TI SN74ABT162244DGGR

SCBS238E − JUNE 1992 − REVISED JUNE 2004
D Members of the Texas Instruments
D
D
D
D
D
D
D
SN54ABT162244 . . . WD PACKAGE
SN74ABT162244 . . . DGG, DGV, OR DL PACKAGE
(TOP VIEW)
Widebus E Family
Output Ports Have Equivalent 25-Ω Series
Resistors, So No External Resistors Are
Required
Typical VOLP (Output Ground Bounce)
<1 V at VCC = 5 V, TA = 25°C
High-Impedance State During Power Up
and Power Down
Ioff and Power-Up 3-State Support Hot
Insertion
Distributed VCC and GND Pins Minimize
High-Speed Switching Noise
Flow-Through Architecture Optimizes PCB
Layout
Latch-Up Performance Exceeds 500 mA Per
JESD-17
1OE
1Y1
1Y2
GND
1Y3
1Y4
VCC
2Y1
2Y2
GND
2Y3
2Y4
3Y1
3Y2
GND
3Y3
3Y4
VCC
4Y1
4Y2
GND
4Y3
4Y4
4OE
description/ordering information
The ’ABT162244 devices are 16-bit buffers and
line drivers designed specifically to improve both
the performance and density of 3-state memory
address drivers, clock drivers, and bus-oriented
receivers and transmitters. These devices can be
used as four 4-bit buffers, two 8-bit buffers, or one
16-bit buffer. These devices provide noninverting
outputs
and
symmetrical
active-low
output-enable (OE) inputs.
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
2OE
1A1
1A2
GND
1A3
1A4
VCC
2A1
2A2
GND
2A3
2A4
3A1
3A2
GND
3A3
3A4
VCC
4A1
4A2
GND
4A3
4A4
3OE
The outputs, which are designed to source or sink up to 12 mA, include equivalent 25-Ω series resistors to
reduce overshoot and undershoot.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
TA
TOP-SIDE
MARKING
Tube
SN74ABT162244DL
Tape and reel
SN74ABT162244DLR
TSSOP − DGG
Tape and reel
SN74ABT162244DGGR
ABT162244
TVSOP − DGV
Tape and reel
SN74ABT162244DGVR
AH2244
SSOP − DL
−40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
ABT162244
−55°C to 125°C
CFP − WD
Tube
SNJ54ABT162244WD
SNJ54ABT162244WD
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
Copyright  2004, Texas Instruments Incorporated
!"#$ % &'!!($ #% )'*+&#$ ,#$(!,'&$% &!" $ %)(&&#$% )(! $.( $(!"% (/#% %$!'"($%
%$#,#!, 0#!!#$1- !,'&$ )!&(%%2 ,(% $ (&(%%#!+1 &+',(
$(%$2 #++ )#!#"($(!%-
)!,'&$% &")+#$ $ 345 #++ )#!#"($(!% #!( $(%$(,
'+(%% $.(!0%( $(,- #++ $.(! )!,'&$% )!,'&$
)!&(%%2 ,(% $ (&(%%#!+1 &+',( $(%$2 #++ )#!#"($(!%-
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCBS238E − JUNE 1992 − REVISED JUNE 2004
description/ordering information (continued)
These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the devices when they are powered down.
