Obsolete Device TC1306 Dual 150mA CMOS LDO With Select Mode™ Operation, Shutdown and RESET Output Features General Description • Extremely Low Supply Current for Longer Battery Life • Select Mode™ Operation: Selectable Output Voltages for High Design Flexibility • Very Low Dropout Voltage • 10μsec (Typ.) Wake-Up Time from SHDN • Maximum 150mA Output Current per Output • High Output Voltage Accuracy • Power-Saving Shutdown Mode • RESET Output Can Be Used as a Low Battery Detector or Processor Reset Generator • Over Current Protection and Over Temperature Shutdown • Space Saving 8-Pin MSOP Package The TC1306 combines two CMOS Low Dropout Regulators and a Microprocessor Monitor in a space saving 8-Pin MSOP package. Designed specifically for battery operated systems, total supply current is typically 120μA at full load, 20 to 60 times lower than in bipolar regulators. Applications • • • • • • • Load Partitioning Battery Operated Systems Portable Computers Medical Instruments Instrumentation Pagers and Cellular/GSM/PHS Phones Linear Post-Regulator for SMPS Device Selection Table Part Number Junction Temperature Range Package TC1306R-BDVUA 8-Pin MSOP -40°C to +125°C NOTE: “R” denotes the suffix for the 2.63V RESET threshold. “B” indicates VOUT1 = 1.8V (fixed). “D” indicates VOUT2 = 2.8V, 3.0V (selectable). Other output voltages are available. Please contact Microchip Technology Inc. for details. The TC1306 features selectable output voltages for higher design flexibility. The dual-state SELECT input pin allows the user to select VOUT2 from 2 different values (2.8V and 3.0V). VOUT1 supplies a fixed 1.8V voltage. An active low RESET is asserted when the output voltage VOUT2 falls below the 2.63V reset voltage threshold. The RESET output remains low for 300msec (typical) after VOUT2 rises above reset threshold. When the shutdown control (SHDN1) is low, the regulator output voltage VOUT1 falls to zero and RESET output remains valid. When the shutdown control (SHDN2) is low, the regulator output voltage VOUT2 falls to zero and RESET output is low. Other key features for the device include ultra low noise operation, fast response to step changes in load and very low dropout voltage (typically 125mV at full load). The device also incorporates both over temperature and over current protection. Each regulator is stable with an output capacitor of only 1μF and has a maximum output current of 150mA. Typical Application VIN 8 2 GND 3 RESET 7 TC1306 SELECT VOUT2 3.3µF 6 VOUT1 3.3µF SHDN1 Package Type 1 4 5 SHDN2 8-Pin MSOP VIN 1 8 RESET 7 VOUT2 GND 2 SELECT 3 TC1306 SHDN1 4 © 2007 Microchip Technology Inc. 6 VOUT1 5 SHDN2 DS21527C-page 1 TC1306 1.0 ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS* Input Voltage .........................................................6.5V Output Voltage........................... (-0.3V) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 7) Maximum Voltage on Any Pin ......... VIN +0.3V to -0.3V Operating Temperature Range.... -40°C < TJ < +125°C Storage Temperature Range ..............