FREESCALE XC56309VF100A

Freescale Semiconductor
Technical Data Advance Information
DSP56309
Rev. 7, 2/2005
DSP56309
24-Bit Digital Signal Processor
16
6
6
3
The DSP56309 is intended
for applications benefiting
from a large amount of
internal memory, such as
wireless infrastructure
applications.
Memory Expansion Area
Peripheral
Expansion Area
X Data
RAM
7168 × 24
bits
(default)
PrograM
RAM
20480 × 24
bits
(default)
Address
Generation
Unit
Six-Channel
DMA Unit
YAB
XAB
PAB
DAB
Y Data
RAM
7168 × 24
bits
(default)
YM_EB
SCI
XM_EB
ESSI
PM_EB
HI08
PIO_EB
Triple
Timer
External
Bus
13
Interface
and Inst.
Cache Control
Control
24-Bit
Bootstrap
ROM
DSP56300
Core
DDB
YDB
XDB
PDB
GDB
Internal
Data
Bus
Switch
18
External
Address
Bus
Address
Switch
External
Data Bus
Switch
EXTAL
XTAL
Clock
Generator
PLL
Program
Interrupt
Controller
Program
Decode
Controller
Program
Address
Generator
Data ALU
24 × 24 + 56 →56-bit MAC
Two 56-bit Accumulators
56-bit Barrel Shifter
Power
Management
24
What’s New?
Data
5
Rev. 7 includes the following
changes:
• Adds lead-free packaging and
part numbers.
JTAG
OnCE™
DE
2
RESET
PINIT/NMI
MODA/IRQA
MODB/IRQB
MODC/IRQC
MODD/IRQD
Figure 1. DSP56309 Block Diagram
The DSP56309 is a member of the DSP56300 core family of programmable CMOS DSPs. The DSP56300 core
includes a barrel shifter, 24-bit addressing, an instruction cache, and direct memory access (DMA). The DSP56309
offers 100 MMACS at 3.0–3.6 V using an internal 100 MHz clock. The large internal memory is ideal for wireless
infrastructure and wireless local-loop applications. The DSP56300 core family offers a new level of performance in
speed and power provided by its rich instruction set and low-power dissipation, thus enabling a new generation of
wireless, multimedia, and telecommunications products.
Note: This document contains information on a new product. Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 1996, 2005. All rights reserved.
Table of Contents
Data Sheet Conventions .......................................................................................................................................ii
Features...............................................................................................................................................................iii
Target Applications ............................................................................................................................................. iv
Product Documentation ......................................................................................................................................iv
Chapter 1
Signals/Connections
1.1
1.2
1.3
1.5
1.6
1.7
1.8
1.9
1.10
1.11
1.12
Chapter 2
Specifications
2.1
2.3
2.4
2.5
Chapter 3
TQFP Package Description...............................................................................................................................3-2
TQFP Package Mechanical Drawing................................................................................................................3-9
MAP-BGA Package Description ....................................................................................................................3-10
MAP-BGA Package Mechanical Drawing .....................................................................................................3-18
Design Considerations
4.1
4.2
4.3
4.4
4.5
Appendix A
Maximum Ratings.............................................................................................................................................2-1
Thermal Characteristics ....................................................................................................................................2-2
DC Electrical Characteristics............................................................................................................................2-2
AC Electrical Characteristics............................................................................................................................2-3
Packaging
3.1
3.2
3.3
3.4
Chapter 4
Power ................................................................................................................................................................1-3
Ground ..............................................................................................................................................................1-3
Clock.................................................................................................................................................................1-4
External Memory Expansion Port (Port A) ......................................................................................................1-4
Interrupt and Mode Control ..............................................................................................................................1-7
Host Interface (HI08)........................................................................................................................................1-8
Enhanced Synchronous Serial Interface 0 (ESSI0) ........................................................................................1-11
Enhanced Synchronous Serial Interface 1 (ESSI1) ........................................................................................1-12
Serial Communication Interface (SCI) ...........................................................................................................1-14
Timers .............................................................................................................................................................1-15
JTAG and OnCE Interface ..............................................................................................................................1-16
Thermal Design Considerations........................................................................................................................4-1
Electrical Design Considerations......................................................................................................................4-2
Power Consumption Considerations.................................................................................................................4-3
PLL Performance Issues ...................................................................................................................................4-4
Input (EXTAL) Jitter Requirements .................................................................................................................4-5
Power Consumption Benchmark
Data Sheet Conventions
OVERBAR
“asserted”
“deasserted”
Examples:
Indicates a signal that is active when pulled low (For example, the RESET pin is active when
low.)
Means that a high true (active high) signal is high or that a low true (active low) signal is low
Means that a high true (active high) signal is low or that a low true (active low) signal is high
Signal/Symbol
Logic State
Signal State
PIN
True
Asserted
PIN
False
Deasserted
PIN
True
Asserted
PIN
False
Deasserted
Note: Values for VIL, VOL, VIH, and VOH are defined by individual product specifications.
Voltage
VIL/VOL
VIH /VOH
VIH /VOH
VIL/VOL
DSP56309 Technical Data, Rev. 7
ii
Freescale Semiconductor
Features
Table 1 lists the features of the DSP56309 device.
Table 1. DSP56309 Features
Feature
Description
High-Performance
DSP56300 Core
• 100 million multiply-accumulates per second (MMACS) with a 100 MHz clock at 3.3 V nominal
• Data arithmetic logic unit (Data ALU) with fully pipelined 24 × 24-bit parallel multiplier-accumulator (MAC),
56-bit parallel barrel shifter (fast shift and normalization; bit stream generation and parsing), conditional
ALU instructions, and 24-bit or 16-bit arithmetic support under software control
• Program control unit (PCU) with position-independent code (PIC) support, addressing modes optimized for
DSP applications (including immediate offsets), internal instruction cache controller, internal memoryexpandable hardware stack, nested hardware DO loops, and fast auto-return interrupts
• Direct memory access (DMA) with six DMA channels supporting internal and external accesses; one-, twoand three-dimensional transfers (including circular buffering); end-of-block-transfer interrupts; and
triggering from interrupt lines and all peripherals
• Phase-lock loop (PLL) allows change of low-power divide factor (DF) without loss of lock and output clock
with skew elimination
• Hardware debugging support including On-Chip Emulation (OnCE‘) module, Joint Test Action Group
(JTAG) test access port (TAP)
Internal Peripherals
• Enhanced 8-bit parallel host interface (HI08) supports a variety of buses (for example, ISA) and provides
glueless connection to a number of industry-standard microcomputers, microprocessors, and DSPs
• Two enhanced synchronous serial interfaces (ESSI), each with one receiver and three transmitters (allows
six-channel home theater)
• Serial communications interface (SCI) with baud rate generator
• Triple timer module
• Up to thirty-four programmable general-purpose input/output (GPIO) pins, depending on which peripherals
are enabled
• 192 × 24-bit bootstrap ROM
• 8 K × 24-bit RAM total
• Program RAM, instruction cache, X data RAM, and Y data RAM sizes are programmable:
Internal Memories
External Memory
Expansion
Power Dissipation
Packaging
Program RAM
Size
Instruction
Cache Size
X Data RAM
Size
Y Data RAM
Size
Instruction
Cache
Switch Mode
20480 × 24 bits
0
7168 × 24 bits
7168 × 24 bits
disabled
disabled
19456 × 24 bits
1024 × 24-bit
7168 × 24 bits
7168 × 24 bits
enabled
disabled
24576 × 24 bits
0
5120 × 24 bits
5120 × 24 bits
disabled
enabled
23552 × 24 bits
1024 × 24-bit
5120 × 24 bits
5120 × 24 bits
enabled
enabled
• Data memory expansion to two 256 K × 24-bit word memory spaces using the standard external address
lines
• Program memory expansion to one 256 K × 24-bit words memory space using the standard external
address lines
• External memory expansion port
• Chip select logic for glueless interface to static random access memory (SRAMs)
• Internal DRAM Controller for glueless interface to dynamic random access memory (DRAMs)
•
•
•
•
Very low-power CMOS design
Wait and Stop low-power standby modes
Fully static design specified to operate down to 0 Hz (dc)
Optimized power management circuitry (instruction-dependent, peripheral-dependent, and modedependent)
• 144-pin TQFP package in lead-free or lead-bearing versions
• 196-pin molded array plastic-ball grid array (MAP-BGA) package in lead-free or lead-bearing versions
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
iii
Target Applications
The DSP56309 is intended for applications benefiting from a large amount of internal memory, such as wireless
infrastructure applications.
Product Documentation
The documents listed in Table 2 are required for a complete description of the DSP56309 device and are necessary
to design properly with the part. Documentation is available from a local Freescale distributor, a Freescale
semiconductor sales office, or a Freescale Semiconductor Literature Distribution Center. For documentation
updates, visit the Freescale DSP website. See the contact information on the back cover of this document.
Table 2. DSP56309 Documentation
Name
DSP56309
User’s Manual
Description
Detailed functional description of the DSP56309 memory configuration,
operation, and register programming
Order Number
DSP56309UM
DSP56300 Family Detailed description of the DSP56300 family processor core and instruction set
Manual
DSP56300FM
Application Notes
See the DSP56309 product website
Documents describing specific applications or optimized device operation
including code examples
DSP56309 Technical Data, Rev. 7
iv
Freescale Semiconductor
1
Signals/Connections
The DSP56309 input and output signals are organized into functional groups as shown in Table 1-1. Figure 1-1
diagrams the DSP56309 signals by functional group. The remainder of this chapter describes the signal pins in
each functional group.
Table 1-1.
DSP56309 Functional Signal Groupings
Number of Signals
Functional Group
TQFP
MAP-BGA
Power (VCC)
20
20
Ground (GND)
19
66
Clock
2
2
PLL
3
3
Address bus
18
18
24
24
13
13
Port A1
Data bus
Bus control
Interrupt and mode control
5
5
Port B2
16
16
Ports C and D 3
12
12
3
3
Timer
3
3
OnCE/JTAG Port
6
6
Host interface (HI08)
Enhanced synchronous serial interface (ESSI)
4
Serial communication interface (SCI)
Notes:
1.
2.
3.
4.
5.
Port E
Port A signals define the external memory interface port, including the external address bus, data bus, and control signals.
Port B signals are the HI08 port signals multiplexed with the GPIO signals.
Port C and D signals are the two ESSI port signals multiplexed with the GPIO signals.
Port E signals are the SCI port signals multiplexed with the GPIO signals.
There are 2 signal connections in the TQFP package and 7 signal connections in the MAP-BGA package that are not used.
These are designated as no connect (NC) in the package description (see Chapter 3).
Note: This chapter refers to a number of configuration registers used to select individual multiplexed signal
functionality. Refer to the DSP56309 User’s Manual for details on these configuration registers.
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
1-1
Signals/Connections
DSP56309
VCCP
VCCQL
VCCQH
VCCA
VCCD
VCCC
VCCH
VCCS
GNDP
GNDP1
GNDQ
GNDA
GNDD
GNDC
GNDH
GNDS
4
3
3
4
2
2
Grounds4:
PLL
PLL
Internal Logic
Address Bus
Data Bus
Bus Control
HI08
ESSI/SCI/Timer
4
4
2
2
EXTAL
XTAL
During
Reset
PINIT
Power Inputs:
PLL
Internal Logic
I/O
Address Bus
Data Bus
Bus Control
HI08
ESSI/SCI/Timer
Clock
CLKOUT
PCAP
After
Reset
NMI
Interrupt/
Mode Control
8
Host
Interface
(HI08) Port1
Enhanced
Synchronous Serial
Interface Port 0
(ESSI0) 2
3
Enhanced
Synchronous Serial
Interface Port 1
(ESSI1) 2
3
During Reset
MODA
MODB
MODC
MODD
RESET
After Reset
IRQA
IRQB
IRQC
IRQD
RESET
Non-Multiplexed
Bus
H[0–7]
HA0
HA1
HA2
HCS/HCS
Single DS
HRW
HDS/HDS
Single HR
HREQ/HREQ
HACK/HACK
Multiplexed
Bus
HAD[0–7]
HAS/HAS
HA8
HA9
HA10
Double DS
HRD/HRD
HWR/HWR
Double HR
HTRQ/HTRQ
HRRQ/HRRQ
SC0[0–2]
SCK0
SRD0
STD0
Port C GPIO
PC[0–2]
PC3
PC4
PC5
SC1[0–2]
SCK1
SRD1
STD1
Port D GPIO
PD[0–2]
PD3
PD4
PD5
RXD
TXD
SCLK
Port E GPIO
PE0
PE1
PE2
PLL
Port B
GPIO
PB[0–7]
PB8
PB9
PB10
PB13
PB11
PB12
PB14
PB15
Port A
A[0–17]
D[0–23]
AA[0–3]/RAS[0–3]
RD
WR
TA
BR
BG
BB
CAS
BCLK
BCLK
Notes:
1.
2.
3.
4.
18
24
4
External
Address Bus
Serial
Communications
Interface (SCI) Port2
External
Data Bus
External
Bus
Control
Timers3
OnCE/
JTAG Port
TIO0
TIO1
TIO2
Timer GPIO
TIO0
TIO1
TIO2
TCK
TDI
TDO
TMS
TRST
DE
The HI08 port supports a non-multiplexed or a multiplexed bus, single or double Data Strobe (DS), and single or
double Host Request (HR) configurations. Since each of these modes is configured independently, any combination
of these modes is possible. These HI08 signals can also be configured alternatively as GPIO signals (PB[0–15]).
Signals with dual designations (for example, HAS/HAS) have configurable polarity.
The ESSI0, ESSI1, and SCI signals are multiplexed with the Port C GPIO signals (PC[0–5]), Port D GPIO signals
(PD[0–5]), and Port E GPIO signals (PE[0–2]), respectively.
TIO[0–2] can be configured as GPIO signals.
Ground connections shown in this figure are for the TQFP package. In the MAP-BGA package, in addition to the
GNDP and GNDP1 connections, there are 64 GND connections to a common internal package ground plane.
Figure 1-1.
Signals Identified by Functional Group
DSP56309 Technical Data, Rev. 7
1-2
Freescale Semiconductor
Power
1.1 Power
Table 1-2.
Power Name
Power Inputs
Description
VCCP
PLL Power—VCC dedicated for PLL use. The voltage should be well-regulated and the input should be provided with
an extremely low impedance path to the VCC power rail.
VCCQL
Quiet Power (core)—An isolated power for the core processing logic. This input must be isolated externally from all
other chip power inputs.
VCCQH
Quiet External (High) Power—A quiet power source for I/O lines. This input must be tied externally to all other chip
power inputs, except VCCQL.
VCCA
Address Bus Power—An isolated power for sections of the address bus I/O drivers. This input must be tied externally
to all other chip power inputs, except VCCQL.
VCCD
Data Bus Power—An isolated power for sections of the data bus I/O drivers. This input must be tied externally to all
other chip power inputs, except VCCQL.
VCCC
Bus Control Power—An isolated power for the bus control I/O drivers. This input must be tied externally to all other
chip power inputs, except VCCQL.
VCCH
Host Power—An isolated power for the HI08 I/O drivers. This input must be tied externally to all other chip power
inputs, except VCCQL.
VCCS
ESSI, SCI, and Timer Power—An isolated power for the ESSI, SCI, and timer I/O drivers. This input must be tied
externally to all other chip power inputs, except VCCQL.
Note: The user must provide adequate external decoupling capacitors for all power connections.
1.2 Ground
Table 1-3.
Ground Name
Grounds1
Description
GNDP
PLL Ground—Ground-dedicated for PLL use. The connection should be provided with an extremely low-impedance
path to ground. VCCP should be bypassed to GND P by a 0.47 µF capacitor located as close as possible to the chip
package.
GNDP1
PLL Ground 1—Ground-dedicated for PLL use. The connection should be provided with an extremely low-impedance
path to ground.
GNDQ2
Quiet Ground—An isolated ground for the internal processing logic. This connection must be tied externally to all other
chip ground connections, except GNDP and GNDP1. The user must provide adequate external decoupling capacitors.
GNDA2
Address Bus Ground—An isolated ground for sections of the address bus I/O drivers. This connection must be tied
externally to all other chip ground connections, except GND P and GND P1. The user must provide adequate external
decoupling capacitors.
GNDD2
Data Bus Ground—An isolated ground for sections of the data bus I/O drivers. This connection must be tied externally
to all other chip ground connections, except GNDP and GNDP1. The user must provide adequate external decoupling
capacitors.
GNDC2
Bus Control Ground—An isolated ground for the bus control I/O drivers. This connection must be tied externally to all
other chip ground connections, except GNDP and GNDP1. The user must provide adequate external decoupling
capacitors.
GNDH2
Host Ground—An isolated ground for the HI08 I/O drivers. This connection must be tied externally to all other chip
ground connections, except GND P and GND P1. The user must provide adequate external decoupling capacitors.
GNDS2
ESSI, SCI, and Timer Ground—An isolated ground for the ESSI, SCI, and timer I/O drivers. This connection must be
tied externally to all other chip ground connections, except GND P and GND P1. The user must provide adequate external
decoupling capacitors.
GND3
Ground—Connected to an internal device ground plane.
Notes:
1.
2.
3.
The user must provide adequate external decoupling capacitors for all GND connections.
These connections are only used on the TQFP package.
These connections are common grounds used on the MAP-BGA package.
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
1-3
Signals/Connections
1.3 Clock
Table 1-4.
Signal Name
Type
State During
Reset
Clock Signals
Signal Description
EXTAL
Input
Input
External Clock/Crystal Input—Interfaces the internal crystal oscillator input
to an external crystal or an external clock.
XTAL
Output
Chip-driven
Crystal Output—Connects the internal crystal oscillator output to an external
crystal. If an external clock is used, leave XTAL unconnected.
1.4 PLL
Table 1-5.
Signal Name
CLKOUT
Type
Output
Phase-Locked Loop Signals
State During
Reset
Signal Description
Chip-driven
Clock Output—Provides an output clock synchronized to the internal core
clock phase.
If the PLL is enabled and both the multiplication and division factors equal one,
then CLKOUT is also synchronized to EXTAL.
If the PLL is disabled, the CLKOUT frequency is half the frequency of EXTAL.
PCAP
Input
Input
PLL Capacitor—An input connecting an off-chip capacitor to the PLL filter.
Connect one capacitor terminal to PCAP and the other terminal to VCCP.
If the PLL is not used, PCAP can be tied to VCC, GND, or left floating.
PINIT
Input
NMI
Input
Input
PLL Initial—During assertion of RESET, the value of PINIT is written into the
PLL enable (PEN) bit of the PLL control (PCTL) register, determining whether
the PLL is enabled or disabled.
Nonmaskable Interrupt—After RESET deassertion and during normal
instruction processing, this Schmitt-trigger input is the negative-edge-triggered
NMI request internally synchronized to CLKOUT.
Note: PINIT/NMI can tolerate 5 V.
1.5 External Memory Expansion Port (Port A)
Note: When the DSP56309 enters a low-power standby mode (stop or wait), it releases bus mastership and tristates the relevant Port A signals: A[0–17], D[0–23], AA0/RAS0–AA3/RAS3, RD, WR, BB, CAS.
1.5.1
External Address Bus
Table 1-6.
Signal Name
A[0–17]
Type
Output
State During
Reset, Stop, or
Wait
Tri-stated
External Address Bus Signals
Signal Description
Address Bus—When the DSP is the bus master, A[0–17] are active-high outputs that
specify the address for external program and data memory accesses. Otherwise, the
signals are tri-stated. To minimize power dissipation, A[0–17] do not change state when
external memory spaces are not being accessed.
DSP56309 Technical Data, Rev. 7
1-4
Freescale Semiconductor
External Memory Expansion Port (Port A)
1.5.2
External Data Bus
Table 1-7.
Signal
Name
D[0–23]
1.5.3
State
During Stop
or Wait
State
During
Reset
Type
Input/ Output
Ignored Input
Last state:
Input: Ignored
Output:
Tri-stated
Signal Description
Data Bus—When the DSP is the bus master, D[0–23] are active-high,
bidirectional input/outputs that provide the bidirectional data bus for external
program and data memory accesses. Otherwise, D[0–23] are tri-stated.
External Bus Control
Table 1-8.
Signal
Name
External Data Bus Signals
Type
State During Reset,
Stop, or Wait
Tri-stated
External Bus Control Signals
Signal Description
AA[0–3]
Output
Address Attribute—When defined as AA, these signals can be used as chip selects or
additional address lines. The default use defines a priority scheme under which only
one AA signal can be asserted at a time. Setting the AA priority disable (APD) bit (Bit
14) of the Operating Mode Register, the priority mechanism is disabled and the lines
can be used together as four external lines that can be decoded externally into 16 chip
select signals.
RAS[0–3]
Output
RD
Output
Tri-stated
Read Enable—When the DSP is the bus master, RD is an active-low output that is
asserted to read external memory on the data bus (D[0–23]). Otherwise, RD is tristated.
WR
Output
Tri-stated
Write Enable—When the DSP is the bus master, WR is an active-low output that is
asserted to write external memory on the data bus (D[0–23]). Otherwise, the signals
are tri-stated.
TA
Input
Ignored Input
Transfer Acknowledge—If the DSP56309 is the bus master and there is no external
bus activity, or the DSP56309 is not the bus master, the TA input is ignored. The TA
input is a data transfer acknowledge (DTACK) function that can extend an external bus
cycle indefinitely. Any number of wait states (1, 2. . .infinity) can be added to the wait
states inserted by the bus control register (BCR) by keeping TA deasserted. In typical
operation, TA is deasserted at the start of a bus cycle, is asserted to enable completion
of the bus cycle, and is deasserted before the next bus cycle. The current bus cycle
completes one clock period after TA is asserted synchronous to CLKOUT. The number
of wait states is determined by the TA input or by the BCR, whichever is longer. The
BCR can be used to set the minimum number of wait states in external bus cycles.
Row Address Strobe—When defined as RAS, these signals can be used as RAS for
DRAM interface. These signals are tri-statable outputs with programmable polarity.
To use the TA functionality, the BCR must be programmed to at least one wait state. A
zero wait state access cannot be extended by TA deassertion; otherwise, improper
operation may result. TA can operate synchronously or asynchronously depending on
the setting of the TAS bit in the Operating Mode Register. TA functionality cannot be
used during DRAM type accesses; otherwise improper operation may result.
BR
Output
Reset: Output
(deasserted)
State during Stop/Wait
depends on BRH bit
setting:
• BRH = 0: Output,
deasserted
• BRH = 1: Maintains last
state (that is, if asserted,
remains asserted)
Bus Request—Asserted when the DSP requests bus mastership. BR is deasserted
when the DSP no longer needs the bus. BR may be asserted or deasserted
independently of whether the DSP56309 is a bus master or a bus slave. Bus “parking”
allows BR to be deasserted even though the DSP56309 is the bus master. (See the
description of bus “parking” in the BB signal description.) The bus request hold (BRH)
bit in the BCR allows BR to be asserted under software control even though the DSP
does not need the bus. BR is typically sent to an external bus arbitrator that controls the
priority, parking, and tenure of each master on the same external bus. BR is affected
only by DSP requests for the external bus, never for the internal bus. During hardware
reset, BR is deasserted and the arbitration is reset to the bus slave state.
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
1-5
Signals/Connections
Table 1-8.
Signal
Name
BG
Type
Input
External Bus Control Signals (Continued)
State During Reset,
Stop, or Wait
Ignored Input
Signal Description
Bus Grant—Asserted by an external bus arbitration circuit when the DSP56309
becomes the next bus master. When BG is asserted, the DSP56309 must wait until BB
is deasserted before taking bus mastership. When BG is deasserted, bus mastership is
typically given up at the end of the current bus cycle. This may occur in the middle of an
instruction that requires more than one external bus cycle for execution.
The default operation of this bit requires a setup and hold time as specified in Table 214. An alternate mode can be invoked: set the asynchronous bus arbitration enable
(ABE) bit (Bit 13) in the Operating Mode Register. When this bit is set, BG and BB are
synchronized internally. This eliminates the respective setup and hold time
requirements but adds a required delay between the deassertion of an initial BG input
and the assertion of a subsequent BG input.
BB
Input/
Output
Ignored Input
Bus Busy—Indicates that the bus is active. Only after BB is deasserted can the
pending bus master become the bus master (and then assert the signal again). The
bus master may keep BB asserted after ceasing bus activity regardless of whether BR
is asserted or deasserted. Called “bus parking,” this allows the current bus master to
reuse the bus without rearbitration until another device requires the bus. BB is
deasserted by an “active pull-up” method (that is, BB is driven high and then released
and held high by an external pull-up resistor).
The default operation of this signal requires a setup and hold time as specified in Table
2-14. An alternative mode can be invoked by setting the ABE bit (Bit 13) in the
Operating Mode Register. When this bit is set, BG and BB are synchronized internally.
See BG for additional information.
Note: BB requires an external pull-up resistor.
CAS
Output
Tri-stated
Column Address Strobe—When the DSP is the bus master, CAS is an active-low
output used by DRAM to strobe the column address. Otherwise, if the Bus Mastership
Enable (BME) bit in the DRAM control register is cleared, the signal is tri-stated.
BCLK
Output
Tri-stated
Bus Clock
When the DSP is the bus master, BCLK is active when the Operating Mode Register
Address Trace Enable bit is set. When BCLK is active and synchronized to CLKOUT by
the internal PLL, BCLK precedes CLKOUT by one-fourth of a clock cycle.
BCLK
Output
Tri-stated
Bus Clock Not
When the DSP is the bus master, BCLK is the inverse of the BCLK signal. Otherwise,
the signal is tri-stated.
DSP56309 Technical Data, Rev. 7
1-6
Freescale Semiconductor
Interrupt and Mode Control
1.6 Interrupt and Mode Control
The interrupt and mode control signals select the chip operating mode as it comes out of hardware reset. After
RESET is deasserted, these inputs are hardware interrupt request lines.
Table 1-9.
