HANBIT HFDOM40P

HANBit
HFDOM40P-xxxSx
40Pin Flash Disk Module Min.8MB ~ Max.384MB, True IDE Interface
Mode, 3.3V / 5.0V Operating
Part No. HFDOM40P-xxxSx
1. PRODUCT OVERVIEW
GENERAL DESCRIPTION
The HFDOM40P-xxxSx series 40Pin Flash Disk Module is a flash technology based with True IDE interface flash
memory card. It is constructed with flash disk controller chip and NAND-type (Samsung) flash memory device. The
HFDOM40P-xxxSx series operates in both 3.3-Volt and 5.0-Volt power supplies. It comes in capacity of 8, 16, 32, 64, 128,
192, 256 MB and up to 384 MB formatted 40Pin type .
By optimizing flash memory management, the life of this HFDOM40P-xxxSx series can be extended to its maximum
level. Because the ECC function is included, the correctness of data transfer between the HFDOM40P-xxxSx series and a
True IDE compatible interface device can be guaranteed.
The HFDOM40P-xxxSx series is fully compatible with applications such as CPU card / board, set top box, industry /
military PC / Notebook, security equipment, measuring instrument and embedded systems.
FEATURES
-
True IDE compatible host interface
Direct plug in for 3.5″ IDE Connectors
40 pin 2.54mm IDE Connector
Very high performance, very low power consumption
Automatic error correction
Support 3 power save mode : stop/idle/active
Support for CIS implemented with 256 bytes of attribute memory
3.3V/5.0V operation voltage
Host data transfer rate : 20MB/s
Flash data transfer rate : 10MB/s
Host Interface bus width : 8/16 bit Access
Flash Interface bus width : 8 bit Access
Capacity : Min. 8MB ~ Max. 384MB
MTBF : 1,000,000 hours, minimum 30,000 insertions
Operating vibration : 15G peak to peak maximum
Operating shock : 1,000G maximum
PRODUCT SPECIFICATIONS
Capacities :
8, 16, 32, 64, 128, 192, 256 and up to 384 MB (formatted)
Operating Voltage :
3.3V / 5.0V ± 10%
Power consumptions :
Read mode
30 mA (typ), 50 Ma (Max)
Write mode
30 mA (typ), 70 Ma (Max)
Stop mode
30 uA (typ)
Environment conditions :
Operating temperature
0° C to + 60° C
Storage temperature
- 25° C to + 85° C
Relative humidity
95%(Max)
Mechanical conditions :
Weight : Maximum 9.0g
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ELECTRICAL SPECIFICATIONS
Table 1.1 Absolute Maximum Ratings
Symbol
Parameter
Ratings
Unit
VDD
Supply voltage
- 0.3 to + 7.0
V
VIN
Input voltage
- 0.3 to + 7.0
V
IIN
DC input current
- 10
mA
- 20 to + 85
°C
Ratings
Unit
TSTG
Storage temperature
Table 1.2 Recommended Operating Conditions
Symbol
VDD
Ta
Parameter
DC Supply voltage
5V
4.75 to 5.25
V
3.3V
3.0 to 3.6
V
- 20 to +70
°C
Storage temperature
Table 1.3 DC Characteristics
(Ta=0° C to 70° C, VDD=3.0 to 5.3V)
Symbol
Parameter
Typ.
Max.
Unit
IDD
Operating Current
Min.
30
70
mA
Ids
Stop Current
50
150
µA
VDD
High Level Output Voltage
VDD
Low Level Output Voltage
0.4
V
2.4
V
CAPACITY SPECIFICATIONS
Table 1.4 Capacity Specifications
Part Number
Capacity (Unformatted)
Total Sector
Cylinders
Heads
Sectors
HFDOM40P-008Sx
7,864,320 bytes
15,360
30
16
32
HFDOM40P-016Sx
15,990,784 bytes
31,232
61
16
32
HFDOM40P-032Sx
32,243,712 bytes
62,976
123
16
32
HFDOM40P-064Sx
65,536,000 bytes
128,000
250
16
32
HFDOM40P-128Sx
131,858,432 bytes
257,536
503
16
32
HFDOM40P-192Sx
196,608,000 bytes
384,000
750
16
32
HFDOM40P-256Sx
265,027,584 bytes
517,632
1011
16
32
HFDOM40P-384Sx
395,837,440 bytes
773,120
1510
16
32
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PHYSYCAL SPECIFICATIONS
51.85± 0.1mm
1
2
3
Jumper
22.10± 0.1mm
Master
Slave
1,2
2,3
Close
Close
29.0± 0.2mm
7.0± 0.1mm
Jumper
+
-
1
55.37± 0.1mm
< View from front side >
3.8± 0.1mm
2.54± 0.05mm
6.0± 0.1mm
2.54± 0.05mm
48.20± 0.1mm
55.30± 0.1mm
< View from connector side >
Figure 1.1 40 pin Type Flash Disk Module Dimensions
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INSTALLTION GUIDE
1) Setting Method
①
②
Make sure your computer is turned off before you open the case.
Plug the carefully into the 40pin IDE slot on your computer.
Caution: Make sure to align pin1 on host adapter interface connector with pin 1 on your Flash Disk Module. Pin 1
is indicated by a triangle on the Flash Disk Module connector.
③
The Flash Disk Module is used power connector cable of the computer.
Caution: If you need to remove your Flash Disk Module, use both hands to pull it out carefully.
④
Check all cable connections and then replace your computer cover.
2) BIOS setting Method
Before you format or partition your new drive, you must configure your computer's BIOS so that the computer can
recognize your new drive.
①
Turn your computer on. As your computer start up, watch the screen for a message describing how to run the
system setup program on the screen (sometimes called BIOS or CMOS setup). This is usually done by pressing a
special key, such as Delete, Esc or F1 during startup. See your computer manual for details. Press the
appropriate key to run the system setup program.
②
③
If your BIOS provides automatic drive detection (an "AUTO" drive type), select this option. ( We
recommend to use Normal / CHS mode to partition your Flash Disk Module to get the maximum formatted
capacity. )
This allows your computer to configure itself automatically for your new drive.
If your BIOS dose not provide “ AUTO” drive detection, select "User-defined" drive setting and enter the
CHS values from the table. BIOS Settings (see specification) Capacity Cylinders Heads Sectors(unformatted)
Save the settings and exit the System Setup program. ( your computer will automatically reboot ) After you
configure your computer, you can use the standard DOS commands to partition and format your Flash Disk
Module, as described below.
3) Formatting Method
To partition your new Flash Disk Module with Microsoft DOS program :
①
Insert a bootable DOS diskette into your diskette drive and restart your computer.
②
Insert a DOS program diskette that contains the FDISK.EXE and FORMAT.COM
programs into your diskette drive. Use the same DOS version that is on your bootable diskette. At the A:\ >
prompt, type “ FDISK” and press Enter.
③
Select “ Create DOS partition or logical DOS drive” by pressing 1. Then press Enter.
④
Select “ Create primary DOS partition” by pressing 1 again. Then press Enter.
Create your first drive partition. If you are creating a partition that will be used to boot your computer (drive C),
make sure that the partition is marked active.
Create an extended partition and additional logical drives as necessary, until all the space on your new hard drive
has been partitioned.
When the partitioning is complete, FDISK reboots your computer.
Caution: Make sure to use the correct drive letters so that you do not format a drive that already contains data.
⑤
⑥
⑦
At the A:\ > prompt, type “ format c:/s” , where c is the letter of your first new partition, Repeat the format process
for all the new partitions you have created.
⑧
After you format your drive, it is ready to use.
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2. PIN INFORMATION
PIN ASSIGNMENTS AND PIN TYPE
Table 2.1 Pin Assignment and Pin type
Pin
Signal
Pin Type
Pin
Signal
Pin Type
1
/RESET
I
2
GND
Ground
3
D07
I/O
4
D08
I/O
5
D06
I/O
6
D09
I/O
7
D05
I/O
8
D10
I/O
9
D04
I/O
10
D11
I/O
11
D03
I/O
12
D12
I/O
13
D02
I/O
14
D13
I/O
15
D01
I/O
16
D14
I/O
17
D00
I/O
18
D15
I/O
19
GND
DC
20
Key Pin
--
21
Reserved
--
22
GND
Ground
23
/IOW
I
24
GND
Ground
25
/IOR
I
26
GND
Ground
27
IORDY
O
28
Reserved
--
29
Reserved
--
30
GND
Ground
31
IRQ
O
32
/IOIS16
O
33
A01
I
34
/PDIAG
I/O
35
A00
I
36
A02
I
37
/CS0
I
38
/CS1
I
39
/DASP(LED)
I/O
40
GND
Ground
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Signal Descriptions
Table 2.2 Signal Descriptions
Signal Name
Dir.
Pin
I
33,35,36
-PDIAG
I/O
34
-DASP(LED)
I/O
39
-CS0, -CS1
I
37,38
A[2:0]
3,4,5,6,
Description
In True IDE Mode only A[2:0] are used to select the one of eight registers in
the Task File, the remaining address lines should be grounded by the host.
This input / output is the Pass Diagnostic signal in the Master / Slave
handshake protocol.
This signal used either to drive an LED whenever the Disk Module is being
accessed or as indication of a second drive present. This signal is active low
when the Disk Module is busy.
CS0 is the chip select for the task file registers while CS2 is used to select
the Alternate Status Register and the Device Control Register.
All Task File operations occur in byte mode on the low order bus D00-D07
while all data transfers are 16 bit using D00-D15.
7,8,9,10,
D[15:00]
I/O
11,12,13,
14,15,16,
17,18
2,19,22,
GND
--
Ground.
24,26,
30,40,
-IOR
I
25
This is an I/O Read strobe generated by the host.
-IOW
I
23
The I/O Write strobe pulse is used to clock I/O data on the Card Data bus
into the Storage Card controller registers when the Storage Card is
configured to use the I/O interface. The clocking will occur on the negative to
positive edge of the signal (trailing edge).
IRQ
O
31
In True IDE Mode signal is the active high Interrupt Request to the host.
-RESET
I
1
This input pin is the active low hardware reset from the host.
IORDY
O
27
This output signal may be used as IORDY.
-IOIS16
O
32
This output signal is asserted low when this device is expecting a word data
transfer cycle.
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BLOCK DIAGRAM
Reset IC
Data I/O
Flash 0
Flash 1
IDE Interface
Control
Flash 2
Flash Memory
X’tal
CONTROLLER
Figure 2.1 Flash Disk Module Block Diagram
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3. INTERFACE BUS TIMING
ACCESS SPCIFICATIONS
IDE MODE I/O ACCESS SPECIFICATIONS
In this True IDE Mode the Flash Disk Module protocol and configuration are disabled and only I/O operations to the
Task File and Data Register are allowed. In this mode no Memory or Attribute Registers are accessible to the host.
