MC145011 Rev. 5.0, 11/2006 Freescale Semiconductor Technical Data Photoelectric Smoke Detector IC with I/O For Line-Powered Applications The CMOS MC145011 is an advanced smoke detector component containing sophisticated very-low-power analog and digital circuitry. The IC is used with an infrared photoelectric chamber. Detection is accomplished by sensing scattered light from minute smoke particles or other aerosols. When detection occurs, a pulsating alarm is sounded via on-chip push-pull drivers and an external piezoelectric transducer. The variable-gain photo amplifier allows direct interface to IR detectors (photodiodes). Two external capacitors C1 and C2, C1 being the larger, determine the gain settings. Low gain is selected by the IC during most of the standby state. Medium gain is selected during a local-smoke condition. High gain is used during push button test. During standby, the special monitor circuit which periodically checks for degraded chamber sensitivity uses high gain, also. The I/O pin, in combination with VSS, can be used to interconnect up to 40 units for common signaling. An on-chip current sink provides noise immunity when the I/ O is an input. A local-smoke condition activates the short-circuit-protected I/O driver, thereby signaling remote smoke to the interconnected units. Additionally, the I/ O pin can be used to activate escape lights, enable auxiliary or remote alarms, and/ or initiate auto-dialers. While in standby, the low-supply detection circuitry conducts periodic checks using a load current from the LED pin. The trip point is set using two external resistors. The supply for the MC145011 must be a dc power source capable of supplying 35 mA continuously and 45 mA peak. When the MC145011 is in standby, an external LED is continuously illuminated to indicate that the device is receiving power. An extinguished LED accompanied by a pulsating audible alarm indicates a local-smoke condition. A pulsating audible alarm with the LED illuminated indicates a remote-smoke condition. A beep or chirp indicates a low-supply condition or degraded chamber sensitivity. A low-supply condition does not affect the smoke detection capability if VDD ≥ 6 V. Therefore, the low-supply condition and degraded chamber sensitivity can be distinguished by performing a push button (chamber) test. This circuit is designed to operate in smoke detector systems that comply with UL217 and UL268 specifications. Features • • • • • • • Operating Voltage Range: 6 to 12 V Operating Temperature Range: -10 to 60°C Average Standby Supply Current (Visible LED Illuminated): 20 mA Power-On Reset Places IC in Standby Mode (Non-Alarm State) Electrostatic Discharge (ESD) and Latch Up Protection Circuitry on All Pins Chip Complexity: 2000 FETs, 12 NPNs, 16 Resistors, and 10 Capacitors Pb-Free Packaging Designated by Suffix Code ED MC145011 PHOTOELECTRIC SMOKE DETECTOR IC WITH I/O FOR LINE-POWERED APPLICATIONS P SUFFIX ED SUFFIX (PB-FREE) PLASTIC DIP CASE 648-08 DW SUFFIX PLASTIC SOIC CASE 751G-04 C1 1 C2 2 DETECT 3 14 VSS STROBE 4 13 R1 VDD 5 12 OSC IRED 6 11 LED I/O 7 BRASS 8 Package MC145011P Plastic Dip MC145011ED MCZ145011DW SOIC Package Freescale Semiconductor, Inc. reserves the right to change the detail specifications, as may be required, to permit improvements in the design of its products. © Freescale Semiconductor, Inc., 2006. All rights reserved. 