Signal Name
Type
State During
Reset
Interrupt and Mode Control
Signal Description
RESET
Input
Schmitt-trigger
Input
Reset—Places the chip in the Reset state and resets the internal phase
generator. The Schmitt-trigger input allows a slowly rising input (such as a
capacitor charging) to reset the chip reliably. When the RESET signal is
deasserted, the initial chip operating mode is latched from the MODA, MODB,
MODC, and MODD inputs. The RESET signal must be asserted after powerup.
MODA
Input
Schmitt-trigger
Input
Mode Select A—MODA, MODB, MODC, and MODD select one of 16 initial
chip operating modes, latched into the Operating Mode Register when the
RESET signal is deasserted.
IRQA
Input
MODB
Input
IRQB
Input
MODC
Input
IRQC
MODD
IRQD
External Interrupt Request A—After reset, this input becomes a levelsensitive or negative-edge-triggered, maskable interrupt request input during
normal instruction processing. If the processor is in the STOP or WAIT standby
state and IRQA is asserted, the processor exits the STOP or WAIT state.
Schmitt-trigger
Input
External Interrupt Request B—After reset, this input becomes a levelsensitive or negative-edge-triggered, maskable interrupt request input during
normal instruction processing. If the processor is in the WAIT standby state and
IRQB is asserted, the processor exits the WAIT state.
Schmitt-trigger
Input
Input
Input
Mode Select B—MODA, MODB, MODC, and MODD select one of 16 initial
chip operating modes, latched into the Operating Mode Register when the
RESET signal is deasserted.
Mode Select C—MODA, MODB, MODC, and MODD select one of 16 initial
chip operating modes, latched into the Operating Mode Register when the
RESET signal is deasserted.
External Interrupt Request C—After reset, this input becomes a levelsensitive or negative-edge-triggered, maskable interrupt request input during
normal instruction processing. If the processor is in the WAIT standby state and
IRQC is asserted, the processor exits the WAIT state.
Schmitt-trigger
Input
Input
Mode Select D—MODA, MODB, MODC, and MODD select one of 16 initial
chip operating modes, latched into the Operating Mode Register when the
RESET signal is deasserted.
External Interrupt Request D—After reset, this input becomes a levelsensitive or negative-edge-triggered, maskable interrupt request input during
normal instruction processing. If the processor is in the WAIT standby state and
IRQD is asserted, the processor exits the WAIT state.
Note: These signals are all 5 V tolerant.
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
1-7
Signals/Connections
1.7 Host Interface (HI08)
The HI08 provides a fast, 8-bit, parallel data port that connects directly to the host bus. The HI08 supports a variety
of standard buses and connects directly to a number of industry-standard microcomputers, microprocessors, DSPs,
and DMA hardware.
1.7.1
Host Port Usage Considerations
Careful synchronization is required when the system reads multiple-bit registers that are written by another
asynchronous system. This is a common problem when two asynchronous systems are connected (as they are in the
Host port). The considerations for proper operation are discussed in Table 1-10.
Table 1-10.
Host Port Usage Considerations
Action
Description
Asynchronous read of receive byte
registers
When reading the receive byte registers, Receive register High (RXH), Receive register Middle
(RXM), or Receive register Low (RXL), the host interface programmer should use interrupts or poll
the Receive register Data Full (RXDF) flag that indicates data is available. This assures that the data
in the receive byte registers is valid.
Asynchronous write to transmit byte
registers
The host interface programmer should not write to the transmit byte registers, Transmit register High
(TXH), Transmit register Middle (TXM), or Transmit register Low (TXL), unless the Transmit register
Data Empty (TXDE) bit is set indicating that the transmit byte registers are empty. This guarantees
that the transmit byte registers transfer valid data to the Host Receive (HRX) register.
Asynchronous write to host vector
The host interface programmer must change the Host Vector (HV) register only when the Host
Command bit (HC) is clear. This practice guarantees that the DSP interrupt control logic receives a
stable vector.
1.7.2
Host Port Configuration
HI08 signal functions vary according to the programmed configuration of the interface as determined by the 16 bits
in the HI08 Port Control Register.
Table 1-11.
Host Interface
Type
State During
Reset1,2
H[0–7]
Input/Output
Ignored Input
HAD[0–7]
Input/Output
Host Address—When the HI08 is programmed to interface with a multiplexed
host bus and the HI function is selected, these signals are lines 0–7 of the
bidirectional multiplexed Address/Data bus.
Input or Output
Port B 0–7—When the HI08 is configured as GPIO through the HI08 Port
Control Register, these signals are individually programmed as inputs or outputs
through the HI08 Data Direction Register.
Signal Name
PB[0–7]
Signal Description
Host Data—When the HI08 is programmed to interface with a non-multiplexed
host bus and the HI function is selected, these signals are lines 0–7 of the
bidirectional Data bus.
DSP56309 Technical Data, Rev. 7
1-8
Freescale Semiconductor
Host Interface (HI08)
Table 1-11.
Host Interface (Continued)
Type
State During
Reset1,2
HA0
Input
Ignored Input
HAS/HAS
Input
Host Address Strobe—When the HI08 is programmed to interface with a
multiplexed host bus and the HI function is selected, this signal is the host
address strobe (HAS) Schmitt-trigger input. The polarity of the address strobe is
programmable but is configured active-low (HAS) following reset.
PB8
Input or Output
Port B 8—When the HI08 is configured as GPIO through the HI08 Port Control
Register, this signal is individually programmed as an input or output through the
HI08 Data Direction Register.
HA1
Input
HA8
Input
Host Address 8—When the HI08 is programmed to interface with a multiplexed
host bus and the HI function is selected, this signal is line 8 of the host address
(HA8) input bus.
PB9
Input or Output
Port B 9—When the HI08 is configured as GPIO through the HI08 Port Control
Register, this signal is individually programmed as an input or output through the
HI08 Data Direction Register.
HA2
Input
HA9
Input
Host Address 9—When the HI08 is programmed to interface with a multiplexed
host bus and the HI function is selected, this signal is line 9 of the host address
(HA9) input bus.
PB10
Input or Output
Port B 10—When the HI08 is configured as GPIO through the HI08 Port Control
Register, this signal is individually programmed as an input or output through the
HI08 Data Direction Register.
Signal Name
Ignored Input
Ignored Input
Signal Description
Host Address Input 0—When the HI08 is programmed to interface with a
nonmultiplexed host bus and the HI function is selected, this signal is line 0 of
the host address input bus.
Host Address Input 1—When the HI08 is programmed to interface with a
nonmultiplexed host bus and the HI function is selected, this signal is line 1 of
the host address (HA1) input bus.
Host Address Input 2—When the HI08 is programmed to interface with a
nonmultiplexed host bus and the HI function is selected, this signal is line 2 of
the host address (HA2) input bus.
HCS/HCS
Input
HA10
Input
Host Address 10—When the HI08 is programmed to interface with a
multiplexed host bus and the HI function is selected, this signal is line 10 of the
host address (HA10) input bus.
PB13
Input or Output
Port B 13—When the HI08 is configured as GPIO through the HI08 Port Control
Register, this signal is individually programmed as an input or output through the
HI08 Data Direction Register.
HRW
Input
HRD/HRD
Input
Host Read Data—When the HI08 is programmed to interface with a doubledata-strobe host bus and the HI function is selected, this signal is the HRD
strobe Schmitt-trigger input. The polarity of the data strobe is programmable but
is configured as active-low (HRD) after reset.
Input or Output
Port B 11—When the HI08 is configured as GPIO through the HI08 Port Control
Register, this signal is individually programmed as an input or output through the
HI08 Data Direction Register.
PB11
Ignored Input
Ignored Input
Host Chip Select—When the HI08 is programmed to interface with a
nonmultiplexed host bus and the HI function is selected, this signal is the host
chip select (HCS) input. The polarity of the chip select is programmable but is
configured active-low (HCS) after reset.
Host Read/Write—When the HI08 is programmed to interface with a singledata-strobe host bus and the HI function is selected, this signal is the Host
Read/Write (HRW) input.
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
1-9
Signals/Connections
Table 1-11.
Host Interface (Continued)
Type
State During
Reset1,2
HDS/HDS
Input
Ignored Input
HWR/HWR
Input
Host Write Data—When the HI08 is programmed to interface with a doubledata-strobe host bus and the HI function is selected, this signal is the host write
data strobe (HWR) Schmitt-trigger input. The polarity of the data strobe is
programmable but is configured as active-low (HWR) following reset.
Input or Output
Port B 12—When the HI08 is configured as GPIO through the HI08 Port Control
Register, this signal is individually programmed as an input or output through the
HI08 Data Direction Register.
Signal Name
PB12
Signal Description
Host Data Strobe—When the HI08 is programmed to interface with a singledata-strobe host bus and the HI function is selected, this signal is the host data
strobe (HDS) Schmitt-trigger input. The polarity of the data strobe is
programmable but is configured as active-low (HDS) following reset.
HREQ/HREQ
Output
HTRQ/HTRQ
Output
Transmit Host Request—When the HI08 is programmed to interface with a
double host request host bus and the HI function is selected, this signal is the
transmit host request (HTRQ) output. The polarity of the host request is
programmable but is configured as active-low (HTRQ) following reset. The host
request may be programmed as a driven or open-drain output.
Input or Output
Port B 14—When the HI08 is configured as GPIO through the HI08 Port Control
Register, this signal is individually programmed as an input or output through the
HI08 Data Direction Register.
PB14
HACK/HACK
Input
HRRQ/HRRQ
Output
PB15
Notes:
Input or Output
1.
2.
3.
Ignored Input
Ignored Input
Host Request—When the HI08 is programmed to interface with a single host
request host bus and the HI function is selected, this signal is the host request
(HREQ) output. The polarity of the host request is programmable but is
configured as active-low (HREQ) following reset. The host request may be
programmed as a driven or open-drain output.
Host Acknowledge—When the HI08 is programmed to interface with a single
host request host bus and the HI function is selected, this signal is the host
acknowledge (HACK) Schmitt-trigger input. The polarity of the host
acknowledge is programmable but is configured as active-low (HACK) after
reset.
Receive Host Request—When the HI08 is programmed to interface with a
double host request host bus and the HI function is selected, this signal is the
receive host request (HRRQ) output. The polarity of the host request is
programmable but is configured as active-low (HRRQ) after reset. The host
request may be programmed as a driven or open-drain output.
Port B 15—When the HI08 is configured as GPIO through the HI08 Port Control
Register, this signal is individually programmed as an input or output through the
HI08 Data Direction Register.
In the Stop state, the signal maintains the last state as follows:
• If the last state is input, the signal is an ignored input.
• If the last state is output, the signal is tri-stated.
The Wait processing state does not affect the signal state.
All inputs are 5 V tolerant.
DSP56309 Technical Data, Rev. 7
1-10
Freescale Semiconductor
Enhanced Synchronous Serial Interface 0 (ESSI0)
1.8 Enhanced Synchronous Serial Interface 0 (ESSI0)
Two synchronous serial interfaces (ESSI0 and ESSI1) provide a full-duplex serial port for serial communication
with a variety of serial devices, including one or more industry-standard codecs, other DSPs, microprocessors, and
peripherals that implement the serial peripheral interface (SPI).
Table 1-12.
Signal Name
Type
SC00
Input or Output
PC0
Input or Output
SC01
Input/Output
PC1
Input or Output
SC02
Input/Output
PC2
Input or Output
SCK0
Input/Output
Enhanced Synchronous Serial Interface 0
State During
Reset1,2
Ignored Input
Signal Description
Serial Control 0—For asynchronous mode, this signal is used for the receive
clock I/O (Schmitt-trigger input). For synchronous mode, this signal is used
either for transmitter 1 output or for serial I/O flag 0.
Port C 0—The default configuration following reset is GPIO input PC0. When
configured as PC0, signal direction is controlled through the Port C Direction
Register. The signal can be configured as ESSI signal SC00 through the Port C
Control Register.
Ignored Input
Serial Control 1—For asynchronous mode, this signal is the receiver frame
sync I/O. For synchronous mode, this signal is used either for transmitter 2
output or for serial I/O flag 1.
Port C 1—The default configuration following reset is GPIO input PC1. When
configured as PC1, signal direction is controlled through the Port C Direction
Register. The signal can be configured as an ESSI signal SC01 through the Port
C Control Register.
Ignored Input
Serial Control Signal 2—The frame sync for both the transmitter and receiver
in synchronous mode, and for the transmitter only in asynchronous mode. When
configured as an output, this signal is the internally generated frame sync signal.
When configured as an input, this signal receives an external frame sync signal
for the transmitter (and the receiver in synchronous operation).
Port C 2—The default configuration following reset is GPIO input PC2. When
configured as PC2, signal direction is controlled through the Port C Direction
Register. The signal can be configured as an ESSI signal SC02 through the Port
C Control Register.
Ignored Input
Serial Clock—Provides the serial bit rate clock for the ESSI. The SCK0 is a
clock input or output, used by both the transmitter and receiver in synchronous
modes or by the transmitter in asynchronous modes.
Although an external serial clock can be independent of and asynchronous to
the DSP system clock, it must exceed the minimum clock cycle time of 6T (that
is, the system clock frequency must be at least three times the external ESSI
clock frequency). The ESSI needs at least three DSP phases inside each half of
the serial clock.
PC3
Input or Output
SRD0
Input
PC4
Input or Output
Port C 3—The default configuration following reset is GPIO input PC3. When
configured as PC3, signal direction is controlled through the Port C Direction
Register. The signal can be configured as an ESSI signal SCK0 through the Port
C Control Register.
Ignored Input
Serial Receive Data—Receives serial data and transfers the data to the ESSI
Receive Shift Register. SRD0 is an input when data is received.
Port C 4—The default configuration following reset is GPIO input PC4. When
configured as PC4, signal direction is controlled through the Port C Direction
Register. The signal can be configured as an ESSI signal SRD0 through the
Port C Control Register.
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
1-11
Signals/Connections
Table 1-12.
Signal Name
State During
Reset1,2
Type
STD0
Output
PC5
Input or Output
Notes:
1.
2.
3.
Enhanced Synchronous Serial Interface 0 (Continued)
Ignored Input
Signal Description
Serial Transmit Data—Transmits data from the Serial Transmit Shift Register.
STD0 is an output when data is transmitted.
Port C 5—The default configuration following reset is GPIO input PC5. When
configured as PC5, signal direction is controlled through the Port C Direction
Register. The signal can be configured as an ESSI signal STD0 through the Port
C Control Register.
In the Stop state, the signal maintains the last state as follows:
• If the last state is input, the signal is an ignored input.
• If the last state is output, the signal is tri-stated.
The Wait processing state does not affect the signal state.
All inputs are 5 V tolerant.
1.9 Enhanced Synchronous Serial Interface 1 (ESSI1)
Table 1-13.
Signal Name
Type
SC10
Input or Output
PD0
Input or Output
SC11
Input/Output
PD1
Input or Output
SC12
Input/Output
PD2
Input or Output
Enhanced Serial Synchronous Interface 1
State During
Reset1,2
Ignored Input
Signal Description
Serial Control 0—For asynchronous mode, this signal is used for the receive
clock I/O (Schmitt-trigger input). For synchronous mode, this signal is used
either for transmitter 1 output or for serial I/O flag 0.
Port D 0—The default configuration following reset is GPIO input PD0. When
configured as PD0, signal direction is controlled through the Port D Direction
Register. The signal can be configured as an ESSI signal SC10 through the Port
D Control Register.
Ignored Input
Serial Control 1—For asynchronous mode, this signal is the receiver frame
sync I/O. For synchronous mode, this signal is used either for Transmitter 2
output or for Serial I/O Flag 1.
Port D 1—The default configuration following reset is GPIO input PD1. When
configured as PD1, signal direction is controlled through the Port D Direction
Register. The signal can be configured as an ESSI signal SC11 through the Port
D Control Register.
Ignored Input
Serial Control Signal 2—The frame sync for both the transmitter and receiver
in synchronous mode and for the transmitter only in asynchronous mode. When
configured as an output, this signal is the internally generated frame sync signal.
When configured as an input, this signal receives an external frame sync signal
for the transmitter (and the receiver in synchronous operation).
Port D 2—The default configuration following reset is GPIO input PD2. When
configured as PD2, signal direction is controlled through the Port D Direction
Register. The signal can be configured as an ESSI signal SC12 through the Port
D Control Register.
DSP56309 Technical Data, Rev. 7
1-12
Freescale Semiconductor
Enhanced Synchronous Serial Interface 1 (ESSI1)
Table 1-13.
Signal Name
SCK1
Type
Input/Output
Enhanced Serial Synchronous Interface 1 (Continued)
State During
Reset1,2
Ignored Input
Signal Description
Serial Clock—Provides the serial bit rate clock for the ESSI. The SCK1 is a
clock input or output used by both the transmitter and receiver in synchronous
modes or by the transmitter in asynchronous modes.
Although an external serial clock can be independent of and asynchronous to
the DSP system clock, it must exceed the minimum clock cycle time of 6T (that
is, the system clock frequency must be at least three times the external ESSI
clock frequency). The ESSI needs at least three DSP phases inside each half of
the serial clock.
PD3
Input or Output
SRD1
Input
PD4
Input or Output
STD1
Output
PD5
Input or Output
Notes:
1.
2.
3.
Port D 3—The default configuration following reset is GPIO input PD3. When
configured as PD3, signal direction is controlled through the Port D Direction
Register. The signal can be configured as an ESSI signal SCK1 through the Port
D Control Register.
Ignored Input
Serial Receive Data—Receives serial data and transfers the data to the ESSI
Receive Shift Register. SRD1 is an input when data is being received.
Port D 4—The default configuration following reset is GPIO input PD4. When
configured as PD4, signal direction is controlled through the Port D Direction
Register. The signal can be configured as an ESSI signal SRD1 through the
Port D Control Register.
Ignored Input
Serial Transmit Data—Transmits data from the Serial Transmit Shift Register.
STD1 is an output when data is being transmitted.
Port D 5—The default configuration following reset is GPIO input PD5. When
configured as PD5, signal direction is controlled through the Port D Direction
Register. The signal can be configured as an ESSI signal STD1 through the Port
D Control Register.
In the Stop state, the signal maintains the last state as follows:
• If the last state is input, the signal is an ignored input.
• If the last state is output, the signal is tri-stated.
The Wait processing state does not affect the signal state.
All inputs are 5 V tolerant.
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
1-13
Signals/Connections
1.10 Serial Communication Interface (SCI)
The SCI provides a full duplex port for serial communication with other DSPs, microprocessors, or peripherals
such as modems.
Table 1-14.
Signal Name
Type
RXD
Input
PE0
Input or Output
TXD
Output
PE1
Input or Output
SCLK
Input/Output
PE2
Input or Output
Notes:
1.
2.
3.
Serial Communication Interface
State During
Reset1,2
Ignored Input
Signal Description
Serial Receive Data—Receives byte-oriented serial data and transfers it to the
SCI Receive Shift Register.
Port E 0—The default configuration following reset is GPIO input PE0. When
configured as PE0, signal direction is controlled through the Port E Direction
Register. The signal can be configured as an SCI signal RXD through the Port E
Control Register.
Ignored Input
Serial Transmit Data—Transmits data from the SCI Transmit Data Register.
Port E 1—The default configuration following reset is GPIO input PE1. When
configured as PE1, signal direction is controlled through the Port E Direction
Register. The signal can be configured as an SCI signal TXD through the Port E
Control Register.
Ignored Input
Serial Clock—Provides the input or output clock used by the transmitter and/or
the receiver.
Port E 2—The default configuration following reset is GPIO input PE2. When
configured as PE2, signal direction is controlled through the Port E Direction
Register. The signal can be configured as an SCI signal SCLK through the Port
E Control Register.
In the Stop state, the signal maintains the last state as follows:
• If the last state is input, the signal is an ignored input.
• If the last state is output, the signal is tri-stated.
The Wait processing state does not affect the signal state.
All inputs are 5 V tolerant.
DSP56309 Technical Data, Rev. 7
1-14
Freescale Semiconductor
Timers
1.11 Timers
The DSP56309 has three identical and independent timers. Each timer can use internal or external clocking and can
either interrupt the DSP56309 after a specified number of events (clocks) or signal an external device after
counting a specific number of internal events.
Table 1-15.
Signal Name
TIO0
Type
Input or Output
Triple Timer Signals
State During
Signal Description
Reset1,2
Ignored Input
Timer 0 Schmitt-Trigger Input/Output— When Timer 0 functions as an
external event counter or in measurement mode, TIO0 is used as input. When
Timer 0 functions in watchdog, timer, or pulse modulation mode, TIO0 is used
as output.
The default mode after reset is GPIO input. TIO0 can be changed to output or
configured as a timer I/O through the Timer 0 Control/Status Register (TCSR0).
TIO1
Input or Output
Ignored Input
Timer 1 Schmitt-Trigger Input/Output— When Timer 1 functions as an
external event counter or in measurement mode, TIO1 is used as input. When
Timer 1 functions in watchdog, timer, or pulse modulation mode, TIO1 is used
as output.
The default mode after reset is GPIO input. TIO1 can be changed to output or
configured as a timer I/O through the Timer 1 Control/Status Register (TCSR1).
TIO2
Input or Output
Ignored Input
Timer 2 Schmitt-Trigger Input/Output— When Timer 2 functions as an
external event counter or in measurement mode, TIO2 is used as input. When
Timer 2 functions in watchdog, timer, or pulse modulation mode, TIO2 is used
as output.
The default mode after reset is GPIO input. TIO2 can be changed to output or
configured as a timer I/O through the Timer 2 Control/Status Register (TCSR2).
Notes:
1.
2.
3.
In the Stop state, the signal maintains the last state as follows:
• If the last state is input, the signal is an ignored input.
• If the last state is output, the signal is tri-stated.
The Wait processing state does not affect the signal state.
All inputs are 5 V tolerant.
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
1-15
Signals/Connections
1.12 JTAG and OnCE Interface
The DSP56300 family and in particular the DSP56309 support circuit-board test strategies based on the IEEE®
Std. 1149.1™ test access port and boundary scan architecture, the industry standard developed under the
sponsorship of the Test Technology Committee of IEEE and the JTAG.
The OnCE module provides a means to interface nonintrusively with the DSP56300 core and its peripherals so that
you can examine registers, memory, or on-chip peripherals. Functions of the OnCE module are provided through
the JTAG TAP signals.
For programming models, see the chapter on debugging support in the DSP56300 Family Manual.
Table 1-16.
Signal
Name
JTAG/OnCE Interface
Type
State During
Reset
TCK
Input
Input
Test Clock—A test clock input signal to synchronize the JTAG test logic.
TDI
Input
Input
Test Data Input—A test data serial input signal for test instructions and data.
TDI is sampled on the rising edge of TCK and has an internal pull-up resistor.
TDO
Output
Tri-stated
Test Data Output—A test data serial output signal for test instructions and
data. TDO is actively driven in the shift-IR and shift-DR controller states. TDO
changes on the falling edge of TCK.
TMS
Input
Input
Test Mode Select—Sequences the test controller’s state machine. TMS is
sampled on the rising edge of TCK and has an internal pull-up resistor.
TRST
Input
Input
Test Reset—Initializes the test controller asynchronously. TRST has an
internal pull-up resistor. TRST must be asserted after powerup.
Input/ Output
(open-drain)
Input
Debug Event—As an input, initiates Debug mode from an external command
controller, and, as an open-drain output, acknowledges that the chip has
entered Debug mode. As an input, DE causes the DSP56300 core to finish
executing the current instruction, save the instruction pipeline information,
enter Debug mode, and wait for commands to be entered from the debug
serial input line. This signal is asserted as an output for three clock cycles
when the chip enters Debug mode as a result of a debug request or as a result
of meeting a breakpoint condition. The DE has an internal pull-up resistor.
DE
Signal Description
This signal is not a standard part of the JTAG TAP controller. The signal
connects directly to the OnCE module to initiate debug mode directly or to
provide a direct external indication that the chip has entered Debug mode. All
other interface with the OnCE module must occur through the JTAG port.
Note: All inputs are 5 V tolerant.
DSP56309 Technical Data, Rev. 7
1-16
Freescale Semiconductor
2
Specifications
Note: The DSP56309 is fabricated in high-density CMOS with Transistor-Transistor Logic (TTL) compatible
inputs and outputs. The DSP56309 specifications are preliminary and are from design simulations, and
may not be fully tested or guaranteed. Finalized specifications will be published after full characterization
and device qualifications are complete.
2.1 Maximum Ratings
CAUTION
This device contains circuitry protecting
against damage due to high static voltage or
electrical fields; however, normal precautions
should be taken to avoid exceeding maximum
voltage ratings. Reliability is enhanced if
unused inputs are tied to an appropriate logic
voltage level (for example, either GND or VCC).
In the calculation of timing requirements, adding a maximum value of one specification to a minimum value of
another specification does not yield a reasonable sum. A maximum specification is calculated using a worst case
variation of process parameter values in one direction. The minimum specification is calculated using the worst
case for the same parameters in the opposite direction. Therefore, a “maximum” value for a specification never
occurs in the same device that has a “minimum” value for another specification; adding a maximum to a minimum
represents a condition that can never exist.
2.2 Absolute Maximum Ratings
Table 2-1.
Rating
Absolute Maximum Ratings1
Symbol
Supply Voltage
VCC
All input voltages excluding “5 V tolerant” inputs
VIN
All “5 V tolerant” input voltages2
VIN5
Current drain per pin excluding VCC and GND
Operating temperature range
Storage temperature
Notes:
1.
2.
I
TJ
TSTG
Value
Unit
−0.3 to +4.0
V
GND −0.3 to 5.5
V
10
mA
GND − 0.3 to VCC + 0.3
−40 to +100
−55 to +150
V
°C
°C
Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond
the maximum rating may affect device reliability or cause permanent damage to the device.
At power-up, ensure that the voltage difference between the 5 V tolerant pins and the chip VCC never exceeds 3.5 V.
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
2-1
Specifications
2.3 Thermal Characteristics
Table 2-2.
Thermal Characteristics
Symbol
TQFP Value
MAP-BGA3
Value
MAP-BGA4
Value
Unit
Junction-to-ambient thermal resistance1
RθJA or θJA
49.3
49.4
28.5
°C/W
Junction-to-case thermal resistance2
RθJC or θJC
8.2
12.0
—
°C/W
Thermal characterization parameter
ΨJT
5.5
2.0
—
°C/W
Characteristic
Notes:
1.
