Micrel, Inc. 3.3V DUAL DIFFERENTIAL LVPECL-to-LVTTL TRANSLATOR Precision Edge® ® SY89223L Precision Edge SY89223L FEATURES ■ ■ ■ ■ ■ ■ ■ ■ fMAX >160MHz 3.3V ±10% power supply <2.5ns propagation delay <300ps within-device skew Differential LVPECL inputs 24mA LVTTL outputs Industrial temperature range: –40°C to +85°C Available in an ultra-small 8-pin (2mm × 2mm) MLF™ package Precision Edge® DESCRIPTION The SY89223L is a 3.3V, precision dual differential LVPECL-to-LVTTL translator. The ultra-small 8-pin MLF package and the low skew, dual gate design of this translator makes it ideal for applications which require the translation of a clock and a data signal. The SY89223L translator accepts 10k or 100k differential LVPECL inputs. BLOCK DIAGRAM D0 /D0 FUNCTIONAL CROSS REFERENCE Q0 LVPECL INPUTS Micrel Part Number Functional Cross SY89223L 10/100ELT23 TTL OUTPUTS D1 /D1 Q1 Precision Edge is a registered trademark of Micrel, Inc. MicroLeadFrame and MLF are trademarks of Amkor Technology, Inc. M9999-051805 [email protected] or (408) 955-1690 Rev.: B 1 Amendment: /0 Issue Date: May 2005 Precision Edge® SY89223L Micrel, Inc. PACKAGE/ORDERING INFORMATION Ordering Information(1) D0 1 8 VCC Part Number Package Type Operating Range Package Marking Lead Finish /D0 2 7 Q0 SY89223LMITR(2) MLF-8 Industrial 223 Sn-P /D1 3 6 Q1 SY89223LMGTR(2) MLF-8 Industrial D1 4 5 GND 223 with Pb-Free bar-line indicator Pb-Free NiPdAu 8-Pin MLF™ Ultra-Small Outline Notes: 1. Contact factory for die availability. Dice are guaranteed at TA = 25°C, DC electricals only. 2. Tape and Reel. PIN DESCRIPTION Pin Number Pin Name Type 1, 2, 3, 4 D0, /D0 D1, /D1 10k/100k PECL Input 7, 6 Q0, Q1 LVTTL Output 8 VCC VCC Power 5 GND, Exposed Pad Ground M9999-051805 [email protected] or (408) 955-1690 Pin Function Differential LVPECL Input: Channels 0 and 1 inputs are applied to these LVPECL compatible inputs. See “Input Interface Applications” section for single-ended inputs. Single-ended Output: LVTTL outputs. Positive Power Supply: Bypass with 0.1µF//0.01µF low ESR capacitors. Ground and exposed pad must be tied to ground plane. 2 Precision Edge® SY89223L Micrel, Inc. Absolute Maximum Ratings(Note 1) Operating Ratings(Note 2) Power Supply Voltage (VCC) ......................... –0.5V to 4.0V PECL Input Voltage (VIN) ........................ +0V to VCC +0.5V Voltage Applied to Output at HIGH State (VOUT) ....................................................... –0.5V to VCC Current Applied to Output at LOW State (IOUT) ........................................ Twice the Rated IOL mA Lead Temperature (soldering, 20 sec.) ..................... 260°C Storage Temperature (TS) ....................... –65°C to +150°C Power Supply Voltage (VCC) ....................... +3.0V to +3.6V Ambient Temperature (TA) ......................... –40°C to +85°C Package Thermal Resistance,(Note 3) MLF™ (θJA) Still-Air ............................................................. 93°C/W 500lfpm ............................................................ 87°C/W MLF™ (ψJB), ....................................................... 