The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
FUNCTION TABLE
(each 4-bit buffer)
INPUTS
OE
A
OUTPUT
Y
L
H
H
L
L
L
H
X
Z
logic diagram (positive logic)
1OE
1A1
1A2
1A3
1A4
2OE
2A1
2A2
2A3
2A4
2
1
3OE
47
2
46
3
44
5
43
6
1Y1
3A1
1Y2
3A2
1Y3
3A3
1Y4
3A4
48
4OE
41
8
40
9
38
11
37
12
2Y1
4A1
2Y2
4A2
2Y3
4A3
2Y4
4A4
POST OFFICE BOX 655303
25
36
13
35
14
33
16
32
17
3Y1
3Y2
3Y3
3Y4
24
30
19
29
20
27
22
26
23
• DALLAS, TEXAS 75265
4Y1
4Y2
4Y3
4Y4
SCBS238E − JUNE 1992 − REVISED JUNE 2004
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high or power-off state, VO . . . . . . . . . . . . . . . . . . . −0.5 V to 5.5 V
Current into any output in the low state, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −18 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Package thermal impedance, θJA (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54ABT162244
SN74ABT162244
MIN
MAX
MIN
MAX
4.5
5.5
4.5
5.5
UNIT
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
IOH
IOL
High-level output current
VCC
−3
Low-level output current
8
12
mA
∆t /∆v
Input transition rise or fall rate
10
10
ns/V
∆t/∆VCC
TA
Power-up ramp rate
200
Operating free-air temperature
−55
High-level input voltage
2
2
0.8
Input voltage
0
Outputs enabled
0
V
0.8
V
VCC
−12
V
−40
mA
µs/V
200
125
V
85
°C
NOTES: 3. All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCBS238E − JUNE 1992 − REVISED JUNE 2004
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
TEST CONDITIONS
VCC = 4.5 V,
VCC = 4.5 V,
II = −18 mA
IOH = −1 mA
VCC = 5 V,
VCC = 4.5 V
VOL
VCC = 4.5 V
Vhys
II
MIN
TA = 25°C
TYP† MAX
SN54ABT162244
MIN
−1.2
MAX
SN74ABT162244
MIN
−1.2
−1.2
3.35
3.35
3.35
IOH = −1 mA
IOH = −3 mA
3.85
3.85
3.85
3.1
3.1
3.1
IOH = −12 mA
IOL = 8 mA
2.6*
UNIT
V
V
2.6
0.4
IOL = 12 mA
0.8
0.65
0.8*
0.8
100
VCC = 0 to 5.5 V, VI = VCC or GND
VCC = 0 to 2.1 V,
VO = 0.5 V to 2.7 V, OE = X
IOZPU
V
mV
±1
±1
±1
µA
±50
±50
±50
µA
±50
±50
±50
µA
IOZPD
VCC = 2.1 V to 0,
VO = 0.5 V to 2.7 V, OE = X
IOZH
VCC = 2.1 V to 5.5 V,
VO = 2.7 V, OE ≥ 2 V
10
10
10
µA
IOZL
VCC = 2.1 V to 5.5 V,
VO = 0.5 V, OE ≥ 2 V
−10
−10
−10
µA
±100
µA
50
µA
−100
mA
VCC = 0, VI or VO ≤ 4.5 V
VCC = 5.5 V,
Outputs high
VO = 5.5 V
Ioff
ICEX
IO
VCC = 5.5 V,
VCC = 5.5 V,
IO = 0,
VI = VCC or GND
ICC‡
Data inputs
∆ICC§
Control inputs
Ci
Co
VCC = 5.5 V,
One input at 3.4 V,
Other inputs at
VCC or GND
VO = 2.5 V
Outputs high
±100
50
−25
−55
−100
50
−25
−100
−25
2
2
2
30
30
30
Outputs disabled
2
2
2
Outputs enabled
50
50
50
Outputs disabled
50
50
50
50
50
50
Outputs low
VCC = 5.5 V, One input at 3.4 V,
Other inputs at VCC or GND
VI = 2.5 V or 0.5 V
VO = 2.5 V or 0.5 V
POST OFFICE BOX 655303
mA
µA
3
pF
8
pF
* On products compliant to MIL-PRF-38535, this parameter does not apply.
† All typical values are at VCC = 5 V.