10 FEEDBACK 9 SILVER Figure 1. Pin Connections ORDERING INFORMATION Device 16 TEST LOW-SUPPLY 15 TRIP C1 C2 1 2 AMP OSC R1 TEST 12 OSC 13 16 - GAIN VDD - 3.5 V REF STROBE LOW-SUPPLY TRIP 15 Smoke GATE ON/OFF Timing Logic Gate On/Off 4 COMP + 7 Alarm Logic LOW SUPPLY 3 ZERO DETECT Horn Modulator And Driver VDD - 5 V REF 8 9 BRass SILVER 10 6 FEEDBACK IRED 11 COMP + I/O LED PIN 5 = VDD PIN 14 = VSS Figure 2. Block Diagram Table 1. Maximum Ratings(1) (Voltages referenced to VSS) Parameter DC Supply Voltage DC Input Voltage C1, C2, DETECT OSC, LOW-SUPPLY TRIP I/O FEEDBACK Test DC Input Current, per Pin Symbol Value Unit VDD -0.5 to +12 V VIN -0.25 to VDD +0.25 -0.25 to VDD +0.25 -0.25 to VDD +10 -15 to +25 -1.0 to VDD +0.25 V IIN ±10 mA DC Output Current, per Pin IOUT ±25 mA DC Supply Current, VDD and VSS Pins IDD +25 / -150 mA PD 1200(2) 350(3) mW TSTG -55 to +125 °C TL 260 °C Power Dissipation in Still Air Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds 5 Seconds Continuous 1. Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the limits in the Electrical Characteristics tables. 2. Derating: -12 mW/°C from 25° to 60°C. 3. Derating: - 3.5 mW/°C from 25° to 60°C. This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD except for the I/O, which can exceed VDD, and the Test input, which can go below VSS. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs and/or an unused I/O must be left open. MC145011 2 Sensors Freescale Semiconductor Table 2. Electrical Characteristics (TA = -10 to 60°C Unless Otherwise Indicated, Voltages Referenced to VSS) Characteristic Symbol Test Condition VDD/VDC Min Max Unit — 6.0 12 V — 6.5 7.8 V Power Supply Voltage Range VDD Supply Threshold Voltage, Low-Supply Alarm VTH Low-Supply Trip: VIN = VDD/3 Average Operating Supply Current, Excluding the Visible LED Current (per Package) IDD Standby Configured per Figure 8 12.0 — 12 µA Peak Supply Current, Excluding the Visible LED Current (per Package) IDD During Strobe On, IRED Off Configured per Figure 8 12.0 — 2.0 mA During Strobe On, IRED On Configured per Figure 8 12.0 — 3.0 Low-Level Input Voltage I/O FEEDBACK Test VIL 9.0 9.0 9.0 — — — 1.5 2.7 7.0 V High-Level Input Voltage I/O FEEDBACK Test VIH 9.0 9.0 9.0 3.2 6.3 8.5 — — — V OSC, DETECT LOW-SUPPLY TRIP FEEDBACK IIN VIN = VSS or VDD VIN = VSS or VDD VIN = VSS or VDD 12.0 12.0 12.0 — — — ±100 ±100 ± 00 nA Low-Level Input Current Test IIL VIN = VSS 12.0 — -1 µA Pull-Down Current Test I/O IIH VIN = VDD No Local Smoke, VIN = VDD No Local Smoke, VIN = 17 V 9.0 9.0 12.0 0.5 25 — 10 100 140 µA Input Current Low-Level Output Voltage LED SILVER, BRASS VOL IOUT = 10 mA IOUT = 16 mA 6.5 6.5 — — 0.6 1.0 V High-Level Output Voltage SILVER, BRASS VOH IOUT = -16 mA 6.5 5.5 — V STROBE VOUT Inactive, IOUT = -1 µA Active, IOUT = 100 µA to 500 µA (Load Regulation) — 9.0 VDD - 0.1 VDD - 4.4 — VDD - 5.6 V Inactive, IOUT = 1 µA Active, IOUT = 6 mA (Load Regulation) — 9.0 — 2.25(1) 0.1 3.75(1) Local Smoke, VOUT = 4.5 V 6.5 -4 — Local Smoke, VOUT = VSS (Short Circuit Current) 12.0 — -16 12.0 — ±1 µA Output Voltage (For Line Regulation, see Pin Descriptions) IRED High-Level Output Current I/O Off-State Output Leakage Current Common Mode Voltage Range Smoke Comparator Reference Voltage IOH mA LED IOZ VOUT = VSS or VDD C1, C2, DETECT VIC Local Smoke, Push button Test, or Chamber Sensitivity Test — VDD - 4 VDD - 2 V Internal Vref Local Smoke, Push button Test, or Chamber Sensitivity Test — VDD 3.08 VDD - 3.92 V 1. TA = 25°C only. MC145011 Sensors Freescale Semiconductor 3 Table 3. AC Electrical Characteristics (Reference Timing Diagram Figure 6 and Figure 7) (TA = 25°C, VDD = 9.0 V, Component Values from Figure 8: R1 = 100.0 KΩ, C3 = 1500.0 pF, R2 = 10.0 MΩ) No. Characteristic 1 Oscillator Period 2 LED Status (1) Symbol 1/fOSC tLED Test Condition Free-Running Sawtooth Measured at Pin 12 Min Max Unit 9.5 11.5 ms No Local Smoke, and No Remote Smoke Illuminated 3 Remote Smoke, but No Local Smoke Illuminated 4 Local Smoke or Push button Test 5 STROBE Pulse Width 6 IRED Pulse Period 9.5 11.5 ms Smoke Test 9.67 11.83 s 7 Chamber Sensitivity Test, without Local Smoke 38.9 47.1 8 Push button Test 0.302 0.370 tw(IRED) 94 116 µs tR — 30 