GSI GS8170LW36AC-250

GS8170LW36/72AC-350/333/300/250
209-Bump BGA
Commercial Temp
Industrial Temp
18Mb Σ1x1Lp CMOS I/O
Late Write SigmaRAM™
250 MHz–350 MHz
1.8 V VDD
1.8 V I/O
Features
• Late Write mode, Pipelined Read mode
• JEDEC-standard SigmaRAM™ pinout and package
• 1.8 V +150/–100 mV core power supply
• 1.8 V CMOS Interface
• ZQ controlled user-selectable output drive strength
• Dual Cycle Deselect
• Burst Read and Write option
• Fully coherent read and write pipelines
• Echo Clock outputs track data output drivers
• Byte write operation (9-bit bytes)
• 2 user-programmable chip enable inputs
• IEEE 1149.1 JTAG-compliant Serial Boundary Scan
• 209-bump, 14 mm x 22 mm, 1 mm bump pitch BGA package
• Pin-compatible with future 36Mb, 72Mb, and 144Mb
devices
• Pb-Free 209-bump BGA package available
Bottom View
SigmaRAM Family Overview
GS8170LW36/72A SigmaRAMs are built in compliance with
the SigmaRAM pinout standard for synchronous SRAMs.
They are 18,874,368-bit (18Mb) SRAMs. This family of wide,
very low voltage CMOS I/O SRAMs is designed to operate at
the speeds needed to implement economical high performance
networking systems.
ΣRAMs are offered in a number of configurations including
Late Write, Double Late Write, and Double Data Rate (DDR).
The logical differences between the protocols employed by
these RAMs mainly involve various approaches to write
cueing and data transfer rates. The ΣRAM™ family standard
allows a user to implement the interface protocol best suited to
the task at hand.
209-Bump, 14 mm x 22 mm BGA
1 mm Bump Pitch, 11 x 19 Bump Array
Functional Description
Because SigmaRAMs are synchronous devices, address data
inputs and read/write control inputs are captured on the rising
edge of the input clock. Write cycles are internally self-timed
and initiated by the rising edge of the clock input. This feature
eliminates complex off-chip write pulse generation required by
asynchronous SRAMs and simplifies input signal timing.
ΣRAMs support pipelined reads utilizing a rising-edgetriggered output register. They also utilize a Dual Cycle
Deselect (DCD) output deselect protocol.
ΣRAMs are implemented with high performance CMOS
technology and are packaged in a 209-bump BGA.
Parameter Synopsis
Rev: 1.04 4/2005
Key Fast Bin Specs
Symbol
- 350
Cycle Time
tKHKH
2.86 ns
Access Time
tKHQV
1.7 ns
1/32
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
GS8170LW36/72AC-350/333/300/250
SigmaRAM Pinouts
256K x 72 Common I/O—Top View (Package C)
1
2
3
4
5
6
7
8
9
10
11
A
DQg
DQg
A
E2
A
ADV
A
E3
A
DQb
DQb
B
DQg
DQg
Bc
Bg
NC
W
A
Bb
Bf
DQb
DQb
C
DQg
DQg
Bh
Bd
NC
(144M)
E1
NC
Be
Ba
DQb
DQb
D
DQg
DQg
VSS
NC
NC
MCL
NC
NC
VSS
DQb
DQb
E
DQg
DQc
VDDQ
VDDQ
VDD
VDD
VDD
VDDQ
VDDQ
DQf
DQb
F
DQc
DQc
VSS
VSS
VSS
ZQ
VSS
VSS
VSS
DQf
DQf
G
DQc
DQc
VDDQ
VDDQ
VDD
EP2
VDD
VDDQ
VDDQ
DQf
DQf
H
DQc
DQc
VSS
VSS
VSS
EP3
VSS
VSS
VSS
DQf
DQf
J
DQc
DQc
VDDQ
VDDQ
VDD
MCL
VDD
VDDQ
VDDQ
DQf
DQf
K
CQ2
CQ2
CK
NC
VSS
MCL
VSS
NC
NC
CQ1
CQ1
L
DQh
DQh
VDDQ
VDDQ
VDD
MCH
VDD
VDDQ
VDDQ
DQa
DQa
M
DQh
DQh
VSS
VSS
VSS
MCH
VSS
VSS
VSS
DQa
DQa
N
DQh
DQh
VDDQ
VDDQ
VDD
MCH
VDD
VDDQ
VDDQ
DQa
DQa
P
DQh
DQh
VSS
VSS
VSS
MCL
VSS
VSS
VSS
DQa
DQa
R
DQd
DQh
VDDQ
VDDQ
VDD
VDD
VDD
VDDQ
VDDQ
DQa
DQe
T
DQd
DQd
VSS
NC
NC
MCL
NC
NC
VSS
DQe
DQe
U
DQd
DQd
NC
A
NC
(72M)
A
NC
(36M)
A
NC
DQe
DQe
V
DQd
DQd
A
A
A
A1
A
A
A
DQe
DQe
W
DQd
DQd
TMS
TDI
A
A0
A
TDO
TCK
DQe
DQe
11 x 19 Bump BGA—14 x 22 mm2 Body—1 mm Bump Pitch
• 2002.06
•
Note:
Users of CMOS I/O SigmaRAMs may wish to connect “NC, VREF” and the “NC, CK” pins to VREF (i.e., VDDQ/2) to
allow alternate use of future HSTL I/O SigmaRAMs.
