TS3L500AE 16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH WITH LED SWITCH AND ENHANCED ESD PROTECTION www.ti.com SCDS246 – JUNE 2007 FEATURES 49 GND 50 VCC 51 2LED2 52 2LED1 53 GND 55 GND 54 LED2 47 1B1 3 46 0B2 VCC 4 45 1B2 NC 5 44 GND GND 6 43 2B1 A2 7 42 3B1 A3 8 41 2B2 GND 9 40 3B2 39 GND VCC 10 A4 11 38 VCC A5 12 37 4B1 GND 13 36 5B1 A6 14 35 4B2 A7 15 34 5B2 33 GND GND 16 32 6B1 VCC 18 31 7B1 LED0 19 30 6B2 LED1 20 29 7B2 GND 28 SEL 17 VCC 27 10/100/1000 Base-T Signal Switching Differential (LVDS, LVPECL) Signal Switching Audio/Video Switching Hub and Router Signal Switching 2 A1 GND 21 • • • • A0 1LED2 26 APPLICATIONS 48 0B1 0LED2 25 • 1 GND 24 • • GND 1LED1 23 • TQFN PACKAGE (TOP VIEW) 0LED1 22 • Wide Bandwidth (BW = 950 MHz Typ) Low Crosstalk (XTALK = –37 dB Typ) Low Bit-to-Bit Skew (tsk(o) = 100 ps Max) Low and Flat ON-State Resistance (ron = 4 Ω Typ, ron(flat) = 0.5 Ω Typ) Low Input/Output Capacitance (CON = 8 pF Typ) Rail-to-Rail Switching on Data I/O Ports (0 to 3.6 V) VCC Operating Range From 3 V to 3.6 V Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Performance Tested Per JESD 22 – 8-kV IEC61000-4-2, Contact Discharge on Switch IOs – > 3-kV Human Body Model on SEL 56 VCC • • • • DESCRIPTION/ORDERING INFORMATION The TS3L500AE is a 16-bit to 8-bit multiplexer/demultiplexer LAN switch with a single select (SEL) input. SEL controls the data path of the multiplexer/demultiplexer. The device provides additional I/Os for switching status indicating LED signals and includes high ESD protection. The device provides a low and flat ON-state resistance (ron) and an excellent ON-state resistance match. Low input/output capacitance, high bandwidth, low skew, and low crosstalk among channels make this device suitable for various LAN applications, such as 10/100/1000 Base-T. This device can be used to replace mechanical relays in LAN applications. It also can be used to route signals from a 10/100 Base-T ethernet transceiver to the RJ-45 LAN connectors in laptops or in docking stations. ORDERING INFORMATION TA –40°C to 85°C (1) (2) PACKAGE TQFN (1) (2) Tape and reel ORDERABLE PART NUMBER TS3L500AERHUR TOP-SIDE MARKING TK500AE Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007, Texas Instruments Incorporated TS3L500AE 16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH WITH LED SWITCH AND ENHANCED ESD PROTECTION www.ti.com SCDS246 – JUNE 2007 FUNCTION TABLE INPUT SEL INPUT/OUTPUT An FUNCTION L nB1 An = nB1, LEDx = XLED1 H nB2 An = nB2, LEDx = XLED2 PIN DESCRIPTION 2 NAME DESCRIPTION An Data I/Os nBm Data I/Os SEL Select input LEDx LED I/O port XLEDm LED I/O port Submit Documentation Feedback TS3L500AE 16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH WITH LED SWITCH AND ENHANCED ESD PROTECTION www.ti.com SCDS246 – JUNE 2007 LOGIC DIAGRAM (POSITIVE LOGIC) 2 48 3 47 0B1 A0 1B1 A1 46 0B2 45 1B2 7 43 2B1 A2 8 42 3B1 A3 41 2B2 40 3B2 11 37 12 36 4B1 A4 5B1 A5 35 4B2 34 5B2 14 32 15 31 6B1 A6 7B1 A7 30 6B2 29 7B2 19 LED0 22 25 LED1 20 23 26 LED2 54 52 51 SEL 0LED1 0LED2 1LED1 1LED2 2LED1 2LED2 17 Submit Documentation Feedback 3 TS3L500AE 16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH WITH LED SWITCH AND ENHANCED ESD PROTECTION www.ti.com SCDS246 – JUNE 2007 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 4.6 V VIN Control input voltage range (2) (3) –0.5 7 V (2) (3) (4) VI/O Switch I/O voltage range IIK Control input clamp current VIN < 0 –50 mA II/OK I/O port clamp current VI/O < 0 –50 mA ±128 mA II/O ON-state switch current –0.5 (5) 7 UNIT V Continuous current through VDD or GND ±100 mA θJA Package thermal impedance (6) 31.8 °C/W Tstg Storage temperature range 150 °C (1) (2) (3) (4) (5) (6) –65 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to ground, unless otherwise specified. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. VI and VO are used to denote specific conditions for VI/O. II and IO are used to denote specific conditions for II/O. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) MIN MAX VCC Supply voltage 3 3.6 V VIH High-level control input voltage (SEL) 2 5.5 V VIL Low-level control input voltage (SEL) 0 0.8 V VI Input voltage (SEL) 0 5.5 V VI/O Input/output voltage 0 VCC V TA Operating free-air temperature –40 85 °C (1) 4 UNIT All unused control inputs of the device must be held at VDD or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback TS3L500AE 16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH WITH LED SWITCH AND ENHANCED ESD PROTECTION www.ti.com SCDS246 – JUNE 2007 Electrical Characteristics for 1000 Base-T Ethernet switching over recommended operating free-air temperature range, VDD = 3.3 V ± 0.3 V (unless otherwise noted) TEST CONDITIONS (1) PARAMETER VIK SEL VCC = 3.6 V, IIN = –18 mA IIH SEL VCC = 3.6 V, IIL SEL IOFF SEL ICC MIN TYP (2) MAX UNIT –1.2 V VIN = VDD ±1 μA VCC = 3.6 V, VIN = GND ±1 μA VCC = 0 V, VIN = 0 to 3.6 V VCC = 3.6 V, II/O = 0, CIN SEL f = 1 MHz, VIN = 0 COFF B port –0.7 Switch ON or OFF ±1 μA 250 600 μA 2 2.5 pF VI = 0, f = 1 MHz, Outputs open, Switch OFF 3 4 pF CON VI = 0, f = 1 MHz, Outputs open, Switch ON 9 9.8 pF ron VCC = 3 V, 1.5 V ≤ VI ≤ VCC, IO = –40 mA 4 8 Ω VCC = 3 V, VI = 1.5 V and VCC, IO = –40 mA 0.7 VCC = 3 V, 1.5 V ≤ VI ≤ VCC, IO = –40 mA 0.2 ron(flat) (3) Δron (4) (1) (2) (3) (4) Ω 1.2 Ω VI, VO, II, and IO refer to I/O pins. VIN refers to the control inputs. All typical values are at VDD = 3.3 V (unless otherwise noted), TA = 25°C. ron(flat) is the difference of ron in a given channel at specified voltages. Δron is the difference of ron from center (A4, A5) ports to any other port. Electrical Characteristics for 10/100 Base-T Ethernet switching over recommended operating free-air temperature range, VDD = 3.3 V ± 0.3 V (unless otherwise noted) TEST CONDITIONS (1) PARAMETER MIN TYP (2) MAX –0.7 –1.2 V UNIT VIK SEL VCC = 3.6 V, IIN = –18 mA IIH SEL VCC = 3.6 V, VIN = VDD ±1 μA IIL SEL VCC = 3.6 V, VIN = GND ±1 μA IOFF SEL VCC = 0 V, VIN = 0 to 3.6 V VCC = 3.6 V, II/O = 0, ICC CIN SEL f = 1 MHz, VIN = 0 COFF B port Switch ON or OFF ±1 μA 250 600 μA 2 2.5 pF VI = 0, f = 1 MHz, Outputs open, Switch OFF 3 4 pF CON VI = 0, f = 1 MHz, Outputs open, Switch ON 9 9.8 pF ron VCC = 3 V, 1.25 V ≤ VI ≤ VCC, IO = –10 mA to –30 mA 4 6 Ω VCC = 3 V, VI = 1.25 V and VCC, IO = –10 mA to –30 mA 0.5 VCC = 3 V, 1.25 V ≤ VI ≤ VCC, IO = –10 mA to –30 mA 0.4 ron(flat) (3) Δron (4) (1) (2) (3) (4) Ω 1 Ω VI, VO, II, and IO refer to I/O pins. VIN refers to the control inputs. All typical values are at VDD = 3.3 V (unless otherwise noted), TA = 25°C. ron(flat) is the difference of ron in a given channel at specified voltages. Δron is the difference of ron from center (A4, A5) ports to