MCP1603/B/L 2.0 MHz, 500 mA Synchronous Buck Regulator Features General Description • Over 90% Typical Efficiency • Output Current Up To 500 mA • Low PFM Quiescent Current = 45 µA, typical (MCP1603/L) • Low Shutdown Current = 0.1 µA, typical • Adjustable Output Voltage: - 0.8V to 4.5V • Fixed Output Voltage: - 1.2V, 1.5V, 1.8V, 2.5V, 3.3V (MCP1603/L) - 1.8V, 3.3V (MCP1603B) • 2.0 MHz Fixed-Frequency PWM (Heavy Load) • Automatic PWM-to-PFM Mode Transition (MCP1603/L) • PWM Mode Only Option (MCP1603B) • 100% Duty Cycle Operation • Internally Compensated • Undervoltage Lockout (UVLO) • Overtemperature Protection • Space Saving Packages: - 5-Lead TSOT, Two Pinout Types (MCP1603/L) - 8-Lead 2 x 3 DFN The MCP1603/B/L is a high-efficiency, fully-integrated 500 mA synchronous buck regulator whose 2.7V to 5.5V input voltage range makes it ideally suited for applications powered from 1-cell Li-Ion or 2-cell/3-cell NiMH/NiCd batteries. Applications • • • • • • • • Cellular Telephones Portable Computers Organizers / PDAs USB Powered Devices Digital Cameras Portable Equipment +5V or +3.3V Distributed Systems Headsets 2007-2012 Microchip Technology Inc. At heavy loads, the MCP1603/B/L operates in the 2.0 MHz fixed frequency pulse-width modulation (PWM) mode, which provides a low noise, low-output ripple, small-size solution. When the load is reduced to light levels, the MCP1603/L automatically changes operation to a Pulse Frequency Modulation (PFM) mode to minimize quiescent current draw from the battery. No intervention is necessary for a smooth transition from one mode to another. These two modes of operation allow the MCP1603/L to achieve the highest efficiency over the entire operating current range. The MCP1603B device disables the PFM mode switching, and operates only in normal PWM mode over the entire load range (without skipping). MCP1603B is for applications that cannot tolerate the low-frequency output ripple associated with PFM switching. The MCP1603/B/L family is available with either an adjustable or fixed-output voltage. The available fixed output voltage options for MCP1603/L are 1.2V, 1.5V, 1.8V, 2.5V and 3.3V, and for MCP1603B are 1.8 and 3.3V. When a fixed option is used, only three additional small external components are needed to form a complete solution. Couple this with the low profile, small-foot print packages and the entire system solution is achieved with minimal size. Additional protection features include: overtemperature and overcurrent protection. UVLO, DS22042B-page 1 MCP1603/B/L Package Types MCP1603L TSOT MCP1603/MCP1603B TSOT VIN 1 GND 2 SHDN 3 5 LX SHDN 1 GND 2 LX 3 MCP1603 2 x 3 DFN* 5 LX 1 VFB/VOUT NC 2 4 VFB/VOUT 4 SHDN 3 VFB/VOUT 4 VIN 8 GND EP 9 7 VIN 6 NC 5 NC * Includes Exposed Thermal Pad (EP); see Table 3-1. Typical Application Circuit L1 4.7 µH VIN 2.7V to 4.5V VIN CIN 4.7 µF VOUT 1.8V @ 500 mA LX COUT 4.7 µF SHDN VFB GND 100 Efficiency (%) 90 VIN = 2.7V VOUT = 1.8V 80 70 60 50 40 VIN = 3.6V 30 VIN = 4.5V __ PFM/PWM (MCP1603/L) --- PWM (MCP1603B) 20 10 0.1 1 10 100 1000 Output Current (mA) DS22042B-page 2 2007-2012 Microchip Technology Inc. MCP1603/B/L Functional Block Diagram VIN Band Gap UVLO Thermal Shutdown UVLO VREF Soft Start SHDN ILIMPWM TSD IPK Limit IPEAKPWM ILIMPFM IPEAKPFM Slope Comp. + OSC -ILPK + S R Q POFF Q Switch Drive Logic and Timing NOFF LX PWM/PFM - PWM ONLY PWM-ONLY PFM Error Amp PWM/PFM Logic GND IPEAKPFM IPEAKPWM VREF PWM Error Amp -ILPK EA -IPK Limit VREF OV Threshold Disable Switcher VFB / VOUT UVLO TSD UV Threshold 2007-2012 Microchip Technology Inc. DS22042B-page 3 MCP1603/B/L NOTES: DS22042B-page 4 2007-2012 Microchip Technology Inc. MCP1603/B/L 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † VIN - GND.......................................................................+6.0V All Other I/O ............................... (GND - 0.3V) to (VIN + 0.3V) LX to GND .............................................. -0.3V to (VIN + 0.3V) Output Short Circuit Current ................................. Continuous Power Dissipation (Note 5) .......................... Internally Limited Storage Temperature ....................................-65°C to +150°C Ambient Temp. with Power Applied ................-40°C to +85°C Operating Junction Temperature...................-40°C to +125°C ESD Protection On All Pins: HBM ............................................................................. 