LINER LTC2704CGW-14

LTC2704
Quad 12-, 14- and 16-Bit
Voltage Output SoftSpan
DACs with Readback
U
FEATURES
DESCRIPTIO
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The LTC®2704-16/LTC2704-14/LTC2704-12 are serial input, 12-, 14- or 16-bit, voltage output SoftSpan™ DACs
that operate from 3V to 5V logic and ±5V to ±15V analog
supplies. SoftSpan offers six output spans—two unipolar
and four bipolar—fully programmable through the 3-wire
SPI serial interface. INL is accurate to 1LSB (2LSB for the
LTC2704-16). DNL is accurate to 1LSB for all versions.
■
■
■
■
■
■
■
■
Six Programmable Output Ranges:
Unipolar: 0V to 5V, 0V to 10V
Bipolar: ±5V, ±10V, ±2.5V, –2.5V to 7.5V
Serial Readback of All On-Chip Registers
1LSB INL and DNL Over the Industrial
Temperature Range (LTC2704-14/LTC2704-12)
Force/Sense Outputs Enable Remote Sensing
Glitch Impulse: < 2nV-sec
Outputs Drive ±5mA
Pin Compatible 12-, 14- and 16-Bit Parts
Power-On and Clear to Zero Volts
44-Lead SSOP Package
Readback commands allow verification of any on-chip
register in just one 24- or 32- bit instruction cycle. All other
commands produce a “rolling readback” response from
the LTC2704, dramatically reducing the needed number of
instruction cycles.
U
APPLICATIO S
■
■
■
■
A Sleep command allows any combination of DACs to be
powered down. There is also a reset flag and an offset
adjustment pin for each channel.
Process Control and Industrial Automation
Direct Digital Waveform Generation
Software Controlled Gain Adjustment
Automated Test Equipment
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
SoftSpan is a trademark of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
W
W
SI PLIFIED BLOCK DIAGRA
AGND
V+ 1
32
42
V–
REFM1 REFG1 REF1 REF2 REFG2 REFM2 V+2 1,8,15,22,31,36
44
2
43
24
21
23
LTC2704-16
Integral Nonlinearity (INL)
25
VOSB 40
C1B 39
RFBB 37
DAC C
DAC B
OUTB 38
27 VOSC
1.0
28 C1C
0.8
30 RFBC
0.6
26 AGNDC
VOSA 4
19 VOSD
INL (LSB)
–1
–1
0.2
0
–0.2
C1A 5
18 C1D
–0.4
RFBA 7
16 RFBD
–0.6
DAC A
DAC D
17 OUTD
OUTA 6
AGNDA 3
20 AGNDD
33
34
GND VDD
10
13
11
14
CS/LD SCK
SDI
CLR
9
35
12
LDAC RFLAG SRO
ALL 4 DACS
SUPERIMPOSED
0.4
29 OUTC
AGNDB 41
V+/V – = ±15V
VREF = 5V
±10V RANGE
–0.8
–1.0
0
16384
32768
CODE
49152
65535
2704 BD
2704 TA01b
2704f
1
LTC2704
W
U
U
U
W W
W
ABSOLUTE MAXIMUM RATINGS
PACKAGE/ORDER INFORMATION
(Note 1)
Total Supply Voltage V+1, V+2 to V – ........... –0.3V to 36V
V+1, V+2, REF1, REF2, REFM1, REFM2,
OUTx, RFBx, VOSx to GND, AGND,
AGNDx, C1x, REFG1, REFG2 ................................... 18V
GND, AGND, AGNDx, C1x, REFG1, REFG2 to V+1,
V+2, V –, REF1, REF2, REFM1, REFM2, OUTx,
RFBx, VOSx ............................................................... 18V
OUTA, RFBA, VOSA, OUTB, RFBB, VOSB, REF1,
REFM1 to GND, AGND ............... V– – 0.3V to V+1 + 0.3V
OUTC, RFBC, VOSC, OUTD, RFBD, VOSD, REF2, REFM2
to GND, AGND ........................... V– – 0.3V to V+2 + 0.3V
VDD, Digital Inputs/Outputs to GND ............. –0.3V to 7V
Digital Inputs/Outputs to VDD ................................. 0.3V
GND, AGNDx, REFG1, REFG2 to AGND ................ ±0.3V
C1x to AGNDx ....................................................... ±0.3V
V– to Any Pin .......................................................... 0.3V
Maximum Junction Temperature ......................... 150°C
Operating Temperature Range
LTC2704C ............................................... 0°C to 70°C
LTC2704I ............................................ – 40°C to 85°C
Storage Temperature Range ................. – 65°C to 150°C
Lead Temperature (Soldering, 10 sec).................. 300°C
ORDER PART
NUMBER
TOP VIEW
V–
1
44 REFM1
REFG1
2
43 REF1
AGNDA
3
42 V+1
VOSA
4
41 AGNDB
C1A
5
40 VOSB
OUTA
6
39 C1B
RFBA
7
38 OUTB
V–
8
37 RFBB
LDAC
9
36 V–
CS/LD 10
35 RFLAG
SDI 11
34 VDD
SRO 12
33 GND
SCK 13
32 AGND
CLR 14
31 V–
V–
LTC2704CGW-16
LTC2704IGW-16
LTC2704CGW-14
LTC2704IGW-14
LTC2704CGW-12
LTC2704IGW-12
15
30 RFBC
RFBD 16
29 OUTC
OUTD 17
28 C1C
C1D 18
27 VOSC
VOSD 19
26 AGNDC
25 V+2
AGNDD 20
REFG2 21
24 REF2
V – 22
23 REFM2
GW PACKAGE
44-LEAD PLASTIC SSOP
TJMAX = 125°C, θJA = 80°C/W
Order Options Tape and Reel: Add #TR
Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF
Lead Free Part Marking: http://www.linear.com/leadfree/
Consult LTC Marketing for parts specified with wider operating temperature ranges.
ELECTRICAL CHARACTERISTICS
The ● denotes specifications which apply over the full operating temperature range, otherwise specifications are TA = 25°C,
V+1 = V+2 = 15V, V– = –15V, VDD = 5V, REF1 = REF2 = 5V, AGND = AGNDx = REFG1 = REFG2 = GND = 0V.
