AM26C31 www.ti.com................................................................................................................................................... SLLS103M – DECEMBER 1990 – REVISED JUNE 2008 QUADRUPLE DIFFERENTIAL LINE DRIVER FEATURES 1 1A 16 VCC 1Y 2 15 4A 1Z 3 14 4Y G 4 13 4Z 2Z 5 12 G 2Y 6 11 2A 7 10 3Z 3Y GND 8 9 3A NC VCC 3 2 1 20 19 4A 1A AM26C31M. . .FK PACKAGE (TOP VIEW) DESCRIPTION/ORDERING INFORMATION 1Z 4 18 4Y G 5 17 4Z NC 6 16 NC 2Z 7 15 G 2Y 8 14 3Z 3Y 3A 9 10 11 12 13 2A The AM26C31 is a differential line driver with complementary outputs, designed to meet the requirements of TIA/EIA-422-B and ITU (formerly CCITT). The 3-state outputs have high-current capability for driving balanced lines, such as twisted-pair or parallel-wire transmission lines, and they provide the high-impedance state in the power-off condition. The enable functions are common to all four drivers and offer the choice of an active-high (G) or active-low (G) enable input. BiCMOS circuitry reduces power consumption without sacrificing speed. 1 NC • • AM26C31M. . .J OR W PACKAGE AM26C31Q. . .D PACKAGE AM26C31C. . .D, DB, OR NS PACKAGE AM26C31I. . .D, DB, N, NS, OR PW PACKAGE (TOP VIEW) 1Y • • • • • Meets or Exceeds the Requirements of TIA/EIA-422-B and ITU Recommendation V.11 Low Power, ICC = 100 µA Typ Operates From a Single 5-V Supply High Speed, tPLH = tPHL = 7 ns Typ Low Pulse Distortion, tsk(p) = 0.5 ns Typ High Output Impedance in Power-Off Conditions Improved Replacement for AM26LS31 Available in Q-Temp Automotive – High-Reliability Automotive Applications – Configuration Control/Print Support – Qualification to Automotive Standards GND • NC – No internal connection The AM26C31C is characterized for operation from 0°C to 70°C, the AM26C31I is characterized for operation from –40°C to 85°C, the AM26C31Q is characterized for operation over the automotive temperature range of –40°C to 125°C, and the AM26C31M is characterized for operation over the full military temperature range of –55°C to 125°C. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1990–2008, Texas Instruments Incorporated AM26C31 SLLS103M – DECEMBER 1990 – REVISED JUNE 2008................................................................................................................................................... www.ti.com ORDERING INFORMATION PACKAGE (1) (2) TA PDIP (N) 0°C to 70°C –40°C to 125°C –55°C to 125°C (1) (2) TOP-SIDE MARKING Tube of 25 AM26C31CN Tube of 40 AM26C31CD Reel of 2500 AM26C31CDR SOP (NS) Reel of 2000 AM26C31CNSR 26C31 SSOP (DB) Reel of 2000 AM26C31CDBR 26C31 PDIP (N) Tube of 25 AM26C31IN AM26C31IN Tube of 40 AM26C31ID Reel of 2500 AM26C31IDR SOP (NS) Reel of 2000 AM26C31INSR 26C31I SSOP (DB) Reel of 2000 AM26C31IDBR 26C31I TSSOP (PW) Tube of 90 AM26C31IPW 26C31I Tube of 40 AM26C31QD Reel of 2500 AM26C31QDR CDIP (J) Tube of 25 AM26C31MJ AM26C31MJ CFP (W) Tube of 150 AM26C31MW AM26C31MW LCCC (FK) Tube of 55 AM26C31MFK AM26C31MFK SOIC (D) SOIC (D) –40°C to 85°C ORDERABLE PART NUMBER SOIC (D) AM26C31CN AM26C31C AM26C31I AM26C31QD Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. FUNCTION TABLE (Each Driver) (1) INPUT A (1) 2 ENABLES OUTPUTS G G Y H H X H Z L L H X L H H X L H L L X L L H X L H Z Z H = High level, L = Low level, X = Irrelevant, Z = High impedance (off) Submit Documentation Feedback Copyright © 1990–2008, Texas Instruments Incorporated Product Folder Link(s): AM26C31 AM26C31 www.ti.com................................................................................................................................................... SLLS103M – DECEMBER 1990 – REVISED JUNE 2008 LOGIC DIAGRAM (POSITIVE LOGIC) 4 G G 12 2 1 1A 2A 3A 3 6 7 5 10 9 11 14 4A 15 13 1Y 1Z 2Y 2Z 3Y 3Z 4Y 4Z Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages. SCHEMATICS OF INPUTS AND OUTPUTS EQUIVALENT OF EACH INPUT TYPICAL OF ALL OUTPUTS VCC VCC Input Output GND GND Submit Documentation Feedback Copyright © 1990–2008, Texas Instruments Incorporated Product Folder Link(s): AM26C31 3 AM26C31 SLLS103M – DECEMBER 1990 – REVISED JUNE 