4 kV MM ..............................................................................300V † Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Characteristics: Unless otherwise indicated, MCP1603/L, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH, VOUT(ADJ) = 1.8V, IOUT = 100 mA, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C. Parameters Sym Min Typ Max Units Conditions VIN 2.7 — 5.5 V Note 1 IOUT 500 — — mA Note 1 IIN_SHDN — 0.1 1 µA SHDN = GND Quiescent Current - PFM IQ — 45 60 µA SHDN = VIN, IOUT = 0 mA, device switching Quiescent Current - PWM IQ 1.0 2.7 4 mA SHDN = VIN, IOUT = 0 mA, device switching (MCP1603B) — 15 %VIN VIN = 2.7V to 5.5V %VIN VIN = 2.7V to 5.5V Input Characteristics Input Voltage Maximum Output Current Shutdown Current Shutdown/UVLO/Thermal Shutdown Characteristics SHDN, Logic Input Voltage Low SHDN, Logic Input Voltage High SHDN, Input Leakage Current Undervoltage Lockout Undervoltage Lockout Hysteresis Thermal Shutdown Thermal Shutdown Hysteresis Note 1: 2: 3: 4: 5: 6: VIL — VIH 45 — — IL_SHDN -1.0 ±0.1 1.0 µA VIN = 2.7V to 5.5V UVLO 2.12 2.28 2.43 V VIN Falling UVLOHYS — 140 — mV TSHD — 150 — °C Note 4, Note 5 TSHD-HYS — 10 — °C Note 4, Note 5 The input voltage should be greater then the output voltage plus headroom voltage; higher load currents increase the input voltage required for regulation. MCP1603B device requires a minimum load for regulation. See Section 2.0, Typical Performance Curves for typical operating voltage ranges. Reference Feedback Voltage Tolerance applies to adjustable output voltage setting. VR is the output voltage setting. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable temperature and the thermal resistance from junction to air (i.e. TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. The internal MOSFET switches have an integral diode from the LX pin to the VIN pin, and from the LX pin to the GND pin. In cases where these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not able to limit the junction temperature for these cases. The current limit threshold is a cycle-by-cycle peak current limit. 2007-2012 Microchip Technology Inc. DS22042B-page 5 MCP1603/B/L DC CHARACTERISTICS (CONTINUED) Electrical Characteristics: Unless otherwise indicated, MCP1603/L, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH, VOUT(ADJ) = 1.8V, IOUT = 100 mA, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C. Parameters Sym Min Typ Max Units Conditions VOUT 0.8 — 4.5 V — 0.8 — V -3.0 — +3.0 % TA = -40°C to +25°C TA = +25°C to +85°C Output Characteristics Adjustable Output Voltage Range Reference Feedback Voltage VFB Reference Feedback Voltage Tolerance Note 2 -2.5 — +2.5 % Feedback Input Bias Current IVFB — 0.1 — nA Output Voltage Tolerance Fixed VOUT -3.0% VR +3.0% % TA = -40°C to +25°C, Note 3 VOUT -2.5 VR +2.5 % TA = +25°C to +85°C, Note 3 Line Regulation VLINE-REG — 0.3 — %/V Load Regulation VLOAD-REG — 0.35 — % FOSC 1.5 2.0 2.8 MHz Internal Oscillator Frequency VIN = VR + 1V to 5.5V, IOUT = 100 mA VIN = VR +1.5V, ILOAD = 100 mA to 500 mA TSS — 0.6 — ms TR = 10% to 90% RDSon P-Channel RDSon-P — 500 — m IP = 100 mA RDSon N-Channel RDSon-N — 500 — m IN = 100 mA ILX -1.0 ±0.1 1.0 µA SHDN = 0V, VIN = 5.5V, LX = 0V, LX = 5.5V +ILX(MAX) — 860 — mA Note 6 Start Up Time LX Pin Leakage Current Positive Current Limit Threshold Note 1: 2: 3: 4: 5: 6: The input voltage should be greater then the output voltage plus headroom voltage; higher load currents increase the input voltage required for regulation. MCP1603B device requires a minimum load for regulation. See Section 2.0, Typical Performance Curves for typical operating voltage ranges. Reference Feedback Voltage Tolerance applies to adjustable output voltage setting. VR is the output voltage setting. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable temperature and the thermal resistance from junction to air (i.e. TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. The internal MOSFET switches have an integral diode from the LX pin to the VIN pin, and from the LX pin to the GND pin. In cases where these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not able to limit the junction temperature for these cases. The current limit threshold is a cycle-by-cycle peak current limit. TEMPERATURE SPECIFICATIONS Electrical Specifications: Unless otherwise indicated, all limits are specified for: VIN + 2.7V to 5.5V Parameters Sym Min Typ Max Units Conditions Operating Junction Temperature Range TJ -40 — +125 °C Storage Temperature Range TA -65 — +150 °C Maximum Junction Temperature TJ — — +150 °C Thermal Resistance, 5L-TSOT JA — 207.4 — °C/W Typical 4-layer Board with Internal Ground Plane Thermal Resistance, 8L-2x3 DFN JA — 68 — °C/W Typical 4-layer Board with Internal Ground Plane and 2-Vias in Thermal