M TC1188/TC1189 MAX8863/64 Pin Compatible, Low Dropout, 120 mA Linear Regulators Features General Description • • • • • • • • • The TC1188 and TC1189 are fixed output, low dropout linear regulators that operate from a 2.7V to 6.0V input voltage source. The output is capable of delivering up to 120 mA while consuming only 50 µA of quiescent current. The low dropout voltage, 120 mV, make the TC1188 and TC1189 good choices for battery powered applications. Integrated over-current and over-temperature protection features provide for a fault tolerant solution. Input Voltage Range: 2.7 V to 6.0 V 120 mA Output Current Low Supply Current: 50 µA, (typical) Low Dropout Voltage: 110 mV, (typical at 100 mA) Fast Turn-On from Shutdown: 140 µsec (typical) Low Output Noise Over-Current and Over-Temperature Protection Low Power Shutdown Mode Auto Discharge of Output Capacitor (TC1189) Applications • • • • • • Battery Powered Systems Portable Computers Medical Instruments Cellular, Cordless Phones PDAs Pagers The TC1189 includes an output voltage auto discharge feature. When shutdown, the TC1189 will automatically discharge the output voltage using an internal N-Channel MOSFET switch. Fixed output voltage options for the TC1188/TC1189 are: 1.80V, 2.80V, 2.84V and 3.15V. Both the TC1188 and TC1189 are available in SOT23-5 packages. Typical Application Circuit VOUT VIN Package Type 5-Pin SOT-23A GND VOUT 4 5 TC1188 TC1189 1 2 + – Battery CIN 1 µF TC1188 TC1189 SHDN GND Output Voltage COUT 1 µF GND 3 SHDN GND VIN NOTE: 5-Pin SOT-23A is equivalent to the EIAJ (SC-74A) 2002 Microchip Technology Inc. DS21364B-page 1 TC1188/TC1189 1.0 ELECTRICAL CHARACTERISTICS *Notice: *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings* Input Voltage .........................................................6.5V Output Short-Circuit Duration .............................Infinite Output Voltage .......................... (-0.3V) to (VIN + 0.3V) Maximum Voltage On Any Pin.... (-0.3V) to (VIN +0.3V) Continuous Power Dissipation (TA = +70°C) SOT-23-5 (derate 7.1 mW/°C above +70°C) ..................................................................571 mW Operating Temperature Range............... -40°C to 85°C Storage Temperature .........................-65°C to +160°C Lead Temperature (Soldering, 10 Sec.) ........... +300°C DC SPECIFICATIONS Electrical Characteristics: VIN = +3.6V, GND = 0V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C. (Note 1) Parameters Symbol Min Typ Max Units Conditions Input Voltage VIN VOUT+0.5V 2.7 — — 6.0 6.0 V VOUT ≥ 2.5V VOUT = 1.8V (Note 2) Output Voltage VOUT 3.05 3.15 3.25 V 0 mA ≤ IOUT ≤ 50 mA T 2.75 2.84 2.93 V 0 mA ≤ IOUT ≤ 50 mA S 2.70 2.80 2.88 V 0 mA ≤ IOUT ≤ 50 mA R 1.745 1.80 1.85 V 0 mA ≤ IOUT ≤ 50 mA Q — mA Maximum Output Current IOUT 120 — Current Limit ILIM — 280 — mA Note 3 Input Current IIN — 50 90 µA IOUT = 0 — 1.1 — mV IOUT = 1 mA — 55 120 mV IOUT = 50 mA Dropout Voltage — 110 240 mV IOUT = 100 mA (Note 4) Line Regulation ∆VLNR -0.10 0.001 0.10 %/V VIN = VOUT + 0.5V to 6.0V — — — %/V IOUT = 1 mA Load Regulation ∆VLDR — 0.01 0.040 — 350 — µVRMS — 220 — µVRMS 10 Hz to 1 MHz C OUT = 100 µF tWK — 10 — µsec VIN = 3.6V CIN = 1 µF, COUT = 1 µF IL = 30 mA, (See Figure 3-1) tS — 140 — µsec VIN = 3.6V CIN = 1 µF, COUT = 1 µF IL = 30 mA, (See Figure 3-1) Output Voltage Noise Wake Up Time %/mA IOUT = 0 mA to 50 mA (from Shutdown Mode) Setting Time (from Shutdown Mode) 10 Hz to 1 MHz, COUT = 1 µF Note 1: Limits are 100% production tested at TA = +25°C. Limits over the operating temperature range are ensured through correlation using Statistical Quality Control (SQC) methods. 