Central CTLSH1-40M322 SURFACE MOUNT HIGH CURRENT, LOW VF SILICON SCHOTTKY DIODE TINY LEADLESS MODULETM LOW VF Top View Bottom View TLM322 CASE Semiconductor Corp. DESCRIPTION: The CENTRAL SEMICONDUCTOR CTLSH1-40M322 is a low VF Schottky diode designed for applications where small size and operational efficiency are prime requirements. With a maximum power dissipation of 1.45W, and a very small package footprint (approximately equal to the SOT-363), this Tiny Leadless Module (TLM) is capable of dissipating up to 4 times the power of similar devices in a comparable surface mount package. MARKING CODE: CBA FEATURES: APPLICATIONS: • High Current (IF = 1.0A) • DC/DC Converters • Low Forward Voltage Drop (VF=0.55V Max @ 1.0A) • Reverse Battery Protection • Battery powered applications (Cell phones, PDAs, Digital Camera, MP3 Players, etc.) • High Thermal Efficiency MAXIMUM RATINGS: (TA=25°C) Peak Repetitive Reverse Voltage Continuous Forward Current Peak Repetitive Forward Current, tp ≤ 1ms Forward Surge Current, tp = 8ms Power Dissipation Operating and Storage Junction Temperature Thermal Resistance ELECTRICAL CHARACTERISTICS: SYMBOL TEST CONDITIONS IR IR IR BVR VF VF VF VF TM SYMBOL VRRM IF IFRM IFSM PD TJ, Tstg ΘJA (TA=25°C unless otherwise noted) MIN 40 1.0 3.5 10 1.45 UNITS V A A A W* -65 to +150 86.20 °C °C/W* MAX UNITS VR= 5.0V VR= 8.0V 10 µA 20 µA VR= 15V 50 µA IR= 100µA IF= 10mA TYP 40 V IF= 100mA IF= 500mA 0.29 V 0.36 V 0.45 V 0.55 V CJ IF= 1.0A VR= 4.0V, f= 1.0MHz 50 pF trr IF=IR= 500mA, Irr= 50mA, RL= 50Ω 15 ns * FR-4 Epoxy PC Board with copper mounting pad area of 21 mm2 R2 (10-April 2006) Central CTLSH1-40M322 TM Semiconductor Corp. SURFACE MOUNT HIGH CURRENT, LOW VF SILICON SCHOTTKY DIODE TINY LEADLESS MODULETM TLM322 CASE - MECHANICAL OUTLINE Suggested mounting pad layout for maximum power dissipation (Dimensions in mm) LEAD CODE: 1) CATHODE 2) ANODE 3) ANODE MARKING CODE: CBA For standard mounting refer to TLM322 Package Details R2 (10-April 2006)