ROHM RF081M2S

Data Sheet
Super Fast Recovery Diode
RF081M2S
Land size figure (Unit : mm)
Dimensions (Unit : mm)
Series
Standard Fast Recovery
0.1±0.1
0.05
1.2
0.85
1.6±0.1
2.6±0.1
①
3.5±0.2
3.05
Applications
General rectification
PMDU
Features
1)Small power mold type. (PMDU)
2)high switching speed
3)Low Reverse current
Structure
0.9±0.1
0.8±0.1
ROHM : PMDU
JEDEC :SOD-123
Manufacture Date
Construction
Silicon epitaxial planar
Taping dimensions (Unit : mm)
4.0±0.1
1.81±0.1
Absolute maximum ratings (Tl=25°C)
Parameter
Symbol
VRM
Repetitive peak Reverse voltage
VR
Reverse voltage
Average rectified forward current
Io
IFSM
Tj
Tstg
Forward current surge peak
Junction temperature
Storage temperature
Electrical characteristics (Tj=25°C)
Parameter
Symbol
Limits
200
200
0.8
1.0
15
150
55 to 150
Forward voltage
VF
Reverse current
IR
Min.
-
-
-
Reverse recovery time
trr
-
12
25
Rth(j-l)
-
-
20
Thermal Resistance
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φ1.0±0.1
8.0±0.2
3.71±0.1
0.25±0.05
1.75±0.1
φ1.55±0.05
2.0±0.05
3.5±0.05
4.0±0.1
1.5MAX
Conditions
Unit
V
V
Direct voltage
Glass epoxy substrate mounted
A
50×50mm Glass epoxy substrate mounted
A 60Hz half sin wave, Non-repetitive one cycle peak value, Tj=25°C
°C
°C
Typ.
0.83
0.86
0.01
Max.
0.95
0.98
10
Conditions
Unit
μA
IF=0.8A
IF=1.0A
VR=200V
ns
IF=0.5A,IR=1A,Irr=0.25*IR
V
°C/W junction to lead
1/3
2011.05
Data Sheet
RF081M2S
Electrical characteristics curves
10000
10
100
Tj=150℃
REVERSE CURRENT:IR(nA)
Tj=150℃
Tj=25℃
0.1
0.01
200
400
600
800
1000
Tj=125℃
100
Tj=25℃
10
1
0
50
100
150
REVERSE VOLTAGE:VR(V)
VR-IR CHARACTERISTICS
0
200
800
AVE:818mV
750
10
AVE:10.8nA
VF DISPERSION MAP
REVERSE RECOVERY TIME:trr(ns)
60
AVE:69.5A
40
20
20
15
10
50
AVE:51.5pF
45
Ct DISPERSION MAP
AVE:12.2ns
Ifsm
8.3ms
100
10
1
0
1
trr DISPERSION MAP
1000
30
10
NUMBER OF CYCLES
IFSM-CYCLE CHARACTERISTICS
IM=10mA
10
20
15
10
AVE:13.6kV
5
0
1
1
10
TIME:t(ms)
IFSM-t CHARACTERISTICS
100
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Rth(j-a)
TRANSIENT
THAERMAL IMPEDANCE:Rth (℃/W)
ELECTROSTATIC
DISCHARGE TEST ESD(KV)
PEAK SURGE
FORWARD CURRENT:IFSM(A)
100
25
C=200pF
R=0Ω
C=100pF
R=1.5kΩ
ESD DISPERSION MAP
2/3
100
IF=0.5A
No break at 30kV
t
8.3ms
1cyc
5
IFSM DISPERSION MAP
Ifsm
30
1000
Tj=25℃
IF=0.5A
IR=1A
Irr=0.25*IR
n=10pcs
25
0
1000
25
40
30
80
20
Tj=25℃
f=1MHz
VR=0V
n=10pcs
IR DISPERSION MAP
100
15
55
1
700
10
60
Tj=25℃
VR=200V
n=20pcs
CAPACITANCE BETWEEN
TERMINALS:Ct(pF)
850
REVERSE CURRENT:IR(nA)
Tj=25℃
IF=1.0A
n=20pcs
5
REVERSE VOLTAGE:VR(V)
VR-Ct CHARACTERISTICS
100
900
FORWARD VOLTAGE:VF(mV)
10
1
1200
FORWARD VOLTAGE:VF(mV)
VF-IF CHARACTERISTICS
PEAK SURGE
FORWARD CURRENT:IFSM(A)
CAPACITANCE BETWEEN
TERMINALS:Ct(pF)
1
f=1MHz
1000
PEAK SURGE
FORWARD CURRENT:IFSM(A)
FORWARD CURRENT:IF(A)
Tj=125℃
1ms
100
time
300us
Mounted on epoxy board
Rth(j-c)
10
1
0.1
0.001
0.01
0.1
1
10
100
1000
TIME:t(s)
Rth-t CHARACTERISTICS
2011.05
Data Sheet
RF081M2S
0A
Io
0V
VR
t
half sin wave
0.6
D=0.2
D=0.1
0.4
D=0.05
0.2
D=t/T
VR=160V
Tj=150℃
D.C.
1.5
T
D=0.8
D=0.5
1
half sin wave
D=0.2
0.5
D=0.1
D.C.
1.5
D=0.8
D=0.5
1
half sin wave
D=0.2
0.5
D=0.1
D=0.05
0
0
0.5
1
1.5
AVERAGE RECTIFIED
FORWARD CURRENT:Io(A)
Io-Pf CHARACTERISTICS
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© 2011 ROHM Co., Ltd. All rights reserved.
2
D=t/T
VR=160V
Tj=150℃
T
VR
t
D=0.8
D=0.5
AVERAGE RECTIFIED
FORWARD CURRENT:Io(A)
FORWARD POWER
DISSIPATION:Pf(W)
0V
2
AVERAGE RECTIFIED
FORWARD CURRENT:Io(A)
D.C.
0.8
Io
0A
2
1
D=0.05
0
0
0
30
60
90
120
AMBIENT TEMPERATURE:Ta(℃)
Derating Curve゙(Io-Ta)
3/3
150
0
30
60
90
120
150
CASE TEMPARATURE:Tc(℃)
Derating Curve(Io-Tc)
2011.05
Notice
Notes
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© 2011 ROHM Co., Ltd. All rights reserved.
R1120A