MICREL SY89202U

SY89202U
Precision 1:8 LVPECL Fanout Buffer with
Three ÷1/÷2/÷4 Clock Divider Output Banks
General Description
The SY89202U is a precision, high-speed,
integrated clock divider LVPECL fanout buffer
capable of handling clocks up to 1.5GHz. Optimized
for communications applications, the three
independently controlled output banks are phase
matched and can be configured for pass-through
(÷1), ÷2 or ÷4 divide ratios.
The differential input includes Micrel’s unique, 3-pin
input termination architecture that allows the user to
interface to any AC- or DC-coupled signal as small
as 100mV (200mVpp) without any level shifting or
termination resistor networks in the signal path. The
low skew, low jitter outputs are 800mV, 100k
compatible LVPECL, with extremely fast rise/fall
times guaranteed to be less than 220ps.
The EN (enable) input guarantees that the ÷1, ÷2
and ÷4 outputs will start from the same state without
any runt pulse after an asynchronous MR (master
reset) is asserted. This is accomplished by enabling
the outputs after a four-clock delay to allow the
counters to synchronize.
®
The SY89202U is part of Micrel’s Precision Edge
product family.
All support documentation can be found at Micrel’s
web site at: www.micrel.com
®
Precision Edge
Features
• Three low-skew LVPECL output banks with
programmable ÷1, ÷2 and ÷4 divider options
• Three independently programmable output banks
• Guaranteed AC performance over temp and
voltage:
– >1.5GHz clock frequency (fMAX)
– <930ps In-to-Out tpd
– <220ps tr/tf
• Ultra-low jitter design:
– <1psRMS random jitter (RJ)
– <10psPP total jitter (clock)
• Internal input termination
• Patent-pending input termination and VT pin
accepts DC-coupled and AC-coupled inputs (CML,
PECL, LVDS)
• 800mV LVPECL output swing
• CMOS/TTL-compatible output enable (EN) and
divider select control
• Power supply 2.5V +5% or 3.3V +10%
o
o
• –40 C to +85 C industrial temperature range
®
• Available in 32-pin MLF package
Applications
• All SONET/SDH channel select applications
• All Fibre Channel multi-channel select applications
• All Gigabit Ethernet multi-channel select
Applications
Markets
•
•
•
•
LAN/WAN
Enterprise servers
ATE
Test and measurement
Precision Edge is a registered trademark of Micrel, Inc.
MicroLeadFrame and MLF are registered trademarks of Amkor Technology.
June 2006
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SY89202U
Functional Block Diagram
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Ordering Information (1)
Part Number
Package
Type
Operating
Range
Package Marking
Lead
Finish
SY89202UMG
MLF-32
Industrial
SY89202U with Pb-Free bar-line indicator
NiPdAu
Pb-Free
MLF-32
Industrial
SY89202U with Pb-Free bar-line indicator
NiPdAu
Pb-Free
SY89202UMGTR
(2)
Notes:
1. Contact factory for die availability. Dice are guaranteed at TA = 25°C, DC Electricals Only.
2. Tape and Reel.
Pin Configuration
®
32-Pin MLF (MLF-32)
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Pin Description
Pin Number
Pin Name
Pin Function
2, 7, 8
DIVSEL1
DIVSEL2
DIVSEL3
Single-Ended Inputs: These TTL/CMOS inputs select the divide ratio for each of the
three banks of outputs. Note that each of these inputs is internally connected to a
25kΩ pull-up resistor and will default to logic HIGH state if left open. The inputswitching threshold is VCC/2.
3, 6
IN, /IN
Differential Input: This input pair is the differential signal input to the device. This
input accepts AC- or DC-coupled signals as small as 100mV. The input pair
internally terminates to a VT pin through 50Ω. Note that these inputs will default to
an indeterminate state if left open. Please refer to the “Input Interface Applications”
section for more details.
4
VT
Input Termination Center-Tap: Each side of the differential input pair terminates to
the VT pin. The VT pin provides a center-tap to a termination network for maximum
interface flexibility. See “Input Interface Applications” section for more details.
