Microwave Ceramics and Modules 2 – Pole Filter for WLAN 5GHz / [5150 - 5850] MHz Filter B69842N5507A700 Preliminary Datasheet Features ! SMD filter consisting of coupled resonators with stepped impedances ! MgTiO3 - CaTiO3 (εr = 21 / TCf =0±10 ppm/K) with a coating of copper (10µm) and tin (>5µm) ! Excellent reflow solderability, no migration effect due to copper/tin metallization Index Page 2 ! Component drawing ! Recommended footprint Page 3 ! Characteristics ! Maximum ratings ! Typical passband characteristic Page 4 ! Processing information ! Soldering requirements ! Delivery mode ISSUE DATE 18.09.03 ISSUE P2 PUBLISHER SAW MWC PD F PAGE 1/4 Microwave Ceramics and Modules 2 – Pole Filter for WLAN 5GHz / [5150 - 5850] MHz Filter B69842N5507A700 Preliminary Datasheet Component drawing Recommended footprint I/O I/O G G G FOOTPRINT_010601.DWG"WMF ISSUE DATE 18.09.03 ISSUE P2 PUBLISHER SAW MWC PD F PAGE 2/4 Microwave Ceramics and Modules 2 – Pole Filter for WLAN 5GHz / [5150 - 5850] MHz Filter B69842N5507A700 Preliminary Datasheet Characteristics min. Center frequency typ. max. 5.5 fc αIL Insertion loss [5150 – 5850] MHz Passband [5150 – 5850] MHz 1.0 GHz 1.4 dB B 700 MHz ∆α Amplitude ripple (peak - peak) [5150 – 5850] MHz Standing wave ratio [5150 – 5850] MHz Impedance Power SWR 1.8 Z P 50 α Attenuation at DC to 1990 MHz at 1990 to 2170 MHz at 2400 to 2500 MHz dB 2.0 Ω W 1.0 dB dB dB 50 45 43 45 42 40 Maximum ratings IEC climatic category (IEC 68-1) - 40/+ 90/56 Operating temperature Top -40 / +85 °C Typical passband characteristic 0 -10 [dB] -20 S11 [dB] S21 [dB] -30 -40 -50 6,0 5,5 5,0 4,5 4,0 3,5 3,0 2,5 2,0 1,5 1,0 -60 G ISSUE DATE 18.09.03 ISSUE P2 PUBLISHER SAW MWC PD F PAGE 3/4 Microwave Ceramics and Modules 2 – Pole Filter for WLAN 5GHz / [5150 - 5850] MHz Filter B69842N5507A700 Preliminary Datasheet Processing information ZNr.: 577 (FILT95_2) ! Wettability to IEC 68-2-58: ≥ 75% (after aging) Soldering requirements Profile for eutectic SnPb solder paste Profile for leadfree solder paste Soldering type reflow Maximum soldering temperature 235 (max. 2 sec.) (measuring point on top surface of the component) 225 (max. 10 sec.) reflow 260 (max. 2 sec.) °C 250 (max. 10 sec.) °C Recommended soldering conditions (infrared): within 10 sec. Temp. [°C] within 10 sec. Temp. [°C] 245°C±5°C 215°C±10°C 20-40 sec. 30 sec. Time [sec.] 2.5 °C/s 40-80 sec. eutectic SnPb solder paste profile 2-3 min. Time [sec.] > - 5 °C/s leadfree solder paste profile Delivery mode ! Blister tape acc. to IEC 286-3, PS, grey ! Pieces/tape: t.b.d. t.b.d. EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed. ISSUE DATE 18.09.03 ISSUE P2 PUBLISHER SAW MWC PD F PAGE 4/4