Pad Temperature Ranges Steady State Transient Package Thermal Resistances DS22042B-page 6 2007-2012 Microchip Technology Inc. MCP1603/B/L 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 50 49 48 47 46 45 44 43 42 41 40 52 VOUT = 1.8V VIN = 3.6V VIN = 4.2V VIN = 3.0V 3 0V Quiiescent Current (µA) Quie escent Current (µA) Note: Unless otherwise indicated, MCP1603/L, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH, VOUT(ADJ) = 1.8V, ILOAD = 100 mA, TA = +25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics. 48 46 5 44 42 TA = -40oC 2.7 20 35 50 65 80 95 110 125 Ambient Temperature 3.4 Quies scent Current (mA) VIN = 3.0V 3.1 3 VIN = 4.2V 2.8 2.7 3.75 4.1 4.45 4.8 5.15 5.5 Input Voltage (V) VOUT = 1.8V 2.9 3.4 FIGURE 2-4: (MCP1603/L). 3.3 3.2 3.05 (oC) FIGURE 2-1: PFM IQ vs. Ambient Temperature (MCP1603/L). Quies scent Current (mA) TA = +25oC 40 -40 -25 -10 VIN = 3.6V 2.6 2.5 PFM IQ vs. Input Voltage VOUT = 1.8V TA = +90oC 3.2 TA = +25oC 3 2.8 2.6 2.4 TA = -40oC 2.2 2 2.4 -40 -25 -10 5 20 35 50 65 Ambient Temperature (oC) 2.7 3.05 3.4 3.75 4.1 4.45 4.8 5.15 5.5 80 Input Voltage (V) FIGURE 2-2: PWM IQ vs. Ambient Temperature (MCP1603B). PWM IQ vs. Input Voltage FIGURE 2-5: (MCP1603B). 100 100 90 VOUT = 1.2V 95 80 IOUT = 100 mA 90 85 80 IOUT = 300 mA 75 IOUT = 500 mA 70 Efficiency (%) E Efficiency (%) TA = +90oC 50 70 60 50 40 65 60 10 3.05 3.4 3.75 4.1 4.45 4.8 5.15 5.5 Input Voltage (V) FIGURE 2-3: (VOUT = 1.2V). Efficiency vs. Input Voltage 2007-2012 Microchip Technology Inc. VOUT = 1.2V 30 20 2.7 VIN = 3.6V VIN = 2.7V VIN = 4.2V PFM/PWM PWM Only 0 0.1 FIGURE 2-6: (VOUT = 1.2V). 1 10 100 Output Current (mA) 1000 Efficiency vs. Output Load DS22042B-page 7 MCP1603/B/L Note: Unless otherwise indicated, MCP1603/L, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH, VOUT(ADJ) = 1.8V, ILOAD = 100 mA, TA = +25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics. 0.6 100 Efficiency (%) 95 IOUT = 100 mA 90 85 IOUT = 300 mA IOUT = 500 mA 80 75 VOUT = 1.8V Lin ne Regualtion (%/V) VOUT = 1.8V 0.5 IOUT = 300 mA 0.4 0.3 IOUT = 100 mA 0.2 02 0.1 70 2.7 3.05 3.4 3.75 4.1 4.45 4.8 5.15 -40 -25 -10 5.5 Efficiency vs. Input Voltage FIGURE 2-10: Line Regulation vs. Ambient Temperature (VOUT = 1.8V). 100 Output O Voltage (V) 70 60 50 VIN = 4.2V 40 30 VOUT = 1.8V 1 8V 20 PFM/PWM PWM Only 10 TA = +90oC 1.80 1.79 1.78 TA = +25oC TA = -40oC 1.77 1.76 1.75 1.74 0 1 FIGURE 2-8: (VOUT = 1.8V). 10 100 Output Current (mA) VOUT = 2.4V IOUT = 100 mA 95 90 IOUT = 300 mA IOUT = 500 mA 85 80 75 3 3.5 4 4.5 5 5.5 Input Voltage (V) FIGURE 2-9: (VOUT = 2.4V). DS22042B-page 8 150 200 250 300 350 400 450 500 Output Current (mA) Efficiency vs. Output Load 100 100 1000 Efficiency vs. Input Voltage FIGURE 2-11: Output Voltage vs. Load Current (VOUT = 1.8V). 100 90 80 70 60 50 40 30 20 10 0 VIN = 2.7V VIN = 3.6V Efficiency (%) E 0.1 Efficiency (%) TA = +125oC 1.81 VIN = 3.6V 80 Efficiency (%) E 1.82 VIN = 2.7V 90 20 35 50 65 80 95 110 125 Ambient Temperature (oC) Input Voltage (V) FIGURE 2-7: (VOUT = 1.8V). 5 VIN = 4.2V VOUT = 2.4V 2 4V PFM/PWM PWM Only 0.1 1 10 100 Output Current (mA) 1000 FIGURE 2-12: PFM/PWM Efficiency vs. Output Load (VOUT = 2.4V). 2007-2012 Microchip Technology Inc. MCP1603/B/L 100.0 VOUT = 3.3V 97.5 Efficiency (%) IOUT = 100 mA IOUT = 300 mA 95.0 92.5 90.0 IOUT = 500 mA 87.5 85.0 3.5 3.75 4 4.25 4.5 4.75 5 Switch hing Frequency (MHz) Note: Unless otherwise indicated, MCP1603/L, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH, VOUT(ADJ) = 1.8V, ILOAD = 100 mA, TA = +25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics. 2.20 2.15 2.10 2.05 2.00 1.95 5.25 5.5 -40 -25 -10 5 20 35 50 65 80 95 110 125 Ambient Temperature (oC) Input Voltage (V) FIGURE 2-13: (VOUT = 3.3V). Efficiency vs. Input Voltage FIGURE 2-16: Switching Frequency vs. Ambient Temperature. 90 VIN = 3.6V 80 Efficiency (%) E 70 60 50 VIN = 4.2V 40 30 VOUT = 3.3V 20 PFM/PWM PWM Only 10 Switch hing Frequency (MHz) 100 2.20 2.15 2.10 2.05 2 00 2.00 1.95 2.7 0 0.1 1 FIGURE 2-14: (VOUT = 3.3V). 10 100 Output Current (mA) 3.4 Efficiency vs. Output Load 3.75 4.1 4.45 4.8 5.15 5.5 Input Voltage (V) FIGURE 2-17: Input Voltage. 10 Switching Frequency vs. 0.65 8 Regulation 7 6 TA= +25oC 5 4 TA= -40oC TA= +85oC 3 2 No Regulation 1 Swittch Resistance () 9 Lo oad Current (mA) 3.05 1000 0.60 0.55 0.50 N-Channel P-Channel 0.45 0.40 0.35 0 2.7 1.8 2 2.2 2.4 2.6 2.8 3 VIN - VOUT (V) 3.2 FIGURE 2-15: PWM-Only Device Minimum Load for Regulation (MCP1603B). 