Rev: 1.04 4/2005
2/32
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
GS8170LW36/72AC-350/333/300/250
512K x 36 Common I/O—Top View (Package C)
1
2
3
4
5
6
7
8
9
10
11
A
NC
NC
A
E2
A
ADV
A
E3
A
DQb
DQb
B
NC
NC
Bc
NC
A
W
A
Bb
NC
DQb
DQb
C
NC
NC
NC
Bd
NC
(144M)
E1
NC
NC
Ba
DQb
DQb
D
NC
NC
VSS
NC
NC
MCL
NC
NC
VSS
DQb
DQb
E
NC
DQc
VDDQ
VDDQ
VDD
VDD
VDD
VDDQ
VDDQ
NC
DQb
F
DQc
DQc
VSS
VSS
VSS
ZQ
VSS
VSS
VSS
NC
NC
G
DQc
DQc
VDDQ
VDDQ
VDD
EP2
VDD
VDDQ
VDDQ
NC
NC
H
DQc
DQc
VSS
VSS
VSS
EP3
VSS
VSS
VSS
NC
NC
J
DQc
DQc
VDDQ
VDDQ
VDD
MCL
VDD
VDDQ
VDDQ
NC
NC
K
CQ2
CQ2
CK
NC
VSS
MCL
VSS
NC
NC
CQ1
CQ1
L
NC
NC
VDDQ
VDDQ
VDD
MCH
VDD
VDDQ
VDDQ
DQa
DQa
M
NC
NC
VSS
VSS
VSS
MCH
VSS
VSS
VSS
DQa
DQa
N
NC
NC
VDDQ
VDDQ
VDD
MCH
VDD
VDDQ
VDDQ
DQa
DQa
P
NC
NC
VSS
VSS
VSS
MCL
VSS
VSS
VSS
DQa
DQa
R
DQd
NC
VDDQ
VDDQ
VDD
VDD
VDD
VDDQ
VDDQ
DQa
NC
T
DQd
DQd
VSS
NC
NC
MCL
NC
NC
VSS
NC
NC
U
DQd
DQd
NC
A
NC
(72M)
A
NC
(36M)
A
NC
NC
NC
V
DQd
DQd
A
A
A
A1
A
A
A
NC
NC
W
DQd
DQd
TMS
TDI
A
A0
A
TDO
TCK
NC
NC
11 x 19 Bump BGA—14 x 22 mm2 Body—1 mm Bump Pitch
• 2002.06
•
Note:
Users of CMOS I/O SigmaRAMs may wish to connect “NC, VREF” and the “NC, CK” pins to VREF (i.e., VDDQ/2) to
allow alternate use of future HSTL I/O SigmaRAMs.
Rev: 1.04 4/2005
3/32
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
GS8170LW36/72AC-350/333/300/250
Pin Description Table
Symbol
Description
Type
Comments
A
Address
Input
—
ADV
Advance
Input
Active High
Bx
Byte Write Enable
Input
Active Low
W
Write Enable
Input
Active Low
E1
Chip Enable
Input
Active Low
E2 & E3
Chip Enable
Input
Programmable Active High or Low
EP2 & EP3
Chip Enable Program Pin
Mode Input
To be tied directly to VDD, VDDQ or VSS
CK
Clock
Input
Active High
CQ, CQ
Echo Clock
Output
Three State - Deselect via E2 or E3 False
DQ
Data I/O
Input/Output
Three State
MCH
Must Connect High
Input
Active High
To be tied directly to VDD or VDDQ
MCL
Must Connect Low
Input
Active Low
To be tied directly to VSS
ZQ
Output Impedance Control
Mode Input
Low = Low Impedance [High Drive]
High = High Impedance [Low Drive]
To be tied directly to VDDQ or VSS
TCK
Test Clock
Input
Active High
TDI
Test Data In
Input
—
TDO
Test Data Out
Output
—
TMS
Test Mode Select
Input
—
NC
No Connect
—
Not connected to die or any other pin
VDD
Core Power Supply
Input
1.8 V Nominal
VDDQ
Output Driver Power Supply
Input
1.8 V Nominal
VSS
Ground
Input
—
Operation Control
All address, data and control inputs (with the exception of EP2, EP3, ZQ, and the mode pins, L6, M6, and J6) are synchronized to
rising clock edges. Data in is captured on both rising and falling edges of CK. Read and write operations must be initiated with the
Advance/Load pin (ADV) held low, in order to load the new address. Device activation is accomplished by asserting all three of
the Chip Enable inputs (E1, E2, and E3). Deassertion of any one of the Enable inputs will deactivate the device. It should be noted
that ONLY deactivation of the RAM via E2 and/or E3 deactivates the Echo Clocks, CQ1–CQ2.
Rev: 1.04 4/2005
4/32
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
GS8170LW36/72AC-350/333/300/250
Read Operations
Pipelined Read
Read operation is initiated when the following conditions are satisfied at the rising edge of clock: All three chip enables (E1, E2,
and E3) are active, the write enable input signal (W) is deasserted high, and ADV is asserted low. The address presented to the
address inputs is latched into the address register and presented to the memory core and control logic. The control logic determines
that a read access is in progress and allows the requested data to propagate to the input of the output register. At the next rising edge
of clock the read data is allowed to propagate through the output register and onto the output pins.
Single Data Rate Pipelined Read
Read
Deselect
Read
Read
Read
A
XX
C
D
E
CK
Address
F
ADV
/E1
/W
DQ
QC
QA
QD
CQ
Key
Hi-Z
Access
Write Operations
Write operation occurs when the following conditions are satisfied at the rising edge of clock: All three chip enables (E1, E2, and
E3) are active, the write enable input signal (W) is asserted low, and ADV is asserted low.
Rev: 1.04 4/2005
5/32
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
GS8170LW36/72AC-350/333/300/250
Late Write
In Late Write mode the RAM requires Data In one rising clock edge later than the edge used to load Address and Control. Late
Write protocol has been employed on SRAMs designed for RISC processor L2 cache applications and in Flow Through mode NBT
SRAMs.
SigmaRAM Late Write with Pipelined Read
Read
Deselect
Write
Read
Read
A
XX
C
D
E
CK
Address
F
ADV
/E1
/W
DQ
QA
DC
QD
CQ
Key
Hi-Z
Access
Byte Write Control
The Byte Write Enable inputs (Bx) determine which bytes will be written. Any combination of Byte Write Enable control pins,
including all or none, may be activated. A Write Cycle with no Byte Write inputs active is a write abort cycle.
Example of x36 Byte Write Truth Table
Rev: 1.04 4/2005
Function
W
Ba
Bb
Bc
Bd
Read
H
X
X
X
X
Write Byte A
L
L
H
H
H
Write Byte B
L
H
L
H
H
Write Byte C
L
H
H
L
H
Write Byte D
L
H
H
H
L
Write all Bytes
L
L
L
L
L
Write Abort
L
H
H
H
H
6/32
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
GS8170LW36/72AC-350/333/300/250
Two Byte Write Control Example with Late Write SigmaRAM
Write
Write
Write
Non-Write
Write
A
B
C
D
E
CK
Address
F
ADV
/E1
ADV
/BA
/BB
DA
DB
DE
DQA0-DQA8
DA
DC
DQB0-DQB8
CQ
Special Functions
Burst Cycles
SRAMs provide an on-chip burst address generator that can be utilized, if desired, to simplify burst read or write implementations.
