FREESCALE MPXV10GC6T1

Freescale Semiconductor
Technical Data
MPX10
Rev 12, 01/2007
10 kPa Uncompensated
Silicon Pressure Sensors
The MPX10 and MPXV10GC series devices are silicon piezoresistive
pressure sensors providing a very accurate and linear voltage output — directly
proportional to the applied pressure. These standard, low cost, uncompensated
sensors permit manufacturers to design and add their own external temperature
compensation and signal conditioning networks. Compensation techniques are
simplified because of the predictability of Freescale's single element strain gauge
design. Figure 1 shows a schematic of the internal circuitry on the stand-alone
pressure sensor chip.
Features
• Low Cost
• Patented Silicon Shear Stress Strain Gauge Design
• Ratiometric to Supply Voltage
• Easy to Use Chip Carrier Package Options
• Differential and Gauge Options
• Durable Epoxy Unibody Element or Thermoplastic (PPS) Surface Mount Package
Functional Description
• Air Movement Control
• Environmental Control Systems
• Level Indicators
• Leak Detection
• Medical Instrumentation
• Industrial Controls
• Pneumatic Control Systems
• Robotics
MPX10
MPXV10GC
SERIES
UNCOMPENSATED PRESSURE
SENSOR
0 TO 10 kPA (0–1.45 psi)
35 mV FULL SCALE SPAN
(TYPICAL)
SMALL OUTLINE PACKAGES
MPXV10GC6U
CASE 482A-01
MPXV10GC7U
CASE 482C-03
SMALL OUTLINE PACKAGE
PIN NUMBERS
ORDERING INFORMATION(1)
Device Type
Options
Case No.
Order Number
SMALL OUTLINE PACKAGE (MPXV10G SERIES)
Ported
Rails
482A
MPXV10GC6U
Elements
Tape and Reel
482A
MPXV10GC6T1
Rails
482C
MPXV10GC7U
UNIBODY PACKAGE (MPX10 SERIES)
Basic
Differential
344
MPX10D
Element
Ported
Differential
344C
MPX10DP
Elements
Gauge
344B
MPX10GP
Gauge
344E
MPX10GS
Device Marking
MPXV10G
MPXV10G
MPXV10G
MPX10D
1
GND
5
N/C
2
+Vout
6
N/C
3
Vs
7
N/C
4
–Vout
8
N/C
NOTE: Pin 1 is noted by the notch in the lead.
UNIBODY PACKAGE PIN NUMBERS
1
GND
3
Vs
2
+Vout
4
–Vout
NOTE: Pin 1 is noted by the notch in the lead.
MPX10DP
MPX10GP
MPX10D
1. MPX10 series pressure sensors are available in differential and gauge configurations.
Devices are available in the basic element package or with pressure port fittings which
provide printed circuit board mounting ease and barbed hose pressure connections.
UNIBODY PACKAGES
MPX10D
CASE 344-15
MPX10GP
CASE 344B-01
© Freescale Semiconductor, Inc., 2007. All rights reserved.
MPX10DP
CASE 344C-01
MPX10GS
CASE 344E-01
3
+VS
2
Sensing
Element
4
+VOUT
–VOUT
1
GND
Figure 1. Uncompensated Pressure Sensor Schematic
VOLTAGE OUTPUT VERSUS APPLIED DIFFERENTIAL PRESSURE
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
side (P1) relative to the vacuum side (P2). Similarly, output
voltage increases as increasing vacuum is applied to the
vacuum side (P2) relative to the pressure side (P1).
Table 1. Maximum Ratings(1)
Rating
Maximum Pressure (P1 > P2)
Burst Pressure (P > P2)
Storage Temperature
Operating Temperature
Symbol
Value
Unit
PMAX
75
kPa
PBURST
100
kPa
TSTG
–40 to +125
°C
TA
–40 to +125
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX10
2
Sensors
Freescale Semiconductor
Table 2. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Units
POP
0
—
10
kPa
VS
—
3.0
6.0
VDC
IO
—
6.0
—
mAdc
Full Scale Span(3)
VFSS
20
35
50
mV
Offset(4)
VOFF
0
20
35
mV
Sensitivity
∆V/∆Ρ
—
3.5
—
mV/kPa
Linearity(5)
—
–1.0
—
1.0
%VFSS
—
—
±0.1
—
%VFSS
—
—
±0.5
—
%VFSS
TCVFSS
–0.22
—
–0.16
%VFSS/°C
TCVOFF
—
±15
—
µV/°C
TCR
0.28
—
0.34
%/ZIN/°C
ZIN
400
—
550
Ω
ZOUT
750
—
1250
Ω
Response Time(6) (10% to 90%)
tR
—
1.0
—
ms
Warm-Up Time(7)
—
—
20
—
ms
—
—
±0.5
—
%VFSS
Differential Pressure Range
Supply
(1)
Voltage(2)
Supply Current
Pressure Hysteresis(5) (0 to 10 kPa)
Temperature
Hysteresis(5)
(–40°C to +125°C)
Temperature Coefficient of Full Scale Span
(5)
Temperature Coefficient of Offset(5)
Temperature Coefficient of Resistance(5)
Input Impedance
Output Impedance
Offset
Stability(8)
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum related pressure.
4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
•
•
•
•
•
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:
Output deviation at any pressure with the specified range, when this pressure is cycled to and from the minimum
or maximum rated pressure at 25°C.
TcSpan:
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative
to 25°C.
TCR:
ZIN deviation with minimum rated pressure applied, over the temperature range of -40°C to ±125°C, relative to 25°C.
6. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized.
8. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX10
Sensors
Freescale Semiconductor
3
TEMPERATURE COMPENSATION
Figure 2 shows the typical output characteristics of the
MPX10 and MPXV10GC series over temperature.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to
differences in the thermal expansion of the strain gauge and
the diaphragm, as are often encountered in bonded strain
gauge pressure sensors. However, the properties of the
strain gauge itself are temperature dependent, requiring that
the device be temperature compensated if it is to be used
over an extensive temperature range.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components,
or by designing your system using the MPX2010D series
sensor.
Several approaches to external temperature
compensation over both –40 to +125°C and 0 to +80°C
ranges are presented in Application Note AN840.
LINEARITY
Linearity refers to how well a transducer’s output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range (Figure 3). There are two basic methods for
calculating nonlinearity: 1) end point straight line fit or 2) a
least squares best line fit. While a least squares fit gives the
“best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
80
70
VS = 3 VDC
P1 > P2
Output (mVdc)
60
+25°C
-40°C
50
Span
Range
(Typ)
40
30
+125°C
20
Offset
(Typ)
10
0
PSI 0
0.3
kPa
2.0
0.6
0.9
4.0
6.0
1.2
1.5
8.0
10
Pressure Differential
Figure 2. Output versus Pressure Differential
70
Linearity
60
Output (mVdc)
50
Actual
Span
(VFSS)
40
30
Theoretical
20
Offset
(Voff)
10
0
0
Pressure (kPA)
Max
POP
Figure 3. Linearity Specification Comparison
MPX10
4
Sensors
Freescale Semiconductor
Silicone
Die Coat
Stainless Steel
Metal Cover
Die
P1
Epoxy
Case
Wire Bond
RTV Die
Bond
Lead Frame
P2
Figure 4. Unibody Package — Cross-Sectional Diagram (Not to Scale)
Figure 4 illustrates the differential or gauge configuration
in the basic chip carrier (Case 344). A silicone gel isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
The MPX10 and MPXV10GC series pressure sensor
operating characteristics and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media other than dry air may have adverse effects on
sensor performance and long term reliability. Contact the
factory for information regarding media compatibility in your
application.
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The Freescale
pressure sensor is designed to operate with positive
differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table.
Part Number
MPX10D
Case Type
344
Pressure (P1) Side Identifier
Stainless Steep Cap
MPX10DP
344C
Side with Part Marking
MPX10GP
344B
Side with Port Attached
MPX10GS
344E
Side with Port Attached
MPXV10GC6U
482A
Side with Part Marking
MPXV10GC7U
482C
Side with Part Marking
MPX10
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
C
R
M
1
B
2
-A-
Z
4
3
DIM
A
B
C
D
F
G
J
L
M
N
R
Y
Z
N
L
1 2 3 4
PIN 1
-TSEATING
PLANE
J
F
G
F
Y
D 4 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
M
T A
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
M
STYLE 2:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
STYLE 3:
PIN 1.
2.
3.
4.
VCC
- SUPPLY
+ SUPPLY
GROUND
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
0.595
0.630 15.11
16.00
0.514
0.534 13.06
13.56
0.200
0.220
5.08
5.59
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016
0.36
0.40
0.695
0.725 17.65
18.42
30˚ NOM
30˚ NOM
0.475
0.495 12.07
12.57
0.430
0.450 10.92
11.43
0.048
0.052
1.22
1.32
0.106
0.118
2.68
3.00
GND
-VOUT
VS
+VOUT
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-A-
-T-
U
L
R
H
N
PORT #1
POSITIVE
PRESSURE
(P1)
-Q-
B
1 2 3 4
PIN 1
K
-P0.25 (0.010)
J
M
T Q
S
S
F
C
G
D 4 PL
0.13 (0.005)
M
T S
S
Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
1.145
1.175
29.08
29.85
0.685
0.715
17.40
18.16
0.305
0.325
7.75
8.26
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65
18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67
11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.230
0.250
5.84
6.35
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
MPX10
6
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-AU
V
PORT #1
R
W
L
H
PORT #2
PORT #1
POSITIVE PRESSURE
(P1)
PORT #2
VACUUM
(P2)
N
-QB
SEATING
PLANE
SEATING
PLANE
1 2 3 4
PIN 1
K
-P-T-
0.25 (0.010)
-T-
M
T Q
S
S
F
J
G
D 4 PL
C
0.13 (0.005)
M
T S
S
Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
V
W
INCHES
MILLIMETERS
MIN
MAX
MIN MAX
1.145
1.175
29.08 29.85
0.685
0.715
17.40 18.16
0.405
0.435
10.29 11.05
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65 18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67 11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.063
0.083
1.60
2.11
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
0.248
0.278
6.30
7.06
0.310
0.330
7.87
8.38
STYLE 1:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
C
PORT #1
POSITIVE
PRESSURE
(P1)
-B-
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
A
BACK SIDE
VACUUM
(P2)
DIM
A
B
C
D
F
G
J
K
N
R
S
V
V
4 3
2 1
PIN 1
K
J
N
R
SEATING
PLANE
S
-T-
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
0.690
0.720 17.53
18.28
0.245
0.255 6.22
6.48
0.780
0.820 19.81
20.82
0.016
0.020 0.41
0.51
0.048
0.064 1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016 0.36
0.41
0.345
0.375 8.76
9.53
0.300
0.310 7.62
7.87
0.178
0.186 4.52
4.72
0.220
0.240 5.59
6.10
0.182
0.194 4.62
4.93
G
F
D 4 PL
0.13 (0.005)
M
T B
M
STYLE 1:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
CASE 344E-01
ISSUE B
UNIBODY PACKAGE
MPX10
Sensors
Freescale Semiconductor
7
PACKAGE DIMENSIONS
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE
MPX10
8
Sensors
Freescale Semiconductor
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MPX10
Rev. 12
01/2007
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