any other port. Submit Documentation Feedback 5 TS3L500AE 16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH WITH LED SWITCH AND ENHANCED ESD PROTECTION www.ti.com SCDS246 – JUNE 2007 Switching Characteristics over recommended operating free-air temperature range, VDD = 3.3 V ± 0.3 V, RL = 200 Ω, CL = 10 pF (unless otherwise noted) (see Figures 4 and 5) FROM (INPUT) TO (OUTPUT) A or B B or A SEL A or B 0.5 tPHZ, tPLZ SEL A or B 0.9 tsk(o) (3) A or B B or A PARAMETER tpd (2) tPZH, tPZL MIN TYP (1) 0.25 tsk(p) (4) (1) (2) (3) (4) MAX UNIT ns 15 ns 9 ns 50 100 ps 50 100 ps All typical values are at VDD = 3.3 V (unless otherwise noted), TA = 25°C. The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance when driven by an ideal voltage source (zero output impedance). Output skew between center port (A4 to A5) to any other port Skew between opposite transitions of the same output in a given device |tPHL – tPLH| Dynamic Characteristics over recommended operating free-air temperature range, VDD = 3.3 V ± 0.3 V (unless otherwise noted) PARAMETER (1) 6 TYP (1) TEST CONDITIONS UNIT XTALK RL = 100 Ω, f = 250 MHz, See Figure 8 –37 OIRR RL = 100 Ω, f = 250 MHz, See Figure 9 –37 dB BW RL = 100 Ω, See Figure 7 950 MHz All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C. Submit Documentation Feedback dB TS3L500AE 16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH WITH LED SWITCH AND ENHANCED ESD PROTECTION www.ti.com SCDS246 – JUNE 2007 OPERATING CHARACTERISTICS 0 0 −2 Attenuation (dB) −20 Gain (dB) −4 −6 −8 −40 −60 −80 −10 −12 0.1 1 10 100 1000 10,000 −100 0.1 1 Frequency (MHz) Figure 1. Gain vs Frequency 10,000 Figure 2. OFF Isolation vs Frequency 6 0 5 −20 4 ron (W) Attenuation (dB) 1000 10 100 Frequency (MHz) −40 −60 2 −80 −100 0.1 3 1 0 1 10 100 Frequency (MHz) 1000 10,000 0 1 2 3 4 5 6 VCOM (V) Figure 3. Crosstalk vs Frequency Submit Documentation Feedback Figure 4. ron (Ω) vs Vcom (V) 7 TS3L500AE 16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH WITH LED SWITCH AND ENHANCED ESD PROTECTION www.ti.com SCDS246 – JUNE 2007 PARAMETER MEASUREMENT INFORMATION (Enable and Disable Times) VCC Input Generator VIN 50 Ω 50 Ω VG1 TEST CIRCUIT DUT 2 × VCC Input Generator VI S1 RL VO 50 Ω CL (see Note A) 50 Ω VG2 RL TEST VCC S1 RL Vin CL V∆ tPLZ/tPZL 3.3 V ± 0.3 V 2 × VCC 200 Ω GND 10 pF 0.3 V tPHZ/tPZH 3.3 V ± 0.3 V GND 200 Ω VCC 10 pF 0.3 V VI VO 2.5 V Output Control (VIN) 1.25 V 1.25 V 0V Output Waveform 1 S1 at 2 y VCC (see Note B) tPZL tPLZ VOH VCC/2 VOL + 0.3 V tPZH VO Open GND Output Waveform 2 S1 at GND (see Note B) VOL tPHZ VCC/2 VOH − 0.3 V VOH VOL VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. Figure 5. Test Circuit and Voltage Waveforms 8 Submit Documentation Feedback TS3L500AE 16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH WITH LED SWITCH AND ENHANCED ESD PROTECTION www.ti.com SCDS246 – JUNE 2007 PARAMETER MEASUREMENT INFORMATION (Skew) VCC Input Generator VIN 50 Ω 50 Ω VG1 TEST CIRCUIT DUT 2 × VCC Input Generator 50 Ω RL TEST VCC S1 RL Vin CL tsk(o) 3.3 V ± 0.3 V Open 200 Ω VCC or GND 10 pF tsk(p) 3.3 V ± 0.3 V Open 200 Ω VCC or GND 10 pF 3.5 V 2.5 V 1.5 V Data In at Ax or Ay tPHLx VOH (VOH + VOL)/2 VOL Data Out at XB1 or XB2 tsk(o) VO CL (see Note A) 50 Ω tPLHx VO Open GND VG2 VI RL VO VI S1 3.5 V tsk(o) VOH (VOH + VOL)/2 VOL Data Out at YB1 or YB2 tPLHy 2.5 