NCP631 3.0 A Linear Voltage Regulator with Soft−Start The NCP631 is a low dropout positive voltage regulator that is capable of providing a guaranteed output current of 3.0 A with a maximum dropout voltage of 1.25 V at 3.0 A over temperature. The NCP631 is currently offered as a fixed voltage version at 3.47 V. On chip trimming adjusts the reference/output voltage to within "1.5% accuracy. The Soft−Start function allows control of start up times. This prevents current spikes at start up due to output capacitor in−rush current. Internal protection features consist of output foldback current limiting, and thermal shutdown. The NCP631 is available in D2PAK package. http://onsemi.com D2PAK D2T SUFFIX CASE 936A 1 5 Tab = Ground Pin 1. Shutdown 2. Vin 3. Ground 4. Vout 5. Soft−Start Features • • • • • • • • Output Current of 3.0 A 1.25 V Maximum Dropout Voltage at 3.0 A Over Temperature Voltage on Shutdown Pin is TTL compatible Reference/Output Voltage Trimmed to "1.5 % Current Limit Protection Thermal Shutdown Protection 0°C to 125°C Junction Temperature Range Pb−Free Packages are Available MARKING DIAGRAM NC P631GD2T AWLYWWG Applications • • • • Microprocessor Power Supplies SMPS Post Regulation Battery Chargers DSP Power Supplies 2 INPUT Cin 1 4 NCP631 3 5 Cout Cs Vout 3.47 NCP631GD2T = Device Code A = Assembly Location WL = Wafer Lot Y = Year WW = Work Week G = Pb−Free Package ORDERING INFORMATION Device Package Shipping† NCP631GD2TR4 D2PAK 800/Tape & Reel NCP631GD2TR4G D2PAK 800/Tape & Reel Shutdown Figure 1. Typical Application Circuit (Pb−Free) NCP631GD2T D2PAK 50 Units / Tube NCP631GD2TG D2PAK 50 Units / Tube (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2006 April, 2006 − Rev. 5 1 Publication Order Number: NCP631/D NCP631 PIN DESCRIPTION ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Pin No. Symbol Description 1 Shutdown This input is used to place the NCP631 into shutdown mode. The NCP631 is active when a voltage greater than 2.0 V is applied. The NCP631 will be placed into a shutdown mode when a voltage less then 0.8 V is applied. If left unused then connect the pin high. 2 Vin 3, Tab Ground 4 Vout 5 Soft−Start Positive Power Supply Input Voltage Power Supply Ground Regulated Output Voltage Soft−Start capacitor is placed from this pin to ground. Refer to applications information section on Page 6 for proper capacitor selection. MAXIMUM RATINGS Rating Symbol Value Unit Vin 9.0 V Enable −0.3 to 7 V Output Voltage Vout −0.3 to Vin + 0.3 V Power Dissipation and Thermal Characteristics Case 936A (D2PAK) Power Dissipation (Note 2) Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case PD RqJA RqJC Internally Limited 45 5.0 W °C/W °C/W Operating Junction Temperature Range TJ −40 to 125 °C Storage Temperature Range Tstg −55 to 150 °C Input Voltage (Note 1) Shutdown Voltage Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model JESD 22−A114−B Machine Model JESD 22−A115−A 2. The maximum package power dissipation is: T (max) * TA PD + J RqJA VIN VOUT THERMAL SHUTDOWN + −− + SHUTDOWN VREF1 (Band Gap) ~ 1.25 V − + VREF2 Soft−Start GND Figure 2. Simplified Block Diagram http://onsemi.com 2 NCP631 ELECTRICAL CHARACTERISTICS (Cin = 68 mF, Cout = 47 + 470 mF, Vin = Vout + 1.5 V, Iout = 10 mA, for typical value TJ = 25°C, for min and max values TJ = 0°C to 125°C unless otherwise noted.) Symbol Characteristic Output Voltage (Vin = 5.0 V to 7.0 V, Iout = 10 mA to 3.0 A, TJ = 25°C) (Vin = 5.0 V to 7.0 V, Iout = 10 mA to 3.0 A, TJ = 0°C to 125°C) Min Typ Max 3.418 3.383 3.470 − 3.522 3.557 − − 0.02 0.06 − − − − 0.01 0.06 − − − − 0.75 1.0 1.0 1.25 − − 0.4 1.0 1.0 2.0 − 40 75 3.0 − − A − 5.2 − A − 155 − °C 2.0 − − − − 0.8 Vadj Line Regulation (TJ = 25°C) (Note 3) (Vin = Vout + 1.5 V to 7.0 V) (Vin = Vout + 1.5 V to 7.0 V, TJ = 0°C to 125°C) Regline Load Regulation (TJ = 25°C) (Note 3) (Iout = 10 mA to 3.0 A, TJ = 25°C) (Iout = 10 mA to 3.0 A, TJ = 0°C to 125°C) Regload Dropout Voltage (Measured at Vout – 2%) (Iout = 300 mA) (Iout = 3.0 A) Vin−Vout Ground Pin Current in Normal Mode (Iout = 300 mA) (Iout = 3.0 A) IGnd Ground Pin Current in Shutdown Mode (Vshutdown < 0.8) IGnd Peak Output Limit Iout Internal Current Limitation Thermal Shutdown Shutdown Input Threshold Voltage (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) Unit V % % V mA mA Vtth(shutdown) V Shutdown Input Low Current (Vin = 0.8 V), (Negative Current Flows out of Pin) IIL −10 −2.0 − mA Shutdown Input High Current (Vin = 2.0 V), (Negative Current Flows out of Pin) IIH −10 −2.0 − mA Ripple Rejection (Cout = 100 mF, f = 1.0 kHz) RR − 76 − Soft−Start Pin Current ISS − 11 − dB mA 3. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 4. Line regulation is defined as the change in output voltage for a change in input voltage. Load regulation is defined as the change in output voltage for a change in output load current at a constant temperature. The limits for line and load regulation are contained within the reference voltage specification, Vadj. Typical numbers are included in the specification for line and load regulation. http://onsemi.com 3 Vout, OUTPUT VOLTAGE (V) 3.485 3.480 3.475 3.470 3.465 3.460 3.455 3.450 3.445 −40 −15 10 35 85 60 110 130 Isc, SHORT CIRCUIT CURRENT LIMIT (A) NCP631 6 5 4 3 2 1 0 −40 10 −15 35 60 85 110 130 TA, AMBIENT TEMPERATURE (°C) Figure 3. Output Voltage vs. Temperature Figure 4. Short Circuit Limit vs. Temperature 1.2 IGND, GROUND CURRENT (mA) 1.0 0.8 Iout = 3.0 A 0.6 Iout = 300 mA 0.4 0.2 −15 10 35 60 85 110 130 1.0 0.8 Iout = 3.0 A 0.6 0.4 Iout = 300 mA 0.2 0 −40 −15 10 35 60 85 110 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 5. Dropout Voltage vs. Temperature Figure 6. Ground Current vs. Temperature 50 IGND, GROUND CURRENT (mA) Vin − Vout, DROPOUT (V) 7 TA, AMBIENT TEMPERATURE (°C) 1.2 0 −40 8 40 30 Vshutdown = 0 V 20 10 0 −40 −15 10 35 60 85 110 130 TA, AMBIENT TEMPERATURE (°C) Figure 7. Ground Pin Current in Shutdown Mode vs. Temperature http://onsemi.com 4 130 1.200 120 1.000 100 RIPPLE REJECTION (dB) NOISE VALUE (mV) NCP631 0.800 0.600 0.400 Vin = 4.47 V Cout = 33 mF Cin = 100 mF Iout = 10 mA 0.200 80 40 40 20 0 10 0.000 1 10 100 1,000 10,000 Vin = 5.0 V + 0.5 Vpp Cout = 100 mF, Al Electrolytic Iout = 10 mA 100,000 1,000,000 100 Vin, INPUT VOLTAGE (V) 6 5 OUTPUT VOLTAGE DEVIATION (mV) 50 Cin = 68 mF, Al Electrolytic Cout = 33 mF, Al Electrolytic Iout = 200 mA 20 10 7 6 5 60 Cin = 1.0 mF Cout = 33 mF, Al Electrolytic Iout = 200 mA 40 20 0 −20 0 100 200 300 500 400 −40 600 0 10 20 TIME (mS) 3.0 1.5 Iout = 100 mA to 3.0 A 0 0 −50 Cin = 68 mF, Al Electrolytic Cout = 33 mF, Al Electrolytic Vin = 5.0 V −100 0 40 Figure 11. Line Transient 4.5 −150 30 TIME (mS) Figure 10. Line Transient Iout, OUTPUT CURRENT (A) 0 100,000 Figure 9. Ripple Rejection vs. Frequency 7 OUTPUT VOLTAGE DEVIATION (mV) OUTPUT VOLTAGE DEVIATION (mV) Vin, INPUT VOLTAGE (V) Figure 8. Noise Characterization 30 10,000 f, FREQUENCY (Hz) f, FREQUENCY (Hz) 40 1,000 10 20 30 40 TIME (mS) Figure 12. Load Transient http://onsemi.com 5 50 60 50 60 NCP631 APPLICATIONS INFORMATION Input Capacitor Where: The minimum capacitance required for stability is a 68 mF aluminum electrolytic or tantalum capacitor. The maximum ESR allowed for stability is 5.0 W. The capacitor should be place as close as possible to the input of the device. The placement of a ceramic capacitor in parallel is not recommend due to possible instabilities. Iss + 11 mA Cs + 10 nF (typ) Vref + 1.2 V Vout + 3.47 V Output current limitation during start−up: ǒ A minimum output capacitor value of 33 mF is required for stability. The type of capacitor can be aluminum electrolytic or tantalum capacitor. ESR can vary up to a maximum of 2.0 W for stability. The capacitor should be placed as close as possible to the output of the device. The placement of a ceramic capacitor in parallel is not recommend due to possible instabilities. (eq. 3) An example for Cout = 500 mF, Cs = 10 nF: ǒ Ǔ Iout + 3.47 * 500E * 6 * 11E * 6 + 1.59 A (eq. 4) 1.2 10E * 9 Time when the output voltage will reach target value can be