3.3V 10Gbps DIFFERENTIAL CML LINE DRIVER/RECEIVER WITH INTERNAL TERMINATION FEATURES ■ ■ ■ ■ ■ ■ ■ ■ SY58016L FINAL DESCRIPTION Accepts up to 10.7Gbps data < 45ps edge rate Gain ≥ 4V/V CML/PECL differential inputs CML outputs Internal 50Ω input termination Internal 50Ω output load resistors Available in die or 16-pin (3mm × 3mm) MLF package The SY58016L is a high-speed, current mode logic (CML) differential receiver. It is ideal for interfacing with high frequency sources. It can be used as Line Receiver, Line Driver and Limiting Amplifier. The device can be operated from DC to 10Gbps. The input incorporates internal temination resistors, and directly interfaces to a CML logic signal. The output is CML compatible, and includes 50Ω load resistors. APPLICATIONS ■ ■ ■ ■ Backplane buffering OC-3/OC-192 SONET clock or data distribution/driver All GigE clock or data distribution/driver Fibre Channel distribution/driver FUNCTIONAL BLOCK DIAGRAM VCC VEE VEE VCC 16 15 14 13 TYPICAL PERFORMANCE Backplane SY58016L D 1 12 50Ω VTR* 2 Q 50Ω 50Ω VCC11 VCC 100mV Input Swing VTR* 400mV Output Swing 50Ω VTR* 3 /D 4 10 50Ω VCC 50Ω 9 400mV Out VTR* /Q (< 45ps Edge Rate) 100mV In VCC 5 6 7 8 VCC VEE VEE VCC *VTR is not connected to the DIE. MLF and MicroLeadFrame are trademarks of Amkor Technology, Inc. Rev.: A 1 Amendment: /0 Issue Date: September 2002 SY58016L Micrel PACKAGE/ORDERING INFORMATION D VCC VEE VEE VCC Ordering Information Part Number Package Type Operating Range Package Marking 16 15 14 13 SY58016LXC DIE 25°C — 1 VTR 2 VTR /D 3 4 12 16-pin MLF 11 10 9 Q SY58016LMI MLF-16 Industrial 016L VTR VTR /Q SY58016LMITR* MLF-16 Industrial 016L *Tape and Reel VCC VEE VEE VCC 5 6 7 8 16-Pin MLF (MLF-16) PIN DESCRIPTION Pin Number Pin Name 1, 4 D, /D CML, PECL Differential Inputs with internal 50Ω pull-up resistors. Pin Function 2, 3, 10, 11 VTR Transmission Line Return: Normally connected to the most positive supply. 6, 7, 14, 15 Exposed pad VEE Most Negative Supply. Exposed pad to be at the same electrical potential as VEE pins. 12, 9 Q, /Q CML Differential Outputs with internal 50Ω pull-up resistors. 5, 8, 13, 16 VCC Positive Power Supply: +3.3V nominal. 2 SY58016L Micrel Absolute Maximum Ratings(Note 1) Operating Ratings(Note 2) Supply Voltage VCC – VEE| ........................................... +4.0V Output Voltage (VOUT) .............................. Max. VCC +0.5V ........................................................... Min. VCC –1.0V Maximum Input Current (IIN) .................................... ±25mA Maximum Output Current (IOUT) .............................. ±25mA Lead Temperature (Soldering, 10 sec.) .................... 220°C Supply Voltage (VIN) Input Voltage (VCC = 0V) ......................... –1.0V to +0.5V Input Voltage (VEE = 0V) ........... VCC –1.0V to VCC +0.5V Ambient Temperature (TA) ......................... –40°C to +85°C Storage Temperature (TS) ....................... –65°C to +150°C Package Thermal Resistance MLF (θJA) Still Air ............................................................. 60°C/W 500lfpm ............................................................ 54°C/W MLF (ΨJB)(Note 4) ............................................................. 