2: Validated by line regulation test. 3: Not tested. For design purposes, the current limit should be considered 150 mA minimum to 410 mA maximum. 4: The dropout voltage is defined as (VIN – VOUT) when VOUT is 100 mV below the value of VOUT for VIN = VOUT +2V. DS21364B-page 2 2002 Microchip Technology Inc. TC1188/TC1189 DC SPECIFICATIONS (CONTINUED) Electrical Characteristics: VIN = +3.6V, GND = 0V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C. (Note 1) Parameters Symbol Min Typ Max Units Conditions VIH 2.0 — — V VIL — — 0.4 V Ishdn — 0.1 100 nA VSHDN = VIN, TA = +25°C, TA = TMAX — 50 — nA VSHDN = VIN, TA = +25°C, TA = TMAX — 0.002 1 µA VOUT = 0V, TA = +25°C, TA = TMAX — 0.02 — µA — 1 — msec TSHDN — 170 — °C ∆TSHDN — 20 — °C Shutdown: SHDN Input Threshold SHDN Input Bias Current Shutdown Supply Current Iqshdn Shutdown to Output Discharge Delay (TC1189) VOUT = 0V, TA = +25°C, TA = TMAX COUT = 1 µF, no load at 10% of VOUT Thermal Protection Thermal Shutdown Temperature Thermal Shutdown Hysteresis Note 1: Limits are 100% production tested at TA = +25°C. Limits over the operating temperature range are ensured through correlation using Statistical Quality Control (SQC) methods. 2: Validated by line regulation test. 3: Not tested. For design purposes, the current limit should be considered 150 mA minimum to 410 mA maximum. 4: The dropout voltage is defined as (VIN – VOUT) when VOUT is 100 mV below the value of VOUT for VIN = VOUT +2V. 2002 Microchip Technology Inc. DS21364B-page 3 TC1188/TC1189 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0.040 0.10 Line Reg. @ 3.50 V to 5.50V(%) 0.035 LOAD REGULATION (%) LINE REGULATION (%) 0.08 0.06 0.04 0.02 0.00 –0.02 –0.04 –0.06 0.025 0.020 0.015 0.010 Load Reg. 0 to 50mA (%) Load Reg. 0 to 100mA (%) 0.005 –0.08 –0.10 –40°C 0.030 0°C 25°C 70°C 0.000 –40°C 85°C 85°C FIGURE 2-4: Load Regulation vs. Temperature. (TC1188) 2.930 0.120 VOUT - SET/1.0mA @ 3.5V (V) 2.910 70°C TEMPERATURE (°C) FIGURE 2-1: Line Regulation vs. Temperature. (TC1188) 50mA, Dropout V (V) 0.100 2.890 2.870 0.080 2.850 (V) VOUT (V) 25°C 0°C TEMPERATURE (°C) 2.830 2.810 0.060 0.040 2.790 0.020 2.770 2.750 –40°C 0°C 25°C 70°C 0.000 –40°C 85°C 0°C 25°C FIGURE 2-2: Output Voltage vs. Temperature. (TC1188) 85°C FIGURE 2-5: Dropout Voltage vs. Temperature. (TC1188) 10.0 0.040 RLOAD = 50µΩ COUT = 1µF Load Reg. 0 to 50mA (%) 0.035 0.030 Noise (µV/√HZ) LOAD REGULATION (%) 70°C TEMPERATURE (°C) TEMPERATURE (°C) 0.025 0.020 0.015 1.0 0.1 0.010 0.005 0.000 –40°C 0°C 25°C 70°C 85°C 0.0 0.01 TEMPERATURE (°C) FIGURE 2-3: Load Regulation vs. Temperature. (TC1188) DS21364B-page 4 0.01 1 10 100 1000 FREQUENCY (kHz) FIGURE 2-6: (TC1188) Output Noise vs. Frequency. 2002 Microchip Technology Inc. TC1188/TC1189 -10 CIN = COUT = 1µF, RL = 470Ω, XSHDN = 3.5V VOUT = 2.84V RLOAD = 50Ω 100mV p-p -20 -30 VIN = 4.5V VIN = 3.5V -40 -50 (dB) CH1 T CH1 GND -60 -70 VOUTAC 20µV/DIV COUT = 1µF -80 CH2 CH2 GND T -90 -100 10 10K 100K 1M 100 1K 10M 100µsec/Div FREQUENCY (kHz) T = 25° CIN = 1µF CL =1µF RL = ∞ VOUT = 0.5V/DIV SHDN SHDN = 0V CH1 GND FIGURE 2-10: OUTPUT, SHUTDOWN VOLTAGE (V) FIGURE 2-7: Power Supply Rejection Ratio vs. Frequency. (TC1188) 3V SHDN 2.8V VOUT 0V TIME (100µs/Div) 200µsec/Div FIGURE 2-11: Wake-Up Response Time. TC1189 Shutdown Transient T CIN = 1µF COUT =1µF RL = 100Ω VIN = 3.5V XSHDN = 3V Turn On Time = 150µS VOUT = 2.7V No Overshoot CH1 GND 