2007-2012 Microchip Technology Inc. 3.05 3.4 3.6 3.4 3.75 4.1 4.45 4.8 5.15 5.5 Input Voltage (V) FIGURE 2-18: Voltage. Switch Resistance vs. Input DS22042B-page 9 MCP1603/B/L Note: Unless otherwise indicated, MCP1603/L, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH, VOUT(ADJ) = 1.8V, ILOAD = 100 mA, TA = +25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics. Swittch Resistance () 0.9 0.8 N-Channel 0.7 0.6 0.5 0.4 P-Channel 0.3 -40 -25 -10 5 20 35 50 65 80 95 110 125 Ambient Temperature (oC) FIGURE 2-19: Switch Resistance vs. Ambient Temperature. FIGURE 2-22: PFM Light Load Switching Waveforms (MCP1603/L). FIGURE 2-20: Waveform. Output Voltage Startup FIGURE 2-23: Output Voltage Load Step Response vs. Time. FIGURE 2-21: Waveform. Heavy Load Switching FIGURE 2-24: Output Voltage Line Step Response vs. Time. DS22042B-page 10 2007-2012 Microchip Technology Inc. MCP1603/B/L Note: Unless otherwise indicated, MCP1603/L, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH, VOUT(ADJ) = 1.8V, ILOAD = 100 mA, TA = +25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics. VLx = 2 V/div VOUT = 50 mV/div, AC IOUT = 5 mA IL = 20 mA/div 0.4 µs/div FIGURE 2-25: PWM Light Load Switching Waveforms (MCP1603B). 2007-2012 Microchip Technology Inc. DS22042B-page 11 MCP1603/B/L NOTES: DS22042B-page 12 2007-2012 Microchip Technology Inc. MCP1603/B/L 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE MCP1603/B TSOT-23 MCP1603L TSOT-23 MCP1603 2 x 3 DFN 1 4 7 VIN 2 2 8 GND 3 1 3 SHDN 4 5 4 VFB/VOUT 5 3 1 LX Switch Node, Buck Inductor Connection Pin 3.1 Symbol Shutdown Control Input Pin Feedback / Output Voltage Pin — 2, 5, 6 NC No Connect — — Exposed Pad EP For the DFN package, the center exposed pad is a thermal path to remove heat from the device. Electrically, this pad is at ground potential and should be connected to GND. Power Supply Input Voltage Pin (VIN) Ground Pin (GND) Ground pin for the device. The loop area of the ground traces should be kept as minimal as possible. 3.3 Power Supply Input Voltage Pin Ground Pin — Connect the input voltage source to VIN. The input source must be decoupled to GND with a 4.7 µF capacitor. 3.2 Description Shutdown Control Input Pin (SHDN) The SHDN pin is a logic-level input used to enable or disable the device. A logic high (>45% of VIN) will enable the regulator output. A logic low (<15% of VIN) will ensure that the regulator is disabled. 2007-2012 Microchip Technology Inc. 3.4 Feedback / Output Voltage Pin (VFB/VOUT) For adjustable output options, connect the center of the output voltage divider to the VFB/VOUT pin. For fixedoutput voltage options, connect the output directly to the VFB/VOUT pin. 3.5 Switch Node, Buck Inductor Connection Pin (LX) Connect the LX pin directly to the buck inductor. This pin carries large signal-level current; all connections should be made as short as possible. 3.6 Exposed Metal Pad (EP) For the DFN package, connect the Exposed Pad to GND, with vias into the GND plane. This connection to the GND plane will aid in heat removal from the package. DS22042B-page 13 MCP1603/B/L NOTES: DS22042B-page 14 2007-2012 Microchip Technology Inc. MCP1603/B/L 4.0 DETAILED DESCRIPTION 4.1 Device Overview The MCP1603/L is a synchronous buck regulator that operates in a Pulse Frequency Modulation (PFM) mode or a Pulse Width Modulation (PWM) mode to maximize system efficiency over the entire operating current range. Capable of operating from a 2.7V to 5.5V input voltage source, the MCP1603 can deliver 500 mA of continuous output current. The MCP1603B device disables the PFM mode switching, and operates only in normal PWM mode. When using the MCP1603/B/L, the PCB area required for a complete step-down converter is minimized, since both the main P-Channel MOSFET and the synchronous N-Channel MOSFET are integrated. Also while in PWM mode, the device switches at a constant frequency of 2.0 MHz (typical), which allows for small filtering components. Both fixed and adjustable output voltage options are available. The fixed voltage options (1.2V, 1.5V 1.8V, 2.5V, 3.3V) do not require an external voltage divider, which further reduces the required circuit board footprint. The adjustable output voltage options allow for more flexibility in the design, but require an external voltage divider. Additionally, the device features an undervoltage lockout (UVLO), overtemperature shutdown, overcurrent protection and enable/disable control. 