MICREL SY89853U

SY89853U
Precision Low-Power Dual 2:1 LVPECL MUX
with Internal Termination
General Description
The SY89853U features two, low jitter 2:1 differential
multiplexers with 100K LVPECL (800mV) compatible
outputs, capable of handling clocks up to 2.5GHz and
data streams up to 2.5Gbps.
The SY89853U differential inputs include Micrel’s
unique, 3-input termination architecture that allows
users to interface to any differential signal (AC- or DCCoupled) as small as 100mV without any level shifting
or termination resistors networks in the signal path. The
result is a clean, stub-free, low jitter interface solution.
The differential 800mV LVPECL outputs have fast
rise/fall times guaranteed to be less than 180ps.
The SY89853U operates from a 2.5V ±5% or a 3.3V
±10% supply, and is guaranteed over the full industrial
temperature range (–40°C to +85°C). For applications
that require higher performance, consider the
SY58026U. The SY89853U is part of Micrel's Precision
®
Edge product family.
All support documentation can be found on Micrel’s web
site at www.micrel.com.
®
Precision Edge
Features
• Dual 2:1 MUX, each channel selects from inputs
• Unique, patent-pending input isolation design
minimizes crosstalk
• Low power 210mW (VCC = 2.5V)
• Guaranteed AC performance over temperature and
voltage:
- DC-to->2.5Gbps data rate throughput
- <360ps IN-to-Q tpd
- <180ps tr/tf times
• Ultra-low jitter design:
- <1psRMS random jitter
- <10psPP deterministic jitter
- <10psPP total jitter (clock)
- <0.7psRMS crosstalk-induced jitter
• Unique, patent-pending 50Ω input termination and
VT pin accepts DC- and AC-coupled inputs (CML,
LVDS, PECL)
• 800mV LVPECL output swing
• Power supply 2.5V ±5% or 3.3V ±10%
• –40°C to +85°C temperature range
• Available in 32-pin (5mm x 5mm) MLF® package
Applications
•
•
•
•
Data communication systems
All SONET OC-3 to OC-48 applications
All Fibre Channel applications
All GigE applications
Markets
•
•
•
•
LAN/WAN communication
Enterprise servers
ATE
Test and measurement
Precision Edge is a registered trademark of Micrel, Inc
MLF and MicroLeadFrame are registered trademarks of Amkor Technology.
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
February 2007
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SY89853U
Functional Block Diagram
Truth Table
SEL
Q
0
IN0 Input Select
1
IN1 Input Select
February 2007
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SY89853U
Ordering Information(1)
Part Number
Package
Type
Operating
Range
Package Marking
Lead Finish
SY89853UMG
MLF-32
Industrial
SY89853U with Pb-Free bar-line indicator
NiPdAu Pb-Free
SY89853UMGTR(2)
MLF-32
Industrial
SY89853U with Pb-Free bar-line indicator
NiPdAu Pb-Free
Notes:
1. Contact factory for die availability. Dice are guaranteed at TA = 25ºC, DC Electricals only.
2. Tape and Reel.
Pin Configuration
32-Pin MLF® (MLF-32)
Pin Description
Pin Number
Pin Name
25, 28,
29, 32
1, 4
5, 8
INA0, /INA0,
INA1, /INA1,
INB0, /INB0,
INB1, /INB1
10, 13, 16, 17,
20, 23
VCC
14, 19
NC
18
15
SELA,
SELB
22, 21
12, 11
QA, /QA,
QB, /QB
Differential Outputs: These LVPECL output pairs are the outputs of the device. They are a
logic function of the INA0, INA1, INB0, INB1 and SELA and SELB inputs. Please refer to
the “Truth Table” below for details.
26, 30
2, 6
VTA0, VTA1
VTB0, VTB1
Input Termination Center-Tap: Each side of the differential input pair terminates to a VT
pin. The VTA0, VTA1, VTB0, VTB1 pins provide a center-tap to a termination network for
maximum interface flexibility. See “Input Interface Applications” section for details.
27
31
3
7
VREF-ACA0,
VREF-ACA1,
VREF-ACB0,
VREF-ACB1
Reference Voltages: These reference voltage outputs are equivalent to VCC-1.2V. They are
used for AC-coupled inputs. Connect VREF-AC directly to the VT pin and bypass with
0.01µF low ESR capacitor to VCC. See “Input Interface Applications” section. Maximum
sink/source current is ±1.5mA.
9, 24
GND,
Exposed Pad
Ground: Ground pins and exposed pad must be connected to the same ground plane.