32°C/W Note 1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to ABSOLUTE MAXIMUM RATlNG conditions for extended periods may affect device reliability. Note 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. Note 3. The device is guaranteed to meet the DC specifications, shown in the table above, after thermal equilibrium has been established. The device is tested in a socket such that transverse airflow of ≥500lfpm is maintained. Note 4. Junction-to-board resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. DC ELECTRICAL CHARACTERISTICS VEE = GND, VCC = +3.3V ±10% Symbol Parameter IEE Condition Min Typ Max Units Power Supply Current — 50 75 mA RIN Input Resistance 40 50 60 Ω ROUT Output Source Impedance 40 50 60 Ω VIH Input HIGH Voltage VCC–0.9 — VCC V VIL Input LOW Voltage VCC–1.0 — VCC–0.1 V VOH Output HIGH Voltage Note 1 VCC V VOL Outuput LOW Voltage Note 1 — VOUT(swing) Output Voltage Swing Note 1 325 VCC–0.040 VCC–0.010 VCC–0.400 VCC–0.325 400 — Note 1. 50Ω output load and input swing is more than 100mVp-p. See Figure 1 for Output Swing definition. QOUT QOUT VDIFF—IN,VDIFF—OU 800mV QOUT — /QOUT VIN, VOUT 400mV (typical) /QOUT /QOUT Figure 1. Input/Output Swing 3 V mVp-p SY58016L Micrel AC ELECTRICAL CHARACTERISTICS VEE = GND, VCC = +3.3V ±10% Symbol Parameter fMAX Maximum Data Rate tPLH tPHL Propagation Delay tJITTER Random Jitter Condition Min Typ Max Units 10.7 — — Gbps — 100 150 ps Note 1 — — 1.5 ps(rms) Deterministic Jitter Note 2 — — 15 ps(pk-pk) VIN Minimum Input Swing Note 3 100 — — mVp-p tr, tf Output Rise/Fall Times (20% to 80%) Note 4 — 30 45 ps Note 1. Measured with a K28.7 comma detect character pattern, measured at 10Gbps. See “Figure 2. Eye Diagram.” Note 2. Measured with a K28.5 pattern 223–1 PRBS pattern at 10Gbps. Note 3. Minimum input swing for which AC parameters are guaranteed. See Figure 1. Reduced input swing will impact maximum data rate and the resulting eye pattern. Note 4. 50Ω load and input swing is more than 100mVp-p. EYE DIAGRAM Figure 2. Eye Diagram 4 SY58016L Micrel 16 LEAD MicroLeadFrame™ (MLF-16) 0.42 +0.18 –0.18 0.23 +0.07 –0.05 0.85 +0.15 –0.65 0.01 +0.04 –0.01 3.00BSC 1.60 +0.10 –0.10 0.65 +0.15 –0.65 0.20 REF. 2.75BSC 0.42 PIN 1 ID +0.18 –0.18 N 16 1 1 0.50 DIA 2 2 2.75BSC 3.00BSC 3 3 1.60 +0.10 –0.10 4 4 12° max 0.42 +0.18 –0.18 SEATING PLANE 0.5 BSC 0.40 +0.05 –0.05 1.5 REF BOTTOM VIEW TOP VIEW CC 0.23 +0.07 –0.05 CL 4 0.01 +0.04 –0.01 SECTION "C-C" SCALE: NONE 0.5BSC 1. 2. 3. 4. DIMENSIONS ARE IN mm. DIE THICKNESS ALLOWABLE IS 0.305mm MAX. PACKAGE WARPAGE MAX 0.05mm. THIS DIMENSION APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.20mm AND 0.25mm FROM TIP. 5. APPLIES ONLY FOR TERMINALS Package Notes: 1. Package meets Level 2 Moisture Sensitivity Classification and is shipped in Dry-pack form. 2. Expose pad must be soldered to a ground for proper thermal management. MICREL, INC. TEL 1849 FORTUNE DRIVE SAN JOSE, CA 95131 + 1 (408) 944-0800 FAX + 1 (408) 944-0970 WEB Rev. 02 USA http://www.micrel.com This information is believed to be accurate and reliable, however no responsibility is assumed by Micrel for its use nor for any infringement of patents or other rights of third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent right of Micrel, Inc. © 2002 Micrel, Incorporated. 5