BITECH BB1020DTLF7

MODEL BB1020DT
SCSI Termination Resistor network
Low Voltage Differential (LVD)
DISCRIPTION
Model BB1020DT is a SCSI LVD termination network designed to terminate high performance SPI-2 (Ultra2)
and SPI-3 (Ultra3) bused applications. Wide SCSI bus applications can be terminated with three BB1020DT
networks and a linear regulator IC.
For use in high-speed SCSI bus applications, the BB1020DT utilizes thick film resistors on a ceramic substrate
with ball grid array (BGA) terminals. Resistors and solder balls reside on the same side of the ceramic
substrate, resulting in the absolute minimum stray capacitance and inductance.
FEATURES
•
SPI-2 (Ultra2) and SPI-3 (Ultra3) compliant
•
Each network contains LVD termination for up to 9 lines
•
Superior high frequency performance
•
Minimal stray capacitance and inductance
•
Surface mountable with automatic pick and place equipment
SCHEMATIC
R1 = 475Ω (18 places)
R2 = 121Ω (9 places)
ELECTRICAL1
Resistance Nominal (R1 & R2)
475Ω, 121Ω
Absolute Tolerance
±1%
Temperature Coefficient of Resistance (TCR)
±100 ppm/°C
Interlead Capacitance, Maximum
0.1 pF
Operating Temperature Range
-55°C to +125°C
1 Watt
Power Rating (per network @ 70°C)
1
Specifications subject to change without notice.
BI Technologies Corporation
4200 Bonita Place, Fullerton, CA 92835 USA
Phone: 714 447 2345
June 14, 2006
Website: www.bitechnologies.com
page 1 of 2
BI technologies
MODEL BB1020DT
MECHANICAL
Solder Ball Finish (for non-RoHS)
SnPbAg 10/88/2
Solder Ball Co-planarity
0.15 mm
Substrate Material
Al2O3
Resistor Material
Cermet
3
ORDERING INFORMATION2
Reel Size (inches)
Quantity/Reel
RoHS compliant
BB1020DT7
7
1000
No
BB1020DTLF7
7
1000
Yes
BB1020DT13
13
4000
No
BB1020DTLF13
13
4000
Yes
OUTLINE DRAWING
Units: inches / (mm)
APPLICATION NOTES
2
3
Contact our customer service for custom designs and features.
Preliminary release date is Q3 2006.
BI Technologies Corporation
4200 Bonita Place, Fullerton, CA 92835 USA
Phone: 714 447 2345
June 13, 2006
Website: www.bitechnologies.com
page 2 of 2
BI technologies