February 2007
Pin Function
Differential Inputs: These input pairs are the differential signal inputs to the device. Inputs
accept AC- or DC-coupled signals as small as 100mV. Each pin of a pair internally
terminates to a VT pin through 50Ω. Note that these inputs will default to an indeterminate
state if left open. Connecting one input to VCC and the complementary input-to-GND
through 1kΩ resistor can terminate unused differential input pairs. The VT pin is to be left
open in this configuration. Please refer to the “Input Interface Applications” section for more
details.
Positive power supply. Bypass with 0.1µF//0.01µF low ESR capacitors. The 0.01µF
capacitor should be as close to VCC pin as possible.
Not connected.
Bank A and Bank B Input Channel Select (TTL/CMOS): These TTL/CMOS-compatible
inputs select the inputs to the multiplexers. These inputs are internally connected to a
25kΩ pull-up resistor and will default to logic HIGH state if left open.
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SY89853U
Absolute Maximum Ratings(1)
Operating Ratings(2)
Supply Voltage (VCC) ............................–0.5V to +4.0V
Input Voltage (VIN) ....................................–0.5V to VCC
LVPECL Output Current (IOUT)
Continuous................................................. ±50mA
Surge ....................................................... ±100mA
Termination Current
Source or Sink Current on VT .................... ±50mA
Input Current
Source or Sink Current on IN, /IN.............. ±50mA
Current (VREF-AC)
Source or Sink Current on VREF-AC ............... ±2mA
Lead Temperature (soldering, 20sec.) ...............260°C
Storage Temperature (Ts) ................ –65°C to +150°C
Supply Voltage (VCC) .....................+2.375V to +2.625V
.....................................................+3.0V to +3.6V
Ambient Temperature (TA)....................–40°C to +85°C
Package Thermal Resistance(3)
MLF® (θJA)
Still-Air......................................................35°C/W
500lfpm ....................................................28°C/W
MLF® (ψJB)
Junction-to-Board.....................................16°C/W
DC Electrical Characteristics(4)
TA = –40°C to +85°C, unless otherwise noted.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply
VCC = 2.5V
VCC = 3.3V
2.375
3.0
2.5
3.3
2.625
3.6
V
V
ICC
Power Supply Current
No load, max. VCC.
65
85
mA
RIN
Input Resistance
(IN-to-VT)
45
50
55
Ω
RDIFF_IN
Differential Input Resistance
(IN-to-/IN)
90
100
110
Ω
VIH
Input High Voltage
(IN, /IN)
VCC– 1.2
VCC
V
VIL
Input Low Voltage
(IN, /IN)
0
VIH– 0.1
V
VIN
Input Voltage Swing
(IN-to-/IN)
See Figure 1a.
100
1700
mV
VDIFF_IN
Differential Input Voltage Swing
|IN - /IN|
See Figure 1b.
200
VT_IN
Maximum Input Voltage
(IN-to-VT)
VREF-AC
Output Reference Voltage
VCC– 1.3
mV
VCC– 1.2
1.28
V
VCC– 1.1
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions
for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. θJA and ψJB
values are determined for a 4-layer board in still-air, unless otherwise stated.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
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SY89853U
LVPECL Outputs DC Electrical Characteristics(5)
VCC = 2.5V ±5% or 3.3V ±10%; RL = 50Ω to VCC–2V; TA = –40°C to +85°C, unless otherwise noted.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VOH
Output High Voltage
(Q, /Q)
VCC–1.145
VCC–0.895
V
VOL
Output Low Voltage
(Q, /Q)
VCC–1.945
VCC–1.695
V
VOUT
Output Voltage Swing
(Q, /Q)
See Figure 1a.
400
800
mV
VDIFF-OUT
Differential Output Voltage Swing
(Q, /Q)
See Figure 1b.
800
1600
mV
Min
Typ
LVTTL/CMOS DC Electrical Characteristics(5)
VCC = 2.5V ±5% or 3.3V ±10%; TA = –40°C to +85°C, unless otherwise noted.
Symbol
Parameter
VIH
Input High Voltage
VIL
Input Low Voltage
Condition
Max
2.0
V
0.8
IIH
Input High Current
VIN = VCC
IIL
Input Low Current
VIN = 0.5V
Units
75
–300
V
µA
µA
Notes:
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
February 2007
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SY89853U
AC Electrical Characteristics(6)
VCC = 2.5V ±5% or 3.3V ±10%; TA = –40°C to + 85°C, RL = 50Ω to VCC–2V, unless otherwise stated.
