MICROCHIP 93LC86C

93AA86A/B/C, 93LC86A/B/C,
93C86A/B/C
16K Microwire Compatible Serial EEPROM
Device Selection Table
Part Number
VCC Range
ORG Pin
PE Pin
Word Size
Temp Ranges
Packages
93AA86A
1.8-5.5
No
No
8-bit
I
OT
93AA86B
1.8-5-5
No
No
16-bit
I
OT
93LC86A
2.5-5.5
No
No
8-bit
I, E
OT
93LC86B
2.5-5.5
No
No
16-bit
I, E
OT
93C86A
4.5-5.5
No
No
8-bit
I, E
OT
93C86B
4.5-5.5
No
No
16-bit
I, E
OT
93AA86C
1.8-5.5
Yes
Yes
8 or 16-bit
I
P, SN, ST, MS
93LC86C
2.5-5.5
Yes
Yes
8 or 16-bit
I, E
P, SN, ST, MS
93C86C
4.5-5.5
Yes
Yes
8 or 16-bit
I, E
P, SN, ST, MS
Features
Description
•
•
•
•
•
The Microchip Technology Inc. 93XX86A/B/C devices
are 16K bit low-voltage serial Electrically Erasable
PROMs (EEPROM). Word-selectable devices such as
the 93XX86C are dependent upon external logic
levels driving the ORG pin to set word size. For
dedicated 8-bit communication, the 93XX86A devices
are available, while the 93XX86B devices provide
dedicated 16-bit communication, available on SOT-23
devices only. A Program Enable (PE) pin allows the
user to write-protect the entire memory array.
Advanced CMOS technology makes these devices
ideal for low-power, nonvolatile memory applications.
The entire 93XX Series is available in standard packages including 8-lead PDIP and SOIC, and advanced
packaging including 8-lead MSOP, 6-lead SOT-23,
and 8-lead TSSOP. Pb-free (Pure Matte Sn) finish is
also available.
•
•
•
•
•
•
•
•
•
Low-power CMOS technology
ORG pin to select word size for ‘86C’ version
2048 x 8-bit organization ‘A’ devices (no ORG)
1024 x 16-bit organization ‘B’ devices (no ORG)
Program Enable pin to write-protect the entire
array
Self-timed ERASE/WRITE cycles (including
auto-erase)
Automatic ERAL before WRAL
Power-on/off data protection circuitry
Industry standard 3-wire serial I/O
Device Status signal (READY/BUSY)
Sequential READ function
1,000,000 E/W cycles
Data retention > 200 years
Temperature ranges supported:
- Industrial (I)
-40°C to +85°C
- Automotive (E)
-40°C to +125°C
Pin Function Table
Name
Function
CS
Chip Select
CLK
Serial Data Clock
DI
Serial Data Input
DO
Serial Data Output
VSS
Ground
PE
Program Enable
ORG
Memory Configuration
VCC
Power Supply
 2004 Microchip Technology Inc.
Package Types (not to scale)
PDIP/SOIC
SOT-23
(P, SN)
(OT)
CS
CLK
1
2
8
7
VCC
PE
DI
3
6
ORG
DO
4
5
VSS
DO
1
6
VCC
VSS
2
5
CS
DI
3
4
CLK
TSSOP/MSOP
(ST, MS)
CS
1
8
VCC
CLK
2
7
PE
DI
3
6
ORG
DO
4
5
VSS
DS21797D-page 1
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings (†)
VCC .............................................................................................................................................................................7.0V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied ................................................................................................-40°C to +125°C
ESD protection on all pins ......................................................................................................................................................≥ 4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
All parameters apply over the specified
ranges unless otherwise noted.
Param.
Symbol
No.
Parameter
VCC = 1.8V to 5.5V
Industrial (I):
TA = -40°C to +85°C
Automotive (E): TA = -40°C to +125°C
Min
Typ
Max
Units
Conditions
D1
VIH1
VIH2
High-level input voltage
2.0
0.7 VCC
—
—
VCC +1
VCC +1
V
V
VCC ≥ 2.7V
VCC < 2.7V
D2
VIL1
VIL2
Low-level input voltage
-0.3
-0.3
—
—
0.8
0.2 VCC
V
V
VCC ≥ 2.7V
VCC < 2.7V
D3
VOL1
VOL2
Low-level output voltage
—
—
—
—
0.4
0.2
V
V
IOL = 2.1 mA, VCC = 4.5V
IOL = 100 µA, VCC = 2.5V
D4
VOH1
VOH2
High-level output voltage
2.4
VCC - 0.2
—
—
—
—
V
V
IOH = -400 µA, VCC = 4.5V
IOH = -100 µA, VCC = 2.5V
D5
ILI
Input leakage current
—
—
±1
µA
VIN = VSS to VCC
D6
ILO
Output leakage current
—
—
±1
µA
VOUT = VSS to VCC
D7
CIN,
COUT
Pin capacitance (all inputs/
outputs)
—
—
7
pF
VIN/VOUT = 0V (Note 1)
TA = 25°C, FCLK = 1 MHz
D8
ICC write Write current
—
—
—
500
3
—
mA
µA
FCLK = 3 MHz, VCC = 5.5V
FCLK = 2 MHz, VCC = 2.5V
D9
ICC read Read current
—
—
—
—
—
100
1
500
—
mA
µA
µA
FCLK = 3 MHz, VCC = 5.5V
FCLK = 2 MHz, VCC = 3.0V
FCLK = 2 MHz, VCC = 2.5V
D10
ICCS
Standby current
—
—
—
—
1
5
µA
µA
I – Temp
E – Temp
CLK = Cs = 0V
ORG = DI = VSS or VCC
(Note 2) (Note 3)
D11
VPOR
VCC voltage detect
93AA86A/B/C, 93LC86A/B/C
93C86A/B/C
—
—
1.5V
3.8V
—
—
V
V
(Note 1)
Note 1:
2:
3:
This parameter is periodically sampled and not 100% tested.
ORG pin not available on ‘A’ or ‘B’ versions.
READY/BUSY status must be cleared from DO, see Section 3.4 “Data Out (DO)”.
DS21797D-page 2
 2004 Microchip Technology Inc.
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
TABLE 1-2:
AC CHARACTERISTICS
All parameters apply over the specified
ranges unless otherwise noted.
Param.
Symbol
No.
Parameter
VCC = 1.8V to 5.5V
Industrial (I):
TA = -40°C to +85°C
Automotive (E): TA = -40°C to +125°C
Min
Max
Units
Conditions
A1
FCLK
Clock frequency
—
3
2
1
MHz
MHz
MHz
4.5V ≤ VCC < 5.5V
2.5V ≤ VCC < 4.5V
1.8V ≤ VCC < 2.5V
A2
TCKH
Clock high time
200
250
450
—
ns
ns
ns
4.5V ≤ VCC < 5.5V
2.5V ≤ VCC < 4.5V
1.8V ≤ VCC < 2.5V
A3
TCKL
Clock low time
100
200
450
—
ns
ns
ns
4.5V ≤ VCC < 5.5V
2.5V ≤ VCC < 4.5V
1.8V ≤ VCC < 2.5V
A4
TCSS
Chip Select setup time
50
100
250
—
ns
ns
ns
4.5V ≤ VCC < 5.5V
2.5V ≤ VCC < 4.5V
1.8V ≤ VCC < 2.5V
A5
TCSH
Chip Select hold time
0
—
ns
1.8V ≤ VCC < 5.5V
A6
TCSL
Chip Select low time
250
—
ns
1.8V ≤ VCC < 5.5V
A7
TDIS
Data input setup time
50
100
250
—
ns
ns
ns
4.5V ≤ VCC < 5.5V
2.5V ≤ VCC < 4.5V
1.8V ≤ VCC < 2.5V
A8
TDIH
Data input hold time
50
100
250
—
ns
ns
ns
4.5V ≤ VCC < 5.5V
2.5V ≤ VCC < 4.5V
1.8V ≤ VCC < 2.5V
A9
TPD
Data output delay time
—
100
250
400
ns
ns
ns
4.5V ≤ VCC < 5.5V, CL = 100 pF
2.5V ≤ VCC < 4.5V, CL = 100 pF
1.8V ≤ VCC < 2.5V, CL = 100 pF
A10
TCZ
Data output disable time
—
100
200
ns
ns
4.5V ≤ VCC < 5.5V, (Note 1)
1.8V ≤ VCC < 4.5V, (Note 1)
A11
TSV
Status valid time
—
200
300
500
ns
ns
ns
4.5V ≤ VCC < 5.5V, CL = 100 pF
2.5V ≤ VCC < 4.5V, CL = 100 pF
1.8V ≤ VCC < 2.5V, CL = 100 pF
A12
TWC
Program cycle time
—
5
ms
ERASE/WRITE mode (AA and LC
versions)
A13
TWC
—
2
ms
ERASE/WRITE mode
(93C versions)
A14
TEC
—
6
ms
ERAL mode, 4.5V ≤ VCC ≤ 5.5V
A15
TWL
—
15
ms
WRAL mode, 4.5V ≤ VCC ≤ 5.5V
A16
—
1M
—
Note 1:
2:
Endurance
cycles 25°C, VCC = 5.0V, (Note 2)
This parameter is periodically sampled and not 100% tested.
This application is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which may be obtained from
www.microchip.com.
 2004 Microchip Technology Inc.
DS21797D-page 3
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
FIGURE 1-1:
CS
SYNCHRONOUS DATA TIMING
VIH
TCSS
VIL
TCKH
TCKL
TCSH
VIH
CLK
VIL
TDIS
TDIH
VIH
DI
VIL
DO
(READ)
VOH
VOL
TCZ
TSV
DO VOH
(PROGRAM)
VOL
Note:
TCZ
TPD
TPD
STATUS VALID
TSV is relative to CS.
TABLE 1-3: INSTRUCTION SET FOR X 16 ORGANIZATION (93XX86B OR 93XX86C WITH ORG = 1)
SB
Opcode
Address
Data In
Data Out
Req. CLK
Cycles
READ
1
10
A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
—
D15 – D0
29
EWEN
1
00
X
—
HIGH-Z
13
ERASE
1
11
A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
—
(RDY/BSY)
13
ERAL
1
00
—
(RDY/BSY)
13
WRITE
1
01
(RDY/BSY)
29
WRAL
1
00
0
1
X
X
X
X
X
X
X
X
D15 – D0
(RDY/BSY)
29
EWDS
1
00
0
0
X
X
X
X
X
X
X
X
—
HIGH-Z
13
Instruction
1
1
1
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D15 – D0
TABLE 1-4: INSTRUCTION SET FOR X 8 ORGANIZATION (93XX86A OR 93XX86C WITH ORG = 0)
SB
Opcode
Address
Data In
Data Out
Req. CLK
Cycles
READ
1
10
A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
—
D7 – D0
22
EWEN
1
00
X
—
HIGH-Z
14
ERASE
1
11
A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
—
(RDY/BSY)
14
ERAL
1
00
—
(RDY/BSY)
14
WRITE
1
01
(RDY/BSY)
22
WRAL
1
00
0
1
X
X
X
X
X
X
X
X
X
D7 – D0
(RDY/BSY)
22
EWDS
1
00
0
0
X
X
X
X
X
X
X
X
X
—
HIGH-Z
14
Instruction
DS21797D-page 4
1
1
1
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 – D0
 2004 Microchip Technology Inc.
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
2.0
FUNCTIONAL DESCRIPTION
2.2
Data In/Data Out (DI/DO)
When the ORG* pin is connected to VCC, the (x16)
organization is selected. When it is connected to
ground, the (x8) organization is selected. Instructions,
addresses and write data are clocked into the DI pin on
the rising edge of the clock (CLK). The DO pin is
normally held in a HIGH-Z state except when reading
data from the device, or when checking the READY/
BUSY status during a programming operation. The
READY/BUSY status can be verified during an Erase/
Write operation by polling the DO pin; DO low indicates
that programming is still in progress, while DO high
indicates the device is ready. DO will enter the HIGH-Z
state on the falling edge of CS.
It is possible to connect the Data In and Data Out pins
together. However, with this configuration it is possible
for a “bus conflict” to occur during the “dummy zero”
that precedes the read operation, if A0 is a logic high
level. Under such a condition the voltage level seen at
Data Out is undefined and will depend upon the relative
impedances of Data Out and the signal source driving
A0. The higher the current sourcing capability of the
driver, the higher the voltage at the Data Out pin. In
order to limit this current, a resistor should be connected between DI and DO.
2.1
All modes of operation are inhibited when VCC is below
a typical voltage of 1.5V for ‘93AA’ and ‘93LC’ devices
or 3.8V for ‘93C’ devices.
Start Condition
The Start bit is detected by the device if CS and DI are
both high with respect to the positive edge of CLK for
the first time.
Before a Start condition is detected, CS, CLK, and DI
may change in any combination (except to that of a
Start condition), without resulting in any device
operation (READ, WRITE, ERASE, EWEN, EWDS,
ERAL or WRAL). As soon as CS is high, the device is
no longer in Standby mode.
An instruction following a Start condition will only be
executed if the required opcode, address and data bits
for any particular instruction are clocked in.
2.3
Data Protection
The EWEN and EWDS commands give additional
protection against accidentally programming during
normal operation.
Note:
For added protection, an EWDS command
should be performed after every write
operation.
After power-up, the device is automatically in the
EWDS mode. Therefore, an EWEN instruction must be
performed before the initial ERASE or WRITE instruction
can be executed.
Block Diagram
VCC
VSS
Memory
Array
Address
Decoder
Address
Counter
Data Register
Output
Buffer
DO
DI
ORG*
CS
Mode
Decode
Logic
PE*
CLK
Clock
Register
*ORG and PE inputs are not available on
A/B devices.
 2004 Microchip Technology Inc.
DS21797D-page 5
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
2.4
ERASE
The DO pin indicates the READY/BUSY status of the
device if CS is brought high after a minimum of 250 ns
low (TCSL). DO at logical ‘0’ indicates that programming
is still in progress. DO at logical ‘1’ indicates that the
register at the specified address has been erased and
the device is ready for another instruction.
The ERASE instruction forces all data bits of the
specified address to the logical ‘1’ state. The rising
edge of CLK before the last address bit initiates the
write cycle.
Note:
FIGURE 2-1:
Issuing a Start bit and then taking CS low
will clear the READY/BUSY status from
DO.
ERASE TIMING
TCSL
CS
CHECK STATUS
CLK
1
DI
1
1
AN
AN-1
AN-2
•••
A0
TSV
DO
HIGH-Z
BUSY
TCZ
READY
HIGH-Z
TWC
DS21797D-page 6
 2004 Microchip Technology Inc.
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
2.5
ERASE ALL (ERAL)
The DO pin indicates the READY/BUSY status of the
device, if CS is brought high after a minimum of 250 ns
low (TCSL).
The Erase All (ERAL) instruction will erase the entire
memory array to the logical ‘1’ state. The ERAL cycle is
identical to the ERASE cycle, except for the different
opcode. The ERAL cycle is completely self-timed. The
rising edge of CLK before the last data bit initiates the
write cycle. Clocking of the CLK pin is not necessary
after the device has entered the ERAL cycle.
FIGURE 2-2:
Note:
Issuing a Start bit and then taking CS low
will clear the READY/BUSY status from
DO.
VCC must be ≥ 4.5V for proper operation of ERAL.
ERAL TIMING
TCSL
CS
CHECK STATUS
CLK
1
DI
0
0
1
0
X
•••
X
TSV
DO
HIGH-Z
BUSY
TCZ
READY
HIGH-Z
TEC
 2004 Microchip Technology Inc.
DS21797D-page 7
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
2.6
ERASE/WRITE DISABLE And ENABLE (EWDS/EWEN)
The 93XX86A/B/C powers up in the ERASE/WRITE
Disable (EWDS) state. All programming modes must be
preceded by an ERASE/WRITE Enable (EWEN) instruction. Once the EWEN instruction is executed, programming remains enabled until an EWDS instruction is
executed or VCC is removed from the device.
FIGURE 2-3:
To protect against accidental data disturbance, the
EWDS instruction can be used to disable all ERASE/
WRITE functions and should follow all programming
operations. Execution of a READ instruction is
independent of both the EWEN and EWDS instructions.
EWDS TIMING
TCSL
CS
CLK
1
DI
FIGURE 2-4:
0
0
0
0
•••
X
X
EWEN TIMING
TCSL
CS
CLK
1
DI
2.7
0
0
1
1
•••
X
READ
devices) output string. The output data bits will toggle on
the rising edge of the CLK and are stable after the specified time delay (TPD). Sequential read is possible when
CS is held high. The memory data will automatically cycle
to the next register and output sequentially.
The READ instruction outputs the serial data of the
addressed memory location on the DO pin. A dummy
zero bit precedes the 8-bit (If ORG pin is low or A-Version
devices) or 16-bit (If ORG pin is high or B-version
FIGURE 2-5:
X
READ TIMING
CS
CLK
DI
DO
DS21797D-page 8
1
HIGH-Z
1
0
An
•••
A0
0
Dx
•••
D0
Dx
•••
D0
Dx
•••
D0
 2004 Microchip Technology Inc.
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
2.8
WRITE
The DO pin indicates the READY/BUSY status of the
device, if CS is brought high after a minimum of 250 ns
low (TCSL). DO at logical ‘0’ indicates that programming
is still in progress. DO at logical ‘1’ indicates that the
register at the specified address has been written with
the data specified and the device is ready for another
instruction.
The WRITE instruction is followed by 8 bits (If ORG is
low or A-version devices) or 16 bits (If ORG pin is high
or B-version devices) of data which are written into the
specified address. The self-timed auto-erase and
programming cycle is initiated by the rising edge of CLK
on the last data bit.
FIGURE 2-6:
Note:
Issuing a Start bit and then taking CS low
will clear the READY/BUSY status from
DO.
WRITE TIMING
TCSL
CS
CLK
DI
1
0
1
An
•••
A0
Dx
•••
D0
TSV
DO
HIGH-Z
BUSY
TCZ
READY
HIGH-Z
Twc
 2004 Microchip Technology Inc.
DS21797D-page 9
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
2.9
WRITE ALL (WRAL)
The DO pin indicates the READY/BUSY status of the
device if CS is brought high after a minimum of 250 ns
low (TCSL).
The Write All (WRAL) instruction will write the entire
memory array with the data specified in the command.
The self-timed auto-erase and programming cycle is
initiated by the rising edge of CLK on the last data bit.
Clocking of the CLK pin is not necessary after the
device has entered the WRAL cycle. The WRAL
command does include an automatic ERAL cycle for
the device. Therefore, the WRAL instruction does not
require an ERAL instruction but the chip must be in the
EWEN status.
FIGURE 2-7:
Note:
Issuing a Start bit and then taking CS low
will clear the READY/BUSY status from
DO.
VCC must be ≥ 4.5V for proper operation of WRAL.
WRAL TIMING
TCSL
CS
CLK
DI
1
0
0
0
1
X
•••
X
Dx
•••
D0
TSV
DO
HIGH-Z
BUSY
TCZ
READY
HIGH-Z
TWL
DS21797D-page 10
 2004 Microchip Technology Inc.
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
3.0
PIN DESCRIPTIONS
TABLE 3-1:
3.1
PIN DESCRIPTIONS
Name
SOIC/PDIP/
MSOP/TSSOP
SOT-23
CS
1
5
Chip Select
CLK
2
4
Serial Clock
DI
3
3
Data In
DO
4
1
Data Out
VSS
5
2
ORG
6
N/A
Organization / 93XX86C
PE
7
N/A
Program Enable
VCC
8
6
Chip Select (CS)
A high level selects the device; a low level deselects
the device and forces it into Standby mode. However, a
programming cycle which is already in progress will be
completed, regardless of the Chip Select (CS) input
signal. If CS is brought low during a program cycle, the
device will go into Standby mode as soon as the
programming cycle is completed.
CS must be low for 250 ns minimum (TCSL) between
consecutive instructions. If CS is low, the internal
control logic is held in a Reset status.
3.2
Function
Serial Clock (CLK)
The Serial Clock is used to synchronize the communication between a master device and the 93XX series
device. Opcodes, address and data bits are clocked in
on the positive edge of CLK. Data bits are also clocked
out on the positive edge of CLK.
CLK can be stopped anywhere in the transmission
sequence (at high or low level) and can be continued
anytime with respect to clock high time (TCKH) and
clock low time (TCKL). This gives the controlling master
freedom in preparing opcode, address and data.
CLK is a “don't care” if CS is low (device deselected). If
CS is high, but the Start condition has not been
detected (DI = 0), any number of clock cycles can be
received by the device without changing its status (i.e.,
waiting for a Start condition).
CLK cycles are not required during the self-timed
WRITE (i.e., auto ERASE/WRITE) cycle.
After detection of a Start condition the specified number
of clock cycles (respectively low-to-high transitions of
CLK) must be provided. These clock cycles are
required to clock in all required opcode, address and
data bits before an instruction is executed. CLK and DI
then become don't care inputs waiting for a new Start
condition to be detected.
 2004 Microchip Technology Inc.
Ground
Power Supply
3.3
Data In (DI)
Data In (DI) is used to clock in a Start bit, opcode,
address and data synchronously with the CLK input.
3.4
Data Out (DO)
Data Out (DO) is used in the Read mode to output data
synchronously with the CLK input (TPD after the positive edge of CLK).
This pin also provides READY/BUSY status information during ERASE and WRITE cycles. READY/BUSY
status information is available on the DO pin if CS is
brought high after being low for minimum Chip Select
low time (TCSL) and an erase or write operation has
been initiated.
The Status signal is not available on DO, if CS is held
low during the entire ERASE or WRITE cycle. In this
case, DO is in the HIGH-Z mode. If status is checked
after the ERASE/WRITE cycle, the data line will be high
to indicate the device is ready.
Note:
3.5
Issuing a Start bit and then taking CS low
will clear the READY/BUSY status from
DO.
Organization (ORG)
When the ORG pin is connected to VCC or Logic HI, the
(x16) memory organization is selected. When the ORG
pin is tied to VSS or Logic LO, the (x8) memory
organization is selected. For proper operation, ORG
must be tied to a valid logic level.
93XX86A devices are always x8 organization and
93XX86B devices are always x16 organization.
DS21797D-page 11
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
3.6
Program Enable (PE)
This pin allows the user to enable or disable the ability
to write data to the memory array. If the PE pin is tied
to VCC, the device can be programmed. If the PE pin is
tied to VSS, programming will be inhibited. PE is not
available on 93XX86A or 93XX86B. On those devices,
programming is always enabled. This pin cannot be
floated, it must be tied to VCC or VSS.
DS21797D-page 12
 2004 Microchip Technology Inc.
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
4.0
PACKAGING INFORMATION
4.1
Package Marking Information
8-Lead MSOP (150 mil)
Example:
3L86I
2281L7
XXXXXXT
YWWNNN
MSOP 1st Line Marking Codes
Device
std mark
Pb-free
mark
93AA86C
93LC86C
93C86C
3A86CT
3L86CT
3C86CT
GA86CT
GL86CT
GC86CT
T = blank for commercial, “I” for Industrial,
“E” for Extended.
Example:
6-Lead SOT-23
5EL7
XXNN
8-Lead PDIP
Example:
XXXXXXXX
XXXXXNNN
YYWW
93LC86
I/P 1L7
0228
8-Lead SOIC
Example:
XXXXXXXX
XXXXYYWW
NNN
93LC86
I/SN 0228
1L7
SOT23 Marking Codes
Device
93AA86A
93AA86B
93LC86A
93LC86B
93C86A
93C86B
I-temp
5BNN
5LNN
5ENN
5PNN
5HNN
5TNN
E-temp
–
–
5FNN
5RNN
5JNN
5UNN
Pb-free topside mark is same; Pb-free
noted only on carton label.
TSSOP 1st Line Marking Codes
Example:
8-Lead TSSOP
L86
I228
1L7
XXXX
TYWW
NNN
Device
std mark
Pb-free
mark
93AA86C
A86C
GAEC
93LC86C
93C86C
L86C
C86C
GLEC
GCEC
Temperature grade is marked on line 2.
Legend:
XX...X
T
Blank
I
E
YY
WW
NNN
Note:
Part number
Temperature
Commercial
Industrial
Extended
Year code (last 2 digits of calendar year) except TSSOP
and MSOP which use only the last 1 digit
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Custom marking available.
 2004 Microchip Technology Inc.
DS21797D-page 13
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
E
E1
p
D
2
B
n
1
α
A2
A
c
φ
A1
(F)
L
β
Units
Dimension Limits
n
p
MIN
INCHES
NOM
MAX
MILLIMETERS*
NOM
8
0.65 BSC
0.75
0.85
0.00
4.90 BSC
3.00 BSC
3.00 BSC
0.40
0.60
0.95 REF
0°
0.08
0.22
5°
5°
-
MIN
8
Number of Pins
Pitch
.026 BSC
A
.043
Overall Height
A2
Molded Package Thickness
.030
.033
.037
A1
.000
.006
Standoff
E
Overall Width
.193 TYP.
E1
.118 BSC
Molded Package Width
D
.118 BSC
Overall Length
L
.016
.024
.031
Foot Length
Footprint (Reference)
F
.037 REF
φ
0°
8°
Foot Angle
c
.003
.006
.009
Lead Thickness
B
.009
.012
.016
Lead Width
α
5°
15°
Mold Draft Angle Top
β
5°
15°
Mold Draft Angle Bottom
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
MAX
1.10
0.95
0.15
0.80
8°
0.23
0.40
15°
15°
JEDEC Equivalent: MO-187
Drawing No. C04-111
DS21797D-page 14
 2004 Microchip Technology Inc.
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
6-Lead Plastic Small Outline Transistor (OT) (SOT-23)
E
E1
B
p1
n
D
1
α
c
A
A2
φ
L
β
Units
Dimension Limits
n
p
MIN
A1
INCHES*
NOM
MAX
MILLIMETERS
NOM
6
0.95
1.90
0.90
1.18
0.90
1.10
0.00
0.08
2.60
2.80
1.50
1.63
2.80
2.95
0.35
0.45
0
5
0.09
0.15
0.35
0.43
0
5
0
5
MIN
Number of Pins
6
Pitch
.038
p1
Outside lead pitch (basic)
.075
Overall Height
A
.035
.046
.057
Molded Package Thickness
.035
.043
.051
A2
Standoff
.000
.003
.006
A1
Overall Width
E
.102
.110
.118
Molded Package Width
.059
.064
.069
E1
Overall Length
D
.110
.116
.122
Foot Length
L
.014
.018
.022
φ
Foot Angle
0
5
10
c
Lead Thickness
.004
.006
.008
Lead Width
B
.014
.017
.020
α
Mold Draft Angle Top
0
5
10
β
Mold Draft Angle Bottom
0
5
10
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .005" (0.127mm) per side.
MAX
1.45
1.30
0.15
3.00
1.75
3.10
0.55
10
0.20
0.50
10
10
JEITA (formerly EIAJ) equivalent: SC-74A
Drawing No. C04-120
 2004 Microchip Technology Inc.
DS21797D-page 15
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
p
eB
B
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
L
c
§
B1
B
eB
α
β
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
MAX
8
.100
.155
.130
.170
.145
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
MAX
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS21797D-page 16
 2004 Microchip Technology Inc.
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
α
h
45°
c
A2
A
φ
β
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
h
L
φ
c
B
α
β
MIN
.053
.052
.004
.228
.146
.189
.010
.019
0
.008
.013
0
0
A1
INCHES*
NOM
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.197
.020
.030
8
.010
.020
15
15
MILLIMETERS
NOM
8
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
6.02
3.71
3.91
4.80
4.90
0.25
0.38
0.48
0.62
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
 2004 Microchip Technology Inc.
DS21797D-page 17
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
E
E1
p
D
2
1
n
B
α
A
c
φ
β
A1
A2
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
L
φ
c
B
α
β
MIN
INCHES
NOM
MAX
8
.026
.033
.002
.246
.169
.114
.020
0
.004
.007
0
0
.035
.004
.251
.173
.118
.024
4
.006
.010
5
5
.043
.037
.006
.256
.177
.122
.028
8
.008
.012
10
10
MILLIMETERS*
NOM
MAX
8
0.65
1.10
0.85
0.90
0.95
0.05
0.10
0.15
6.25
6.38
6.50
4.30
4.40
4.50
2.90
3.00
3.10
0.50
0.60
0.70
0
4
8
0.09
0.15
0.20
0.19
0.25
0.30
0
5
10
0
5
10
MIN
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086
DS21797D-page 18
 2004 Microchip Technology Inc.
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
APPENDIX A:
REVISION HISTORY
Revision C
Corrections to Section 1.0, Electrical Characteristics.
Section 4.1, 6-Lead SOT-23 package to OT.
Revision D
Corrections to Device Selection Table, Table 1-1, Table
1-2, Section 2.4, Section 2.5, Section 2.8 and Section
2.9. Added note to Figure 2-7.
 2004 Microchip Technology Inc.
DS21797D-page 19
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
NOTES:
DS21797D-page 20
 2004 Microchip Technology Inc.
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
ON-LINE SUPPORT
Microchip provides on-line support on the Microchip
World Wide Web site.
The web site is used by Microchip as a means to make
files and information easily available to customers. To
view the site, the user must have access to the Internet
and a web browser, such as Netscape® or Microsoft®
Internet Explorer. Files are also available for FTP
download from our FTP site.
Connecting to the Microchip Internet
Web Site
SYSTEMS INFORMATION AND
UPGRADE HOT LINE
The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip's development systems software products.
Plus, this line provides information on how customers
can receive the most current upgrade kits.The Hot Line
Numbers are:
1-800-755-2345 for U.S. and most of Canada, and
1-480-792-7302 for the rest of the world.
042003
The Microchip web site is available at the following
URL:
www.microchip.com
The file transfer site is available by using an FTP
service to connect to:
ftp://ftp.microchip.com
The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A variety of Microchip specific business information is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:
• Latest Microchip Press Releases
• Technical Support Section with Frequently Asked
Questions
• Design Tips
• Device Errata
• Job Postings
• Microchip Consultant Program Member Listing
• Links to other useful web sites related to
Microchip Products
• Conferences for products, Development Systems,
technical information and more
• Listing of seminars and events
 2004 Microchip Technology Inc.
DS21797D-page 21
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
Technical Publications Manager
RE:
Reader Response
Total Pages Sent ________
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Y
N
Device: 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
Literature Number: DS21797D
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21797D-page 22
 2004 Microchip Technology Inc.
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
X
PART NO.
Device
Tape & Reel Temperature
Range
Device
/XX
X
Package
X
Lead Finish
93AA86A: 16K 1.8V Microwire Serial EEPROM (x8)
93AA86B: 16K 1.8V Microwire Serial EEPROM (x16)
93AA86C: 16K 1.8V Microwire Serial EEPROM w/ORG
93LC86A: 16K 2.5V Microwire Serial EEPROM (x8)
93LC86B: 16K 2.5V Microwire Serial EEPROM (x16)
93LC86C: 16K 2.5V Microwire Serial EEPROM w/ORG
Examples:
a)
b)
c)
93AA86CT-I/MS: 16K, 2048x8 or 1024x16
Serial EEPROM, MSOP package, tape and
reel, 1.8V
a)
93LC86C-I/MS: 16K, 2048x8, 1024x16 Serial
EEPROM, MSOP package, 2.5V
93LC86BT-I/OT:
16K,
1024x16
Serial
EEPROM, SOT-23 package, tape and reel,
2.5V
93LC86CT-I/SNG: 16K, 2048x8 or 1024x16
Serial EEPROM, SOIC package, Industrial
temperature, tape and reel, Pb-free finish, 2.5V
b)
93C86A:
93C86B:
93C86C:
16K 5.0V Microwire Serial EEPROM (x8)
16K 5.0V Microwire Serial EEPROM (x16)
16K 5.0V Microwire Serial EEPROM w/ORG
Tape & Reel:
Blank =
T
=
Standard packaging
Tape & Reel
Temperature Range
I
E
=
=
-40°C to +85°C
-40°C to +125°C
Package
MS
OT
P
SN
ST
=
=
=
=
=
Plastic MSOP (Micro Small outline, 8-lead)
SOT-23, 6-lead (Tape & Reel only)
Plastic DIP (300 mil body), 8-lead
Plastic SOIC (150 mil body), 8-lead
TSSOP, 8-lead
Lead Finish:
Blank =
G
=
93AA86C-I/MS: 16K, 2048x8 or 1024x16
Serial EEPROM, MSOP package, 1.8V
93AA86AT-I/OT: 16K, 2048x8 Serial EEPROM,
SOT-23 package, tape and reel, 1.8V
c)
a)
b)
93C86C-I/MS: 16K, 2048x8 or 1024x16 Serial
EEPROM, MSOP package, 5.0V
93C86AT-I/OT: 16K, 2048x8 Serial EEPROM,
SOT-23 package, tape and reel, 5.0V
Standard 63% / 37% SnPb
Pb-free (Matte Tin - Pure Sn)
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences
and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of
the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2004 Microchip Technology Inc.
DS21797D-page 23
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
NOTES:
DS21797D-page 24
 2004 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE and PowerSmart are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER,
SEEVAL, SmartShunt and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Application Maestro, dsPICDEM, dsPICDEM.net,
dsPICworks, ECAN, ECONOMONITOR, FanSense,
FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP,
ICEPIC, microPort, Migratable Memory, MPASM, MPLIB,
MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICtail,
PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC,
Select Mode, SmartSensor, SmartTel and Total Endurance
are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2004, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in October
2003. The Company’s quality system processes and procedures are for
its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.
 2004 Microchip Technology Inc.
DS21797D-page 25
WORLDWIDE SALES AND SERVICE
AMERICAS
China - Beijing
Korea
Corporate Office
Unit 706B
Wan Tai Bei Hai Bldg.
No. 6 Chaoyangmen Bei Str.
Beijing, 100027, China
Tel: 86-10-85282100
Fax: 86-10-85282104
168-1, Youngbo Bldg. 3 Floor
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Tel: 82-2-554-7200 Fax: 82-2-558-5932 or
82-2-558-5934
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#07-02 Prime Centre
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Tel: 65-6334-8870 Fax: 65-6334-8850
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Technical Support: 480-792-7627
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Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200
Fax: 86-28-86766599
Boston
China - Fuzhou
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848
Fax: 978-692-3821
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506
Fax: 86-591-7503521
Atlanta
Chicago
333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
2767 S. Albright Road
Kokomo, IN 46902
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888
Fax: 949-263-1338
San Jose
1300 Terra Bella Avenue
Mountain View, CA 94043
Tel: 650-215-1444
Fax: 650-961-0286
Toronto
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699
Fax: 905-673-6509
ASIA/PACIFIC
Australia
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Hong Kong SAR
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
Singapore
Taiwan
Kaohsiung Branch
30F - 1 No. 8
Min Chuan 2nd Road
Kaohsiung 806, Taiwan
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Taiwan
Taiwan Branch
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
China - Shanghai
Austria
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700
Fax: 86-21-6275-5060
Durisolstrasse 2
A-4600 Wels
Austria
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark
China - Shenzhen
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45-4420-9895 Fax: 45-4420-9910
Rm. 1812, 18/F, Building A, United Plaza
No. 5022 Binhe Road, Futian District
Shenzhen 518033, China
Tel: 86-755-82901380
Fax: 86-755-8295-1393
China - Shunde
Room 401, Hongjian Building, No. 2
Fengxiangnan Road, Ronggui Town, Shunde
District, Foshan City, Guangdong 528303, China
Tel: 86-757-28395507 Fax: 86-757-28395571
China - Qingdao
Rm. B505A, Fullhope Plaza,
No. 12 Hong Kong Central Rd.
Qingdao 266071, China
Tel: 86-532-5027355 Fax: 86-532-5027205
India
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Japan
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
France
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany
Steinheilstrasse 10
D-85737 Ismaning, Germany
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy
Via Quasimodo, 12
20025 Legnano (MI)
Milan, Italy
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands
P. A. De Biesbosch 14
NL-5152 SC Drunen, Netherlands
Tel: 31-416-690399
Fax: 31-416-690340
United Kingdom
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44-118-921-5869
Fax: 44-118-921-5820
01/26/04
DS21797D-page 26
 2004 Microchip Technology Inc.