Micrel, Inc. 2.5V/3.3V/5V 1:2 DIFFERENTIAL PECL/LVPECL/ECL FANOUT BUFFER Precision Edge® SY89311U ® Precision Edge SY89311U FEATURES ■ 2.5V, 3.3V and 5V power supply ■ Guaranteed AC parameters over temperature: • fMAX > 3.0GHz • < 20ps output-to-output skew • < 200ps tr / tf • < 300ps propagation delay ■ 100K compatible I/O ■ Wide temperature range: –40°C to +85°C ■ Available in ultra-small 8-pin MLF® (2mm × 2mm) package Precision Edge® DESCRIPTION The SY89311U is a precision, high-speed 1:2 differential fanout buffer. Having within-device skews and output transition times significantly improved over the EL11V, the SY89311U is ideally suited for those applications which require the ultimate in AC performance in a small package. The differential inputs of the SY89311U employ clamping circuitry to maintain stability under open input conditions. If the inputs are left open, the Q outputs will be LOW. The differential inputs can accept 10/100K ECL/PECL signals (external termination required) and the outputs are 100K ECL/PECL compatible. BLOCK DIAGRAM Q0 IN PECL /Q0 PECL /IN Q1 /Q1 Precision Edge is a registered trademark of Micrel, Inc. MicroLeadFrame and MLF are registered trademarks of Amkor Technology, Inc. M9999-092606 [email protected] or (408) 955-1690 Rev.: D 1 Amendment: /0 Issue Date: September 2006 Precision Edge® SY89311U Micrel, Inc. PACKAGE/ORDERING INFORMATION Ordering Information Q0 1 8 VCC /Q0 2 7 IN Part Number Q1 3 6 /IN /Q1 4 5 VEE 8-Pin MLF® Ultra-Small Outline (2mm × 2mm) Package Type Operating Range Package Marking Lead Finish SY89311UMITR MLF-8 Industrial 311 Sn-Pb SY89311UMGTR(1) MLF-8 Industrial 311 with Pb-Free bar-line indicator Pb-Free NiPdAu Note: 1. Pb-Free package is recommended for new designs. PIN DESCRIPTION Pin Number Pin Name Type 1, 2, 3, 4 Q0, /Q0, Q1, /Q1 100K Output Differential PECL/ECL Outputs: Default to LOW if IN inputs are left open. See“Output Interface Applications” section for recommendations on terminations. Unused output pairs may be left floating without any inpact on skew or jitter. 5 VEE, Exposed Pad Negative Power Supply Negative Power Supply: VEE and exposed pad must be tied to most negative supply. For PECL/LVPECL connect to ground. 6 /IN 100K Input Differential PECL/ECL Input: Internal 75kΩ pull-up and pull-down resistors. If left floating, pin defaults to VCC/2. When not used, this input can be left open. See “Input Interface Applications” section for single-ended inputs. 7 IN 100K Input Differential PECL/ECL Input: Internal 75kΩ pull-down resistor. If left open, pin defaults LOW. Q output will be LOW. Accepts differential 10K and 100K ECL/PECL. See “Input Interface Applications” section for single-ended inputs. 8 VCC Positive Power Supply M9999-092606 [email protected] or (408) 955-1690 Pin Function Positive Power Supply: Bypass with 0.1µF//0.01µF low ESR capacitors. 2 Precision Edge® SY89311U Micrel, Inc. Absolute Maximum Ratings(1) Operating Ratings(2) Supply Voltage (VCC) .................................. –0.5V to +6.0V Input Voltage (VIN) ......................................... –0.5V to VCC LVPECL Output Current (IOUT) Continuous ............................................................. 50mA Surge .................................................................... 100mA Input Current Source or sink current on IN, /IN .......................... ±50mA Lead Temperature (soldering, 20 sec.) ................... +260°C Storage Temperature (TS) ....................... –65°C to +150°C Supply Voltage |VCC–VEE| .................. +2.375V to +2.625V ............................................................ +3.0V to +3.6V ............................................................ +4.5V to +5.5V Ambient Temperature (TA) ......................... –40°C to +85°C Package Thermal Resistance, Note 3 MLF™ (θJA) Still-Air ................................................................. 93°C/W 500lfpm ............................................................... 87°C/W MLF™ (ΨJB) Junction-to-Board ................................................ 