ONSEMI MBR230LSFT1G

MBR230LSFT1
Surface Mount
Schottky Power Rectifier
Plastic SOD-123 Package
This device uses the Schottky Barrier principle with a large area
metal-to-silicon power diode. Ideally suited for low voltage, high
frequency rectification or as free wheeling and polarity protection
diodes in surface mount applications where compact size and weight
are critical to the system. This package also provides an easy to work
with alternative to leadless 34 package style. Because of its small size,
it is ideal for use in portable and battery powered products such as
cellular and cordless phones, chargers, notebook computers, printers,
PDAs and PCMCIA cards. Typical applications are AC-DC and
DC-DC converters, reverse battery protection, and “Oring” of
multiple supply voltages and any other application where performance
and size are critical.
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SCHOTTKY BARRIER
RECTIFIER
2.0 AMPERES, 30 VOLTS
Features
SOD-123FL
CASE 498
PLASTIC
•Guardring for Stress Protection
•Low Forward Voltage
•125°C Operating Junction Temperature
•Epoxy Meets UL 94 V-0
•Package Designed for Optimal Automated Board Assembly
•ESD Ratings: Machine Model, C
MARKING DIAGRAM
Human Body Model, 3B
L3N MG
G
•This is a Pb-Free Device
Mechanical Characteristics
•Reel Options: MBR230LSFT1 = 3,000 per 7 in reel/8 mm tape
•Device Marking: L3N
•Polarity Designator: Cathode Band
•Weight: 11.7 mg (approximately)
•Case: Epoxy, Molded
•Lead Finish: 100% Matte Sn (Tin)
•Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
•Device Meets MSL 1 Requirements
L3N = Specific Device Code
M
= Date Code
G
= Pb-Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
MBR230LSFT1G SOD-123FL
(Pb-Free)
Shipping†
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2007
May, 2007 - Rev. 0
1
Publication Order Number:
MBR230LSFT1/D
MBR230LSFT1
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VRRM
VRWM
VR
30
V
IO
2.0
A
Peak Repetitive Forward Current
(At Rated VR, Square Wave, 100 kHz, TL = 95°C)
IFRM
4.0
A
Non-Repetitive Peak Surge Current
(Non-Repetitive peak surge current, halfwave, single phase, 60 Hz)
IFSM
40
A
Storage Temperature
Tstg
-55 to 150
°C
Operating Junction Temperature
TJ
-55 to 125
°C
dv/dt
10,000
V/ms
Rtjl
Rtjl
Rtja
Rtja
26
21
325
82
°C/W
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current (At Rated VR, TL = 105°C)
Voltage Rate of Change (Rated VR, TJ = 25°C)
THERMAL CHARACTERISTICS
Thermal
Thermal
Thermal
Thermal
Resistance,
Resistance,
Resistance,
Resistance,
Junction-to-Lead (Note 1)
Junction-to-Lead (Note 2)
Junction-to-Ambient (Note 1)
Junction-to-Ambient (Note 2)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Mounted with minimum recommended pad size, PC Board FR4.
2. Mounted with 1 in. copper pad (Cu area 700 mm2).
ELECTRICAL CHARACTERISTICS
VF
Maximum Instantaneous Forward Voltage (Note 3)
(IF = 1.0 A)
(IF = 2.0 A)
IR
Maximum Instantaneous Reverse Current (Note 3)
(VR = 30 V)
3. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2%.
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2
TJ = 25°C
TJ = 100°C
0.38
0.43
0.30
0.37
TJ = 25°C
TJ = 100°C
1.0
25
V
mA
MBR230LSFT1
TYPICAL CHARACTERISTICS
TJ = 125°C
TJ = 100°C
TJ = 25°C
TJ = -55°C
0.1
0.10
0.20
0.30
0.40
0.50
0.60
0.70
1 T = 125°C
J
TJ = 100°C
0.1
0.10
0.80
0.20
0.30
0.40
0.50
0.60
VF, MAXIMUM INSTANTANEOUS FORWARD
VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
TJ = 125°C
10E-3
TJ = 25°C
10E-6
1E-6
TJ = -55°C
100E-9
TJ = 125°C
10E-3
TJ = 100°C
1E-3
TJ = 25°C
100E-6
10E-9
1E-9
0
10
20
VR, REVERSE VOLTAGE (VOLTS)
30
TJ = -55°C
10E-6
0
3.5
dc
3
2.5
freq = 20 kHz
square wave
Ipk/IO = p
Ipk/IO = 5
1.5
1
0.5
0
25
35
45
55
65
75
85
95
10
20
VR, REVERSE VOLTAGE (VOLTS)
30
Figure 4. Maximum Reverse Current
105 115
125
TL, LEAD TEMPERATURE (°C)
PFO, AVERAGE POWER DISSIPATION (WATTS)
Figure 3. Typical Reverse Current
2
0.70
1E+0
100E-3
TJ = 100°C
1E-3
100E-6
IO, AVERAGE FORWARD CURRENT (AMPS)
TJ = -55°C
TJ = 25°C
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
100E-3
IR, REVERSE CURRENT (AMPS)
IF, INSTANTANEOUS FORWARD
CURRENT (AMPS)
1
10
IR, MAXIMUM REVERSE CURRENT (AMPS)
IF, INSTANTANEOUS FORWARD
CURRENT (AMPS)
10
1.6
1.4
dc
square wave
Ipk/IO = p
1.2
1.0
Ipk/IO = 5
0.8
0.6
0.4
0.2
0
0
0.5
1.0
1.5
2.0
2.5
3.0
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 6. Forward Power Dissipation
Figure 5. Current Derating
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3
3.5
MBR230LSFT1
C, CAPACITANCE (pF)
1000
TJ, DERATED OPERATING TEMPERATURE (°C)
TYPICAL CHARACTERISTICS
TJ = 25 °C
100
10
0
5
10
15
20
25
VR, REVERSE VOLTAGE (VOLTS)
30
125
120
RqJA = 25.6 °C/W
115
110
105
100
RqJA = 130 °C/W
95
90
RqJA = 235 °C/W
85
80
75
70
65
RqJA = 324.9 °C/W
RqJA = 400 °C/W
0
r(t), TRANSIENT THERMAL RESISTANCE
Figure 7. Capacitance
2
4
6
8
10 12
14 16
VR, DC REVERSE VOLTAGE (VOLTS)
18
20
Figure 8. Typical Operating Temperature
Derating
1000
D = 0.5
100
0.2
0.1
0.05
P(pk)
10
0.01
t1
t2
1
DUTY CYCLE, D = t1/t2
SINGLE PULSE
qJA = 321.8 °C/W
Test Type > Min Pad < Die Size 38x38 @ 75% mils
0.1
0.000001 0.00001
0.0001
0.001
0.1
0.01
t1, TIME (sec)
Figure 9. Thermal Response
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4
1
10
100
1000
MBR230LSFT1
PACKAGE DIMENSIONS
SOD-123LF
CASE 498-01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.
4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT
SECTION OF THE LEAD: BETWEEN 0.10 AND 0.25 MM
FROM THE LEAD TIP.
E
q
D
DIM
A
A1
b
c
D
E
L
HE
q
A1
POLARITY INDICATOR
OPTIONAL AS NEEDED
A
L
b
MIN
0.90
0.00
0.70
0.10
1.50
2.50
0.55
3.40
0°
MILLIMETERS
NOM
MAX
0.95
1.00
0.05
0.10
0.90
1.10
0.15
0.20
1.65
1.80
2.70
2.90
0.75
0.95
3.60
3.80
8°
-
MIN
0.035
0.000
0.028
0.004
0.059
0.098
0.022
0.134
0°
INCHES
NOM
0.037
0.002
0.035
0.006
0.065
0.106
0.030
0.142
-
MAX
0.039
0.004
0.043
0.008
0.071
0.114
0.037
0.150
8°
HE
q
c
SOLDERING FOOTPRINT*
ÉÉ
ÉÉ
ÉÉ
0.91
0.036
ÉÉ
ÉÉ
ÉÉ
2.36
0.093
4.19
0.165
1.22
0.048
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 81-3-5773-3850
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ON Semiconductor Website: www.onsemi.com
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For additional information, please contact your local
Sales Representative
MBR230LSFT1/D