The ADV control pin, when driven high, commands the SRAM to advance the internal address counter and use the counter
generated address to read or write the SRAM. The starting address for the first cycle in a burst cycle series is loaded into the SRAM
by driving the ADV pin low, into Load mode.
Rev: 1.04 4/2005
7/32
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
GS8170LW36/72AC-350/333/300/250
SigmaRAM Pipelined Burst Reads with Counter Wrap-around
Read
Continue
Continue
Continue
Continue
External
Address
A2
XX
XX
XX
XX
Internal
Address
A2
A3
A0
A1
A2
CK
Counter Wraps
ADV
/E1
/W
DQ
QA2
QA3
QA0
QA1
CQ
Rev: 1.04 4/2005
8/32
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
GS8170LW36/72AC-350/333/300/250
SigmaRAM Late Write SRAM Burst Writes with Counter Wrap-around
Write
Continue
Continue
Continue
Continue
Address
A2
XX
XX
XX
XX
Internal
Address
A2
A3
A0
A1
A2
CK
ADV
XX
Counter Wraps
/E1
/W
ADV
DQ
D2
D3
D1
D0
D2
CQ
Burst Order
The burst address counter wraps around to its initial state after four internal addresses (the loaded address and three more) have
been accessed. SigmaRAMs always count in linear burst order.
Linear Burst Order
A[1:0]
1st address
00
01
10
11
2nd address
01
10
11
00
3rd address
10
11
00
01
4th address
11
00
01
10
Note:
The burst counter wraps to initial state on the 5th rising edge of clock.
Echo Clock
SRAMs feature Echo Clocks, CQ1, CQ2, CQ1, and CQ2 that track the performance of the output drivers. The Echo Clocks are
delayed copies of the main RAM clock, CK. Echo Clocks are designed to track changes in output driver delays due to variance in
die temperature and supply voltage. The Echo Clocks are designed to fire with the rest of the data output drivers. SigmaRAMs
provide both in-phase, or true, Echo Clock outputs (CQ1 and CQ2) and inverted Echo Clock outputs (CQ1 and CQ2).
Rev: 1.04 4/2005
9/32
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
GS8170LW36/72AC-350/333/300/250
It should be noted that deselection of the RAM via E2 and E3 also deselects the Echo Clock output drivers. The deselection of
Echo Clock drivers is always pipelined to the same degree as output data. Deselection of the RAM via E1 does not deactivate the
Echo Clocks.
Programmable Enables
ΣRAMs feature two user-programmable chip enable inputs, E2 and E3. The sense of the inputs, whether they function as active
low or active high inputs, is determined by the state of the programming inputs, EP2 and EP3. For example, if EP2 is held at VDD,
E2 functions as an active high enable. If EP2 is held to VSS, E2 functions as an active low chip enable input.
Programmability of E2 and E3 allows four banks of depth expansion to be accomplished with no additional logic. By programming
the enable inputs of four SRAMs in binary sequence (00, 01, 10, 11) and driving the enable inputs with two address inputs, four
SRAMs can be made to look like one larger RAM to the system.
Example Four Bank Depth Expansion Schematic—Σ1x1Lp
A0–An
E1
CK
W
DQ0–DQn
A0–An – 2
An – 1
An
Bank 0
Bank 1
A0–An – 2
A
An – 1
E3
An
E2
E1
E1
CK
A0–An – 2
A
An – 1
E3
An
E2
A0–An – 2
A
Bank 3
Bank 2
E3
An – 1
E2
An
E3
E2
E1
E1
CK
A
CK
CK
EP3
0
W
EP3
1
W EP3
0
W
EP3
1
DQ EP2
0
DQ EP2
0
DQ EP2
1
DQ EP2
CQ
1
W
CQ
CQ
CQ
CQ
Bank Enable Truth Table
Rev: 1.04 4/2005
EP2
EP3
E2
E3
Bank 0
VSS
VSS
Active Low
Active Low
Bank 1
VSS
VDD
Active Low
Active High
Bank 2
VDD
VSS
Active High
Active Low
Bank 3
VDD
VDD
Active High
Active High
10/32
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
GS8170LW36/72AC-350/333/300/250
Echo Clock Control in Two Banks of SigmaRAMs
Read
Read
Read
Read
Read
A
B
C
D
E
CK
Address
F
ADV
/E1
/E2 Bank 1
E2 Bank 2
DQ
Bank 1
QA
QC
CQ
Bank 1
CQ1 + CQ2
CQ
Bank 2
DQ
Bank 2
QB
QD
Note: E1\ does not deselect the Echo Clock Outputs. Echo Clock outputs are synchronously deselected by E2 or E3 being sampled false.
It should be noted that deselection of the RAM via E2 and E3 also deselects the Echo Clock output drivers. The deselection of
Echo Clock drivers is always pipelined to the same degree as output data. Deselection of the RAM via E1 does not deactivate the
Echo Clocks.
In some applications it may be appropriate to pause between banks; to deselect both RAMs with E1 before resuming read
operations. An E1 deselect at a bank switch will allow at least one clock to be issued from the new bank before the first read cycle
in the bank. Although the following drawing illustrates a E1 read pause upon switching from Bank 1 to Bank 2, a write to Bank 2
would have the same effect, causing the RAM in Bank 2 to issue at least one clock before it is needed.
Rev: 1.04 4/2005
11/32
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
GS8170LW36/72AC-350/333/300/250
.
Pipelined Read Bank Switch with E1 Deselect
Read
No Op
Read
Read
Read
A
XX
C
D
E
CK
Address
F
ADV
/E1
/E2 Bank 1
E2 Bank 2
DQ
Bank 1
QA
CQ
Bank 1
CQ1 + CQ2
CQ
Bank 2
DQ
Bank 2
QC
QD
Note: E1\ does not deselect the Echo Clock Outputs. Echo Clock outputs are synchronously deselected by E2 or E3 being sampled false.
CMOS Output Driver Impedance Control
CMOS I/O SigmaRAMs are supplied with selectable (high or low) impedance output drivers. The ZQ pin allows selection between
SRAM nominal drive strength (ZQ low) for multi-drop bus applications and low drive strength (ZQ high) point-to-point
applications.
