ONSEMI NB6L11MMNR2G

NB6L11M
2.5V / 3.3V 1:2 Differential
CML Fanout Buffer
Multi−Level Inputs w/ Internal Termination
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Description
The NB6L11M is a differential 1:2 CML fanout buffer. The
differential inputs incorporate internal 50 W termination resistors that
are accessed through the VT pins and will accept LVPECL, LVCMOS,
LVTTL, CML, or LVDS logic levels.
The VREFAC pin is an internally generated voltage supply available
to this device only. VREFAC is used as a reference voltage for
single−ended PECL or NECL inputs. For all single−ended input
conditions, the unused complementary differential input is connected
to VREFAC as a switching reference voltage. VREFAC may also rebias
capacitor−coupled inputs. When used, decouple VREFAC with a
0.01 mF capacitor and limit current sourcing or sinking to 0.5 mA.
When not used, VREFAC output should be left open.
The device is housed in a small 3x3 mm 16 pin QFN package.
The NB6L11M is a member of the ECLinPS MAXt family of
high performance clock products.
MARKING
DIAGRAM*
16
1
QFN−16
MN SUFFIX
CASE 485G
NB6L
11M
ALYWG
G
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
Features
•
•
•
•
•
•
•
•
•
•
•
•
Maximum Input Clock Frequency > 4 GHz, Typical
225 ps Typical Propagation Delay
70 ps Typical Rise and Fall Times
0.5 ps maximum RMS Clock Jitter
Differential CML Outputs, 380 mV peak−to−peak, typical
LVPECL Operating Range: VCC = 2.375 V to 3.63 V with VEE = 0 V
NECL Operating Range: VCC = 0 V with VEE = −2.375 V to −3.63 V
Internal Input Termination Resistors, 50 W
VREFAC Reference Output
Functionally Compatible with Existing 2.5 V / 3.3V LVEL, LVEP,
EP, and SG Devices
−40°C to +85°C Ambient Operating Temperature
These are Pb−Free Devices
Q0
VTD
Q0
D
D
Q1
VTD
Q1
VREFAC
Figure 1. Simplified Logic Diagram
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
© Semiconductor Components Industries, LLC, 2007
March, 2007 − Rev. 1
1
Publication Order Number:
NB6L11M/D
NB6L11M
VCC
16
VTD
1
D
2
VEE VEE
VCC
15
13
14
Exposed Pad (EP)
12
Q0
11
Q0
NB6L11M
D
3
10
Q1
VTD
4
9
Q1
5
6
7
VCC VREFAC VEE
8
VCC
Figure 2. Pin Configuration (Top View)
Table 1. PIN DESCRIPTION
Pin
Name
I/O
1
VTD
−
Description
2
D
ECL, CML,
LVCMOS, LVDS,
LVTTL Input
Noninverted Differential Input. Note 1. Internal 50 W Resistor to Termination Pin, VTD.
3
D
ECL, CML,
LVCMOS, LVDS,
LVTTL Input
Inverted Differential Input. Note 1. Internal 50 W Resistor to Termination Pin, VTD.
4
VTD
−
Internal 50 W Termination Pin for D input.
5
VCC
−
Positive Supply Voltage
6
VREFAC
Internal 50 W Termination Pin for D input.
Output Reference Voltage for direct or capacitor coupled inputs
7
VEE
−
Negative Supply Voltage
8
VCC
−
Positive Supply Voltage
9
Q1
CML Output
Inverted Differential Output. Typically Terminated with 50 W Resistor to VCC.
10
Q1
CML Output
Noninverted Differential Output. Typically Terminated with 50 W Resistor to VCC.
11
Q0
CML Output
Inverted Differential Output. Typically Terminated with 50 W Resistor to VCC.
12
Q0
CML Output
Noninverted Differential Output. Typically Terminated with 50 W Resistor to VCC.
