Order this document by MPX100/D SEMICONDUCTOR TECHNICAL DATA The MPX100 series device is a silicon piezoresistive pressure sensor providing a very accurate and linear voltage output — directly proportional to the applied pressure. This standard, low cost, uncompensated sensor permits manufacturers to design and add their own external temperature compensating and signal conditioning networks. Compensation techniques are simplified because of the predictability of Motorola’s single element strain gauge design. 0 to 100 kPa (0 – 14.5 psi) 60 mV FULL SCALE SPAN (TYPICAL) Features • Low Cost • Patented, Silicon Shear Stress Strain Gauge Design • Easy to Use Chip Carrier Package Options • Ratiometric to Supply Voltage • 60 mV Span (Typ) • Absolute, Differential and Gauge Options • ± 0.25% Linearity (Max) BASIC CHIP CARRIER ELEMENT CASE 344–15, STYLE 1 Application Examples • Pump/Motor Controllers • Robotics • Level Indicators • Medical Diagnostics • Pressure Switching • Barometers • Altimeters Figure 1 illustrates a schematic of the internal circuitry on the stand–alone pressure sensor chip. PIN 3 + VS PIN 2 + Vout X–ducer DIFFERENTIAL PORT OPTION CASE 344C–01, STYLE 1 NOTE: Pin 1 is the notched pin. PIN NUMBER 1 Gnd 3 VS 2 +Vout 4 –Vout PIN 4 – Vout PIN 1 Figure 1. Uncompensated Pressure Sensor Schematic VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the X–ducer is directly proportional to the differential pressure applied. The absolute sensor has a built–in reference vacuum. The output voltage will decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure (P1) side relative to the vacuum (P2) side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum (P2) side relative to the pressure (P1) side. X–ducer is a trademark of Motorola, Inc. REV 6 Motorola Sensor Device Data Motorola, Inc. 1998 1 MAXIMUM RATINGS Rating Overpressure(8) (P1 > P2) Burst Pressure(8) (P1 > P2) Storage Temperature Operating Temperature Symbol Value Unit Pmax 200 kPa Pburst 1000 kPa Tstg – 40 to +125 °C TA – 40 to +125 °C OPERATING CHARACTERISTICS (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 100 kPa Supply Voltage(2) VS — 3.0 6.0 Vdc Supply Current Io — 6.0 — mAdc VFSS 45 60 90 mV Voff 0 20 35 mV Sensitivity ∆V/∆P — 0.6 — mV/kPa Linearity(5) — – 0.25 — 0.25 %VFSS Pressure Hysteresis(5) (0 to 100 kPa) — — ± 0.1 — %VFSS Temperature Hysteresis(5) (– 40°C to +125°C) — — ± 0.5 — %VFSS Temperature Coefficient of Full Scale Span(6) TCVFSS – 0.22 — – 0.16 %VFSS/°C TCVoff — ±15 — µV/°C TCR 0.21 — 0.27 %Zin/°C Zin 400 — 550 Ω Characteristic Full Scale Span(3) Offset(4) Temperature Coefficient of Offset(5) Temperature Coefficient of Resistance(5) Input Impedance Zout 750 — 1875 Ω Response Time(6) (10% to 90%) tR — 1.0 — ms Warm–Up — — 20 — ms Offset Stability(9) — — ± 0.5 — %VFSS Output Impedance MECHANICAL CHARACTERISTICS Symbol Min Typ Max Unit Weight (Basic Element Case 344–15) Characteristic — — 2.0 — Grams Common Mode Line Pressure(7) — — — 690 kPa NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. • TCR: Zin deviation with minimum rated pressure applied, over the temperature range of – 40°C to +125°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Common mode pressures beyond specified may result in leakage at the case–to–lead interface. 8. Exposure beyond these limits may cause permanent damage or degradation to the device. 9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. 2 Motorola Sensor Device Data LINEARITY Linearity refers to how well a transducer’s output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range (see Figure 2). There are two basic methods for calculating nonlinearity: (1) end point straight line fit or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worse case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. TEMPERATURE COMPENSATION Figure 3 shows the typical output characteristics of the MPX100 series over temperature. The X–ducer piezoresistive pressure sensor element is a semiconductor device which gives an electrical output signal proportional to the pressure applied to the device. This device uses a unique transverse voltage diffused semiconductor strain gauge which is sensitive to stresses produced in a thin silicon diaphragm by the applied pressure. Because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors. However, the properties of the strain gauge itself are temperature dependent, requiring that the device be temperature compensated if it is to be used over an extensive temperature range. Temperature compensation and offset calibration can be achieved rather simply with additional resistive components or by designing your system using the MPX2100 series sensors. Several approaches to external temperature compensation over both – 40 to +125°C and 0 to + 80°C ranges are presented in Motorola Applications Note AN840. 