FREESCALE MPXH6101A

Freescale Semiconductor
Technical Data
MPX4101A
Rev 6, 12/2006
Integrated Silicon Pressure Sensor
for Manifold Absolute Pressure
Applications On-Chip Signal
Conditioned, Temperature
Compensated and Calibrated
MPX4101A
MPXA4101A
MPXH6101A
SERIES
The Freescale MPX4101A/MPXA4101A/MPXH6101A series Manifold
Absolute Pressure (MAP) sensor for engine control is designed to sense
absolute air pressure within the intake manifold. This measurement can be used
to compute the amount of fuel required for each cylinder. The small form factor
and high reliability of on-chip integration makes the Freescale MAP sensor a
logical and economical choice for automotive system designers.
The MPX4101A/MPXA4101A/MPXH6101A series piezoresistive transducer
is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This
sensor combines advanced micromachining techniques, thin film metallization,
and bipolar semiconductor processing to provide an accurate, high level analog
output signal that is proportional to applied pressure.
INTEGRATED
PRESSURE SENSOR
15 TO 102 kPA
(2.18 TO 14.8 psi)
0.25 TO 4.95 V OUTPUT
UNIBODY PACKAGE
Features
• 1.72% Maximum Error Over 0° to 85°C
• Specifically Designed for Intake Manifold Absolute Pressure Sensing in
Engine Control Systems
• Temperature Compensated Over –40°C to +125°C
• Durable Epoxy Unibody Element or Thermoplastic (PPS) Surface Mount Package
Typical Applications
• Manifold Sensing for Automotive Systems
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
• Also Ideal for Non-Automotive Applications
MPX4101A
CASE 867-O8
SMALL OUTLINE PACKAGE
UNIBODY PACKAGE PIN NUMBERS(1)
1
VOUT
4
N/C
2
3
GND
VS
5
6
N/C
N/C
MPXA4101AC6U
CASE 482A-01
1. Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or
ground. Pin 1 is noted by the notch in the lead.
SMALL OUTLINE PACKAGE
PIN NUMBERS(1)
SUPER SMALL OUTLINE PACKAGE
SUPER SMALL OUTLINE PACKAGE
PIN NUMBERS(1)
1
2
N/C
VS
5
6
N/C
N/C
1
2
N/C
VS
5
6
N/C
N/C
3
4
GND
VOUT
7
8
N/C
N/C
3
4
GND
VOUT
7
8
N/C
N/C
MPXH6101A6U/6T1
CASE 1317-04
1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the notch in the lead.
ORDERING INFORMATION
Device Type
Options
Case No.
UNIBODY PACKAGE (MPX4101A SERIES)
Basic Element
Absolute, Element Only
867
SMALL OUTLINE PACKAGE (MPXA4101A SERIES)
Ported Element
Absolute, Axial Port
482A
SUPER SMALL OUTLINE PACKAGE (MPXA6101A SERIES)
Basic Element
Absolute, Element Only
1317
Absolute, Element Only
1317
© Freescale Semiconductor, Inc., 2006. All rights reserved.
MPX Series Order No.
Packing Options
MPX4101A
—
Device Marking
MPX4101A
MPXA4101AC6U
Rails
MPXA4101A
MPXH6101A6U
MPXH6101A6T1
Rails
Tape and Reel
MPXH6101A
MPXH6101A
VS
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
GND
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Vout
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for small outline package devices.
Pins 4, 5, and 6 are NO CONNECTS for
unibody devices.
Figure 1. Temperature Compensated and Calibrated Pressure Sensor Schematic
Table 1. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
PMAX
400
kPa
Storage Temperature
TSTG
Operating Temperature
TA
°C
-40 to +125
-40 to +125
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX4101A
2
Sensors
Freescale Semiconductor
Table 2. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2.
Decoupling circuit shown in Figure 3 required to meet electrical specifications.)
Characteristic
Pressure Range
Symbol
Min
Typ
Max
Unit
POP
15
—
102
kPa
VS
4.85
5.1
5.35
Vdc
Io
—
7.0
10
mAdc
(0 to 85°C)
Voff
0.171
0.252
0.333
Vdc
(0 to 85°C)
VFSO
4.870
4.951
5.032
Vdc
(0 to 85°C)
VFSS
—
4.7
—
Vdc
(0 to 85°C)
—
—
—
±1.72
%VFSS
(1)
(2)
Supply Voltage
Supply Current
Minimum Pressure Offset @ VS = 5.1 Volts
Full Scale Output @ VS = 5.1 Volts
Full Scale Span @ VS = 5.1 Volts
(3)
(4)
(5)
Accuracy(6)
Sensitivity
V/P
—
54
—-
mV/kPa
Response Time(7)
tR
—
15
—-
ms
Output Source Current at Full Scale Output
Io+
—
0.1
—-
mAdc
Warm-Up Time(8)
—
—
20
—-
ms
Offset Stability(9)
—
—
±0.5
—-
%VFSS
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
• TcSpan:
Output deviation over the temperature range of 0 to 85°C, relative to 25°C.
• TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX4101A
Sensors
Freescale Semiconductor
3
ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION
Figure 2 illustrates an absolute sensing chip in the super
small outline package (Case 1317).
Figure 4 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C. The output will saturate outside of the specified
pressure range.
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the sensor diaphragm. The MPX4101A/
MPXA4101A/MPXH6101A series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Die
Fluoro Silicone
Gel Die Coat
Stainless
Steel Cap
P1
Thermoplastic Case
Wire Bond
Lead Frame
Absolute Element
Die Bond
Sealed Vacuum Reference
Figure 2. Cross Sectional Diagram SSOP (not to scale)
5.0
+5.1 V
4.5
4.0
MPXH6101A
to ADC
Vout Pin 4
100 nF
GND Pin 3
47 pF
51 K
Output (Volts)
3.5
VS Pin 2
3.0
2.5
Transfer Function:
Vout = Vs* (PX0.01059*P-0.10941) ± Error
VS = 5.1 Vdc
Temperature = 0 to 85°C
20 kPa to 105 kPa
MPX4101A
TYP
2.0
1.5
1.0
MAX
MIN
0.5
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
110
0
Pressure (ref: to sealed vacuum) in kPa
Figure 3. Recommended Power Supply Decoupling and
Output Filtering
Figure 4. Output versus Absolute Pressure
MPX4101A
4
Sensors
Freescale Semiconductor
Transfer Function (MPX4101A, MPXA4101A, MPXH6101A)
Nominal Transfer Value: Vout = VS (P x 0.01059 - 0.10941)
± (Pressure Error x Temp. Factor x 0.01059 x VS)
VS = 5.1 V ± 0.25 Vdc
Temperature Error Band
MPX4101A, MPXA4101A MPXH6101A SERIES
4.0
Temp
3.0
Temperature
Error
Factor
Multiplier
-40
0 to 85
+125
2.0
3
1
3
1.0
0.0
–40
–20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C.
Pressure Error Band
Error Limits for Pressure
3.0
Pressure Error (kPa)
2.0
1.0
0.0
0
15
30
45
60
75
90
105
120
Pressure (in kPa)
–1.0
–2.0
–3.0
Pressure
Error (Max)
15 to 102 (kPa)
±1.5 (kPa)
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel
which protects the die from harsh media. The Freescale
pressure sensor is designed to operate with positive
differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Part Number
MPX4101A
Case Type
867
Pressure (P1)
Side Identifier
Stainless Steel Cap
MPXA4101AC6U
482A
Side with Port Attached
MPXH6101A6U
1317
Stainless Steel Cap
MPXH6101A6T1
1317
Stainless Steel Cap
MPX4101A
Sensors
Freescale Semiconductor
5
INFORMATION FOR USING THE SMALL OUTLINE PACKAGES
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
footprint, the packages will self align when subjected to a
design. The footprint for the surface mount packages must be
solder reflow process. It is always recommended to design
the correct size to ensure proper solder connection interface
boards with a solder mask layer to avoid bridging and
between the board and the package. With the correct
shorting between solder pads.
0.100 TYP 8X
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
inch
mm
0.100 TYP 8X
2.54
SCALE 2:1
Figure 5. SOP Footprint (Case 482)
0.050
1.27
TYP
0.387
9.83
0.150
3.81
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
Figure 6. SSOP Footprint (Case 1317)
MPX4101A
6
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
-A-
D
8 PL
4
0.25 (0.010)
5
N
T B
M
S
A
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
-BG
8
1
S
W
V
C
H
J
-T-
INCHES
MIN
MAX
0.415 0.425
0.415 0.425
0.500 0.520
0.038 0.042
0.100 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0˚
7˚
0.444 0.448
0.709 0.725
0.245 0.255
0.115 0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0˚
7˚
11.28
11.38
18.01
18.41
6.22
6.48
2.92
3.17
SEATING
PLANE
PIN 1 IDENTIFIER
M
K
DIM
A
B
C
D
G
H
J
K
M
N
S
V
W
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
C
R
POSITIVE PRESSURE
(P1)
M
B
-AN
PIN 1
SEATING
PLANE
1
2
3
4
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
DIM
A
B
C
D
F
G
J
L
M
N
R
S
L
6
-TG
J
S
F
D 6 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
VOUT
GROUND
VCC
V1
V2
VEX
STYLE 2:
PIN 1.
2.
3.
4.
5.
6.
OPEN
GROUND
-VOUT
VSUPPLY
+VOUT
OPEN
M
T A
M
STYLE 3:
PIN 1.
2.
3.
4.
5.
6.
INCHES
MILLIMETERS
MAX
MIN
MAX MIN
0.595
0.630 15.11
16.00
0.514
0.534 13.06
13.56
0.200
0.220
5.08
5.59
0.027
0.033
0.68
0.84
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016
0.36
0.40
0.695
0.725 17.65
18.42
30˚ NOM
30˚ NOM
12.57
0.475
0.495 12.07
0.430
0.450 10.92
11.43
0.090
0.105
2.29
2.66
OPEN
GROUND
+VOUT
+VSUPPLY
-VOUT
OPEN
CASE 867-08
ISSUE N
UNIBODY PACKAGE
MPX4101A
Sensors
Freescale Semiconductor
7
PACKAGE DIMENSIONS
PAGE 1 OF 3
CASE 1317-04
ISSUE F
SUPER SMALL OUTLINE PACKAGE
MPX4101A
8
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 2 OF 3
CASE 1317-04
ISSUE F
SUPER SMALL OUTLINE PACKAGE
MPX4101A
Sensors
Freescale Semiconductor
9
PACKAGE DIMENSIONS
PAGE 3 OF 3
CASE 1317-04
ISSUE F
SUPER SMALL OUTLINE PACKAGE
MPX4101A
10
Sensors
Freescale Semiconductor
NOTES
MPX4101A
Sensors
Freescale Semiconductor
11
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MPX4101A
Rev. 6
12/2006
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