TI SN74LV4053APWR

SCLS430K − MAY 1999 − REVISED APRIL 2005
2Y1
2Y0
3Y1
3-COM
3Y0
INH
GND
GND
15
3
14
4
13
5
12
6
11
7
10
8
9
2Y0
3Y1
3-COM
3Y0
INH
GND
VCC
2-COM
1-COM
1Y1
1Y0
A
B
C
1
16
2
15
3
14
4
13
5
12
6
11
10
7
8
Applications include signal gating, chopping,
modulation or demodulation (modem), and signal
multiplexing
for
analog-to-digital
and
digital-to-analog conversion systems.
2-COM
1-COM
1Y1
1Y0
A
B
9
GND
The ’LV4053A devices handle both analog and
digital signals. Each channel permits signals with
amplitudes up to 5.5 V (peak) to be transmitted in
either direction.
16
2
SN74LV4053A . . . RGY PACKAGE
(TOP VIEW)
description/ordering information
These
triple
2-channel
CMOS
analog
multiplexers/demultiplexers are designed for 2-V
to 5.5-V VCC operation.
1
VCC
D
All Ports
High On-Off Output-Voltage Ratio
Low Crosstalk Between Switches
Individual Switch Controls
Extremely Low Input Current
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
C
D
D
D
D
D
SN54LV4053A . . . J OR W PACKAGE
SN74LV4053A . . . D, DB, DGV, N, NS, OR PW PACKAGE
(TOP VIEW)
2Y1
D 2-V to 5.5-V VCC Operation
D Support Mixed-Mode Voltage Operation on
ORDERING INFORMATION
PACKAGE†
TA
Tube of 25
SN74LV4053AN
SN74LV4053AN
QFN − RGY
Reel of 1000
SN74LV4053ARGYR
LW053A
Tube of 40
SN74LV4053AD
Reel of 2500
SN74LV4053ADR
SOP − NS
Reel of 2000
SN74LV4053ANSR
74LV4053A
SSOP − DB
Reel of 2000
SN74LV4053ADBR
LW053A
Tube of 90
SN74LV4053APW
Reel of 2000
SN74LV4053APWR
Reel of 250
SN74LV4053APWT
TVSOP − DGV
Reel of 2000
SN74LV4053ADGVR
LW053A
CDIP − J
Tube of 25
SNJ54LV4053AJ
SNJ54LV4053AJ
CFP − W
Tube of 150
SNJ54LV4053AW
TSSOP − PW
−55°C to 125°C
TOP-SIDE
MARKING
PDIP − N
SOIC − D
−40°C to 85°C
ORDERABLE
PART NUMBER
LV4053A
LW053A
SNJ54LV4053AW
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2005, Texas Instruments Incorporated
! "#$%&'( $#()(! (*#+&)#( $%++'( )! #* ,%-.$)#( ")'/ +#"%$! $#(*#+& #
!,'$*$)#(! ,'+ ' '+&! #* '0)! (!+%&'(! !)(")+" 1)++)(2/
+#"%$#( ,+#$'!!(3 "#'! (# ('$'!!)+.2 ($.%"' '!(3 #* )..
,)+)&''+!/
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCLS430K − MAY 1999 − REVISED APRIL 2005
FUNCTION TABLE
INPUTS
B
A
ON CHANNELS
INH
C
L
L
L
L
1Y0, 2Y0, 3Y0
L
L
L
H
1Y1, 2Y0, 3Y0
L
L
H
L
1Y0, 2Y1, 3Y0
L
L
H
H
1Y1, 2Y1, 3Y0
L
H
L
L
1Y0, 2Y0, 3Y1
L
H
L
H
1Y1, 2Y0, 3Y1
L
H
H
L
1Y0, 2Y1, 3Y1
L
H
H
H
1Y1, 2Y1, 3Y1
H
X
X
X
None
logic diagram (positive logic)
15
14
A
12
2
2
1Y1
2Y0
2Y1
9
5
3
INH
1Y0
10
1
C
1-COM
11
13
B
2-COM
6
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3Y0
3Y1
3-COM
SCLS430K − MAY 1999 − REVISED APRIL 2005
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Switch I/O voltage range, VIO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
I/O diode current, IIOK (VIO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Switch through current, IT (VIO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
(see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
(see Note 3): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W
(see Note 3): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
(see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
(see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This value is limited to 5.5 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
