TI MAX3222ECPW

•
•
•
•
•
•
•
•
ESD Protection for RS-232 Bus Pins
– ±15-kV Human-Body Model (HBM)
– ±8-kV IEC61000-4-2, Contact Discharge
– ±15-kV IEC61000-4-2, Air-Gap Discharge
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
Operates With 3-V to 5.5-V VCC Supply
Operates up to 500 kbit/s
Two Drivers and Two Receivers
Low Standby Current . . . 1 µA Typ
External Capacitors . . . 4 × 0.1 µF
Accepts 5-V Logic Input With 3.3-V Supply
Alternative High-Speed Pin-Compatible Device
(1 Mbit/s) for SNx5C3222E
DB, DW, OR PW PACKAGE
(TOP VIEW)
EN
C1+
V+
C1−
C2+
C2−
V−
DOUT2
RIN2
ROUT2
1
20
2
3
19
18
4
17
5
16
6
7
15
14
8
9
13
12
10
11
RHL PACKAGE
(TOP VIEW)
1
24
APPLICATIONS
DESCRIPTION/ORDERING INFORMATION
The MAX3222E consists of two line drivers, two line
receivers, and a dual charge-pump circuit with ±15-kV
ESD protection pin to pin (serial-port connection pins,
including GND).
The device meets the requirements of TIA/EIA-232-F
and provides the electrical interface between an
asynchronous communication controller and the
serial-port connector. The charge pump and four
small external capacitors allow operation from a
single 3-V to 5.5-V supply. The device operates at
typical data signaling rates up to 500 kbit/s and a
maximum of 30-V/µs driver output slew rate.
C1+
NC
V+
C1–
C2+
C2–
V–
DOUT2
NC
RIN2
2
3
4
23 VCC
22 NC
21 GND
5
6
20 DOUT1
19 RIN1
7
8
18 ROUT1
17 NC
9
10
16 DIN1
15 NC
14 DIN2
11
12
13
NC
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
ROUT2
•
•
•
•
•
•
PWRDOWN
VCC
GND
DOUT1
RIN1
ROUT1
NC
DIN1
DIN2
NC
NC − No internal connection
PWRDOWN
FEATURES
•
SLLS708 – JANUARY 2006
EN
www.ti.com
MAX3222E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
NC − No internal connection
The MAX3222E can be placed in the power-down mode by setting the power-down (PWRDOWN) input low,
which draws only 1 µA from the power supply. When the device is powered down, the receivers remain active
while the drivers are placed in the high-impedance state. Also, during power down, the onboard charge pump is
disabled; V+ is lowered to VCC, and V– is raised toward GND. Receiver outputs also can be placed in the
high-impedance state by setting enable (EN) high.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
MAX3222E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS708 – JANUARY 2006
ORDERING INFORMATION
PACKAGE (1)
TA
SOIC – DW
0°C to 70°C
SSOP – DB
TSSOP – PW
SOIC – DW
–40°C to 85°C
SSOP – DB
TSSOP – PW
(1)
ORDERABLE PART NUMBER
Tube of 25
MAX3222ECDW
Reel of 2000
MAX3222ECDWR
Tube of 70
MAX3222ECDB
Reel of 2000
MAX3222ECDBR
Tube of 70
MAX3222ECPW
Reel of 2000
MAX3222ECPWR
Tube of 25
MAX3222EIDW
Reel of 2000
MAX3222EIDWR
Tube of 70
MAX3222EIDB
Reel of 2000
MAX3222EIDBR
Tube of 70
MAX3222EIPW
Reel of 2000
MAX3222EIPWR
MAX3222EC
MP222EC
MP222EC
MAX3222EI
MP222EI
MP222EI
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLES
XXX
EACH DRIVER (1)
INPUTS
(1)
DIN
PWRDOWN
OUTPUT
DOUT
X
L
Z
L
H
H
H
H
L
H = high level, L = low level, X = irrelevant, Z = high impedance
EACH RECEIVER (1)
INPUTS
(1)
2
TOP-SIDE MARKING
RIN
EN
OUTPUT
ROUT
L
L
H
H
L
L
X
H
Z
Open
L
H
H = high level, L = low level, X = irrelevant,
Z = high impedance (off),
Open = input disconnected or connected driver off
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MAX3222E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS708 – JANUARY 2006
LOGIC DIAGRAM (POSITIVE LOGIC)
DIN1
DIN2
PWRDOWN
EN
ROUT1
13
17
12
8
20
DOUT1
DOUT2
Powerdown
1
15
16
RIN1
5 k
ROUT2
10
9
RIN2
5 k
Pin numbers are for the DB, DW, and PW packages.