µs 9 IRED Pulse Width 10 IRED Rise Time IRED Fall Time 11 11, 12 SILVER and BRASS Modulation Period SILVER and BRASS Duty Cycle tW(STB) Extinguished tIRED — 200 tMOD tF Local or Remote Smoke 297 363 ms tON/tMOD Local or Remote Smoke 73 77 % 13 SILVER and BRASS Chirp Pulse Period tCH Low Supply or Degraded Chamber Sensitivity 38.9 47.1 s 14 SILVER and BRASS Chirp Pulse Width tW(CH) Low Supply or Degraded Chamber Sensitivity 9.5 11.5 ms 15 Rising Edge on I/O to Smoke Alarm Response Time tRR Remote Smoke, No Local Smoke — 800 ms 16 Strobe Pulse Period tSTB s Smoke Test 9.67 11.83 17 Chamber Sensitivity Test, without Local Smoke 38.9 47.1 18 Low Supply Test, without Local Smoke 38.9 47.1 19 Push button Test 0.302 0.370 1. Oscillator period T (= TR + TF) is determined by the external components R1, R2, and C3 where TR = (0.6931) R2 C3 and TF = (0.6931) R1 C3. The other timing characteristics are some multiple of the oscillator timing as shown in the table. Table 4. Pin Description Pin No. Pin Name Description 1 C1 A capacitor connected to this pin as shown in Figure 8. determines the gain of the on-chip photo amplifier during push button test and chamber sensitivity test (high gain). The capacitor value is chosen such that the alarm is tripped from background reflections in the chamber during push button test. Av ≈ 1 + (C1/10) where C1 is in pF. CAUTION: The value of the closed-loop gain should not exceed 10,000. 2 C2 A capacitor connected to this pin as shown in Figure 8. determines the gain of the on-chip photo amplifier except during push button or chamber sensitivity tests. Av ≈ 1 + (C2/10) where C2 is in pF. This gain increases about 10% during the IRED pulse, after two consecutive local smoke detections. Resistor R14 must be installed in series with C2. R14 ≈ [1/(12√C2)] - 680 where R14 is in ohms and C2 is in farads. 3 DETECT This input to the high-gain pulse amplifier is tied to the cathode of an external photodiode. The photodiode should have low capacitance and low dark leakage current. The diode must be shunted by a load resistor and is operated at zero bias. The Detect input must be ac/dc decoupled from all other signals, VDD, and VSS. Lead length and/or foil traces to this pin must be minimized, also. See Figure 9. MC145011 4 Sensors Freescale Semiconductor Table 4. Pin Description (Continued) Pin No. Pin Name Description 4 STROBE This output provides a strobed, regulated voltage referenced to VDD. The temperature coefficient of this voltage is ± 0.2% °C maximum from - 10° to 60°C. The supply-voltage coefficient (line regulation) is ± 0.2%/V maximum from 6 to 12 V. Strobe is tied to external resistor string R8, R9, and R10. 5 VDD This pin is connected to the positive supply potential and may range from + 6 to + 12 V with respect to VSS. 6 IRED This output provides pulsed base current for external NPN transistor Q1 used as the infrared emitter driver. Q1 must have β ≥ 100. At 10 mA, the temperature coefficient of the output voltage is typically + 0.5%/°C from - 10° to 60°C. The supply-voltage coefficient (line regulation) is ± 0.2%/V maximum from 6 to 12 V. The IRED pulse width (active-high) is determined by external components R1 and C3. With a 100 kΩ/1500 pF combination, the nominal width is 105 µs. To minimize noise impact, IRED is not active when the visible LED and horn outputs are active. IRED is active near the end of Strobe pulses for Smoke Tests, Chamber Sensitivity Test, and Push button Test. 7 I/O This pin can be used to connect up to 40 units together in a wired-OR configuration for common signaling. VSS is used as the return. An on-chip current sink minimizes noise pick up during non-smoke conditions and eliminates the need for an external pull-down resistor to complete the wired-OR. Remote units at lower supply voltages do not draw excessive current from a sending unit at a higher supply voltage. I/O can also be used to activate escape lights, auxiliary alarms, remote alarms, and/or auto-dialers. As an input, this pin feeds a positive-edge-triggered flip-flop whose output is sampled nominally every 625 ms during standby (using the recommended component values). A local-smoke condition or the push button-test mode forces this current-limited output to source current. All input signals are ignored when I/O is sourcing current. If unused, I/O must be left unconnected. 