70 LINEARITY 60 70 VS = 3.0 Vdc P1 > P2 60 ACTUAL 40 SPAN (VFSS) 30 THEORETICAL 20 OUTPUT (mVdc) OUTPUT (mVdc) 50 – 40°C +25°C 50 +125°C 40 30 20 OFFSET (TYP) 10 10 OFFSET (VOFF) 0 0 MAX POP 0 PSI kPa 0 PRESSURE (kPA) WIRE BOND 2.0 4.0 6.0 8.0 10 10 20 30 40 50 60 70 12 14 16 80 90 100 PRESSURE DIFFERENTIAL Figure 2. Linearity Specification Comparison SILICONE GEL DIE COAT SPAN RANGE (TYP) Figure 3. Output versus Pressure Differential DIFFERENTIAL/GAUGE STAINLESS STEEL DIE METAL COVER P1 EPOXY CASE ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ LEAD FRAME DIFFERENTIAL/GAUGE ELEMENT P2 DIE BOND SILICONE GEL ABSOLUTE DIE COAT DIE P1 STAINLESS STEEL METAL COVER EPOXY CASE ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ WIRE BOND LEAD FRAME ABSOLUTE ELEMENT P2 DIE BOND Figure 4. Cross–Sectional Diagrams (Not to Scale) Figure 4 illustrates the absolute sensing configuration (right) and the differential or gauge configuration in the basic chip carrier (Case 344–15). A silicone gel helps protect the die surface and wire bond from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. Motorola Sensor Device Data The MPX100 series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. 3 PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The differential or gauge sensor is designed to operate with positive differential Part Number pressure applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side. The Pressure (P1) side may be identified by using the table below: Case Type Pressure (P1) Side Identifier MPX100A, MPX100D 344–15C Stainless Steel Cap MPX100DP 344C–01 Side with Part Marking MPX100AP, MPX100GP 344B–01 Side with Port Attached MPX100AS 344E–01 Side with Port Attached MPX100ASX 344F–01 Side with Port Attached ORDERING INFORMATION MPX100 series pressure sensors are available in absolute, differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. Device Type Options Case Type MPX Series Device Marking Basic Element Absolute, Differential Case 344–15 MPX100A MPX100D MPX100A MPX100D Ported Elements Differential Case 344C–01 MPX100DP MPX100DP Absolute, Gauge Case 344B–01 MPX100AP MPX100GP MPX100AP MPX100GP Absolute, Gauge Stove Pipe Case 344E–01 MPX100AS MPX100GS MPX100A MPX100D Absolute, Gauge Axial Case 344F–01 MPX100ASX MPX100GSX MPX100A MPX100D 4 Motorola Sensor Device Data PACKAGE DIMENSIONS C R M 1 B 2 –A– Z 4 3 DIM A B C D F G J L M N R Y Z N 1 PIN 1 2 3 L 4 –T– SEATING PLANE J F G F D Y 4 PL 0.136 (0.005) M T A DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. “F” 8 PL M NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION –A– IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). INCHES MIN MAX 0.595 0.630 0.514 0.534 0.200 0.220 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 30 _ NOM 0.475 0.495 0.430 0.450 0.048 0.052 0.106 0.118 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 15.11 16.00 13.06 13.56 5.08 5.59 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.40 17.65 18.42 30 _ NOM 12.07 12.57 10.92 11.43 1.22 1.32 2.68 3.00 GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344–15 ISSUE Z SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: INCH. –A– –T– U L R H N PORT #1 POSITIVE PRESSURE (P1) –Q– B 1 2 3 4 PIN 1 K –P– 0.25 (0.010) J M T Q S S F C G D 4 PL 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.230 0.250 0.220 0.240 0.910 BSC STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344B–01 ISSUE B Motorola Sensor Device Data 5 PACKAGE DIMENSIONS — CONTINUED PORT #1 R NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. –A– U V W L H PORT #2 N PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) –Q– B SEATING PLANE SEATING PLANE 1 2 3 4 PIN 1 K –P– –T– 0.25 (0.010) –T– M T Q S S F J G D 4 PL C 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U V W INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.248 0.278 0.310 0.330 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 6.30 7.06 7.87 8.38 GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344C–01 ISSUE B PORT #1 POSITIVE PRESSURE (P1) –B– C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A BACK SIDE VACUUM (P2) DIM A B C D F G J K N R S V V 4 3 2 1 PIN 1 K J N R SEATING PLANE S –T– INCHES MIN MAX 0.690 0.720 0.245 0.255 0.780 0.820 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.345 0.375 0.300 0.310 0.178 0.186 0.220 0.240 0.182 0.194 MILLIMETERS MIN MAX 17.53 18.28 6.22 6.48 19.81 20.82 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.41 8.76 9.53 7.62 7.87 4.52 4.72 5.59 6.10 4.62 4.93 G F D 4 PL 0.13 (0.005) M T B M STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344E–01 ISSUE B 6 Motorola Sensor Device Data PACKAGE DIMENSIONS — CONTINUED –T– C A E –Q– U N V B R PORT #1 POSITIVE PRESSURE (P1) PIN 1 –P– 0.25 (0.010) M T Q M 4 3 2 1 S K J F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MIN MAX 1.080 1.120 0.740 0.760 0.630 0.650 0.016 0.020 0.160 0.180 0.048 0.064 0.100 BSC 0.014 0.016 0.220 0.240 0.070 0.080 0.150 0.160 0.150 0.160 0.440 0.460 0.695 0.725 0.840 0.860 0.182 0.194 MILLIMETERS MIN MAX 27.43 28.45 18.80 19.30 16.00 16.51 0.41 0.51 4.06 4.57 1.22 1.63 2.54 BSC 0.36 0.41 5.59 6.10 1.78 2.03 3.81 4.06 3.81 4.06 11.18 11.68 17.65 18.42 21.34 21.84 4.62 4.92 G D 4 PL 0.13 (0.005) M T P S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (–) OUT CASE 344F–01 ISSUE B Motorola Sensor Device Data 7 Motorola reserves the right to make changes without further notice to any products herein. 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