-65°C to +150°C *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC1306 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN = VR + 1V, IL = 100μA, CL = 3.3μF, SHDN1 > VIH, SHDN2 > VIH, TA = 25°C, unless otherwise noted. Boldface type specifications apply for junction temperature of -40°C to +125°C. Applies to both VOUT1 and VOUT2. Symbol Parameter Min Typ Max Units VIN Input Operating Voltage 2.7 — 6.0 V IOUTMAX Maximum Output Current 150 — — mA VOUT Output Voltage (VOUT1 and VOUT2) TCVOUT VOUT Temperature Coefficient ΔVOUT/ΔVIN Line Regulation VR – 2.5% VR ± 0.5% VR + 2.5% — — 20 40 — — V Test Conditions Note 1 Per Channel Note 2 ppm/°C Note 3 — 0.05 0.35 % (VR + 1V) < VIN < 6V ΔVOUT/VOUT Load Regulation — 0.3 2 % IL = 0.1mA to IOUTMAX (Note 4) VIN – VOUT Dropout Voltage — 2 45 85 125 — 120 240 360 mV IL = 100μA IL = 50mA IL = 100mA IL = 150mA, (Note 5) IIN Supply Current — 120 200 μA SHDN1, SHDN2 = VIH, IL = 0 IINSD Shutdown Supply Current — 0.05 0.5 μA SHDN1, SHDN2 = 0V PSRR Power Supply Rejection Ratio — 55 — dB FRE ≤ 120Hz IOUTSC Output Short Circuit Current — 450 — mA VOUT = 0V ΔVOUTΔPD Thermal Regulation — 0.04 — V/W Notes 6, 7 tWK Wake Up Time — 10 — μsec VIN = 5V CIN = 1μF, COUT = 4.7μF IL = 30mA, (See Figure 4-1) — 40 — μsec VIN = 5V CIN = 1μF, COUT = 4.7μF IL = 30mA, (See Figure 4-1) (from Shutdown Mode) ts Settling Time (from Shutdown Mode) Note 1: 2: 3: 4: 5: 6: 7: The minimum VIN has to meet two conditions: VIN ≥ 2.7 and VIN = VR + VDROPOUT. VR is the regulator output voltage setting. For example: VR = 2.8V, 3.0V. TC VOUT = (VOUTMAX – VOUTMIN) x 106 VOUT x ΔT Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 Thermal Considerations section of this data sheet for more details. DS21527C-page 2 © 2007 Microchip Technology Inc. TC1306 TC1306 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: VIN = VR + 1V, IL = 100μA, CL = 3.3μF, SHDN1 > VIH, SHDN2 > VIH, TA = 25°C, unless otherwise noted. Boldface type specifications apply for junction temperature of -40°C to +125°C. Applies to both VOUT1 and VOUT2. Symbol Parameter Min Typ Max Units Thermal Shutdown Die Temperature — 160 — °C ΔTSD Thermal Shutdown Hysteresis — 15 — °C eN Output Noise — 200 — nV√Hz VIH SHDN Input High Threshold 65 — — %VIN VIN = 2.7V to 6.0V VIL SHDN Input Low Threshold — — 15 %VIN VIN = 2.7V to 6.0V TSD Test Conditions F = 10kHz SHDN Input SELECT Input VSELH SELECT Input HIgh Threshold 65 — — %VIN VIN = 2.7V to 6.0V VSELL SELECT Input Low Threshold — — 15 %VIN VIN = 2.7V to 6.0V RESET Output VINMIN Minimum VIN Operating Voltage 1.0 1.2 — — 6.0 6.0 V TA = 0°C to +70°C TA = -40°C to +125°C VTH Reset Threshold 2.59 2.55 2.63 — 2.66 2.70 V TA = +25°C TA = -40°C to +125°C ppm/°C Reset Threshold Tempco — 30 — VOUT2 to Reset Delay — 100 — μsec 140 300 560 msec Reset Active Time-out Period VOUT2 = VTH to (VTH – 100mV) VOL RESET Output Voltage Low — — — — — — 0.3 0.4 0.3 V VOUT2 = VTHMIN, ISINK = 1.2mA VOUT2 = VTHMIN, ISINK = 3.2mA VOUT2 > 1.0V, ISINK = 50μA VOH RESET Output Voltage High 0.8 VOUT2 — — V VOUT2 – 1.5 — — VOUT2 > VTHMAX, ISOURCE = 500μA VOUT2 > VTHMAX, ISOURCE = 800μA Note 1: 2: 3: 4: 5: 6: 7: The minimum VIN has to meet two conditions: VIN ≥ 2.7 and VIN = VR + VDROPOUT. VR is the regulator output voltage setting. For example: VR = 2.8V, 3.0V. TC VOUT = (VOUTMAX – VOUTMIN) x 106 VOUT x ΔT Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 Thermal Considerations section of this data sheet for more details. © 2007 Microchip Technology Inc. DS21527C-page 3 TC1306 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin MSOP) Symbol 1 VIN 3.0 Description Power supply input. 