60°C/W DC ELECTRICAL CHARACTERISTICS(4) TA = –40°C to +85°C Symbol Parameter Condition VCC Power Supply Voltage LVPECL LVPECL PECL ECL LVECL LVECL IEE Power Supply Current Max. VCC, no load IIH Input HIGH Current VIN = VIH IIL Input LOW Current CIN Input Capacitance IN /IN VIN = VIL VIN = VIL Min Typ Max Units 2.375 3.0 4.5 –5.5 –3.6 –2.625 2.5 3.3 5.0 –5.0 –3.3 –2.5 2.625 3.6 5.5 –4.5 –3.0 –2.375 V V V V V V 30 44 mA 150 µA 0.5 –150 µA µA 1.0 pF (100K) ECL/LVECL DC ELECTRICAL CHARACTERISTICS VCC = +2.5V ±5% or +3.3V ±10% or +5.0V ±10% and VEE = 0V; VCC = 0V and VEE = –2.5V ±5% or –3.3V ±10% or –5.0V ±10%; RL = 50Ω to VCC–2V; TA = –40°C to +85°C, unless otherwise noted. Symbol Parameter VOH Output HIGH Voltage VOL Condition Min Typ Max Units VCC–1.145 VCC–0.895 V Output LOW Voltage VCC–1.945 VCC–1.695 V VIH Input HIGH Voltage VCC–1.225 VCC–0.88 V VIL Input LOW Voltage VCC–1.945 VCC–1.625 V VIHCMR Input HIGH Voltage Common Mode Range Note 5 VEE+1.2 VCC V IIH Input HIGH Current VIN = VIH 150 µA IIL Input LOW Current (IN) VIN = VIL 0.5 µA Input LOW Current (/IN) VIN = VIL –150 µA Notes: 1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratlng conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Package Thermal Resistance values assume exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB. 4. This circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. 5. VIHCMR (min) varies 1:1 with VEE, (max) varies 1:1 with VCC. M9999-092606 [email protected] or (408) 955-1690 3 Precision Edge® SY89311U Micrel, Inc. AC ELECTRICAL CHARACTERISTICS(6) VCC = +2.5V ±5% or +3.3V ±10% or +5.0V ±10% and VEE = 0V; VCC = 0V and VEE = –2.5V ±5% or –3.3V ±10% or or –5.0V ±10%; RL = 50Ω to VCC–2V; TA = –40°C to +85°C, unless otherwise noted. Symbol Parameter fMAX Maximum Toggle Frequency tpd Propagation Delay (Differential) IN to Q, /Q IN to Q, /Q VCC = 3.3V/5V VCC = 2.5V Within-Device Skew Note 7 tSKEW Condition Min Typ Max 3 Q, /Q Part-to-Part Skew tJITTER Cycle-to-Cycle Jitter (rms) VDIFF Input Swing tr, tf Output Rise/Fall Time (20% to 80%) 140 170 GHz 220 240 300 360 ps ps 5 20 ps 150 120 ps ps 1 ps(rms) VCC = 3.3V/5V, Note 7 VCC = 2.5V, Note 7 Note 8 150 800 1200 mV 70 120 200 ps Notes: 6. Measured with 750mV input signal, 50% duty cycle. VDIFF_OUT is ≥ 400mV. 7. Skew is measured between outputs under identical transitions. Duty cycle skew is defined only for differential operation when the delays are measured from the cross point of the inputs to the cross point of the outputs. 8. See “Input Waveform.” INPUT WAVEFORM IN VIHCMR VDIFF = 150mV to 1200mV /IN M9999-092606 [email protected] or (408) 955-1690 4 Units Precision Edge® SY89311U Micrel, Inc. INPUT INTERFACE APPLICATIONS VCC R1 VCC IN VCC –1.3V R2 VCC = 2.5V; R1 = 1kΩ, R2 = 900Ω VCC = 3.3V; R1 = 1kΩ, R2 = 1.6kΩ VCC = 5V; R1 = 1kΩ, R2 = 2.8kΩ Figure 1. Single-Ended Input (Terminating unused input) LVPECL OUTPUT INTERFACE APPLICATIONS VCC VCC R1 R1 VCC VCC ZO = 50Ω ZO = 50Ω ZO = 50Ω VCC –2V R2 50Ω R2 VCC = 2.5V; Rpd = 39Ω VCC = 3.3V; Rpd = 50Ω VCC = 5V; Rpd = 100Ω VCC = 2.5V; R1 = 250Ω, R2 = 62.5Ω VCC = 3.3V; R1 = 130Ω, R2 = 82Ω VCC = 5V; R1 = 83Ω, R2 = 125Ω Figure 2a. Parallel Thevenin-Equivalent Termination VCC VCC R1 R1 R3 VCC ZO = 50Ω R2 VCC –2V 50Ω Rpd Figure 2b. Three Resistor “Y Termination” VCC R2 R4 VCC –1.3V VCC = 2.5V; R1 = 250Ω, R2 = 62.5Ω, R3 = 1kΩ, R4 = 900Ω, VCC = 3.3V; R1 = 130Ω, R2 = 82Ω, R3 = 1kΩ, R4 = 1.6kΩ, VCC = 5V; R1 = 83Ω, R2 = 125Ω, R3 = 1kΩ, R4 = 2.8kΩ, Figure 2c. Terminating Unused I/O M9999-092606 [email protected] or (408) 955-1690 VCC ZO = 50Ω 5 C (Optional) 0.01µF Precision Edge® SY89311U Micrel, Inc. 8 LEAD ULTRA-SMALL EPAD-MicroLeadFrame® (MLF-8) Package EP- Exposed Pad Die CompSide Island Heat Dissipation Heat Dissipation VEE Heavy Copper Plane VEE Heavy Copper Plane PCB Thermal Consideration for 8-Pin MLF® Package Package Notes: 1. Package meets Level 2 qualification. 2. All parts are dry-packaged before shipment. 3. Exposed pads must be soldered to a ground for proper thermal management. MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA TEL + 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB http://www.micrel.com The information furnished by Micrel in this datasheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. © 2006 Micrel, Incorporated. M9999-092606 [email protected] or (408) 955-1690 6