8 BRASS This half of the push-pull driver output is connected to the metal support electrode of a piezoelectric audio transducer and to the horn-starting resistor. A continuous modulated tone from the transducer is a smoke alarm indicating either local or remote smoke. A short beep or chirp is a trouble alarm indicating a low supply or degraded chamber sensitivity. 9 SILVER This half of the push-pull driver output is connected to the ceramic electrode of a piezoelectric transducer and to the horn-starting capacitor. 10 FEEDBACK This input is connected to both the feedback electrode of a self-resonating piezoelectric transducer and the horn-starting resistor and capacitor through current-limiting resistor R4. If unused, this pin must be tied to VSS or VDD. 11 LED This active-low open-drain output directly drives an external visible LED. The load for the low-supply test is applied by this output. This low-supply test is non-coincident with the smoke tests, chamber sensitivity test, push button test, or any alarm signals. The LED also provides a visual indication of the detector status as follows, assuming the component values shown in Figure 8: Standby (includes low-supply and chamber sensitivity tests) - constantly illuminated Local Smoke - constantly extinguished Remote Smoke - constantly illuminated Push button Test - constantly extinguished (system OK); constantly illuminated (system problem) 12 OSC This pin is used in conjunction with external resistor R2 (10 MΩ) to VDD and external capacitor C3 (1500 pF) to VDD to form an oscillator with a nominal period of 10.5 ms. 13 R1 This pin is used in conjunction with resistor R1 (100 kΩ) to pin 12 and C3 (1500 pF, see pin 12 description) to determine the IRED pulse width. With this RC combination, the nominal pulse width is 105 µs. 14 VSS 15 LOWSUPPLY TRIP This pin is the negative supply potential and the return for the I/O pin. Pin 14 is usually tied to ground. This pin is connected to an external voltage which determines the low-supply alarm threshold. The trip voltage is obtained through a resistor divider connected between the VDD and LED pins. The low-supply alarm threshold voltage (in volts) ≈ (5R7/R6) + 5 where R6 and R7 are in the same units. 16 TEST This input has an on-chip pull-down device and is used to manually invoke a test mode. The Push button Test mode is initiated by a high level at pin 16 (usually depression of a S.P.S.T. normally-open push button switch to VDD). After one oscillator cycle, IRED pulses approximately every 336 ms, regardless of the presence of smoke. Additionally, the amplifier gain is increased by automatic selection of C1. Therefore, the background reflections in the smoke chamber may be interpreted as smoke, generating a simulated-smoke condition. After the second IRED pulse, a successful test activates the horn-driver and I/O circuits. The active I/O allows remote signaling for system testing. When the Push button Test switch is released, the Test input returns to VSS due to the on-chip pulldown device. After one oscillator cycle, the amplifier gain returns to normal, thereby removing the simulated-smoke condition. After two additional IRED pulses, less than a second, the IC exits the alarm mode and