2 GND 3 SELECT SELECT control for setting VOUT2. SELECT = Low for VOUT2 = 2.8V, SELECT = High for VOUT2 = 3.0V. Ground terminal. 4 SHDN1 Shutdown control input for VOUT1. Regulator 1 is fully enabled when a logic high is applied to this input. Regulator 1 enters shutdown when a logic low is applied to this input. During shutdown, regulator output voltage falls to zero, RESET output remains valid. 5 SHDN2 Shutdown control input for VOUT2. Regulator 2 is fully enabled when a logic high is applied to this input. Regulator 2 enters shutdown when a logic low is applied to this input. During shutdown, regulator output voltage falls to zero, RESET output is low. 6 VOUT1 Regulated voltage output 1. 7 VOUT2 Regulated voltage output 2. 8 RESET RESET Output. RESET = Low when VOUT2 is below the Reset Threshold Voltage. RESET = High when VOUT2 is above the Reset Threshold Voltage. DETAILED DESCRIPTION The TC1306 is a precision fixed output voltage regulator that contains two fully independent 150mA outputs. The device also features separate shutdown modes for low-power operation. The Select Mode™ operation allows the user to select VOUT2 from two different values (2.8V, 3.0V), therefore providing high design flexibility. VOUT1 supplies a fixed 1.8V output voltage. The CMOS construction of the TC1306 results in a very low supply current, which does not increase with load changes. In addition, VOUT remains stable and within regulation at no load currents. DS21527C-page 4 The TC1306 also features an integrated microprocessor supervisor that monitors the VOUT2 output. The active low RESET signal is asserted when the voltage of VOUT2 falls below the reset voltage threshold (2.63V). The RESET output remains low for 300msec (typical) after VOUT2 rises above the reset threshold. The RESET output of the TC1306 is optimized to reject fast transient glitches on the monitored output line. © 2007 Microchip Technology Inc. TC1306 4.0 TYPICAL APPLICATIONS 4.3 4.1 Input and Output Capacitor The Select Mode™ operation is a dual-state input that allows the user to select VOUT2 from two different values. By applying a logic low to the SELECT pin, VOUT2 is set to supply a 2.8V output voltage. A logic high signal at the SELECT pin sets VOUT2 to 3.0V. This output voltage functionality provides high design flexibility and minimizes cost associated with inventory, time-to-market and new device qualifications. The TC1306 is stable with a wide range of capacitor values and types. A capacitor with a minimum value of 1μF from VOUT to Ground is required. The output capacitor should have an effective series resistance (ESR) of 0.1Ω to 10Ω for a 1μF capacitor and 0.01Ω to 10Ω for a 10μF capacitor. A 1μF capacitor should be connected from the VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalums are recommended for applications operating below -20°C). When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. 