4.2 Synchronous Buck Regulator The MCP1603/L has two distinct modes of operation that allow the device to maintain a high level of efficiency throughout the entire operating current and voltage range. The device automatically switches between PWM mode and PFM mode, depending on the output load requirements. MCP1603B switches in PWM mode only. 4.2.1 PFM/PWM MODE DEVICE OPTION (MCP1603/L) During heavy load conditions, the MCP1603/L operates at a high, fixed switching frequency of 2.0 MHz (typical) using current mode control. This minimizes output ripple (10 – 15 mV, typically) and noise, while maintaining high efficiency (88% typical with VIN = 3.6V, VOUT = 1.8V, IOUT = 300 mA). 2007-2012 Microchip Technology Inc. During normal PWM operation, the beginning of a switching cycle occurs when the internal P-Channel MOSFET is turned on. The ramping inductor current is sensed and tied to one input of the internal high-speed comparator. The other input to the high-speed comparator is the error amplifier output. This is the difference between the internal 0.8V reference and the divided-down output voltage. When the sensed current becomes equal to the amplified error signal, the highspeed comparator switches states and the P-Channel MOSFET is turned off. The N-Channel MOSFET is turned on until the internal oscillator sets an internal RS latch, initiating the beginning of another switching cycle. PFM-to-PWM mode transition is initiated for any of the following conditions: • Continuous device switching • Output voltage has dropped out of regulation 22.214.171.124 Light Load, PFM Mode During light-load conditions, the MCP1603/L operates in a PFM mode. When the MCP1603/L enters this mode, it begins to skip pulses to minimize unnecessary quiescent-current draw by reducing the number of switching cycles per second. The typical quiescent current draw for this device is 45 µA. PWM-to-PFM mode transition is initiated for any of the following conditions: • Discontinuous inductor current is sensed for a set duration • Inductor peak current falls below the transition threshold limit 4.2.2 PWM MODE DEVICE OPTION (MCP1603B) There are applications that cannot tolerate the low frequency pulse skipping mode or the output ripple voltage associated with it, which is distinctive for PFM switching. The MCP1603B device has disabled the PFM mode switching. It operates only in normal PWM mode over the entire load range (without skipping pulses). During periods of light load operation, the MCP1603B continues to operate at a constant 2 MHz switching frequency, keeping the output ripple voltage lower than PFM mode. Because there are no skipping pulses, a minimum load current is necessary to keep output in regulation (see Figure 2-15, without a minimum load, the output voltage will be greater than the set point). The minimum load value depends on the input-tooutput ratio. DS22042B-page 15 MCP1603/B/L 4.3 Soft Start The output of the MCP1603 is controlled during startup. This control allows for a very minimal amount of VOUT overshoot during start-up from VIN rising above the UVLO voltage or SHDN being enabled. 4.4 Enable/Disable Control The SHDN pin is used to enable or disable the MCP1603/B/L. When the SHDN pin is pulled low, the device is disabled. When pulled high, the device is enabled and begins operation, unless the input voltage is below the UVLO threshold or a fault condition exists. Overtemperature Protection Overtemperature protection circuitry is integrated in the MCP1603/B/L device family. This circuitry monitors the device junction temperature and shuts the device off, if the junction temperature exceeds the typical +150°C threshold. If this threshold is exceeded, the device will automatically restart once the junction temperature drops by approximately 10°C. The soft start is reset during an overtemperture condition. 4.5 4.6 Overcurrent Protection Cycle-by-cycle current limiting is used to protect the MCP1603/B/L device family from being damaged when an external short circuit is applied. The typical peak current limit is 860 mA. If the sensed current reaches the 860 mA limit, the P-Channel MOSFET is turned off, even if the output voltage is not in regulation. The device will attempt to start a new switching cycle when the internal oscillator sets the internal RS latch. DS22042B-page 16 4.7 Undervoltage Lockout (UVLO) The UVLO feature uses a comparator to sense the input voltage (VIN) level. If the input voltage is lower than the voltage necessary to properly operate the MCP1603, the UVLO feature will hold the converter off. When VIN rises above the necessary input voltage, the UVLO is released and soft start begins. Hysteresis is built into the UVLO circuit to compensate for input impedance. For example, if there is any resistance between the input voltage source and the device when it is operating, there will be a voltage drop at the input to the device equal to IIN x RIN. The typical hysteresis is 140 mV. 2007-2012 Microchip Technology Inc. MCP1603/B/L 5.0 APPLICATION INFORMATION 5.1 Typical Applications The MCP1603/B/L 500 mA synchronous buck regulator operates over a wide input voltage range (2.7V to 5.5V) and is ideal for single-cell Li-Ion batterypowered applications, USB-powered applications, three cell NiMH or NiCd applications and 3V or 5V regulated input applications. The 5-lead TSOT and 8lead 2 x 3 DFN packages provide a small footprint with minimal external components. 