2008................................................................................................................................................... www.ti.com ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range (2) –0.5 7 V VI Input voltage range –0.5 VCC + 0.5 V VID Differential input voltage range –14 14 V VO Output voltage range –0.5 7 IIK IOK Input or output clamp current IO Output current VCC current GND current θJA TJ Operating virtual junction temperature Tstg Storage temperature range (1) (2) (3) (4) ±20 mA ±150 mA 200 mA –200 Package thermal impedance (3) (4) UNIT mA D package 73 DB package 82 N package 67 NS package 64 PW package 108 –65 °C/W 150 °C 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential voltages, are with respect to the network ground terminal. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS MIN NOM MAX 4.5 5 5.5 UNIT VCC Supply voltage VID Differential input voltage VIH High-level input voltage VIL Low-level input voltage 0.8 V IOH High-level output current –20 µA IOL Low-level output current 20 mA ±7 TA 4 Operating free-air temperature V 2 AM26C31C V 0 70 AM26C31I –40 85 AM26C31Q –40 125 AM26C31M –55 125 Submit Documentation Feedback V °C Copyright © 1990–2008, Texas Instruments Incorporated Product Folder Link(s): AM26C31 AM26C31 www.ti.com................................................................................................................................................... SLLS103M – DECEMBER 1990 – REVISED JUNE 2008 ELECTRICAL CHARACTERISTICS over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER AM26C31C AM26C31I TEST CONDITIONS MIN TYP (1) VOH High-level output voltage IO = –20 mA VOL Low-level output voltage IO = 20 mA VOD Differential output voltage magnitude RL = 100 Ω, See Figure 1 (2) 2.4 UNIT MAX 3.4 0.2 2 V 0.4 3.1 V V Δ|VOD| Change in magnitude of differential output voltage RL = 100 Ω, See Figure 1 ±0.4 V VOC Common-mode output voltage RL = 100 Ω, See Figure 1 3 V Δ|VOC| Change in magnitude of common-mode output voltage (2) RL = 100 Ω, See Figure 1 ±0.4 V II Input current VI = VCC or GND ±1 µA IO(off) Driver output current with power off VCC = 0 IOS Driver output short-circuit current VO = 0 IOZ High-impedance off-state output current ICC Quiescent supply current Ci Input capacitance VO = 6 V 100 VO = –0.25 V –100 –30 –150 VO = 2.5 V 20 VO = 0.5 V –20 VI = 0 or 5 V (1) (2) (3) IO = 0 VI = 2.4 V or 0.5 V (3) µA mA µA 100 µA 3 mA 1.5 6 pF All typical values are at VCC = 5 V and TA = 25°C. Δ|VOD| and Δ|VOC| are the changes in magnitude of VOD and VOC, respectively, that occur when the input is changed from a high level to a low level. This parameter is measured per input. All other inputs are at 0 or 5 V. SWITCHING CHARACTERISTICS over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS tPLH Propagation delay time, low-to-high-level output tPHL Propagation delay time, high-to-low-level output tsk(p) S1 is open, See Figure 2 Pulse skew time (|tPLH – tPHL|) S1 is open, See Figure 2 tr(OD), tf(OD) Differential output rise and fall times S1 is open, See Figure 3 tPZH Output enable time to high level tPZL Output enable time to low level tPHZ Output disable time from high level tPLZ Output disable time from low level Cpd Power dissipation capacitance (each driver) (2) (1) (2) S1 is closed, See Figure 4 S1 is closed, See Figure 4 S1 is open, See Figure 2 AM26C31C AM26C31I UNIT MIN TYP (1) MAX 3 7 12 3 7 12 0.5 4 ns ns 5 10 10 19 10 19 7 16 7 16 170 ns ns ns pF All typical values are at VCC = 5 V and TA = 25°C. Cpd is used to estimate the switching losses according to PD = Cpd × VCC2 × f, where f is the switching frequency. Submit Documentation Feedback Copyright © 1990–2008, Texas Instruments Incorporated Product Folder Link(s): AM26C31 5 AM26C31 SLLS103M – DECEMBER 1990 – REVISED JUNE 2008................................................................................................................................................... www.ti.com ELECTRICAL CHARACTERISTICS over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER AM26C31Q AM26C31M TEST CONDITIONS MIN TYP (1) VOH High-level