13
VCC
−
Positive Supply Voltage
14
VEE
−
Negative Supply Voltage
15
VEE
−
Negative Supply Voltage
16
VCC
−
Positive Supply Voltage
−
EP
−
The Exposed Pad (EP) on the QFN−16 package bottom is thermally connected to the die for
improved heat transfer out of package. The exposed pad must be attached to a heat−sinking
conduit. The pad is not electrically connected to the die, but is recommended to be electrically
and thermally connected to VEE on the PC board.
1. In the differential configuration when the input termination pins (VTD, VTD) are connected to a common termination voltage or left open, and
if no signal is applied on D/D input, then, the device will be susceptible to self−oscillation.
2. All VCC and VEE pins must be externally connected to a power supply for proper operation.
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NB6L11M
Table 2. ATTRIBUTES
Characteristics
ESD Protection
Value
Human Body Model
Machine Model
Moisture Sensitivity
16−QFN
Flammability Rating
Oxygen Index: 28 to 34
> 2 kV
> 200V
Level 1
UL 94 V−0 @ 0.125 in
Transistor Count
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
For additional information, see Application Note AND8003/D.
Table 3. MAXIMUM RATINGS
Rating
Unit
VCC
Symbol
Positive Power Supply
Parameter
VEE = 0 V
Condition 1
Condition 2
4.0
V
VEE
Negative Power Supply
VCC = 0 V
−4.0
V
VIO
Positive Input/Output Voltage
Negative Input/Output Voltage
VEE = 0 V
VCC = 0 V
4.0
−4.0
V
V
VINPP
Differential Input Voltage |D − D|
VCC − VEE
V
IIN
Input Current Through RT (50 W Resistor)
Static
Surge
45
80
mA
mA
IOUT
Output Current (CML Output)
Continuous
Surge
25
50
mA
mA
IVREFAC
VREFAC Sink/Source Current
$0.5
mA
TA
Operating Temperature Range
−40 to +85
_C
Tstg
Storage Temperature Range
−65 to +150
_C
qJA
Thermal Resistance (Junction−to−Ambient)
(Note 3)
0 lfmp
500 lfmp
QFN−16
QFN−16
42
35
_C/W
_C/W
qJC
Thermal Resistance (Junction−to−Case)
(Note 3)
QFN−16
4
_C/W
Tsol
Wave Solder Pb−Free
265
_C
−0.5 v VIo v VCC + 0.5
+0.5 v VIo v VEE − 0.5
16 QFN
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
3. JEDEC standard multilayer board − 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad.
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NB6L11M
Table 4. DC CHARACTERISTICS, Multi−Level Inputs VCC = 2.375 V to 3.63 V, VEE = 0 V, or VCC = 0 V, VEE = −2.375 V to
−3.63 V, TA = −40°C to +85°C
Symbol
Characteristic
Min
Typ
Max
Unit
45
60
75
mA
VCC − 40
3260
2460
VCC − 10
3290
2490
VCC
3300
2500
mV
VCC = 3.3 V
VCC = 2.5 V
VCC − 500
2800
2000
VCC − 400
2900
2100
VCC − 300
3000
2200
mV
VCC = 3.3V
VCC = 2.5V
1125
VCC − 75
mV
POWER SUPPLY CURRENT
ICC
Power Supply Current (Inputs and Outputs Open)
CML OUTPUTS (Notes 4 and 5)
VOH
VOL
Output HIGH Voltage
Output LOW Voltage
DIFFERENTIAL INPUT DRIVEN SINGLE−ENDED (see Figures 4 and 5) (Note 6)
Vth
Input Threshold Reference Voltage Range (Note 7)
VIH
Single−ended Input HIGH Voltage
Vth + 75
VCC
mV
VIL
Single−ended Input LOW Voltage
VEE
Vth − 75
mV
VISE
Single−ended Input Voltage Amplitude (VIH − VIL)
150
2800
mV
VCC – 1325
mV
VREFAC
VREFAC
Output Reference Voltage
VCC – 1525
VCC – 1425
DIFFERENTIAL INPUTS DRIVEN DIFFERENTIALLY (see Figures 6, 7 and 8) (Note 8)
VIHD
Differential Input HIGH Voltage
VEE + 1200
VCC
mV
VILD
Differential Input LOW Voltage
VEE
VCC − 100
mV
VID
Differential Input Voltage (VIHD − VILD)
VEE + 100
VCC − VEE
mV
VCMR
Input Common Mode Range (Differential Configuration) (Note9)
VEE + 1150
VCC − 50
mV
IIH
Input HIGH Current D / D, (VTD/VTD Open)
−10
50
uA
IIL
Input LOW Current D / D, (VTD/VTD Open)
−50
10
uA
TERMINATION RESISTORS
RTIN
Internal Input Termination Resistor
40
50
60
W
RTOUT
Internal Output Termination Resistor
40
50
60
W
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
4. CML outputs loaded with 50 W to VCC for proper operation.
5. Input and output parameters vary 1:1 with VCC.
6. Vth, VIH, VIL,, and VISE parameters must be complied with simultaneously.
7. Vth is applied to the complementary input when operating in single−ended mode.
8. VIHD, VILD, VID and VCMR parameters must be complied with simultaneously.
9. VCMR min varies 1:1 with VEE, VCMR maximum varies 1:1 with VCC. The VCMR range is referenced to the most positive side of the differential
input signal.
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NB6L11M
Table 5. AC CHARACTERISTICS VCC = 2.375 V to 3.63 V, VEE = 0 V, or VCC = 0 V, VEE = −2.375 V to −3.63 V, TA = −40°C to
+85°C; (Note 10)
Symbol
Characteristic
VOUTPP
Output Voltage Amplitude (@ VINPP(MIN)
(Note 15) (See Figure 9)
tPD
Propagation Delay
tSKEW
Duty Cycle Skew (Note 11)
Within Device Skew
Device to Device Skew (Note 12)
tDC
tJITTER
RMS Random Clock Jitter (Note 13)
Peak−to−Peak Data Dependent Jitter
(Note 14)
Input Voltage Swing/Sensitivity
(Differential Configuration) (Note 15)
tr
tf
Output Rise/Fall Times @ 0.5 GHz
(20% − 80%)
Typ
fin ≤ 3.0GHz
fin ≤ 3.5 GHz
fin ≤ 4.0 GHz
230
190
150
380
320
270
D to Q
175
225
325
ps
5.0
3.0
15
15
80
ps
50
60
%
fin ≤ 4GHz
0.2
0.5
fin ≤ 4Gb/s
40
fin ≤ 4.0GHz
Output Clock Duty Cycle (Reference Duty Cycle = 50%)
VINPP
Min
40
Unit
mV
ps
150
Q, Q
Max
70
2800
mV
120
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
10. Measured by forcing VINPP (MIN) from a 50% duty cycle clock source. All loading with an external RL = 50 W to VCC. Input edge rates 40 ps
(20% − 80%).