0V VIN = 3.6V ILOAD = 30mA CIN = 1µF CLOAD = 1µF CH2 GND FIGURE 2-8: Response. TC1189 Line Response. CH2 XSHDN = 0V CH1 VOUT = 0V CH2 GND T 200µsec/Div FIGURE 2-9: Response. TC1189 Shutdown Transient 2002 Microchip Technology Inc. DS21364B-page 5 TC1188/TC1189 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Symbol SHDN GND Active Low Shutdown Input. When the SHDN input is low (< 0.2V), the quiscent current for the TC1188/TC1189 is reduced to 0.1 nA. When the input voltage to the SHDN pin is high (> 2.0V) the output of the TC1188/TC1189 is enabled. For the TC1189 only, the output capacitor is discharged by an internal switch when the SHDN is low. Ground. Connect to ground. Unregulated Input Voltage. The input voltage can range from 2.7V to 6.0V. VIN 3.1 Description VOUT Regulator Output. Sources up to 120 mA. Bypass with a 1 µF, <1 Ω typical ESR capacitor to GND. GND Connect to GND. Detailed Description The TC1188/TC1189 devices are fixed output, low dropout linear regulators. Utilizing CMOS construction, the internal quiescent current consumed by the regulator is minimized when compared to older bipolar low dropout regulators. The LDO output voltage is sensed at the non-inverting pin of the internal error amplifier. The internal voltage reference is sensed at the inverting pin of the internal error amplifier. The error amplifier adjusts the gate source voltage of the internal P-channel pass device until the divided down output voltage matches the internal reference voltage. When it does, the LDO output voltage is in regulation. The SHDN, when pulled low, is used to turn off the PChannel MOSFET and lower the internal quiescent current to less than 1 µA maximum. For normal operation, the SHDN pin is pulled to a high level. (> 2.0V). The TC1189 incorporates an internal N-Channel MOSFET, which is used to discharge the output capacitor when shutdown. The TC1188 does not have the internal N-Channel MOSFET, therefore, when the device is shutdown, the output voltage will decrease at a rate which is dependant on the load current. 3.2 released from shutdown. The settling time of the output voltage is dependent on load conditions and output capacitance on VOUT (RC response). VIH VIL SHDN tS 98% 2% VOUT tWK FIGURE 3-1: 3.3 Wake-Up Response Time. Internal P-Channel Pass Transistor The Internal P-Channel MOSFET is operated in the linear region to regulate the LDO output voltage. The RDSon of the P-Channel MOSFET is approximately 1.1 Ω, making the LDO able to regulate with little input to output voltage differential, "Low Dropout". Another benefit of using CMOS construction is that the P-Channel MOSFET is a voltage controlled device, so it doesn't consume a fraction of the bias current required of bipolar PNP LDOs. Turn-On Response The turn-on response is defined as two separate response categories: Wake-Up Time (tWK) and Settling Time (tS). The TC1188/TC1189 have fast wake-up times (10 µsec typical) when released from shutdown. See Figure 3-1 for the wake-up time, designated as tWK. The wake-up time is defined as the time it takes for the output to rise to 2% of the VOUT value after being released from shutdown. The total turn on response is defined as the Settling Time (tS) (Figure 3-1). Settling Time (inclusive with tWK) is defined as the condition when the output is within 2% of its fully enabled value (140 µsec typical) when DS21364B-page 6 2002 Microchip Technology Inc. TC1188/TC1189 VIN – Shutdown Logic SHDN Thermal Sensor GND PMOS Pass Transistor MOS Driver With ILIMIT + VOUT Error Amplifier N (TC1189 Only) Bandgap Reference GND FIGURE 3-2: 3.4 Functional Block Diagram. Shutdown The SHDN input is used to turn off the LDO P-Channel pass MOSFET and internal bias. When shutdown, the typical quiescent current consumed by the LDO is 0.1 nA. A logic low (< 0.4V) at the SHDN input will cause the device to operate in the shutdown mode. A logic high (> 2.0V) at the SHDN input will cause the device to operate in the normal mode. 3.5 Current Limit The LDO output current is monitored internal to the TC1188/TC1189. The internal current sense will limit the LDO output current to a typical value of 280 mA. The current limit can range from approximately 50 mA to 410 mA from device to device. The internal current limit protects the device from a continuous output short circuit. 3.6 Thermal Overload Protection Integrated thermal protection circuitry shuts the TC1188/TC1189 off when the internal die temperature exceeds approximately 170°C. The regulator output remains off until the internal die temperature drops to approximately 150°C. 3.7 Operating Region and Power Dissipation The internal power dissipation to the LDO is primarily determined by the input voltage, output voltage and output current. The following equation is used to approximate the worst case for power dissipation: EQUATION PD = VIN(MAX) - VOUT(MIN) x ILOAD(MAX) Where: PD = Worst case internal power dissipation. VIN(MAX) = Maximum input voltage. VOUT(MIN) = Minimum output voltage. ILOAD(MAX) = Maximum output current. The maximum power dissipation is a function of the maximum ambient temperature, TA(MAX), the maximum junction temperature, TJ(MAX), and the package thermal resistance from junction to air, θJA. The 5-Pin SOT23A package has a θJA of approximately 220°C/Watt. EQUATION PD = (TJ(MAX) - TA(MAX))/θJA Where all terms are previously defined. 2002 Microchip Technology Inc. DS21364B-page 7 TC1188/TC1189 EXAMPLE 3-1: The previously defined power dissipation equations can be used to ensure that the regulator thermal operation is within limits. Given: VIN(MAX) = 3.0V +10% VOUT(MAX) = 2.7V - 2.5% ILOAD(MAX) = 40 MA TJ(MAX) = 125°C TA(MAX) = 55°C Find: 1. 2. Actual power dissipation. Maximum allowable dissipation. Actual power dissipation: PD = VIN(MAX) - VOUT(MIN) x ILOAD(MAX) PD = ((3.0 * 1.1) - (2.7 * 0.975)) * 40 mA PD = 26.7 mWatts 4.0 APPLICATIONS INFORMATION 4.1 Input Capacitor A 1 µF (or larger) capacitor is recommended to bypass the LDO input and lower input impedance for circuit stability when operating from batteries or high impedance sources. The input capacitor can be ceramic, tantalum or aluminum electrolytic. For applications that require low noise and input power supply rejection, low effective series resistance (ESR) ceramic capacitors are recommended over higher ESR electrolytic capacitors. Larger value input capacitors can be used to improve circuit performance. 4.2 Output Capacitor A 1 µF (minimum) capacitor is required from VOUT to ground to ensure circuit stability. The output capacitor should have an ESR greater than 0.1 ohms and less than 2 ohm. Tantalum or aluminum electrolytic capacitors are recommended. Since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalums are recommended for applications operating below 25°C. Maximum allowable power dissipation: PD = (TJ(MAX) - TA(MAX))/θJA PD(MAX) = (125 - 55) / 220 PD(MAX) = 318 mWatts. In this example, the TC1188/TC1189 dissipates a maximum of 26.7 mW below the allowable limit of 318 mW. In a similar manner, the