2.
3.
4.
Junction-to-ambient thermal resistance is based on measurements on a horizontal single-sided printed circuit board per
JEDEC Specification JESD51-3.
Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI G30-88, with the exception that
the cold plate temperature is used for the case temperature.
These are simulated values. See note 1 for test board conditions.
These are simulated values. The test board has two 2-ounce signal layers and two 1-ounce solid ground planes internal to the
test board.
2.4 DC Electrical Characteristics
Table 2-3.
Characteristics
DC Electrical Characteristics6
Symbol
Min
Typ
Max
Unit
VCC
3.0
3.3
3.6
V
VIH
VIHP
2.0
2.0
—
—
VCC
5.25
V
V
VIHX
0.8 × VCC
—
VCC
V
VIL
VILP
VILX
–0.3
–0.3
–0.3
—
—
—
0.8
0.8
0.2 × VCC
V
V
V
Input leakage current
IIN
–10
—
10
µA
High impedance (off-state) input current (@ 2.4 V / 0.4 V)
ITSI
–10
—
10
µA
Output high voltage
• TTL (IOH = –0.4 mA)5,7
• CMOS (IOH = –10 µA)5
VOH
2.4
VCC – 0.01
—
—
—
—
V
V
Output low voltage
• TTL (IOL = 1.6 mA, open-drain pins IOL = 6.7 mA)5,7
• CMOS (IOL = 10 µA) 5
VOL
—
—
—
—
0.4
0.01
V
V
—
—
—
127
7.5
100
—
—
—
mA
mA
µA
—
1
2.5
mA
—
—
10
pF
Supply voltage
Input high voltage
• D[0–23], BG, BB, TA
• MOD1/IRQ1, RESET, PINIT/NMI and all
JTAG/ESSI/SCI/Timer/HI08 pins
• EXTAL8
Input low voltage
• D[0–23], BG, BB, TA, MOD1/IRQ1, RESET, PINIT
• All JTAG/ESSI/SCI/Timer/HI08 pins
• EXTAL8
Internal supply current2:
• In Normal mode
• In Wait mode3
• In Stop mode4
ICCI
ICCW
ICCS
PLL supply current
Input capacitance5
CIN
DSP56309 Technical Data, Rev. 7
2-2
Freescale Semiconductor
AC Electrical Characteristics
Table 2-3.
DC Electrical Characteristics6 (Continued)
Characteristics
Notes:
1.
2.
3.
4.
5.
6.
7.
8.
Symbol
Min
Typ
Max
Unit
Refers to MODA/IRQA, MODB/IRQB, MODC/IRQC, and MODD/IRQD pins.
Section 4.3 provides a formula to compute the estimated current requirements in Normal mode. In order to obtain these
results, all inputs must be terminated (that is, not allowed to float). Measurements are based on synthetic intensive DSP
benchmarks (see Appendix A). The power consumption numbers in this specification are 90 percent of the measured results
of this benchmark. This reflects typical DSP applications. Typical internal supply current is measured with VCC = 3.3 V at TJ =
100°C.
In order to obtain these results, all inputs must be terminated (that is, not allowed to float).
In order to obtain these results, all inputs that are not disconnected at Stop mode must be terminated (that is, not allowed to
float). PLL and XTAL signals are disabled during Stop state.
Periodically sampled and not 100 percent tested.
VCC = 3.3 V ± 0.3 V; TJ = –40°C to +100 °C, CL = 50 pF
This characteristic does not apply to XTAL and PCAP.
Driving EXTAL to the low VIHX or the high VILX value may cause additional power consumption (DC current). To minimize
power consumption, the minimum VIHX should be no lower than
0.9 × VCC and the maximum VILX should be no higher than 0.1 × VCC .
2.5 AC Electrical Characteristics
The timing waveforms shown in the AC electrical characteristics section are tested with a VIL maximum of 0.3 V
and a VIH minimum of 2.4 V for all pins except EXTAL, which is tested using the input levels shown in Note 6 of
the previous table. AC timing specifications, which are referenced to a device input signal, are measured in
production with respect to the 50 percent point of the respective input signal transition. DSP56309 output levels are
measured with the production test machine VOL and VOH reference levels set at 0.4 V and 2.4 V, respectively.
Note: Although the minimum value for the frequency of EXTAL is 0 MHz, the device AC test conditions are 15
MHz and rated speed.
2.5.1
Internal Clocks
Table 2-4.
Internal Clocks, CLKOUT
Expression1, 2
Characteristics
Symbol
Min
Typ
Max
Internal operation frequency and CLKOUT
with PLL enabled
f
—
(Ef × MF)/
(PDF × DF)
—
Internal operation frequency and CLKOUT
with PLL disabled
f
—
Ef/2
—
TH
—
0.49 × ETC ×
PDF × DF/MF
0.47 × ETC ×
PDF × DF/MF
ETC
—
—
0.51 × ETC ×
PDF × DF/MF
0.53 × ETC ×
PDF × DF/MF
—
0.49 × ETC ×
PDF × DF/MF
0.47 × ETC ×
PDF × DF/MF
ETC
—
—
ETC × PDF ×
DF/MF
Internal clock and CLKOUT high period
• With PLL disabled
• With PLL enabled and MF ≤4
•
With PLL enabled and MF > 4
Internal clock and CLKOUT low period
• With PLL disabled
• With PLL enabled and MF ≤4
•
TL
With PLL enabled and MF > 4
Internal clock and CLKOUT cycle time with
PLL enabled
TC
—
—
—
0.51 × ETC ×
PDF × DF/MF
0.53 × ETC ×
PDF × DF/MF
—
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
2-3
Specifications
Table 2-4.
Internal Clocks, CLKOUT (Continued)
Expression1, 2
Characteristics
Symbol
Internal clock and CLKOUT cycle time with
PLL disabled
Instruction cycle time
Notes:
1.
Typ
Max
TC
—
2 × ETC
—
ICYC
—
TC
—
DF = Division Factor; Ef = External frequency; ETC = External clock cycle; MF = Multiplication Factor;
PDF = Predivision Factor; TC = internal clock cycle
See the PLL and Clock Generation section in the DSP56300 Family Manual for a detailed discussion of the PLL.
2.
2.5.2
Min
External Clock Operation
The DSP56309 system clock is derived from the on-chip oscillator or is externally supplied. To use the on-chip
oscillator, connect a crystal and associated resistor/capacitor components to EXTAL and XTAL; examples are
shown in Figure 2-1.
EXTAL
XTAL
R
C
XTAL1
C
Note: Make sure that in
the PCTL Register:
• XTLD (bit 16) = 0
• If fOSC > 200 kHz,
XTLR (bit 15) = 0
Fundamental Frequency
Crystal Oscillator
Figure 2-1.
Suggested Component Values:
fOSC = 4 MHz
fOSC = 20 MHz
R = 680 kΩ ± 10%
R = 680 kΩ ± 10%
C = 56 pF ± 20%
C = 22 pF ± 20%
Calculations were done for a 4/20 MHz crystal
with the following parameters:
• CLof 30/20 pF,
• C0 of 7/6 pF,
• series resistance of 100/20 Ω, and
• drive level of 2 mW.
Crystal Oscillator Circuits
If an externally-supplied square wave voltage source is used, disable the internal oscillator circuit during bootup by
setting XTLD (PCTL Register bit 16 = 1—see the DSP56309 User’s Manual). The external square wave source
connects to EXTAL; XTAL is not physically connected to the board or socket. Figure 2-2 shows the relationship
between the EXTAL input and the internal clock and CLKOUT.
Midpoint
EXTAL
VILX
ETH
ETL
2
Note:
3
4
5
ETC
VIHX
The midpoint is
0.5 (VIHX + VILX).
5
CLKOUT with
PLL disabled
7
CLKOUT with
PLL enabled
6a
6b
Figure 2-2.
7
External Clock Timing
DSP56309 Technical Data, Rev. 7
2-4
Freescale Semiconductor
AC Electrical Characteristics
Table 2-5.
Clock Operation
100 MHz
No.
Characteristics
Symbol
Min
Max
Ef
0
100.0
1
Frequency of EXTAL (EXTAL Pin Frequency)
The rise and fall time of this external clock should be 3 ns maximum.
2
EXTAL input high1, 2
• With PLL disabled (46.7%–53.3% duty cycle6)
• With PLL enabled (42.5%–57.5% duty cycle6)
ETH
4.67 ns
4.25 ns
∞
157.0 µs
EXTAL input low 1, 2
• With PLL disabled (46.7%–53.3% duty cycle6)
• With PLL enabled (42.5%–57.5% duty cycle6)
ETL
4.67 ns
4.25 ns
∞
157.0 µs
EXTAL cycle time2
• With PLL disabled
• With PLL enabled
ETC
10.00 ns
10.00 ns
∞
273.1 µs
3
4
5
Internal clock change from EXTAL fall with PLL disabled
4.3 ns
11.0 ns
6
a.Internal clock rising edge from EXTAL rising edge with PLL enabled (MF = 1 or 2 or
4, PDF = 1, Ef > 15 MHz) 3,5
0.0 ns
1.8 ns
b. Internal clock falling edge from EXTAL falling edge with PLL enabled (MF ≤4, PDF ≠
1, Ef / PDF > 15 MHz)3,5
0.0 ns
1.8 ns
20.0 ns
10.00 ns
∞
8.53 µs
7
Instruction cycle time = ICYC = TC 4
(see Table 2-4) (46.7%–53.3% duty cycle)
• With PLL disabled
• With PLL enabled
Notes:
2.5.3
1.
2.
3.
4.
5.
6.
ICYC
Measured at 50 percent of the input transition.
The maximum value for PLL enabled is given for minimum VCO frequency (see Table 2-4) and maximum MF.
Periodically sampled and not 100 percent tested.
The maximum value for PLL enabled is given for minimum VCO frequency and maximum DF.
The skew is not guaranteed for any other MF value.
The indicated duty cycle is for the specified maximum frequency for which a part is rated. The minimum clock high or low time
required for correction operation, however, remains the same at lower operating frequencies; therefore, when a lower clock
frequency is used, the signal symmetry may vary from the specified duty cycle as long as the minimum high time and low time
requirements are met.
Phase Lock Loop (PLL) Characteristics
Table 2-6.
PLL Characteristics
100 MHz
Characteristics
Unit
Min
Max
30
200
MHz
(580 × MF) − 100
830 × MF
(780 × MF) − 140
1470 × MF
pF
pF
Voltage Controlled Oscillator (VCO) frequency when PLL enabled
(MF × Ef × 2/PDF)
PLL external capacitor (PCAP pin to VCCP) (CPCAP1)
• @ MF ≤4
• @ MF > 4
Note:
C PCAP is the value of the PLL capacitor (connected between the PCAP pin and VCCP) computed using the appropriate expression
listed above.
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
2-5
Specifications
2.5.4
Reset, Stop, Mode Select, and Interrupt Timing
Table 2-7.
Reset, Stop, Mode Select, and Interrupt Timing6
100 MHz
No.
8
9
10
11
12
Characteristics
Expression
Unit
Min
Max
—
—
26.0
ns
50 × ETC
1000 × ETC
75000 × ETC
75000 × ETC
2.5 × TC
2.5 × TC
500.0
10.0
0.75
0.75
25.0
25.0
—
—
—
—
—
—
ns
µs
ms
ms
ns
ns
3.25 × TC + 2.0
20.25 × TC + 10
34.5
—
—
212.5
ns
ns
TC
5.9
—
—
10.0
ns
ns
3.25 × TC + 1.0
20.25 × TC + 1.0
33.5
—
—
203.5
ns
ns
Delay from RESET assertion to all pins at reset value3
duration4
Required RESET
• Power on, external clock generator, PLL disabled
• Power on, external clock generator, PLL enabled
• Power on, internal oscillator
• During STOP, XTAL disabled (PCTL Bit 16 = 0)
• During STOP, XTAL enabled (PCTL Bit 16 = 1)
• During normal operation
Delay from asynchronous RESET deassertion to first external address
output (internal reset deassertion)5
• Minimum
• Maximum
Synchronous reset set-up time from RESET deassertion to CLKOUT
Transition 1
• Minimum
• Maximum
Synchronous reset deasserted, delay time from the CLKOUT Transition
1 to the first external address output
• Minimum
• Maximum
13
Mode select setup time
30.0
—
ns
14
Mode select hold time
0.0
—
ns
15
Minimum edge-triggered interrupt request assertion width
6.6
—
ns
16
Minimum edge-triggered interrupt request deassertion width
6.6
—
ns
17
Delay from IRQA, IRQB, IRQC, IRQD, NMI assertion to external
memory access address out valid
• Caused by first interrupt instruction fetch
• Caused by first interrupt instruction execution
4.25 × TC + 2.0
7.25 × TC + 2.0
44.5
74.5
—
—
ns
ns
10 × TC + 5.0
105.0
—
ns
18
Delay from IRQA, IRQB, IRQC, IRQD, NMI assertion to generalpurpose transfer output valid caused by first interrupt instruction
execution
19
Delay from address output valid caused by first interrupt instruction
execute to interrupt request deassertion for level sensitive fast
interrupts1, 7, 8
(WS + 3.75) × TC – 10.94
—
Note 8
ns
20
Delay from RD assertion to interrupt request deassertion for level
sensitive fast interrupts1, 7, 8
(WS + 3.25) × TC – 10.94
—
Note 8
ns
21
Delay from WR assertion to interrupt request deassertion for level
sensitive fast interrupts1, 7, 8
• DRAM for all WS
• SRAM WS = 1
• SRAM WS = 2, 3
• SRAM WS ≥ 4
(WS + 3.5) × TC – 10.94
(WS + 3.5) × TC – 10.94
(WS + 3) × TC – 10.94
(WS + 2.5) × TC – 10.94
—
—
—
—
Note 8
Note 8
Note 8
Note 8
ns
ns
ns
ns
5.9
TC
ns
83.5
—
—
252.5
ns
ns
22
Synchronous interrupt set-up time from IRQA, IRQB, IRQC, IRQD, NMI
assertion to the CLKOUT Transition 2
23
Synchronous interrupt delay time from the CLKOUT Transition 2 to the
first external address output valid caused by the first instruction fetch
after coming out of Wait Processing state
• Minimum
• Maximum
8.25 × TC + 1.0
24.75 × TC + 5.0
DSP56309 Technical Data, Rev. 7
2-6
Freescale Semiconductor
AC Electrical Characteristics
Table 2-7.
Reset, Stop, Mode Select, and Interrupt Timing6 (Continued)
100 MHz
No.
Characteristics
Expression
Unit
Min
Max
5.9
—
24
Duration for IRQA assertion to recover from Stop state
25
Delay from IRQA assertion to fetch of first instruction (when exiting
Stop)2, 3
• PLL is not active during Stop (PCTL Bit 17 = 0) and Stop delay is
enabled (Operating Mode Register Bit 6 = 0)
• PLL is not active during Stop (PCTL Bit 17 = 0) and Stop delay is not
enabled (Operating Mode Register Bit 6 = 1)
• PLL is active during Stop (PCTL Bit 17 = 1) (Implies No Stop Delay)
PLC × ETC × PDF + (128 K −
1.3
9.1
PLC/2) × TC
PLC × ETC × PDF + (23.75 ± 232.5 ns 12.3 ms
0.5) × TC
(8.25 ± 0.5) × TC
87.5
97.5
ms
Duration of level sensitive IRQA assertion to ensure interrupt service
(when exiting Stop)2, 3
• PLL is not active during Stop (PCTL Bit 17 = 0) and Stop delay is
enabled (Operating Mode Register Bit 6 = 0)
• PLL is not active during Stop (PCTL Bit 17 = 0) and Stop delay is not
enabled (Operating Mode Register Bit 6 = 1)
• PLL is active during Stop (PCTL Bit 17 = 1) (implies no Stop delay)
PLC × ETC × PDF + (128K −
PLC/2) × TC
PLC × ETC × PDF +
(20.5 ± 0.5) × TC
5.5 × TC
26
27
28
29
ns
ns
13.6
—
ms
12.3
—
ms
55.0
—
ns
Interrupt Request Rate
• HI08, ESSI, SCI, Timer
• DMA
• IRQ, NMI (edge trigger)
• IRQ, NMI (level trigger)
Maximum:
12 × TC
8 × TC
8 × TC
12 × TC
—
—
—
—
120.0
80.0
80.0
120.0
ns
ns
ns
ns
DMA Request Rate
• Data read from HI08, ESSI, SCI
• Data write to HI08, ESSI, SCI
• Timer
• IRQ, NMI (edge trigger)
Maximum:
6 × TC
7 × TC
2 × TC
3 × TC
—
—
—
—
60.0
70.0
20.0
30.0
ns
ns
ns
ns
Minimum:
4.25 × TC + 2.0
30.3
—
ns
Delay from IRQA, IRQB, IRQC, IRQD, NMI assertion to external
memory (DMA source) access address out valid
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
2-7
Specifications
Table 2-7.
Reset, Stop, Mode Select, and Interrupt Timing6 (Continued)
100 MHz
No.
Characteristics
Expression
Unit
Min
Notes:
1.
2.
3.
4.
5.
6.
7.
8.
Max
When fast interrupts are used and IRQA, IRQB, IRQC, and IRQD are defined as level-sensitive, timings 19 through 21 apply to
prevent multiple interrupt service. To avoid these timing restrictions, the deasserted Edge-triggered mode is recommended
when fast interrupts are used. Long interrupts are recommended for Level-sensitive mode.
This timing depends on several settings:
• For PLL disable, using internal oscillator (PLL Control Register (PCTL) Bit 16 = 0) and oscillator disabled during Stop (PCTL
Bit 17 = 0), a stabilization delay is required to assure that the oscillator is stable before programs are executed. Resetting the
Stop delay (Operating Mode Register Bit 6 = 0) provides the proper delay. While Operating Mode Register Bit 6 = 1 can be set,
it is not recommended, and these specifications do not guarantee timings for that case.
• For PLL disable, using internal oscillator (PCTL Bit 16 = 0) and oscillator enabled during Stop (PCTL Bit 17=1), no
stabilization delay is required and recovery is minimal (Operating Mode Register Bit 6 setting is ignored).
• For PLL disable, using external clock (PCTL Bit 16 = 1), no stabilization delay is required and recovery time is defined by the
PCTL Bit 17 and Operating Mode Register Bit 6 settings.
• For PLL enable, if PCTL Bit 17 is 0, the PLL is shutdown during Stop. Recovering from Stop requires the PLL to get locked.
The PLL lock procedure duration, PLL Lock Cycles (PLC), may be in the range of 0 to 1000 cycles. This procedure occurs in
parallel with the stop delay counter, and stop recovery ends when the last of these two events occurs. The stop delay counter
completes count or PLL lock procedure completion.
• PLC value for PLL disable is 0.
• The maximum value for ETC is 4096 (maximum MF) divided by the desired internal frequency (that is, for 66 MHz it is 4096/66
MHz = 62 µs). During the stabilization period, TC, TH, and TL is not constant, and their width may vary, so timing may vary as
well.
Periodically sampled and not 100 percent tested.
Value depends on clock source:
• For an external clock generator, RESET duration is measured while RESET is asserted, VCC is valid, and the EXTAL input is
active and valid.
• For an internal oscillator, RESET duration is measured while RESET is asserted and VCC is valid. The specified timing
reflects the crystal oscillator stabilization time after power-up. This number is affected both by the specifications of the crystal
and other components connected to the oscillator and reflects worst case conditions.
• When the VCC is valid, but the other “required RESET duration” conditions (as specified above) have not been yet met, the
device circuitry is in an uninitialized state that can result in significant power consumption and heat-up. Designs should
minimize this state to the shortest possible duration.
If PLL does not lose lock.
V CC = 3.3 V ± 0.3 V; TJ = –40°C to +100°C, CL = 50 pF.
WS = number of wait states (measured in clock cycles, number of TC).
Use the expression to compute a maximum value.
VIH
RESET
9
10
8
All Pins
Reset Value
First Fetch
A[0–17]
Figure 2-3.
Reset Timing
DSP56309 Technical Data, Rev. 7
2-8
Freescale Semiconductor
AC Electrical Characteristics
CLKOUT
11
RESET
12
A[0–17]
Figure 2-4.
Synchronous Reset Timing
First Interrupt Instruction
Execution/Fetch
A[0–17]
RD
20
WR
21
IRQA, IRQB,
IRQC, IRQD,
NMI
17
19
a) First Interrupt Instruction Execution
General
Purpose
I/O
18
IRQA, IRQB,
IRQC, IRQD,
NMI
b) General-Purpose I/O
Figure 2-5.
External Fast Interrupt Timing
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
2-9
Specifications
IRQA, IRQB,
IRQC, IRQD, NMI
15
IRQA, IRQB,
IRQC, IRQD, NMI
16
Figure 2-6.
External Interrupt Timing (Negative Edge-Triggered)
CLKOUT
IRQA, IRQB,
IRQC, IRQD,
NMI
22
23
A[0–17]
Figure 2-7.
Synchronous Interrupt from Wait State Timing
VIH
RESET
13
14
VIH
MODA, MODB,
MODC, MODD,
PINIT
VIH
IRQA, IRQB,
IRQC, IRQD, NMI
VIL
Figure 2-8.
VIL
Operating Mode Select Timing
DSP56309 Technical Data, Rev. 7
2-10
Freescale Semiconductor
AC Electrical Characteristics
24
IRQA
25
First Instruction Fetch
A[0–17]
Figure 2-9.
Recovery from Stop State Using IRQA
26
IRQA
25
First IRQA Interrupt
Instruction Fetch
A[0–17]
Figure 2-10.
Recovery from Stop State Using IRQA Interrupt Service
DMA Source Address
A[0–17]
RD
WR
29
IRQA, IRQB,
IRQC, IRQD,
NMI
Figure 2-11.
First Interrupt Instruction Execution
External Memory Access (DMA Source) Timing
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
2-11
Specifications
2.5.5
External Memory Expansion Port (Port A)
2.5.5.1 SRAM Timing
Table 2-8.
No.
100
101
102
103
Characteristics
SRAM Read and Write Accesses
Symbol
Address valid and AA assertion pulse width2
Address and AA valid to WR assertion
tRC , tWC
tAS
WR assertion pulse width
tWP
WR deassertion to address not valid
tWR
Expression1
100 MHz
Unit
Min
Max
16.0
—
ns
56.0
—
ns
106.0
—
ns
0.5
—
ns
5.5
—
ns
10.5
—
ns
1.5 × TC −4.0
[WS = 1]
WS × TC −4.0
[2 ≤WS ≤3]
(WS − 0.5) × TC − 4.0
[WS ≥ 4]
11.0
—
ns
16.0
—
ns
31.0
—
ns
0.25 × TC − 2.0
[1 ≤WS ≤3]
1.25 × TC − 4.0
[4 ≤WS ≤7]
2.25 × TC − 4.0
[WS ≥ 8]
0.5
—
ns
8.5
—
ns
18.5
—
ns
(WS + 1) × TC −4.0
[1 ≤WS ≤3]
(WS + 2) × TC −4.0
[4 ≤WS ≤7]
(WS + 3) × TC −4.0
[WS ≥ 8]
0.25 × TC − 2.0
[WS = 1]
0.75 × TC − 2.0
[2 ≤WS ≤3]
1.25 × TC − 2.0
[WS ≥ 4]
tAA, tAC
(WS + 0.75) × TC − 5.0
[WS ≥ 1]
—
12.5
ns
RD assertion to input data valid
tOE
(WS + 0.25) × TC – 5.0
[WS ≥ 1]
—
7.5
ns
106
RD deassertion to data not valid (data hold time)
tOHZ
0.0
—
ns
107
Address valid to WR deassertion2
tAW
(WS + 0.75) × TC − 4.0
[WS ≥ 1]
13.5
—
ns
108
Data valid to WR deassertion (data setup time)
tDS (tDW )
(WS −0.25) × TC − 3.0
[WS ≥ 1]
4.5
—
ns
109
Data hold time from WR deassertion
tDH
0.25 × TC − 2.0
[1 ≤WS ≤3]
1.25 × TC − 2.0
[4 ≤WS ≤7]
2.25 × TC − 2.0
[WS ≥ 8]
0.5
—
ns
10.5
—
ns
20.5
—
ns
3.8
—
ns
–1.2
—
ns
–6.2
—
ns
104
Address and AA valid to input data valid
105
110
WR assertion to data active
—
0.75 × TC −3.7
[WS = 1]
0.25 × TC – 3.7
[2 ≤WS ≤3]
–0.25 × TC −3.7
[WS ≥ 4]
DSP56309 Technical Data, Rev. 7
2-12
Freescale Semiconductor
AC Electrical Characteristics
Table 2-8.
No.
111
112
113
114
SRAM Read and Write Accesses (Continued)
Characteristics
Symbol
WR deassertion to data high impedance
—
Previous RD deassertion to data active (write)
RD deassertion time
WR deassertion time
—
—
—
Expression1
100 MHz
Unit
Min
Max
0.25 × TC + 0.2
[1 ≤WS ≤3]
1.25 × TC + 0.2
[4 ≤WS ≤7]
2.25 × TC + 0.2
[WS > 8]
—
2.7
ns
—
12.7
ns
—
22.7
ns
1.25 × TC – 4.0
[1 ≤WS ≤3]
2.25 × TC – 4.0
[4 ≤WS ≤7]
3.25 × TC – 4.0
[WS > 8]
8.5
—
ns
18.5
—
ns
28.5
—
ns
3.5
—
ns
13.5
—
ns
23.5
—
ns
1.0
—
ns
6.0
—
ns
21.0
—
ns
31.0
—
ns
1.0
—
ns
0.75 × TC − 4.0
[1 ≤WS ≤3]
1.75 × TC − 4.0
[4 ≤WS ≤7]
2.75 × TC − 4.0
[WS ≥ 8]
0.5 × TC −4.0
[WS = 1]
TC −4.0
[2 ≤WS ≤3]
2.5 × TC −4.0
[4 ≤WS ≤7]
3.5 × TC −4.0
[WS ≥ 8]
115
Address valid to RD assertion
—
0.5 × TC −4.0
116
RD assertion pulse width
—
(WS + 0.25) × TC −4.0
8.5
—
ns
117
RD deassertion to address not valid
—
0.25 × TC −2.0
[1 ≤WS ≤3]
1.25 × TC − 2.0
[4 ≤WS ≤7]
2.25 × TC − 2.0
[WS ≥ 8]
0.5
—
ns
10.5
—
ns
20.5
—
ns
118
TA setup before RD or WR deassertion4
—
0.25 × TC + 2.0
4.5
—
ns
119
TA hold after RD or WR deassertion
—
—
0
—
ns
Notes:
1.