Rev: 1.04 4/2005
12/32
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
GS8170LW36/72AC-350/333/300/250
Late Write, Pipelined Read Truth Table
CK
E1 E ADV W
B
(tn) (tn) (tn) (tn) (tn)
Previous
Operation
Current Operation
DQ/CQ
(tn)
DQ/CQ
(tn+1)
0→1
X
F
0
X
X
X
Bank Deselect
***/***
Hi-Z/Hi-Z
0→1
X
X
1
X
X
Bank Deselect
Bank Deselect (Continue)
Hi-Z/Hi-Z
Hi-Z/Hi-Z
0→1
1
T
0
X
X
X
Deselect
***/***
Hi-Z/CQ
0→1
X
X
1
X
X
Deselect
Deselect (Continue)
Hi-Z/CQ
Hi-Z/CQ
0→1
0
T
0
0
T
X
Write
Loads new address
Stores DQx if Bx = 0
***/***
D1/CQ
0→1
0
T
0
0
F
X
Write (Abort)
Loads new address
No data stored
***/***
Hi-Z/CQ
0→1
X
X
1
X
T
Write
Write Continue
Increments address by 1
Stores DQx if Bx = 0
Dn-1/CQ
Dn/CQ
0→1
X
X
1
X
F
Write
Write Continue (Abort)
Increments address by 1
No data stored
Dn-1/CQ
Hi-Z/CQ
0→1
0
T
0
1
X
X
Read
Loads new address
***/***
Q1/CQ
0→1
X
X
1
X
X
Read
Read Continue
Increments address by 1
Qn-1/CQ
Qn/CQ
Notes:
1. If E2 = EP2 and E3 = EP3, then E = “T” else E = “F”.
2. If one or more Bx = 0, then B = “T” else B = “F”.
3. “1” = input “high”; “0” = input “low”; “X” = input “don’t care”; “T” = input “true”; “F” = input “false”.
4. “***” indicates that the DQ input requirement / output state and CQ output state are determined by the previous operation.
5. DQs are tristated in response to Bank Deselect, Deselect, and Write commands, one full cycle after the command is sampled.
6. CQs are tristated in response to Bank Deselect commands only, one full cycle after the command is sampled.
7. Up to three (3) Continue operations may be initiated after a Read or Write operation is initiated to burst transfer up to four (4) distinct pieces
of data per single external address input. If a fourth (4th) Continue operation is initiated, the internal address wraps back to the initial external (base) address.
Rev: 1.04 4/2005
13/32
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
GS8170LW36/72AC-350/333/300/250
Common I/O State Diagram
X,F,0,X or X,X,1,X
Bank
Deselect
0,T,0,1
0,T,0,0
1,T,0,X
X,F,0,X
Deselect
0,T,0,1
0,T,0,0
1,T,0,X or X,X,1,X
1,T,0,X
1,T,0,X
0,T,0,0
Read
Write
0,T,0,1
X,F,0,X
0,T,0,1
X,X,1,X
X,F,0,X
X,X,1,X
0,T,0,1
1,T,0,X
X,F,0,X
0,T,0,0
Read
Continue
0,T,0,0
0,T,0,1
X,F,0,X
X,X,1,X
n
Input Command Code
1,T,0,X
Write
Continue
X,X,1,X
Key
0,T,0,0
n+1
n+2
n+3
Clock (CK)
ƒ Transition
Current State (n)
Next State (n + 1)
ƒ
Command
Current State
ƒ
ƒ
ƒ
Next State
Current State & Next State Definition for Read/Write Control State Diagram
Notes:
1. The notation “X,X,X,X” controlling the state transitions above indicate the states of inputs E1, E, ADV, and W respectively.
2. If (E2 = EP2 and E3 = EP3) then E = “T” else E = “F”.
3. “1” = input “high”; “0” = input “low”; “X” = input “don’t care”; “T” = input “true”; “F” = input “false”.
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Absolute Maximum Ratings
(All voltages reference to VSS)
Symbol
Description
Value
Unit
VDD
Voltage on VDD Pins
–0.5 to 2.5
V
VDDQ
Voltage in VDDQ Pins
–0.5 to VDD
V
VI/O
Voltage on I/O Pins
–0.5 to VDDQ + 0.5 (≤ 2.5 V max.)
V
VIN
Voltage on Other Input Pins
–0.5 to VDDQ + 0.5 (≤ 2.5 V max.)
V
IIN
Input Current on Any Pin
+/–100
mA dc
IOUT
Output Current on Any I/O Pin
+/–100
mA dc
TJ
Maximum Junction Temperature
125
oC
TSTG
Storage Temperature
–55 to 125
ºC
Note:
Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended
Operating Conditions. Exposure to conditions exceeding the Recommended Operating Conditions, for an extended period of time, may affect
reliability of this component.
Recommended Operating Conditions
Power Supplies
Parameter
Symbol
Min.
Typ.
Max.
Unit
Notes
Supply Voltage
VDD
1.7
1.8
1.95
V
1.8 V I/O Supply Voltage
VDDQ
1.7
1.8
VDD
V
Ambient Temperature
(Commercial Range Versions)
TA
0
25
70
°C
1
Ambient Temperature
(Industrial Range Versions)
TA
–40
25
85
°C
1
Note:
The part number of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted
are evaluated for worst case in the temperature range marked on the device.
CMOS I/O DC Input Characteristics
Parameter
Symbol
Min.
Typ.
Max.
Unit
Notes
CMOS Input High Voltage
VIH
0.65 * VDDQ
—
VDDQ + 0.3
V
1
CMOS Input Low Voltage
VIL
–0.3
—
0.35 * VDDQ
V
1
Note: For devices supplied with CMOS input buffers. Compatible with both 1.8 V and 1.5 V I/O drivers.
Rev: 1.04 4/2005
15/32
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GS8170LW36/72AC-350/333/300/250
Undershoot Measurement and Timing
Overshoot Measurement and Timing
VIH
20% tKC
VDD + 1.0 V
VSS
50%
50%
VDD
VSS – 1.0 V
20% tKC
VIL
Capacitance
(TA = 25oC, f = 1 MHZ, VDD = 1.8 V)
Parameter
Symbol
Test conditions
Typ.
Max.
Unit
Input Capacitance
CIN
VIN = 0 V
4
5
pF
Output Capacitance
COUT
VOUT = 0 V
6
7
pF
Note:
This parameter is sample tested.