output voltage IO = –20 mA VOL Low-level output voltage IO = 20 mA VOD Differential output voltage magnitude RL = 100 Ω, See Figure 1 (2) 2.2 UNIT MAX 3.4 0.2 2 V 0.4 3.1 V V Δ|VOD| Change in magnitude of differential output voltage RL = 100 Ω, See Figure 1 ±0.4 V VOC Common-mode output voltage RL = 100 Ω, See Figure 1 3 V Δ|VOC| Change in magnitude of common-mode output voltage (2) RL = 100 Ω, See Figure 1 ±0.4 V II Input current VI = VCC or GND ±1 µA IO(off) Driver output current with power off VCC = 0 IOS Driver output short-circuit current VO = 0 IOZ High-impedance off-state output current ICC Quiescent supply current Ci Input capacitance (1) (2) (3) VO = 6 V 100 VO = –0.25 V –100 –170 VO = 2.5 V 20 VO = 0.5 V –20 IO = 0 µA mA µA VI = 0 or 5 V 100 µA VI = 2.4 V or 0.5 V (3) 3.2 mA 6 pF All typical values are at VCC = 5 V and TA = 25°C. Δ|VOD| and Δ|VOC| are the changes in magnitude of VOD and VOC, respectively, that occur when the input is changed from a high level to a low level. This parameter is measured per input. All other inputs are at 0 or 5 V. SWITCHING CHARACTERISTICS over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS AM26C31Q AM26C31M MIN tPLH Propagation delay time, low-to-high-level output tPHL Propagation delay time, high-to-low-level output tsk(p) S1 is open, See Figure 2 Pulse skew time (|tPLH – tPHL|) S1 is open, See Figure 2 tr(OD), tf(OD) Differential output rise and fall times S1 is open, See Figure 3 tPZH Output enable time to high level tPZL Output enable time to low level tPHZ Output disable time from high level tPLZ Output disable time from low level Cpd Power dissipation capacitance (each driver) (2) (1) (2) 6 S1 is closed, See Figure 4 S1 is closed, See Figure 4 S1 is open, See Figure 2 UNIT TYP (1) MAX 7 12 6.5 12 0.5 4 ns ns 5 12 10 19 10 19 7 16 7 16 100 ns ns ns pF All typical values are at VCC = 5 V and TA = 25°C. Cpd is used to estimate the switching losses according to PD = Cpd × VCC2 × f, where f is the switching frequency. Submit Documentation Feedback Copyright © 1990–2008, Texas Instruments Incorporated Product Folder Link(s): AM26C31 AM26C31 www.ti.com................................................................................................................................................... SLLS103M – DECEMBER 1990 – REVISED JUNE 2008 PARAMETER MEASUREMENT INFORMATION Figure 1. Differential and Common-Mode Output Voltages C2 = 40 pF Input RL/2 500 Ω C1 = 40 pF 1.5 V S1 C3 = 40 pF RL/2 See Note A TEST CIRCUIT 3V 1.3 V 0V Input A (see Note B) tPLH Output Y 50% tPHL 50% 1.3 V tsk(p) Output Z 50% tsk(p) 50% 1.3 V tPHL tPLH A. C1, C2, and C3 include probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, duty cycle ≤ 50%, and tr, tf ≤ 6 ns. Figure 2. Propagation Delay Time and Skew Waveforms and Test Circuit Submit Documentation Feedback Copyright © 1990–2008, Texas Instruments Incorporated Product Folder Link(s): AM26C31 7 AM26C31 SLLS103M – DECEMBER 1990 – REVISED JUNE 2008................................................................................................................................................... www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) A. C1, C2, and C3 include probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, duty cycle ≤ 50%, and tr, tf ≤ 6 ns. Figure 3. Differential-Output Rise- and Fall-Time Waveforms and Test Circuit 8 Submit Documentation Feedback Copyright © 1990–2008, Texas Instruments Incorporated Product Folder Link(s): AM26C31 AM26C31 www.ti.com................................................................................................................................................... SLLS103M – DECEMBER 1990 – REVISED JUNE 2008 PARAMETER MEASUREMENT INFORMATION (continued) Output C2 = 40 pF 0V 3V Enable Inputs (see Note B) C1 = 40 pF Input A C3 = 40 pF G 50 Ω 500 Ω 1.5 V S1 50 Ω Output G See Note A TEST CIRCUIT Enable G Input (see Note C) 3V 1.3 V1.3 V Enable G Input 0V 1.5 V Output WIth 0 V to A Input VOL + 0.3 V 0.8 V VOL tPLZ tPZL VOH Output WIth 3 V to A Input VOH - 0.3 V 2V 1.5 V tPHZ tPZH VOLTAGE WAVEFORMS A. C1, C2, and C3 include probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, duty cycle ≤ 50%, and tr, tf ≤ 6 ns. C. Each enable is tested separately. Figure 4. Output Enable- and Disable-Time Waveforms and Test Circuit Submit Documentation Feedback Copyright © 1990–2008, Texas Instruments Incorporated Product Folder Link(s): AM26C31 9 AM26C31 SLLS103M – DECEMBER 1990 – REVISED JUNE 2008................