returns to standby timing. MC145011 Sensors Freescale Semiconductor 5 AC Parameter (Normalized To 9.0 V Value) 1.04 1.02 Pulse Width Of IRED 1.00 Period Or Pulse Width Of Other Parameters 0.98 TA = 25°C 0.96 6.0 7.0 8.0 9.0 11.0 10.0 12.0 VDD, Power Supply Voltage (V) AC Parameter (Normalized To 25oC Value) Figure 3. AC Characteristics versus Supply 1.02 1.01 Pulse Width Of IRED 1.00 Period Or Pulse Width Of Other Parameters 0.99 VDD = 9.0 V 0.98 -10 0 10 30 20 40 50 60 TA, Ambient Temperature (°C) NOTE: Includes external component variations. See Figure 5. Figure 4. AC Characteristics versus Temperature Component Value (Normalized To 25oC Value) 1.03 1.02 1.01 10 MΩ Carbon Composition 1.00 100 kΩ Metal Film 1500 pF Dipped Mica 0.99 0.98 -10 0 10 20 30 40 50 60 TA, Ambient Temperature (°C) NOTE: These components were used to generate Figure 4. Figure 5. RC Component Variation Over Temperature MC145011 6 Sensors Freescale Semiconductor Figure 6. Standby Timing Diagram MC145011 Sensors Freescale Semiconductor 7 16 6 Power-on Reset 2 17 No Low Supply Chamber Sensitivity Ok (Continuously Illuminated) 6 7 NOTES: Numbers refer to the AC Electrical Characteristics Table. Illustration is not to scale. SILVER, BRASS Enable (Internal) LED (Pin 11) STROBE (Pin 4) IRED (Pin 6) Smoke Test (Internal) Chamber Test (Internal) Low Supply Test (Internal) OSC (Pin 12) 1 9 Chirps Indicate Low Supply 13 18 14 Chirps Indicate Degraded Chamber Sensitivity 13 Figure 7. Smoke Timing Diagram MC145011 8 Sensors Freescale Semiconductor No Smoke 4 90% 12 10% 10 11 (Remote Smoke = Don't Care) Local Smoke (EXTINGUISHED) 5 6 10 (As Output) (Not Performed) (Not Performed) NOTES: Numbers refer to the AC Electrical Characteristics Table. Illustration is not to scale. SILVER, BRASS Enable (Internal) I/O (Pin 7) LED (Pin 11) STROBE (Pin 4) IRED (Pin 6) Chamber Test (Internal) Low Supply Test (Internal) IRED 9 No Smoke 15 3 (No Local Smoke) Remote Smoke (As Input) (Continuously Illuminated) Test Push button (As Output) 4 19 8 C1 0.047 µF SW1 C2* 4700 pF V+ 1 R14 560 Ω R8 8.2 k 3 R10 4.7 k D1 IR DETECTOR 4 R12 1k D2 IR Emitter + To Other MC145011(S), Escape Light (S), Auxiliary Alarm (S), Remote Alarm (S), And/or Auto-dialer 5 6 Q1 IR Current 2 R11 250 k R9† 5k C5 100 µF + 1 TO 22 µF C4** R13* 4.7 TO 22 7 8 TEST C1 R6 100 k LOW-SUPPLY 15 TRIP C2 VSS DETECT MC145011 STROBE R1 VDD OSC IRED LED I/O Push button Test 16 FEEDBACK BRASS SILVER R7 47 k 14 13 12 R1 100 k R2 10 M C3 1500 pF D3 Visible LED R3 11 470 10 R4 9 100 k 0.01 µF C6 Horn X1 2.2 M R5 Values for R4, R5, and C6 may differ depending on type of piezoelectric horn used. * C2 and R13 are used for coarse sensitivity adjustment. Typical values are shown. † R9 is for fine sensitivity adjustment (optional). If fixed resistors are used, R8 = 12 k, R10 is 5.6 k to 10 k, and R9 is eliminated. When R9 is used, noise pickup is increased due to antenna effects. Shielding may be required. ** C4 should be 22 µF if B1 is a carbon battery. C4 could be reduced to 1 µF when an alkaline battery is used. Figure 8. Typical Application MC145011 Sensors Freescale Semiconductor 9 CALIBRATION pin with 100 µA continuously drawn out of the pin for at least one cycle on the OSC pin. To exit this mode, the Test pin is floated for at least one OSC cycle. In the calibration mode, the IRED pulse rate is increased to one for every OSC cycle. Also, Strobe is always active low. To facilitate checking the sensitivity and calibrating smoke detectors, the MC145011 can be placed in a calibration mode. In this mode, certain device pins are controlled/ reconfigure as shown in Table 5. To place the part in the calibration mode, Pin 16 (Test) must be pulled below the VSS Table 5. Configuration of Pins in the Calibration Mode Pin Description Comment 7 I/O Disabled as an output. Forcing this pin high places the photo amp output on pin 1 or 2, as determined by Low-Supply Trip. The amp's output appears as pulses and is referenced to VDD. 15 LOW-SUPPLY TRIP If the I/O pin is high, pin 15 controls which gain capacitor is used. Low: normal gain, amp output on pin 1. High: supervisory gain, amp output on pin 2. 10 FEEDBACK Driving this input high enables hysteresis (10% gain increase) in the photo amp; pin 15 must be low. 12 OSC Driving this input high brings the internal clock high. Driving the input low brings the internal clock low. If desired, the RC network for the oscillator may be left intact; this allows the oscillator to run similar to the normal mode of operation. 9 SILVER This pin becomes the smoke comparator output. When the OSC pin is toggling, positive pulses indicate that smoke has been detected. A static low level indicates no smoke. 8 BRASS This pin becomes the smoke integrator output. That is, 2 consecutive smoke detections are required for “on” (static high level) and 2 consecutive no-detections for “off” (static low level). Do Not Run Any Additional Traces In This Region C1 R14 C2 Pin 1 C2 Pin 16 R8 R11 R10 D2 MOUNTED IN CHAMBER Pin 9 Pin 8 NOTES: Illustration is bottom view of layout using a DIP. Top view for SOIC layout is mirror image. Optional potentiometer R9 is not included. Drawing is not to scale. Leads on D1, R11, R8, and R10 and their associated traces must be kept as short as possible. This practice minimizes noise pick up. Pin 3 must be decoupled from all other traces. Figure 9. Recommended PCB Layout MC145011 10 Sensors Freescale Semiconductor PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. -A16 9 1 8 B F C DIM A B C D F G H J K L M S L S SEATING PLANE -TK H G D M J 16 PL 0.25 (0.010) M T A STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. M CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE ANODE ANODE ANODE ANODE ANODE ANODE ANODE ANODE STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. INCHES MILLIMETERS MIN MAX MIN MAX 0.740 0.770 18.80 19.55 0.250 0.270 6.35 6.85 0.145 0.175 3.69 4.44 0.015 0.021 0.39 0.53 0.040 0.70 1.02 1.77 0.100 BSC 2.54 BSC 0.050 BSC 1.27 BSC 0.008 0.015 0.21 0.38 0.110 0.130 2.80 3.30 0.295 0.305 7.50 7.74 0 10 0 10 0.020 0.040 0.51 1.01 COMMON DRAIN COMMON DRAIN COMMON DRAIN COMMON DRAIN COMMON DRAIN COMMON DRAIN COMMON DRAIN COMMON DRAIN GATE SOURCE GATE SOURCE GATE SOURCE GATE SOURCE CASE 648-08 ISSUE R 16-LEAD PLASTIC DIP 0.25 8X PIN'S NUMBER M B A 10.55 10.05 2.65 2.35 0.25 0.10 16X 16 1 0.49 0.35 0.25 6 M T A B PIN 1 INDEX 14X 10.45 4 10.15 A A 8 1.27 9 7.6 7.4 T B SEATING PLANE 16X 0.1 T 5 0.75 0.25 X45˚ 0.32 0.23 1.0 0.4 SECTION A-A NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 3. DATUMS A AND B TO BE DETERMINED AT THE PLANE WHERE THE BOTTOM OF THE LEADS EXIT THE PLASTIC BODY. 4. THIS DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURRS. MOLD FLASH, PROTRUSTION OR GATE BURRS SHALL NOT EXCEED 0.15mm PER SIDE. THIS DIMENSION IS DETERMINED AT THE PLANE WHERE THE BOTTOM OF THE LEADS EXIT THE PLASTIC BODY. 5. THIS DIMENSION DOES NOT INCLUDE INTER-LEAD FLASH OR PROTRUSIONS. INTER-LEAD FLASH AND PROTRUSIONS SHALL NOT EXCEED 0.25mm PER SIDE. THIS DIMENSION IS DETERMINED AT THE PLANE WHERE THE BOTTOM OF THE LEADS EXIT THE PLASTIC BODY. 6. THIS DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.62mm. 7˚ 0˚ CASE 751G-04 ISSUE D 16-LEAD SOIC MC145011 Sensors Freescale Semiconductor 11 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] RoHS-compliant and/or Pb-free versions of Freescale products have the functionality and electrical characteristics of their non-RoHS-compliant and/or non-Pb-free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. 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