which degrades the slew rate. To analyze this circuit, assume that the output is initially high. For this to occur, the voltage at the inverting input must be less than the voltage at the non-inverting input. Therefore, capacitor C1 is discharged. The voltage at the non-inverting input (VH) is: EQUATION 4-5: R2 ( VDD ) V H = --------------------------------------------[ R2 + ( R1 || R3 ) ] where, if R1 = R2 = R3, then: EQUATION 4-6: 2 ( V DD ) V H = ------------------3 Capacitor C1 will charge up through R4. When the voltage at the comparator’s inverting input is equal to VH, the comparator output will switch. With the output at ground potential, the value at the non-inverting input terminal (VL) is reduced by the hysteresis network to a value given by: EQUATION 4-7: V DD V L = ---------3 Using the same resistors as before, capacitor C1 must now discharge through R4 toward ground. The output will return to a high state when the voltage across the capacitor has discharged to a value equal to VL. The period of oscillation will be twice the time it takes for the RC circuit to charge up to one half its final value. The period can be calculated from: EQUATION 4-8: 1 ----------------- = 2 ( 0.694 ) ( R4 ) ( C1 ) FREQ DS21656C-page 5 TC1025 FIGURE 4-1: The frequency stability of this circuit should only be a function of the external component tolerances. Figure 4-5 shows the circuit for a pulse width modulator circuit. It is essentially the same as in Figure 4-4, but with the addition of an input control voltage. When the input control voltage is equal to one-half VDD, operation is basically the same as described for the free-running oscillator. If the input control voltage is moved above or below one-half VDD, the duty cycle of the output square wave will be altered. This is because the addition of the control voltage at the input has now altered the trip points. The equations for these trip points are shown in Figure 4-5 (see VH and VL). Pulse width sensitivity to the input voltage variations can be increased by reducing the value of R6 from 10kΩ and conversely, sensitivity will be reduced by increasing the value of R6. The values of R1 and C1 can be varied to produce the desired center frequency. COMPARATOR EXTERNAL HYSTERESIS CONFIGURATION RC TC1025 VDD RA + VSRC VOUT – 1/2 RB VR FIGURE 4-2: 32.768 kHz “TIME OF DAY” CLOCK OSCILLATOR 32.768kHz VDD TC1025 VDD RA 150k 1/2 + VOUT _ RB 150k RC 1M CA 100pF FIGURE 4-3: Vper = 30.52µsec NON-RETRIGGERABLE MULTIVIBRATOR VDD R3 1M TC1025 R1 R4 1M A – IN 100k R2 100k t0 TC1025 C – CMPTR1 C1 100pF + B D1 GND IN R5 10M R6 562k R10 61.9k CMPTR2 VDD OUT OUT GND + R8 R9 243k R7 1M C VDD GND 10M D2 DS21656C-page 6 © 2005 Microchip Technology Inc. TC1025 FIGURE 4-4: SQUARE WAVE GENERATOR VDD TC1025 R1 100k R4 VDD 1/2 TC1025 – C1 VH = + R2 (VDD) R2 + (R1||R3) (VDD) (R2||R3) R1 + (R2||R3) 1 FREQ = 2(0.694)(R4)(C1) VL = R3 100k R2 100k FIGURE 4-5: PULSE WIDTH MODULATOR VDD VC R6 10k R1 100k TC1025 R4 VH = VDD (R1R2R6 + R2R3R6) + VC (R1R2R3) R1R2R6 + R1R3R6 + R2R3R6 + R1R2R3 VL = VDD (R2R3R6) + VC (R1R2R3) R1R2R6 + R1R3R6 + R2R3R6 + R1R2R3 1/2 TC1025 VDD – + C1 FREQ = 1 2 (0.694) (R4) (C1) For Square Wave Generation Select R1 = R2 = R3 R2 100k © 2005 Microchip Technology Inc. R3 100k VC = VDD 2 DS21656C-page 7 TC1025 5.0 TYPICAL CHARACTERISTICS The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Comparator Propagation Delay vs. Supply Voltage 7 TA = 25°C CL = 100pF DELAY TO FALLING EDGE (µsec) 6 Overdrive = 10mV 5 4 Overdrive = 50mV 3 2 6 Overdrive = 10mV 5 Overdrive = 100mV Overdrive = 50mV 4 3 2 2.5 3 3.5 4 4.5 5 1.5 5.5 6 VDD = 5V 5 VDD = 4V VDD = 2V 4 VDD = 3V 2 2.5 3 3.5 4 4.5 5 5.5 -40°C SUPPLY VOLTAGE (V) 2.5 7 2.5 2.0 VDD - VOUT (V) 6 VDD = 5V VDD = 4V VDD = 3V VDD = 2V TA = 25°C 2.0 VDD = 3V 1.5 VDD = 1.8V 1.0 4 85°C Comparator Output Swing vs. Output Sink Current TA = 25°C Overdrive = 100mV 25°C TEMPERATURE (°C) Comparator Output Swing vs. Output Source Current Comparator Propagation Delay vs. Temperature 5 Overdrive = 100mV 3 SUPPLY VOLTAGE (V) DELAY TO FALLING EDGE (µsec) 7 TA = 25°C CL = 100pF 2 1.5 VDD = 5.5V .5 1.5 VDD = 3V 1.0 VDD = 1.8V .5 VDD = 5.5V 3 -40°C 0 25°C 0 0 85°C 1 TEMPERATURE (°C) Comparator Output Short-Circuit Current vs. Supply Voltage 3 2 4 ISOURCE (mA) 5 6 0 1 2 3 4 5 6 ISINK (mA) Supply Current vs. Supply Voltage 10 60 TA = -40°C 50 SUPPLY CURRENT (µA) OUTPUT SHORT-CIRCUIT CURRENT (mA) Comparator Propagation Delay vs. Temperature VOUT - VSS (V) DELAY TO RISING EDGE (µsec) 7 Comparator Propagation Delay vs. Supply Voltage DELAY TO RISING EDGE (µsec) Note: TA = 25°C 40 TA = 85°C C 0° 30 TA 20 Sinking 10 Sourcing 0 0 = -4 TA = 25°C TA = 85°C 3 1 2 4 5 SUPPLY VOLTAGE (V) DS21656C-page 8 9 TA = 85°C 8 7 TA = 25°C TA = -40°C 6 5 4 6 0 1 3 2 4 5 SUPPLY VOLTAGE (V) 6 © 2005 Microchip Technology Inc. TC1025 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Package marking data not available at this time. 6.2 Taping Form Component Taping Orientation for 8-Pin MSOP Devices User Direction of Feed PIN 1 W P Standard Reel Component Orientation for TR Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package 8-Pin MSOP Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 2500 13 in Component Taping Orientation for 8-Pin SOIC (Narrow) Devices User Direction of Feed PIN 1 W P Standard Reel Component Orientation for TR Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package 8-Pin SOIC (N) © 2005 Microchip Technology Inc. Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 2500 13 in DS21656C-page 9 TC1025 6.3 Package Dimensions 8-Pin Plastic DIP PIN 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .070 (1.78) .040 (1.02) .310 (7.87) .290 (7.37) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .040 (1.02) .020 (0.51) .150 (3.81) .115 (2.92) .110 (2.79) .090 (2.29) .015 (0.38) .008 (0.20) 3° MIN. .400 (10.16) .310 (7.87) .022 (0.56) .015 (0.38) Dimensions: inches (mm) 8-Pin MSOP PIN 1 .122 (3.10) .114 (2.90) .197 (5.00) .189 (4.80) .026 (0.65) TYP. .122 (3.10) .114 (2.90) .043 (1.10) MAX. .016 (0.40) .010 (0.25) .006 (0.15) .002 (0.05) .008 (0.20) .005 (0.13) 6° MAX. .028 (0.70) .016 (0.40) Dimensions: inches (mm) DS21656C-page 10 © 2005 Microchip Technology Inc. TC1025 6.3 Package Dimensions (Continued) 8-Pin SOIC PIN 1 .157 (3.99) .150 (3.81) .244 (6.20) .228 (5.79) .050 (1.27) TYP. .197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) .010 (0.25) .007 (0.18) 8° MAX.. .050 (1.27) .016 (0.40) Dimensions: inches (mm) © 2005 Microchip Technology Inc. DS21656C-page 11 TC1025 NOTES: DS21656C-page 12 © 2005 Microchip Technology Inc. TC1025 Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. © 2005 Microchip Technology Inc. DS21656C-page13 TC1025 NOTES: DS21656C-page14 © 2005 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2005 Microchip Technology Inc. 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