5
VREF-AC
Reference Voltage: This output biases to VCC –1.2V. It is used for AC-coupling
inputs IN and /IN. For AC-coupled applications, connect VREF-AC directly to the VT
pin. Bypass with 0.01µF low ESR capacitor to VCC.
Single-Ended Input: This TTL/CMOS input disables and enables the Q0 – Q7
outputs. This input is internally connected to a 25kW pull-up resistor and will default
to logic HIGH state if left open. The input-switching threshold is VCC/2. For the input
enable and disable functional description, refer to “Timing Diagram” section.
9
EN
10, 19, 22, 31
VCC
Positive power supply. Bypass with 0.1uF//0.01uF low ESR capacitors as close to
VCC pins as possible.
16, 15, 14,
13, 12, 11
Q4, /Q4, Q5, /Q5,
Q6, /Q6
Bank 2 LVPECL differential output pairs controlled by DIVSEL2: LOW, Q4 – Q6 =
÷2, HIGH, Q4 – Q6 = ÷4. Unused output pairs may be left open. Each output is
designed to drive 800mV into 50Ω terminated at VCC–2V.
30, 29, 28,
27, 26, 25,
24, 23
Q0, /Q0, Q1, /Q1,
Q2, /Q2, Q3, /Q3
Bank 1 LVPECL differential output pairs controlled by DIVSEL1: LOW, Q0 – Q3 =
÷1, HIGH, Q0 – Q3 = ÷2. Unused output pairs may be left open. Each output is
designed to drive 800mV into 50Ω terminated at VCC–2V.
18, 17
Q7, /Q7
Bank 3 LVPECL differential output pair controlled by DIVSEL3: LOW, Q7 = ÷2,
HIGH, Q7 = ÷4. Unused output pairs may be left open. Each output is designed to
drive 800mV into 50W terminated at VCC–2V.
32
/MR
1, 20, 21
GND,
Exposed Pad
Single-Ended Input: This TTL/CMOS-compatible master reset function
asynchronously sets Q0 – Q7 outputs LOW and /Q0 – /Q7 outputs HIGH, and holds
them in that state as long as the /MR input remains LOW. This input is internally
connected to a 25kΩ pull-up resistor and will default to a logic HIGH state if left
open. The input-switching threshold is VCC/2.
Ground: Ground pin and exposed pad must be connected to the same ground
plane.
Truth Table
/MR
( 1)
( 2, 3)
EN
DIVSEL1
DIVSEL2
DIVSEL3
Q0 – Q3
Q4 – Q6
Q7
0
0
0
0
X
X
X
X
1
0
X
X
X
0
0
0
1
1
0
0
0
÷1
÷2
÷2
1
1
1
1
1
÷2
÷4
÷4
Notes:
1.
/MR asynchronously forces Q0 – Q7 LOW (/Q0 - /Q7 HIGH).
2.
EN forces Q0 – Q7 LOW between 2 and 6 input clock cycles after the falling edge of EN. Refer to “Timing Diagram” section.
3.
EN synchronously enables the outputs between 2 and 6 input clock cycles after the rising edge of EN. Refer to “Timing Diagram” section.
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SY89202U
Absolute Maximum Ratings(1)
Operating Ratings(2)
Supply Voltage (VCC) .............................-0.5V to +4.0V
Input Voltage (VIN) .....................................-0.5V to VCC
Termination Current
Source or sink current on VT .................... ±100mA
Output Current
Source or sink current on IN, /IN................ ±50mA
VREF-AC Current
Source or sink current on VREF-AC .............. ±1.5mA
Lead Temperature (soldering, 20 sec.)............ +260°C
Storage Temperature (Ts) ...................–65°C to 150°C
Supply Voltage (VCC) ....................+2.375V to +2.625V
........................................................ +3.0V to +3.6V
Ambient Temperature (TA) .................. –40°C to +85°C
(4)
Package Thermal Resistance
®
MLF (θJA)
Still-Air ........................................................ 35°C/W
®
MLF (ψJB)
Junction-to-Board ...................................... 20°C/W
DC Electrical Characteristics(5)
TA = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
VCC
Power Supply
ICC
Power Supply Current
RDIFF_IN
Differential Input Resistance
(IN-to-/IN)
RIN
Condition
Min
Typ
Max
Units
2.625
3.6
V
V
125
180
mA
90
100
110
Ω
Input Resistance
(IN-to-VT)
45
50
55
Ω
VIH
Input High Voltage
(IN, /IN)
1.2
VCC
V
VIL
Input Low Voltage
(IN, /IN)
0
VIH–0.1
V
VIN
Input Voltage Swing
(IN, /IN)
See Figure 1a.