56°C/W LVTTL DC ELECTRICAL CHARACTERISTICS VCC = 3.3V ±10%; GND = 0V, TA = –40°C to +85°C; unless otherwise noted. Symbol Parameter Condition Min VOH Output HIGH Voltage IOH = –3.0mA 2.0 VOL Output LOW Voltage IOL = 24mA ICC Power Supply Current IOS Output Short Circuit Current VOUT = 0V Typ Max Units V –80 0.5 V 30 mA –240 mA LVPECL DC ELECTRICAL CHARACTERISTICS VCC = 3.3V ±10%; GND = 0V, TA = –40°C to +85°C; unless otherwise noted. Symbol Parameter VIH Condition Min Typ Max Units Input HIGH Voltage VCC–1.165 — VCC–0.880 V VIL Input LOW Voltage VCC–1.810 — VCC–1.475 V VIHCMR Input HIGH Common Mode Range 1.2 — VCC V VPP Minimum Input Swing 200 — — mV IIH Input HIGH Current — — 150 µA IIL Input LOW Current 0.5 — — µA Note 4 Note 1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to ABSOLUTE MAXIMUM RATlNG conditions for extended periods may affect device reliability. Note 2. Note 3. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB. Note 4. VIHCMR(min) varies 1:1 with VEE, Max varies 1:1 with VCC. M9999-051805 [email protected] or (408) 955-1690 3 Precision Edge® SY89223L Micrel, Inc. AC ELECTRICAL CHARACTERISTICS VCC = 3.3V ±10%; GND = 0V, TA = –40°C to +85°C; CL = 20pF unless otherwise noted. Symbol Parameter Condition Min fMAX Maximum Input Frequency Note 5 160 tpd Propagation Delay tSKEW++ Within-Device Skew tSKEW– – Typ Max Units MHz 1.5 2.5 ns Notes 6, 8 0.3 ns Within-Device Skew Notes 7, 8 0.3 ns tSKPP Part-to-Part Skew Notes 8, 9 0.5 ns tr,tf Output Rise/Fall Times (1.0V to 2.0V) 1.0 ns 0.5 Note 5. Frequency at which output levels will meet a 0.8V to 2.0V minimum swing. Note 6. Within-Device Skew considering HIGH-to-HIGH transitions at common VCC level. Note 7. Within-Device Skew considering LOW-to-LOW transitions at common VCC level. Note 8. All skew parameters are guaranteed but not tested. Note 9. Device-to-Device Skew considering HIGH-to-HIGH transitions at common VCC level. INPUT INTERFACE APPLICATIONS +3.3V 1kΩ +3.3V 1kΩ +3.3V +3.3V IN VCC —1.3V VCC —1.3V 1.6kΩ 1.6kΩ Figure 1a. Single-Ended Input (Terminating Unused Input) Figure 1b. Terminating Inputs of Unused Gate RELATED PRODUCT AND SUPPORT DOCUMENTATION Part Number Function Data Sheet Link SY89206/216V 3.3V/5V 1GHz Differential PECL/ECL Receiver/Buffer www.micrel.com/product-info/products/sy89206-216v.shtml SY89306/316V 3.3V/5V 2.5GHz PECL/ECL Differential Receiver/Buffer www.micrel.com/product-info/products/sy89306-316v.shtml HBW Solutions New Products and Applications www.micrel.com/product-info/products/solutions.shtml M9999-051805 [email protected] or (408) 955-1690 4 Precision Edge® SY89223L Micrel, Inc. 8 LEAD ULTRA-SMALL EPAD-MicroLeadFrame™ (MLF-8) Package EP- Exposed Pad Die CompSide Island Heat Dissipation Heat Dissipation VEE Heavy Copper Plane VEE Heavy Copper Plane PCB Thermal Consideration for 8-Pin MLF™ Package (Always solder, or equivalent, the exposed pad to the PCB) Package Notes: Note 1. Note 2. Note 3. Package meets level two qualification. All parts are dry-packaged before shipment. Exposed pads must be soldered to a ground plane, of the same potential as the device GND pin, for proper thermal management. MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 TEL + 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB USA http://www.micrel.com The information furnished by Micrel in this datasheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. © 2005 Micrel, Incorporated. M9999-051805 [email protected] or (408) 955-1690 5