4.2 Shutdown Mode Applying a logic high to each of the shutdown pins turns on the corresponding output. Each regulator enters shutdown mode when a logic low is applied to the corresponding input. During shutdown mode, output voltage falls to zero, and regulator supply current is reduced to 0.5μA (max). If shutdown mode is not necessary, the pins should be connected to VIN. 4.4 Select Mode™ Operation Turn On Response The turn on response is defined as two separate response categories, Wake Up Time (tWK) and Settling Time (tS). The TC1306 has a fast Wake Up Time (10μsec typical) when released from shutdown. See Figure 4-1 for the Wake Up Time designated as tWK. The Wake Up Time is defined as the time it takes for the output to rise to 2% of the VOUT value after being released from shutdown. The total turn on response is defined as the Settling Time (tS), see Figure 4-1. Settling Time (inclusive with tWK) is defined as the condition when the output is within 2% of its fully enabled value (40μsec typical) when released from shutdown. The settling time of the output voltage is dependent on load conditions, output voltage and VOUT (RC response). FIGURE 4-1: WAKE-UP RESPONSE TIME VIH SHDN VIL tS 98% VOUT 2% tWK © 2007 Microchip Technology Inc. DS21527C-page 5 TC1306 5.0 THERMAL CONSIDERATIONS 5.1 Thermal Shutdown Integrated thermal protection circuitry shuts the regulator off when die exceeds approximately 160°C. The regulator remains off until the die temperature drops to approximately 145°C. Thermal shutdown is intended to protect the device under transient accidental (fault) overload conditions. Thermal Shutdown may not protect the LDO while operating above junction temperatures of 125°C continuously. Sufficient thermal evaluation of the design needs to be conducted to ensure that the junction temperature does not exceed 125°C. 5.2 Power Dissipation The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation. EQUATION 5-1: PD ≈ (VINMAX – VOUT1MIN)ILOAD1MAX + (VINMAX – VOUT2MIN)ILOAD2MAX Where: PD = Worst case actual power dissipation VINMAX = Maximum voltage on VIN VOUT1MIN = Minimum regulator output voltage1 ILOAD1MAX = Maximum output (load) current1 VOUT2MIN = Minimum regulator output voltage2 ILOAD2MAX = Maximum output (load) current2 The maximum allowable power dissipation (Equation 5-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (125°C), and the thermal resistance from junction-to-air (θJA). The MSOP-8 package has a θJA of approximately 200°C/W when mounted on a four layer FR4 dielectric copper clad PC board. EQUATION 5-2: PDMAX = (TJMAX – TAMAX) θJA Where all terms are previously defined. DS21527C-page 6 Equation 5-1 can be used in conjunction with Equation 5-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX = 3.8V ± 5% VOUT1MIN = 1.8V ± 2.5% VOUT2MIN = 3.0V ± 2.5% ILOAD1MAX = 60mA ILOAD2MAX = 120mA TJMAX = 125°C TAMAX = 55°C θJA = 200°C/W Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: PD ≈ [(VINMAX – VOUT1MIN)] x ILOAD1MAX + [(VINMAX – VOUT2MIN)] x ILOAD2MAX [(3.8 x 1.05) – (1.8 x .975)] x 60 x 10-3 + [(3.8 x 1.05) – (3.0 x .975)] x 120 x 10-3 = 256mW Maximum allowable power dissipation: PD = (TJMAX – TAMAX) θJA = (125 – 55) 200 = 350mW In this example, the TC1306 dissipates a maximum of 262mW; below the allowable limit of 350mW. In a similar manner, Equation 5-1 and Equation 5-2 can be used to calculate maximum current and/or input voltage limits. For example, the maximum allowable