Symbol
Parameter
Condition
Min
fMAX
Maximum Operating Frequency
NRZ Data
2.5
Gbps
Clock, VOUT > 400mV
2.5
GHz
tpd
Typ
Max
Units
Propagation Delay
IN-to-Q
160
250
360
ps
SEL-to-Q
100
260
400
ps
tpd
Tempco
Differential Propagation Delay
Temperature Coefficient
tSKEW
Input-to-Input Skew (Within-bank)
Note 7
10
20
ps
Bank-to-Bank Skew
Note 8
12
25
ps
tJITTER
143
fs/ ºC
Data
Random Jitter (RJ)
Note 9
1
psRMS
Deterministic Jitter (DJ)
Note 10
10
psPP
Clock
Cycle-to-Cycle Jitter
Note 11
1
psRMS
Total Jitter (TJ)
Note 12
10
psPP
0.7
psRMS
180
ps
Crosstalk-Induced Jitter
Channel-to-Channel (Within-bank)
tr, tf
Output Rise/Fall Time (20% to 80%)
Note 13, within-bank
At full output swing.
50
100
Notes:
6.
High-speed AC parameters are guaranteed by design and characterization. VIN swing ≥ 100mV, unless otherwise stated.
7.
Input-to-input skew is the difference in time between two inputs to the output within a bank.
8.
Bank-to-bank skew is the difference in time from input to the output between banks.
9.
Random jitter is measured with a K28.7 character pattern, measured at <fMAX.
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10. Deterministic jitter is measured at 2.5Gbps with both K28.5 and 2 -1 PRBS pattern.
11. Cycle-to-cycle jitter definition: the variation of periods between adjacent cycles, Tn – Tn-1 where T is the time between rising edges of the
output signal.
12
12. Total jitter definition: with an ideal clock input of frequency <fMAX, no more than one output edge in 10 output edges will deviate by more than
the specified peak-to-peak jitter value.
13. Crosstalk is measured at the output while applying two similar differential clock frequencies that are asynchronous with respect to each other
at the inputs.
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SY89853U
Typical Operating Characteristics
VCC = 3.3V ±10%; TA = –40°C to + 85°C, RL = 50Ω to VCC–2V, unless otherwise stated.
February 2007
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SY89853U
Functional Characteristics
VCC = 3.3V ±10%; TA = –40°C to + 85°C, RL = 50Ω to VCC–2V, unless otherwise stated.
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SY89853U
Single-Ended and Differential Swings
Figure 1a. Single-Ended Voltage Swing
Figure 1b. Differential Voltage Swing
Timing Diagram
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SY89853U
Input and Output Stages
Figure 2b. Simplified LVPECL Output Stage
Figure 2a. Simplified Differential Input Stage
Input Interface Applications
Figure 3a. LVPECL Interface
(DC-Coupled)
Figure 3b. LVPECL Interface
(AC-Coupled)
Figure 3c. LVDS Interface
option: may connect VT to VCC.
Figure 3d. CML Interface
(DC-Coupled)
February 2007
Figure 3e. CML Interface
(AC-Coupled)
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SY89853U
Output Interface Applications
LVPECL has high input impedance, very low output
(open emitter) impedance, and small signal swing,
which result in low EMI. LVPECL is ideal for driving
50Ω and 100Ω controlled impedance transmission
lines. There are different techniques for terminating
LVPECL outputs: Parallel Termination TheveninEquivalent, Parallel Termination (3-resistor), and ACcoupled termination. Unused output pairs may be left
floating; however, single-ended outputs must be
terminated or balanced.
Note:
Note:
1. For a 2.5V system, R1 = 250Ω, R2 = 62.5 Ω.
1. For a 2.5V system, Rb = 19Ω.
2. For a 3.3V system, R1 = 130Ω, R2 = 82Ω.
2. For a 3.3V system, Rb = 50Ω.
Figure 4b. Parallel Termination
(3-Resistor)
Figure 4a. Parallel Thevenin-Equivalent
Termination
Note:
Note:
For a 2.5V system, R = 50Ω.
For a 2.5V system, R1 = 250Ω, R2 = 62.5 Ω.
Figure 4d. Parallel Thevenin-Equivalent
Termination
Figure 4c. AC-Coupled Termination
Related Product and Support Documentation
Part Number
Function
Data Sheet Link
SY58026U
5Gbps Dual 2 :1 400mV LVPECL MUX
with Internal Termination
www.micrel.com/product-info/products/sy58026u.shtml.
HBW Solutions
February 2007
MLF® Application Note
www.amkor.com/products/notes_papers/MLFAppNote.pdf
New Products and Applications
www.micrel.com/product-info/products/solutions.shtml
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SY89853U
Package Information
32-Pin MLF® (MLF-32)
PCB Thermal Consideration for 32-Pin MLF® Package
(Always solder, or equivalent, the exposed pad to the PCB)
Packages Notes:
February 2007
1.
Package meets Level 2 Moisture Sensitivity Classification.
2.
All parts are dry-packed before shipment.
3.
Exposed pads must be soldered to a ground for proper thermal management.
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SY89853U
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http:/www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for
its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a
product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for
surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant
injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk
and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale.
© 2005 Micrel, Incorporated.
February 2007
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