‡ Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
§ This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
4
MAX
• DALLAS, TEXAS 75265
SCBS238E − JUNE 1992 − REVISED JUNE 2004
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
SN54ABT162244
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
Y
tPZH
tPZL
OE
Y
tPHZ
tPLZ
OE
Y
VCC = 5 V,
TA = 25°C
MIN
MAX
MIN
TYP
MAX
1
2.5
3.6
1
4.1
1
3.1
4.7
1
5.3
1
3.2
4.8
1
5.6
1
3.2
4.7
1
5.5
1
3.2
5.3
1
6.3
1
3.1
4.6
1
4.9
UNIT
ns
ns
ns
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
SN74ABT162244
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
Y
tPZH
tPZL
OE
Y
tPHZ
tPLZ
OE
Y
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
VCC = 5 V,
TA = 25°C
MIN
MAX
MIN
TYP
MAX
1
2.5
3.2
1
3.9
1
3.1
4
1
4.8
1
3.2
4.2
1
5.4
1
3.2
4.1
1
5.1
1
3.2
4
1
4.6
1
3.1
3.9
1
4.5
UNIT
ns
ns
ns
5
SCBS238E − JUNE 1992 − REVISED JUNE 2004
PARAMETER MEASUREMENT INFORMATION
500 Ω
From Output
Under Test
S1
7V
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
7V
Open
3V
LOAD CIRCUIT
Timing Input
1.5 V
0V
tw
tsu
3V
th
3V
Input
1.5 V
1.5 V
0V
Data Input
1.5 V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
3V
1.5 V
Input
1.5 V
0V
VOH
1.5 V
Output
1.5 V
VOL
VOH
1.5 V
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
1.5 V
0V
tPZL
tPLZ
Output
Waveform 1
S1 at 7 V
(see Note B)
tPLH
tPHL
Output
3V
Output
Control
tPHL
tPLH
1.5 V
Output
Waveform 2
S1 at Open
(see Note B)
1.5 V
3.5 V
VOL + 0.3 V
VOL
tPHZ
tPZH
1.5 V
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
6-Aug-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
1
5962-9458701QXA
ACTIVE
CFP
WD
48
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ABT162244DGVRE4
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ABT162244DGVRG4
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ABT162244DLRG4
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT162244DGGR
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT162244DGVR
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT162244DL
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT162244DLG4
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT162244DLR
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54ABT162244WD
ACTIVE
CFP
WD
48
TBD
A42 SNPB
MSL Peak Temp (3)
74ABT162244DGGRE4
1
TBD
Lead/Ball Finish
A42 SNPB
N / A for Pkg Type
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jul-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
16-Jul-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74ABT162244DGGR
DGG
48
MLA
330
24
8.6
15.8
1.8
12
24
Q1
SN74ABT162244DGVR
DGV
48
MLA
330
24
6.8
10.1
1.6
12
24
Q1
SN74ABT162244DLR
DL
48
MLA
330
32
11.35
16.2
3.1
16
32
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74ABT162244DGGR
DGG
48
MLA
333.2
333.2
31.75
SN74ABT162244DGVR
DGV
48
MLA
333.2
333.2
31.75
SN74ABT162244DLR
DL
48
MLA
346.0
346.0
49.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jul-2007
Pack Materials-Page 3
MECHANICAL DATA
MCFP010B – JANUARY 1995 – REVISED NOVEMBER 1997
WD (R-GDFP-F**)
CERAMIC DUAL FLATPACK
48 LEADS SHOWN
0.120 (3,05)
0.075 (1,91)
0.009 (0,23)
0.004 (0,10)
1.130 (28,70)
0.870 (22,10)
0.370 (9,40)
0.250 (6,35)
0.390 (9,91)
0.370 (9,40)
0.370 (9,40)
0.250 (6,35)
48
1
0.025 (0,635)
A
0.014 (0,36)
0.008 (0,20)
25
24
NO. OF
LEADS**
48
56
A MAX
0.640
(16,26)
0.740
(18,80)
A MIN
0.610
(15,49)
0.710
(18,03)
4040176 / D 10/97
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification only
Falls within MIL STD 1835: GDFP1-F48 and JEDEC MO -146AA
GDFP1-F56 and JEDEC MO -146AB
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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