4. The package thermal impedance is calculated in accordance with JESD 51-5.
recommended operating conditions (see Note 5)
SN54LV4053A
VCC
VIH
Supply voltage
High-level input voltage, control inputs
VIL
Low-level input voltage, control inputs
VI
VIO
Control input voltage
∆t/∆v
MIN
2‡
VCC = 2 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
Input transition rise or fall rate
5.5
MIN
2‡
1.5
1.5
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC = 2 V
VCC = 2.3 V to 2.7 V
0.5
0
0
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
VCC × 0.3
5.5
VCC
200
MAX
5.5
UNIT
V
V
0.5
VCC × 0.3
VCC × 0.3
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
Input/output voltage
MAX
SN74LV4053A
VCC × 0.3
VCC × 0.3
0
0
VCC × 0.3
5.5
V
V
VCC
200
V
100
100
ns/V
20
20
TA
Operating free-air temperature
−55
125
−40
85
°C
‡ With supply voltages at or near 2 V, the analog switch on-state resistance becomes very nonlinear. It is recommended that only digital signals
be transmitted at these low supply voltages.
NOTE 5: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
(*#+&)#( $#($'+(! ,+#"%$! ( ' *#+&)4' #+
"'!3( ,)!' #* "'4'.#,&'(/ )+)$'+!$ ")) )(" #'+
!,'$*$)#(! )+' "'!3( 3#).!/ '0)! (!+%&'(! +'!'+4'! ' +3 #
$)(3' #+ "!$#((%' '!' ,+#"%$! 1#% (#$'/
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCLS430K − MAY 1999 − REVISED APRIL 2005
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
TEST
CONDITIONS
PARAMETER
VCC
MIN
TA = 25°C
TYP
MAX
SN54LV4053A
MIN
MAX
SN74LV4053A
MIN
MAX
IT = 2 mA,
VI = VCC or GND,
VINH = VIL
(see Figure 1)
2.3 V
41
180
225
225
3V
30
150
190
190
4.5 V
23
75
100
100
IT = 2 mA,
VI = VCC to GND,
VINH = VIL
2.3 V
139
500
600
600
3V
63
180
225
225
4.5 V
35
100
125
125
Difference in
on-state resistance
between switches
IT = 2 mA,
VI = VCC to GND,
VINH = VIL
2.3 V
Control input current
VI = 5.5 V or GND
IS(off)
IS(on)
On-state
switch resistance
ron
ron(p)
∆ron
II
ICC
CIC
Peak on-state resistance
UNIT
Ω
Ω
2
30
40
40
3V
1.6
20
30
30
4.5 V
1.3
15
20
20
0 to
5.5 V
±0.1
±1
±1
µA
Off-state
switch leakage current
VI = VCC and
VO = GND, or
VI = GND and
VO = VCC,
VINH = VIH
(see Figure 2)
5.5 V
±0.1
±1
±1
µA
On-state
switch leakage current
VI = VCC or GND,
VINH = VIH
(see Figure 3)
5.5 V
±0.1
±1
±1
µA
Supply current
VI = VCC or GND
5.5 V
20
20
µA
Control input capacitance
Ω
2
pF
CIS
Common
terminal capacitance
8.2
pF
COS
Switch
terminal capacitance
5.6
pF
CF
Feedthrough capacitance
0.5
pF
switching characteristics over recommended operating free-air temperature range,
VCC = 2.5 V ± 0.2 V (unless otherwise noted)
PARAMETER
TA = 25°C
TYP
MAX
SN74LV4053A
TO
(OUTPUT)
TEST
CONDITIONS
COM or Yn
Yn or COM
CL = 15 pF
(see Figure 4)
2.5
10
16
16
ns
MIN
MIN
MAX
MIN
MAX
UNIT
tPLH
tPHL
Propagation
delay time
tPZH
tPZL
Enable
delay time
INH
COM or Yn
CL = 15 pF
(see Figure 5)
7.6
18
23
23
ns
tPHZ
tPLZ
Disable
delay time
INH
COM or Yn
CL = 15 pF
(see Figure 5)
7.7
18
23
23
ns
tPLH
tPHL
Propagation
delay time
COM or Yn
Yn or COM
CL = 50 pF
(see Figure 4)
4.4
12
18
18
ns
tPZH
tPZL
Enable
delay time
INH
COM or Yn
CL = 50 pF