AC Test Conditions
Parameter
Conditions
Input high level
VDDQ
Input low level
0V
Max. input slew rate
2 V/ns
Input reference level
VDDQ/2
Output reference level
VDDQ/2
AC Test Load Diagram
DQ
RQ = 250 Ω (HSTL I/O)
50Ω
VT = VDDQ/2
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Input and Output Leakage Characteristics
Parameter
Symbol
Test Conditions
Min.
Max
Notes
Input Leakage Current
(except mode pins)
IIL
VIN = 0 to VDDQ
–2 uA
2 uA
—
ZQ, MCH, MCL, EP2, EP3
Pin Input Current
IINM
VIN = 0 to VDDQ
–50 uA
50 uA
—
Output Leakage Current
IOL
Output Disable,
VOUT = 0 to VDDQ
–2 uA
2 uA
—
Selectable Impedance Output Driver DC Electrical Characteristics
Parameter
Symbol
Test Conditions
Min.
Max
Notes
Low Drive Output High Voltage
VOHL
IOHL = –4 mA
VDDQ – 0.4 V
—
1
Low Drive Output Low Voltage
VOLL
IOLL = 4 mA
—
0.4 V
1
High Drive Output High Voltage
VOHH
IOHH = –8 mA
VDDQ – 0.4 V
—
2
High Drive Output Low Voltage
VOLH
IOLH = 8 mA
—
0.4 V
2
Notes:
1.
2.
ZQ = 1; High Impedance output driver setting
ZQ = 0; Low Impedance output driver setting
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Operating Currents
-350
Chip Disable
Current
Bank Deselect
Current
CMOS
Deselect
Current
Rev: 1.04 4/2005
-300
-250
Symbol
0°C
to
70°C
–40°C
to
+85°C
0°C
to
70°C
–40°C
to
+85°C
0°C
to
70°C
–40°C
to
+85°C
0°C
to
70°C
–40°C
to
+85°C
Test Conditions
x72
IDDP (PL)
365 mA
375 mA
345 mA
355 mA
320 mA
330 mA
275 mA
285 mA
x36
IDDP (PL)
265 mA
275 mA
245 mA
255 mA
225 mA
235 mA
200 mA
210 mA
E1 ≤ VIL Max.
tKHKH ≥ tKHKH Min.
All other inputs
VIL ≥ VIN ≥ VIH
x72
ISB1 (PL)
80 mA
90 mA
75 mA
85 mA
70 mA
80 mA
65 mA
75 mA
x36
ISB1 (PL)
75 mA
85 mA
70 mA
80 mA
65 mA
75 mA
60 mA
70 mA
x72
ISB2 (PL)
80 mA
90 mA
75 mA
85 mA
70 mA
80 mA
65 mA
75 mA
x36
ISB2 (PL)
75 mA
85 mA
70 mA
80 mA
65 mA
75 mA
60 mA
70 mA
Parameter
Operating
Current
-333
IDD3
45 mA
55 mA
45 mA
55 mA
45 mA
55 mA
45 mA
18/32
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
55 mA
E1 ≥ VIH Min. or
tKHKH ≥ tKHKH Min.
All other inputs
VIL ≥ VIN ≥ VIH
E2 or E3 False
tKHKH ≥ tKHKH Min.
All other inputs
VIL ≥ VIN ≥ VIH
Device Deselected
All inputs
VSS + 0.10 V
≥ VIN ≥
VDD – 0.10 V
© 2003, GSI Technology
GS8170LW36/72AC-350/333/300/250
AC Electrical Characteristics
Parameter
Symbol
Clock Cycle Time
-350
-333
-300
-250
Unit
Notes
—
ns
—
1.6
—
ns
—
—
1.6
—
ns
—
—
0.5
—
ns
2
1.8
1.8
—
2.1
ns
—
—
1.8
1.8
—
2.1
ns
1.7
—
1.8
1.8
—
2.1
ns
1, 2
0.5
—
0.5
—
—
0.5
—
ns
1
tKHQV
—
1.7
—
1.8
1.8
—
2.1
ns
—
Clock High to Output Invalid
tKHQX
0.5
—
0.5
—
—
0.5
—
ns
—
Clock High to Output High-Z
tKHQZ
—
1.7
—
1.8
1.8
—
2.1
ns
1
Echo Clock High to Output Valid
tCHQV
—
0.35
—
0.35
—
0.38
—
0.45
ns
2
Echo Clock High to Output Invalid
tCHQX
–0.35
—
–0.35
—
–0.38
—
–0.45
—
ns
2
Address Valid to Clock High
tAVKH
0.4
—
0.6
—
0.7
—
0.8
—
ns
—
Clock High to Address Don’t Care
tKHAX
0.4
—
0.4
—
0.4
—
0.5
—
ns
—
Enable Valid to Clock High
tEVKH
0.4
—
0.6
—
0.7
—
0.8
—
ns
—
Clock High to Enable Don’t Care
tKHEX
0.4
—
0.4
—
0.4
—
0.5
—
ns
—
Write Valid to Clock High
tWVKH
0.4
—
0.6
—
0.7
—
0.8
—
ns
—
Clock High to Write Don’t Care
tKHWX
0.4
—
0.4
—
0.4
—
0.5
—
ns
—
Byte Write Valid to Clock High
tBVKH
0.4
—
0.6
—
0.7
—
0.8
—
ns
—
Clock High to Byte Write Don’t Care
tKHBX
0.4
—
0.4
—
0.4
—
0.5
—
ns
—
Data In Valid to Clock High
tDVKH
0.4
—
0.5
—
0.5
—
0.5
—
ns
—
Clock High to Data In Don’t Care
tKHDX
0.4
—
0.4
—
0.4
—
0.5
—
ns
—
ADV Valid to Clock High
tadvVKH
0.4
—
0.6
—
0.7
—
0.8
—
ns
—
Clock High to ADV Don’t Care
tKHadvX
0.4
—
0.4
—
0.4
—
0.5
—
ns
—
Min
Max
Min
Max
Min
Max
Min
Max
tKHKH
2.86
—
3.0
—
3.3
—
4.0
Clock High Time
tKHKL
1.0
—
1.2
—
1.3
—
Clock Low Time
tKLKH
1.0
—
1.2
—
1.3
Clock High to Echo Clock Low-Z
tKHCX1
0.5
—
0.5
—
0.5
Clock High to Echo Clock High
tKHCH
—
1.7
—
Clock Low to Echo Clock Low
tKLCL
—
1.7
Clock High to Echo Clock High-Z
tKHCZ
—
Clock High to Output Low-Z
tKHQX1
Clock High to Output Valid
0.5
0.5
Notes:
