SN54AHC14, SN74AHC14 HEX SCHMITT-TRIGGER INVERTERS SCLS238I − OCTOBER 1995 − REVISED JULY 2003 D Operating Range 2-V to 5.5-V VCC D Latch-Up Performance Exceeds 250 mA Per D ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) − 1000-V Charged-Device Model (C101) JESD 17 SN54AHC14 . . . J OR W PACKAGE SN74AHC14 . . . D, DB, DGV, N, NS, OR PW PACKAGE (TOP VIEW) 13 3 12 4 11 5 10 6 9 7 8 1Y 2A 2Y 3A 3Y 14 1Y 1A NC VCC 6A VCC 1 13 6A 2 3 12 6Y 4 11 5A 10 5Y 9 4A 5 6 7 8 SN54AHC14 . . . FK PACKAGE (TOP VIEW) 3 2A NC 2Y NC 3A 4 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 6Y NC 5A NC 5Y 3Y GND NC 4Y 4A 2 VCC 6A 6Y 5A 5Y 4A 4Y 4Y 14 1A 1 GND 1A 1Y 2A 2Y 3A 3Y GND SN74AHC14 . . . RGY PACKAGE (TOP VIEW) NC − No internal connection description/ordering information The ’AHC14 devices contain six independent inverters. These devices perform the Boolean function Y = A. Each circuit functions as an independent inverter, but because of the Schmitt action, the inverters have different input threshold levels for positive-going (VT+) and negative-going (VT−) signals. ORDERING INFORMATION Tape and reel SN74AHC14RGYR HA14 PDIP − N Tube SN74AHC14N SN74AHC14N Tube SN74AHC14D Tape and reel SN74AHC14DR SOP − NS Tape and reel SN74AHC14NSR AHC14 SSOP − DB Tape and reel SN74AHC14DBR HA14 Tube SN74AHC14PW Tape and reel SN74AHC14PWR TVSOP − DGV Tape and reel SN74AHC14DGVR HA14 CDIP − J Tube SNJ54AHC14J SNJ54AHC14J CFP − W Tube SNJ54AHC14W SNJ54AHC14W LCCC − FK Tube SNJ54AHC14FK SNJ54AHC14FK TSSOP − PW −55°C 55 C to 125 125°C C † TOP-SIDE MARKING QFN − RGY SOIC − D −40°C to 85°C ORDERABLE PART NUMBER PACKAGE† TA AHC14 HA14 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright © 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54AHC14, SN74AHC14 HEX SCHMITT-TRIGGER INVERTERS SCLS238I − OCTOBER 1995 − REVISED JULY 2003 FUNCTION TABLE (each inverter) INPUT A OUTPUT Y H L L H logic diagram (positive logic) A Y absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W (see Note 2): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W (see Note 2): N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W (see Note 2): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W (see Note 2): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W (see Note 3): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 3. The package thermal impedance is calculated in accordance with JESD 51-5. recommended operating conditions (see Note 4) SN54AHC14 SN74AHC14 MIN MAX MIN MAX UNIT VCC Supply voltage 2 5.5 2 5.5 V VI Input voltage 0 5.5 0 5.5 V VO Output voltage 0 VCC 0 VCC V mA IOH High-level High level output current VCC = 2 V IOL TA Low-level Low level output current −50 −50 VCC = 3.3 V ± 0.3 V −4 −4 VCC = 5 V ± 0.5 V −8 −8 VCC = 2 V 50 50 VCC = 3.3 V ± 0.3 V 4 4 VCC = 5 V ± 0.5 V 8 8 Operating free-air temperature −55 125 −40 85 mA mA mA °C NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54AHC14, SN74AHC14 HEX SCHMITT-TRIGGER INVERTERS SCLS238I − OCTOBER 1995 − REVISED JULY 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC TA = 25°C MIN TYP SN54AHC14 MAX MIN MAX SN74AHC14 MIN MAX VT+ Positive going Positive-going input threshold voltage 3V 1.2 2.2 1.2 2.2 1.2 2.2 4.5 V 1.75 3.15 1.75 3.15 1.75 3.15 5.5 V 2.15 3.85 2.15 3.85 2.15 3.85 VT− T Negative going Negative-going input threshold voltage 3V 0.9 1.9 0.9 1.9 0.9 1.9 4.5 V 1.35 2.75 1.35 2.75 1.35 2.75 5.5 V 1.65 3.35 1.65 3.35 1.65 3.35 ΔVT Hysteresis (VT+ − VT− T ) 3V 0.3 1.2 0.3 1.2 0.3 1.2 4.5 V 0.4 1.4 0.4 1.4 0.4 1.4 5.5 V 0.5 1.6 0.5 1.6 0.5 1.6 2V 1.9 2 1.9 1.9 3V 2.9 3 2.9 2.9 4.5 IOH = −50 50 mA 4.5 V 4.4 4.4 4.4 IOH = −4 mA 3V 2.58 2.48 2.48 IOH = −8 mA 4.5 V 3.94 3.8 3.8 VOH UNIT V V V V 2V 0.1 0.1 0.1 3V 0.1 0.1 0.1 4.5 V 0.1 0.1 0.1 IOL = 4 mA 3V 0.36 0.5 0.44 IOL = 8 mA 4.5 V 0.36 0.5 0.44 0 V to 5.5 V ±0.1 ±1* ±1 mA 2 20 20 mA 10 pF IOL = 50 mA VOL II VI = 5.5 V or GND ICC VI = VCC or GND, Ci VI = VCC or GND IO = 0 5.5 V 5V 2 10 V * On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V. switching characteristics over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1) PARAMETER tPLH tPHL tPLH tPHL FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE A Y CL = 15 pF A Y CL = 50 pF TA = 25°C MIN SN54AHC14 SN74AHC14 TYP MAX MIN MAX MIN MAX 8.3** 12.8** 1** 15** 1 15 8.3** 12.8** 1** 15** 1 15 10.8 16.3 1 18.5 1 18.5 10.8 16.3 1 18.5 1 18.5 UNIT ns ns ** On products compliant to MIL-PRF-38535, this parameter is not production tested. switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER tPLH tPHL tPLH tPHL FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE A Y CL = 15 pF A Y CL = 50 pF TA = 25°C MIN SN54AHC14 SN74AHC14 TYP MAX MIN MAX MIN MAX 5.5** 8.6** 1** 10** 1 10 5.5** 8.6** 1** 10** 1 10 7 10.6 1 12 1 12 7 10.6 1 12 1 12 UNIT ns ns ** On products compliant to MIL-PRF-38535, this parameter is not production tested. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN54AHC14, SN74AHC14 HEX SCHMITT-TRIGGER INVERTERS SCLS238I − OCTOBER 1995 − REVISED JULY 2003 noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°C (see Note 5) SN74AHC14 PARAMETER MIN TYP MAX UNIT VOL(P) Quiet output, maximum dynamic VOL 0.8 V VOL(V) Quiet output, minimum dynamic VOL −0.4 V VOH(V) Quiet output, minimum dynamic VOH 4.6 V VIH(D) High-level dynamic input voltage VIL(D) Low-level dynamic input voltage 3.5 V 1.5 V TYP UNIT NOTE 5: Characteristics are for surface-mount packages only. operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd 4 TEST CONDITIONS Power dissipation capacitance No load, POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 f = 1 MHz 9 pF SN54AHC14, SN74AHC14 HEX SCHMITT-TRIGGER INVERTERS SCLS238I − OCTOBER 1995 − REVISED JULY 2003 PARAMETER MEASUREMENT INFORMATION VCC From Output Under Test RL = 1 kΩ From Output Under Test Test Point S1 Open TEST GND CL (see Note A) CL (see Note A) S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Drain Open VCC GND VCC LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS VCC 50% VCC Timing Input tw tsu VCC 50% VCC 50% VCC Input 0V th VCC 50% VCC Data Input 50% VCC 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC 50% VCC Input 50% VCC 0V tPLH tPHL VOH In-Phase Output 50% VCC tPHL Out-of-Phase Output 50% VCC VOL Output Waveform 1 S1 at VCC (see Note B) 50% VCC VOH 50% VCC VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 50% VCC 0V tPZL tPLZ ≈VCC 50% VCC tPZH tPLH 50% VCC VCC Output Control Output Waveform 2 S1 at GND (see Note B) VOL + 0.3 V VOL tPHZ 50% VCC VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. D. The outputs are measured one at a time with one input transition per measurement. E. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 9-Apr-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9680201Q2A ACTIVE LCCC FK 20 1 TBD 5962-9680201QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type 5962-9680201QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type 5962-9682001QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type 5962-9682001QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SN74AHC14D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU SN74AHC14DBLE OBSOLETE SSOP DB 14 TBD Call TI SN74AHC14DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC14DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC14DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC14DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC14DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC14DGVR ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC14DGVRE4 ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC14DGVRG4 ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC14DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC14DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC14DRG3 PREVIEW SOIC D 14 2500 SN74AHC14DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) SN74AHC14N ACTIVE PDIP N 14 25 SN74AHC14NE4 ACTIVE PDIP N 14 25 SN74AHC14NSR ACTIVE SO NS 14 SN74AHC14NSRG4 ACTIVE SO NS 14 SN74AHC14PW ACTIVE TSSOP PW 14 90 SN74AHC14PWE4 ACTIVE TSSOP PW 14 SN74AHC14PWG4 ACTIVE TSSOP PW 14 SN74AHC14PWLE OBSOLETE TSSOP PW 14 SN74AHC14PWR ACTIVE TSSOP PW 14 TBD POST-PLATE N / A for Pkg Type Call TI Level-1-260C-UNLIM Call TI Call TI CU NIPDAU Level-1-260C-UNLIM Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD Call TI 2000 Green (RoHS & no Sb/Br) Addendum-Page 1 CU NIPDAU Call TI Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM www.ti.com 9-Apr-2010 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74AHC14PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) SN74AHC14PWRG3 PREVIEW TSSOP PW 14 2000 SN74AHC14PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC14RGYR ACTIVE VQFN RGY 14 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74AHC14RGYRG4 ACTIVE VQFN RGY 14 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TBD Lead/Ball Finish CU NIPDAU Call TI MSL Peak Temp (3) Level-1-260C-UNLIM Call TI SNJ54AHC08J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54AHC08W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54AHC14FK ACTIVE LCCC FK 20 1 TBD SNJ54AHC14J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54AHC14W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54AHC14, SN74AHC14 : • Enhanced Product: SN74AHC14-EP NOTE: Qualified Version Definitions: • Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74AHC14DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 SN74AHC14DGVR TVSOP DGV 14 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1 SN74AHC14DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74AHC14DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74AHC14NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74AHC14PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74AHC14RGYR VQFN RGY 14 3000 330.0 12.4 3.75 3.75 1.15 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AHC14DBR SSOP DB 14 2000 346.0 346.0 33.0 SN74AHC14DGVR TVSOP DGV 14 2000 346.0 346.0 29.0 SN74AHC14DR SOIC D 14 2500 346.0 346.0 33.0 SN74AHC14DR SOIC D 14 2500 333.2 345.9 28.6 SN74AHC14NSR SO NS 14 2000 346.0 346.0 33.0 SN74AHC14PWR TSSOP PW 14 2000 346.0 346.0 29.0 SN74AHC14RGYR VQFN RGY 14 3000 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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