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage
range (2)
–0.3
6
V
V+
Positive-output supply voltage range (2)
–0.3
7
V
V–
Negative-output supply voltage range (2)
0.3
–7
V
13
V
V+ – V–
Supply voltage
difference (2)
VI
Input voltage range
VO
Output voltage range
θJA
Package thermal impedance (3) (4)
TJ
Operating virtual junction temperature
Tstg
Storage temperature range
Driver (EN, PWRDOWN)
–0.3
6
Receiver
–25
25
–13.2
13.2
–0.3
VCC + 0.3
Driver
Receiver
DB package
70
DW package
58
PW package
83
RHL package
(1)
(2)
(3)
(4)
UNIT
V
V
°C/W
TBD
–65
150
°C
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network GND.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
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3
MAX3222E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS708 – JANUARY 2006
Recommended Operating Conditions (1)
See Figure 5
MIN NOM MAX UNIT
VCC = 3.3 V
Supply voltage
VCC = 5 V
VIH
Driver and control high-level input voltage
DIN, EN, PWRDOWN
VIL
Driver and control low-level input voltage
DIN, EN, PWRDOWN
VI
Driver and control input voltage
DIN, EN, PWRDOWN
VI
Receiver input voltage
TA
(1)
VCC = 3.3 V
VCC = 5 V
3.3
3.6
5
5.5
V
2
V
2.4
MAX3222EC
Operating free-air temperature
3
4.5
MAX3222EI
0.8
V
0
5.5
V
–25
25
V
0
70
–40
85
°C
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
II
ICC
(1)
(2)
4
TEST CONDITIONS
Input leakage current (EN, PWRDOWN)
Supply current
No load, PWRDOWN at VCC
Supply current (powered off)
No load, PWRDOWN at GND
MIN
TYP (2)
MAX
±0.01
±1
µA
0.3
1
mA
1
10
µA
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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UNIT
MAX3222E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS708 – JANUARY 2006
DRIVER SECTION
abc
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
MIN TYP (2)
TEST CONDITIONS
MAX
UNIT
VOH
High-level output voltage
DOUT at RL = 3 kΩ to GND,
DIN = GND
5
5.4
VOL
Low-level output voltage
DOUT at RL = 3 kΩ to GND,
DIN = VCC
–5
–5.4
IIH
High-level input current
VI = VCC
±0.01
±1
µA
IIL
Low-level input current
VI at GND
±0.01
±1
µA
±35
±60
mA
IOS
Short-circuit output current (3)
ro
Output resistance
IOZ
(1)
(2)
(3)
VCC = 3.6 V
VO = 0 V
VCC = 5.5 V
VCC, V+, and V– = 0 V,
Output leakage current
PWRDOWN = GND
VO = ±2 V
300
V
V
Ω
10M
VCC = 3 V to 3.6 V,
VO = ±12 V
±25
VCC = 4.5 V to 5.5 V,
VO = ±10 V
±25
µA
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
Maximum data rate
CL = 1000 pF,
One DOUT switching,
RL = 3 kΩ,
See Figure 1
tsk(p)
Pulse skew (3)
CL = 150 pF to 2500 pF,
See Figure 2
RL = 3 kΩ to 7 kΩ,
SR(tr)
Slew rate,
transition region
(see Figure 1)
RL = 3 kΩ to 7 kΩ,
VCC = 3.3 V
(1)
(2)
(3)
MIN
TYP (2)
250
500
kbit/s
300
ns
MAX
CL = 150 pF to 1000 pF
6
30
CL = 150 pF to 2500 pF
4
30
UNIT
V/µs
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
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5
MAX3222E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS708 – JANUARY 2006
RECEIVER SECTION
abc
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
VOH
High-level output voltage
IOH = –1 mA
VOL
Low-level output voltage
IOL = 1.6 mA
TYP (2)
VCC – 0.6
VCC – 0.1
MAX
1.5
2.4
VCC = 5 V
1.8
2.4
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input hysteresis (VIT+ – VIT–)
IOZ
Output leakage current
EN = 1
ri
Input resistance
VI = ±3 V to ±25 V
VCC = 3.3 V
0.6
1.2
VCC = 5 V
0.8
1.5
UNIT
V
0.4
VCC = 3.3 V
VIT+
(1)
(2)
MIN
TEST CONDITIONS
V
V
V
0.3
V
±0.05
±10
µA
5
7
kΩ
3
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Switching Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TYP (2)
UNIT
tPLH
Propagation delay time, low- to high-level output
CL = 150 pF, See Figure 3
300
ns
tPHL
Propagation delay time, high- to low-level output
CL = 150 pF, See Figure 3
300
ns
ten
Output enable time
CL = 150 pF, RL = 3 kΩ, See Figure 4
200
ns
tdis
Output disable time
CL = 150 pF, RL = 3 kΩ, See Figure 4
200
ns
tsk(p)
Pulse skew (3)
See Figure 3
300
ns
(1)
(2)
(3)
6
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
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MAX3222E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS708 – JANUARY 2006
PARAMETER MEASUREMENT INFORMATION
3V
Input
Generator
(see Note B)
1.5 V
RS-232
Output
50 Ω
RL
1.5 V
0V
CL
(see Note A)
tTHL
3V
PWRDOWN
tTLH
VOH
3V
3V
Output
−3 V
−3 V
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
SR(tr) t
THL
6V
or t
TLH
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 1. Driver Slew Rate
3V
Generator
(see Note B)
RS-232
Output
50 Ω
RL
Input
1.5 V
1.5 V
0V
CL
(see Note A)
tPHL
tPLH
VOH
3V
PWRDOWN
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
EN
0V
3V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
tPHL
CL
(see Note A)
tPLH
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
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7
MAX3222E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS708 – JANUARY 2006
PARAMETER MEASUREMENT INFORMATION (continued)
VCC
GND
S1
3V
Input
RL
3 V or 0 V
0V
tPZH
(S1 at GND)
CL
(see Note A)
S1 at GND)
VOH
Output
50%
0.3 V
Generator
(see Note B)
1.5 V
tPHZ
Output
EN
1.5 V
50 Ω
tPLZ
(S1 at VCC)
0.3 V
Output
50%
VOL
tPZL
(S1 at VCC)
TEST CIRCUIT
VOLTAGE WAVEFORMS
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 4. Receiver Enable and Disable Times
8
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MAX3222E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS708 – JANUARY 2006
APPLICATION INFORMATION
1
EN
2
+
C1
−
3
C3†
+
20
Powerdown
VCC
C1+
V+
GND
19
18
17
C1−
16
5
C2+
−
6
7
DOUT2
RIN2
−
15
C2−
14
V−
RIN1
ROUT1
NC
+
13
8
9
12
5 k
ROUT2
DOUT1
5 k
+
C4
+ C
BYPASS
− = 0.1 µF
−
4
C2
PWRDOWN
11
10
DIN1
DIN2
NC
† C3 can be connected to V
CC or GND.
NOTES: A. Resistor values shown are nominal.
B. NC − No internal connection
C. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
VCC vs CAPACITOR VALUES
VCC
3.3 V 0.3 V
C1
0.1 µF
C2, C3, and C4
0.1 µF
5 V 0.5 V
0.047 µF
0.33 µF
3 V to 5.5 V
0.1 µF
0.47 µF
Figure 5. Typical Operating Circuit and Capacitor Values
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9
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
MAX3222ECDB
ACTIVE
SSOP
DB
20
MAX3222ECDBR
ACTIVE
SSOP
DB
20
MAX3222ECDW
ACTIVE
SOIC
DW
20
MAX3222ECDWR
ACTIVE
SOIC
DW
20
MAX3222ECPW
ACTIVE
TSSOP
PW
20
MAX3222ECPWR
ACTIVE
TSSOP
PW
MAX3222ECRHLR
PREVIEW
QFN
MAX3222EIDB
ACTIVE
SSOP
MAX3222EIDBR
ACTIVE
MAX3222EIDW
70
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
RHL
24
1000
TBD
Call TI
DB
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SOIC
DW
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3222EIDWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3222EIPW
ACTIVE
TSSOP
PW
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3222EIPWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3222EIRHLR
PREVIEW
QFN
RHL
24
1000
25
70
25
70
TBD
Call TI
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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