1. Measured at 100 mV from steady state. Not 100% tested.
2. Guaranteed by design. Not 100% tested.
3. For any specific temperature and voltage tKHCZ < tKHCX1.
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Timing Parameter Key—Pipelined Read Cycle Timing
tKHKH
tKHKL
CK
tKHAX
tKLKH
tAVKH
C
A
D
E
tKHQZ
tKHQX
tKHQV
tKHQX1
DQ (Data Out)
QB
tCHQX
tCHQV
tKHCH
tKHCX1
tCHCL
tCLCH
tKHCZ
CQ
= CQ High Z
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Timing Parameter Key—Late Write Mode Control and Data In Timing
CK
tKHAX
tAVKH
A
A
B
tnVKH
C
tKHnX
E1, E2, E3,
W, Bx, ADV
tDVKH
DQ (Data In)
DA
DB
tKHDX
Note: tnVKH = tEVKH, tWVKH, tBVKH, etc. and tKHnX = tKHEX, tKHWX, tKHBX, etc.
JTAG Port Operation
Overview
The JTAG Port on this RAM operates in a manner that is compliant with IEEE Standard 1149.1-1990, a serial boundary scan
interface standard (commonly referred to as JTAG). The JTAG Port input interface levels scale with VDD. The JTAG output
drivers are powered by VDDQ.
Disabling the JTAG Port
It is possible to use this device without utilizing the JTAG port. The port is reset at power-up and will remain inactive unless
clocked. TCK, TDI, and TMS are designed with internal pull-up circuits.To assure normal operation of the RAM with the JTAG
Port unused, TCK, TDI, and TMS may be left floating or tied to either VDD or VSS. TDO should be left unconnected.
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JTAG Port Registers
JTAG Pin Descriptions
Pin
Pin Name
I/O
Description
TCK
Test Clock
In
Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate
from the falling edge of TCK.
TMS
Test Mode Select
In
The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP
controller state machine. An undriven TMS input will produce the same result as a logic one input
level.
In
The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers
placed between TDI and TDO. The register placed between TDI and TDO is determined by the
state of the TAP Controller state machine and the instruction that is currently loaded in the TAP
Instruction Register (refer to the TAP Controller State Diagram). An undriven TDI pin will produce
the same result as a logic one input level.
TDI
Test Data In
TDO
Test Data Out
Output that is active depending on the state of the TAP state machine. Output changes in
Out response to the falling edge of TCK. This is the output side of the serial registers placed between
TDI and TDO.
Note:
This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while TMS is
held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up.
Overview
The various JTAG registers, refered to as Test Access Port orTAP Registers, are selected (one at a time) via the sequences of 1s
and 0s applied to TMS as TCK is strobed. Each of the TAP Registers is a serial shift register that captures serial input data on the
rising edge of TCK and pushes serial data out on the next falling edge of TCK. When a register is selected, it is placed between the
TDI and TDO pins.
Instruction Register
The Instruction Register holds the instructions that are executed by the TAP controller when it is moved into the Run, Test/Idle, or
the various data register states. Instructions are 3 bits long. The Instruction Register can be loaded when it is placed between the
TDI and TDO pins. The Instruction Register is automatically preloaded with the IDCODE instruction at power-up or whenever the
controller is placed in Test-Logic-Reset state.
Bypass Register
The Bypass Register is a single bit register that can be placed between TDI and TDO. It allows serial test data to be passed through
the RAM’s JTAG Port to another device in the scan chain with as little delay as possible.
Boundary Scan Register
The Boundary Scan Register is a collection of flip flops that can be preset by the logic level found on the RAM’s input or I/O pins.
The flip flops are then daisy chained together so the levels found can be shifted serially out of the JTAG Port’s TDO pin. The
Boundary Scan Register also includes a number of place holder flip flops (always set to a logic 1). The relationship between the
device pins and the bits in the Boundary Scan Register is described in the Scan Order Table following. The Boundary Scan
Register, under the control of the TAP Controller, is loaded with the contents of the RAMs I/O ring when the controller is in
Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z,
SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register.
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GS8170LW36/72AC-350/333/300/250
JTAG TAP Block Diagram
·
·
·
·
·
·
Boundary Scan Register
·
·
0
Bypass Register
0
108
·
1
·
·
2 1 0
Instruction Register
TDI
TDO
ID Code Register
31 30 29
·
· · ·
2 1 0
Control Signals
TMS
TCK
Test Access Port (TAP) Controller
Identification (ID) Register
The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in
Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM.
It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the
controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins.
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Die
Revision
Code
GSI Technology
JEDEC Vendor
ID Code
I/O
Configuration
Not Used
Presence Register
Tap Controller Instruction Set
ID Register Contents
Bit #
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
0
x72
X
X
X
X
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
1
0
0 0 1 1 0 1 1 0 0 1
1
x36
X
X
X
X
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0 0 1 1 0 1 1 0 0 1
1
Overview
There are two classes of instructions defined in the Standard 1149.1-1990; the standard (Public) instructions, and device specific
(Private) instructions. Some Public instructions are mandatory for 1149.1 compliance. Optional Public instructions must be
implemented in prescribed ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load
address, data or control signals into the RAM or to preload the I/O buffers.
When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01.
When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired
instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the
TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction set for this
device is listed in the following table.
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JTAG Tap Controller State Diagram
1
0
Test Logic Reset
0
Run Test Idle
1
Select DR
1
Select IR
0
0
1
1
Capture DR
Capture IR
0
0
Shift DR
1
1
Shift IR
0
1
1
Exit1 DR
0
Exit1 IR
0
0
Pause DR
1
Exit2 DR
1
Update DR
1
1
0
0
Pause IR
1
Exit2 IR
0
1
0
0
Update IR
1
0
Instruction Descriptions
BYPASS
When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This
occurs when the TAP controller is moved to the Shift-DR state. This allows the board level scan path to be shortened to facilitate testing of other devices in the scan path.