(see Figure 5)
8.8
28
35
35
ns
tPHZ
tPLZ
Disable
delay time
INH
COM or Yn
CL = 50 pF
(see Figure 5)
11.7
28
35
35
ns
(*#+&)#( $#($'+(! ,+#"%$! ( ' *#+&)4' #+
"'!3( ,)!' #* "'4'.#,&'(/ )+)$'+!$ ")) )(" #'+
!,'$*$)#(! )+' "'!3( 3#).!/ '0)! (!+%&'(! +'!'+4'! ' +3 #
$)(3' #+ "!$#((%' '!' ,+#"%$! 1#% (#$'/
4
SN54LV4053A
FROM
(INPUT)
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCLS430K − MAY 1999 − REVISED APRIL 2005
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V ± 0.3 V (unless otherwise noted)
PARAMETER
TA = 25°C
TYP
MAX
SN54LV4053A
SN74LV4053A
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
COM or Yn
Yn or COM
CL = 15 pF
(see Figure 4)
1.6
6
10
10
ns
MIN
MIN
MAX
MIN
MAX
UNIT
tPLH
tPHL
Propagation
delay time
tPZH
tPZL
Enable
delay time
INH
COM or Yn
CL = 15 pF
(see Figure 5)
5.3
12
15
15
ns
tPHZ
tPLZ
Disable
delay time
INH
COM or Yn
CL = 15 pF
(see Figure 5)
6.1
12
15
15
ns
tPLH
tPHL
Propagation
delay time
COM or Yn
Yn or COM
CL = 50 pF
(see Figure 4)
2.9
9
12
12
ns
tPZH
tPZL
Enable
delay time
INH
COM or Yn
CL = 50 pF
(see Figure 5)
6.1
20
25
25
ns
tPHZ
tPLZ
Disable
delay time
INH
COM or Yn
CL = 50 pF
(see Figure 5)
8.9
20
25
25
ns
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
MIN
TA = 25°C
TYP
MAX
SN54LV4053A
MIN
MAX
SN74LV4053A
MIN
MAX
UNIT
tPLH
tPHL
Propagation
delay time
COM or Yn
Yn or COM
CL = 15 pF
(see Figure 4)
0.9
4
7
7
ns
tPZH
tPZL
Enable delay
time
INH
COM or Yn
CL = 15 pF
(see Figure 5)
3.8
8
10
10
ns
tPHZ
tPLZ
Disable
delay time
INH
COM or Yn
CL = 15 pF
(see Figure 5)
4.6
8
10
10
ns
tPLH
tPHL
Propagation
delay time
COM or Yn
Yn or COM
CL = 50 pF
(see Figure 4)
1.8
6
8
8
ns
tPZH
tPZL
Enable delay
time
INH
COM or Yn
CL = 50 pF
(see Figure 5)
4.3
14
18
18
ns
tPHZ
tPLZ
Disable
delay time
INH
COM or Yn
CL = 50 pF
(see Figure 5)
6.3
14
18
18
ns
(*#+&)#( $#($'+(! ,+#"%$! ( ' *#+&)4' #+
"'!3( ,)!' #* "'4'.#,&'(/ )+)$'+!$ ")) )(" #'+
!,'$*$)#(! )+' "'!3( 3#).!/ '0)! (!+%&'(! +'!'+4'! ' +3 #
$)(3' #+ "!$#((%' '!' ,+#"%$! 1#% (#$'/
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SCLS430K − MAY 1999 − REVISED APRIL 2005
analog switch characteristics
PARAMETER
Frequency response
(switch on)
FROM
(INPUT)
COM or Yn
Crosstalk
(between any switches)
Feedthrough attenuation
(switch off)
TEST CONDITIONS
Yn or COM
COM or Yn
Crosstalk
(control input to signal output)
Sine-wave distortion
TO
(OUTPUT)
Yn or COM
INH
COM or Yn
COM or Yn
Yn or COM
COM or Yn
Yn or COM
VCC
TA = 25°C
TYP
CL = 50 pF,
RL = 600 Ω,,
fin = 1 MHz (sine wave)
(see Note 6 and Figure 6)
2.3 V
30
3V
35
4.5 V
50
CL = 50 pF,
RL = 600 Ω,,
fin = 1 MHz (sine wave)
(see Note 7 and Figure 7)
2.3 V
−45
3V
−45
4.5 V
−45
CL = 50 pF,
RL = 600 Ω,,
fin = 1 MHz (square wave)
(see Figure 8)
2.3 V
20
3V
35
4.5 V
65
CL = 50 pF,
RL = 600 Ω,,
fin = 1 MHz
(see Note 7 and Figure 9)
2.3 V
−45
3V
−45
4.5 V
−45
CL = 50 pF,
RL = 10 kΩ,
fin = 1 kHz
(sine wave)
(see Figure 10)
2.3 V
0.1
3V
0.1
4.5 V
0.1
VI = 2 Vp-p
VI = 2.5 Vp-p
VI = 4 Vp-p
UNIT
MHz
dB
mV
dB
%
NOTES: 6. Adjust fin voltage to obtain 0-dBm output. Increase fin frequency until dB meter reads −3 dB.
7. Adjust fin voltage to obtain 0-dBm input.
operating characteristics, VCC = 3.3 V, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
CL = 50 pF,
f = 10 MHz
PARAMETER MEASUREMENT INFORMATION
VCC
VINH = VIL
VCC
VI = VCC or GND
VO
(ON)
GND
r on +
2 mA
V
VI − VO
Figure 1. On-State Resistance Test Circuit
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
VI – VO
2
10 –3
W
TYP
UNIT
5.3
pF
SCLS430K − MAY 1999 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
VCC
VINH = VIH
VCC
A
VI
VO
(OFF)
GND
Condition 1: VI = 0, VO = VCC
Condition 2: VI = VCC, VO = 0
Figure 2. Off-State Switch Leakage-Current Test Circuit
VCC
VINH = VIL
VCC
A
VI
Open
(ON)
GND
VI = VCC or GND
Figure 3. On-State Switch Leakage-Current Test Circuit
VCC
VINH = VIL
VCC
Input
Output
(ON)
50 Ω
GND
CL
Figure 4. Propagation Delay Time, Signal Input to Signal Output
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
SCLS430K − MAY 1999 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
VCC
50 Ω
VINH
VCC
VI
S1
VO
GND
1 kΩ
S2
TEST
S1
S2
tPLZ/tPZL
tPHZ/tPZH
GND
VCC
VCC
GND
CL
TEST CIRCUIT
VCC
VCC
VINH
50%
50%
0V
0V
tPZL
tPZH
≈VCC
VOH
VO
50%
50%
VOL
≈0 V
(tPZL, tPZH)
VCC
VCC
VINH
50%
50%
0V
0V
tPLZ
tPHZ
≈VCC
VOH
VO
VOL + 0.3 V
VOL
(tPLZ, tPHZ)
VOH − 0.3 V
≈0 V
VOLTAGE WAVEFORMS
Figure 5. Switching Time (tPZL, tPLZ, tPZH, tPHZ), Control to Signal Output
VCC
VINH = GND
VCC
(ON)
fin
50 Ω
0.1 µF
GND
VO
RL
CL
VCC/2
NOTE A: fin is a sine wave.
Figure 6. Frequency Response (Switch On)
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCLS430K − MAY 1999 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
VCC
VINH = GND
VCC
(ON)
fin
0.1 µF 600 Ω
50 Ω
VO1
GND
RL
CL
VCC/2
VCC
VINH = VCC
VCC
(OFF)
fin
VO2
GND
600 Ω
RL
CL
VCC/2
Figure 7. Crosstalk Between Any Two Switches
50 Ω
VCC
VINH
VCC
VO
GND
600 Ω
RL
VCC/2
CL
VCC/2
Figure 8. Crosstalk Between Control Input and Switch Output
VCC
VINH = VCC
0.1 µF
VCC
(OFF)
fin
50 Ω
600 Ω
GND
VCC/2
VO
RL
CL
VCC/2
Figure 9. Feedthrough Attenuation (Switch Off)
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
SCLS430K − MAY 1999 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
VCC
VINH = GND
10 µF
fin
600 Ω
10 µF
VCC
(ON)
VO
GND
RL
VCC/2
Figure 10. Sine-Wave Distortion
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
CL
PACKAGE OPTION ADDENDUM
www.ti.com
9-Aug-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV4053AD
ACTIVE
SOIC
D
16
SN74LV4053ADBR
ACTIVE
SSOP
DB
SN74LV4053ADBRE4
ACTIVE
SSOP
SN74LV4053ADE4
ACTIVE
SN74LV4053ADG4
40
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4053ADGVR
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4053ADGVRE4
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4053ADR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4053ADRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4053ADRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4053AN
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LV4053ANE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LV4053ANSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4053ANSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4053APW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4053APWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4053APWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4053APWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4053APWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4053APWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4053APWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4053APWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4053APWTG4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4053ARGYR
ACTIVE
QFN
RGY
16
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74LV4053ARGYRG4
ACTIVE
QFN
RGY
16
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Aug-2005
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2005, Texas Instruments Incorporated