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS SUPPLY CURRENT vs SWITCHING FREQUENCY Figure 5. 10 Submit Documentation Feedback Copyright © 1990–2008, Texas Instruments Incorporated Product Folder Link(s): AM26C31 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty AM26C31CD ACTIVE SOIC D 16 AM26C31CDBLE OBSOLETE SSOP DB 16 AM26C31CDBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C31CDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C31CDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C31CDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C31CDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C31CDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C31CDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C31CDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C31CN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type AM26C31CNE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type AM26C31CNSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C31CNSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C31CNSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C31ID ACTIVE SOIC D 16 CU NIPDAU Level-1-260C-UNLIM AM26C31IDBLE OBSOLETE SSOP DB 16 AM26C31IDBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C31IDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C31IDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C31IDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C31IDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C31IDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C31IDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C31IDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C31IN ACTIVE PDIP N 16 CU NIPDAU N / A for Pkg Type 40 Green (RoHS & no Sb/Br) TBD 40 Green (RoHS & no Sb/Br) TBD 25 Addendum-Page 1 Pb-Free Lead/Ball Finish CU NIPDAU Call TI Call TI MSL Peak Temp (3) Level-1-260C-UNLIM Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty AM26C31INE4 ACTIVE PDIP N 16 AM26C31INSR ACTIVE SO NS 16 AM26C31INSRG4 ACTIVE SO NS 16 AM26C31IPW ACTIVE TSSOP PW 16 90 AM26C31IPWE4 ACTIVE TSSOP PW 16 AM26C31IPWG4 ACTIVE TSSOP PW 16 AM26C31IPWR ACTIVE TSSOP PW AM26C31IPWRG4 ACTIVE TSSOP Lead/Ball Finish MSL Peak Temp (3) (RoHS) 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C31QD ACTIVE SOIC D 16 40 TBD CU NIPDAU Level-1-220C-UNLIM AM26C31QDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C31QDR ACTIVE SOIC D 16 2500 TBD CU NIPDAU Level-1-220C-UNLIM AM26C31QDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF AM26C31 : Product: AM26C31-EP • Enhanced • Military: AM26C31M NOTE: Qualified Version Definitions: Product - Supports Defense, Aerospace and Medical Applications • Enhanced • Military - QML certified for Military and Defense Applications Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing AM26C31CDBR SSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 12.0 16.0 Q1 DB 16 2000 330.0 16.4 8.2 6.6 2.5 AM26C31CDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 AM26C31CNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 AM26C31IDBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 AM26C31IDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 AM26C31INSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 AM26C31IPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) AM26C31CDBR SSOP DB 16 2000 346.0 346.0 33.0 AM26C31CDR SOIC D 16 2500 333.2 345.9 28.6 AM26C31CNSR SO NS 16 2000 346.0 346.0 33.0 AM26C31IDBR SSOP DB 16 2000 346.0 346.0 33.0 AM26C31IDR SOIC D 16 2500 333.2 345.9 28.6 AM26C31INSR SO NS 16 2000 346.0 346.0 33.0 AM26C31IPWR TSSOP PW 16 2000 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. 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