SAMPLE/PRELOAD
SAMPLE/PRELOAD is a Standard 1149.1 mandatory public instruction. When the SAMPLE / PRELOAD instruction is
loaded in the Instruction Register, moving the TAP controller into the Capture-DR state loads the data in the RAMs input and
I/O buffers into the Boundary Scan Register. Boundary Scan Register locations are not associated with an input or I/O pin, and
are loaded with the default state identified in the Boundary Scan Chain table at the end of this section of the datasheet. Because
the RAM clock is independent from the TAP Clock (TCK) it is possible for the TAP to attempt to capture the I/O ring contents
while the input buffers are in transition (i.e. in a metastable state). Although allowing the TAP to sample metastable inputs will
not harm the device, repeatable results cannot be expected. RAM input signals must be stabilized for long enough to meet the
TAPs input data capture set-up plus hold time (tTS plus tTH). The RAMs clock inputs need not be paused for any other TAP
operation except capturing the I/O ring contents into the Boundary Scan Register. Moving the controller to Shift-DR state then
places the boundary scan register between the TDI and TDO pins.
EXTEST
EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with
all logic 0s. The EXTEST command does not block or override the RAM’s input pins; therefore, the RAM’s internal state is
still determined by its input pins.
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Typically, the Boundary Scan Register is loaded with the desired pattern of data with the SAMPLE/PRELOAD command.
Then the EXTEST command is used to output the Boundary Scan Register’s contents, in parallel, on the RAM’s data output
drivers on the falling edge of TCK when the controller is in the Update-IR state.
Alternately, the Boundary Scan Register may be loaded in parallel using the EXTEST command. When the EXTEST instruction is selected, the sate of all the RAM’s input and I/O pins, as well as the default values at Scan Register locations not associated with a pin, are transferred in parallel into the Boundary Scan Register on the rising edge of TCK in the Capture-DR
state, the RAM’s output pins drive out the value of the Boundary Scan Register location with which each output pin is associated.
IDCODE
The IDCODE instruction causes the ID ROM to be loaded into the ID register when the controller is in Capture-DR mode and
places the ID register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction
loaded in at power up and any time the controller is placed in the Test-Logic-Reset state.
SAMPLE-Z
If the SAMPLE-Z instruction is loaded in the instruction register, all RAM outputs are forced to an inactive drive state (highZ) and the Boundary Scan Register is connected between TDI and TDO when the TAP controller is moved to the Shift-DR
state.
RFU
These instructions are Reserved for Future Use. In this device they replicate the BYPASS instruction.
JTAG TAP Instruction Set Summary
Instruction
Code
Description
Notes
EXTEST
000
Places the Boundary Scan Register between TDI and TDO.
1
IDCODE
001
Preloads ID Register and places it between TDI and TDO.
1, 2
SAMPLE-Z
010
Captures I/O ring contents. Places the Boundary Scan Register between TDI and
TDO.
Forces all RAM output drivers to High-Z.
1
RFU
011
Do not use this instruction; Reserved for Future Use.
Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.
1
SAMPLE/
PRELOAD
100
Captures I/O ring contents. Places the Boundary Scan Register between TDI and
TDO.
1
GSI
101
GSI private instruction.
1
RFU
110
Do not use this instruction; Reserved for Future Use.
Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.
1
BYPASS
111
Places Bypass Register between TDI and TDO.
1
Notes:
1. Instruction codes expressed in binary, MSB on left, LSB on right.
2. Default instruction automatically loaded at power-up and in test-logic-reset state.
Rev: 1.04 4/2005
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GS8170LW36/72AC-350/333/300/250
JTAG Port AC Test Conditions
Parameter
Conditions
Input high level
VDD – 0.2 V
Input low level
0.2 V
Input slew rate
1 V/ns
Input reference level
VDDQ/2
Output reference level
VDDQ/2
JTAG Port AC Test Load
DQ
30pF*
50Ω
VDDQ/2
* Distributed Test Jig Capacitance
Notes:
1. Include scope and jig capacitance.
2. Test conditions as as shown unless otherwise noted.
JTAG Port Recommended Operating Conditions and DC Characteristics
Parameter
Symbol
Min.
Max.
Unit Notes
Test Port Input High Voltage
VIHJ
0.6 * VDD
VDD +0.3
V
1
Test Port Input Low Voltage
VILJ
–0.3
0.3 * VDD
V
1
TMS, TCK and TDI Input Leakage Current
IINHJ
–300
1
uA
2
TMS, TCK and TDI Input Leakage Current
IINLJ
–1
100
uA
3
TDO Output Leakage Current
IOLJ
–1
1
uA
4
Test Port Output High Voltage
VOHJ
1.7
—
V
5, 6
Test Port Output Low Voltage
VOLJ
—
0.4
V
5, 7
Test Port Output CMOS High
VOHJC
VDDQ – 100 mV
—
V
5, 8
Test Port Output CMOS Low
VOLJC
—
100 mV
V
5, 9
Notes:
1. Input Under/overshoot voltage must be –2 V > Vi < VDDn +2 V not to exceed 3.6 V maximum, with a pulse width not to exceed 20% tTKC.