11. Duty cycle skew is measured between differential outputs using the deviations of the sum of Tpw− and Tpw+ @ 0.5GHz.
12. Device to device skew is measured between outputs under identical transition @ 0.5 GHz.
13. Additive RMS jitter with 50% duty cycle clock signal.
14. Additive peak−to−peak data dependent jitter with input NRZ data at PRBS23.
15. Input and output voltage swing is a single−ended measurement operating in differential mode.
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NB6L11M
VTD
VCC
50 W
RC
RC
D
I
D
50 W
VTD
Figure 3. Input Structure
VCC
Vthmax
D
VIH
VIHmax
VILmax
Vth
VIH
Vth
VIL
Vth
VIL
Vthmin
D
Vth
VILmin
VEE
Figure 5. Vth Diagram
Figure 4. Differential Input Driven
Single−Ended
D
D
D
D
Figure 6. Differential Inputs
Driven Differentially
VCC
VIHmin
VID = |VIHD(D) − VILD(D)|
VIHD
VILD
Figure 7. Differential Inputs Driven Differentially
VIHD(MAX)
D
VILD(MAX)
VINPP = VIH(D) − VIL(D)
D
VCMR
VIHD
VID = VIHD − VILD
Q
VILD
VOUTPP = VOH(Q) − VOL(Q)
Q
VIHD(MIN)
GND
tPD
tPD
VIL(MIN)
Figure 8. VCMR Diagram
Figure 9. AC Reference Measurement
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NB6L11M
VCC
VCC
ZO = 50 W
D
VCC
VCC
ZO = 50 W
NB6L11M
50 W
VTD
LVPECL
Driver
ZO = 50 W
ZO = 50 W
50 W
D
VT = VT
VT = VT = VCC − 2 V
VEE
VT
50 W*
IN
GND
VEE
NB6L11M
50 W*
VT
LVDS
Driver
VTD
IN
GND
Figure 10. LVPECL Interface
Figure 11. LVDS Interface
VCC
VCC
ZO = 50 W
CML
Driver
IN
NB6L11M
50 W*
VT
VCC
ZO = 50 W
VT = VT = VCC
VT
50 W*
IN
GND
GND
Figure 12. Standard 50 W Load CML Interface
VCC
VCC
ZO = 50 W
Differential
Driver
VCC
ZO = 50 W
IN
VT
VT
VCC
ZO = 50 W
NB6L11M
50 W*
Single−Ended
Driver
50 W*
IN
VCC
IN
VT
VT
NB6L11M
50 W*
50 W*
IN
VT = VT = External VREFAC
GND
VCC
VT = VT = External VREFAC
GND
GND
GND
Figure 14. Capacitor−Coupled Single−Ended Interface
(VT/VT Connected to VREFAC; VREFAC Bypassed to
Ground with 0.1 mF Capacitor)
Figure 13. Capacitor−Coupled Differential Interface
(VT/VT Connected to VREFAC; VREFAC Bypassed to
Ground with 0.1 mF Capacitor)
*VREFAC bypassed to ground with a 0.01 mF capacitor
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VOUTPP OUTPUT VOLTAGE AMPLITUDE (mV)
(TYPICAL)
NB6L11M
VCC
800
700
600
500
50 W
50 W
400
Q
300
Q
200
100
0
0
1
2
3
4
fout, CLOCK OUTPUT FREQUENCY (GHz)
16 mA
Figure 15. Output Voltage Amplitude (VOUTPP) versus Output
Frequency at Ambient Temperature (Typical)
VEE
Figure 16. CML Output Structure
VCC
50 W
Z = 50 W
DUT
Driver
Device
50 W
Q
D
Receiver
Device
Z = 50 W
Q
D
Figure 17. Typical CML Termination for Output Driver and Device Evaluation
ORDERING INFORMATION
Package
Shipping †
NB6L11MMNG
QFN−16 (Pb−free)
123 Units / Rail
NB6L11MMNR2G
QFN−16 (Pb−free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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NB6L11M
PACKAGE DIMENSIONS
D
PIN 1
LOCATION
16 PIN QFN
MN SUFFIX
CASE 485G−01
ISSUE C
A
B
ÇÇ
ÇÇ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. Lmax CONDITION CAN NOT VIOLATE 0.2 MM
MINIMUM SPACING BETWEEN LEAD TIP
AND FLAG
E
0.15 C
TOP VIEW
0.15 C
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
(A3)
0.10 C
A
16 X
0.08 C
SIDE VIEW
SEATING
PLANE
A1
C
SOLDERING FOOTPRINT*
D2
16X
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.18
0.30
3.00 BSC
1.65
1.85
3.00 BSC
1.65
1.85
0.50 BSC
0.18 TYP
0.30
0.50
e
L
5
NOTE 5
EXPOSED PAD
8
4
0.575
0.022
9
3.25
0.128
0.30
0.012
EXPOSED PAD
E2
16X
K
12
1
16
16X
13
1.50
0.059
3.25
0.128
b
0.10 C A B
0.05 C
e
BOTTOM VIEW
NOTE 3
0.50
0.02
0.30
0.012
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ECLinPS MAX is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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For additional information, please contact your
local Sales Representative.
NB6L11M/D