SYMBOL PARAMETER
Accuracy
Resolution
Monotonicity
INL
Integral Nonlinearity
DNL
Differential Nonlinearity
GE
Gain Error
Gain Temperature
Coefficient
VOS
Unipolar Zero-Scale Error
LTC2704-12
MIN TYP MAX
CONDITIONS
●
●
VREF = 5V
VREF = 5V
VREF = 5V
∆Gain/∆Temperature
Span = 0V to 5V, TA = 25°C
Span = 0V to 10V, TA = 25°C
Span = 0V to 5V
Span = 0V to 10V
12
12
14
14
●
●
●
±0.5
±2
●
●
±80
±100
±140
±150
●
LTC2704-14
MIN TYP MAX
±1
±1
±2
±200
±300
±400
±600
LTC2704-16
MIN TYP MAX
16
16
±1
±2
±80
±100
±140
±150
±1
±1
±5
±200
±300
±400
±600
±4
±2
±80
±100
±140
±150
±2
±1
±20
±200
±300
±400
±600
UNITS
Bits
Bits
LSB
LSB
LSB
ppm/°C
µV
µV
µV
µV
2704f
2
LTC2704
ELECTRICAL CHARACTERISTICS
The ● denotes specifications which apply over the full operating temperature range, otherwise specifications are TA = 25°C,
V+1 = V+2 = 15V, V– = –15V, VDD = 5V, REF1 = REF2 = 5V, AGND = AGNDx = REFG1 = REFG2 = GND = 0V.
SYMBOL PARAMETER
VOS Temperature
Coefficient
BZE
Bipolar Zero
Error
PSRR
Power Supply
Rejection Ratio
CONDITIONS
0V to 5V Range
0V to 10V Range
All Bipolar Ranges
●
●
●
VDD = 5V ±10% (Note 3)
VDD = 3V ±10% (Note 3)
0V to 10V Range, Code = 0
●
V+/V– = ±15V ±10% (Note 2)
V+/V– = ±5V ±10%, VREF = 2V (Note 2) ●
LTC2704-12
MIN TYP MAX
±2
±2
±0.25 ±1
±2
±0.003
±0.006
LTC2704-14
MIN TYP MAX
±2
±2
±0.5
±2
±2.5
±0.013
±0.025
±0.001 ±0.06
±0.002 ±0.05
±0.005 ±0.25
±0.01 ±0.13
Analog Outputs (Note 4)
Settling Time
ISC
SR
0V to 5V Range, 5V Step, to ±1LSB
0V to 10V or ±5V Range,
10V Step, to ±1LSB
±10V Range, 20V Step, to ±1LSB
Output Swing
V+/V– = ±15V, VREF = ±7.25V,
0V to 10V Range, ILOAD = ±3mA (Note 2)
V+/V– = ±5V, VREF = ±2.25V,
0V to 10V Range, ILOAD = ±3mA (Note 2)
Load Current
V+/V– = ±10.8V to ±16.5V, VREF = ±5V,
0V to 10V Range, VOUT = ±10V (Note 2)
V+/V– = ±4.5V to ±16.5V, VREF = ±2V,
0V to 10V Range, VOUT = ±4V (Note 2)
Load Regulation V+/V– = ±15V, VREF = 5V,
0V to 10V Range, Code = 0, ±5mA Load
(Note 2)
V+/V– = ±5V, VREF = 2V,
0V to 10V Range, Code = 0, ±3mA Load
(Note 2)
Output
VREF = 5V, 0V to 10V Range,
Impedance
Code = 0, ±5mA Load
Short-Circuit
V+/V– = ±16.5V, VREF = 5V, ±10V Range
Current
Code = 0, VOUT Shorted to V+ (Note 2)
Code = Full Scale, VOUT Shorted to V–
V+/V– = ±5.5V, VREF = 2V, ±10V Range
Code = 0, VOUT Shorted to V+ (Note 2)
Code = Full Scale, VOUT Shorted to V–
Slew Rate
RL= 2k, V+/V– = ±15V (Note 2)
RL= 2k, V+/V– = ±5V (Note 2)
Capacitive Load Within Maximum Load Current
Driving
LTC2704-16
MIN TYP MAX
±2
±2
±2
±8
±10
±0.05
±0.1
UNITS
µV/°C
µV/°C
LSB
LSB
LSB/V
LSB/V
±0.02
±0.04
LSB/V
LSB/V
±1
±0.5
3
3.5
4
µs
5
8
5.5
9
6
10
●
–14.5
14.5
–14.5
14.5
–14.5
14.5
µs
µs
V
●
–4.5
4.5
–4.5
4.5
–4.5
4.5
V
●
±5
±5
±5
mA
●
±3
±3
±3
mA
●
±0.005
±0.01
±0.04 LSB/mA
●
±0.01
±0.013
±0.05 LSB/mA
●
0.015
0.006
0.006
Ω
38
mA
mA
38
mA
mA
V/µs
V/µs
pF
●
●
●
●
●
●
38
–36
38
–36
–36
38
–36
2.2
2.0
3
2.8
1000
38
–36
2.2
2.0
3
2.8
1000
–36
2.2
2.0
3
2.8
1000
The ● denotes specifications which apply over the full operating temperature range, otherwise specifications are TA = 25°C,
V+1 = V+2 = 15V, V– = –15V, VDD = 5V, REF1 = REF2 = 5V, AGND = AGNDx = REFG1 = REFG2 = GND = 0V.
SYMBOL
PARAMETER
Reference Inputs
REF1, REF2 Input Voltage
Resistances
RREF1, RREF2 Reference Input Resistance
RFBx
Output Feedback Resistance
RVOSX
Offset Adjust Input Resistance
CONDITIONS
V+/V– = ±15V, 0V to 5V Span (Note 2)
MIN
●
–14.5
●
5
7
700
●
●
TYP
7
10
1000
MAX
UNITS
14.5
V
kΩ
kΩ
kΩ
2704f
3
LTC2704
ELECTRICAL CHARACTERISTICS
The ● denotes specifications which apply over the full operating temperature range, otherwise specifications are TA = 25°C,
V+1 = V+2 = 15V, V– = –15V, VDD = 5V, REF1 = REF2 = 5V, AGND = AGNDx = REFG1 = REFG2 = GND = 0V.
SYMBOL
PARAMETER
AC Performance (Note 4)
Glitch Impulse
Crosstalk
Digital Feedthrough
Multiplying Feedthrough Error
Multiplying Bandwidth
Output Noise Voltage Density
Output Noise Voltage
Power Supply
IDD
Supply Current, VDD
IS
Supply Current, V+/V–
VDD
Logic Supply Voltage
V+1/V+2
Positive Analog Supply Voltage
V–
Negative Analog Supply Voltage
Digital Inputs/Outputs
VIH
Digital Input High Voltage
VIL
Digital Input Low Voltage
VOH
VOL
IIN
CIN
Digital Output High Voltage
Digital Output Low Voltage
Digital Input Current
Digital Input Capacitance
CONDITIONS
MIN
0V to 5V Range, Midscale Transition
10V Step on VOUTA
DAC B: 0V to 5V Range, Full Scale
DAC B: 0V to 10V Range, Full Scale
±10V Range, Midscale
0V to 10V Range, VREF = ±5V, 10kHz Sine Wave
Span = 0V to 5V, Full Scale
Span = 0V to 10V, Full Scale
10kHz
Span = 0V to 5V, Midscale
Span = 0V to 10V, Midscale
0.1Hz to 10Hz
Span = 0V to 5V, Midscale
Span = 0V to 10V, Midscale
Digital Inputs = 0V or VDD
V+/V– = ±15V, ±10%; VREF = 5V, VOUT = 0V (Note 2)
V+/V– = ±5V, ±10%; VREF = 2V, VOUT = 0V (Note 2)
Sleep Mode—All DACs (Note 4)
●
●
2.7
4.5
–16.5
●
●
2.4
2.0
nV-s
nV-s
nV-s
nV-s
mVP-P
kHz
kHz
30
50
nV/√Hz
nV/√Hz
0.8
1.2
µVRMS
µVRMS
●
●
2
20
18
1
5.5
16.5
– 4.5
0.6
0.8
● VCC – 0.4
●
●
VIN = 0V (Note 3)
UNITS
2
3
0.2
0.35
300
250
0.5
17.5
17.0
●
●
●
●
WU
TI I G CHARACTERISTICS
MAX
2
●
VDD = 2.7V to 5.5V
VDD = 2.7V to 3.3V
VDD = 2.7V to 5.5V
VDD = 4.5V to 5.5V
IOH = 200µA
IOL = 200µA
TYP
0.001
●
0.4
±1
5
µA
mA
mA
mA
V
V
V
V
V
V
V
V
V
µA
pF
The ● denotes specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C.
SYMBOL PARAMETER
VDD = 4.5V to 5.5V
t1
SDI Valid to SCK Setup
t2
SDI Valid to SCK Hold
t3
SCK High Time
t4
SCK Low Time
t5
CS/LD Pulse Width
t6
LSB SCK High to CS/LD High
t7
CS/LD Low to SCK Positive Edge
t8
CS/LD High to SCK Positive Edge
t9
SRO Propagation Delay
t10
CLR Pulse Width
CONDITIONS
MIN
●
●
●
●
●
●
●
●
CLOAD = 10pF
MAX
7
7
11
11
9
0
12
12
●
●
TYP
18
50
UNITS
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
2704f
4
LTC2704
WU
TI I G CHARACTERISTICS
The ● denotes specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C.
SYMBOL
t11
t12
t13
PARAMETER
LDAC Pulse Width
CLR Low to RFLAG Low
CS/LD High to RFLAG High
SCK Frequency
VDD = 2.7V to 3.3V
t1
SDI Valid to SCK Setup
t2
SDI Valid to SCK Hold
t3
SCK High Time
t4
SCK Low Time
t5
CS/LD Pulse Width
t6
LSB SCK High to CS/LD High
t7
CS/LD Low to SCK Positive Edge
t8
CS/LD High to SCK Positive Edge
t9
SRO Propagation Delay
t10
CLR Pulse Width
t11
LDAC Pulse Width
t12
CLR Low to RFLAG Low
t13
CS/LD High to RFLAG High
SCK Frequency
CONDITIONS
MIN
15
●
●
CLOAD = 10pF (Note 3)
CLOAD = 10pF (Note 3)
50% Duty Cycle (Note 5)
●
●
●
●
●
●
●
●
●
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
MHz
26
●
90
20
●
●
CLOAD = 10pF
CLOAD = 10pF
50% Duty Cycle (Note 5)
UNITS
ns
ns
ns
MHz
9
9
15
15
12
0
12
12
●
CLOAD = 10pF
MAX
50
40
40
●
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The notation V+ is used to denote both V+1 and V+2 when the same
voltage is applied to both pins.
Note 3: Guaranteed by design, not subject to test.
TYP
70
60
25
●
●
Note 4: Measured in unipolar 0V to 5V mode.
Note 5: When using SRO, maximum SCK frequency fMAX is limited by
SRO propagation delay as follows:
⎛
⎞
1
fMAX = ⎜
⎟ , where ts is the setup time of the receiving
⎝ 2 (t 9 + t S)⎠
device.
U W
TYPICAL PERFOR A CE CHARACTERISTICS
LTC2704-16
Differential Nonlinearity (DNL)
INL vs VREF
V+/V – = ±15V
0.8 VREF = 5V
±10V RANGE
0.6
V+/V– = ±15V
0.8 VREF = 5V
±10V RANGE
0.6
1.0
0.4
0.4
0.4
0.2
0.2
0.2
1.0
0
–0.2
V+/V– = ±15V
0.8 ±5V RANGE
0.6
INL (LSB)
DNL (LSB)
INL (LSB)
Integral Nonlinearity (INL)
1.0
0
–0.2
0
–0.4
–0.4
–0.4
–0.6
–0.6
–0.8
–0.8
–0.8
–1.0
–1.0
16384
32768
CODE
49152
65535
2704 G01
0
16384
32768
CODE
49152
65535
2704 G02
MIN
MAX
MIN
–0.2
–0.6
0
MAX
–1.0
–10 –8 –6 –4 –2 0 2
VREF (V)
4
6
8
10
2704 G03
2704f
5
LTC2704
U W
TYPICAL PERFOR A CE CHARACTERISTICS
LTC2704-16
DNL vs Temperature
INL vs Temperature
0.8
0.6
V+/V– = ±15V
1.0
V+/V– = ±15V
VREF = 5V
±10V RANGE
0.8
VREF = 5V
±10V RANGE
0.6
0.2
0
MIN
–0.2
0.2
0
–0.4
–O.6
–O.6
–0.8
–0.8
–30
30
50
–10 10
TEMPERATURE (°C)
70
90
MAX
MIN
–0.2
–0.4
–1.0
–50
400
0.4
MAX
DNL (LSB)
INL (LSB)
0.4
Offset vs Temperature
600
OFFSET (µV)
1.0
–1.0
–50
–30
30
50
–10 10
TEMPERATURE (°C)
70
–600
–50
90
–30
30
50
–10 10
TEMPERATURE (°C)
2704 G05
70
90
2704 G06
Gain Error vs Temperature
V+/V– = ±15V
16
VREF = 5V
±10V RANGE
12
V+/V– = ±15V
VREF = 5V
±10V RANGE
8
GAIN ERROR (LSB)
4
2
LSB
0
–400
Bipolar Zero vs Temperature
6
200
–200
2704 G04
8
V+/V– = ±15V
VREF = 5V
0V TO 10V RANGE
0
–2
4
0
–4
–4
–8
–6
–12
–8
–50
–30
–10 10
30
50
TEMPERATURE (°C)
70
–16
–50
90
–30
30
50
–10 10
TEMPERATURE (°C)
2704 G07
Settling 0V to 5V
Settling ±10V
VOUT
5V/DIV
VOUT
10V/DIV
VOUT
1mV/DIV
VOUT
1mV/DIV
VOUT
1mV/DIV
CS/LD
5V/DIV
CS/LD
5V/DIV
CS/LD
5V/DIV
2.5µs/DIV
2704 G18
90
2704 G08
Settling 0V to 10V
VOUT
5V/DIV
70
2.5µs/DIV
2704 G19
2.5µs/DIV
2704 G20
2704f
6
LTC2704
U W
TYPICAL PERFOR A CE CHARACTERISTICS
LTC2704-14
Integral Nonlinearity (INL)
1.0
1.0
V+/V– = ±15V
VREF = 5V
±10V RANGE
0.8
0.6
V+/V– = ±15V
VREF = 5V
±10V RANGE
0.8
0.6
0.4
0.4
0.2
0.2
LSB
LSB
Differential Nonlinearity (DNL)
0
–0.2
0
–0.2
–0.4
–0.4
–0.6
–0.6
–0.8
–0.8
–1.0
–1.0
0
4096
8192
CODE
12288
0
16383
4096
8192
CODE
2704 G09
12288
16383
2704 G10
LTC2704-12
Integral Nonlinearity (INL)
V+/V– = ±15V
1.0
0.8
VREF = 5V
±10V RANGE
0.8
0.6
V+/V– = ±15V
VREF = 5V
±10V RANGE
0.6
0.4
0.4
0.2
0.2
LSB
LSB
Differential Nonlinearity (DNL)
1.0
0
–0.2
0
–0.2
–0.4
–0.4
–0.6
–0.6
–0.8
–0.8
–1.0
–1.0
0
512 1536 1024 2048 2560 3072 3584 4095
CODE
0
512 1536 1024 2048 2560 3072 3584 4095
CODE
2704 G11
2704 G12
LTC2704-16/LTC2704-14/LTC2704-12
Positive Slew
Midscale Glitch
Negative Slew
CS/LD
5V/DIV
5V/DIV
5V/DIV
VOUT
2mV/DIV
V+/V– = ±15V
VREF = 5V
±10V RANGE
20V STEP
2.5µs/DIV
2704 G13
V+/V– = ±15V
VREF = 5V
±10V RANGE
20V STEP
2.5µs/DIV
2704 G14
2.5µs/DIV
2704 G15
2704f
7
LTC2704
U W
TYPICAL PERFOR A CE CHARACTERISTICS
LTC2704-16/LTC2704-14/LTC2704-12
VCC Supply Current
vs Logic Voltage
0.1Hz to 10Hz Noise
3.5
3.0
VDD = 5V
SCK, SDI, CS/LD, LDAC
CLR TIED TOGETHER
2.5
ICC (mA)
1µV/DIV
2.0
1.5
1.0
V+/V– = ±15V
VREF = 5V
0V TO 5V RANGE
CODE = 0
1s/DIV
2704 G16
0.5
0
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
LOGIC VOLTAGE (V)
2704 G17
U
U
U
PI FU CTIO S
V– (Pins 1, 8, 15, 22, 31, 36): Analog Negative Supply,
Typically –15V. –4.5V to –16.5V Range.
LDAC (Pin 9): Asynchronous DAC Load Input. When
LDAC is a logic low, all DACs are updated.
REFG1 (Pin 2): Reference 1 Ground. High impedance
input, does not carry supply currents. Tie to clean analog
ground.
CS/LD (Pin 10): Synchronous Chip Select and Load Pin.
AGNDA (Pin 3): DAC A Signal Ground. High impedance
input, does not carry supply currents. Tie to clean analog
ground.
SRO (Pin 12): Serial Readback Data Output. Data is clocked
out on the falling edge of SCK. Readback data begins clocking out after the last address bit A0 is clocked in.
VOSA (Pin 4): Offset Adjust for DAC A. Nominal input
range is ±5V. VOS(DAC A) = –0.01• V(VOSA) [0V to 5V,
±2.5V modes]. See Operation section.
SCK (Pin 13): Serial Clock.
C1A (Pin 5): Feedback Capacitor Connection for DAC A
Output. This pin provides direct access to the negative
input of the channel A output amplifier.
OUTA (Pin 6): DAC A Voltage Output Pin. For best load
regulation, this open-loop amplifier output is connected to
RFBA as close to the load as possible.
RFBA (Pin 7): DAC A Output Feedback Resistor Pin.
SDI (Pin 11): Serial Data Input. Data is clocked in on the
rising edge of the serial clock when CS/LD is low.
CLR (Pin 14): Asynchronous Clear Pin. When this pin is
low, all code and span B2 registers are cleared to zero. All
DAC outputs are cleared to zero volts.
RFBD (Pin 16): DAC D Voltage Output Feedback Resistor
Pin.
OUTD (Pin 17): DAC D Voltage Output Pin. For best load
regulation, this open-loop amplifier output is connected to
RFBD as close to the load as possible.
2704f
8
LTC2704
U
U
U
PI FU CTIO S
C1D (Pin 18): Feedback Capacitor Connection for DAC D
Output. This pin provides direct access to the negative
input of the channel D output amplifier.
RFBC (Pin 30): DAC C Output Feedback Resistor Pin.
AGND (Pin 32): Analog Ground Pin. Tie to clean analog
ground.
VOSD (Pin 19): Offset Adjust for DAC D. Nominal input
range is ±5V. VOS(DAC D) = –0.01• V(VOSD) [0V to 5V,
±2.5V modes]. See Operation section.
GND (Pin 33): Ground Pin. Tie to clean analog ground.
AGNDD (Pin 20): DAC D Signal Ground. High impedance
input, does not carry supply currents. Tie to clean analog
ground.
RFLAG (Pin 35): Reset Flag Pin. An active low output is
asserted when there is a power on reset or a clear event.
Returns high when an update command is executed.
REFG2 (Pin 21): Reference 2 Ground. High impedance
input, does not carry supply currents. Tie to clean analog
ground.
RFBB (Pin 37): DAC B Output Feedback Resistor Pin.
REFM2 (Pin 23): Reference 2 Inverting Amp Output. The
gain from REF2 to REFM2 is –1. Can swing to within 0.5V
of the analog supplies V+/V–.
VDD (Pin 34): Logic Supply. 2.7V to 5.5V Range.
OUTB (Pin 38): DAC B Voltage Output Pin. For best load
regulation, this open-loop amplifier output is connected to
RFBB as close to the load as possible.
REF2 (Pin 24): DAC C and DAC D Reference Input.
C1B (Pin 39): Feedback Capacitor Connection for DAC B
Output. This pin provides direct access to the negative
input of the channel B output amplifier.
V+2 (Pin 25): Analog Positive Supply for DACs C and D.
Typically 15V. 4.5V to 16.5V Range. Can be different from
V +1.
VOSB (Pin 40): Offset Adjust for DAC B. Nominal input
range is ±5V. VOS(DAC B) = –0.01 • V(VOSB) [0V to 5V,
±2.5V modes]. See Operation section.
AGNDC (Pin 26): DAC C Signal Ground. High impedance
input, does not carry supply currents. Tie to clean analog
ground.
AGNDB (Pin 41): DAC B Signal Ground. High impedance
input, does not carry supply currents. Tie to clean analog
ground.
VOSC (Pin 27): Offset Adjust for DAC C. Nominal input
range is ±5V. VOS(DAC C) = –0.01• V(VOSC) [0V to 5V,
±2.5V modes]. See Operation section.
V+1 (Pin 42): Analog Positive Supply for DACs A DND B.
Typically 15V. 4.5V to 16.5V Range. Can be different from
V +2.
C1C (Pin 28): Feedback Capacitor Connection for DAC C
Output. This pin provides direct access to the negative
input of the channel C output amplifier.
REF1 (Pin 43): DAC A and DAC B Reference Input.
OUTC (Pin 29): DAC C Voltage Output Pin. For best load
regulation, this open-loop amplifier output is connected to
RFBC as close to the load as possible.
REFM1 (Pin 44): Reference 1 Inverting Amp Output. The
gain from REF1 to REFM1 is –1. Can swing to within 0.5V
of the analog supplies V+/V–.
2704f
9
LTC2704
W
BLOCK DIAGRA
42
V–
1,8,15,22,31,36
V+1
43
REF1
32
25
AGND
V+2
REF2
27
40
38
41
C1C
RFBB
RFBC
OUTB
AGNDB
OUTC
DAC C
DAC B
+
–
+
–
+
AGNDC
7
6
3
44
2
29
26
19
C1A
C1D
RFBA
RFBD
OUTA
AGNDA
30
VOSD
VOSA
4
5
28
–
+
37
C1B
–
39
24
VOSC
VOSB
OUTD
DAC D
DAC A
+
–
+
–
AGNDD
REFM1
REFM2
REFG1
REFG2
COMMAND
DECODE
INPUT
SHIFT REGS
CS/LD SCK
SDI
10
13
11
DAC
BUFFERS
SRO
READBACK
SHIFT REGS
CLR
LDAC
14
9
RFLAG
35
VDD
GND
33
34
18
16
17
20
23
21
12
POR
2704 BD
WU
W
TI I G DIAGRA
t1
t2
t3
1
SCK
2
t6
t4
31
32
t8
SDI
LSB
t5
t7
CS/LD
t11
LDAC
t9
SRO
Hi-Z
LSB
2704 TD
2704f
10
LTC2704
U
OPERATIO
SERIAL INTERFACE
When the CS/LD pin is taken low, the data on the SDI pin
is loaded into the shift register on the rising edge of the
clock signal (SCK pin). The minimum (24-bit wide) loading sequence required for the LTC2704 is a 4-bit command word (C3 C2 C1 C0), followed by a 4-bit address
word (A3 A2 A1 A0) and 16 data (span or code) bits, MSB
first. Figure 1 shows the SDI input word syntax to use
when writing a code or span. If a 32-bit input sequence is
needed, the first eight bits must be zeros, followed by the
same sequence as for a 24-bit wide input. Figure 2 shows
the input and readback sequences for both 24-bit and
32-bit operations.
When CS/LD is low, the Serial Readback Output (SRO) pin
is an active output. The readback data begins after the
command (C3-C0) and address (A3-A0) words have been
shifted into SDI. For a 24-bit load sequence, the 16
readback bits are shifted out on the falling edges of clocks
8-23, suitable for shifting into a microprocessor on the
rising edges of clocks 9-24. For a 32-bit load sequence,
add 8 to these clock cycle counts; see Figure 2b.
When CS/LD is high, the SRO pin presents a high impedance (three-state) output. At the beginning of a load
sequence, when CS/LD is taken low, SRO outputs a logic
low until the readback data begins.
When the asynchronous load pin, LDAC, is taken low, all
DACs are updated with code and span data (data in B1
buffers is copied into B2 buffers). CS/LD must be high
during this operation. The use of LDAC is functionally
identical to the “Update B1→B2” commands.
The codes for the command word (C3-C0) are defined in
Table 1; Table 2 defines the codes for the address word
(A3-A0).
READBACK
Each DAC has two pairs of double-buffered digital registers, one pair for DAC code and the other for the output
span (four buffers per DAC). Each double-buffered pair
comprises two registers called buffer 1 (B1) and buffer 2
(B2).
B1 is the holding buffer. When data is shifted into B1 via
a write operation, DAC outputs are not affected. The
contents of B2 can only be changed by copying the
contents of B1 into B2 via an update operation (B1 and B2
can be changed together, see commands 0110-1001 in
Table 1). The contents of B2 (DAC code or DAC span)
directly control the DAC output voltage or the DAC output
range.
Additionally each DAC has one readback register associated with it. When a readback command is issued to a DAC,
the contents of one of its four buffers is copied into its
readback register and serially shifted out onto the SRO pin.
Figure 2 shows the loading and readback sequences. In
the 16-bit data field (D15-D0 for the LTC2704-16, see
Figure 2a) of any write or update command, the readback
pin (SRO) shifts out the contents of the buffer which was
specified in the preceding command. This “rolling
readback” mode of operation can be used to reduce the
number of operations, since any command can be verified
during succeeding commands with no additional overhead. Table 1 shows the location (readback pointer) of the
data which will be output from SRO during the next
instruction.
For readback commands, the data is shifted out during the
readback instruction itself (on the 16 falling SCK edges
immediately after the last address bit is shifted in on SDI).
When programming the span of a DAC, the span bits are
the last four bits shifted in; and when checking the span of
a DAC using SRO, the span bits are likewise the last four
bits shifted out. Table 3 shows the span codes.
When span information is read back on SRO, the sleep
status of the addressed DAC is also output. The sleep
status bit, SLP, occurs sequentially just before the four
span bits. The sequence is shown in Figures 2a and 2b. See
Table 4 for SLP codes. Note that SLP is an output bit only;
sleep is programmed by using command code 1110 along
with the desired address. Any update command, including
the use of LDAC, wakes the addressed DAC(s).
2704f
11
LTC2704
U
OPERATIO
OUTPUT RANGES
The LTC2704 is a quad DAC with software-programmable
output ranges. SoftSpan provides two unipolar output
ranges (0V to 5V and 0V to 10V), and four bipolar ranges
(±2.5V, ±5V, ±10V and – 2.5V to 7.5V). These ranges are
obtained when an external precision 5V reference and
analog supplies of ±12V to ±15V are used. When a
reference voltage of 2V and analog supplies of ±5V are
used, the SoftSpan ranges become: 0V to 2V, 0V to 4V,
±1V, ±2V, ±4V and –1V to 3V. The output ranges are
linearly scaled for references other than 2V and 5V (appropriate analog supplies should be used within the range
±5V to ±15V). Each of the four DACs can be programmed
to any one of the six output ranges. DAC outputs can swing
to ±10V on ±10.8V supplies (±12V supplies with ±10%
tolerance) while sourcing or sinking 5mA of load current.
Table 1. Command Codes
C3
CODE
C2 C1
C0
COMMAND
READBACK POINTER—
CURRENT INPUT WORD W0
READBACK POINTER—
NEXT INPUT WORD W+1
0
0
1
0
Write to B1 Span DAC n
Set by Previous Command
B1 Span DAC n
0
0
1
1
Write to B1 Code DAC n
Set by Previous Command
B1 Code DAC n
0
1
0
0
Update B1→B2 DAC n
Set by Previous Command
B2 Span DAC n
0
1
0
1
Update B1→B2 All DACs
Set by Previous Command
B2 Code DAC A
0
1
1
0
Write to B1 Span DAC n
Update B1→B2 DAC n
Set by Previous Command
B2 Span DAC n
0
1
1
1
Write to B1 Code DAC n
Update B1→B2 DAC n
Set by Previous Command
B2 Code DAC n
1
0
0
0
Write to B1 Span DAC n
Update B1→B2 All DACs
Set by Previous Command
B2 Span DAC n
1
0
0
1
Write to B1 Code DAC n
Update B1→B2 All DACs
Set by Previous Command
B2 Code DAC n
1
0
1
0
Read B1 Span DAC n
B1 Span DAC n
1
0
1
1
Read B1 Code DAC n
B1 Code DAC n
1
1
0
0
Read B2 Span DAC n
B2 Span DAC n
1
1
0
1
Read B2 Code DAC n
1
1
1
0
Sleep DAC n (Note 1)
Set by Previous Command
B2 Span DAC n
1
1
1
1
No Operation
Set by Previous Command
B2 Code DAC n
B2 Code DAC n
Codes not shown are reserved and should not be used.
Note 1: Normal operation can be resumed by issuing any update B1→B2 command to the sleeping DAC.
Table 3. Span Codes
Table 2. Address Codes
A3 A2 A1
A0
n
READBACK POINTER n
S3
S2
S1
S0
SPAN
0
0
0
0
DAC A
DAC A
0
0
0
0
Unipolar 0V to 5V
0
0
1
0
DAC B
DAC B
0
0
0
1
Unipolar 0V to 10V
0
1
0
0
DAC C
DAC C
0
0
1
0
Bipolar –5V to 5V
0
1
1
0
DAC D
DAC D
0
0
1
1
Bipolar –10V to 10V
1
1
1
1
All DACs
DAC A
0
1
0
0
Bipolar – 2.5V to 2.5V
0
1
0
1
Bipolar –2.5V to 7.5V
Codes not shown are reserved and should not be used.
Codes not shown are reserved and should not be used.
2704f
12
SDI
C3
C3
LTC2704-12
LTC2704-14
LTC2704-16
(WRITE SPAN)
C3
LTC2704-14
(WRITE CODE)
LTC2704-12
(WRITE CODE)
C3
LTC2704-16
(WRITE CODE)
C1
C1
C1
C1
CONTROL WORD
C2
CONTROL WORD
C2
CONTROL WORD
C2
CONTROL WORD
C2
C0
C0
C0
C0
A3
A3
A3
A3
A1
A1
A1
A1
ADDRESS WORD
A2
ADDRESS WORD
A2
ADDRESS WORD
A2
ADDRESS WORD
A2
A0
A0
A0
A0
0
D11
MSB
D13
MSB
D15
MSB
0
D9
D11
D13
0
D8
D10
D12
0
D7
D9
D11
D6
D8
D10
D5
0
12 ZEROS
0
D7
D6
0
D4
0
D3
D5
16-BIT CODE
D8
14-BIT CODE
D7
D9
12-BIT CODE
Figure 1. Input Words
0
D10
D12
D14
0
D2
D4
D6
0
D1
D3
D5
0
D0
LSB
D2
D4
S3
0
D1
D3
0
S1
SPAN
S2
0
D0
LSB
S0
0
2 ZEROS
0
D1
4 ZEROS
0
D0
LSB
D2
2704 F01
LTC2704
U
OPERATIO
2704f
13
14
0
0
0
3
0
0
0
0
0
8 ZEROS
0
4
C1
3
0
5
0
0
0
6
0
0
0
0
0
7
0
0
C0
4
0
0
0
8
0
0
A3
A2
6
A1
7
0
0
C3
C2
10
0
0
C1
11
0
0
A0
8
0
0
0
0
CONTROL WORD
9
0
0
ADDRESS WORD
5
0
0
C0
12
0
D15
D15
9
0
D13
D13
11
0
D12
D12
12
0
D11
D11
13
0
D10
D10
14
D8
16
0
D9
0
D8
A1
15
0
0
0
0
ADDRESS WORD
A2
14
0
0
A0
16
0
D15
D15
17
0
D14
D14
18
32-BIT DATA STREAM
D6
D15
SRO
t1
0
D11
D11
21
0
D6
D15
0
D12
D12
20
0
D7
t3
17
0
D10
t2
22
0
D5
D9
23
21
24
S3
D3
D3
D8
SLEEP
STATUS
SLP
D4
D4
20
D7
25
t8
0
t4
D9
D14
D14
0
D8
18
0
D7
23
S1
D1
D1
D6
26
SPAN
S2
D2
D2
22
0
D6
DAC CODE OR DAC SPAN
19
D5
D10
18
SDI
SCK
0
D13
D13
19
Figure 2b. 32-Bit Load Sequence
0
0
A3
13
D7
17
DAC CODE OR DAC SPAN
D9
15
Figure 2a. 24-Bit Load Sequence
0
D14
D14
10
0
D5
D5
27
SLP
D4
D4
28
29
S3
D3
D3
2704 F02a
SLEEP
STATUS
S0
D0
D0
24
31
S1
D1
D1
SPAN
S2
D2
D2
30
S0
D0
D0
32
2704 F02b
U
OPERATIO
READBACK SPAN
0
READBACK SPAN
Hi-Z
0
0
0
2
0
C2
READBACK CODE
0
Hi-Z
0
1
Hi-Z
READBACK CODE
Hi-Z
SRO
0
0
SRO
SDI
SCK
CS/LD
SRO
SRO
C3
SDI
2
CONTROL WORD
1
SCK
CS/LD
24-BIT DATA STREAM
LTC2704
2704f
LTC2704
U
OPERATIO
Examples
1. Using a 24-bit loading sequence, load DAC A with the
unipolar range of 0V to 10V, output at zero volts and all
other DACs with the bipolar range of ±10V, outputs at
zero volts. Note all DAC outputs should change at the
same time.
a) CS/LD↓
b) Clock SDI = 0010 1111 0000 0000 0000 0011
c) CS/LD↑
B1-Range of all DACs set to bipolar ±10V.
d) CS/LD↓
Clock SDI = 0010 0000 0000 0000 0000 0001
e) CS/LD↑
B1-Range of DAC A set to unipolar 0V to 10V.
f) CS/LD↓
Clock SDI = 0011 1111 1000 0000 0000 0000
g) CS/LD↑
B1-Code of all DACs set to midscale.
h) CS/LD↓
Clock SDI = 0011 0000 0000 0000 0000 0000
i) CS/LD↑
B1-Code of DAC A set to zero code.
j) CS/LD↓
Clock SDI = 0100 1111 XXXX XXXX XXXX XXXX
k) CS/LD↑
Update all DACs B1s into B2s for both Code and
Range.
l) Alternatively steps j and k could be replaced with
LDAC .
2. Using a 32-bit load sequence, load DAC C with bipolar
±2.5V and its output at zero volts. Use readback to
check B1 contents before updating the DAC output (i.e.,
before copying B1 contents into B2).
a) CS/LD↓ (Note that after power-on, the Code in B1 is
zero)
b) Clock SDI = 0000 0000 0011 0100 1000 0000 0000
0000
c) CS/LD↑
B1-Code of DAC C set to midscale setting.
d) CS/LD↓
Clock SDI = 0000 0000 0010 0100 0000 0000 0000
0100
e) Read Data out on SRO = 1000 0000 0000 0000
Verifies that B1-Code DAC C is at midscale setting.
f) CS/LD↑
B1-Range of DAC C set to Bipolar ±2.5V range.
g) CS/LD↓
Clock SDI = 0000 0000 1010 0100 xxxx xxxx xxxx
xxxx
Data Out on SRO = 0000 0000 0000 0100
Verifies that B1-Range of DAC C set to Bipolar ±2.5V
Range.
CS/LD↑
h) CS/LD↓
Clock SDI = 0000 0000 0100 0100 xxxx xxxx xxxx
xxxx
i) CS/LD↑
Update DAC C B1 into B2 for both Code and Range
j) Alternatively steps h and i could be replaced with
LDAC .
2704f
15
LTC2704
U
OPERATIO
System Offset Adjustment
Many systems require compensation for overall system
offset, which may be an order of magnitude or more
greater than the excellent offset of the LTC2704.
The LTC2704 has individual offset adjust pins for each of
the four DACs. VOSA, VOSB, VOSC and VOSD are referred
to their corresponding signal grounds, AGNDA, AGNDB,
AGNDC and AGNDD. For noise immunity and ease of
adjustment, the control voltage is attenuated to the DAC
output:
VOS = –0.01 • V(VOSx) [0V to 5V, ±2.5V spans]
VOS = –0.02 • V(VOSx) [0V to 10V, ±5V,
–2.5V to 7.5V spans]
VOS = –0.04 • V(VOSx) [±10V span]
The nominal input range of these pins is ±5V; other
reference voltages of up to ±15V may be used if needed.
The VOSx pins have an input impedance of 1MΩ. To
preserve the settling performance of the LTC2704, these
pins should be driven with a Thevenin-equivalent impedance of 10kΩ or less. If not used, they should be shorted
to their respective signal grounds, AGNDx.
POWER-ON RESET AND CLEAR
When power is first applied to the LTC2704, all DACs
power-up in 5V unipolar mode (S3 S2 S1 S0 = 0000). All
internal DAC registers are reset to 0 and the DAC outputs
are zero volts.
When the CLR pin is taken low, a system clear results. The
command and address shift registers, and the code and
configuration B2 buffers, are reset to 0; the DAC outputs
are all reset to zero volts. The B1 buffers are left intact, so
that any subsequent “Update B1→B2” command (including the use of LDAC) restores the addressed DACs to their
respective previous states.
If CLR is asserted during an operation, i.e., when CS/LD is
low, the operation is aborted. Integrity of the relevant input
(B1) buffers is not guaranteed under these conditions,
therefore the contents should be checked using readback
or replaced.
The RFLAG pin is used as a flag to notify the system of a
loss of data integrity. The RFLAG output is asserted low at
power-up, system clear, or if the logic supply VDD dips
below approximately 2V; and stays asserted until any valid
update command is executed.
SLEEP MODE
When a sleep command (C3 C2 C1 C0 = 1110) is issued,
the addressed DAC or DACs go into power-down mode.
DACs A and B share a reference inverting amplifier as do
DACs C and D. If either DAC A or DAC B (similarly for DACs
C and D) is powered down, its shared reference inverting
amplifier remains powered on. When both DAC A and
DAC B are powered down together, their shared reference
inverting amplifier is also powered down (similarly for
DACs C and D). To determine the sleep status of a
particular DAC, a direct read span command is performed
by addressing the DAC and reading its status on the
readback pin SRO. The fifth LSB is the sleep status bit (see
Figures 2a and 2b). Table 4 shows the sleep status bit’s
functionality.
Table 4. Readback Sleep Status Bit
SLP
STATUS
0
DAC n Awake
1
DAC n in Sleep Mode
2704f
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LTC2704
U
W
U U
APPLICATIO S I FOR ATIO
Overview
The LTC2704 is a highly integrated device, greatly simplifying design and layout as compared to a design using
multiple current output DACs and separate amplifiers. A
similar design using four separate current output DACs
would require six precision op amps, compensation capacitors, bypass capacitors for each amplifier, several
times as much PCB area and a more complicated serial
interface. Still, it is important to avoid some common
mistakes in order to achieve full performance. DC752A is
the evaluation board for the LTC2704. It is designed to
meet all data sheet specifications, and to allow the LTC2704
to be integrated into other prototype circuitry. All force/
sense lines are available to allow the addition of current
booster stages or other output circuits.
The DC752A design is presented as a tutorial on properly
applying the LTC2704. This board shows how to properly
return digital and analog ground currents, and how to
compensate for small differences in ground potential
between the two banks of two DACs. There are other ways
to ground the LTC2704, but the one requirement is that
analog and digital grounds be connected at the LTC2704
by a very low impedance path. It is NOT advisable to split
the ground plane and connect them with a jumper or
inductor. When in doubt, use a single solid ground plane
rather than separate planes.
The LTC2704 does allow the ground potential of the DACs
to vary by ±300mV with respect to analog ground, allowing compensation for ground return resistance.
Power Supply Grounding and Noise
LTC2704 V+ and V– pins are the supplies to all of the output
amplifiers, ground sense amplifiers and reference inversion amplifiers. These amplifiers have good power supply
rejection, but the V+ and V– supplies must be free from
wideband noise. The best scheme is to prefilter low noise
regulators such as the LT®1761 (positive) and LT1964
(negative). Refer to Linear Technology Application Note
101, Minimizing Switching Regulator Residue in Linear
Regulator Outputs.
The LTC2704 VDD pin is the supply for the digital logic and
analog DAC switches and is very sensitive to noise. It must
be treated as an analog supply. The evaluation board uses
an LT1790 precision reference as the VDD supply to minimize noise.
The GND pin is the return for digital currents and the AGND
pin is a bias point for internal analog circuitry. Both of these
pins must be tied to the same point on a quiet ground plane.
Each DAC has a separate ground sense pin that can be
used to compensate for small differences in ground potential within a system. Since DACs A and B are associated
with REF1 and DACs C and D are associated with REF2, the
grounds must be grouped together as follows:
AGNDA, AGNDB and REFG1 tied together (“GND1” on
DC752A)
AGNDC, AGNDD and REFG2 tied together (“GND2” on
DC752A)
This scheme allows compensation for ground return IR
drops, as long as the resistance is shared by both DACs in
a group. This implies that the ground return for DACs A
and B must be as close as possible, and GND1 must be
connected to this point through a low current, low resistance trace. (Similar for DACs C and D.)
Figure 3 shows the top layer of the evaluation board. The
GND1 trace connects REFG1, AGNDA, AGNDB and the
ground pin of the LT1236 precision reference (U4.) This
point is the ground reference for DACs A and B. The GND2
trace connects REFG2, AGNDC, AGNDD and the ground
pin of the other LT1236 precision reference (U5). This
point is the ground reference for DACs C and D.
Voltage Reference
A high quality, low noise reference such as the LT1236 or
LT1027 must be used to achieve full performance. The
ground terminal of this reference must be connected
directly to the common ground point. If GND1 and GND2
are separate, then two references must be used.
2704f
17
LTC2704
U
W
U U
APPLICATIO S I FOR ATIO
Voltage Output/Feedback and Compensation
The LTC2704 provides separate voltage output and feedback pins for each DAC. This allows compensation for
resistance between the output and load, or a current
boosting stage such as an LT1970 may be inserted without affecting accuracy. When OUTx is connected directly
to RFBx and no additional capacitance is present, the
internal frequency compensation is sufficient for stability
and is optimized for fast settling time. If a low bandwidth
booster stage is used, then a compensation capacitor
from OUTx to C1x may be required. Similarly, extra compensation may be required to drive a heavy capacitive load.
POWER AND LOAD RETURN
CURRENTS FLOW IN THIS REGION
EXPOSED GROUND PLANE AROUND EDGE
ALLOWS GROUNDING TO PROTOTYPE CIRCUITS
VOUTA AND VOUTB LOAD
RETURN CURRENTS FLOW
IN THIS REGION WHEN
JP8 IS SET TO “TIE”
VOUTC AND VOUTD LOAD
RETURN CURRENTS FLOW
IN THIS REGION WHEN
JP9 IS SET TO “TIE”
2704 F03
GND1 TRACE,
SEPARATED FROM
AGND UNDER LTC2704
GND2 TRACE,
SEPARATED FROM
AGND UNDER LTC2704
2704 F05
DIGITAL RETURN CURRENTS
FLOW IN THIS REGION
Figure 3. DC752 Top Layer
Figure 5. DC752A Load Return, Power Return and Digital Return
2704 F04
CUTOUT PREVENTS DIGITAL RETURN CURRENTS
FROM COUPLING INTO ANALOG GROUND PLANE. NOTE
THAT THERE IS A PLANE IN THIS REGION ON LAYER 3
Figure 4. DC752 Analog Ground Layer. No Currents are Returned
to this Plane, so it May be Used as a Reference Point for Precise
Voltage Measurements
2704 F06
SMALL GROUND POUR ALLOWS
LOW IMPEDANCE BYPASSING
OF V+ AND V –
Figure 6. DC752A Routing, Bypass
2704f
18
LTC2704
U
PACKAGE DESCRIPTIO
GW Package
44-Lead Plastic SSOP (Wide .300 Inch)
(Reference LTC DWG # 05-08-1642)
44
23
1.40 ±0.127
17.73 – 17.93*
(.698 – .706)
44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23
10.804 MIN
7.75 – 8.258
10.11 – 10.55
(.398 – .415)
1
0.520 ±0.0635
22
0.800 BSC
RECOMMENDED SOLDER PAD LAYOUT
7.417 – 7.595**
(.292 – .299)
0.254 – 0.406 × 45°
(.010 – .016)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
0.355
REF
2.286 – 2.388
(.090 – .094)
2.44 – 2.64
(.096 – .104)
0° – 8° TYP
0.231 – 0.3175
(.0091 – .0125)
0.40 – 1.27
(.015 – .050)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
MILLIMETERS
2. DIMENSIONS ARE IN
(INCHES)
0.800
(.0315)
BSC
0.28 – 0.51
(.011 – .02)
TYP
0.1 – 0.3
(.004 – .0118)
G44 SSOP 0204
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.152mm (0.006") PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.254mm (0.010") PER SIDE
2704f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
19
LTC2704
U
TYPICAL APPLICATIO
Evaluation Board Schematic. Force/Sense Lines Allow for Remote Sensing and Optimal Grounding
VDD
OUTA
BAV99LT1 1
10k
9
LDAC
CS/LD
VDD
SPI
INTERFACE
VDD
10k
1k
SDI
SRO
SCK
10
11
12
13
14
CLR
35
RFLAG
LDAC
VOSA
CS/LD
C1A
SDI
RFBA
SRO
OUTA
SCK
AGNDA
RFLAG
VOSB
C1B
REMOTE
20k
VOSx
REFMx
5V
2
GND1
2 REF1
3
5VREF1
43
REFM1
44
REFG1
RFBB
REF1
OUTB
REFM1
AGNDB
3
5
REMOTE
7
OUTSA
6
OUTA
3
GND1
40
TIE
2
VOSA
CLR
REFx
1
4
OUTB
BAV99LT1 1
2
VOSB
3
39
TIE
REMOTE
37
OUTSB
38
OUTB
41
GND1
LTC2704
OFFSET ADJUSTMENT
FOR VOSA, VOSB,
VOSC, VOSC
REMOTE
5V
21
1
GND2
2 REF2
3
5VREF2
24
REFM2
23
REFG2
VOSC
REF2
C1C
REFM2
RFBC
BAT54S VDD
3
OUTC
AGNDC
REF
REGULATOR
1
1
2
14
5V
33
0.1µF
32
VS
15V
7V
1
1
VDD
VOSD
GND
C1D
2
GND
0.1µF
OUTD
AGNDD
V+1 V+2
GND
1
2
25
4.7µF
15V
–15V
4.7µF
25V
4.7µF
25V
5VREF1
VS
0.1µF
2 LT1236ACS8-5 6
VOUT
VIN
5
TRIM
GND
0.1µF
42
OUTSC
29
OUTC
26
OUTC
1
GND2
19
2
VOSD
18
4
4
GND1
GND2
TIE
REMOTE
OUTSD
17
OUTD
20
OUTD
1
GND2
V–
2
1,8,15,22,31,36
1µF
BAV99LT1 3
TIE
REMOTE
1µF
GND1
1
5VREF2
2 LT1236ACS8-5 6
VOUT
VIN
5
TRIM
GND
BAV99LT1 3
16
–15V
1µF
VS
4.7µF
30
15V
1µF
15V
RFBD
AGND
4 LT1790ACS6-5 6
VIN
VOUT
2
VOSC
28
VDD
2 VDD
3
27
3
1
2
2
3
GND2
1
TIE
3
REMOTE
1
2
2
3
TIE
REMOTE
4.7µF
GND1
–15V
BAT54S
GND2
BAT54S
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DESCRIPTION
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®
2704f
20
Linear Technology Corporation
LT/LWI 0806 • PRINTED IN THE USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
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© LINEAR TECHNOLOGY CORPORATION 2006