2.
3.
4.
5.
WS is the number of wait states specified in the BCR. An expression is used to compute the number listed as the minimum or
maximum value, as appropriate.
Timings 100, 107 are guaranteed by design, not tested.
All timings for 100 MHz are measured from 0.5 × Vcc to 0.5 × Vcc.
Timing 118 is relative to the deassertion edge of RD or WR even if TA remains asserted.
VCC = 3.3 V ± 0.3 V; TJ = –40°C to +100°C, CL = 50 pF
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
2-13
Specifications
100
A[0–17]
AA[0–3]
113
117
116
RD
105
106
WR
104
118
119
TA
Data
In
D[0–23]
Note: Address lines A[0–17] hold their state after a
read or write operation. AA[0–3] do not hold their
state after a read or write operation.
Figure 2-12.
SRAM Read Access
100
A[0–17]
AA[0–3]
107
101
102
103
WR
114
RD
119
118
TA
108
109
Data
Out
D[0–23]
Note: Address lines A[0–17] hold their state after a
read or write operation. AA[0–3] do not hold their
state after a read or write operation.
Figure 2-13.
SRAM Write Access
DSP56309 Technical Data, Rev. 7
2-14
Freescale Semiconductor
AC Electrical Characteristics
2.5.5.2 DRAM Timing
The selection guides in Figure 2-14 and Figure 2-17 are for primary selection only. Final selection should be based
on the timing in the following tables. For example, the selection guide suggests that four wait states must be used
for 100 MHz operation with Page Mode DRAM. However, consulting the appropriate table, a designer can evaluate
whether fewer wait states might suffice by determining which timing prevents operation at 100 MHz, running the
chip at a slightly lower frequency (for example, 95 MHz), using faster DRAM (if it becomes available), and
manipulating control factors such as capacitive and resistive load to improve overall system performance.
Note:
DRAM type
(tRAC ns)
This figure should be used for primary selection. For exact
and detailed timings, see the following tables.
100
80
70
60
Chip frequency
50
40
66
80
120
100
(MHz)
1 Wait states
3 Wait states
2 Wait states
4 Wait states
Figure 2-14.
DRAM Page Mode Wait State Selection Guide
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
2-15
Specifications
Table 2-9.
No.
131
DRAM Page Mode Timings, Three Wait States1,2,3
Characteristics
Symbol
Page mode cycle time for two consecutive accesses of the same
direction
Expression4
100 MHz
Unit
Min
Max
4 × TC
40.0
—
ns
Page mode cycle time for mixed (read and write) accesses
tPC
3.5 × TC
35.0
—
ns
132
CAS assertion to data valid (read)
tCAC
2 × TC − 5.7
—
14.3
ns
133
Column address valid to data valid (read)
tAA
3 × TC − 5.7
—
24.3
ns
134
CAS deassertion to data not valid (read hold time)
tOFF
0.0
—
ns
135
Last CAS assertion to RAS deassertion
tRSH
2.5 × TC − 4.0
21.0
—
ns
136
Previous CAS deassertion to RAS deassertion
tRHCP
4.5 × TC − 4.0
41.0
—
ns
137
CAS assertion pulse width
tCAS
2 × TC − 4.0
16.0
—
ns
—
4.75 × TC − 6.0
6.75 × TC − 6.0
—
41.5
61.5
—
—
—
—
ns
ns
5
Last CAS deassertion to RAS assertion
• BRW[1–0] = 00, 01—not applicable
• BRW[1–0] = 10
• BRW[1–0] = 11
tCRP
139
CAS deassertion pulse width
tCP
1.5 × TC − 4.0
11.0
—
ns
140
Column address valid to CAS assertion
tASC
TC −4.0
6.0
—
ns
141
CAS assertion to column address not valid
tCAH
2.5 × TC − 4.0
21.0
—
ns
142
Last column address valid to RAS deassertion
tRAL
4 × TC − 4.0
36.0
—
ns
143
WR deassertion to CAS assertion
tRCS
1.25 × TC − 4.0
8.5
—
ns
144
CAS deassertion to WR assertion
tRCH
0.75 × TC − 4.0
3.5
—
ns
145
CAS assertion to WR deassertion
tWCH
2.25 × TC − 4.2
18.3
—
ns
146
WR assertion pulse width
tWP
3.5 × TC − 4.5
30.5
—
ns
147
Last WR assertion to RAS deassertion
tRWL
3.75 × TC − 4.3
33.2
—
ns
148
WR assertion to CAS deassertion
tCWL
3.25 × TC − 4.3
28.2
—
ns
149
Data valid to CAS assertion (write)
tDS
0.5 × TC – 4.5
0.5
—
ns
150
CAS assertion to data not valid (write)
tDH
2.5 × TC − 4.0
21.0
—
ns
151
WR assertion to CAS assertion
tWCS
1.25 × TC − 4.3
8.2
—
ns
152
Last RD assertion to RAS deassertion
tROH
3.5 × TC − 4.0
31.0
—
ns
153
RD assertion to data valid
tGA
2.5 × TC − 5.7
—
19.3
ns
0.0
—
ns
0.75 × TC – 1.5
6.0
—
ns
0.25 × TC
—
2.5
ns
138
valid6
154
RD deassertion to data not
155
WR assertion to data active
156
WR deassertion to data high impedance
Notes:
1.
2.
3.
4.
5.
6.
tGZ
The number of wait states for Page mode access is specified in the DRAM Control Register.
The refresh period is specified in the DRAM Control Register.
The asynchronous delays specified in the expressions are valid for the DSP56309.
All the timings are calculated for the worst case. Some of the timings are better for specific cases (for example, tPC equals 4 ×
TC for read-after-read or write-after-write sequences). An expression is used to compute the number listed as the minimum or
maximum value listed, as appropriate.
BRW[1–0] (DRAM control register bits) defines the number of wait states that should be inserted in each DRAM out-of pageaccess.
RD deassertion always occurs after CAS deassertion; therefore, the restricted timing is tOFF and not tGZ .
DSP56309 Technical Data, Rev. 7
2-16
Freescale Semiconductor
AC Electrical Characteristics
DRAM Page Mode Timings, Four Wait States1,2,3
Table 2-10.
No.
131
Characteristics
Symbol
Page mode cycle time for two consecutive accesses of the same
direction
Expression4
100 MHz
Unit
Min
Max
5 × TC
50.0
—
ns
Page mode cycle time for mixed (read and write) accesses
tPC
4.5 × TC
45.0
—
ns
132
CAS assertion to data valid (read)
tCAC
2.75 × TC − 5.7
—
21.8
ns
133
Column address valid to data valid (read)
tAA
3.75 × TC − 5.7
—
31.8
ns
134
CAS deassertion to data not valid (read hold time)
tOFF
0.0
—
ns
135
Last CAS assertion to RAS deassertion
tRSH
3.5 × TC − 4.0
31.0
—
ns
136
Previous CAS deassertion to RAS deassertion
tRHCP
6 × TC − 4.0
56.0
—
ns
137
CAS assertion pulse width
tCAS
2.5 × TC − 4.0
21.0
—
ns
—
5.25 × TC − 6.0
7.25 × TC − 6.0
—
46.5
66.5
—
—
—
—
ns
ns
5
Last CAS deassertion to RAS assertion
• BRW[1–0] = 00, 01—Not applicable
• BRW[1–0] = 10
• BRW[1–0] = 11
tCRP
139
CAS deassertion pulse width
tCP
2 × TC − 4.0
16.0
—
ns
140
Column address valid to CAS assertion
tASC
TC −4.0
6.0
—
ns
141
CAS assertion to column address not valid
tCAH
3.5 × TC − 4.0
31.0
—
ns
142
Last column address valid to RAS deassertion
tRAL
5 × TC − 4.0
46.0
—
ns
143
WR deassertion to CAS assertion
tRCS
1.25 × TC − 4.0
8.5
—
ns
144
CAS deassertion to WR assertion
tRCH
1.25 × TC – 3.7
8.8
—
ns
145
CAS assertion to WR deassertion
tWCH
3.25 × TC − 4.2
28.3
—
ns
146
WR assertion pulse width
tWP
4.5 × TC − 4.5
40.5
—
ns
147
Last WR assertion to RAS deassertion
tRWL
4.75 × TC −4.3
43.2
—
ns
148
WR assertion to CAS deassertion
tCWL
3.75 × TC − 4.3
33.2
—
ns
149
Data valid to CAS assertion (write)
tDS
0.5 × TC – 4.5
0.5
—
ns
150
CAS assertion to data not valid (write)
tDH
3.5 × TC − 4.0
31.0
—
ns
151
WR assertion to CAS assertion
tWCS
1.25 × TC − 4.3
8.2
—
ns
152
Last RD assertion to RAS deassertion
tROH
4.5 × TC − 4.0
41.0
—
ns
153
RD assertion to data valid
tGA
3.25 × TC − 5.7
—
26.8
ns
0.0
—
ns
0.75 × TC – 1.5
6.0
—
ns
0.25 × TC
—
2.5
ns
138
valid6
154
RD deassertion to data not
155
WR assertion to data active
156
WR deassertion to data high impedance
Notes:
1.
2.
3.
4.
5.
6.
tGZ
The number of wait states for Page mode access is specified in the DRAM Control Register.
The refresh period is specified in the DRAM Control Register.
The asynchronous delays specified in the expressions are valid for the DSP56309.
All the timings are calculated for the worst case. Some of the timings are better for specific cases (for example, tPC equals 3 ×
TC for read-after-read or write-after-write sequences). An expressions is used to calculate the maximum or minimum value
listed, as appropriate.
BRW[1–0] (DRAM control register bits) defines the number of wait states that should be inserted in each DRAM out-of-page
access.
RD deassertion always occurs after CAS deassertion; therefore, the restricted timing is tOFF and not tGZ .
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
2-17
Specifications
RAS
136
131
135
CAS
137
139
138
140
141
A[0–17]
Column
Address
Column
Address
Row
Add
142
151
Last Column
Address
144
145
147
WR
146
RD
148
155
156
150
149
D[0–23]
Data Out
Figure 2-15.
Data Out
Data Out
DRAM Page Mode Write Accesses
RAS
136
131
135
CAS
137
139
140
A[0–17]
Row
Add
Column
Address
138
141
142
Last Column
Address
Column
Address
143
WR
132
133
152
153
RD
134
154
D[0–23]
Data In
Figure 2-16.
Data In
Data In
DRAM Page Mode Read Accesses
DSP56309 Technical Data, Rev. 7
2-18
Freescale Semiconductor
AC Electrical Characteristics
DRAM Type
(tRAC ns)
Note:
This figure should be used for primary selection. For exact and
detailed timings, see the following tables.
100
80
70
60
50
66
40
No.
100
120
4 Wait States
11 Wait States
8 Wait States
15 Wait States
Figure 2-17.
Table 2-11.
80
Chip Frequency
(MHz)
DRAM Out-of-Page Wait State Selection Guide
DRAM Out-of-Page and Refresh Timings, Eleven Wait States1,2
Characteristics
Symbol
Expression3
100 MHz
Unit
Min
Max
157
Random read or write cycle time
tRC
12 × TC
120.0
—
ns
158
RAS assertion to data valid (read)
tRAC
6.25 × TC − 7.0
—
55.5
ns
159
CAS assertion to data valid (read)
tCAC
3.75 × TC − 7.0
—
30.5
ns
160
Column address valid to data valid (read)
tAA
4.5 × TC − 7.0
—
38.0
ns
161
CAS deassertion to data not valid (read hold time)
tOFF
0.0
—
ns
162
RAS deassertion to RAS assertion
tRP
4.25 × TC − 4.0
38.5
—
ns
163
RAS assertion pulse width
tRAS
7.75 × TC − 4.0
73.5
—
ns
164
CAS assertion to RAS deassertion
tRSH
5.25 × TC − 4.0
48.5
—
ns
165
RAS assertion to CAS deassertion
tCSH
6.25 × TC − 4.0
58.5
—
ns
166
CAS assertion pulse width
tCAS
3.75 × TC − 4.0
33.5
—
ns
167
RAS assertion to CAS assertion
tRCD
2.5 × TC ± 4.0
21.0
29.0
ns
168
RAS assertion to column address valid
tRAD
1.75 × TC ± 4.0
13.5
21.5
ns
169
CAS deassertion to RAS assertion
tCRP
5.75 × TC − 4.0
53.5
—
ns
170
CAS deassertion pulse width
tCP
4.25 × TC – 6.0
36.5
—
ns
171
Row address valid to RAS assertion
tASR
4.25 × TC − 4.0
38.5
—
ns
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
2-19
Specifications
Table 2-11.
No.
DRAM Out-of-Page and Refresh Timings, Eleven Wait States1,2 (Continued)
Characteristics
Symbol
Expression3
100 MHz
Unit
Min
Max
172
RAS assertion to row address not valid
tRAH
1.75 × TC − 4.0
13.5
—
ns
173
Column address valid to CAS assertion
tASC
0.75 × TC − 4.0
3.5
—
ns
174
CAS assertion to column address not valid
tCAH
5.25 × TC − 4.0
48.5
—
ns
175
RAS assertion to column address not valid
tAR
7.75 × TC − 4.0
73.5
—
ns
176
Column address valid to RAS deassertion
tRAL
6 × TC − 4.0
56.0
—
ns
177
WR deassertion to CAS assertion
tRCS
3.0 × TC − 4.0
26.0
—
ns
tRCH
1.75 × TC – 3.7
13.8
—
ns
tRRH
0.25 × TC − 2.0
0.5
—
ns
178
4
CAS deassertion to WR assertion
WR4
179
RAS deassertion to
assertion
180
CAS assertion to WR deassertion
tWCH
5 × TC − 4.2
45.8
—
ns
181
RAS assertion to WR deassertion
tWCR
7.5 × TC − 4.2
70.8
—
ns
182
WR assertion pulse width
tWP
11.5 × TC − 4.5
110.5
—
ns
183
WR assertion to RAS deassertion
tRWL
11.75 × TC −4.3
113.2
—
ns
184
WR assertion to CAS deassertion
tCWL
10.25 × TC −4.3
98.2
—
ns
185
Data valid to CAS assertion (write)
tDS
5.75 × TC − 4.0
53.5
—
ns
186
CAS assertion to data not valid (write)
tDH
5.25 × TC − 4.0
48.5
—
ns
187
RAS assertion to data not valid (write)
tDHR
7.75 × TC − 4.0
73.5
—
ns
188
WR assertion to CAS assertion
tWCS
6.5 × TC − 4.3
60.7
—
ns
189
CAS assertion to RAS assertion (refresh)
tCSR
1.5 × TC − 4.0
11.0
—
ns
190
RAS deassertion to CAS assertion (refresh)
tRPC
2.75 × TC − 4.0
23.5
—
ns
191
RD assertion to RAS deassertion
tROH
11.5 × TC − 4.0
111.0
—
ns
192
RD assertion to data valid
tGA
10 × TC −7.0
—
93.0
ns
0.0
—
ns
0.75 × TC – 1.5
6.0
—
ns
0.25 × TC
—
2.5
ns
5
193
RD deassertion to data not valid
194
WR assertion to data active
195
WR deassertion to data high impedance
Notes:
1.
2.
3.
4.
5.
tGZ
The number of wait states for an out-of-page access is specified in the DRAM Control Register.
The refresh period is specified in the DRAM Control Register.
Use the expression to compute the maximum or minimum value listed (or both if the expression includes ±) .
Either tRCH or tRRH must be satisfied for read cycles.
RD deassertion always occurs after CAS deassertion; therefore, the restricted timing is tOFF and not tGZ .
DSP56309 Technical Data, Rev. 7
2-20
Freescale Semiconductor
AC Electrical Characteristics
Table 2-12.
No.
DRAM Out-of-Page and Refresh Timings, Fifteen Wait States1,2
Characteristics
Symbol
Expression3
100 MHz
Unit
Min
Max
157
Random read or write cycle time
tRC
16 × TC
160.0
—
ns
158
RAS assertion to data valid (read)
tRAC
8.25 × TC − 5.7
—
76.8
ns
159
CAS assertion to data valid (read)
tCAC
4.75 × TC − 5.7
—
41.8
ns
160
Column address valid to data valid (read)
tAA
5.5 × TC − 5.7
—
49.3
ns
161
CAS deassertion to data not valid (read hold time)
tOFF
0.0
0.0
—
ns
162
RAS deassertion to RAS assertion
tRP
6.25 × TC − 4.0
58.5
—
ns
163
RAS assertion pulse width
tRAS
9.75 × TC − 4.0
93.5
—
ns
164
CAS assertion to RAS deassertion
tRSH
6.25 × TC − 4.0
58.5
—
ns
165
RAS assertion to CAS deassertion
tCSH
8.25 × TC − 4.0
78.5
—
ns
166
CAS assertion pulse width
tCAS
4.75 × TC − 4.0
43.5
—
ns
167
RAS assertion to CAS assertion
tRCD
3.5 × TC ± 2
33.0
37.0
ns
168
RAS assertion to column address valid
tRAD
2.75 × TC ± 2
25.5
29.5
ns
169
CAS deassertion to RAS assertion
tCRP
7.75 × TC − 4.0
73.5
—
ns
170
CAS deassertion pulse width
tCP
6.25 × TC – 6.0
56.5
—
ns
171
Row address valid to RAS assertion
tASR
6.25 × TC − 4.0
58.5
—
ns
172
RAS assertion to row address not valid
tRAH
2.75 × TC − 4.0
23.5
—
ns
173
Column address valid to CAS assertion
tASC
0.75 × TC − 4.0
3.5
—
ns
174
CAS assertion to column address not valid
tCAH
6.25 × TC − 4.0
58.5
—
ns
175
RAS assertion to column address not valid
tAR
9.75 × TC − 4.0
93.5
—
ns
176
Column address valid to RAS deassertion
tRAL
7 × TC − 4.0
66.0
—
ns
177
WR deassertion to CAS assertion
tRCS
5 × TC − 3.8
46.2
—
ns
178
CAS deassertion to WR4 assertion
tRCH
1.75 × TC – 3.7
13.8
—
ns
4
179
RAS deassertion to WR assertion
tRRH
0.25 × TC − 2.0
0.5
—
ns
180
CAS assertion to WR deassertion
tWCH
6 × TC − 4.2
55.8
—
ns
181
RAS assertion to WR deassertion
tWCR
9.5 × TC − 4.2
90.8
—
ns
182
WR assertion pulse width
tWP
15.5 × TC − 4.5
150.5
—
ns
183
WR assertion to RAS deassertion
tRWL
15.75 × TC −4.3
153.2
—
ns
184
WR assertion to CAS deassertion
tCWL
14.25 × TC −4.3
138.2
—
ns
185
Data valid to CAS assertion (write)
tDS
8.75 × TC − 4.0
83.5
—
ns
186
CAS assertion to data not valid (write)
tDH
6.25 × TC − 4.0
58.5
—
ns
187
RAS assertion to data not valid (write)
tDHR
9.75 × TC − 4.0
93.5
—
ns
188
WR assertion to CAS assertion
tWCS
9.5 × TC − 4.3
90.7
—
ns
189
CAS assertion to RAS assertion (refresh)
tCSR
1.5 × TC − 4.0
11.0
—
ns
190
RAS deassertion to CAS assertion (refresh)
tRPC
4.75 × TC − 4.0
43.5
—
ns
191
RD assertion to RAS deassertion
tROH
15.5 × TC − 4.0
151.0
—
ns
192
RD assertion to data valid
tGA
14 × TC −5.7
—
134.3
ns
0.0
—
ns
0.75 × TC – 1.5
6.0
—
ns
0.25 × TC
—
2.5
ns
valid5
193
RD deassertion to data not
194
WR assertion to data active
195
WR deassertion to data high impedance
Notes:
1.
2.
3.
4.
5.
tGZ
The number of wait states for an out-of-page access is specified in the DRAM Control Register.
The refresh period is specified in the DRAM Control Register.
Use the expression to compute the maximum or minimum value listed (or both if the expression includes ±) .
Either tRCH or tRRH must be satisfied for read cycles.
RD deassertion always occurs after CAS deassertion; therefore, the restricted timing is tOFF and not tGZ .
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
2-21
Specifications
157
163
162
162
165
RAS
167
164
169
168
170
166
CAS
171
173
174
175
A[0–17]
Row Address
Column Address
172
176
177
179
191
WR
178
160
159
RD
193
158
192
161
Data
In
D[0–23]
Figure 2-18.
DRAM Out-of-Page Read Access
DSP56309 Technical Data, Rev. 7
2-22
Freescale Semiconductor
AC Electrical Characteristics
157
162
163
162
165
RAS
167
169
164
168
170
166
CAS
173
171
174
172
176
Row Address
A[0–17]
Column Address
181
175
188
180
182
WR
184
183
RD
187
186
185
195
194
D[0–23]
Data Out
Figure 2-19.
DRAM Out-of-Page Write Access
157
162
162
163
RAS
190
170
165
189
CAS
177
WR
Figure 2-20.
DRAM Refresh Access
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
2-23
Specifications
2.5.5.3 Synchronous Timings
Table 2-13.
No.
198
199
External Bus Synchronous Timings1,2
Expression3,4,5
Characteristics
CLKOUT high to address, and AA valid6
CLKOUT high to address, and AA invalid
6
100 MHz
Unit
Min
Max
0.25 × TC + 4.0
—
6.5
ns
0.25 × TC
2.5
—
ns
200
TA valid to CLKOUT high (set-up time)
4.0
—
ns
201
CLKOUT high to TA invalid (hold time)
0.0
—
ns
202
CLKOUT high to data out active
0.25 × TC
2.5
—
ns
203
CLKOUT high to data out valid
0.25 × TC + 4.0
—
6.5
ns
204
CLKOUT high to data out invalid
0.25 × TC
2.5
—
ns
205
CLKOUT high to data out high impedance
0.25 × TC
—
2.5
ns
206
Data in valid to CLKOUT high (set-up)
4.0
—
ns
207
CLKOUT high to data in invalid (hold)
0.0
—
ns
6.7
10.0
ns
0.0
4.0
ns
5.0
9.3
ns
0.0
4.3
ns
0.0
3.8
ns
208
CLKOUT high to RD assertion
209
CLKOUT high to RD deassertion
210
CLKOUT high to WR assertion2
211
Notes:
maximum: 0.75 × TC + 2.5
maximum: 0.5 × TC + 4.3
for WS = 1 or WS ≥ 4
for 2 ≤WS ≤3
CLKOUT high to WR deassertion
1.
2.
3.
4.
5.
6.
Use external bus synchronous timings only for reference to the clock and not for relative timings.
Synchronous Bus Arbitration is not recommended. Use Asynchronous mode whenever possible.
WS is the number of wait states specified in the BCR.
If WS > 1, WR assertion refers to the next rising edge of CLKOUT.
Use the expression to compute the maximum or minimum value listed, as appropriate. For timing 210, the minimum is an
absolute value.
T198 and T199 are valid for Address Trace mode if the ATE bit in the Operating Mode Register is set. when this mode is
enabled, use the status of BR (See T212) to determine whether the access referenced by A[0–17] is internal or external.
DSP56309 Technical Data, Rev. 7
2-24
Freescale Semiconductor
AC Electrical Characteristics
198
CLKOUT
A[0–17]
AA[0–3]
199
201
200
TA
211
WR
205
210
203
204
D[0–23]
Data Out
208
202
209
RD
207
206
D[0–23]
Data In
Note: Address lines A[0–17] hold their state after a read or write operation. AA[0–3] do not hold their state
after a read or write operation.
Figure 2-21.
Synchronous Bus Timings 1 WS (BCR Controlled)
CLKOUT
A[0–17]
AA[0–3]
199
198
201
201
200
TA
200
211
WR
210
205
203
204
Data Out
D[0–23]
202
208
209
RD
207
206
Data In
D[0–23]
Note: Address lines A[0–17] hold their state after a read or write operation. AA[0–3] do not hold their
state after a read or write operation.
Figure 2-22.
Synchronous Bus Timings 2 WS (TA Controlled)
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
2-25
Specifications
2.5.5.4 Arbitration Timings
Table 2-14.
No.
Arbitration Bus Timings1
Expression2
Characteristics
100 MHz
Unit
Min
Max
212
CLKOUT high to BR assertion/deassertion3
0.0
4.0
ns
213
BG asserted/deasserted to CLKOUT high (setup)
4.0
—
ns
214
CLKOUT high to BG deasserted/asserted (hold)
0.0
—
ns
215
BB deassertion to CLKOUT high (input set-up)
4.0
—
ns
216
CLKOUT high to BB assertion (input hold)
0.0
—
ns
217
CLKOUT high to BB assertion (output)
0.0
4.0
ns
218
CLKOUT high to BB deassertion (output)
0.0
4.0
ns
219
BB high to BB high impedance (output)
—
4.5
ns
220
CLKOUT high to address and controls active
0.25 × TC
2.5
—
ns
221
CLKOUT high to address and controls high impedance
0.75 × TC
—
7.5
ns
222
CLKOUT high to AA active
0.25 × TC
2.5
—
ns
223
CLKOUT high to AA deassertion
maximum: 0.25 × TC + 4.0
2.0
6.5
ns
224
CLKOUT high to AA high impedance
0.75 × TC
—
7.5
ns
Notes:
1.
2.
3.
Synchronous bus arbitration is not recommended. Use Asynchronous mode whenever possible.
An expression is used to compute the maximum or minimum value listed, as appropriate. For timing 223, the minimum is an
absolute value.
T212 is valid for Address Trace mode when the ATE bit in the Operating Mode Register is set. BR is deasserted for internal
accesses and asserted for external accesses.
DSP56309 Technical Data, Rev. 7
2-26
Freescale Semiconductor
AC Electrical Characteristics
CLKOUT
BR
214
212
213
BG
216
215
217
BB
220
A[0–17]
RD, WR
222
AA[0–3]
Note: Address lines A[0–17] hold their state after a read or write operation. AA[0–3] do not hold their
state after a read or write operation.
Figure 2-23.
Bus Acquisition Timings
CLKOUT
BR
214
212
213
BG
219
218
BB
221
A[0–17]
RD, WR
224
223
AA[0–3]
Note: Address lines A[0–17] hold their state after a read or write operation. AA[0–3] do not hold their
state after a read or write operation.
Figure 2-24.
Bus Release Timings Case 1 (BRT Bit in Operating Mode Register Cleared)
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
2-27
Specifications
CLKOUT
212
BR
214
213
BG
219
218
BB
221
A[0–17]
RD, WR
224
223
AA[0–3]
Note: Address lines A[0–17] hold their state after a read or write operation. AA[0–3] do not hold their
state after a read or write operation.
Figure 2-25.
Bus Release Timings Case 2 (BRT Bit in Operating Mode Register Set)
DSP56309 Technical Data, Rev. 7
2-28
Freescale Semiconductor
AC Electrical Characteristics
2.5.5.5 Asynchronous Bus Arbitration Timings
Asynchronous Bus Timings1, 2
Table 2-15.
No.
250
251
Notes:
Expression3
Characteristics
BB assertion window from BG input deassertion5
Delay from BB assertion to BG assertion
1.
2.
3.
4.
5.
5
100 MHz4
Unit
Min
Max
2.5 × Tc + 5
—
30
ns
2 × Tc + 5
25
—
ns
Bit 13 in the Operating Mode Register must be set to enter Asynchronous Arbitration mode.
If Asynchronous Arbitration mode is active, none of the timings in Table 2-14 is required.
An expression is used to compute the maximum or minimum value listed, as appropriate.
Asynchronous Arbitration mode is recommended for operation at 100 MHz.
In order to guarantee timings 250, and 251, BG inputs must be asserted to different DSP56300 devices on the same bus in the
non-overlap manner shown in Figure 2-26.
BG1
BB
250
BG2
251
250+251
Figure 2-26.
Asynchronous Bus Arbitration Timing
The asynchronous bus arbitration is enabled by internal synchronization circuits on BG and BB inputs. These
synchronization circuits add delay from the external signal until it is exposed to internal logic. As a result of this
delay, a DSP56300 part may assume mastership and assert BB, for some time after BG is deasserted. This is the
reason for timing 250.
Once BB is asserted, there is a synchronization delay from BB assertion to the time this assertion is exposed to other
DSP56300 components that are potential masters on the same bus. If BG input is asserted before that time, and BG
is asserted and BB is deasserted, another DSP56300 component may assume mastership at the same time.
Therefore, some non-overlap period between one BG input active to another BG input active is required. Timing 251
ensures that overlaps are avoided.
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
2-29
Specifications
2.5.6
Host Interface Timing
Table 2-16.
Host Interface Timings1,2,12
Characteristic10
No.
317
Read data strobe assertion width5
HACK assertion width
318
Read data strobe deassertion width5
HACK deassertion width
319
Read data strobe deassertion width5 after “Last Data Register” reads8,11, or
between two consecutive CVR, ICR, or ISR reads3
HACK deassertion width after “Last Data Register” reads8,11
320
Write data strobe assertion width6
321
Write data strobe deassertion width8
HACK write deassertion width
• after ICR, CVR and “Last Data Register” writes
•
100 MHz
Expression
TC + 9.9
2.5 × TC + 6.6
2.5 × TC + 6.6
after IVR writes, or
after TXH:TXM:TXL writes (with HLEND= 0), or
after TXL:TXM:TXH writes (with HLEND = 1)
Unit
Min
Max
19.9
—
ns
9.9
—
ns
31.6
—
ns
13.2
—
ns
31.8
—
ns
16.5
—
ns
322
HAS assertion width
9.9
—
ns
323
HAS deassertion to data strobe assertion4
0.0
—
ns
324
Host data input setup time before write data strobe deassertion6
9.9
—
ns
325
Host data input hold time after write data strobe deassertion6
3.3
—
ns
326
Read data strobe assertion to output data active from high impedance5
HACK assertion to output data active from high impedance
3.3
—
ns
327
Read data strobe assertion to output data valid5
HACK assertion to output data valid
—
24.5
ns
328
Read data strobe deassertion to output data high impedance5
HACK deassertion to output data high impedance
—
9.9
ns
329
Output data hold time after read data strobe deassertion5
Output data hold time after HACK deassertion
3.3
—
ns
330
HCS assertion to read data strobe deassertion5
19.9
—
ns
331
HCS assertion to write data strobe deassertion6
9.9
—
ns
332
HCS assertion to output data valid
—
19.3
ns
333
HCS hold time after data strobe deassertion4
0.0
—
ns
334
Address (HAD[0–7]) setup time before HAS deassertion (HMUX=1)
4.6
—
ns
335
Address (HAD[0–7]) hold time after HAS deassertion (HMUX=1)
3.3
—
ns
336
HA[8–10] (HMUX=1), HA[0–2] (HMUX=0), HR/W setup time before data strobe
assertion4
• Read
• Write
0
4.6
—
—
ns
ns
3.3
—
ns
TC + 9.9
337
HA[8–10] (HMUX=1), HA[0–2] (HMUX=0), HR/W hold time after data strobe
deassertion4
338
Delay from read data strobe deassertion to host request assertion for “Last Data
Register” read5, 7, 8
TC + 5.3
15.3
—
ns
339
Delay from write data strobe deassertion to host request assertion for “Last Data
Register” write6, 7, 8
1.5 × TC + 5.3
20.3
—
ns
DSP56309 Technical Data, Rev. 7
2-30
Freescale Semiconductor
AC Electrical Characteristics
Table 2-16.
Host Interface Timings1,2,12 (Continued)
100 MHz
Characteristic10
No.
Expression
Unit
Min
Max
340
Delay from data strobe assertion to host request deassertion for “Last Data
Register” read or write (HROD=0) 4, 7, 8
—
19.3
ns
341
Delay from data strobe assertion to host request deassertion for “Last Data
Register” read or write (HROD=1, open drain host request)4, 7, 8, 9
—
300.0
ns
Notes:
See the Programmer’s Model section in the chapter on the HI08 in the DSP56309 User’s Manual.
In the timing diagrams below, the controls pins are drawn as active low. The pin polarity is programmable.
This timing is applicable only if two consecutive reads from one of these registers are executed.
The data strobe is Host Read (HRD) or Host Write (HWR) in the Dual Data Strobe mode and Host Data Strobe (HDS) in the
Single Data Strobe mode.
5. The read data strobe is HRD in the Dual Data Strobe mode and HDS in the Single Data Strobe mode.
6. The write data strobe is HWR in the Dual Data Strobe mode and HDS in the Single Data Strobe mode.
7. The host request is HREQ in the Single Host Request mode and HRRQ and HTRQ in the Double Host Request mode.
8. The “Last Data Register” is the register at address $7, which is the last location to be read or written in data transfers. This is
RXL/TXL in the Big Endian mode (HLEND = 0; HLEND is the Interface Control Register bit 7—ICR[7]), or RXH/TXH in the
Little Endian mode (HLEND = 1).
9. In this calculation, the host request signal is pulled up by a 4.7 kΩ resistor in the Open-drain mode.
10. VCC = 3.3 V ± 0.3 V; TJ = –40°C to +100 °C, CL = 50 pF
11. This timing is applicable only if a read from the “Last Data Register” is followed by a read from the RXL, RXM, or RXH registers
without first polling RXDF or HREQ bits, or waiting for the assertion of the HREQ signal.
12. After the external host writes a new value to the ICR, the HI08 is ready for operation after three DSP clock cycles (3 × Tc).
1.
2.
3.
4.
317
318
HACK
328
327
326
329
H[0–7]
HREQ
Note: The IVR is read only by an MC680xx host processor in non-multiplexed mode.
Figure 2-27.
Host Interrupt Vector Register (IVR) Read Timing Diagram
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
2-31
Specifications
HA[2–0]
336
337
333
330
HCS
336
337
HRW
317
HDS
318
328
332
319
327
329
326
H[7–0]
338
340
341
HREQ (single host request)
HRRQ (double host request)
Figure 2-28.
Read Timing Diagram, Non-Multiplexed Bus, Single Data Strobe
HA[2–0]
336
337
333
330
HCS
317
HRD
318
328
332
319
327
329
326
H[7–0]
340
338
341
HREQ (single host request)
HRRQ (double host request)
Figure 2-29.
Read Timing Diagram, Non-Multiplexed Bus, Double Data Strobe
DSP56309 Technical Data, Rev. 7
2-32
Freescale Semiconductor
AC Electrical Characteristics
HA[2–0]
336
337
333
331
HCS
336
337
HRW
320
HDS
321
324
325
H[7–0]
339
340
341
HREQ (single host request)
HTRQ (double host request)
Figure 2-30.
Write Timing Diagram, Non-Multiplexed Bus, Single Data Strobe
HA[2–0]
336
337
333
331
HCS
320
HWR
321
324
325
H[7–0]
340
339
341
HREQ (single host request)
HTRQ (double host request)
Figure 2-31.
Write Timing Diagram, Non-Multiplexed Bus, Double Data Strobe
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
2-33
Specifications
,
HA[10–8]
336
322
HAS
337
323
336
337
HRW
317
HDS
334
318
335
319
327
328
329
HAD[7–0]
Address
Data
326
338
340
341
HREQ (single host request)
HRRQ (double host request)
Figure 2-32.
Read Timing Diagram, Multiplexed Bus, Single Data Strobe
HA[10–8]
336
322
HAS
337
323
317
HRD
334
318
335
319
327
328
329
HAD[7–0]
Address
Data
326
340
HREQ (single host request)
HRRQ (double host request)
Figure 2-33.
338
341
Read Timing Diagram, Multiplexed Bus, Double Data Strobe
DSP56309 Technical Data, Rev. 7
2-34
Freescale Semiconductor
AC Electrical Characteristics
HA[10–8]
336
322
HAS
337
323
336
337
HRW
320
HDS
334
324
321
335
HAD[7–0]
325
Data
Address
340
339
341
HREQ (single host request)
HTRQ (double host request)
Figure 2-34.
Write Timing Diagram, Multiplexed Bus, Single Data Strobe
,
HA[10–8]
336
322
HAS
337
323
320
HWR
334
324
321
335
HAD[7–0]
325
Data
Address
340
339
341
HREQ (single host request)
HTRQ (double host request)
Figure 2-35.
Write Timing Diagram, Multiplexed Bus, Double Data Strobe
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
2-35
Specifications
2.5.7
SCI Timing
Table 2-17.
100 MHz
Characteristics1
No.
SCI Timings
Symbol
tSCC2
Expression
Unit
Min
Max
8 × TC
53.3
—
ns
400
Synchronous clock cycle
401
Clock low period
tSCC/2 − 10.0
16.7
—
ns
402
Clock high period
tSCC/2 − 10.0
16.7
—
ns
403
Output data setup to clock falling edge (internal
clock)
tSCC /4 + 0.5 × TC −17.0
8.0
—
ns
404
Output data hold after clock rising edge (internal
clock)
tSCC/4 −0.5 × TC
15.0
—
ns
405
Input data setup time before clock rising edge
(internal clock)
tSCC/4 + 0.5 × TC + 25.0
50.0
—
ns
406
Input data not valid before clock rising edge
(internal clock)
tSCC/4 + 0.5 × TC −5.5
—
19.5
ns
407
Clock falling edge to output data valid (external
clock)
—
32.0
ns
408
Output data hold after clock rising edge (external
clock)
18.0
—
ns
409
Input data setup time before clock rising edge
(external clock)
0.0
—
ns
410
Input data hold time after clock rising edge
(external clock)
9.0
—
ns
411
Asynchronous clock cycle
64 × TC
640.0
—
ns
412
Clock low period
tACC/2 − 10.0
310.0
—
ns
413
Clock high period
tACC/2 − 10.0
310.0
—
ns
414
Output data setup to clock rising edge (internal
clock)
tACC/2 − 30.0
290.0
—
ns
415
Output data hold after clock rising edge (internal
clock)
tACC/2 − 30.0
290.0
—
ns
Notes:
1.
2.
3.
4.
TC + 8.0
tACC 3
V CC = 3.3 V ± 0.3 V; TJ = −40°C to +100 °C, CL = 50 pF.
tSCC = synchronous clock cycle time (for internal clock, tSCC is determined by the SCI clock control register and TC ).
tACC = asynchronous clock cycle time; value given for 1X Clock mode (for internal clock, tACC is determined by the SCI clock
control register and TC).
An expression is used to compute the number listed as the minimum or maximum value as appropriate.
DSP56309 Technical Data, Rev. 7
2-36
Freescale Semiconductor
AC Electrical Characteristics
400
402
401
SCLK
(Output)
403
404
Data Valid
TXD
405
406
Data
Valid
RXD
a) Internal Clock
400
402
401
SCLK
(Input)
407
408
TXD
Data Valid
409
410
RXD
Data Valid
b) External Clock
Figure 2-36.
SCI Synchronous Mode Timing
411
413
412
1X SCLK
(Output)
414
TXD
415
Data Valid
Figure 2-37.
SCI Asynchronous Mode Timing
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
2-37
Specifications
2.5.8
ESSI0/ESSI1 Timing
Table 2-18.
Characteristics4, 5, 7
No.
ESSI Timings
Symbol
Expression9
100 MHz
Min
Max
3 × TC
4 × TC
30.0
40.0
—
—
Condition5
Unit
430
Clock cycle1
431
Clock high period
• For internal clock
• For external clock
2 × TC - 10.0
1.5 × TC
10.0
15.0
—
—
ns
ns
Clock low period
• For internal clock
• For external clock
2 × TC −10.0
1.5 × TC
10.0
15.0
—
—
ns
ns
432
tSSICC
x ck
i ck
ns
433
RXC rising edge to FSR out (bit-length) high
—
—
37.0
22.0
x ck
i ck a
ns
434
RXC rising edge to FSR out (bit-length) low
—
—
37.0
22.0
x ck
i ck a
ns
435
RXC rising edge to FSR out (word-length-relative) high2
—
—
39.0
37.0
x ck
i ck a
ns
436
RXC rising edge to FSR out (word-length-relative) low 2
—
—
39.0
37.0
x ck
i ck a
ns
437
RXC rising edge to FSR out (word-length) high
—
—
36.0
21.0
x ck
i ck a
ns
438
RXC rising edge to FSR out (word-length) low
—
—
37.0
22.0
x ck
i ck a
ns
439
Data in set-up time before RXC (SCK in Synchronous mode)
falling edge
10.0
19.0
—
—
x ck
i ck
ns
440
Data in hold time after RXC falling edge
5.0
3.0
—
—
x ck
i ck
ns
441
FSR input (bl, wr) 6 high before RXC falling edge2
1.0
23.0
—
—
x ck
i ck a
ns
442
FSR input (wl)6 high before RXC falling edge
3.5
23.0
—
—
x ck
i ck a
ns
443
FSR input hold time after RXC falling edge
3.0
0.0
—
—
x ck
i ck a
ns
444
Flags input set-up before RXC falling edge
5.5
19.0
—
—
x ck
i ck s
ns
445
Flags input hold time after RXC falling edge
6.0
0.0
—
—
x ck
i ck s
ns
446
TXC rising edge to FST out (bit-length) high
—
—
29.0
15.0
x ck
i ck
ns
447
TXC rising edge to FST out (bit-length) low
—
—
31.0
17.0
x ck
i ck
ns
448
TXC rising edge to FST out (word-length-relative) high2
—
—
31.0
17.0
x ck
i ck
ns
449
TXC rising edge to FST out (word-length-relative) low2
—
—
33.0
19.0
x ck
i ck
ns
450
TXC rising edge to FST out (word-length) high
—
—
30.0
16.0
x ck
i ck
ns
451
TXC rising edge to FST out (word-length) low
—
—
31.0
17.0
x ck
i ck
ns
452
TXC rising edge to data out enable from high impedance
—
—
31.0
17.0
x ck
i ck
ns
DSP56309 Technical Data, Rev. 7
2-38
Freescale Semiconductor
AC Electrical Characteristics
Table 2-18.
ESSI Timings (Continued)
Characteristics4, 5, 7
No.
Symbol
Expression9
100 MHz
Min
Max
Condition5
Unit
453
TXC rising edge to transmitter 0 drive enable assertion
—
—
34.0
20.0
x ck
i ck
ns
454
TXC rising edge to data out valid
—
—
20.08
10.0
x ck
i ck
ns
455
TXC rising edge to data out high impedance3
—
—
31.0
16.0
x ck
i ck
ns
456
TXC rising edge to transmitter 0 drive enable deassertion3
—
—
34.0
20.0
x ck
i ck
ns
457
FST input (bl, wr)6 set-up time before TXC falling edge2
2.0
21.0
—
—
x ck
i ck
ns
458
FST input (wl) 6 to data out enable from high impedance
—
27.0
—
ns
459
FST input (wl) 6 to transmitter 0 drive enable assertion
—
31.0
—
ns
460
FST input (wl) 6 set-up time before TXC falling edge
2.5
21.0
—
—
x ck
i ck
ns
461
FST input hold time after TXC falling edge
4.0
0.0
—
—
x ck
i ck
ns
462
Flag output valid after TXC rising edge
—
—
32.0
18.0
x ck
i ck
ns
Notes:
1.
2.
3.
4.
5.
6.
7.
8.
9.
For the internal clock, the external clock cycle is defined by Icyc (see Timing 7) and the ESSI Control Register.
The word-length-relative frame sync signal waveform operates the same way as the bit-length frame sync signal waveform,
but spreads from one serial clock before the first bit clock (same as the Bit Length Frame Sync signal) until the one before last
bit clock of the first word in the frame.
Periodically sampled and not 100 percent tested
V CC = 3.3 V ± 0.3 V; TJ = −40°C to +100 °C, CL = 50 pF.
TXC (SCK Pin) = transmit clock
RXC (SC0 or SCK Pin) = receive clock
FST (SC2 Pin) = transmit frame sync
FSR (SC1 or SC2 Pin) receive frame sync
i ck = internal clock
x ck = external clock
i ck a = internal clock, Asynchronous mode
(asynchronous implies that TXC and RXC are two different clocks)
i ck s = Internal Clock, Synchronous mode
(synchronous implies that TXC and RXC are the same clock)
bl = bit length; wl = word length; wr = word length relative.
If the DSP core writes to the transmit register during the last cycle before causing an underrun error, the delay is 20 ns + (0.5 ×
TC).
An expression is used to compute the number listed as the minimum or maximum value as appropriate.
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
2-39
Specifications
430
TXC
(Input/
Output)
431
432
446
447
FST (Bit)
Out
450
451
FST (Word)
Out
454
454
452
455
Data Out
First
Last
459
Transmitter 0
Drive
Enable
457
453
456
461
FST (Bit) In
458
461
460
FST (Word)
In
462
See Note
Flags Out
Note:
In Network mode, output flag transitions can occur at the start of each time slot within the
frame. In Normal mode, the output flag state is asserted for the entire frame period.
Figure 2-38.
ESSI Transmitter Timing
DSP56309 Technical Data, Rev. 7
2-40
Freescale Semiconductor
AC Electrical Characteristics
430
431
RXC
(Input/
Output)
432
433
434
FSR (Bit)
Out
437
438
FSR
(Word)
Out
440
439
Data In
First Bit
Last Bit
443
441
FSR (Bit)
In
442
443
FSR
(Word)
In
444
445
Flags In
Figure 2-39.
ESSI Receiver Timing
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
2-41
Specifications
2.5.9
Timer Timing
Table 2-19.
No.
Timer Timing1
100 MHz
Expression2
Characteristics
Unit
Min
Max
480
TIO Low
2 × TC + 2.0
22.0
—
ns
481
TIO High
2 × TC + 2.0
22.0
—
ns
482
Timer set-up time from TIO (Input) assertion to
CLKOUT rising edge
9.0
10.0
ns
483
Synchronous timer delay time from CLKOUT rising
edge to the external memory access address out valid
caused by first interrupt instruction execution
10.25 × TC + 1.0
103.5
—
ns
484
CLKOUT rising edge to TIO (Output) assertion
• Minimum
• Maximum
0.5 × TC + 0.5
0.5 × TC + 19.8
5.5
—
—
24.8
ns
ns
CLKOUT rising edge to TIO (Output) deassertion
• Minimum
• Maximum
0.5 × TC + 0.5
0.5 × TC + 19.8
5.5
—
—
24.8
ns
ns
485
Notes:
1.
2.
VCC = 3.3 V ± 0.3 V; TJ = −40°C to +100 °C, CL = 50 pF.
An expression is used to compute the number listed as the minimum or maximum value as appropriate.
480
TIO
481
Figure 2-40.
TIO Timer Event Input Restrictions
CLKOUT
TIO (Input)
482
Address
483
First Interrupt Instruction Execution
Figure 2-41.
Timer Interrupt Generation
CLKOUT
TIO (Output)
484
Figure 2-42.
485
External Pulse Generation
DSP56309 Technical Data, Rev. 7
2-42
Freescale Semiconductor
AC Electrical Characteristics
2.5.10 GPIO Timing
Table 2-20.
GPIO Timing
100 MHz
No.
Characteristics
Expression
Unit
Min
Max
490
CLKOUT edge to GPIO out valid (GPIO out delay time)
—
8.5
ns
491
CLKOUT edge to GPIO out not valid (GPIO out hold time)
0.0
—
ns
492
GPIO In valid to CLKOUT edge (GPIO in set-up time)
8.5
—
ns
493
CLKOUT edge to GPIO in not valid (GPIO in hold time)
0.0
—
ns
494
Fetch to CLKOUT edge before GPIO change
67.5
—
ns
Note:
Minimum: 6.75 × TC
VCC = 3.3 V ± 0.3 V; TJ = −40°C to +100 °C, CL = 50 pF
CLKOUT
(Output)
490
491
GPIO
(Output)
492
GPIO
(Input)
493
Valid
A[0–17]
494
Fetch the instruction MOVE X0,X:(R0); X0 contains the new value of GPIO
and R0 contains the address of the GPIO data register.
Figure 2-43.
GPIO Timing
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
2-43
Specifications
2.5.11 JTAG Timing
Table 2-21.
JTAG Timing
All frequencies
No.
Characteristics
Unit
Min
Max
500
TCK frequency of operation (1/(TC × 3); maximum 22 MHz)
0.0
22.0
MHz
501
TCK cycle time in Crystal mode
45.0
—
ns
502
TCK clock pulse width measured at 1.5 V
20.0
—
ns
503
TCK rise and fall times
0.0
3.0
ns
504
Boundary scan input data setup time
5.0
—
ns
505
Boundary scan input data hold time
24.0
—
ns
506
TCK low to output data valid
0.0
40.0
ns
507
TCK low to output high impedance
0.0
40.0
ns
508
TMS, TDI data setup time
5.0
—
ns
509
TMS, TDI data hold time
25.0
—
ns
510
TCK low to TDO data valid
0.0
44.0
ns
511
TCK low to TDO high impedance
0.0
44.0
ns
512
TRST assert time
100.0
—
ns
513
TRST setup time to TCK low
40.0
—
ns
Notes:
1.
2.
VCC = 3.3 V ± 0.3 V; TJ = –40°C to +100 °C, CL = 50 pF.
All timings apply to OnCE module data transfers because it uses the JTAG port as an interface.
501
502
502
TCK
(Input)
VIH
VM
VIL
503
503
Figure 2-44.
Test Clock Input Timing Diagram
DSP56309 Technical Data, Rev. 7
2-44
Freescale Semiconductor
AC Electrical Characteristics
TCK
(Input)
VIH
VIL
504
Data
Inputs
505
Input Data Valid
506
Data
Outputs
Output Data Valid
507
Data
Outputs
506
Data
Outputs
Output Data Valid
Figure 2-45.
TCK
(Input)
Boundary Scan (JTAG) Timing Diagram
VIH
VIL
508
TDI
TMS
(Input)
509
Input Data Valid
510
TDO
(Output)
Output Data Valid
511
TDO
(Output)
510
TDO
(Output)
Output Data Valid
Figure 2-46.
Test Access Port Timing Diagram
TCK
(Input)
513
TRST
(Input)
512
Figure 2-47.
TRST Timing Diagram
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
2-45
Specifications
2.5.12 OnCE Module TimIng
Table 2-22.
No.
OnCE Module Timing
Characteristics
Expression
Min
Max
Unit
500
TCK frequency of operation
Max 22.0 MHz
0.0
22.0
MHz
514
DE assertion time in order to enter Debug mode
1.5 × TC + 10.0
20.0
—
ns
515
Response time when DSP56309 is executing NOP instructions from
internal memory
5.5 × TC + 30.0
—
67.0
ns
516
Debug acknowledge assertion time
3 × TC + 5.0
25.0
—
ns
Note:
VCC = 3.3 V ± 0.3 V, VCC = 1.8 V ± 0.1 V; TJ = –40°C to +100 °C, C L = 50 pF
DE
514
515
Figure 2-48.
516
OnCE—Debug Request
DSP56309 Technical Data, Rev. 7
2-46
Freescale Semiconductor
3
Packaging
This section includes diagrams of the DSP56309 package pin-outs and tables showing how the signals described in
Chapter 1, are allocated for each package.
The DSP56309 is available in two package types:
•
144-pin Thin Quad Flat Pack (TQFP)
•
196-pin Molded Array Process-Ball Grid Array (MAP-BGA)
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
3-1
Packaging
3.1 TQFP Package Description
D7
D8
109
(Top View)
73
D6
D5
D4
D3
GNDD
VCCD
D2
D1
D0
A17
A16
A15
GNDA
VCCQH
A14
A13
A12
VCC QL
GNDQ
A11
A10
GNDA
VCCA
A9
A8
A7
A6
GNDA
VCCA
A5
A4
A3
A2
GNDA
VCCA
A1
Top and bottom views of the TQFP package are shown in Figure 3-1 and Figure 3-2 with their pin-outs.
VCCD
GNDD
D9
D10
D11
D12
D13
D14
VCCD
GNDD
D15
D16
D17
D18
D19
VCCQL
GNDQ
D20
VCCD
GNDD
D21
D22
D23
MODD
MODC
MODB
MODA
TRST
Orientation Mark
Notes:
DE
PINIT
SRD0
VCCS
GNDS
STD0
SC10
SC00
RXD
TXD
SCLK
SCK1
SCK0
VCCQL
GNDQ
VCCQH
HDS
HRW
HACK
HREQ
VCCS
GNDS
TIO2
TIO1
TIO0
HCS
HA9
HA8
HAS
HAD7
HAD6
HAD5
1
37
SRD1
STD1
SC02
SC01
TDO
TDI
TCK
TMS
SC12
SC11
A0
BG
AA0
AA1
RD
WR
GNDC
VCCC
BB
BR
TA
BCLK
BCLK
CLKOUT
GNDC
VCCC
VCCQL
EXTAL
GNDQ
XTAL
CAS
AA2
AA3
VCCQH
GNDP1
GNDP
PCAP
VCCP
RESET
HAD0
HAD1
HAD2
HAD3
GNDH
VCCH
HAD4
Because of size constraints in this figure, only one name is shown for multiplexed pins. Refer to Table 3-1 and Table
3-2 for detailed information about pin functions and signal names.
Figure 3-1.
DSP56309 Thin Quad Flat Pack (TQFP), Top View
DSP56309 Technical Data, Rev. 7
3-2
Freescale Semiconductor
A0
BG
73
A1
VCCA
GNDA
A2
A3
A4
A5
VCCA
GNDA
A6
A7
A8
A9
VCCA
GNDA
A10
A11
GNDQ
VCCQL
A12
A13
A14
VCCQH
GNDA
A15
A16
A17
D0
D1
D2
VCCD
GNDD
D3
D4
D5
D6
TQFP Package Description
109
(Bottom View)
AA0
AA1
RD
WR
GNDC
VCCC
BB
BR
TA
BCLK
BCLK
CLKOUT
GNDC
VCCC
VCCQL
EXTAL
GNDQ
XTAL
CAS
AA2
AA3
VCCQH
GNDP1
GNDP
PCAP
VCCP
RESET
TRST
Orientation Mark
(on top side)
Notes:
DE
TDO
TDI
TCK
TMS
SC12
SC11
SC01
SC02
STD1
SRD1
1
37
HAD5
HAD6
HAD7
HAS
HA8
HA9
HCS
TIO0
TIO1
TIO2
GNDS
VCCS
HREQ
HACK
HRW
HDS
VCCQH
GNDQ
VCCQL
SCK0
SCK1
SCLK
TXD
RXD
SC00
SC10
STD0
GNDS
VCCS
SRD0
PINIT
HAD0
HAD1
HAD2
HAD3
GNDH
VCCH
HAD4
D7
D8
VCCD
GNDD
D9
D10
D11
D12
D13
D14
VCCD
GNDD
D15
D16
D17
D18
D19
VCCQL
GNDQ
D20
VCCD
GNDD
D21
D22
D23
MODD
MODC
MODB
MODA
Because of size constraints in this figure, only one name is shown for multiplexed pins. Refer to Table 3-1 and Table
3-2 for detailed information about pin functions and signal names.
Figure 3-2.
DSP56309 Thin Quad Flat Pack (TQFP), Bottom View
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
3-3
Packaging
Table 3-1.
Pin
No.
Signal Name
DSP56309 TQFP Signal Identification by Pin Number
Pin
No.
Signal Name
Pin
No.
Signal Name
1
SRD1 or PD4
26
GNDS
51
AA2/RAS2
2
STD1 or PD5
27
TIO2
52
CAS
3
SC02 or PC2
28
TIO1
53
XTAL
4
SC01 or PC1
29
TIO0
54
GNDQ
5
DE
30
HCS/HCS, HA10, or PB13
55
EXTAL
6
PINIT/NMI
31
HA2, HA9, or PB10
56
VCCQL
7
SRD0 or PC4
32
HA1, HA8, or PB9
57
VCCC
8
VCCS
33
HA0, HAS/HAS, or PB8
58
GNDC
9
GNDS
34
H7, HAD7, or PB7
59
CLKOUT
10
STD0 or PC5
35
H6, HAD6, or PB6
60
BCLK
11
SC10 or PD0
36
H5, HAD5, or PB5
61
BCLK
12
SC00 or PC0
37
H4, HAD4, or PB4
62
TA
13
RXD or PE0
38
VCCH
63
BR
14
TXD or PE1
39
GNDH
64
BB
15
SCLK or PE2
40
H3, HAD3, or PB3
65
VCCC
16
SCK1 or PD3
41
H2, HAD2, or PB2
66
GNDC
17
SCK0 or PC3
42
H1, HAD1, or PB1
67
WR
18
VCCQL
43
H0, HAD0, or PB0
68
RD
19
GNDQ
44
RESET
69
AA1/RAS1
20
VCCQH
45
VCCP
70
AA0/RAS0
21
HDS/HDS, HWR/HWR, or PB12
46
PCAP
71
BG
22
HRW, HRD/HRD, or PB11
47
GNDP
72
A0
23
HACK/HACK,
HRRQ/HRRQ, or PB15
48
GNDP1
73
A1
24
HREQ/HREQ,
HTRQ/HTRQ, or PB14
49
VCCQH
74
VCCA
25
VCCS
50
AA3/RAS3
75
GNDA
DSP56309 Technical Data, Rev. 7
3-4
Freescale Semiconductor
TQFP Package Description
Table 3-1.
Pin
No.
Signal Name
DSP56309 TQFP Signal Identification by Pin Number (Continued)
Pin
No.
Signal Name
Pin
No.
Signal Name
76
A2
99
A17
122
D16
77
A3
100
D0
123
D17
78
A4
101
D1
124
D18
79
A5
102
D2
125
D19
80
VCCA
103
VCCD
126
VCCQL
81
GNDA
104
GNDD
127
GNDQ
82
A6
105
D3
128
D20
83
A7
106
D4
129
VCCD
84
A8
107
D5
130
GNDD
85
A9
108
D6
131
D21
86
VCCA
109
D7
132
D22
87
GNDA
110
D8
133
D23
88
A10
111
VCCD
134
MODD/IRQD
89
A11
112
GNDD
135
MODC/IRQC
90
GNDQ
113
D9
136
MODB/IRQB
91
VCCQL
114
D10
137
MODA/IRQA
92
A12
115
D11
138
TRST
93
A13
116
D12
139
TDO
94
A14
117
D13
140
TDI
95
VCCQH
118
D14
141
TCK
96
GNDA
119
VCCD
142
TMS
97
A15
120
GNDD
143
SC12 or PD2
98
A16
121
D15
144
SC11 or PD1
Notes:
Signal names are based on configured functionality. Most pins supply a single signal. Some pins provide a signal with dual
functionality, such as the MODx/IRQx pins that select an operating mode after RESET is deasserted but act as interrupt lines during
operation. Some signals have configurable polarity; these names are shown with and without overbars, such as HAS/HAS. Some
pins have two or more configurable functions; names assigned to these pins indicate the function for a specific configuration. For
example, Pin 34 is data line H7 in non-multiplexed bus mode, data/address line HAD7 in multiplexed bus mode, or GPIO line PB7
when the GPIO function is enabled for this pin.
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
3-5
Packaging
Table 3-2.
DSP56309 TQFP Signal Identification by Name
Signal Name
Pin
No.
Signal Name
Pin
No.
Signal Name
Pin
No.
A0
72
BG
71
D7
109
A1
73
BR
63
D8
110
A10
88
CAS
52
D9
113
A11
89
CLKOUT
59
DE
5
A12
92
D0
100
EXTAL
55
A13
93
D1
101
GNDA
75
A14
94
D10
114
GNDA
81
A15
97
D11
115
GNDA
87
A16
98
D12
116
GNDA
96
A17
99
D13
117
GNDC
58
A2
76
D14
118
GNDC
66
A3
77
D15
121
GNDD
104
A4
78
D16
122
GNDD
112
A5
79
D17
123
GNDD
120
A6
82
D18
124
GNDD
130
A7
83
D19
125
GNDH
39
A8
84
D2
102
GNDP
47
A9
85
D20
128
GNDP1
48
AA0
70
D21
131
GNDQ
19
AA1
69
D22
132
GNDQ
54
AA2
51
D23
133
GNDQ
90
AA3
50
D3
105
GNDQ
127
BB
64
D4
106
GNDS
9
BCLK
60
D5
107
GNDS
26
BCLK
61
D6
108
H0
43
DSP56309 Technical Data, Rev. 7
3-6
Freescale Semiconductor
TQFP Package Description
Table 3-2.
DSP56309 TQFP Signal Identification by Name (Continued)
Signal Name
Pin
No.
Signal Name
Pin
No.
Signal Name
Pin
No.
H1
42
HRD/HRD
22
PB4
37
H2
41
HREQ/HREQ
24
PB5
36
H3
40
HRRQ/HRRQ
23
PB6
35
H4
37
HRW
22
PB7
34
H5
36
HTRQ/HTRQ
24
PB8
33
H6
35
HWR/HWR
21
PB9
32
H7
34
IRQA
137
PC0
12
HA0
33
IRQB
136
PC1
4
HA1
32
IRQC
135
PC2
3
HA10
30
IRQD
134
PC3
17
HA2
31
MODA
137
PC4
7
HA8
32
MODB
136
PC5
10
HA9
31
MODC
135
PCAP
46
HACK/HACK
23
MODD
134
PD0
11
HAD0
43
NMI
6
PD1
144
HAD1
42
PB0
43
PD2
143
HAD2
41
PB1
42
PD3
16
HAD3
40
PB10
31
PD4
1
HAD4
37
PB11
22
PD5
2
HAD5
36
PB12
21
PE0
13
HAD6
35
PB13
30
PE1
14
HAD7
34
PB14
24
PE2
15
HAS/HAS
33
PB15
23
PINIT
6
HCS/HCS
30
PB2
41
RAS0
70
HDS/HDS
21
PB3
40
RAS1
69
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
3-7
Packaging
Table 3-2.
DSP56309 TQFP Signal Identification by Name (Continued)
Signal Name
Pin
No.
Signal Name
Pin
No.
Signal Name
Pin
No.
RAS2
51
STD1
2
VCCD
111
RAS3
50
TA
62
VCCD
119
RD
68
TCK
141
VCCD
129
RESET
44
TDI
140
VCCH
38
RXD
13
TDO
139
VCCP
45
SC00
12
TIO0
29
VCCQH
20
SC01
4
TIO1
28
VCCQH
49
SC02
3
TIO2
27
VCCQH
95
SC10
11
TMS
142
VCCQL
18
SC11
144
TRST
138
VCCQL
56
SC12
143
TXD
14
VCCQL
91
SCK0
17
VCCA
74
VCCQL
126
SCK1
16
VCCA
80
VCCS
8
SCLK
15
VCCA
86
VCCS
25
SRD0
7
VCCC
57
WR
67
SRD1
1
VCCC
65
XTAL
53
STD0
10
VCCD
103
DSP56309 Technical Data, Rev. 7
3-8
Freescale Semiconductor
TQFP Package Mechanical Drawing
3.2 TQFP Package Mechanical Drawing
0.20 T L-M N
4X
Pin 1
ident
0.20 T L-M N
4X 36 TIPS
144
109
1
108
4X
J1
P
J1
M
L
C
L
B
V
140X
B1 V1
View Y
36
View Y
73
Notes:
1. Dimensions and tolerancing per ASME
Y14.5, 1994.
2. Dimensions in millimeters.
3. Datums L, M and N to be determined at the
seating plane, datum T.
4. Dimensions S and V to be determined at
the seating plane, datum T.
5. Dimensions A and B do not include mold
protrusion. Allowable protrusion is 0.25 per
side. Dimensions A and B do include mold
mismatch and are determined at datum
plane H.
6. Dimension D does not include dambar
protrusion. Allowable dambar protrusion
shall not cause the D dimension to exceed
0.35.
72
37
N
A1
S1
A
S
View AB
C
0.1 T
θ2
144X
Seating
plane
θ2
T
Plating
J
F
AA
C2
— 0.05
R2
θ
R1
D
0.08
M
0.25
Base
metal
Gage plane
T L-M N
Section J1-J1
(rotated 90)
144 PL
(K)
C1
E
(Y)
View AB
X
X=L, M or N
G
θ1
DIM
A
A1
B
B1
C
C1
C2
D
E
F
G
J
K
P
R1
R2
S
S1
V
V1
Y
Z
AA
θ
θ1
θ2
Millimeters
MIN
MAX
20.00 BSC
10.00 BSC
20.00 BSC
10.00 BSC
1.40
1.60
0.05
0.15
1.35
1.45
0.17
0.27
0.45
0.75
0.17
0.23
0.50 BSC
0.09
0.20
0.50 REF
0.25 BSC
0.13
0.20
0.13
0.20
22.00 BSC
11.00 BSC
22.00 BSC
11.00 BSC
0.25 REF
1.00 REF
0.09
0.16
0°
0°
7°
11°
13°
(Z)
CASE 918-03
ISSUE C
Figure 3-3.
DSP56309 Mechanical Information, 144-pin TQFP Package
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
3-9
Packaging
3.3 MAP-BGA Package Description
Top and bottom views of the MAP-BGA package are shown in Figure 3-4 and Figure 3-5 with their pin-outs.
Top View
1
2
3
4
5
10
11
12
13
14
NC
SC11
TMS
TDO
MODB
D16
D14
D11
D9
D7
NC
B SRD1
SC12
TDI
TRST
D17
D15
D13
D10
D8
D5
NC
C
SC02
STD1
TCK
VCCQL
D18
VCCD
D12
VCCD
D6
D3
D4
D
PINIT
SC01
DE
GND
GND
GND
GND
GND
GND
GND
D1
D2
VCCD
E
STD0
VCCS
SRD0
GND
GND
GND
GND
GND
GND
GND
A17
A16
D0
F
RXD
SC10
GND
GND
GND
GND
GND
GND
GND
GND
VCCQH
A14
A15
G
SCK1
SCLK
TXD
GND
GND
GND
GND
GND
GND
GND
GND
A13
VCCQL
A12
H VCCQH VCCQL
SCK0
GND
GND
GND
GND
GND
GND
GND
GND
VCCA
A10
A11
J HACK
HRW
HDS
GND
GND
GND
GND
GND
GND
GND
GND
A8
A7
A9
K
VCCS
HREQ
TIO2
GND
GND
GND
GND
GND
GND
GND
GND
VCCA
A5
A6
L
HCS
TIO1
TIO0
GND
GND
GND
GND
GND
GND
GND
GND
VCCA
A3
A4
M
HA1
HA2
HA0
VCCH
PB0
VCCP
CLK
OUT
BCLK
WR
RD
A1
A2
N
H6
H7
H4
H2
RESET GNDP
AA3
CAS
VCCQL
BCLK
BR
VCCC
AA0
A0
P
NC
H5
H3
H1
PCAP GNDP1
AA2
XTAL
VCCC
TA
BB
AA1
BG
NC
A
7
8
9
D23
VCCD
D19
MODD
D21
D20
MODA MODC
D22
GND
GND
SC00
Figure 3-4.
6
VCCQH EXTAL
DSP56309 Molded Array Process-Ball Grid Array (MAP-BGA), Top View
DSP56309 Technical Data, Rev. 7
3-10
Freescale Semiconductor
MAP-BGA Package Description
Bottom View
14
13
12
11
10
9
8
7
NC
D7
D9
D11
D14
D16
D19
VCCD
NC
D5
D8
D10
D13
D15
D17
D4
D3
D6
VCCD
D12
VCCD
VCCD
D2
D1
GND
GND
D0
A16
A17
GND
A15
A14
VCCQH
A12
VCCQL
A11
5
4
3
2
1
D23
MODB
TDO
TMS
SC11
NC
D20
D21
MODD
TRST
TDI
SC12
SRD1 B
D18
VCCQL
D22
MODC MODA
TCK
STD1
SC02
C
GND
GND
GND
GND
GND
GND
DE
SC01
PINIT
D
GND
GND
GND
GND
GND
GND
GND
SRD0
VCCS
STD0
E
GND
GND
GND
GND
GND
GND
GND
GND
SC00
SC10
RXD
F
A13
GND
GND
GND
GND
GND
GND
GND
GND
TXD
SCLK
SCK1 G
A10
VCCA
GND
GND
GND
GND
GND
GND
GND
GND
SCK0
VCCQL VCCQH H
A9
A7
A8
GND
GND
GND
GND
GND
GND
GND
GND
HDS
HRW
HACK J
A6
A5
VCCA
GND
GND
GND
GND
GND
GND
GND
GND
TIO2
HREQ
VCCS
K
A4
A3
VCCA
GND
GND
GND
GND
GND
GND
GND
GND
TIO0
TIO1
HCS
L
A2
A1
RD
WR
BCLK
CLK
OUT
VCCP
PB0
VCCH
HA0
HA2
HA1
M
A0
AA0
VCCC
BR
BCLK
VCCQL
CAS
AA3
GNDP
RESET
H2
H4
H7
H6
N
NC
BG
AA1
BB
TA
VCCC
XTAL
AA2
GNDP1 PCAP
H1
H3
H5
NC
P
Figure 3-5.
EXTAL VCCQH
6
A
DSP56309 Molded Array Process-Ball Grid Array (MAP-BGA), Bottom View
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
3-11
Packaging
Table 3-3.
DSP56309 MAP-BGA Signal Identification by Pin Number
Pin
No.
Signal Name
Pin
No.
Signal Name
Pin
No.
Signal Name
A1
Not Connected (NC), reserved
B12
D8
D9
GND
A2
SC11 or PD1
B13
D5
D10
GND
A3
TMS
B14
NC
D11
GND
A4
TDO
C1
SC02 or PC2
D12
D1
A5
MODB/IRQB
C2
STD1 or PD5
D13
D2
A6
D23
C3
TCK
D14
VCCD
A7
VCCD
C4
MODA/IRQA
E1
STD0 or PC5
A8
D19
C5
MODC/IRQC
E2
VCCS
A9
D16
C6
D22
E3
SRD0 or PC4
A10
D14
C7
VCCQL
E4
GND
A11
D11
C8
D18
E5
GND
A12
D9
C9
VCCD
E6
GND
A13
D7
C10
D12
E7
GND
A14
NC
C11
VCCD
E8
GND
B1
SRD1 or PD4
C12
D6
E9
GND
B2
SC12 or PD2
C13
D3
E10
GND
B3
TDI
C14
D4
E11
GND
B4
TRST
D1
PINIT/NMI
E12
A17
B5
MODD/IRQD
D2
SC01 or PC1
E13
A16
B6
D21
D3
DE
E14
D0
B7
D20
D4
GND
F1
RXD or PE0
B8
D17
D5
GND
F2
SC10 or PD0
B9
D15
D6
GND
F3
SC00 or PC0
B10
D13
D7
GND
F4
GND
B11
D10
D8
GND
F5
GND
DSP56309 Technical Data, Rev. 7
3-12
Freescale Semiconductor
MAP-BGA Package Description
Table 3-3.
DSP56309 MAP-BGA Signal Identification by Pin Number
(Continued)
Pin
No.
Signal Name
Pin
No.
Signal Name
Pin
No.
Signal Name
F6
GND
H3
SCK0 or PC3
J14
A9
F7
GND
H4
GND
K1
VCCS
F8
GND
H5
GND
K2
HREQ/HREQ,
HTRQ/HTRQ, or PB14
F9
GND
H6
GND
K3
TIO2
F10
GND
H7
GND
K4
GND
F11
GND
H8
GND
K5
GND
F12
VCCQH
H9
GND
K6
GND
F13
A14
H10
GND
K7
GND
F14
A15
H11
GND
K8
GND
G1
SCK1 or PD3
H12
VCCA
K9
GND
G2
SCLK or PE2
H13
A10
K10
GND
G3
TXD or PE1
H14
A11
K11
GND
G4
GND
J1
HACK/HACK,
HRRQ/HRRQ, or PB15
K12
VCCA
G5
GND
J2
HRW, HRD/HRD, or PB11
K13
A5
G6
GND
J3
HDS/HDS, HWR/HWR, or PB12
K14
A6
G7
GND
J4
GND
L1
HCS/HCS, HA10, or PB13
G8
GND
J5
GND
L2
TIO1
G9
GND
J6
GND
L3
TIO0
G10
GND
J7
GND
L4
GND
G11
GND
J8
GND
L5
GND
G12
A13
J9
GND
L6
GND
G13
VCCQL
J10
GND
L7
GND
G14
A12
J11
GND
L8
GND
H1
VCCQH
J12
A8
L9
GND
H2
VCCQL
J13
A7
L10
GND
L11
GND
M13
A1
P1
NC
L12
VCCA
M14
A2
P2
H5, HAD5, or PB5
L13
A3
N1
H6, HAD6, or PB6
P3
H3, HAD3, or PB3
L14
A4
N2
H7, HAD7, or PB7
P4
H1, HAD1, or PB1
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
3-13
Packaging
Table 3-3.
DSP56309 MAP-BGA Signal Identification by Pin Number
(Continued)
Pin
No.
Signal Name
Pin
No.
Signal Name
Pin
No.
Signal Name
M1
HA1, HA8, or PB9
N3
H4, HAD4, or PB4
P5
PCAP
M2
HA2, HA9, or PB10
N4
H2, HAD2, or PB2
P6
GND P1
M3
HA0, HAS/HAS, or PB8
N5
RESET
P7
AA2/RAS2
M4
VCCH
N6
GNDP
P8
XTAL
M5
H0, HAD0, or PB0
N7
AA3/RAS3
P9
VCCC
M6
VCCP
N8
CAS
P10
TA
M7
VCCQH
N9
VCCQL
P11
BB
M8
EXTAL
N10
BCLK
P12
AA1/RAS1
M9
CLKOUT
N11
BR
P13
BG
M10
BCLK
N12
VCCC
P14
NC
M11
WR
N13
AA0/RAS0
M12
RD
N14
A0
Notes:
Signal names are based on configured functionality. Most connections supply a single signal. Some connections
provide a signal with dual functionality, such as the MODx/IRQx pins that select an operating mode after RESET is
deasserted but act as interrupt lines during operation. Some signals have configurable polarity; these names are
shown with and without overbars, such as HAS/HAS. Some connections have two or more configurable functions;
names assigned to these connections indicate the function for a specific configuration. For example, connection N2
is data line H7 in non-multiplexed bus mode, data/address line HAD7 in multiplexed bus mode, or GPIO line PB7
when the GPIO function is enabled for this pin. Unlike in the TQFP package, most of the GND pins are connected
internally in the center of the connection array and act as heat sink for the chip. Therefore, except for GNDP and
GND P1 that support the PLL, other GND signals do not support individual subsystems in the chip.
DSP56309 Technical Data, Rev. 7
3-14
Freescale Semiconductor
MAP-BGA Package Description
Table 3-4.
DSP56309 MAP-BGA Signal Identification by Name
Signal Name
Pin
No.
Signal Name
Pin
No.
Signal Name
Pin
No.
A0
N14
BG
P13
D7
A13
A1
M13
BR
N11
D8
B12
A10
H13
CAS
N8
D9
A12
A11
H14
CLKOUT
M9
DE
D3
A12
G14
D0
E14
EXTAL
M8
A13
G12
D1
D12
GND
D4
A14
F13
D10
B11
GND
D5
A15
F14
D11
A11
GND
D6
A16
E13
D12
C10
GND
D7
A17
E12
D13
B10
GND
D8
A2
M14
D14
A10
GND
D9
A3
L13
D15
B9
GND
D10
A4
L14
D16
A9
GND
D11
A5
K13
D17
B8
GND
E4
A6
K14
D18
C8
GND
E5
A7
J13
D19
A8
GND
E6
A8
J12
D2
D13
GND
E7
A9
J14
D20
B7
GND
E8
AA0
N13
D21
B6
GND
E9
AA1
P12
D22
C6
GND
E10
AA2
P7
D23
A6
GND
E11
AA3
N7
D3
C13
GND
F4
BB
P11
D4
C14
GND
F5
BCLK
M10
D5
B13
GND
F6
BCLK
N10
D6
C12
GND
F7
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
3-15
Packaging
Table 3-4.
DSP56309 MAP-BGA Signal Identification by Name (Continued)
Signal Name
Pin
No.
Signal Name
Pin
No.
Signal Name
Pin
No.
GND
F8
GND
J9
H4
N3
GND
F9
GND
J10
H5
P2
GND
F10
GND
J11
H6
N1
GND
F11
GND
K4
H7
N2
GND
G4
GND
K5
HA0
M3
GND
G5
GND
K6
HA1
M1
GND
G6
GND
K7
HA10
L1
GND
G7
GND
K8
HA2
M2
GND
G8
GND
K9
HA8
M1
GND
G9
GND
K10
HA9
M2
GND
G10
GND
K11
HACK/HACK
J1
GND
G11
GND
L4
HAD0
M5
GND
H4
GND
L5
HAD1
P4
GND
H5
GND
L6
HAD2
N4
GND
H6
GND
L7
HAD3
P3
GND
H7
GND
L8
HAD4
N3
GND
H8
GND
L9
HAD5
P2
GND
H9
GND
L10
HAD6
N1
GND
H10
GND
L11
HAD7
N2
GND
H11
GNDP
N6
HAS/HAS
M3
GND
J4
GND P1
P6
HCS/HCS
L1
GND
J5
H0
M5
HDS/HDS
J3
GND
J6
H1
P4
HRD/HRD
J2
GND
J7
H2
N4
HREQ/HREQ
K2
GND
J8
H3
P3
HRRQ/HRRQ
J1
DSP56309 Technical Data, Rev. 7
3-16
Freescale Semiconductor
MAP-BGA Package Description
Table 3-4.
DSP56309 MAP-BGA Signal Identification by Name (Continued)
Signal Name
Pin
No.
Signal Name
Pin
No.
Signal Name
Pin
No.
HRW
J2
PB2
N4
RAS0
N13
HTRQ/HTRQ
K2
PB3
P3
RAS1
P12
HWR/HWR
J3
PB4
N3
RAS2
P7
IRQA
C4
PB5
P2
RAS3
N7
IRQB
A5
PB6
N1
RD
M12
IRQC
C5
PB7
N2
RESET
N5
IRQD
B5
PB8
M3
RXD
F1
MODA
C4
PB9
M1
SC00
F3
MODB
A5
PC0
F3
SC01
D2
MODC
C5
PC1
D2
SC02
C1
MODD
B5
PC2
C1
SC10
F2
NC
A1
PC3
H3
SC11
A2
NC
A14
PC4
E3
SC12
B2
NC
B14
PC5
E1
SCK0
H3
NC
P1
PCAP
P5
SCK1
G1
NC
P14
PD0
F2
SCLK
G2
NMI
D1
PD1
A2
SRD0
E3
PB0
M5
PD2
B2
SRD1
B1
PB1
P4
PD3
G1
STD0
E1
PB10
M2
PD4
B1
STD1
C2
PB11
J2
PD5
C2
TA
P10
PB12
J3
PE0
F1
TCK
C3
PB13
L1
PE1
G3
TDI
B3
PB14
K2
PE2
G2
TDO
A4
PB15
J1
PINIT
D1
TIO0
L3
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
3-17
Packaging
Table 3-4.
DSP56309 MAP-BGA Signal Identification by Name (Continued)
Signal Name
Pin
No.
Signal Name
Pin
No.
Signal Name
Pin
No.
TIO1
L2
VCCC
P9
VCCQH
M7
TIO2
K3
VCCD
A7
VCCQL
C7
TMS
A3
VCCD
C9
VCCQL
G13
TRST
B4
VCCD
C11
VCCQL
H2
TXD
G3
VCCD
D14
VCCQL
N9
VCCA
H12
VCCH
M4
VCCS
E2
VCCA
K12
VCCP
M6
VCCS
K1
VCCA
L12
VCCQH
F12
WR
M11
VCCC
N12
VCCQH
H1
XTAL
P8
3.4 MAP-BGA Package Mechanical Drawing
Figure 3-6.
DSP56309 Mechanical Information, 196-pin MAP-BGA Package
DSP56309 Technical Data, Rev. 7
3-18
Freescale Semiconductor
Design Considerations
4
This section describes various areas to consider when incorporating the DSP56309 device into a system design.
4.1 Thermal Design Considerations
An estimate of the chip junction temperature, T J, in ° C can be obtained from this equation:
Equation 1: T J = T A + ( P D × R θJ A )
Where:
TA
RθJA
PD
=
=
=
ambient temperature °C
package junction-to-ambient thermal resistance °C/W
power dissipation in package
Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and a caseto-ambient thermal resistance, as in this equation:
Equation 2: R θJA = R θJC + R θCA
Where:
RθJA
RθJC
RθCA
=
=
=
package junction-to-ambient thermal resistance °C/W
package junction-to-case thermal resistance °C/W
package case-to-ambient thermal resistance °C/W
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to change
the case-to-ambient thermal resistance, RθCA. For example, the user can change the air flow around the device, add
a heat sink, change the mounting arrangement on the printed circuit board (PCB) or otherwise change the thermal
dissipation capability of the area surrounding the device on a PCB. This model is most useful for ceramic packages
with heat sinks; some 90 percent of the heat flow is dissipated through the case to the heat sink and out to the
ambient environment. For ceramic packages, in situations where the heat flow is split between a path to the case
and an alternate path through the PCB, analysis of the device thermal performance may need the additional
modeling capability of a system-level thermal simulation tool.
The thermal performance of plastic packages is more dependent on the temperature of the PCB to which the
package is mounted. Again, if the estimates obtained from RθJA do not satisfactorily answer whether the thermal
performance is adequate, a system-level model may be appropriate.
A complicating factor is the existence of three common ways to determine the junction-to-case thermal resistance
in plastic packages.
•
To minimize temperature variation across the surface, the thermal resistance is measured from the junction
to the outside surface of the package (case) closest to the chip mounting area when that surface has a
proper heat sink.
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
4-1
Design Considerations
•
To define a value approximately equal to a junction-to-board thermal resistance, the thermal resistance is
measured from the junction to the point at which the leads attach to the case.
•
If the temperature of the package case (TT) is determined by a thermocouple, thermal resistance is
computed from the value obtained by the equation (TJ – TT)/PD.
As noted earlier, the junction-to-case thermal resistances quoted in this data sheet are determined using the first
definition. From a practical standpoint, that value is also suitable to determine the junction temperature from a case
thermocouple reading in forced convection environments. In natural convection, the use of the junction-to-case
thermal resistance to estimate junction temperature from a thermocouple reading on the case of the package will
yield an estimate of a junction temperature slightly higher than actual temperature. Hence, the new thermal metric,
thermal characterization parameter or ΨJT, has been defined to be (TJ – TT)/PD. This value gives a better estimate
of the junction temperature in natural convection when the surface temperature of the package is used. Remember
that surface temperature readings of packages are subject to significant errors caused by inadequate attachment of
the sensor to the surface and to errors caused by heat loss to the sensor. The recommended technique is to attach a
40-gauge thermocouple wire and bead to the top center of the package with thermally conductive epoxy.
4.2 Electrical Design Considerations
CAUTION
This device contains protective circuitry to
guard against damage due to high static
voltage or electrical fields. However, normal
precautions are advised to avoid application
of any voltages higher than maximum rated
voltages to this high-impedance circuit.
Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage
level (for example, either GND or VCC).
Use the following list of recommendations to ensure correct DSP operation.
•
Provide a low-impedance path from the board power supply to each VCC pin on the DSP and from the
board ground to each GND pin.
•
Use at least six 0.01–0.1 µF bypass capacitors positioned as close as possible to the four sides of the
package to connect the VCC power source to GND.
•
Ensure that capacitor leads and associated printed circuit traces that connect to the chip VCC and GND pins
are less than 0.5 inch per capacitor lead.
•
Use at least a four-layer PCB with two inner layers for VCC and GND.
•
Because the DSP output signals have fast rise and fall times, PCB trace lengths should be minimal. This
recommendation particularly applies to the address and data buses as well as the IRQA, IRQB, IRQC, IRQD,
TA, and BG pins. Maximum PCB trace lengths on the order of 6 inches are recommended.
DSP56309 Technical Data, Rev. 7
4-2
Freescale Semiconductor
Power Consumption Considerations
•
Consider all device loads as well as parasitic capacitance due to PCB traces when you calculate
capacitance. This is especially critical in systems with higher capacitive loads that could create higher
transient currents in the VCC and GND circuits.
•
All inputs must be terminated (that is, not allowed to float) by CMOS levels except for the three pins with
internal pull-up resistors (TRST, TMS, DE).
•
Take special care to minimize noise levels on the VCCP, GNDP, and GNDP1 pins.
•
The following pins must be asserted after power-up: RESET and TRST.
•
If multiple DSP devices are on the same board, check for cross-talk or excessive spikes on the supplies due
to synchronous operation of the devices.
•
RESET
•
At power-up, ensure that the voltage difference between the 5 V tolerant pins and the chip V CC never
exceeds 3.5 V.
must be asserted when the chip is powered up. A stable EXTAL signal should be supplied before
deassertion of RESET.
4.3 Power Consumption Considerations
Power dissipation is a key issue in portable DSP applications. Some of the factors affecting current consumption
are described in this section. Most of the current consumed by CMOS devices is alternating current (ac), which is
charging and discharging the capacitances of the pins and internal nodes.
Current consumption is described by this formula:
Equation 3: I = C × V × f
Where:
C
V
f
=
=
=
node/pin capacitance
voltage swing
frequency of node/pin toggle
Example 4-1. Current Consumption
For a Port A address pin loaded with 50 pF capacitance, operating at 3.3 V, with a 66 MHz clock, toggling at its maximum possible rate (33
MHz), the current consumption is expressed in Equation 4.
Equation 4: I = 50 × 10 – 12 × 3.3 × 33 × 10 6 = 5.48 mA
The maximum internal current (ICCImax) value reflects the typical possible switching of the internal buses on bestcase operation conditions—not necessarily a real application case. The typical internal current (ICCItyp) value
reflects the average switching of the internal buses on typical operating conditions.
Perform the following steps for applications that require very low current consumption:
1. Set the EBD bit when you are not accessing external memory.
2. Minimize external memory accesses, and use internal memory accesses.
3. Minimize the number of pins that are switching.
4. Minimize the capacitive load on the pins.
5. Connect the unused inputs to pull-up or pull-down resistors.
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
4-3
Design Considerations
6. Disable unused peripherals.
7. Disable unused pin activity (for example, CLKOUT, XTAL).
One way to evaluate power consumption is to use a current-per-MIPS measurement methodology to minimize
specific board effects (that is, to compensate for measured board current not caused by the DSP). A benchmark
power consumption test algorithm is listed in Appendix A. Use the test algorithm, specific test current
measurements, and the following equation to derive the current-per-MIPS value.
Equation 5: ⁄ MIPS = I ⁄ MHz = ( ItypF2 – I typF1 ) ⁄ ( F2 – F1
Where:
ItypF2
ItypF1
F2
F1
=
=
=
=
current at F2
current at F1
high frequency (any specified operating frequency)
low frequency (any specified operating frequency lower than F2)
Note: F1 should be significantly less than F2. For example, F2 could be 66 MHz and F1 could be 33 MHz. The
degree of difference between F1 and F2 determines the amount of precision with which the current rating
can be determined for an application.
4.4 PLL Performance Issues
The following explanations should be considered as general observations on expected PLL behavior. There is no
test that replicates these exact numbers. These observations were measured on a limited number of parts and were
not verified over the entire temperature and voltage ranges.
4.4.1
Phase Skew Performance
The phase skew of the PLL is defined as the time difference between the falling edges of EXTAL and CLKOUT for a
given capacitive load on CLKOUT, over the entire process, temperature and voltage ranges. As defined in Figure 22, External Clock Timing, on page 2-5 for input frequencies greater than 15 MHz and the MF ≤4, this skew is
greater than or equal to 0.0 ns and less than 1.8 ns; otherwise, this skew is not guaranteed. However, for MF < 10
and input frequencies greater than 10 MHz, this skew is between −1.4 ns and +3.2 ns.
4.4.2
Phase Jitter Performance
The phase jitter of the PLL is defined as the variations in the skew between the falling edges of EXTAL and CLKOUT
for a given device in specific temperature, voltage, input frequency, MF, and capacitive load on CLKOUT. These
variations are a result of the PLL locking mechanism. For input frequencies greater than 15 MHz and MF ≤4, this
jitter is less than ±0.6 ns; otherwise, this jitter is not guaranteed. However, for MF < 10 and input frequencies
greater than 10 MHz, this jitter is less than ±2 ns.
4.4.3
Frequency Jitter Performance
The frequency jitter of the PLL is defined as the variation of the frequency of CLKOUT. For small MF (MF < 10)
this jitter is smaller than 0.5 percent. For mid-range MF (10 < MF < 500) this jitter is between 0.5 percent and
approximately 2 percent. For large MF (MF > 500), the frequency jitter is 2–3 percent.
DSP56309 Technical Data, Rev. 7
4-4
Freescale Semiconductor
Input (EXTAL) Jitter Requirements
4.5 Input (EXTAL) Jitter Requirements
The allowed jitter on the frequency of EXTAL is 0.5 percent. If the rate of change of the frequency of EXTAL is slow
(that is, it does not jump between the minimum and maximum values in one cycle) or the frequency of the jitter is
fast (that is, it does not stay at an extreme value for a long time), then the allowed jitter can be 2 percent. The phase
and frequency jitter performance results are valid only if the input jitter is less than the prescribed values.
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
4-5
Design Considerations
DSP56309 Technical Data, Rev. 7
4-6
Freescale Semiconductor
Power Consumption Benchmark
A
The following benchmark program evaluates DSP56309 power use in a test situation. It enables the PLL, disables
the external clock, and uses repeated multiply-accumulate (MAC) instructions with a set of synthetic DSP
application data to emulate intensive sustained DSP operation.
;**************************************************************************
;**************************************************************************
;*
*
;*
CHECKS
Typical Power Consumption
*
;*
*
;**************************************************************************
page
200,55,0,0,0
nolist
I_VEC EQU
START EQU
INT_PROG
INT_XDAT
INT_YDAT
$000000; Interrupt vectors for program debug only
$8000; MAIN (external) program starting address
EQU $100 ; INTERNAL program memory starting address
EQU $0; INTERNAL X-data memory starting address
EQU $0; INTERNAL Y-data memory starting address
INCLUDE "ioequ.asm"
INCLUDE "intequ.asm"
list
org
P:START
;
movep #$0243FF,x:M_BCR ;; BCR: Area 3 = 2 w.s (SRAM)
; Default: 2w.s (SRAM)
;
movep #$0d0000,x:M_PCTL
; XTAL disable
; PLL enable
; CLKOUT disable
;
; Load the program
;
move
#INT_PROG,r0
move
#PROG_START,r1
do
#(PROG_END-PROG_START),PLOAD_LOOP
move
p:(r1)+,x0
move
x0,p:(r0)+
nop
PLOAD_LOOP
;
; Load the X-data
;
move
#INT_XDAT,r0
move
#XDAT_START,r1
do
#(XDAT_END-XDAT_START),XLOAD_LOOP
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
A-1
Power Consumption Benchmark
move
p:(r1)+,x0
move
x0,x:(r0)+
XLOAD_LOOP
;
; Load the Y-data
;
move
#INT_YDAT,r0
move
#YDAT_START,r1
do
#(YDAT_END-YDAT_START),YLOAD_LOOP
move
p:(r1)+,x0
move
x0,y:(r0)+
YLOAD_LOOP
;
jmp
PROG_START
move
move
move
move
;
clr
clr
move
move
move
move
bset
;
sbr
dor
mac
mac
add
mac
mac
move
_end
bra
nop
nop
nop
nop
PROG_END
nop
nop
XDAT_START
;
org
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
INT_PROG
#$0,r0
#$0,r4
#$3f,m0
#$3f,m4
a
b
#$0,x0
#$0,x1
#$0,y0
#$0,y1
#4,omr
; ebd
#60,_end
x0,y0,a x:(r0)+,x1
x1,y1,a x:(r0)+,x0
a,b
x0,y0,a x:(r0)+,x1
x1,y1,a
b1,x:$ff
y:(r4)+,y1
y:(r4)+,y0
y:(r4)+,y0
sbr
x:0
$262EB9
$86F2FE
$E56A5F
$616CAC
$8FFD75
$9210A
$A06D7B
$CEA798
$8DFBF1
$A063D6
DSP56309 Technical Data, Rev. 7
A-2
Freescale Semiconductor
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
XDAT_END
YDAT_START
;
org
dc
dc
$6C6657
$C2A544
$A3662D
$A4E762
$84F0F3
$E6F1B0
$B3829
$8BF7AE
$63A94F
$EF78DC
$242DE5
$A3E0BA
$EBAB6B
$8726C8
$CA361
$2F6E86
$A57347
$4BE774
$8F349D
$A1ED12
$4BFCE3
$EA26E0
$CD7D99
$4BA85E
$27A43F
$A8B10C
$D3A55
$25EC6A
$2A255B
$A5F1F8
$2426D1
$AE6536
$CBBC37
$6235A4
$37F0D
$63BEC2
$A5E4D3
$8CE810
$3FF09
$60E50E
$CFFB2F
$40753C
$8262C5
$CA641A
$EB3B4B
$2DA928
$AB6641
$28A7E6
$4E2127
$482FD4
$7257D
$E53C72
$1A8C3
$E27540
y:0
$5B6DA
$C3F70B
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
A-3
Power Consumption Benchmark
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
dc
$6A39E8
$81E801
$C666A6
$46F8E7
$AAEC94
$24233D
$802732
$2E3C83
$A43E00
$C2B639
$85A47E
$ABFDDF
$F3A2C
$2D7CF5
$E16A8A
$ECB8FB
$4BED18
$43F371
$83A556
$E1E9D7
$ACA2C4
$8135AD
$2CE0E2
$8F2C73
$432730
$A87FA9
$4A292E
$A63CCF
$6BA65C
$E06D65
$1AA3A
$A1B6EB
$48AC48
$EF7AE1
$6E3006
$62F6C7
$6064F4
$87E41D
$CB2692
$2C3863
$C6BC60
$43A519
$6139DE
$ADF7BF
$4B3E8C
$6079D5
$E0F5EA
$8230DB
$A3B778
$2BFE51
$E0A6B6
$68FFB7
$28F324
$8F2E8D
$667842
$83E053
$A1FD90
$6B2689
$85B68E
$622EAF
DSP56309 Technical Data, Rev. 7
A-4
Freescale Semiconductor
dc
dc
YDAT_END
$6162BC
$E4A245
;**************************************************************************
;
;
EQUATES for DSP56309 I/O registers and ports
;
;
Last update: June 11 1995
;
;**************************************************************************
page
opt
ioequ
ident
132,55,0,0,0
mex
1,0
;-----------------------------------------------------------------------;
;
EQUATES for I/O Port Programming
;
;-----------------------------------------------------------------------;
Register Addresses
M_HDR EQU $FFFFC9
M_HDDR EQU $FFFFC8
M_PCRC EQU $FFFFBF
M_PRRC EQU $FFFFBE
M_PDRC EQU $FFFFBD
M_PCRD EQU $FFFFAF
M_PRRD EQU $FFFFAE
M_PDRD EQU $FFFFAD
M_PCRE EQU $FFFF9F
M_PRRE EQU $FFFF9E
M_PDRE EQU $FFFF9D
M_OGDB EQU $FFFFFC
;
;
;
;
;
;
;
;
;
;
;
;
Host
Host
Port
Port
Port
Port
Port
Port
Port
Port
Port
OnCE
port GPIO data Register
port GPIO direction Register
C Control Register
C Direction Register
C GPIO Data Register
D Control register
D Direction Data Register
D GPIO Data Register
E Control register
E Direction Register
E Data Register
GDB Register
;-----------------------------------------------------------------------;
;
EQUATES for Host Interface
;
;-----------------------------------------------------------------------;
Register Addresses
M_HCR EQU $FFFFC2
M_HSR EQU $FFFFC3
M_HPCR EQU $FFFFC4
M_HBAR EQU $FFFFC5
M_HRX EQU $FFFFC6
M_HTX EQU $FFFFC7
;
;
;
;
;
;
Host
Host
Host
Host
Host
Host
Control Register
Status Register
Polarity Control Register
Base Address Register
Receive Register
Transmit Register
;
HCR bits definition
M_HRIE EQU $0
M_HTIE EQU $1
M_HCIE EQU $2
M_HF2 EQU $3
M_HF3 EQU $4
;
;
;
;
;
Host
Host
Host
Host
Host
Receive interrupts Enable
Transmit Interrupt Enable
Command Interrupt Enable
Flag 2
Flag 3
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
A-5
Power Consumption Benchmark
;
HSR bits definition
M_HRDF EQU $0
M_HTDE EQU $1
M_HCP EQU $2
M_HF0 EQU $3
M_HF1 EQU $4
;
;
;
;
;
Host
Host
Host
Host
Host
Receive Data Full
Receive Data Empty
Command Pending
Flag 0
Flag 1
;
HPCR bits definition
M_HGEN EQU $0
M_HA8EN EQU $1
M_HA9EN EQU $2
M_HCSEN EQU $3
M_HREN EQU $4
M_HAEN EQU $5
M_HEN EQU $6
M_HOD EQU $8
M_HDSP EQU $9
M_HASP EQU $A
M_HMUX EQU $B
M_HD_HS EQU $C
M_HCSP EQU $D
M_HRP EQU $E
M_HAP EQU $F
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
Host
Host
Host
Host
Host
Host
Host
Host
Host
Host
Host
Host
Host
Host
Host
Port GPIO Enable
Address 8 Enable
Address 9 Enable
Chip Select Enable
Request Enable
Acknowledge Enable
Enable
Request Open Drain mode
Data Strobe Polarity
Address Strobe Polarity
Multiplexed bus select
Double/Single Strobe select
Chip Select Polarity
Request Polarity
Acknowledge Polarity
;-----------------------------------------------------------------------;
;
EQUATES for Serial Communications Interface (SCI)
;
;-----------------------------------------------------------------------;
Register Addresses
M_STXH EQU $FFFF97
M_STXM EQU $FFFF96
M_STXL EQU $FFFF95
M_SRXH EQU $FFFF9A
M_SRXM EQU $FFFF99
M_SRXL EQU $FFFF98
M_STXA EQU $FFFF94
M_SCR EQU $FFFF9C
M_SSR EQU $FFFF93
M_SCCR EQU $FFFF9B
;
;
;
;
;
;
;
;
;
;
;
SCI
SCI
SCI
SCI
SCI
SCI
SCI
SCI
SCI
SCI
Transmit Data Register (high)
Transmit Data Register (middle)
Transmit Data Register (low)
Receive Data Register (high)
Receive Data Register (middle)
Receive Data Register (low)
Transmit Address Register
Control Register
Status Register
Clock Control Register
SCI Control Register Bit Flags
M_WDS EQU $7
M_WDS0 EQU 0
M_WDS1 EQU 1
M_WDS2 EQU 2
M_SSFTD EQU 3
M_SBK EQU 4
M_WAKE EQU 5
M_RWU EQU 6
M_WOMS EQU 7
M_SCRE EQU 8
M_SCTE EQU 9
M_ILIE EQU 10
;
;
;
;
;
;
;
;
;
;
;
;
Word Select Mask (WDS0-WDS3)
Word Select 0
Word Select 1
Word Select 2
SCI Shift Direction
Send Break
Wakeup Mode Select
Receiver Wakeup Enable
Wired-OR Mode Select
SCI Receiver Enable
SCI Transmitter Enable
Idle Line Interrupt Enable
DSP56309 Technical Data, Rev. 7
A-6
Freescale Semiconductor
M_SCRIE EQU 11
M_SCTIE EQU 12
M_TMIE EQU 13
M_TIR EQU 14
M_SCKP EQU 15
M_REIE EQU 16
;
SCI Receive Interrupt Enable
SCI Transmit Interrupt Enable
Timer Interrupt Enable
Timer Interrupt Rate
SCI Clock Polarity
SCI Error Interrupt Enable (REIE)
SCI Status Register Bit Flags
M_TRNE EQU
M_TDRE EQU
M_RDRF EQU
M_IDLE EQU
M_OR EQU 4
M_PE EQU 5
M_FE EQU 6
M_R8 EQU 7
;
;
;
;
;
;
;
0
1
2
3
;
;
;
;
;
;
;
;
Transmitter Empty
Transmit Data Register Empty
Receive Data Register Full
Idle Line Flag
Overrun Error Flag
Parity Error
Framing Error Flag
Received Bit 8 (R8) Address
;
;
;
;
;
Clock Divider Mask (CD0-CD11)
Clock Out Divider
Clock Prescaler
Receive Clock Mode Source Bit
Transmit Clock Source Bit
SCI Clock Control Register
M_CD EQU $FFF
M_COD EQU 12
M_SCP EQU 13
M_RCM EQU 14
M_TCM EQU 15
;-----------------------------------------------------------------------;
;
EQUATES for Synchronous Serial Interface (SSI)
;
;-----------------------------------------------------------------------;
;
Register Addresses Of SSI0
M_TX00 EQU $FFFFBC
M_TX01 EQU $FFFFBB
M_TX02 EQU $FFFFBA
M_TSR0 EQU $FFFFB9
M_RX0 EQU $FFFFB8
M_SSISR0 EQU $FFFFB7
M_CRB0 EQU $FFFFB6
M_CRA0 EQU $FFFFB5
M_TSMA0 EQU $FFFFB4
M_TSMB0 EQU $FFFFB3
M_RSMA0 EQU $FFFFB2
M_RSMB0 EQU $FFFFB1
;
;
;
;
;
;
;
;
;
;
;
;
SSI0
SSIO
SSIO
SSI0
SSI0
SSI0
SSI0
SSI0
SSI0
SSI0
SSI0
SSI0
Transmit Data Register 0
Transmit Data Register 1
Transmit Data Register 2
Time Slot Register
Receive Data Register
Status Register
Control Register B
Control Register A
Transmit Slot Mask Register A
Transmit Slot Mask Register B
Receive Slot Mask Register A
Receive Slot Mask Register B
;
Register Addresses Of SSI1
M_TX10 EQU $FFFFAC
M_TX11 EQU $FFFFAB
M_TX12 EQU $FFFFAA
M_TSR1 EQU $FFFFA9
M_RX1 EQU $FFFFA8
M_SSISR1 EQU $FFFFA7
M_CRB1 EQU $FFFFA6
M_CRA1 EQU $FFFFA5
M_TSMA1 EQU $FFFFA4
M_TSMB1 EQU $FFFFA3
M_RSMA1 EQU $FFFFA2
M_RSMB1 EQU $FFFFA1
;
;
;
;
;
;
;
;
;
;
;
;
SSI1
SSI1
SSI1
SSI1
SSI1
SSI1
SSI1
SSI1
SSI1
SSI1
SSI1
SSI1
Transmit Data Register 0
Transmit Data Register 1
Transmit Data Register 2
Time Slot Register
Receive Data Register
Status Register
Control Register B
Control Register A
Transmit Slot Mask Register A
Transmit Slot Mask Register B
Receive Slot Mask Register A
Receive Slot Mask Register B
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
A-7
Power Consumption Benchmark
;
SSI Control Register A Bit Flags
M_PM EQU $FF
M_PSR EQU 11
M_DC EQU $1F000
M_ALC EQU 18
M_WL EQU $380000
M_SSC1 EQU 22
;
Serial Output Flag Mask
Serial Output Flag 0
Serial Output Flag 1
Serial Control Direction Mask
Serial Control 0 Direction
Serial Control 1 Direction
Serial Control 2 Direction
Clock Source Direction
Shift Direction
Frame Sync Length Mask (FSL0-FSL1)
Frame Sync Length 0
Frame Sync Length 1
Frame Sync Relative Timing
Frame Sync Polarity
Clock Polarity
Sync/Async Control
SSI Mode Select
SSI Transmit enable Mask
SSI Transmit #2 Enable
SSI Transmit #1 Enable
SSI Transmit #0 Enable
SSI Receive Enable
SSI Transmit Interrupt Enable
SSI Receive Interrupt Enable
SSI Transmit Last Slot Interrupt Enable
SSI Receive Last Slot Interrupt Enable
SSI Transmit Error Interrupt Enable
SI Receive Error Interrupt Enable
;
;
;
;
;
;
;
;
;
Serial Input Flag Mask
Serial Input Flag 0
Serial Input Flag 1
Transmit Frame Sync Flag
Receive Frame Sync Flag
Transmitter Underrun Error FLag
Receiver Overrun Error Flag
Transmit Data Register Empty
Receive Data Register Full
SSI Transmit Slot Mask Register A
M_SSTSA EQU $FFFF
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
SSI Status Register Bit Flags
M_IF EQU $3
M_IF0 EQU 0
M_IF1 EQU 1
M_TFS EQU 2
M_RFS EQU 3
M_TUE EQU 4
M_ROE EQU 5
M_TDE EQU 6
M_RDF EQU 7
;
Prescale Modulus Select Mask (PM0-PM7)
Prescaler Range
Frame Rate Divider Control Mask (DC0-DC7)
Alignment Control (ALC)
Word Length Control Mask (WL0-WL7)
Select SC1 as TR #0 drive enable (SSC1)
SSI Control Register B Bit Flags
M_OF EQU $3
M_OF0 EQU 0
M_OF1 EQU 1
M_SCD EQU $1C
M_SCD0 EQU 2
M_SCD1 EQU 3
M_SCD2 EQU 4
M_SCKD EQU 5
M_SHFD EQU 6
M_FSL EQU $180
M_FSL0 EQU 7
M_FSL1 EQU 8
M_FSR EQU 9
M_FSP EQU 10
M_CKP EQU 11
M_SYN EQU 12
M_MOD EQU 13
M_SSTE EQU $1C000
M_SSTE2 EQU 14
M_SSTE1 EQU 15
M_SSTE0 EQU 16
M_SSRE EQU 17
M_SSTIE EQU 18
M_SSRIE EQU 19
M_STLIE EQU 20
M_SRLIE EQU 21
M_STEIE EQU 22
M_SREIE EQU 23
;
;
;
;
;
;
;
; SSI Transmit Slot Bits Mask A (TS0-TS15)
SSI Transmit Slot Mask Register B
M_SSTSB EQU $FFFF
; SSI Transmit Slot Bits Mask B (TS16-TS31)
DSP56309 Technical Data, Rev. 7
A-8
Freescale Semiconductor
;
SSI Receive Slot Mask Register A
M_SSRSA EQU $FFFF
;
; SSI Receive Slot Bits Mask A (RS0-RS15)
SSI Receive Slot Mask Register B
M_SSRSB EQU $FFFF
; SSI Receive Slot Bits Mask B (RS16-RS31)
;-----------------------------------------------------------------------;
;
EQUATES for Exception Processing
;
;------------------------------------------------------------------------
;
Register Addresses
M_IPRC EQU $FFFFFF
M_IPRP EQU $FFFFFE
;
; Interrupt Priority Register Core
; Interrupt Priority Register Peripheral
Interrupt Priority Register Core (IPRC)
M_IAL EQU $7
M_IAL0 EQU 0
M_IAL1 EQU 1
M_IAL2 EQU 2
M_IBL EQU $38
M_IBL0 EQU 3
M_IBL1 EQU 4
M_IBL2 EQU 5
M_ICL EQU $1C0
M_ICL0 EQU 6
M_ICL1 EQU 7
M_ICL2 EQU 8
M_IDL EQU $E00
M_IDL0 EQU 9
M_IDL1 EQU 10
M_IDL2 EQU 11
M_D0L EQU $3000
M_D0L0 EQU 12
M_D0L1 EQU 13
M_D1L EQU $C000
M_D1L0 EQU 14
M_D1L1 EQU 15
M_D2L EQU $30000
M_D2L0 EQU 16
M_D2L1 EQU 17
M_D3L EQU $C0000
M_D3L0 EQU 18
M_D3L1 EQU 19
M_D4L EQU $300000
M_D4L0 EQU 20
M_D4L1 EQU 21
M_D5L EQU $C00000
M_D5L0 EQU 22
M_D5L1 EQU 23
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
IRQA
IRQA
IRQA
IRQA
IRQB
IRQB
IRQB
IRQB
IRQC
IRQC
IRQC
IRQC
IRQD
IRQD
IRQD
IRQD
DMA0
DMA0
DMA0
DMA1
DMA1
DMA1
DMA2
DMA2
DMA2
DMA3
DMA3
DMA3
DMA4
DMA4
DMA4
DMA5
DMA5
DMA5
Mode Mask
Mode Interrupt Priority Level (low)
Mode Interrupt Priority Level (high)
Mode Trigger Mode
Mode Mask
Mode Interrupt Priority Level (low)
Mode Interrupt Priority Level (high)
Mode Trigger Mode
Mode Mask
Mode Interrupt Priority Level (low)
Mode Interrupt Priority Level (high)
Mode Trigger Mode
Mode Mask
Mode Interrupt Priority Level (low)
Mode Interrupt Priority Level (high)
Mode Trigger Mode
Interrupt priority Level Mask
Interrupt Priority Level (low)
Interrupt Priority Level (high)
Interrupt Priority Level Mask
Interrupt Priority Level (low)
Interrupt Priority Level (high)
Interrupt priority Level Mask
Interrupt Priority Level (low)
Interrupt Priority Level (high)
Interrupt Priority Level Mask
Interrupt Priority Level (low)
Interrupt Priority Level (high)
Interrupt priority Level Mask
Interrupt Priority Level (low)
Interrupt Priority Level (high)
Interrupt priority Level Mask
Interrupt Priority Level (low)
Interrupt Priority Level (high)
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
A-9
Power Consumption Benchmark
;
Interrupt Priority Register Peripheral (IPRP)
M_HPL EQU $3
M_HPL0 EQU 0
M_HPL1 EQU 1
M_S0L EQU $C
M_S0L0 EQU 2
M_S0L1 EQU 3
M_S1L EQU $30
M_S1L0 EQU 4
M_S1L1 EQU 5
M_SCL EQU $C0
M_SCL0 EQU 6
M_SCL1 EQU 7
M_T0L EQU $300
M_T0L0 EQU 8
M_T0L1 EQU 9
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
Host Interrupt Priority Level Mask
Host Interrupt Priority Level (low)
Host Interrupt Priority Level (high)
SSI0 Interrupt Priority Level Mask
SSI0 Interrupt Priority Level (low)
SSI0 Interrupt Priority Level (high)
SSI1 Interrupt Priority Level Mask
SSI1 Interrupt Priority Level (low)
SSI1 Interrupt Priority Level (high)
SCI Interrupt Priority Level Mask
SCI Interrupt Priority Level (low)
SCI Interrupt Priority Level (high)
TIMER Interrupt Priority Level Mask
TIMER Interrupt Priority Level (low)
TIMER Interrupt Priority Level (high)
;-----------------------------------------------------------------------;
;
EQUATES for TIMER
;
;-----------------------------------------------------------------------;
Register Addresses Of TIMER0
M_TCSR0 EQU
M_TLR0 EQU
M_TCPR0 EQU
M_TCR0 EQU
;
Timer 0 Control/Status Register
TIMER0 Load Reg
TIMER0 Compare Register
TIMER0 Count Register
$FFFF8B
$FFFF8A
$FFFF89
$FFFF88
;
;
;
;
TIMER1
TIMER1
TIMER1
TIMER1
;
;
;
;
;
;
TIMER2 Control/Status Register
TIMER2 Load Reg
TIMER2 Compare Register
TIMER2 Count Register
TIMER Prescaler Load Register
TIMER Prescalar Count Register
Control/Status Register
Load Reg
Compare Register
Count Register
Register Addresses Of TIMER2
M_TCSR2 EQU
M_TLR2 EQU
M_TCPR2 EQU
M_TCR2 EQU
M_TPLR EQU
M_TPCR EQU
;
;
;
;
;
Register Addresses Of TIMER1
M_TCSR1 EQU
M_TLR1 EQU
M_TCPR1 EQU
M_TCR1 EQU
;
$FFFF8F
$FFFF8E
$FFFF8D
$FFFF8C
$FFFF87
$FFFF86
$FFFF85
$FFFF84
$FFFF83
$FFFF82
Timer Control/Status Register Bit Flags
M_TE EQU 0
M_TOIE EQU 1
M_TCIE EQU 2
M_TC EQU $F0
M_INV EQU 8
M_TRM EQU 9
M_DIR EQU 11
;
;
;
;
;
;
;
Timer Enable
Timer Overflow Interrupt Enable
Timer Compare Interrupt Enable
Timer Control Mask (TC0-TC3)
Inverter Bit
Timer Restart Mode
Direction Bit
DSP56309 Technical Data, Rev. 7
A-10
Freescale Semiconductor
M_DI EQU 12
M_DO EQU 13
M_PCE EQU 15
M_TOF EQU 20
M_TCF EQU 21
;
;
;
;
;
;
Timer Prescaler Register Bit Flags
M_PS EQU $600000
M_PS0 EQU 21
M_PS1 EQU 22
;
M_TC0
M_TC1
M_TC2
M_TC3
Data Input
Data Output
Prescaled Clock Enable
Timer Overflow Flag
Timer Compare Flag
; Prescaler Source Mask
Timer Control Bits
EQU 4
EQU 5
EQU 6
EQU 7
;
;
;
;
Timer
Timer
Timer
Timer
Control
Control
Control
Control
0
1
2
3
;-----------------------------------------------------------------------;
;
EQUATES for Direct Memory Access (DMA)
;
;-----------------------------------------------------------------------;
M_DSTR
M_DOR0
M_DOR1
M_DOR2
M_DOR3
;
M_DSR0
M_DDR0
M_DCO0
M_DCR0
;
M_DSR1
M_DDR1
M_DCO1
M_DCR1
;
M_DSR2
M_DDR2
M_DCO2
M_DCR2
;
M_DSR3
M_DDR3
M_DCO3
M_DCR3
Register Addresses Of DMA
EQU FFFFF4
EQU $FFFFF3
EQU $FFFFF2
EQU $FFFFF1
EQU $FFFFF0
;
;
;
;
;
DMA
DMA
DMA
DMA
DMA
Status
Offset
Offset
Offset
Offset
Register
Register
Register
Register
Register
;
;
;
;
DMA0
DMA0
DMA0
DMA0
Source Address Register
Destination Address Register
Counter
Control Register
;
;
;
;
DMA1
DMA1
DMA1
DMA1
Source Address Register
Destination Address Register
Counter
Control Register
;
;
;
;
DMA2
DMA2
DMA2
DMA2
Source Address Register
Destination Address Register
Counter
Control Register
;
;
;
;
DMA3
DMA3
DMA3
DMA3
Source Address Register
Destination Address Register
Counter
Control Register
0
1
2
3
Register Addresses Of DMA0
EQU
EQU
EQU
EQU
$FFFFEF
$FFFFEE
$FFFFED
$FFFFEC
Register Addresses Of DMA1
EQU
EQU
EQU
EQU
$FFFFEB
$FFFFEA
$FFFFE9
$FFFFE8
Register Addresses Of DMA2
EQU
EQU
EQU
EQU
$FFFFE7
$FFFFE6
$FFFFE5
$FFFFE4
Register Addresses Of DMA4
EQU
EQU
EQU
EQU
$FFFFE3
$FFFFE2
$FFFFE1
$FFFFE0
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
A-11
Power Consumption Benchmark
;
M_DSR4
M_DDR4
M_DCO4
M_DCR4
;
Register Addresses Of DMA4
EQU
EQU
EQU
EQU
$FFFFDF
$FFFFDE
$FFFFDD
$FFFFDC
DMA4
DMA4
DMA4
DMA4
Source Address Register
Destination Address Register
Counter
Control Register
;
;
;
;
DMA5
DMA5
DMA5
DMA5
Source Address Register
Destination Address Register
Counter
Control Register
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
DMA
DMA
DMA
DMA
DMA
DMA
DMA
DMA
DMA
DMA
DMA
DMA
DMA
DMA
DMA
DMA
DMA
DMA
DMA
DMA
DMA
DMA
DMA
DMA
DMA
;
;
;
;
;
;
;
;
;
;
;
;
Channel Transfer Done Status MASK (DTD0-DTD5)
DMA Channel Transfer Done Status 0
DMA Channel Transfer Done Status 1
DMA Channel Transfer Done Status 2
DMA Channel Transfer Done Status 3
DMA Channel Transfer Done Status 4
DMA Channel Transfer Done Status 5
DMA Active State
DMA Active Channel Mask (DCH0-DCH2)
DMA Active Channel 0
DMA Active Channel 1
DMA Active Channel 2
Register Addresses Of DMA5
M_DSR5
M_DDR5
M_DCO5
M_DCR5
EQU
EQU
EQU
EQU
;
DMA Control Register
$FFFFDB
$FFFFDA
$FFFFD9
$FFFFD8
M_DSS EQU $3
M_DSS0 EQU 0
M_DSS1 EQU 1
M_DDS EQU $C
M_DDS0 EQU 2
M_DDS1 EQU 3
M_DAM EQU $3f0
M_DAM0 EQU 4
M_DAM1 EQU 5
M_DAM2 EQU 6
M_DAM3 EQU 7
M_DAM4 EQU 8
M_DAM5 EQU 9
M_D3D EQU 10
M_DRS EQU $F800
M_DCON EQU 16
M_DPR EQU $60000
M_DPR0 EQU 17
M_DPR1 EQU 18
M_DTM EQU $380000
M_DTM0 EQU 19
M_DTM1 EQU 20
M_DTM2 EQU 21
M_DIE EQU 22
M_DE EQU 23
;
;
;
;
;
Source Space Mask (DSS0-Dss1)
Source Memory space 0
Source Memory space 1
Destination Space Mask (DDS-DDS1)
Destination Memory Space 0
Destination Memory Space 1
Address Mode Mask (DAM5-DAM0)
Address Mode 0
Address Mode 1
Address Mode 2
Address Mode 3
Address Mode 4
Address Mode 5
Three Dimensional Mode
Request Source Mask (DRS0-DRS4)
Continuous Mode
Channel Priority
Channel Priority Level (low)
Channel Priority Level (high)
Transfer Mode Mask (DTM2-DTM0)
Transfer Mode 0
Transfer Mode 1
Transfer Mode 2
Interrupt Enable bit
Channel Enable bit
DMA Status Register
M_DTD EQU $3F
M_DTD0 EQU 0
M_DTD1 EQU 1
M_DTD2 EQU 2
M_DTD3 EQU 3
M_DTD4 EQU 4
M_DTD5 EQU 5
M_DACT EQU 8
M_DCH EQU $E00
M_DCH0 EQU 9
M_DCH1 EQU 10
M_DCH2 EQU 11
;------------------------------------------------------------------------
DSP56309 Technical Data, Rev. 7
A-12
Freescale Semiconductor
;
;
EQUATES for Phase Locked Loop (PLL)
;
;-----------------------------------------------------------------------;
Register Addresses Of PLL
M_PCTL EQU $FFFFFD
;
; PLL Control Register
PLL Control Register
M_MF EQU $FFF
M_DF EQU $7000
M_XTLR EQU 15
M_XTLD EQU 16
M_PSTP EQU 17
M_PEN EQU 18
M_PCOD EQU 19
M_PD EQU $F00000
;
;
;
;
;
;
;
;
Multiplication Factor Bits Mask (MF0-MF11)
Division Factor Bits Mask (DF0-DF2)
XTAL Range select bit
XTAL Disable Bit
STOP Processing State Bit
PLL Enable Bit
PLL Clock Output Disable Bit
PreDivider Factor Bits Mask (PD0-PD3)
;-----------------------------------------------------------------------;
;
EQUATES for BIU
;
;-----------------------------------------------------------------------;
Register Addresses Of BIU
M_BCR EQU $FFFFFB
M_DCR EQU $FFFFFA
M_AAR0 EQU $FFFFF9
M_AAR1 EQU $FFFFF8
M_AAR2 EQU $FFFFF7
M_AAR3 EQU $FFFFF6
M_IDR EQU $FFFFF5
;
Bus Control Register
DRAM Control Register
Address Attribute Register
Address Attribute Register
Address Attribute Register
Address Attribute Register
ID Register
;
;
;
;
;
;
;
;
Area 0 Wait Control Mask (BA0W0-BA0W4)
Area 1 Wait Control Mask (BA1W0-BA14)
Area 2 Wait Control Mask (BA2W0-BA2W2)
Area 3 Wait Control Mask (BA3W0-BA3W3)
Default Area Wait Control Mask (BDFW0-BDFW4)
Bus State
Bus Lock Hold
Bus Request Hold
;
;
;
;
;
;
;
;
In Page Wait States Bits Mask (BCW0-BCW1)
Out Of Page Wait States Bits Mask (BRW0-BRW1)
DRAM Page Size Bits Mask (BPS0-BPS1)
Page Logic Enable
Mastership Enable
Refresh Enable
Software Triggered Refresh
Refresh Rate Bits Mask (BRF0-BRF7)
0
1
2
3
Bus Control Register
M_BA0W EQU $1F
M_BA1W EQU $3E0
M_BA2W EQU $1C00
M_BA3W EQU $E000
M_BDFW EQU $1F0000
M_BBS EQU 21
M_BLH EQU 22
M_BRH EQU 23
;
;
;
;
;
;
;
;
DRAM Control Register
M_BCW EQU $3
M_BRW EQU $C
M_BPS EQU $300
M_BPLE EQU 11
M_BME EQU 12
M_BRE EQU 13
M_BSTR EQU 14
M_BRF EQU $7F8000
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
A-13
Power Consumption Benchmark
M_BRP EQU 23
;
Address Attribute Registers
M_BAT EQU $3
M_BAAP EQU 2
M_BPEN EQU 3
M_BXEN EQU 4
M_BYEN EQU 5
M_BAM EQU 6
M_BPAC EQU 7
M_BNC EQU $F00
M_BAC EQU $FFF000
;
; Refresh prescaler
;
;
;
;
;
;
;
;
;
Ext. Access Type and Pin Def. Bits Mask (BAT0-BAT1)
Address Attribute Pin Polarity
Program Space Enable
X Data Space Enable
Y Data Space Enable
Address Muxing
Packing Enable
Number of Address Bits to Compare Mask (BNC0-BNC3)
Address to Compare Bits Mask (BAC0-BAC11)
control and status bits in SR
M_CP EQU $c00000
M_CA EQU 0
M_V EQU 1
M_Z EQU 2
M_N EQU 3
M_U EQU 4
M_E EQU 5
M_L EQU 6
M_S EQU 7
M_I0 EQU 8
M_I1 EQU 9
M_S0 EQU 10
M_S1 EQU 11
M_SC EQU 13
M_DM EQU 14
M_LF EQU 15
M_FV EQU 16
M_SA EQU 17
M_CE EQU 19
M_SM EQU 20
M_RM EQU 21
M_CP0 EQU 22
M_CP1 EQU 23
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
mask for CORE-DMA priority bits in SR
Carry
Overflow
Zero
Negative
Unnormalized
Extension
Limit
Scaling Bit
Interupt Mask Bit 0
Interupt Mask Bit 1
Scaling Mode Bit 0
Scaling Mode Bit 1
Sixteen_Bit Compatibility
Double Precision Multiply
DO-Loop Flag
DO-Forever Flag
Sixteen-Bit Arithmetic
Instruction Cache Enable
Arithmetic Saturation
Rounding Mode
bit 0 of priority bits in SR
bit 1 of priority bits in SR
;
control and status bits in OMR
M_CDP EQU $300
; mask for CORE-DMA priority bits in OMR
M_MA
equ0
; Operating Mode A
M_MB
equ1
; Operating Mode B
M_MC
equ2
; Operating Mode C
M_MD
equ3
; Operating Mode D
M_EBD EQU 4
; External Bus Disable bit in OMR
M_SD EQU 6
; Stop Delay
M_MS EQU 7
; Memory Switch bit in OMR
M_CDP0 EQU 8
; bit 0 of priority bits in OMR
M_CDP1 EQU 9
; bit 1 of priority bits in OMR
M_BEN
EQU 10
; Burst Enable
M_TAS EQU 11
; TA Synchronize Select
M_BRT EQU 12
; Bus Release Timing
M_ATE EQU 15
; Address Tracing Enable bit in OMR.
M_XYS EQU 16
; Stack Extension space select bit in OMR.
M_EUN EQU 17
; Extensed stack UNderflow flag in OMR.
M_EOV EQU 18
; Extended stack OVerflow flag in OMR.
M_WRP EQU 19
; Extended WRaP flag in OMR.
DSP56309 Technical Data, Rev. 7
A-14
Freescale Semiconductor
M_SEN EQU 20
; Stack Extension Enable bit in OMR.
;*************************************************************************
;
;
EQUATES for DSP56309 interrupts
;
;
Last update: June 11 1995
;
;*************************************************************************
page
opt
intequ
ident
if
132,55,0,0,0
mex
1,0
@DEF(I_VEC)
;leave user definition as is.
else
I_VEC EQU $0
endif
;-----------------------------------------------------------------------; Non-Maskable interrupts
;-----------------------------------------------------------------------I_RESET EQU I_VEC+$00
; Hardware RESET
I_STACK EQU I_VEC+$02
; Stack Error
I_ILL EQU I_VEC+$04
; Illegal Instruction
I_DBG EQU I_VEC+$06
; Debug Request
I_TRAP EQU I_VEC+$08
; Trap
I_NMI EQU I_VEC+$0A
; Non Maskable Interrupt
;-----------------------------------------------------------------------; Interrupt Request Pins
;-----------------------------------------------------------------------I_IRQA EQU I_VEC+$10
; IRQA
I_IRQB EQU I_VEC+$12
; IRQB
I_IRQC EQU I_VEC+$14
; IRQC
I_IRQD EQU I_VEC+$16
; IRQD
;-----------------------------------------------------------------------; DMA Interrupts
;-----------------------------------------------------------------------I_DMA0 EQU I_VEC+$18
; DMA Channel 0
I_DMA1 EQU I_VEC+$1A
; DMA Channel 1
I_DMA2 EQU I_VEC+$1C
; DMA Channel 2
I_DMA3 EQU I_VEC+$1E
; DMA Channel 3
I_DMA4 EQU I_VEC+$20
; DMA Channel 4
I_DMA5 EQU I_VEC+$22
; DMA Channel 5
;-----------------------------------------------------------------------; Timer Interrupts
;-----------------------------------------------------------------------I_TIM0C EQU I_VEC+$24
; TIMER 0 compare
I_TIM0OF EQU I_VEC+$26
; TIMER 0 overflow
I_TIM1C EQU I_VEC+$28
; TIMER 1 compare
DSP56309 Technical Data, Rev. 7
Freescale Semiconductor
A-15
Power Consumption Benchmark
I_TIM1OF EQU I_VEC+$2A
I_TIM2C EQU I_VEC+$2C
I_TIM2OF EQU I_VEC+$2E
; TIMER 1 overflow
; TIMER 2 compare
; TIMER 2 overflow
;-----------------------------------------------------------------------; ESSI Interrupts
;-----------------------------------------------------------------------I_SI0RD EQU I_VEC+$30
; ESSI0 Receive Data
I_SI0RDE EQU I_VEC+$32
; ESSI0 Receive Data w/ exception Status
I_SI0RLS EQU I_VEC+$34
; ESSI0 Receive last slot
I_SI0TD EQU I_VEC+$36
; ESSI0 Transmit data
I_SI0TDE EQU I_VEC+$38
; ESSI0 Transmit Data w/ exception Status
I_SI0TLS EQU I_VEC+$3A
; ESSI0 Transmit last slot
I_SI1RD EQU I_VEC+$40
; ESSI1 Receive Data
I_SI1RDE EQU I_VEC+$42
; ESSI1 Receive Data w/ exception Status
I_SI1RLS EQU I_VEC+$44
; ESSI1 Receive last slot
I_SI1TD EQU I_VEC+$46
; ESSI1 Transmit data
I_SI1TDE EQU I_VEC+$48
; ESSI1 Transmit Data w/ exception Status
I_SI1TLS EQU I_VEC+$4A
; ESSI1 Transmit last slot
;-----------------------------------------------------------------------; SCI Interrupts
;-----------------------------------------------------------------------I_SCIRD EQU I_VEC+$50
; SCI Receive Data
I_SCIRDE EQU I_VEC+$52
; SCI Receive Data With Exception Status
I_SCITD EQU I_VEC+$54
; SCI Transmit Data
I_SCIIL EQU I_VEC+$56
; SCI Idle Line
I_SCITM EQU I_VEC+$58
; SCI Timer
;-----------------------------------------------------------------------; HOST Interrupts
;-----------------------------------------------------------------------I_HRDF EQU I_VEC+$60
; Host Receive Data Full
I_HTDE EQU I_VEC+$62
; Host Transmit Data Empty
I_HC EQU I_VEC+$64
; Default Host Command
;----------------------------------------------------------------------; INTERRUPT ENDING ADDRESS
;-----------------------------------------------------------------------I_INTEND EQU I_VEC+$FF
; last address of interrupt vector space
DSP56309 Technical Data, Rev. 7
A-16
Freescale Semiconductor
Ordering Information
Consult a Freescale Semiconductor sales office or authorized distributor to determine product availability and place an order.
Part
Supply
Voltage
DSP56309
3.3 V
Pin
Count
Core
Frequency
(MHz)
Solder Spheres
Order Number
Thin Quad Flat Pack (TQFP)
144
100
Lead-free
XC56309AG100A
Lead-bearing
XC56309PV100A
Molded Array Process-Ball Grid
Array (MAP-BGA)
196
100
Lead-free
XC56309VL100A
Lead-bearing
XC56309VF100A
Package Type
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