determined by: Ts + Vref * Cs Iss Soft−Start Function (eq. 5) An example for Cs = 10 nF: Slope of the output voltage during startup (Shutdown pin goes from low to high) can be adjusted by value of Cs capacitor. The basic formula for this function is: SHUTDOWN VOLTAGE (V) Ǔ V Iout + out * Cout * Iss Vref Cs Output Capacitor dV + Iss + Iout * Vref dt Cs Cout Vout (eq. 2) Ts + 1.2 * 10E * 9 + 1.09 ms 11E * 6 (eq. 6) (eq. 1) 2 0 Vcs, SOFT−START CAPACITOR VOLTAGE (V) 2 1 0 Vout, OUTPUT VOLTAGE (V) 4 2 Iout, OUTPUT CURRENT (A) 0 Vin = 5.5 V, Rout = 6.0 W, Cs = 10 nF Cout = 385 mF + 33 mF + 22 mF 3 2 1 0 0 0.2 0.4 0.6 0.8 1.0 TIME (mS) 1.2 Figure 13. Typical Soft−Start Condition http://onsemi.com 6 1.4 1.6 1.8 2.0 NCP631 Reverse Current substitute for proper heatsinking. The maximum device power dissipation can be calculated by: Some situations might occur were the output pin is raised to a voltage while the input pin is at zero volts. This situation will not damage the device. If the output voltage is raised to a higher voltage than the input voltage a diode is recommended from output to input with the anode connect to the output pin. PD + TJ(max) * TA RqJA (eq. 7) The devices are available in surface mount D2PAK package. The package has an exposed metal tab that is specifically designed to reduce the junction to air thermal resistance, RqJA, by utilizing the printed circuit board copper as a heat dissipater. Figure 13 shows typical RqJA values that can be obtained from a square pattern using economical single sided 2.0 ounce copper board material. The final product thermal limits should be tested and quantified in order to insure acceptable performance and reliability. The actual RqJA can vary considerably from the graphs shown. This will be due to any changes made in the copper aspect ratio of the final layout, adjacent heat sources, and air flow. Thermal Considerations This series contains an internal thermal limiting circuit that is designed to protect the regulator in the event that the maximum junction temperature is exceeded. When activated, typically at 155°C, the regulator output switches off and then back on as the die cools. As a result, if the device is continuously operated in an overheated condition, the output will appear to be oscillating. This feature provides protection from a catastrophic device failure due to accidental overheating. It is not intended to be used as a TAPE AND REEL SPECIFICATION SOP Description D2PAK Leads Package Length Package Width Package Thickness Reel Quantity Tape Pitch Tape Width Vendor P/N 5 9.2 mm 10 mm 4.4 mm 800 16 mm 24 mm DDPAK−B http://onsemi.com 7 NCP631 ∅ 1.55 ±0.05 2.0 ±0.1 0.30 $ 0.05 4.0 ±0.1 See Note #2 R 0.3 MAX 1.75 ±0.1 ∅ 1.50 MIN B 0.70 Max 11.5 ±0.1 20° Max 2.40 Max B0 9.00 11.15 A B 16.00 4.70 K0 24.0 ±0.3 A A0 = 10.60 ±0.15 B0 = 16.50 ±0.15 K0 = 4.90 ±0.15 SECTION B−B A0 ALL DIMENSIONS IN MILLIMETERS 0.30 $ 0.05 SECTION A−A 1.00 NOTES: 1. A0 & B0 MEASURED AT 0.3 mm ABOVE BASE OF POCKET 2. 10 PITCHES CUMULATIVE TOTAL ±0.2 mm Figure 14. Package Carrier Dimensions Figure 15. Reel Dimensions http://onsemi.com 8 Nominal Hub Depth W1 +3 4 mm 4.4 7.1 8 mm 8.4 11.1 16 mm 16.4 19.1 28 mm 28.4 31.1 W2MAX −2 NCP631 PACKAGE DIMENSIONS D2PAK 5 CASE 936A−02 ISSUE C −T− OPTIONAL CHAMFER A TERMINAL 6 E U S K B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 6. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. V H 1 2 3 4 5 M D 0.010 (0.254) M T L P N G INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.067 BSC 0.539 0.579 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 5 _ REF 0.116 REF 0.200 MIN 0.250 MIN DIM A B C D E G H K L M N P R S U V R C MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 1.702 BSC 13.691 14.707 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 5 _ REF 2.946 REF 5.080 MIN 6.350 MIN SOLDERING FOOTPRINT* 8.38 0.33 1.702 0.067 10.66 0.42 3.05 0.12 16.02 0.63 SCALE 3:1 1.016 0.04 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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