5.2 Fixed Output Voltage Applications The Typical Application Circuit shows a fixed MCP1603/B/L in an application used to convert three NiMH batteries into a well-regulated 1.8V @ 500 mA output. A 4.7 µF input capacitor, 4.7 µF output capacitor, and a 4.7 µH inductor make up the entire external component solution for this application. No external voltage divider or compensation is necessary. In addition to the fixed 1.8V option, the MCP1603 is also available in 1.2V, 1.5V, 2.5V, or 3.3V fixed voltage options. 5.3 Adjustable Output Voltage Applications When the desired output for a particular application is not covered by the fixed-voltage options, an adjustable MCP1603/B/L can be used. The circuit listed in Figure 6-2 shows an adjustable device being used to convert a 5V rail to 1.0V @ 500 mA. The output voltage is adjustable by using two external resistors as a voltage divider. For adjustable-output voltages, it is recommended that the top resistor divider value be 200 k. The bottom resistor value can be calculated using the following equation: EQUATION 5-1: V FB R BOT = R TOP ----------------------------- V OUT – V FB Example: RTOP = 200 k VOUT = 1.0V VFB = 0.8V RBOT = 200 k x (0.8V/(1.0V – 0.8V)) RBOT = 800 k(Standard Value = 787 k) For adjustable output applications, an additional R-C compensation network is necessary for control loop stability. Recommended values for any output voltage are: RCOMP = 4.99 k CCOMP = 33 pF Refer to Figure 6-2 for proper placement of RCOMP and CCOMP. 5.4 Input Capacitor Selection The input current to a buck converter, when operating in Continuous Conduction mode, is a squarewave with a duty cycle defined by the output voltage (VOUT) to input voltage (VIN) relationship of VOUT/VIN. To prevent undesirable input voltage transients, the input capacitor should be a low-ESR type with an RMS current rating given by Equation 5.5. Because of their small size and low ESR, ceramic capacitors are often used. Ceramic material X5R or X7R are well suited, since they have a low-temperature coefficient and acceptable ESR. EQUATION 5-2: V OUT V IN – V OUT ICIN ,RMS = I OUT ,MAX ------------------------------------------------------ V IN Table 5-1 contains the recommend range for the input capacitor value. 5.5 Output Capacitor Selection The output capacitor helps provide a stable output voltage during sudden load transients, smooths the current that flows from the inductor to the load, and reduces the output voltage ripple. Therefore, low-ESR capacitors are a desirable choice for the output capacitor. As with the input capacitor, X5R and X7R ceramic capacitors are well suited for this application. The output ripple voltage is often a design specification. A buck converters’ output ripple voltage is a function of the charging and discharging of the output capacitor and the ESR of the capacitor. This ripple voltage can be calculated by Equation 5-3. EQUATION 5-3: IL V OUT = I L ESR + --------------------8fC Table 5-1 contains the recommend range for the output capacitor value. TABLE 5-1: 2007-2012 Microchip Technology Inc. CAPACITOR VALUE RANGE CIN COUT Minimum 4.7 µF 4.7 µF Maximum — 22 µF DS22042B-page 17 MCP1603/B/L 5.6 TABLE 5-2: Inductor Selection When using the MCP1603, the inductance value can range from 3.3 µH to 10 µH. An inductance value of 4.7 µH is recommended to achieve a good balance between converter load transient response and minimized noise. The value of inductance is selected to achieve a desired amount of ripple current. It is reasonable to assume a ripple current that is 20% of the maximum load current. The larger the amount of ripple current allowed, the larger the output capacitor value becomes to meet ripple voltage specifications. The inductor ripple current can be calculated according to the following equation. EQUATION 5-4: V OUT V OUT I L = ------------------ 1 – ------------- F SW L V IN Where: FSW = Switching Frequency When considering inductor ratings, the maximum DC current rating of the inductor should be at least equal to the maximum load current, plus one half the peak-topeak inductor ripple current (1/2 x IL). The inductor DC resistance adds to the total converter power loss. An inductor with a low DC resistance allows for higher converter efficiency. TABLE 5-2: MCP1603 RECOMMENDED INDUCTORS Value (µH) DCR (max) ISAT (A) Size WxLxH (mm) SD3110 3.3 0.195 0.81 3.1x3.1x1.0 SD3110 4.7 0.285 0.68 3.1x3.1x1.0 SD3110 6.8 0.346 0.58 3.1x3.1x1.0 SD3812 3.3 0.159 1.40 3.8x3.8x1.2 SD3812 4.7 0.256 1.13 3.8x3.8x1.2 SD3812 6.8 0.299 0.95 3.8x3.8x1.2 Part Number Coiltronics® Würth Elektronik® WE-TPC Type XS 3.3 0.225 0.72 3.3x3.5x0.95 WE-TPC Type XS 4.7 0.290 0.50 3.3x3.5x0.95 WE-TPC Type S 4.7 0.105 0.90 3.8x3.8x1.65 WE-TPC Type S 6.8 0.156 0.75 3.8x3.8x1.65 WE-TPC Type Tiny 4.7 0.100 1.7 2.8x2.8x2.8 DS22042B-page 18 MCP1603 RECOMMENDED INDUCTORS (CONTINUED) Value (µH) DCR (max) ISAT (A) Size WxLxH (mm) CMD4D06 3.3 0.174 0.77 3.5x4.3x0.8 CMD4D06 4.7 0.216 0.75 3.5x4.3x0.8 CMD4D06 6.8 0.296 0.62 3.5x4.3x0.8 XFL3012332ME_ 3.3 0.106 1.2 3x3x1.2 XFL3012472ME_ 4.7 0.143 1.0 3x3x1.2 LPS4018103ML_ 10 0.200 1.2 4x4x1.8 B82462_ G4472M 4.7 0.04 1.8 6x6x3 VLS3015E T-4R7M 4.7 0.113 1.1 3x3x1.5 Part Number Sumida® Coilcraft ® TDK-EPC® 5.7 Thermal Calculations The MCP1603 is available in two different packages (TSOT-23 and 2x3 DFN). The junction temperature is estimated by calculating the power dissipation and applying the package thermal resistance (JA). The maximum continuous junction temperature rating for the MCP1603 is +125°C. To quickly estimate the internal power dissipation for the switching buck regulator, an empirical calculation using measured efficiency can be used. Given the measured efficiency, the internal power dissipation is estimated by the following equation: EQUATION 5-5: VOUT IOUT ------------------------------------ – V OUT IOUT = P Diss Efficiency The difference between the first term, input power dissipation, and the second term, power delivered, is the internal power dissipation. This is an estimate assuming that most of the power lost is internal to the MCP1603. There is some percentage of power lost in the buck inductor, with very little loss in the input and output capacitors. 2007-2012 Microchip Technology Inc. MCP1603/B/L 5.8 PCB Layout Information Good printed circuit board layout techniques are important to any switching circuitry, and switching power supplies are no different. When wiring the highcurrent paths, short and wide traces should be used. This high-current path is shown with red connections in Figure 5-1. The current in this path is switching. Therefore, it is important that the components along the high-current path should be placed as close as possible to the MCP1603 to minimize the loop area. The feedback resistors and feedback signal should be routed away from the switching node and this switching current loop. When possible, ground planes and traces should be used to help shield the feedback signal and minimize noise and magnetic interference. L1 VOUT 4.7 µH 1.8V @ 500 mA VIN 2.7V to 4.5V VIN CIN 4.7 µF LX SHDN VFB COUT 4.7 µF GND FIGURE 5-1: PCB High Current Path. 2007-2012 Microchip Technology Inc. DS22042B-page 19 MCP1603/B/L NOTES: DS22042B-page 20 2007-2012 Microchip Technology Inc. MCP1603/B/L 6.0 TYPICAL APPLICATION CIRCUITS l L1 4.7 µH VIN 3.0V to 4.2V VIN CIN 4.7 µF VOUT 1.5V @ 500 mA LX COUT 4.7 µF VFB SHDN GND FIGURE 6-1: Single Li-Ion to 1.5V @ 500 mA Application. L1 4.7 µH VIN 5.0V VIN LX RTOP CIN 4.7 µF SHDN 200 k VFB CCOMP 33 pF COUT 4.7 µF RBOT 787 k GND FIGURE 6-2: RCOMP 4.99 k VOUT 1.0V @ 500 mA 5V to 1.0V @ 500 mA Application. L1 4.7 µH VIN 2.7V to 4.5V VIN CIN 4.7 µF VOUT 1.2V @ 500 mA LX SHDN VFB COUT 4.7 µF GND FIGURE 6-3: Three NiMH Batteries to 1.2V @ 500 mA Application. 2007-2012 Microchip Technology Inc. DS22042B-page 21 MCP1603/B/L NOTES: DS22042B-page 22 2007-2012 Microchip Technology Inc. MCP1603/B/L 7.0 PACKAGING INFORMATION 7.1 Package Marking Information 5-Lead TSOT-23 Part Number MCP1603T-120I/OS MCP1603T-150I/OS MCP1603T-180I/OS MCP1603T-250I/OS MCP1603T-330I/OS MCP1603T-ADJI/OS MCP1603BT-180I/OS MCP1603BT-330I/OS MCP1603BT-ADJI/OS MCP1603LT-120I/OS MCP1603LT-150I/OS MCP1603LT-180I/OS MCP1603LT-250I/OS MCP1603LT-330I/OS MCP1603LT-ADJI/OS 8-Lead 2x3 DFN Legend: XX...X Y YY WW NNN e3 * Note: Code ETNN EUNN EVNN EWNN EXNN EYNN GBNN GENN GANN FMNN FKNN EJNN FGNN FANN FQNN Part Number Code MCP1603-120I/MC MCP1603T-120I/MC MCP1603-150I/MC MCP1603T-150I/MC MCP1603-180I/MC MCP1603T-180I/MC MCP1603-250I/MC MCP1603T-250I/MC MCP1603-330I/MC MCP1603T-330I/MC MCP1603-ADJI/MC MCP1603T-ADJI/MC AFM AFM AFK AFK AFJ AFJ AFG AFG AFA AFA