Freescale Semiconductor Technical Data MPX53 Rev 4, 01/2007 50 kPa Uncompensated Silicon Pressure Sensors The MPX53/MPXV53GC series silicon piezoresistive pressure sensors provide a very accurate and linear voltage output — directly proportional to the applied pressure. These standard, low cost, uncompensated sensors permit manufacturers to design and add their own external temperature compensating and signal conditioning networks. Compensation techniques are simplified because of the predictability of Freescale's single element strain gauge design. Features • Low Cost • Patented Silicon Shear Stress Strain Gauge Design • Ratiometric to Supply Voltage • Easy to Use Chip Carrier Package Options • 60 mV Span (Typ) • Differential and Gauge Options MPXV53GC6U CASE 482A-01 ORDERING INFORMATION Options Case No. MPX Series Order No. Packing Options Device Marking SMALL OUTLINE PACKAGE(1) (MPXV53 SERIES) Ported Gauge, Side Port, SMT 482A Elements 482A 482C UNCOMPENSATED PRESSURE SENSOR 0 TO 50 kPA (0 – 7.25 psi) 60 mV FULL SCALE SPAN (TYPICAL) SMALL OUTLINE PACKAGES Typical Applications • Air Movement Control • Environmental Control Systems • Level Indicators • Leak Detection • Medical Instrumentation • Industrial Controls • Pneumatic Control Systems • Robotics Device Type MPX53 MPXV53GC SERIES MPXV53GC7U CASE 482C-03 SMALL OUTLINE PACKAGE PIN NUMBERS 1 GND(1) 5 N/C MPXV53GC6T1 Tape & Rail MPXV53G 2 +VOUT 6 N/C MPXV53GC6U Rails MPXV53G 3 VS 7 N/C MPXV53GC7U Rails MPXV53G 4 –VOUT 8 N/C UNIBODY PACKAGE(2) (MPX53 SERIES) Differential Basic Element 344 MPX53D — MPX53D Differential Ported Elements Gauge 344C MPX53DP — MPX53DP 344B MPX53GP — MPX53GP 1. The MPXV53GC series pressure sensors are available with a pressure port, surface mount, or DIP leadforms and two packing options. 2. MPX53 series pressure sensors are available in differential and gauge configurations. Devices are available with basic element package or with pressure port fittings, providing printed circuit board mounting ease and barbed hose pressure. 1. Pin 1 in noted by the notch in the lead. UNIBODY PACKAGE PIN NUMBERS 1 GND(1) 3 VS 2 +VOUT 4 –VOUT 1. Pin 1 in noted by the notch in the lead. UNIBODY PACKAGES MPX53D CASE 344-15 © Freescale Semiconductor, Inc., 2007. All rights reserved. MPX53GP CASE 344B-01 MPX53DP CASE 344C-01 +VS Sensor +VOUT -VOUT GND Figure 1. Uncompensated Pressure Sensor Schematic VOLTAGE OUTPUT VERSUS APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the sensor is directly proportional to the differential the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). Figure 1 shows a schematic of the internal circuitry on the stand-alone pressure sensor chip. Table 1. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) PMAX 200 kPa Storage Temperature TSTG –40 to +125 °C TA –40 to +125 °C Operating Temperature 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. MPX53 2 Sensors Freescale Semiconductor Table 2. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Pressure Supply Range(1) Voltage(2) Supply Current Full Scale Span(3) Symbol Min Typ Max Units POP 0 — 50 kPa VS — 3.0 6.0 VDC IO — 6.0 — mAdc VFSS 45 60 90 mV Offset(4) VOFF 0 20 35 mV Sensitivity ∆V/∆Ρ — 1.2 — mV/kPa Linearity(5) — –0.6 — 0.4 %VFSS — — ±0.1 — %VFSS — — ±0.5 — %VFSS TCVFSS –0.22 — -0.16 %VFSS/°C TCVOFF — ±15 — µV/°C TCR 0.31 — 0.37 %ZIN/°C ZIN 355 — 505 Ω ZOUT 750 — 1875 Ω tR — 1.0 — ms — — 2.0 — ms — — ±0.5 — %VFSS Pressure Hysteresis(5) (0 to 50 kPa) (5) Temperature Hysteresis (–40°C to +125°C) Temperature Coefficient of Full Scale Temperature Coefficient of Span(5) Offset(5) Temperature Coefficient of Resistance Input Impedance Output Impedance Response Time (6) (10% to 90%) Warm-Up Time Offset Stability(7) (5) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum related pressure. 4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 6. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX53 Sensors Freescale Semiconductor 3 TEMPERATURE COMPENSATION Figure 2 shows the typical output characteristics of the MPX53/MPXV53GC series over temperature. The piezoresistive pressure sensor element is a semiconductor device which gives an electrical output signal proportional to the pressure applied to the device. This device uses a unique transverse voltage diffused semiconductor strain gauge which is sensitive to stresses produced in a thin silicon diaphragm by the applied pressure. Because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors. However, the properties of the strain gauge itself are temperature dependent, requiring that the device be temperature compensated if it is to be used over an extensive temperature range. Temperature compensation and offset calibration can be achieved rather simply with additional resistive components, or by designing your system using the MPX2053 series sensors. Several approaches to external temperature compensation over both –40 to +125°C and 0 to +80°C ranges are presented in Freescale Application Note AN840. 100 MPX53 VS = 3 Vdc P1 > P2 Output (mVdc) 90 80 70 +25°C –40°C 60 50 40 Span Range (Typ) +125×C 30 20 10 0 PSI 0 kPa 0 Offset (Typ) 1 10 2 3 4 5 6 20 30 40 Pressure Differential 7 50 8 Figure 2. Output vs. Pressure Differential Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Freescale’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range (see Figure 3). There are two basic methods for calculating nonlinearity: (1) end point straight line fit or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. 90 Linearity 80 70 Actual 60 Span (VFSS) Output (mVdc) 50 40 Theoretical 30 20 Offset (VOFF) 10 0 0 Pressure (kPA) MAX POP Figure 3. Linearity Specification Comparison MPX53 4 Sensors Freescale Semiconductor Silicone Die Coat Stainless Steel Metal Cover Die P1 Epoxy Case Wire Bond RTV Die Bond Lead Frame P2 Figure 4. Unibody Package: Cross Sectional Diagram (Not to Scale) Figure 4 illustrates the differential or gauge configuration in the unibody chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX53/MPXV53GC series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Freescale MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table. Part Number MPX53D MPX53DP MPX53GP MPX53GC Series Case Type 344 Pressure (P1) Side Identifier Stainless Steep Cap 344C Side with Port Marking 344B Side with Port Attached 482A, 482C Side with Port Attached MPX53 Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). C R M 1 B -A- 2 Z 4 3 DIM A B C D F G J L M N R Y Z N L 1 2 3 4 PIN 1 -TSEATING PLANE J F G F D 4 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. Y M T A DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL M STYLE 2: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT STYLE 3: PIN 1. 2. 3. 4. VCC - SUPPLY + SUPPLY GROUND INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30˚ NOM 30˚ NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.048 0.052 1.22 1.32 0.106 0.118 2.68 3.00 GND -VOUT VS +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -A- -T- U L R H N PORT #1 POSITIVE PRESSURE (P1) -Q- B 1 2 3 4 PIN 1 K -P0.25 (0.010) J M T Q S S F C G D 4 PL 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX53 6 Sensors Sensors FreescaleSemiconductor Semiconductor Freescale PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -AU V PORT #1 R W L H PORT #2 PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) N -QB SEATING PLANE SEATING PLANE 1 2 3 4 PIN 1 K -P-T- -T- 0.25 (0.010) M T Q S S F J G D 4 PL C 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U V W INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.063 0.083 1.60 2.11 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC 0.248 0.278 6.30 7.06 0.310 0.330 7.87 8.38 STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE MPX53 Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE MPX53 8 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. 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