100
VCC
mV
VDIFF_IN
Differential Input Voltage Swing
|IN-/IN|
See Figure 1b.
200
VREF-AC
Output Reference Voltage
(VREF-AC)
IN-to-VT
Voltage from Input to VT
2.375
3.0
No load, max. VCC
VCC–1.3
mV
VCC–1.2
VCC–1.1
V
1.8
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is
not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package Thermal Resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. θJA and
ψJB values are determined for a 4-layer board in still air, unless otherwise stated.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
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SY89202U
LVPECL Outputs DC Electrical Characteristics(6)
VCC = 2.5V ±5% or 3.3V ±10%; TA = –40°C to + 85°C; RL = 50Ω to VCC–2V, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VOH
Output HIGH Voltage
Q, /Q
VCC-1.145
VCC–0.895
V
VOL
Output LOW Voltage
Q, /Q
VCC-1.945
VCC –1.695
V
VOUT
Output Voltage Swing
Q, /Q
See Figure 1a.
550
800
mV
VDIFF-OUT
Differential Output Voltage Swing
|Q – /Q|
See Figure 1b.
1100
1600
mV
LVTTL/CMOS DC Electrical Characteristics(6)
VCC = 2.5V ±5% or 3.3V ±10%; TA = –40°C to + 85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
VIH
Input HIGH Voltage
VIH
Input LOW Voltage
IIH
Input HIGH Current
–125
IIL
Input LOW Current
–300
Typ
Max
2.0
Units
V
0.8
V
30
µA
µA
Note:
6. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
June 2006
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SY89202U
AC Electrical Characteristics(7)
VCC = 2.5V ±5% or 3.3V ±10%; TA = –40°C to + 85°C, RL = 50Ω to VCC–2V, unless otherwise stated.
Symbol
fMAX
Parameter
Condition
Min
Maximum Output Toggle Frequency
Output swing ≥ 400mV
1.5
IN-to-Q
530
Maximum Input Frequency
Differential Propagation Delay
tpd
Typ
tskew
tJitter
tr, tf
Units
GHz
3.0
GHz
700
/MR – Q Propagation Delay
tpd
Tempco
Max
Differential Propagation Delay
Temperature Coefficient
930
ps
900
ps
fs/oC
115
Within-bank Skew
Within same fanout bank, Note 8
10
25
ps
Bank-to-Bank Skew
Same divide setting, Note 9
15
35
ps
Bank-to-Bank Skew
Different divide setting, Note 9
25
50
ps
Part-to-Part Skew
Note 10
200
ps
Deterministic Jitter (DJ)
Note 11
10
psPP
Random Jitter (RJ)
Note 12
1
psRMS
Total Jitter
Note 13
10
psPP
Cycle-to-Cycle Jitter
Note 14
1
psRMS
Output Rise/Fall Time
20% to 80%, At full output swing.
220
ps
70
130
Notes:
7.
Measured with 100mV input swing. See “Timing Diagrams” section for definition of parameters. High-frequency AC-parameters are
guaranteed by design and characterization.
8.
Within-bank skew is the difference in propagation delays among the outputs within the same bank.
9.
Bank-to-bank skew is the difference in propagation delays between outputs from different banks. Bank-to-bank skew is also the phase
offset between each bank, after MR is applied.