2. VILJ ≤ VIN ≤ VDDn
3. 0 V ≤ VIN ≤ VILJn
4. Output Disable, VOUT = 0 to VDDn
5. The TDO output driver is served by the VDDQ supply.
6. IOHJ = –4 mA
7. IOLJ = + 4 mA
8. IOHJC = –100 uA
9. IOHJC = +100 uA
Rev: 1.04 4/2005
27/32
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
GS8170LW36/72AC-350/333/300/250
JTAG Port Timing Diagram
tTKC
tTKH
tTKL
TCK
tTH
tTS
TDI
tTH
tTS
TMS
tTKQ
TDO
tTH
tTS
Parallel SRAM input
JTAG Port AC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
TCK Cycle Time
tTKC
50
—
ns
TCK Low to TDO Valid
tTKQ
—
20
ns
TCK High Pulse Width
tTKH
20
—
ns
TCK Low Pulse Width
tTKL
20
—
ns
TDI & TMS Set Up Time
tTS
10
—
ns
TDI & TMS Hold Time
tTH
10
—
ns
Rev: 1.04 4/2005
28/32
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
GS8170LW36/72AC-350/333/300/250
209 BGA Package Drawing (Package C)
14 mm x 22 mm Body, 1.0 mm Bump Pitch, 11 x 19 Bump Array
C A1
A
Side View
D
aaa
D1
∅b
E
E1
e
Bottom View
e
Symbol
Min
Typ
Max
Units
Symbol
Min
Typ
Max
Units
A
—
—
1.70
mm
D1
—
18.0 (BSC)
—
mm
A1
0.40
0.50
0.60
mm
E
13.9
14.0
14.1
mm
∅b
0.50
0.60
0.70
mm
E1
—
10.0 (BSC)
—
mm
c
0.31
0.36
0.38
mm
e
—
1.00 (BSC)
—
mm
D
21.9
22.0
22.1
mm
aaa
—
0.15
—
mm
Rev 1.0
Rev: 1.04 4/2005
29/32
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
GS8170LW36/72AC-350/333/300/250
•
Ordering Information—GSI SigmaRAM
Org
Part Number
Type
I/O
Speed
(MHz)
TA
512K x 36
GS8170LW36AC-350
Late Write Σ1x1Lp ΣRAM
CMOS
350MHz
C
512K x 36
GS8170LW36AC-333
Late Write Σ1x1Lp ΣRAM
CMOS
333 MHz
C
512K x 36
GS8170LW36AC-300
Late Write Σ1x1Lp ΣRAM
CMOS
300 MHz
C
512K x 36
GS8170LW36AC-250
Late Write Σ1x1Lp ΣRAM
CMOS
250 MHz
C
512K x 36
GS8170LW36AC-350I
Late Write Σ1x1Lp ΣRAM
CMOS
350 MHz
I
512K x 36
GS8170LW36AC-333I
Late Write Σ1x1Lp ΣRAM
CMOS
333 MHz
I
512K x 36
GS8170LW36AC-300I
Late Write Σ1x1Lp ΣRAM
CMOS
300 MHz
I
512K x 36
GS8170LW36AC-250I
Late Write Σ1x1Lp ΣRAM
CMOS
250 MHz
I
256K x 72
GS8170LW72AC-350
Late Write Σ1x1Lp ΣRAM
CMOS
350MHz
C
256K x 72
GS8170LW72AC-333
Late Write Σ1x1Lp ΣRAM
CMOS
333 MHz
C
256K x 72
GS8170LW72AC-300
Late Write Σ1x1Lp ΣRAM
CMOS
300 MHz
C
256K x 72
GS8170LW72AC-250
Late Write Σ1x1Lp ΣRAM
CMOS
250 MHz
C
256K x 72
GS8170LW72AC-350I
Late Write Σ1x1Lp ΣRAM
CMOS
350 MHz
I
256K x 72
GS8170LW72AC-333I
Late Write Σ1x1Lp ΣRAM
CMOS
333 MHz
I
256K x 72
GS8170LW72AC-300I
Late Write Σ1x1Lp ΣRAM
CMOS
300 MHz
I
256K x 72
GS8170LW72AC-250I
Late Write Σ1x1Lp ΣRAM
CMOS
250 MHz
I
512K x 36
GS8170LW36AGC-350
Pb-Free Late Write Σ1x1Lp ΣRAM
CMOS
350MHz
C
512K x 36
GS8170LW36AGC-333
Pb-Free Late Write Σ1x1Lp ΣRAM
CMOS
333 MHz
C
512K x 36
GS8170LW36AGC-300
Pb-Free Late Write Σ1x1Lp ΣRAM
CMOS
300 MHz
C
512K x 36
GS8170LW36AGC-250
Pb-Free Late Write Σ1x1Lp ΣRAM
CMOS
250 MHz
C
512K x 36
GS8170LW36AGC-350I
Pb-Free Late Write Σ1x1Lp ΣRAM
CMOS
350 MHz
I
512K x 36
GS8170LW36AGC-333I
Pb-Free Late Write Σ1x1Lp ΣRAM
CMOS
333 MHz
I
512K x 36
GS8170LW36AGC-300I
Pb-Free Late Write Σ1x1Lp ΣRAM
CMOS
300 MHz
I
512K x 36
GS8170LW36AGC-250I
Pb-Free Late Write Σ1x1Lp ΣRAM
CMOS
250 MHz
I
256K x 72
GS8170LW72AGC-350
Pb-Free Late Write Σ1x1Lp ΣRAM
CMOS
350MHz
C
256K x 72
GS8170LW72AGC-333
Pb-Free Late Write Σ1x1Lp ΣRAM
CMOS
333 MHz
C
256K x 72
GS8170LW72AGC-300
Pb-Free Late Write Σ1x1Lp ΣRAM
CMOS
300 MHz
C
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS817xx72C-300T.
2. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range.
Rev: 1.04 4/2005
30/32
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
GS8170LW36/72AC-350/333/300/250
Ordering Information—GSI SigmaRAM
Org
Part Number
Type
I/O
Speed
(MHz)
TA
256K x 72
GS8170LW72AGC-250
Pb-Free Late Write Σ1x1Lp ΣRAM
CMOS
250 MHz
C
256K x 72
GS8170LW72AGC-350I
Pb-Free Late Write Σ1x1Lp ΣRAM
CMOS
350 MHz
I
256K x 72
GS8170LW72AGC-333I
Pb-Free Late Write Σ1x1Lp ΣRAM
CMOS
333 MHz
I
256K x 72
GS8170LW72AGC-300I
Pb-Free Late Write Σ1x1Lp ΣRAM
CMOS
300 MHz
I
256K x 72
GS8170LW72AGC-250I
Pb-Free Late Write Σ1x1Lp ΣRAM
CMOS
250 MHz
I
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS817xx72C-300T.
2. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range.
Rev: 1.04 4/2005
31/32
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
GS8170LW36/72AC-350/333/300/250
18Mb Sync ΣRAM Datasheet Revision History
DS/DateRev. Code: Old;
New
Types of Changes
Format or Content
• Creation of new datasheet
8170LWxxA_r1
• Updated 350 MHz AC specs
8170LWxxA_r1;
8170LWxxA_r1_01
8170LWxxA_r1_01;
8170LWxxA_r1_02
Format
8170LWxxA_r1_02;
8170LWxxA_r1_03
Content
8170LWxxA_r1_03;
8170LWxxA_r1_04
Content
Rev: 1.04 4/2005
Page;Revisions;Reason
• Updated format
• Removed Preliminary banner due to qualification of part
• Corrected JTAG information
• Added Pb-Free information
32/32
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology