IC553 Series Dual Inline Memory Module (DIMM, 160 pins) Specifications Part Number (Details) Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Mating Cycles: Pin Count: 1,000M W min. at 500V DC 700V AC for 1 minute 30m W max. at 10mA/20mV max. –55°C to +170°C 10,000 insertions min. 160 contact pins IC-553 - 1 - MF Series No. Design No. MF = Flanged Unmarked = Not Flanged Materials and Finish Housing: Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Features í Card thickness 1.57mm Outline Socket Dimensions Recommended PC Board Layout Top View from Socket 141.00 ±0.1 102.87 ±0.2 1.27x37=46.99 ±0.2 102.87 ±0.1 1.27x41=52.07 ±0.2 Æ3.20 Thru hole 3.81 Ref 1.27±0.05 (3.81) 160-Æ0.80 + 0.1 0 8.58±0.05 1.27 ±0.1 1.27 ±0.1 108.00 + 0.2 0 132.00 ±0.4 5.38±0.05 13.00 2.54 17.00 1.27x41=52.07 ±0.1 1.27x37=46.99 ±0.1 1.27 ±0.05 Æ3.20 + 0.1 0 141.00 ±0.2 150.00 ±0.4 Matching Module Dimensions 110.50 + 0.2 0 1.88 ±0.05 1.50 +0 0.1 + 0.26 – 0.25 28.70 11.00 4.00 19.00 R 0.75 3.70 ±0.5 w0.40 x t0.30 46.99 52.07 1.57 ±0.15 102.87 104.65 Ref 110.24 + 0.26 – 0.25 SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER Test & Burn-In B-3