10. Part-to-part skew is defined for two parts with identical power supply voltages at the same temperature and with no skew of the edges at
the respective inputs.
11. Deterministic jitter is measured with a K28.7 101010 pattern, measured at <fMAX.
12. Random jitter is measured with a K28.7 101010 pattern, measured at <fMAX.
13. Total jitter definition: with an ideal clock input of frequency <fMAX, no more than one output edge in 1012 output edges will deviate by more
than the specified peak-to-peak jitter value.
14. Cycle-to-cycle jitter definition: the variation of periods between adjacent cycles, Tn – Tn-1 where T is the time between rising edges of the
output signal.
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SY89202U
Single-Ended and Differential Swings
Figure 1a. Single-Ended Voltage Swing
Figure 1b. Differential Voltage Swing
Timing Diagrams
1
2
3
4
IN, /IN
/MR V /2
CC
/MR asynchronously resets the outputs.
EN
EN = HIGH
tpd
÷1 Output
÷2 Output
÷4 Output
Outputs go HIGH simultaneously after 4 complete input
clock (IN) periods after /MR is de-asserted.
Timing Diagram Showing Reset with Output Enabled
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SY89202U
1
2
3
4
IN, /IN
EN
Enable asserted
VCC /2
External ÷1 Output
External ÷2 Output
External ÷4 Output
Outputs go HIGH simultaneously after EN is asserted. The number of IN
clock cycles after EN is asserted before the outputs go HIGH varies from 2
to 6 cycles (4 cycles shown).
Timing Diagram Showing Enable Timing
1
2
3
4
IN, /IN
Enable de-asserted to disable Q0 – Q7 Outputs
EN
VCC /2
÷1 Output
÷2 Output
÷4 Output
Outputs go low in sequence after EN is de-asserted. The ÷4, ÷2 , ÷1
outputs go LOW in that order. The number of IN clock cycles after
EN is de-asserted varies from 2 to 6 cycles (4 cycles shown).
Timing Diagram Showing Disable Timing
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SY89202U
Typical Operating Characteristics
Functional Characteristics
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Input and Output Stages
Figure 2b. Simplified LVPECL Output Stage
Figure 2a. Simplified Differential Input Stage
Input Interface Applications
Option: may connect VT to VCC
Figure 3a. LVPECL Interface
(DC-Coupled)
Figure 3b. LVPECL Interface
(AC-Coupled)
Figure 3c. CML Interface
(DC-Coupled)
Figure 3d. CML Interface
(AC-Coupled)
Figure 3e. LVDS Interface
(DC-Coupled)
Figure 3f. LVDS Interface
(AC-Coupled)
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terminating the LVPECL output: Parallel
Termination-Thevenin Equivalent, Parallel
Termination (3-resistor), and AC-coupled
Termination. Unused output pairs may be left
floating. However, single-ended outputs must be
terminated, or balanced.
LVPECL Output Interface Applications
LVPECL has high input impedance, and very low
output impedance (open emitter), and small signal
swing which results in low EMI. LVPECL is ideal for
driving 50Ω- and 100Ω-controlled impedance
transmission lines. There are several techniques for
Figure 4. Parallel Termination-Thevenin Equivalent
Figure 5. Parallel Termination (3-Resistor)
Related Product and Support Documentation
Part Number
Function
SY89200U
Ultra-precision 1:8 LVDS Fanout with Three
÷1/÷2/÷4 Clock Divider Output Banks
http://www.micrel.com:8000/iphrase/query?query=*SY892
02U*
Data Sheet Link
HBW Solutions
New Products and Applications
http://www.micrel.com/page.do?page=/productinfo/as/HBWsolutions.shtml
®
MLF Application Note
June 2006
www.amkor.com/products/notes_papers/MLFAppNote.pdf
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SY89202U
32-Pin MicroLeadFrame® (MLF-32)
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http:/www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel
for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a
product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended
for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a
significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a
Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale.
© 2006 Micrel, Incorporated.
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