Table 3.1 IDE Mode I/O Access Mode
Mode
-CE2 -CE1
A2-A0
-IORD
-IOWR
D15 - D8
D7 – D0
Invalid Mode
L
L
x
x
x
High Z
High Z
Standby Mode
H
H
x
x
x
High Z
High Z
Task File Write
H
L
1-7h
H
L
Don’t Care
Data In
Task File Read
H
L
1-7h
L
H
High Z
Data Out
Data Register Write
H
L
0
H
L
Odd Byte in
Even Byte in
Data Register Read
H
L
0
L
H
Odd Byte out
Even Byte out
Control Register Write
L
H
6h
H
L
Don’t Care
Control In
All Status Read
L
H
6h
L
H
High Z
Status Out
Table 3.2 IDE Mode I/O Read Timing
Parameter
Symbol
IEEE Symbol
Min. ns
Data Delay after IORD
td (IORD)
tlGLQV
Data Hold following IORD
th (IORD)
tlGHQX
0
IORD Width Time
tw (IORD)
tlGLIGH
165
Address Setup before IORD
tsuA (IORD)
tAVIGL
70
Address Hold following IORD
thA (IORD)
tlGHAX
20
CE Setup before IORD
tsuCE (IORD)
tELIGL
5
CE Hold following IORD
thCE (IORD)
tlGHEH
20
IOIS16 Delay Falling from Address
tdfIOIS16 (ADR)
tAVISL
Max. ns
100
35
IOIS16 Delay Rising from Address
tdrIOIS16 (ADR)
tAVISH
35
NOTE: The maximum load on -IOIS16 is 1 LSTTL with 50pF total load. All times are in nanoseconds. Minimum time
from
–WAIT high to -IORD high is 0nsec, but minimum -IORD width must still be met.
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HFDOM40P-xxxSx
A0-A10
-CE
-IORD
-IOIS16
Dout
Figure 3.1 IDE Mode I/O Read Timing Example
Table 3.3 IDE Mode I/O Write Timing
Parameter
Symbol
IEEE Symbol
Min. ns
Data Setup before IOWR
tsu(IOWR)
tDVIWH
60
Data Hold following IOWR
th(IOWR)
tlWHDX
30
IOWR Width Time
twI(OWR)
tlWLIWH
165
Address Setup before IOWR
tsuA(IOWR)
tAVIWL
70
Address Hold following IOWR
thA(IOWR)
tlWHAX
20
CE Setup before IOWR
tsuCE(IOWR)
tELIWL
5
CE Hold following IOWR
thCE(IOWR)
tlWHEH
20
IOIS16 Delay Falling from Address
tdfIOIS16(ADR)
tAVISL
Max. ns
35
IOIS16 Delay Rising from Address
tdrIOIS16(ADR)
tAVISH
35
NOTE: The maximum load on -IOIS16 is 1 LSTTL with 50pF total load. All times are in nanoseconds. Minimum
time from
-WAIT high to -IOWR high is 0nsec, but minimum -IOWR width must still be met.
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A0-A10
-CE
-IOWR
-IOIS16
Din
Figure 3.2 IDE Mode I/O Write Timing Example
Ordering Infomation
NO
Parts
Size
Capacity
Media transfer
mode
Chip Number
Operation
Mode
1
HFDOM40P-008S1
55.3x29.0x0.9mm
8Mbyte
BYTE
1
True IDE
2
HFDOM40P-016S1
55.3x29.0x0.9mm
16Mbyte
BYTE
1
True IDE
3
HFDOM40P-032S1
55.3x29.0x0.9mm
BYTE
1
True IDE
BYTE
2
True IDE
BYTE
1
True IDE
BYTE
2
True IDE
BYTE
1
True IDE
BYTE
2
True IDE
32Mbyte
4
HFDOM40P-032S2
55.3x29.0x0.9mm
5
HFDOM40P-064S1
55.3x29.0x0.9mm
64Mbyte
6
HFDOM40P-064S2
55.3x29.0x0.9mm
7
HFDOM40P-128S1
55.3x29.0x0.9mm
128Mbyte
8
HFDOM40P-128S2
55.3x29.0x0.9mm
9
HFDOM40P-192S3
55.3x29.0x0.9mm
192Mbyte
BYTE
3
True IDE
10
HFDOM40P-256S2
55.3x29.0x0.9mm
256Mbyte
BYTE
2
True IDE
11
HFDOM40P-384S3
55.3x29.0x0.9mm
384Mbyte
BYTE
3
True IDE
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