power dissipation equation, as a function of VIN, VOUT and ILOAD, along with the power dissipation equation, as a function of maximum junction temperature, maximum ambient temperature and junction to air thermal resistance, can be used to calculate maximum current and/or maximum input voltage limits. DS21364B-page 8 2002 Microchip Technology Inc. TC1188/TC1189 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 5 4 cdef 1 2 3 Part Number (V) Code TC1188-XECT 1.80 G4 TC1188-XECT 2.80 G3 TC1188-XECT 2.84 G2 TC1188-XECT 3.15 G1 TC1189-XECT 1.80 H4 TC1189-XECT 2.80 H3 TC1189-XECT 2.84 H2 TC1189-XECT 3.15 H1 Legend: 1-2 Part Number code + temperature range and voltage* 3 Year and two-month period code 4 Lot ID Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard OTP marking consists of Microchip part number, year code, week code, and traceability code. 2002 Microchip Technology Inc. DS21364B-page 9 TC1188/TC1189 5-Lead Plastic Small Outline Transistor (OT) (SOT23) E E1 p B p1 n D 1 α c A Units Dimension Limits n Number of Pins p Pitch p1 Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic φ L β A A2 A1 E E1 D L φ c B α β MIN .035 .035 .000 .102 .059 .110 .014 0 .004 .014 0 0 A2 A1 INCHES* NOM 5 .038 .075 .046 .043 .003 .110 .064 .116 .018 5 .006 .017 5 5 MAX .057 .051 .006 .118 .069 .122 .022 10 .008 .020 10 10 MILLIMETERS NOM 5 0.95 1.90 0.90 1.18 0.90 1.10 0.00 0.08 2.60 2.80 1.50 1.63 2.80 2.95 0.35 0.45 0 5 0.09 0.15 0.35 0.43 0 5 0 5 MIN MAX 1.45 1.30 0.15 3.00 1.75 3.10 0.55 10 0.20 0.50 10 10 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MO-178 Drawing No. C04-091 DS21364B-page 10 2002 Microchip Technology Inc. TC1188/TC1189 ON-LINE SUPPORT Microchip provides on-line support on the Microchip World Wide Web (WWW) site. The web site is used by Microchip as a means to make files and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape or Microsoft Explorer. Files are also available for FTP download from our FTP site. Connecting to the Microchip Internet Web Site Systems Information and Upgrade Hot Line The Systems Information and Upgrade Line provides system users a listing of the latest versions of all of Microchip's development systems software products. Plus, this line provides information on how customers can receive any currently available upgrade kits.The Hot Line Numbers are: 1-800-755-2345 for U.S. and most of Canada, and 1-480-792-7302 for the rest of the world. 013001 The Microchip web site is available by using your favorite Internet browser to attach to: www.microchip.com The file transfer site is available by using an FTP service to connect to: ftp://ftp.microchip.com The web site and file transfer site provide a variety of services. Users may download files for the latest Development Tools, Data Sheets, Application Notes, User's Guides, Articles and Sample Programs. A variety of Microchip specific business information is also available, including listings of Microchip sales offices, distributors and factory representatives. Other data available for consideration is: • Latest Microchip Press Releases • Technical Support Section with Frequently Asked Questions • Design Tips • Device Errata • Job Postings • Microchip Consultant Program Member Listing • Links to other useful web sites related to Microchip Products • Conferences for products, Development Systems, technical information and more • Listing of seminars and events 2002 Microchip Technology Inc. DS21364B-page11 TC1188/TC1189 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this Data Sheet. To: Technical Publications Manager RE: Reader Response Total Pages Sent From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Device: TC1188/TC1189 Y N Literature Number: DS21364B Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this data sheet easy to follow? If not, why? 4. What additions to the data sheet do you think would enhance the structure and subject? 5. What deletions from the data sheet could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? 8. How would you improve our software, systems, and silicon products? DS21364B-page12 2002 Microchip Technology Inc. TC1188/TC1189 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX Device Voltage Output Package Examples: a) TC1188QECTTR: 1.80V, 100 mA, MAX8863/64 Pin Compatible LDO b) TC1188RECTTR: 2.80V, 100 mA, MAX8863/64 Pin Compatible LDO Device: Voltage Output Options: Package: TC1188: TC1189: Q R S T = = = = ECTTR 100 mA, MAX8863/64 Pin Compatible LDO 100 mA, MAX8863/64 Pin Compatible LDO 1.80V 2.80V 2.84V 3.15V = SOT-23A, 5-Pin (Tape and Reel) c) TC1188SECTTR: 2.84V, 100 mA, MAX8863/64 Pin Compatible LDO d) TC1188TECTTR: 3.15V, 100 mA, MAX8863/64 Pin Compatible LDO a) TC1189QECTTR: 1.80V, 100 mA, MAX8863/64 Pin Compatible LDO b) TC1189RECTTR: 2.80V, 100 mA, MAX8863/64 Pin Compatible LDO c) TC1189SECTTR: 2.84V, 100 mA, MAX8863/64 Pin Compatible LDO d) TC1189TECTTR: 3.15V, 100 mA, MAX8863/64 Pin Compatible LDO Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2002 Microchip Technology Inc. DS21364B-page13 TC1188/TC1189 NOTES: DS21364B-page 14 2002 Microchip Technology Inc. TC1188/TC1189 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, MXDEV, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro ® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified. 2002 Microchip Technology Inc. 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B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 China - Shenzhen 150 Motor Parkway, Suite 202 Hauppauge, NY 11788 Tel: 631-273-5305 Fax: 631-273-5335 Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office Rm. 1315, 13/F, Shenzhen Kerry Centre, Renminnan Lu Shenzhen 518001, China Tel: 86-755-2350361 Fax: 86-755-2366086 San Jose China - Hong Kong SAR Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 Microchip Technology Hongkong Ltd. Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 New York Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 India Microchip Technology Inc. India Liaison Office Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O’Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 Japan Microchip Technology Japan K.K. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934 Singapore Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan Microchip Technology (Barbados) Inc., Taiwan Branch 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 EUROPE Denmark Microchip Technology Nordic ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45 4420 9895 Fax: 45 4420 9910 France Microchip Technology SARL Parc d’Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Microchip Technology GmbH Gustav-Heinemann Ring 125 D-81739 Munich, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44 Italy Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 United Kingdom Microchip Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 Austria Microchip Technology Austria GmbH Durisolstrasse 2 A-4600 Wels Austria Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 05/16/02 DS21364B-page 16 2002 Microchip Technology Inc.