AFQ AFQ Example: ET25 Example: AFM 235 25 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2007-2012 Microchip Technology Inc. DS22042B-page 23 MCP1603/B/L )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ b N E E1 NOTE 1 1 3 2 e e1 D α A A2 c φ L A1 β 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI/HDGV L1 0,//,0(7(56 0,1 120 0$; 1 /HDG3LWFK H %6& 2XWVLGH/HDG3LWFK H 2YHUDOO+HLJKW $ ± ± 0ROGHG3DFNDJH7KLFNQHVV $ 6WDQGRII $ ± 2YHUDOO:LGWK ( 0ROGHG3DFNDJH:LGWK ( %6& 2YHUDOO/HQJWK ' %6& %6& %6& )RRW/HQJWK / )RRWSULQW / )RRW$QJOH /HDG7KLFNQHVV F ± /HDG:LGWK E ± 0ROG'UDIW$QJOH7RS 0ROG'UDIW$QJOH%RWWRP 5() 3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKLQWKHKDWFKHGDUHD 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 5() 5HIHUHQFH'LPHQVLRQXVXDOO\ZLWKRXWWROHUDQFHIRULQIRUPDWLRQSXUSRVHVRQO\ 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% DS22042B-page 24 2007-2012 Microchip Technology Inc. MCP1603/B/L Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2007-2012 Microchip Technology Inc. DS22042B-page 25 MCP1603/B/L !"# $%&'*+,/,:;<=>!" )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ e D b N N L K E2 E EXPOSED PAD NOTE 1 NOTE 1 2 1 2 1 D2 BOTTOM VIEW TOP VIEW A A3 A1 NOTE 2 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV 0,//,0(7(56 0,1 1 120 0$; 3LWFK H 2YHUDOO+HLJKW $ 6WDQGRII $ &RQWDFW7KLFNQHVV $ 5() 2YHUDOO/HQJWK ' %6& 2YHUDOO:LGWK ( ([SRVHG3DG/HQJWK ' ± ([SRVHG3DG:LGWK ( ± E &RQWDFW/HQJWK / &RQWDFWWR([SRVHG3DG . ± ± &RQWDFW:LGWK %6& %6& 3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKLQWKHKDWFKHGDUHD 3DFNDJHPD\KDYHRQHRUPRUHH[SRVHGWLHEDUVDWHQGV 3DFNDJHLVVDZVLQJXODWHG 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 5() 5HIHUHQFH'LPHQVLRQXVXDOO\ZLWKRXWWROHUDQFHIRULQIRUPDWLRQSXUSRVHVRQO\ 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ && DS22042B-page 26 2007-2012 Microchip Technology Inc. MCP1603/B/L Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2007-2012 Microchip Technology Inc. DS22042B-page 27 MCP1603/B/L NOTES: DS22042B-page 28 2007-2012 Microchip Technology Inc. MCP1603/B/L APPENDIX A: REVISION HISTORY Revision B (October 2012) The following is the list of modifications: 1. 2. 3. 4. 5. 6. 7. Added new device option (MCP1603B) with PWM mode only. Added details on this device throughout the document. Updated Typical Application Circuit graphic to show both available options for the MCP1603/B/L family. Added new graphics to Section 2.0, Typical Performance Curves: Figures 2-2, 2-5, 2-15 and 2-25. Updated Figures 2-6, 2-8, 2-12 and 2-14. Restructured Section 4.2, Synchronous Buck Regulator to show both PFM/PWM and PWMonly modes. Updated Table 5-2. Updated Section 7.1, Package Marking Information with available marking codes and package specification drawings. Updated the Product Identification System section. Revision A (May 2007) • Original Release of this Document. 2007-2012 Microchip Technology Inc. DS22042B-page 29 MCP1603/B/L NOTES: DS22042B-page 30 2007-2012 Microchip Technology Inc. MCP1603/B/L PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Examples: PART NO. -XXX X /XX Device Voltage Temperature Package Option Device: 2.0 MHz, 500 mA Buck Regulator with PFM/PWM Mode MCP1603B: 2.0 MHz, 500 mA Buck Regulator with PWM-only MCP1603L: 2.0 MHz, 500 mA Buck Regulator with PFM/PWM Mode and Alternate Pinout a) MCP1603-180I/MC: b) MCP1603T-180I/MC: c) MCP1603T-180I/OS: a) MCP1603BT-180I/OS: Tape and Reel, 1.80V Buck Regulator with PWM Only, Industrial Temperature, 5LD-TSOT package a) MCP1603LT-180I/OS: Tape and Reel, 1.80V Buck Regulator with Alternate TSOT Pinout, Industrial Temperature, 5LD-TSOT package. MCP1603: Voltage Option: MCP1603 MCP1603B MCP1603L ADJ = Adjustable X X X 120 = 1.20V Standard X — X 150 = 1.50V Standard X — X 180 = 1.80V Standard X X X 250 = 2.50V Standard X — X 330 = 3.30V Standard X X X Temperature: I Package Type: MC = Plastic Dual-Flat No-Lead Package (MC), 8-Lead OS = Plastic Thin Small Outline Transistor (OS), 5-Lead 1.80V Buck Regulator, Industrial Temperature, 8LD-DFN package Tape and Reel, 1.80V Buck Regulator, Industrial Temperature, 8LD-DFN package Tape and Reel 1.80V Buck Regulator, Industrial Temperature, 5LD-TSOT package = -40°C to +85°C 2007-2012 Microchip Technology Inc. DS22042B-page 31 MCP1603/B/L NOTES: DS22042B-page 32 2007-2012 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2007-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-62076-632-3 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2007-2012 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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