V 1.5 V Input tPHLy tsk(o) = |tPLHy − tPLHx| or |tPHLy − tPHLx| VOLTAGE WAVEFORMS OUTPUT SKEW (tsk(o)) tPLH tPHL VOH (VOH + VOL)/2 VOL Output tsk(p) = |tPHL − tPLH| VOLTAGE WAVEFORMS PULSE SKEW [tsk(p)] NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. Figure 6. Test Circuit and Voltage Waveforms Submit Documentation Feedback 9 TS3L500AE 16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH WITH LED SWITCH AND ENHANCED ESD PROTECTION www.ti.com SCDS246 – JUNE 2007 PARAMETER MEASUREMENT INFORMATION EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VCC A0 SEL 0B1 DUT CL = 10 pF (see Note A) VSEL A. CL includes probe and jig capacitance. Figure 7. Test Circuit for Frequency Response (BW) Frequency response is measured at the output of the ON channel. For example, when VSEL = 0 and A0 is the input, the output is measured at 0B1. All unused analog I/O ports are left open. HP8753ES Setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM 10 Submit Documentation Feedback TS3L500AE 16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH WITH LED SWITCH AND ENHANCED ESD PROTECTION www.ti.com SCDS246 – JUNE 2007 PARAMETER MEASUREMENT INFORMATION (continued) EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VCC A0 0B1 RL = 100 Ω A1 1B1 0B2 DUT A2 1B2 2B1 RL = 100 Ω A3 3B1 2B2 3B2 SEL VSEL A. CL includes probe and jig capacitance. B. A 50-Ω termination resistor is needed to match the loading of the network analyzer. Figure 8. Test Circuit for Crosstalk (XTALK) Crosstalk is measured at the output of the nonadjacent ON channel. For example, when VSEL = 0 and A1 is the input, the output is measured at A3. All unused analog input (A) ports are connected to GND, and output (B) ports are left open. HP8753ES Setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM Submit Documentation Feedback 11 TS3L500AE 16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH WITH LED SWITCH AND ENHANCED ESD PROTECTION www.ti.com SCDS246 – JUNE 2007 PARAMETER MEASUREMENT INFORMATION (continued) EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VCC A0 0B1 RL = 100 Ω A1 1B1 DUT 0B2 1B2 SEL VSEL A. CL includes probe and jig capacitance. B. A 50-Ω termination resistor is needed to match the loading of the network analyzer. Figure 9. Test Circuit for OFF Isolation (OIRR) OFF isolation is measured at the output of the OFF channel. For example, when VSEL = GND and A1 is the input, the output is measured at 1B2. All unused analog input (A) ports are connected to ground, and output (B) ports are left open. HP8753ES Setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM 12 Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TS3L500AERHUR ACTIVE QFN RHU 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L500AERHURG4 ACTIVE QFN RHU 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 TAPE AND REEL BOX INFORMATION Device TS3L500AERHUR Package Pins RHU 56 Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) SITE 48 329 24 5.3 11.3 1.3 12 Pack Materials-Page 1 W Pin1 (mm) Quadrant 24 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 Device Package Pins Site Length (mm) Width (mm) Height (mm) TS3L500AERHUR RHU 56 SITE 48 370.0 355.0 55.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Telephony www.ti.com/telephony Low Power Wireless www.ti.com/lpw Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated