TI SN74AHCT245DW

SCLS233N − OCTOBER 1995 − REVISED MARCH 2005
D Inputs Are TTL-Voltage Compatible
D Latch-Up Performance Exceeds 250 mA Per
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
A1
A2
A3
A4
A5
A6
A7
A8
1
20
A2
A1
DIR
VCC
VCC
VCC
OE
B1
B2
B3
B4
B5
B6
B7
B8
SN54AHCT245 . . . FK PACKAGE
(TOP VIEW)
A3
A4
A5
A6
A7
19 OE
18 B1
2
3
17 B2
16 B3
4
5
15 B4
14 B5
6
7
13 B6
12 B7
8
9
10
11
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
B1
B2
B3
B4
B5
A8
GND
B8
B7
B6
2
20
B8
1
DIR
DIR
A1
A2
A3
A4
A5
A6
A7
A8
GND
SN74AHCT245 . . . RGY PACKAGE
(TOP VIEW)
GND
SN54AHCT245 . . . J OR W PACKAGE
SN74AHCT245 . . . DB, DGV, DW, N, NS,
OR PW PACKAGE
(TOP VIEW)
OE
JESD 17
description/ordering information
These octal bus transceivers are designed for asynchronous two-way communication between data buses. The
control-function implementation minimizes external timing requirements.
The ’AHCT245 devices allow data transmission from the A bus to the B bus or from the B bus to the A bus,
depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to
disable the device so that the buses effectively are isolated.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
Tube
SN74AHCT245N
SN74AHCT245N
QFN − RGY
Tape and reel
SN74AHCT245RGYR
HB245
Tube
SN74AHCT245DW
Tape and reel
SN74AHCT245DWR
SOP − NS
Tape and reel
SN74AHCT245NSR
AHCT245
SSOP − DB
Tape and reel
SN74AHCT245DBR
HB245
Tube
SN74AHCT245PW
Tape and reel
SN74AHCT245PWR
TVSOP − DGV
Tape and reel
SN74AHCT245DGVR
HB245
CDIP − J
Tube
SNJ54AHCT245J
SNJ54AHCT245J
CFP − W
Tube
SNJ54AHCT245W
SNJ54AHCT245W
LCCC − FK
Tube
SNJ54AHCT245FK
SNJ54AHCT245FK
TSSOP − PW
−55°C
−55
C to 125
125°C
C
TOP-SIDE
MARKING
PDIP − N
SOIC − DW
−40°C
−40
C to 85
85°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
AHCT245
HB245
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2005, Texas Instruments Incorporated
! " #$%! " &$'(#! )!%*
)$#!" # ! "&%##!" &% !+% !%" %," "!$%!"
"!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)%
!%"!/ (( &%!%"*
&)$#!" #&(! ! 012
(( &%!%" % !%"!%)
$(%"" !+%-"% !%)* (( !+% &)$#!"
&)$#!
&#%""/ )%" ! %#%""(. #($)% !%"!/ (( &%!%"*
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCLS233N − OCTOBER 1995 − REVISED MARCH 2005
FUNCTION TABLE
(each transceiver)
INPUTS
OPERATION
OE
DIR
L
L
B data to A bus
L
H
A data to B bus
H
X
Isolation
logic diagram (positive logic)
DIR
1
19
A1
OE
2
18
B1
To Seven Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1): Control inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
I/O, Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0): Control inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
I/O, Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±75 mA
Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
(see Note 2): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W
(see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
(see Note 2): N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
(see Note 2): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
(see Note 2): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
(see Note 3): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3. The package thermal impedance is calculated in accordance with JESD 51-5.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCLS233N − OCTOBER 1995 − REVISED MARCH 2005
recommended operating conditions (see Note 4)
SN54AHCT245
SN74AHCT245
MIN
MAX
MIN
MAX
4.5
5.5
4.5
5.5
UNIT
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
0.8
V
Input voltage
0
5.5
0
5.5
V
VO
IOH
Output voltage
0
0
VCC
−8
V
High-level output current
VCC
−8
mA
IOL
∆t/∆v
Low-level output current
8
8
mA
20
20
ns/V
High-level input voltage
2
2
0.8
Input transition rise or fall rate
V
V
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
VOH
IOH = −50 mA
IOH = −8 mA
4.5 V
VOL
IOL = 50 mA
IOL = 8 mA
4.5 V
II
OE or DIR
VI = 5.5 V or GND
IOZ
A or B inputs†
VO = VCC or GND
ICC
VI = VCC or GND,
One input at 3.4 V,
Other inputs at
VCC or GND
∆ICC‡
Ci
OE or DIR
VI = VCC or GND
VI = VCC or GND
MIN
4.4
IO = 0
TA = 25°C
TYP
MAX
4.5
3.94
SN54AHCT245
MIN
MAX
SN74AHCT245
MIN
4.4
4.4
3.8
3.8
MAX
UNIT
V
0.1
0.1
0.1
0.36
0.44
0.44
0 V to 5.5 V
±0.1
±1*
±1
mA
5.5 V
±0.25
±2.5
±2.5
mA
5.5 V
4
40
40
mA
5.5 V
1.35
1.5
1.5
mA
10
pF
5V
2.5
10
Cio A or B inputs
5V
4
* On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
† For I/O ports, the parameter IOZ includes the input leakage current.
‡ This is the increase in supply current for each input at one of the specified TTL voltage levels, rather than 0 V or VCC.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
V
pF
3
SCLS233N − OCTOBER 1995 − REVISED MARCH 2005
switching characteristics over recommended operating
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
tPLH
tPHL
A or B
B or A
CL = 15 pF
tPZH
tPZL
OE
A or B
CL = 15 pF
tPHZ
tPLZ
OE
A or B
CL = 15 pF
tPLH
tPHL
A or B
B or A
CL = 50 pF
tPZH
tPZL
OE
A or B
CL = 50 pF
tPHZ
tPLZ
OE
A or B
CL = 50 pF
MIN
TA = 25°C
TYP
MAX
free-air
temperature
SN54AHCT245
range,
SN74AHCT245
MIN
MAX
MIN
MAX
4.5**
7.7**
1**
10**
1
8.5
4.5**
7.7**
1**
10**
1
8.5
8.9**
13.8**
1**
16**
1
15
8.9**
13.8**
1**
16**
1
15
9.2**
14.4**
1**
16.5**
1
15.5
9.2**
14.4**
1**
16.5**
1
15.5
5.3
8.7
1
11
1
9.5
5.3
8.7
1
11
1
9.5
9.7
14.8
1
17
1
16
9.7
14.8
1
17
1
16
10
15.4
1
17.5
1
16.5
10
15.4
1
17.5
1
16.5
tsk(o)
CL = 50 pF
** On products compliant to MIL-PRF-38535, this parameter is not production tested.
*** On products compliant to MIL-PRF-38535, this parameter does not apply.
1***
1
UNIT
ns
ns
ns
ns
ns
ns
ns
noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°C (see Note 5)
SN74AHCT245
PARAMETER
VOH(V)
VIH(D)
MIN
TYP
Quiet output, minimum dynamic VOH
MAX
4
High-level dynamic input voltage
V
2
VIL(D)
Low-level dynamic input voltage
NOTE 5: Characteristics are for surface-mount packages only.
UNIT
V
0.8
V
TYP
UNIT
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
4
TEST CONDITIONS
Power dissipation capacitance
No load,
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
f = 1 MHz
13
pF
SCLS233N − OCTOBER 1995 − REVISED MARCH 2005
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
Test
Point
RL = 1 kΩ
From Output
Under Test
S1
VCC
Open
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
3V
1.5 V
Timing Input
0V
tw
3V
1.5 V
Input
1.5 V
th
tsu
3V
1.5 V
Data Input
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
1.5 V
Input
1.5 V
0V
tPLH
In-Phase
Output
tPHL
50% VCC
tPHL
Out-of-Phase
Output
VOH
50% VCC
VOL
Output
Waveform 1
S1 at VCC
(see Note B)
VOH
50% VCC
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
1.5 V
0V
tPZL
tPLZ
≈VCC
50% VCC
tPZH
tPLH
50% VCC
3V
Output
Control
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
tPHZ
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SCLS233N − OCTOBER 1995 − REVISED MARCH 2005
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-9681901Q2A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
5962-9681901QRA
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
1
TBD
Call TI
Level-NC-NC-NC
TBD
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
5962-9681901QSA
ACTIVE
CFP
W
20
SN74AHCT245DBLE
OBSOLETE
SSOP
DB
20
SN74AHCT245DBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT245DBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT245DGVR
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT245DGVRE4
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT245DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT245DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT245DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT245N
ACTIVE
PDIP
N
20
CU NIPDAU
Level-NC-NC-NC
SN74AHCT245NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT245NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT245PW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT245PWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT245PWLE
OBSOLETE
TSSOP
PW
20
TBD
Call TI
SN74AHCT245PWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT245PWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT245PWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT245RGYR
ACTIVE
QFN
RGY
20
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74AHCT245RGYRG4
ACTIVE
QFN
RGY
20
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SNJ54AHCT245FK
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54AHCT245J
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54AHCT245W
ACTIVE
CFP
W
20
1
TBD
Call TI
Level-NC-NC-NC
20
(1)
Pb-Free
(RoHS)
Call TI
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
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• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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