VIN is found by substituting the maximum allowable power dissipation of 350mW into Equation 5-1, from which VINMAX = 4.5V. 5.3 Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower θJA and therefore increase the maximum allowable power dissipation limit. © 2007 Microchip Technology Inc. TC1306 6.0 TYPICAL CHARACTERISTICS The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. VOUT2 at Various VDD / Load Current vs. Temperature (Select = GND) VOUT1 at Various VDD and Load vs. Temperature 1.81 2.505 VDD = 6.0V, IL = 100µA Load 1.80 VOUT2 (V) 1.78 VDD = 2.8V, IL = 150mA Load VDD = 6.0V, IL = 100mA Load 1.77 2.995 2.495 2.990 2.490 2.985 2.485 VDD = 3.8V, IL = 150mA 2.480 VDD = 3.8V, IL = 100mA 2.475 1.76 2.470 VDD = 3.8V, IL = 50mA 2.465 1.74 -40 2.460 -40 5 30 55 80 105 125 LOAD REG (%) IDD (µA) 120 -40°C 60 40 20 0 3 3.5 4 4.5 5 VDD (V) 5.5 -20 5 30 55 6 0.50 0.45 0.45 0.40 0.40 0.35 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 -40 Dropout Voltage vs. Load Current (Select = GND) 0.20 0.15 0.10 DROPOUT VOLTAGE (V) IL = 0.1 to 150mA 0.12 125°C 0.08 -40°C 0.06 0.04 0.05 0.02 0.00 -40 0.00 5 30 55 80 105 125 TEMPERATURE (°C) 25°C 0.10 -20 5 30 55 80 105 125 TEMPERATURE (°C) Dropout Voltage vs. Load Current (Select = VDD) 0.18 0.30 IL = 0.1 to 150mA 0.15 0.05 % Load Reg #1, IL = 0.1 to 150mA 0.00 -40 -20 5 30 55 80 105 125 TEMPERATURE (°C) 0.14 80 105 125 0.20 0.20 0.35 55 0.25 0.10 0.16 30 0.30 0.18 0.40 5 Load Regulation 2 vs. Temperature (Select = GND) 0.20 © 2007 Microchip Technology Inc. -20 TEMPERATURE (°C) 0.45 -20 VDD = 4.0V, IL = 150mA 2.950 -40 80 105 125 0.50 0.25 VDD = 3.8V, IL = 50mA VDD = 3.8V, IL = 100mA 2.955 0.50 Load Regulation 2 vs. Temperature (Select = VDD) LOAD REGULATION (%) 2.970 LOAD REG (%) 25°C 125°C 2.975 Load Regulation 1 vs. Temperature 160 80 2.980 TEMPERATURE (°C) IDD vs. VDD (Select = GND) 100 VDD = 4.0V, IL = 100µA 2.960 VDD = 3.8V, IL = 100µA TEMPERATURE (°C) 140 VDD = 6.0V, IL = 100µA 2.965 1.75 -20 3.000 VDD = 6.0V, IL = 100µA 2.500 DROPOUT VOLTAGE (V) VOUT (V) 1.79 VOUT2 at Various VDD / Load Current vs. Temperature (Select = VDD) VOUT2 (V) Note: 0.16 0.14 0.12 25°C 0.10 0.08 125°C 0.06 -40°C 0.04 0.02 0.00 0 25 50 75 100 125 150 LOAD CURRENT (mA) 0 25 50 75 100 125 150 LOAD CURRENT (mA) DS21527C-page 7 TC1306 6.0 TYPICAL CHARACTERISTICS (CONTINUED) Power Supply Rejection Ratio vs. Frequency Power Supply Rejection Ratio vs. Frequency 0 -40 -60 -80 IOUT = 100µA COUT = 10µF Tantalum VINDC = 4V VINAC = 100mVP-P VOUTDC = 3V -20 PSRR (dB) PSRR (dB) -20 0 IOUT = 150mA COUT = 10µF Ceramic VINDC = 4V VINAC = 100mVP-P VOUTDC = 3V -40 -60 -80 -100 10 100 1k 10k 100 -100 1M 10 100 1k f (Hz) 100 1M Output Noise Power Supply Rejection Ratio vs. Frequency 10 0 IOUT = 150mA COUT = 10µF Tantalum VINDC = 4V VINAC = 100mVP-P VOUTDC = 3V -20 1 Noise (μV/√HZ) PSRR (dB) 10k f (Hz) -40 -60 VOUT1 VOUT2 0.1 0.01 -80 COUT1 = COUT2 = 4.7mF, ILOAD = 100mA, VIN = 4.0V VOUT1 = VOUT2 = 3.0V -100 10 100 1k 10k f (Hz) DS21527C-page 8 100 1M 0.001 0.01 0.1 1 10 100 1000 f (Hz) © 2007 Microchip Technology Inc. TC1306 6.0 TYPICAL CHARACTERISTICS (CONTINUED) Shutdown Response Output Voltage (1V / div) Thermal Shutdown Response VOUT VIN = 6.0V VOUT = 1.8V CIN = 1μF COUT = 1μF SHDN (5V / div) VIN = 4.0V VOUT = 3.0V COUT = 10μF ILOAD = 100μA Time (200ms / div) Time (500ms / div) Thermal Shutdown Response Thermal Shutdown Response VOUT VOUT VIN = 6.0V VOUT = 2.8V CIN = 1μF COUT = 1μF VIN = 6.0V VOUT = 3.0V CIN = 1μF COUT = 1μF Time (500ms / div) VOUT2 VOUT1 VIN 4.6V Output Voltage Output Voltage (50mV / div) (50mV / div) Line Transient Response Line Transient Response VOUT2 VOUT1 3.6V COUT1 = COUT2 = 1μF Tantalum RLOAD = 30kΩ Input Voltage (2V / div) Input Voltage (2V / div) Output Voltage Output Voltage (50mV / div) (50mV / div) Time (500ms / div) VIN 4.6V 3.6V COUT1 = COUT2 = 10μF Ceramic RLOAD = 30kΩ Time (500ms / div) Time (500ms / div) © 2007 Microchip Technology Inc. DS21527C-page 9 TC1306 TYPICAL CHARACTERISTICS (CONTINUED) Output Voltage Output Voltage (20mV / div) (20mV / div) Load Transient Response VOUT2 VOUT1 COUT1 = COUT2 = 10μF Ceramic 100mA VIN = 5.5V RLOAD = 30kΩ RL = 30Ω 100μA Output Current Output Current Output Voltage Output Voltage (20mV / div) (20mV / div) 6.0 Thermal Shutdown Response VOUT2 VOUT1 COUT1 = COUT2 = 1μF Tantalum 100μA Time (500ms / div) Output Voltage 1 Output Voltage 2 (20mV / div) (50mV / div) Load Transient Response VOUT2 VOUT1 COUT1 = COUT2 = 10μF Ceramic 100mA VIN = 5.5V RLOAD = 30kΩ RL = 30Ω 100μA Output Current Output Voltage 1 Output Voltage 2 (20mV / div) (50mV / div) Time (500ms / div) Output Current 100mA VIN = 5.5V RLOAD = 30kΩ RL = 30Ω Thermal Shutdown Response VOUT2 VOUT1 COUT1 = COUT2 = 1μF Tantalum 100mA VIN = 5.5V RLOAD = 30kΩ RL = 30Ω 100μA Time (500ms / div) Time (500ms / div) Output Voltage 2 (1V / div) Wake-Up Response 3.0V VOUT2 1.8V Output Voltage 1 (1V / div) VOUT1 /Shdn1 = /Shdn2 COUT1 = COUT2 = 1μF Tantalum VIN = 5.5V RLOAD = 30kΩ Time (20ms / div) DS21527C-page 10 © 2007 Microchip Technology Inc. TC1306 7.0 PACKAGING INFORMATION 7.1 Package Marking Information Package marking data not available at this time. 7.2 Taping Form Component Taping Orientation for 8-Pin MSOP Devices User Direction of Feed PIN 1 W P Standard Reel Component Orientation for TR Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 2500 13 in 8-Pin MSOP 7.3 Package Dimensions 8-Pin MSOP PIN 1 .122 (3.10) .114 (2.90) .197 (5.00) .189 (4.80) .026 (0.65) TYP. .122 (3.10) .114 (2.90) .043 (1.10) MAX. .016 (0.40) .010 (0.25) .006 (0.15) .002 (0.05) .008 (0.20) .005 (0.13) 6° MAX. .028 (0.70) .016 (0.40) Dimensions: inches (mm) © 2007 Microchip Technology Inc. DS21527C-page 11 TC1306 NOTES: DS21527C-page 12 © 2007 Microchip Technology Inc. TC1306 APPENDIX A: REVISION HISTORY Revision C (February 2007) • Changed device status to “Obsolete” on data sheet • Corrected Figure 6-4 Output Noise Revision B (May 2002) • Undocumented changes Revision A (March 2001) • Original Release of this Document. © 2007 Microchip Technology Inc. DS21527C-page 13 TC1306 NOTES: DS21527C-page 14 © 2007 Microchip Technology Inc. TC1306 Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. © 2007 Microchip Technology Inc. DS21527C-page15 TC1306 NOTES: DS21527C-page16 © 2007 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. 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Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2007 Microchip Technology Inc. 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